SIR408DP-T1-GE3;中文规格书,Datasheet资料
Vishay Siliconix
SiR408DP
Document Number: https://www.360docs.net/doc/5012369933.html,
N-Channel 25-V (D-S) MOSFET
FEATURES
?Halogen-free According to IEC 61249-2-21
Definition
?TrenchFET ? Power MOSFET ?100 % R g Tested ?100 % UIS Tested
?Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
?Server ?POL
?DC/DC High Side
PRODUCT SUMMARY
V DS (V)R DS(on) (Ω)I D (A)a Q g
(Typ.)25
0.0063 at V GS = 10 V 50a 9.3 nC
0.008 at V GS = 4.5 V
50a
Notes:
a.Based on T C = 25 °C. Package limited.
b.Surface Mounted on 1" x 1" FR4 board.
c.t = 10 s.
d.See Solder Profile (https://www.360docs.net/doc/5012369933.html,/ppg?73257). The PowerPAK SO-8 is a leadless packag
e. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
e.Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f.Maximum under Steady State conditions is 70 °C/W.ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
arameter Symbol Limit Unit Drain-Source Voltage V DS 25
V
Gate-Source Voltage V GS ± 20
Continuous Drain Current (T J = 150 °C)
T C = 25 °C I D 50a A
T C = 70 °C 50a
T A = 25 °C 21.5b, c
T A = 70 °C 17.2b, c
Pulsed Drain Current I DM 70
Avalanche Current L = 0.1 mH
I AS
35Avalanche Energy E AS 61
mJ Continuous Source-Drain Diode Current T C = 25 °C I S 37.2
A
T A = 25 °C 4b, c Maximum Power Dissipation
T C = 25 °C P D 44.6W T C = 70 °C 28.6
T A = 25 °C 4.8b, c T A = 70 °C 3.1b, c
Operating Junction and Storage T emperature Range T J , T stg - 55 to 150
°C Soldering Recommendations (Peak Temperature)d, e 260
THERMAL RESISTANCE RATINGS
arameter Symbol Typical Maximum
Unit
Maximum Junction-to-Ambient
b, f t ≤ 10 s R thJA 2126°C/W
Maximum Junction-to-Case (Drain)Steady State
R thJC 2.4 2.8
https://www.360docs.net/doc/5012369933.html, Document Number: 65036Vishay Siliconix
SiR408DP
Notes:
a. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T J = 25 °C, unless otherwise noted
arameter Symbol Test Conditions Min. Typ.Max.Unit
Static
Drain-Source Breakdown Voltage V DS V GS = 0 V , I D = 250 μA
25
V V DS Temperature Coefficient ΔV DS /T J I D = 250 μA
27mV/°C V GS(th) T emperature Coefficient ΔV GS(th)/T J - 5.5
Gate-Source Threshold Voltage V GS(th)V DS = V GS , I D = 250 μA 1 2.5V Gate-Source Leakage
I GSS V DS = 0 V , V GS = ± 20 V ± 100nA Zero Gate Voltage Drain Current I DSS V DS = 25 V , V GS = 0 V 1μA V DS = 25 V , V GS = 0 V , T J = 55 °C
5
On-State Drain Current a
I D(on) V DS ≥ 5 V, V GS = 10 V 50
A Drain-Source On-State Resistance a R DS(on)V GS = 10 V , I D = 20 A 0.00520.0063ΩV GS = 4.5 V, I D = 15 A 0.00640.008
Forward T ransconductance a g fs
V DS = 15 V , I D = 20 A
85
S
Dynamic b
Input Capacitance C iss V DS = 15 V , V GS = 0 V, f = 1 MHz
1230pF
Output Capacitance
C oss 315Reverse Transfer Capacitance C rss 115Total Gate Charge Q g V DS = 12.5 V, V GS = 10 V , I
D = 20 A 21.533nC V DS = 12.5 V , V GS = 4.5 V , I D = 20 A 9.314
Gate-Source Charge Q gs 3.2Gate-Drain Charge Q gd 2.6Gate Resistance R g f = 1 MHz
0.8 1.6Ω
Turn-On Delay Time t d(on) V DD = 12.5 V , R L = 12.5 Ω I D ? 1.0 A, V GEN = 4.5 V, R g = 1 Ω
2030ns Rise Time
t r 2842Turn-Off Delay Time t d(off) 3045Fall Time
t f 1120Turn-On Delay Time t d(on) V DD = 12.5 V , R L = 12.5 Ω I D ? 1.0 A, V GEN = 10 V , R g = 1 Ω1225Rise Time
t r 1525Turn-Off Delay Time t d(off) 3045Fall Time
t f
8
15
Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current I S T C = 25 °C
44.6A Pulse Diode Forward Current I SM 70Body Diode Voltage
V SD I S = 4.0 A, V GS = 0 V
0.75 1.2V Body Diode Reverse Recovery Time t rr I F = 4.0 A, dI/dt = 100 A/μs, T J = 25 °C
2650ns Body Diode Reverse Recovery Charge Q rr 2450
nC Reverse Recovery Fall Time t a 16.5ns
Reverse Recovery Rise Time
t b
9.5
Document Number: https://www.360docs.net/doc/5012369933.html,
Vishay Siliconix
SiR408DP
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
Gate Charge
Transfer Characteristics
https://www.360docs.net/doc/5012369933.html, Document Number: 65036Vishay Siliconix
SiR408DP
TYPICAL CHARACTERISTICS 25°C, unless otherwise noted
Source-Drain Diode Forward Voltage
Threshold Voltage
On-Resistance vs. Gate-to-Source Voltage
Single Pulse Power (Junction-to-Ambient)
Document Number: https://www.360docs.net/doc/5012369933.html,
Vishay Siliconix
SiR408DP
TYPICAL CHARACTERISTICS 25°C, unless otherwise noted
* The power dissipation P D is based on T J(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit.
Current Derating*
Power, Junction-to-Case Power, Junction-to-Ambient
SiR408DP
Vishay Siliconix
TYPICAL CHARACTERISTICS 25°C, unless otherwise noted
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see https://www.360docs.net/doc/5012369933.html,/ppg?65036.
https://www.360docs.net/doc/5012369933.html, Document Number: 65036
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SIR408DP-T1-GE3