EM56001A中文资料

GENERAL DESCRIPTION

EM56000A is a series of single chip dual channel IC with voice synthesizer. The dual channel can be (voice + voice) simultaneously. That contains some input and I/O ports, and a tiny controller. By programming through the tiny controller, user's application including section combination, trigger modes, control outputs, IR communication, and other logical function can be easily implemented.

FEATURES

EM56001A EM56101A EM56200A EM56300A EM56400A EM56500A EM56600A TOTAL ROM(bits)10K x 1016K x 1032K x 1064K x 10128K x 10256Kx10512Kx10

?Single power supply 2.4 V~ 5.5 V.

?Port1 and Port2 with wake-up function, Port3.2 with programmable IR (38 KHz carry) communication

function.

?Power down mode for saving power consumption.

?Single ROM for voice program data.

?Readable ROM code data.

?One 6-bit timer overflow control.

?Two stacks for subroutine calling.

?Dual channel output simultaneously : (voice + voice).

?5-bit ASPCM synthesizer.

?Multiple playing speeds in 2 KHz ~ 32 KHz for voice playback.

?Multiple levels of volume control.

?Fixed current D/A to drive external connected transistor for audio output.

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

20-key Application Circuit For EM56101A

20-key Application Circuit For EM56200A~EM56600A

32-key Application Circuit For EM56200A~EM56600A

128-key Application Circuit (A) For EM56200A~EM56600A

PAD DIAGRAM

Chip Size : 1300 x 1500 um

For PCB layout, IC substrate must be connected to Vss.(0,0)

EM56001A

5

891415

13P3.0P2.3P3.3

OSC TEST

GND 10P2.2

67P3.2P3.14VDD 3

VO1

PAD DIAGRAM

Chip Size : 1500 x 1400 um

For PCB layout, IC substrate must be connected to Vss.(0,0)

EM56101A

5

891415

1213P3.0P2.3P3.3

OSC TEST

P2.0GND 1011P2.2P2.167P3.2P3.14VDD 3

VO1

PAD DIAGRAM

Chip Size : 1700 x 1750 um

For PCB layout, IC substrate must be connected to Vss.(0,0)

EM56200A

9

11

12

1718

1516P2.1P3.2VO1

P2.0

TEST P2.3P2.21314P3.1P3.019

10

8

VO2

20

21

222324

25OSC GND P1.0P1.1P1.2P1.3

P3.3VDD

PAD DIAGRAM

Chip Size : 1700 x 2000 um

For PCB layout, IC substrate must be connected to Vss.(0,0)

EM56300A

9

11

12

1718

1516P2.1P3.2VO1

P2.0

TEST P2.3P2.21314P3.1P3.019

10

8

VO2

20

21

222324

25OSC GND P1.0P1.1P1.2P1.3

P3.3VDD

PAD DIAGRAM

Chip Size : 1700 x 2500 um

For PCB layout, IC substrate must be connected to Vss.(0,0)

EM56400A

9

11

12

17

18

15

16

P2.1P3.2VO1

P2.0

TEST P2.3P2.213

14

P3.1P3.019

10

8

VO2

2021

22232425

OSC GND P1.0P1.1P1.2P1.3

P3.3VDD

PAD DIAGRAM

Chip Size : 1700 x 3600 um

For PCB layout, IC substrate must be connected to Vss.(0,0)

EM56500A

9

11

12

1718

1516P2.1P3.2VO1

P2.0

TEST P2.3P2.21314P3.1P3.019

10

8

VO2

20

21

2223

2425OSC GND P1.0P1.1P1.2P1.3

P3.3VDD

PAD DIAGRAM

Chip Size : 3050 x 3100 um

For PCB layout, IC substrate must be connected to Vss.(0,0)

EM56600A

9

111217181516P2.1P3.2VO1

P2.0TEST P2.3P2.21314P3.1P3.019108VO2202122

23

2425

OSC GND

P1.0

P1.1P1.2P1.3P3.3VDD