STS10DN3LH5;中文规格书,Datasheet资料
May 2009Doc ID 15624 Rev 11/13
STS10DN3LH5
Dual N-channel 30 V , 0.019 ?, 10 A, SO-8
STripFET? V Power MOSFET
■R DS(on) * Q g industry benchmark ■Extremely low on-resistance R DS(on)■Very low switching gate charge ■High avalanche ruggedness ■
Low gate drive power losses
Application
■
Switching applications
Description
This STripFET?V Power MOSFET technology is among the latest improvements, which have been especially tailored to achieve very low on-state resistance providing also one of the best-in-class FOM.
Features
Type V DSS R DS(on) max I D STS10DN3LH5
30 V
0.021 ?
10 A
Table 1.Device summary
Order codes Marking Package Packaging STS10DN3LH5
10DD3L
SO-8
Tape and reel
https://www.360docs.net/doc/3810070895.html,
Contents STS10DN3LH5
Contents
1Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
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STS10DN3LH5Electrical ratings
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1 Electrical ratings
Table 2.
Absolute maximum ratings
Symbol Parameter
Value Unit V DS Drain-source voltage (V GS = 0)30V V GS Gate-Source voltage
± 22V I D (1)1.Limited by wire bonding
Drain current (continuous) at T C = 25 °C 10A I D Drain current (continuous) at T C = 100 °C 7A I DM (2)2.Pulse width limited by safe operating area Drain current (pulsed)40A P TOT T otal dissipation at T C = 25 °C 2.5W Derating factor
0.02W/°C E AS (3)3.Starting T J = 25 °C, I D = 21 A, L= 0.2 mH
Single pulse avalanche energy 50mJ T J
T stg
Operating junction temperature Storage temperature
- 55 to 150
°C
Table 3.
Thermal resistance
Symbol Parameter
Value Unit R thJC Thermal resistance junction-case max 50°C/W R thJA Thermal resistance junction-case max 100°C/W T J
Maximum lead temperature for soldering purpose
275
°C
Electrical characteristics STS10DN3LH5
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2 Electrical characteristics
(T CASE = 25 °C unless otherwise specified)Table 4.
Static
Symbol Parameter Test conditions
Min.Typ.Max.Unit V (BR)DSS Drain-source
breakdown Voltage
I D = 250 μA, V GS = 0
30
V I DSS
Zero gate voltage
drain current (V GS = 0)V DS = 30 V V DS = 30 V , Tc = 125 °C 110
μA μA I GSS Gate body leakage current (V DS = 0)
V GS = ± 22 V
±100
nA V GS(th)Gate threshold voltage V DS = V GS , I D = 250 μA 1
V
R DS(on)
Static drain-source on resistance V GS = 10 V , I D = 5 A 0.0190.021?V GS = 4.5 V , I D = 5 A
0.023
0.028
?
Table 5.
Dynamic
Symbol Parameter Test conditions
Min
Typ.Max.
Unit C iss
C oss C rss Input capacitance Output capacitance Reverse transfer capacitance V DS = 25 V , f = 1 MHz, V GS = 0
-4759719-
pF pF pF Q g Q gs Q gd T otal gate charge Gate-source charge Gate-drain charge
V DD = 15 V , I D = 10 A V GS = 5 V (Figure 14)
- 4.61.71.9-
nC nC nC Q gs1Q gs2
Pre V th gate-to-source
charge
Post V th gate-to-source charge
V DD = 15 V , I D = 10A
V GS = 5 V
(Figure 19)-0.670.84
-nC
nC
R G
Gate input resistance f = 1 MHz gate bias Bias = 0 test signal level = 20 mV open drain
- 2.5-?
STS10DN3LH5Electrical characteristics
Doc ID 15624 Rev 15/13
Table 6.
Switching on/off (resistive load)
Symbol Parameter
Test conditions Min.
Typ.Max.
Unit t d(on)t r Turn-on delay time Rise time
V DD = 15 V , I D = 5 A, R G = 4.7 ?, V GS = 10 V (Figure 13 and Figure 18)-422
-
ns ns
t d(off)t f
Turn-off delay time Fall time V DD = 15 V , I D = 5 A, R G = 4.7 ?, V GS = 10 V (Figure 13 and Figure 18)
-132.8
-
ns ns
Table 7.
Source drain diode
Symbol Parameter
Test conditions
Min.Typ.
Max.Unit I SD I SDM (1)1.Pulsed: pulse duration = 300 μs, duty cycle 1.5 %
Source-drain current Source-drain current (pulsed)
-1040A A V SD Forward on voltage I SD = 5 A, V GS = 0- 1.1
V t rr Q rr I RRM
Reverse recovery time Reverse recovery charge Reverse recovery current
I SD = 10 A, V DD = 25 V di/dt = 100 A/μs, (Figure 15)
-
16.27.81ns nC A
Electrical characteristics STS10DN3LH5
2.1 Electrical characteristics (curves)
Figure 2.Safe operating area Figure 3.Thermal impedance
Figure 4.Output characteristics Figure 5.Transfer characteristics
Figure 6.Normalized BV DSS vs temperature Figure 7.Static drain-source on resistance
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STS10DN3LH5Electrical characteristics
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Figure 8.
Gate charge vs gate-source voltage Figure 9.
Capacitance variations
Figure 10.Normalized gate threshold voltage
Figure 11.Normalized on resistance vs
Figure 12.Source-drain diode forward
Test circuits STS10DN3LH5
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3 Test circuits
Figure 13.Switching times test circuit for
Figure 14.Gate charge test circuit
Figure 15.Test circuit for inductive load
Figure 16.Unclamped inductive load test
Figure 17.Unclamped inductive waveform
Figure 18.Switching time waveform
STS10DN3LH5Test circuits Figure 19.Gate charge waveform
Doc ID 15624 Rev 19/13
Package mechanical data STS10DN3LH5 4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK? packages, depending on their level of environmental compliance. ECOPACK?
specifications, grade definitions and product status are available at: https://www.360docs.net/doc/3810070895.html,. ECOPACK
is an ST trademark.
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分销商库存信息: STM
STS10DN3LH5