SOC_design&Test6

SOC_design&Test6
SOC_design&Test6

System-on-a-Chip Design and Test:

Part 1 -Methods

Lecture 6

Design for testability

Nicola Nicolici

Computer-Aided Design and Test Research Group

McMaster University

该文由浅入深的讲解了SOC设计和测试的基本方法。全文共分9部分, 该文版权归作者与McMaster University版权所有。

由https://www.360docs.net/doc/3c1343333.html,和https://www.360docs.net/doc/3c1343333.html,收集整理,仅供本站内部学习讨论。

Overview

Design for testability

Scan design (full)

Partial scan

Boundary scan

Scan educator (https://www.360docs.net/doc/3c1343333.html,/sc/data/jtag/) Summary

Design for testability

Design for testability(DFT): design techniques that make test generation and test application cost-effective

Design practices learnt through experience as guidelines:?Avoid asynchronous (unclocked) feedback

?Make flip-flops initializable

?Avoid redundant gates and avoid large fanin gates

?Provide test control for difficult-to-control signals

?Avoid gated clocks

Disadvantages of ad-hoc DFT methods:

?Experts and tools not always available

?Tests with no guarantee of high fault coverage

?Design iterations may be necessary

Scan design

Circuit is designed using pre-specified design rules

Test structure is added to the verified design:

?Add a test control(TC) primary input

?Replace flip-flops by scan flip-flops(SFF)

?Connect SFF to form one or more shift registers

?Scan input controlled through primary inputs (PI)

?Scan output observed through primary outputs (PO) Use combinational test generation to obtain tests!

Add shift register tests for use in manufacturing test

Scan design rules

Use only clocked D-type of flip-flops for all state variables At least one PI pin must be available for test:

?More pins, if available, can be used

All clocks must be controlled from PIs

Clocks must not feed data inputs of flip-flops

Correcting a rule violation All clocks must be controlled from PIs.

Comb.

logic D1

D2

Comb.

logic

Q

FF

Comb.

logic

D1

D2

CK

Q

FF

Comb.

logic

Scan flip flop

MUX

Logic overhead

D flip-flop

Master latch Slave latch

D TC

Q

Q

SD

CK

Slave open

Master open

CK

t

Normal mode, D selected

Scan mode, SD selected

TC

t

Adding scan structure

Combinational

logic SFF SFF SFF

PI PO

SCANOUT TC or TCK Not shown: CK or

MCK/SCK feed all

SFFs.

SCANIN

Testing combinational logic

I2

I1

S1 S2

Don’t care or random

bits

PI

SCANIN

TC

0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0

O1O2

N1 N2

PO

SCANOUT

n comb = number of combinational vectors n sff = number of scan flip-flops

Testing sequential logic

Scan register tested before of combinational logic

A shift sequence 00110011 . . . of length n sff+4in scan

mode (TC=0) produces 00, 01, 11 and 10 transitions in all flip-flops and observes the result at SCANOUT output

Total scan test length: (n comb+ 2)n sff+n comb+ 4 clocks 2,000 scan flip-flops, 500 combinational vectors:?Total scan test length ~ 106clocks

Multiple scan registers reduce test length

Multiple scan chains

Scan flip-flops can be distributed among any number of

shift registers, with separate scanin and scanout pins Test sequence length given by the longest scan chain Just one test control (TC) pin is essential

PI

PO

Combinational

logic

SFF

SFF

SFF

CK

TC Scan Out

Scan overhead

Input/Output pins:

?At least one pin necessary (TC)

?Scan in and scan out pins if not multiplexed with PI/PO Area overhead:

?Gate overhead = [4n sff /(n g +10n ff )] x 100%, where n g = comb. gates ;n ff = flip-flops ; Example –n g = 100k gates ,n ff = 2k flip-flops , overhead = 6.7%

?Accurate estimate considers wiring and layout area Performance overhead:

?Multiplexer delay added in combinational path:

–Approximate two gate-delays

?Flip-flop output loading due to one additional fanout:

–Approximate 5-6%

Hierarchical scan

Scan flip-flops are chained within subnetworks: Advantages:

?Automatic scan insertion in netlist ?Circuit hierarchy preserved

?Helps in debugging and design changes Disadvantage: Non-optimum chip layout

SFF3

SFF1

SFF2

SFF4SFF1

SFF2

SFF3

SFF4

Scanout

Scanin

Scanin

Hierarchical netlist

Flat layout

Optimum scan layout

Interconnects

Routing channels

IO pad Flip-flop cell

SFF cell

TC

X’

X

Y’Y

Active areas: XY and X’Y’

Linear dimensions of active area:

X = (C + S) / r

X’ = (C + S +aS) / r

Y’ = Y + ry = Y + Y(1--b) / T

Area overhead:

X’Y’--XY

= --------------x 100%

XY

1--b

= [(1+as)(1+ -------)–1]x 100%

T

1--b

= (as + -------)x 100%

T y = track dimension, wire width+separation C = total comb. cell width

S = total non-scan FF cell width

s = fractional FF cell area = S/(C+S)

a = SFF cell width fractional increase

r = number of cell rows or routing channels b = routing fraction in active area

T = cell height in track dimension y

2,000-gate CMOS chip

Fractional area under flip-flop cells, s = 0.478 Scan flip-flop (SFF) cell width increase, α = 0.25 Routing area fraction, β = 0.471

Cell height in routing tracks, T = 10

Calculated overhead = 17.24%

Actual measured data:

Scan implementation Area overhead Normalized clock rate

_________________________________________________________ None 0.0 1.00

Hierarchical 16.93% 0.87

Optimum layout 11.90% 0.91

Scan test generation benefits

Reduce sequential automatic test pattern generation (ATPG) to combinational ATPG

Original

2,781

179

0.0%

4,603

35/49

70.0%

70.9%

5,533 s

414

414

Full-scan

2,781

179

15.66%

4,603

214/228

99.1%

100.0%

5 s

585

105,662

Number of combinational gates

Number of non-scan flip-flops (10 gates each)

Number of scan flip-flops (14 gates each)

Gate overhead

Number of faults

PI/PO for ATPG

Fault coverage

Fault efficiency

CPU time on SUN Ultra II, 200MHz processor

Number of ATPG vectors

Scan sequence length

Scan automation

Behavior, RTL, and logic

Design and verification

Rule

violations

Scan design

rule audits

Gate-level

netlist

Combinational

ATPG

Scan hardware

insertion

Chip layout: Scan-

chain optimization,

timing verification Scan sequence

and test program

generation

Scan chain order

Combinational

vectors

Scan

netlist

Design and test

data for

manufacturing Mask data

Test program

Timing and power issues

Scan delays and clock skew can cause race condition Large delays in scan path require slower scan clock

Random signal activity in combinational circuit during scan can cause excessive power dissipation

Need for new solutions:

?Maintain the benefit of combinational ATPG

?Reduce the overhead

Partial scan!

Partial scan

A subset of flip-flops is scanned

Objectives:

?Minimize area overhead and scan sequence length ?Achieve required fault coverage

?Exclude selected flip-flops from scan:

–Improve performance

–Allow limited scan design rule violations ?Allow automation:

–In scan flip-flop selection

–In test generation

?Shorter scan sequences

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