T2535-800G中文资料

T2535-800G中文资料
T2535-800G中文资料

1/9

?

BTA/BTB24,BTA25,BTA26

and T25Series

SNUBBERLESS ?&STANDARD

25A TRIAC S

September 2000-Ed:3

MAIN FEATURES:

DESCRIPTION

Available either in through-hole of surface and T25mount packages,the BTA/BTB24-25-26triac series is suitable for general purpose AC power switching.They can be used as an ON/OFF function in applications such as static relays,heating regulation,water heaters,induction motor starting circuits...or for phase control operation in high power motor speed controllers,soft start circuits...The snubberless versions (BTA/BTB...W and T25series)are specially recommended for use on inductive loads,thanks to their high commutation performances.

By using an internal ceramic pad,the BTA series provides voltage insulated tab (rated at 2500V RMS)complying with UL standards (File ref.:E81734).

Symbol Value Unit I T(RMS)25A V DRM /V RRM 600and 800V I GT (Q 1)

35to 50

mA

ABSOLUTE MAXIMUM RATINGS

Symbol Parameter

Value

Unit I T(RMS)

RMS on-state current (full sine wave)

D P AK TO-220AB Tc =100°C 25

A

RD91TOP3Ins.Tc =90°C TO-220AB Ins.Tc =75°C I TSM Non repetitive surge peak on-state current (full cycle,Tj initial =25°C)F =60Hz t =16.7ms 260A F =50Hz

t =20ms

250I t I t Value for fusing

tp =10ms

450

A s dI/dt

Critical rate of rise of on-state current I G =2x I GT ,tr ≤100ns

F =120Hz Tj =125°C 50A/μs V DSM /V RSM Non repetitive surge peak off-state

voltage

tp =10ms Tj =25°C V DRM /V RRM

+100

V I GM Peak gate current

tp =20μs

Tj =125°C 4A P G(AV)Average gate power dissipation Tj =125°C

1W T stg T j

Storage junction temperature range Operating junction temperature range

-40to +150-40to +125

°C G

A2

A1

G

A2

A2A1G

A2

A2A1TO-220AB (BTB24)

TO-220AB Insulated (BTA24)

TOP3Insulated (BTA26)

A1A2

G

A2

A2

G

A1A2

A1G

D 2PAK (T25G)

RD91(BTA25)

BTA/BTB24,BTA25,BTA26and T25Series

2/9

ELECTRICAL CHARACTERISTICS (Tj =25°C,unless otherwise specified)

s

SNUBBERLESS ?(3Quadrants)T25-G,BTA/BTB24...W,BTA25...W,BTA26...W

s

STANDARD (4Quadrants):BTA25...B,BTA26...B

STATIC CHARACTERISTICS

Note 1:minimum IGT is guaranted at 5%of IGT max.Note 2:for both polarities of A2referenced to A1

Symbol Test Conditions

Quadrant

T25BTA/BTB Unit

T2535

CW BW I GT (1)V D =12V R L =33?I -II -III MAX.35

3550

mA V GT I -II -III MAX. 1.3V V GD V D =V DRM R L =3.3k ?

Tj =125°C

I -II -III

MIN.0.2V I H (2)I T =500mA MAX.505075mA I L I G =1.2I GT

I -III MAX.

707080mA II

8080100dV/dt (2)

V D =67%V DRM gate open Tj =125°C

MIN.5005001000V/μs (dI/dt)c (2)Without snubber

Tj =125°C

MIN.

1313

22

A/ms

Symbol Test Conditions

Quadrant Value Unit I GT (1)

V D =12V

R L =33?I -II -III IV MAX.50100mA V GT ALL MAX. 1.3V V GD V D =V DRM R L =3.3k ?

Tj =125°C

ALL

MIN.0.2V I H (2)I T =500mA MAX.80mA I L I G =1.2I GT

I -III -IV

MAX.

70mA

II

160dV/dt (2)

V D =67%V DRM gate open Tj =125°C

MIN.500V/μs (dV/dt)c (2)(dI/dt)c =13.3A/ms

Tj =125°C

MIN.

10

V/μs Symbol Test Conditions

Value Unit V TM (2)I TM =35A

tp =380μs

Tj =25°C MAX. 1.55V V to (2)Threshold voltage Tj =125°C MAX.0.85V R d (2)Dynamic resistance Tj =125°C MAX.16m ?I DRM I RRM

V DRM =V RRM

Tj =25°C MAX.

5μA Tj =125°C

3

mA

BTA/BTB24,BTA25,BTA26and T25Series

3/9

THERMAL RESISTANCES

S:Copper surface under tab

PRODUCT SELECTOR

BTB:Non insulated TO-220AB package

ORDERING INFORMATION

Symbol Parameter

Value Unit R th(j-c)

Junction to case (AC)

D PAK TO-220AB 0.8°C/W

RD91(Insulated)TOP3Insulated 1.1TO-220AB Insulated

1.7R th(j-a)

Junction to ambient

S =1cm

D PAK 45°C/W

TOP3Insulated 50TO-220AB 60

TO-220AB Insulated

Part Number

Voltage (xxx)

Sensitivity

Type Package 600V

800V BTB24-xxxB X X 50mA Standard TO-220AB BTA/BTB24-xxxBW X X 50mA Snubberless TO-220AB BTA/BTB24-xxxCW X X 35mA Snubberless TO-220AB BTA25-xxxB X X 50mA Standard RD-91BTA25-xxxBW X X 50mA Snubberless RD-91BTA25-xxxCW X X 35mA Snubberless RD-91BTA26-xxxB X X 50mA Standard TOP3Ins.BTA26-xxxBW X X 50mA Snubberless TOP3Ins.BTA26-xxxCW X X 35mA Snubberless TOP3Ins.T2535-xxxG

X

X

35mA

Snubberless

D

PAK BT A 24-600BW

TRIAC SERIES INSULATION:A:insulated

B:non insulated

CURRENT:

24:25A in TO-220AB 25:25A in Rd9126:25A in TOP3

SENSITIVITY &TYPE B:50mA STANDARD

BW:50mA SNUBBERLESS CW:35mA SNUBBERLESS

VOLTAGE:600:600V 800:800V

BTA/BTB24,BTA25,BTA26and T25Series

4/9

OTHER INFORMATION

Note :xxx=voltage,y =sensitivity,z =type

Part Number

Marking

Weight Base quantity Packing mode BTA/BTB24-xxxyz BTA/BTB24xxxyz 2.3g 250Bulk BTA25-xxxyz BTA25xxxyz 20g 25Bulk BTA26-xxxyz BTA26xxxyz 4.5g 120Bulk T2535-xxxG T2535xxxG 1.5g 50Tube T2535-xxxG-TR

T2535xxxG

1.5g

1000

Tape &reel

T 2535

-600G

(-TR)

TRIAC SERIES SENSITIVITY:35:35mA

VOLTAGE:600:600V 800:800V

CURRENT:25A

PACKAGE:G:D PAK

2PACKING MODE:Blank:Tube

-TR:Tape &Reel

BTA/BTB24,BTA25,BTA26and T25Series

5/9

Fig.1:Maximum power dissipation versus RMS on-state current (full cycle).

Fig.2-1:RMS on-state current versus case temperature (full cycle).

Fig.2-2:D P AK RMS on-state current versus ambient temperature (printed circuit board FR4,copper thickness:35μm),full cycle.

Fig.3:Relative variation of thermal impedance versus pulse duration.

Fig.4:On-state characteristics (maximum

values).

Fig.5:Surge peak on-state current versus number of cycles.

5

10

15

20

25

0510********IT(RMS)(A)P (W)0

25

50

75

100

125

51015202530Tc(°C)

IT(RMS)(A)

BTA24

BTB/T25

BTA25/26

25

50

75

100

125

0.00.51.01.52.02.53.03.54.0Tamb(°C)IT(RMS)(A)D PAK (S=1cm )

221E-3

1E-2

1E-1

1E+0

1E+1

1E+25E+2

1E-31E-2

1E-1

1E+0

tp (s)

K=[Zth/Rth]

Zth(j-c)

Zth(j-a)BTA/BTB24/T25

Zth(j-a)BTA26

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0 4.5

110

100

300VTM (V)

ITM (A)

Tj=25°C

Tj max

Tj max.Vto =0.85V Rd =16m ?

1

10

100

1000

50

100

150

200250300

Number of cycles

ITSM (A)

Non repetitive Tj initial=25°C

Repetitive Tc=75°C

One cycle

t=20ms

BTA/BTB24,BTA25,BTA26and T25Series

6/9

Fig.6:Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp <10ms,and corresponding value of I t.

Fig.7:Relative variation of gate trigger current,holding current and latching current versus junction temperature (typical values).

Fig.8:Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values).

Fig.9:Relative variation of critical rate of decrease of main current versus junction temperature.

Fig.10:D PAK Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4,copper thickness:35μm).

0.01

0.10

1.00

10.00

1001000

3000

tp (ms)

ITSM (A),I t (A s)Tj initial=25°C

ITSM

I t

dI/dt limitation:

50A/μs

-40

-20

20

40

60

80

100

120

140

0.00.5

1.01.5

2.0

2.5Tj(°C)

IGT,IH,IL[Tj]/IGT,IH,IL[Tj=25°C]

IGT

IH &IL

0.1

1.0

10.0

100.0

0.40.60.81.01.21.41.61.82.02.22.4(dV/dt)c (V/μs)(dI/dt)c [(dV/dt)c]/Specified (dI/dt)c

BW/CW/T2535

B

25

50

75

100

125

012

34

56Tj (°C)

(dI/dt)c [Tj]/(dI/dt)c [Tj specified]

4

8

12

16

20

24

28

32

36

40

1020304050607080S(cm )

Rth(j-a)(°C/W)

D PAK

BTA/BTB24,BTA25,BTA26and T25Series

7/9

PACKAGE MECHANICAL DATA D PAK (Plastic)

REF.DIMENSIONS

Millimeters Inches Min.

Typ.

Max.Min.

Typ.

Max.A 4.30 4.600.1690.181A1 2.49 2.690.0980.106A20.030.230.0010.009B 0.700.93

0.0270.037

B2 1.25 1.40

0.048

0.055

C 0.450.600.0170.024C2 1.21 1.360.0470.054

D 8.959.350.3520.368

E 10.0010.280.3930.405G 4.88 5.280.1920.208L 15.0015.850.5900.624L2 1.27 1.400.0500.055L3 1.40 1.750.055

0.069

R 0.40

0.016

V2

A

C2

D

R

2.0MIN.FLAT ZONE

A2

V2

C

A1

G

L

L3

L2

B

B2E

FOOTPRINT DIMENSIONS (in millimeters)D PAK (Plastic)

8.90

3.70

1.30

5.08

16.90

10.30

BTA/BTB24,BTA25,BTA26and T25Series

8/9

PACKAGE MECHANICAL DATA RD91(Plastic)

REF.DIMENSIONS

Millimeters Inches

Min.

Max.Min.

Max.A 40.00 1.575A129.9030.30 1.177

1.193A22

2.000.867B 27.00 1.063B11

3.5016.500.531

0.650B224.000.945C 14.000.551C1 3.500.138C2 1.95 3.000.0770.118E30.700.900.0270.035F 4.00 4.500.1570.177I 11.2013.600.4410.535L1 3.10 3.500.1220.138L2 1.70 1.900.0670.075N133°43°33°43°N2

28°38°

28°

38°

A2

L2

L1

B2

C

C2

A1

C1

B1

N1

B

F

I

A

E3

N2PACKAGE MECHANICAL DATA TOP3(Plastic)

REF.

DIMENSIONS

Millimeters Inches Min.Typ.

Max.Min.Typ.

Max.A 4.4 4.60.1730.181B 1.45 1.550.0570.061C 14.3515.600.5650.614D 0.50.70.0200.028E 2.7 2.90.1060.114F 15.816.50.6220.650G 20.421.10.8150.831H 15.115.50.5940.610J 5.4 5.650.2130.222K 3.4 3.650.1340.144L 4.08 4.170.1610.164P 1.20

1.40

0.047

0.055

R

4.600.181

BTA/BTB24,BTA25,BTA26and T25Series

9/9

PACKAGE MECHANICAL DATA TO-220AB (Plastic)

REF.DIMENSIONS

Millimeters Inches Min.

Typ.Max.

Min.

Typ.Max.A 15.2015.900.598

0.625

a1 3.75

0.147a213.0014.000.5110.551B 10.0010.400.3930.409b10.610.880.0240.034b2 1.23 1.320.0480.051C 4.40 4.600.1730.181c10.490.700.0190.027c2 2.40 2.720.0940.107e 2.40 2.700.0940.106F 6.20 6.600.2440.259I 3.75 3.850.1470.151

I415.8016.4016.800.6220.6460.661

L 2.65 2.950.1040.116l2 1.14 1.700.0440.066l3 1.14 1.700.044

0.066

M

2.60

0.102

M

B

l4

C

b2

a2

l2

c2

l3

b1

a1

A

F

L

I

e

c1

Information furnished is believed to be accurate and reliable.However,STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use.No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics.Specifications mentioned in this publication are subject to change without notice.This publication supersedes and replaces all information previously supplied.STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

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