SN74ALVCH162373GR,SN74ALVCH162373GR,SN74ALVCH162373GR,74ALVCH162373GRE4,, 规格书,Datasheet 资料

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FEATURES

DESCRIPTION/ORDERING INFORMATION

DGG OR DL PACKAGE

(TOP VIEW)

CC

CC

The outputs,which are designed to sink up to12mA,include equivalent26-?resistors to reduce overshoot and

SN74ALVCH162373

16-BIT TRANSPARENT D-TYPE LATCH

WITH3-STATE OUTPUTS

SCES583A–JULY2004–REVISED OCTOBER2004

?Member of the Texas Instruments Widebus?

Family

?Bus Hold on Data Inputs Eliminates the Need

for External Pullup/Pulldown Resistors

?Output Ports Have Equivalent26-?Series

Resistors,So No External Resistors Are

Required

?Latch-Up Performance Exceeds250mA Per

JESD17

?ESD Protection Exceeds JESD22

–2000-V Human-Body Model(A114-A)

–200-V Machine Model(A115-A)

This16-bit transparent D-type latch is designed for

1.65-V to3.6-V V CC operation.

The SN74ALVCH162373is particularly suitable for

implementing buffer registers,I/O ports,bidirectional

bus drivers,and working registers.This device can

be used as two8-bit latches or one16-bit latch.

When the latch-enable(LE)input is high,the Q

outputs follow the data(D)inputs.When LE is taken

low,the Q outputs are latched at the levels set up at

the D inputs.

A buffered output-enable(OE)input can be used to

place the eight outputs in either a normal logic state

(high or low logic levels)or the high-impedance state.

In the high-impedance state,the outputs neither load

nor drive the bus lines significantly.The

high-impedance state and the increased drive provide

the capability to drive bus lines without need for

interface or pullup components.OE does not affect

internal operations of the latch.Old data can be

retained or new data can be entered while the

outputs are in the high-impedance state.

undershoot.

ORDERING INFORMATION

T A PACKAGE(1)ORDERABLE PART NUMBER TOP-SIDE MARKING

Tube SN74ALVCH162373DL

SSOP-DL ALVCH162373

Tape and reel SN74ALVCH162373LR

-40°C to85°C

TSSOP-DGG Tape and reel SN74ALVCH162373GR ALVCH162373

VFBGA-GQL Tape and reel SN74ALVCH162373KR VH2373

(1)Package drawings,standard packing quantities,thermal data,symbolization,and PCB design guidelines are available at

https://www.360docs.net/doc/a210403865.html,/sc/package.

Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Widebus is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.Copyright?2004,Texas Instruments Incorporated Products conform to specifications per the terms of the Texas

Instruments standard warranty.Production processing does not

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DESCRIPTION/ORDERING INFORMATION (CONTINUED)

GQL PACKAGE (TOP VIEW)A B C D E F G H J K

1

2

3

4

5

6

1OE 1LE

1D1To Seven Other Channels

1Q1

2OE 2LE

2D1

2Q1

To Seven Other Channels

Pin numbers shown are for the DGG and DL packages.

SN74ALVCH162373

16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS

SCES583A–JULY 2004–REVISED OCTOBER 2004

To ensure the high-impedance state during power up or power down,OE should be tied to V CC through a pullup resistor;the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry holds unused or undriven data inputs at a valid logic https://www.360docs.net/doc/a210403865.html,e of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

XXX

XXX

TERMINAL ASSIGNMENTS (1)

1

23456A 1OE NC NC NC NC 1LE B 1Q21Q1GND GND 1D11D2C 1Q41Q3V CC V CC 1D31D4D 1Q61Q5GND

GND

1D51D6E 1Q81Q71D71D8F 2Q12Q22D22D1G 2Q32Q4GND GND 2D42D3H 2Q52Q6V CC V CC 2D62D5J 2Q72Q8GND GND 2D82D7K 2OE

NC

NC

NC

NC

2LE

(1)

NC -No internal connection

FUNCTION TABLE (each 8-bit section)

INPUTS OUTPUT

Q

OE LE D L H H H L H L L L L X Q 0H

X

X

Z

LOGIC DIAGRAM (POSITIVE LOGIC)

2

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ABSOLUTE MAXIMUM RATINGS(1) RECOMMENDED OPERATING CONDITIONS(1)

SN74ALVCH162373 16-BIT TRANSPARENT D-TYPE LATCH

WITH3-STATE OUTPUTS SCES583A–JULY2004–REVISED OCTOBER2004

over operating free-air temperature range(unless otherwise noted)

MIN MAX UNIT

V CC Supply voltage range-0.5 4.6V

V I Input voltage range(2)-0.5 4.6V

V O Output voltage range(2)(3)-0.5V CC+0.5V

I IK Input clamp current V I<0-50mA

I OK Output clamp current V O<0-50mA

I O Continuous output current±50mA

Continuous current through each V CC or GND±100mA

DGG package70

θJA Package thermal impedance(4)DL package63°C/W

GQL package42

T stg Storage temperature range-65150°C (1)Stresses beyond those listed under"absolute maximum ratings"may cause permanent damage to the device.These are stress ratings

only,and functional operation of the device at these or any other conditions beyond those indicated under"recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

(3)This value is limited to4.6V maximum.

(4)The package thermal impedance is calculated in accordance with JESD51-7.

MIN MAX UNIT V CC Supply voltage 1.65 3.6V

V CC=1.65V to1.95V0.65×V CC V CC

V IH High-level input voltage V CC=2.3V to2.7V 1.7V CC V

V CC=2.7V to3.6V2V CC

V CC=1.65V to1.95V00.35×V CC

V IL Low-level input voltage V CC=2.3V to2.7V00.7V

V CC=2.7V to3.6V00.8

V O Output voltage0V CC V

V CC=1.65V-2

V CC=2.3V-6

I OH High-level output current mA

V CC=2.7V-8

V CC=3V-12

V CC=1.65V2

V CC=2.3V6

I OL Low-level output current mA

V CC=2.7V8

V CC=3V12

?t/?v Input transition rise or fall rate10ns/V T A Operating free-air temperature-4085°C (1)All unused control inputs of the device must be held at V CC or GND to ensure proper device operation.Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs,literature number SCBA004.

3

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ELECTRICAL CHARACTERISTICS

TIMING REQUIREMENTS

SN74ALVCH162373

16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS

SCES583A–JULY 2004–REVISED OCTOBER 2004

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V CC

MIN TYP (1)MAX

UNIT

I OH =-100μA 1.65V to 3.6V

V CC -0.2

I OH =-2mA 1.65V 1.2I OH =-4mA

2.3V 1.9V OH

2.3V 1.7V

I OH =-6mA 3V 2.4I OH =-8mA 2.7V 2I OH =-12mA 3V 2

I OL =100μA 1.65V to 3.6V

0.2I OL =2mA 1.65V 0.45I OL =4mA

2.3V 0.4V OL

2.3V 0.55V I OL =6mA 3V 0.55I OL =8mA 2.7V 0.6I OL =12mA

3V 0.8I I

V I =V CC or GND 3.6V ±5

μA V I =0.58V 1.65V 25V I =1.07V 1.65V -25V I =0.7V

2.3V 45I I(hold)

V I =1.7V 2.3V -45μA

V I =0.8V 3V 75V I =2V 3V -75

V I =0to 3.6V (2)

3.6V ±500I OZ V O =V CC or GND 3.6V ±10μA I CC V I =V CC or GND,I O =0

3.6V 40μA ?I CC One input at V CC -0.6V,Other inputs at V CC or GND

3V to 3.6V 750

μA Control inputs 3C i V I =V CC or GND 3.3V pF Data inputs 6C o Outputs

V O =V CC or GND

3.3V

7

pF (1)All typical values are at V CC =3.3V,T A =25°C.

(2)

This is the bus-hold maximum dynamic current.It is the minimum overdrive current required to switch the input from one state to another.

over recommended operating free-air temperature range (unless otherwise noted)(see Figure 1)

V CC =1.8V V CC =2.5V V CC =3.3V V CC =2.7V ±0.15V ±0.2V ±0.3V UNIT

MIN MAX

MIN MAX

MIN MAX MIN MAX

t w Pulse duration,LE high or low 3.3 3.3 3.3 3.3ns t su Setup time,data before LE ↓ 1.1 1.1 1.1 1.1ns t h

Hold time,data after LE ↓

1.1

1.1

1.1

1.1

ns 4

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SWITCHING CHARACTERISTICS OPERATING CHARACTERISTICS

SN74ALVCH162373 16-BIT TRANSPARENT D-TYPE LATCH

WITH3-STATE OUTPUTS SCES583A–JULY2004–REVISED OCTOBER2004

over recommended operating free-air temperature range(unless otherwise noted)(see Figure1)

V CC=1.8V V CC=2.5V V CC=3.3V

V CC=2.7V

FROM TO±0.15V±0.2V±0.3V PARAMETER UNIT (INPUT)(OUTPUT)

MIN MAX MIN MAX MIN MAX MIN MAX

D1 6.31 5.31 4.5 1.14 t pd Q ns

LE1 6.61 5.6151 4.2 t en OE Q17.21 6.5 1.5615ns t dis OE Q1 6.51 5.6 1.5 5.5 1.4 4.5ns t sk(o)10.50.50.5ns

T

A

=25°C

V CC=1.8V V CC=2.5V V CC=3.3V PARAMETER TEST CONDITIONS UNIT

TYP TYP TYP

Outputs enabled202226

C pd Power dissipation capacitance C L=50pF,f=10MHz pF

Outputs disabled6 6.58

5

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PARAMETER MEASUREMENT INFORMATION

V OH V OL

From Output Under Test

LOAD CIRCUIT

Open Output Control (low-level enabling)

Output Waveform 1S1 at V LOAD (see Note B)

Output Waveform 2S1 at GND (see Note B)0 V

0 V

V I 0 V

0 V

V I

V I

VOLTAGE WAVEFORMS SETUP AND HOLD TIMES

VOLTAGE WAVEFORMS PULSE DURATION

VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES

Timing Input

Data Input

Input

t pd t PLZ /t PZL t PHZ /t PZH

Open V LOAD GND

TEST S1NOTES: A.C L includes probe and jig capacitance.

B.Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.

Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z O = 50 ?.D.The outputs are measured one at a time, with one transition per measurement.E.t PLZ and t PHZ are the same as t dis .F.t PZL and t PZH are the same as t en .G.t PLH and t PHL are the same as t pd .

H.All parameters and waveforms are not applicable to all devices.

0 V

V I

Input

Output

VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES

V LOAD /2

1.8 V

2.5 V ± 0.2 V

2.7 V

3.3 V ± 0.3 V

1 k ?500 ?500 ?500 ?

V CC R L 2 × V CC 2 × V CC 6 V 6 V

V LOAD C L 30 pF 30 pF 50 pF 50 pF

0.15 V 0.15 V 0.3 V 0.3 V

V ?V CC V CC 2.7 V 2.7 V

V I V CC /2V CC /21.5 V 1.5 V

V M t r /t f ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns

INPUT SN74ALVCH162373

16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS

SCES583A–JULY 2004–REVISED OCTOBER 2004

Figure 1.Load Circuit and Voltage Waveforms

6

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing

Pins Package Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login)

74ALVCH162373DLG4ACTIVE SSOP DL 4825Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74ALVCH162373GRE4ACTIVE TSSOP DGG 482000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74ALVCH162373GRG4ACTIVE TSSOP DGG 482000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74ALVCH162373LRG4ACTIVE SSOP DL 481000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74ALVCH162373ZQLR

ACTIVE

BGA MICROSTAR JUNIOR

ZQL

56

1000

Green (RoHS & no Sb/Br)SNAGCU

Level-1-260C-UNLIM

SN74ALVCH162373DL ACTIVE SSOP DL 4825Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALVCH162373GR ACTIVE TSSOP DGG 482000Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM SN74ALVCH162373KR

LIFEBUY

BGA MICROSTAR JUNIOR

GQL

56

1000

TBD

SNPB

Level-1-240C-UNLIM

SN74ALVCH162373LR

ACTIVE SSOP

DL 481000

Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

(1)

The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check https://www.360docs.net/doc/a210403865.html,/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

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(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

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TAPE AND REEL

INFORMATION

*All dimensions are nominal

Device

Package Type Package Drawing Pins SPQ

Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant 74ALVCH162373ZQLR BGA MI CROSTA R JUNI OR ZQL

56

1000

330.0

16.4

4.8

7.3

1.45

8.0

16.0

Q1

SN74ALVCH162373GR TSSOP DGG 482000330.024.48.615.8 1.812.024.0Q1SN74ALVCH162373KR

BGA MI CROSTA R JUNI OR GQL

56

1000

330.0

16.4

4.8

7.3

1.45

8.0

16.0

Q1

SN74ALVCH162373LR SSOP

DL 481000330.032.411.3516.2 3.116.032.0Q1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm)

ZQL561000333.2345.928.6

74ALVCH162373ZQLR BGA MICROSTAR

JUNIOR

SN74ALVCH162373GR TSSOP DGG482000367.0367.045.0

SN74ALVCH162373KR BGA MICROSTAR

GQL561000333.2345.928.6

JUNIOR

SN74ALVCH162373LR SSOP DL481000367.0367.055.0

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