DESIGN GUIDE SFX12V v09

DESIGN GUIDE SFX12V v09
DESIGN GUIDE SFX12V v09

SFX/SFX12V Power Supply Design Guide

Version 0.9 of updated SFX PSDG, for review only

Document Revision

Version Release Date Notes

1.0 12/97 Public

release

1.1 4/98 ? Updated all mechanical outlines to clean up

dimensioning of mounting holes.

? Added chassis cutouts for all mechanical outlines to

clarify keep-out areas.

? Added Appendix C.

0.5 Preliminary

Not Released

For Review Only

1/01 ? Document Reformatted

? Additional power ratings added

? Standby current increased to a minimum of 1A ? Change external fan shutoff to, "optional". ? Add SFX12V description

0.7 Preliminary

Not Released

For Review Only

2/01 ? Updated industry standards

? Revised current specifications on SFX12V

0.9 Preliminary

Not Released

For Review Only

3/01 ? Revised sections for clarity ? 180W Power ratings added

SFX/SFX12V Power Supply Design Guide

Version 0.9 of updated SFX PSDG

IMPORTANT INFORMATION AND DISCLAIMERS

1. INTEL CORPORATION (AND ANY CONTRIBUTOR) IS PROVIDING THIS INFORMATION AS

A CONVENIENCE AND ACCORDINGLY MAKES NO WARRANTIES WITH REGARD TO THIS

DOCUMENT. IN PARTICULAR, INTEL (AND ANY CONTRIBUTOR) DOES NOT WARRANT OR

REPRESENT THAT THIS DOCUMENT OR ANY PRODUCTS MADE IN CONFORMANCE WITH IT WILL OPERATE IN THE INTENDED MANNER. NOR DOES INTEL (OR ANY CONTRIBUTOR)

ASSUME RESPONSIBILITY FOR ANY ERRORS THAT THE DOCUMENT MAY CONTAIN.

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THE INFORMATION PROVIDED IN THIS DOCUMENT, INCLUDING LIABILITY FOR

INFRINGEMENT OF ANY PROPRIETARY RIGHTS RELATING TO THE INFORMATION OR THE

IMPLEMENTATION OF INFORMATION IN THIS DOCUMENT. INTEL DOES NOT WARRANT OR REPRESENT THAT SUCH DEVICES OR IMPLEMENTATION WILL NOT INFRINGE SUCH RIGHTS.

INTEL IS NOT OBLIGATED TO PROVIDE ANY SUPPORT, INSTALLATION OR OTHER

ASSISTANCE WITH REGARD TO THE INFORMATION.

4. THE INFORMATION REFERRED TO IN THIS DOCUMENT IS INTENDED FOR STANDARD

COMMERCIAL USE ONLY. CUSTOMERS ARE SOLELY RESPONSIBLE FOR ASSESSING THE

SUITABILITY OF THE INFORMATION FOR USE IN PARTICULAR APPLICATIONS. THE

INFORMATION IS NOT INTENDED FOR USE IN CRITICAL CONTROL OR SAFETY SYSTEMS,

MEDICAL OR LIFE SAVING APPLICATIONS, OR IN NUCLEAR FACILITY APPLICATIONS.

5. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY

INTELLECTUAL PROPERTY RIGHTS IS GRANTED HEREIN.

Copyright 2000, 2001 Intel Corporation. All rights reserved.

Version 0.9 of updated SFX PSDG, Mar 2001

? Third-party brands and names are the property of their respective owners.

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SFX/SFX12V Power Supply Design Guide

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Contents

1. Introduction....................................................................................................................................6 1.1. Scope.....................................................................................................................................6 1.2. Proposed changes for Version 2.0.. (6)

1.2.1. Reformat....................................................................................................................6 1.2.2. Increased Power .......................................................................................................6 1.2.3. Increased +5 VSB Current........................................................................................6 1.2.4. External Fan Control - Optional..................................................................................6 1.2.5. SFX12V......................................................................................................................7 2. Applicable Documents..................................................................................................................7 3. Electrical.........................................................................................................................................9 3.1. AC Input (9)

3.1.1. Input Overcurrent Protection.....................................................................................9 3.1.2. Inrush Current Limiting..............................................................................................9 3.1.3. Input Under Voltage ..................................................................................................10 3.1.4. Regulatory.................................................................................................................10 3.1.5. Catastrophic Failure Protection.................................................................................10 3.2. DC Output (10)

3.2.1. DC Voltage Regulation..............................................................................................10 3.2.2. Remote Sensing........................................................................................................11 3.2.3. Typical Power Distribution.........................................................................................11 3.2.4. Power Limit / Hazardous Energy Levels....................................................................13 3.2.5. Efficiency...................................................................................................................13 3.2.6. Output Ripple/Noise..................................................................................................13 3.2.7. Output Transient Response......................................................................................14 3.2.8. Capacitive Load.........................................................................................................15 3.2.9. Closed-loop Stability..................................................................................................15 3.2.10. +5 VDC / +3.3 VDC Power Sequencing..................................................................15 3.2.11. Voltage Hold-up Time..............................................................................................16 3.3. Timing / Housekeeping / Control.. (16)

3.3.1. PWR_OK...................................................................................................................16 3.3.2. PS_ON#....................................................................................................................17 3.3.3. +5 VSB......................................................................................................................18 3.3.4. Power-on Time..........................................................................................................18 3.3.5. Rise Time..................................................................................................................18 3.3.6. Overshoot at Turn-on / Turn-off ................................................................................19 3.3.7. Reset after Shutdown................................................................................................19 3.3.8. +5 VSB at AC Power-down.......................................................................................19 3.4. Output Protection. (19)

3.4.1. Over Voltage Protection............................................................................................19 3.4.2. Short-circuit Protection. (19)

SFX/SFX12V Power Supply Design Guide Version 0.9 of updated SFX PSDG

Page 4 3.4.3. No-load Operation (20)

3.4.4. Over Current Protection (20)

3.4.5. Over-Temperature Protection (20)

3.4.6. Output Bypass (20)

4. Mechanical (20)

4.1. Labeling / Marking (20)

4.2. Airflow / Fan (21)

4.3. AC Connector (21)

4.4. DC Connectors (22)

4.4.1. SFX Main Power Connector (23)

4.4.2. Peripheral Connector(s) (24)

4.4.3. Floppy Drive Connector (24)

4.4.4. +12V Power Connector (for SFX12V only) (24)

5. Environmental (25)

5.1. Temperature (25)

5.2. Thermal Shock (Shipping) (25)

5.3. Humidity (25)

5.4. Altitude (25)

5.5. Mechanical Shock (25)

5.6. Random Vibration (26)

5.7. Acoustics (26)

5.8.Ecological Requirements (26)

6. Electromagnetic Compatibility (27)

6.1. Emissions (27)

6.1.2Immunity (27)

6.2. Input Line Current Harmonic Content (27)

6.3. Magnetic Leakage Fields (28)

6.4. Reliability (28)

6.5. Mean Time Between Failures (MTBF) (28)

6.6.Voltage Fluctuations and Flicker (29)

7. Safety (29)

7.1. North America (29)

7.2. International (30)

8.0SYSTEM COOLING CONSIDERATIONS (30)

APPENDIX A GUIDELINES FOR A LOWER PROFILE PACKAGE (31)

APPENDIX B GUIDELINES FOR A TOP MOUNT FAN PACKAGE (33)

APPENDIX C GUIDELINES FOR A REDUCED DEPTH, TOP MOUNT FAN PACKAGE (36)

APPENDIX D GUIDELINES FOR A LOWER PROFILE PACKAGE (39)

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Figures

Figure 1. Differential Noise Test Setup.................................................................................................14 Figure 2. Power Supply Timing.............................................................................................................16 Figure 3. PS_ON# Signal Characteristics ............................................................................................18 Figure 4. SFX/SFX12V Connectors......................................................................................................23 Figure 5 40mm Profile Mechanical Outline...........................................................................................32 Figure 6 Chassis Cutout - Appendix A ................................................................................................32 Figure 7 Top Mount Fan Profile Mechanical Outline............................................................................34 Figure 8 Chassis Cutout - Appendix B .................................................................................................35 Figure 9 Recessed Fan Mounting ........................................................................................................35 Figure 10 Reduced Depth Top Mount Fan Profile Mechanical Outline................................................37 Figure 11 Chassis cutout - Appendix C................................................................................................38 Figure 12 60mm Mechanical Outline....................................................................................................40 Figure 13 Chassis Cutout (41)

Tables

Table 1. AC Input Line Requirements ..................................................................................................9 Table 2. DC Output Voltage Regulation...............................................................................................10 Table 3. Typical Power Distribution for a 90W SFX Configuration.......................................................11 Table 4. Typical Power Distribution for a 120W SFX Configuration.....................................................11 Table 5. Typical Power Distribution for a 150 W SFX Configuration....................................................12 Table 6. Typical Power Distribution for a 160W SFX12V Configuration ..............................................12 Table 7. Typical Power Distribution for 180W SFX12V Configuration .................................................12 Table 8. DC Output Noise/Ripple.........................................................................................................14 Table 9. DC Output Transient Step Sizes ............................................................................................15 Table 10. Output Capacitive Loads......................................................................................................15 Table 11. PWR_OK Signal Characteristics..........................................................................................17 Table 12. PS_ON# Signal Characteristics............................................................................................17 Table 13. Over Voltage Protection........................................................................................................19 Table 14: Harmonic Limits, Class A equipment .. (28)

SFX/SFX12V Power Supply Design Guide

Version 0.9 of updated SFX PSDG

1. Introduction

1.1. Scope

This document provides design suggestions for a family of small form factor power supplies, which are primarily intended for use with uATX and FlexATX systems. The connectors conform to the basic requirements of the ATX main board specification except that -5V is not available. It should not be inferred that all SFX power supplies must conform exactly to the content of this document. The design specifics described are not intended to support all possible systems, because power supply needs vary depending on system configuration.

1.2. Proposed changes for Version 2.0

This section provides a brief summary of the proposed changes to revise the SFX Power Supply Design Guide from Version 1.1 to Version 2.0.

1.2.1. Reformat

This design guide has been reformatted to more clearly show the case outline options.

1.2.2. Increased Power

The trend for faster and more powerful systems results in an increasing need for higher rated power supplies. Additional power ratings have been added with increased 5V and 12V current to meet the needs of today's and future system needs. Power ratings have been added at 120W and 150W. These have been added for guidance and are not intended to limit the choice of power ratings available.

1.2.3. Increased +5 VSB Current

Trends in PC system power management solutions (for example, “Instantly Available PC,” “Suspend-to-RAM”) are driving a need for increased +5 VSB current capability for all SFX-family power supplies. The previous +5 VSB output requirement is being raised to 1.0 amps minimum, with 2.0 amps preferred. Recommendations for momentary peak current have also been added to enable USB "wake on" devices. See Section 3.3.3 for details.

1.2.4. External Fan Control - Optional

With the implementation of "Suspend To RAM" (STR or S3 sleep state), the system can obtain a low power condition without the need for external fan shutoff. In STR mode, the main outputs including 12V are not available from the power supply and all system fans and the power supply fan will be off. FANC and FANM functions described in Version 1.1have been removed for Version 2.0. Some vendors may still offer the external Fan functions as an option.

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1.2.5. SFX12V

The latest generation of motherboards will have power delivery based on a 12V rail. To meet the needs of the higher 12V current a new connector has been defined to meet the increased current needs of these motherboards. Wattages at 160W and 180W have been defined to meet the requirements on Intel Pentium? 4 processor systems.

2. Applicable Documents

The latest revision in effect of the following documents forms a part of this document to the extent specified.

Document title Description

AB13-94-146 European Association of Consumer Electronics Manufacturers (EACEM) Hazardous Substance List / Certification

ANSI C62.41-1991 IEEE Recommended Practice on Surge Voltages in Low-Voltage AC Circuits ANSI C62.45-1992

IEEE Guide on Surge Testing for Equipment Connected to Low-Voltage AC Power Circuits

MIL-STD-105K Quality Control MIL-STD-217F Reliability Predictions for Electronic Equipment

MIL-C-5541

Chemical Conversion Coatings on Aluminum and Aluminum Alloys

CSA C22.2 No.234, Level 3 Safety of Component Power Supplies (Intended for use with Electronic Data Processing Equipment and Office Machines)

CAN/CSA C22.2 No.950-95, 3rd

edition

Safety of Information Technology Equipment Including Electrical Business Equipment

UL 1950, 3rd

edition, without D3 Deviation

Safety of Information Technology Equipment Including Electrical Business Equipment

IEC 60950, 2nd ed. 1991: plus A1, A2, A3, A4

Safety of Information Technology Equipment Including Business Equipment EN 60950, 2nd ed. 1992: plus A1, A2, A3, A4

Safety of Information Technology Equipment Including Business Equipment EMKO-TSE (74-SEC) 207/94 Nordic national requirement in addition to EN 60950

CISPR 22:1997 3rd

edition EN 55022:1998 Limits and Methods of Measurements of Radio Interference Characteristics of Information Technology Equipment, Class B

ANSI C63.4 – 1992

American National Standard for Methods of Measurement of Radio-Noise

Emissions from Low-Voltage Electrical and Electronic Equipment in the Range of 9 kHz to 40 GHz for EMI testing

AS/NZS 3548 (Class B) Australian Communications Authority, Standard for Electromagnetic Compatibility (AU & NZ)

CNS 13438 Limits and methods of measurement of radio disturbance characteristics of Information Technology Equipment (Taiwan & China)

EN 55024:1998

Information technology equipment—Immunity characteristics—Limits and methods of measurement

SFX/SFX12V Power Supply Design Guide

Version 0.9 of updated SFX PSDG

CISPR 24: 1997 Information technology equipment—Immunity characteristics—Limits and methods

of measurement

EN 61000-3-2 Electromagnetic compatibility (EMC)—Part 3: Limits—Section 2: Limits for

harmonic current emissions, Class D

IEC 61000-4- Electromagnetic compatibility (EMC) for industrial-process measurement and

control equipment—Part 4: Testing and measurement techniques

Section -2: Electrostatic discharge

Section -3: Radiated, radio-frequency, electromagnetic field

Section -4: Electrical fast transient / burst

Section -5: Surge

Section -6: Conducted disturbances, induced by radio-frequency fields

Section -8: Power frequency magnetic fields

Section -11: Voltage dips, short interruptions, and voltage variations

Japan Electric Association Guidelines for the Suppression of Harmonics in Appliances and General Use

Equipment

IEC Publication 417 International Graphic Symbol Standard

ISO Standard 7000 Graphic Symbols for Use on Equipment

CFR 47, Part 15, Subpart B FCC Regulations pertaining to unintentional radiators (USA)

ICES-003 (Class B) Interference-Causing Equipment Standard, Digital Apparatus (Canada)

VCCI V-3/99.05 (Class B) Implementation Regulations for Voluntary Control of Radio Interference by Data

processing Equipment and Electronic Office Machines (Japan)

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3. Electrical

The electrical requirements that follow are to be met over the environmental ranges specified in Section 5 unless otherwise noted.

3.1. AC Input

Table 1 lists AC input voltage and frequency requirements for continuous operation. The power supply shall be capable of supplying full-rated output power over two input voltage ranges rated 100-127 VAC and 200-240 VAC rms nominal. The correct input range for use in a given environment may be either switch-selectable or auto-ranging. The power supply shall

automatically recover from AC power loss. The power supply must be able to start up under peak loading at 90 VAC.

Table 1. AC Input Line Requirements

Parameter Min. Nom. (1)

Max. Unit V in (115 VAC) 90 115 135 VAC rms V in (230 VAC) 180 230 265 VAC rms V in Frequency

47

--

63

Hz

(1)

Nominal voltages for test purposes are considered to be within ±1.0 V of nominal.

3.1.1. Input Overcurrent Protection

The power supply shall incorporate primary fusing for input over current protection to prevent

damage to the power supply and meet product safety requirements. Fuses should be slow-blow–type or equivalent to prevent nuisance trips 1.

3.1.2. Inrush Current Limiting

Maximum inrush current from power-on (with power on at any point on the AC sine) and

including, but not limited to, three line cycles, shall be limited to a level below the surge rating of the input line cord, AC switch if present, bridge rectifier, fuse, and EMI filter components. Repetitive ON/OFF cycling of the AC input voltage should not damage the power supply or cause the input fuse to blow.

1

. For Denmark and Switzerland international safety requirements, if the internal over-current protective devices exceed 8A for Denmark and 10A for Switzerland, then the power supply must pass international safety testing to EN 60950 using a maximum 16A over-current protected branch circuit, and this 16A (time delay fuse) branch circuit protector must not open during power supply abnormal operation (output short circuit and component fault) testing.

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3.1.3. Input Under Voltage

The power supply shall contain protection circuitry such that the application of an input voltage below the minimum specified in Section 3.1, Table 1, shall not cause damage to the power supply.

3.1.

4. Regulatory

At a minimum, both system and power supply typically must pass safety and EMC testing per the limits and methods described in EN 55024 prior to sale in most parts of the world. Additional national requirements may apply depending on the design, product end use, target geography, customer, and other variables. Consult your company’s Product Safety and Regulations department for more details.

3.1.5. Catastrophic Failure Protection

Should a component failure occur, the power supply should not exhibit any of the following: ? Flame

? Excessive smoke ? Charred PCB

? Fused PCB conductor ? Startling noise

? Emission of molten material

? Earth ground fault (short circuit to ground or chassis enclosure)

3.2. DC Output

3.2.1. DC Voltage Regulation

The DC output voltages shall remain within the regulation ranges shown in Table 2 when measured at the load end of the output connectors under all line, load, and environmental

conditions. The voltage regulation limits shall be maintained under continuous operation for a period of time equal to or greater than the MTBF specified in Section 6.5 at any steady state temperature and operating conditions specified in Section 5.

Table 2. DC Output Voltage Regulation

Output Range Min. Nom. Max. Unit

+12VDC (1)

±5% +11.40 +12.00 +12.60 Volts +5VDC ±5% +4.75 +5.00 +5.25 Volts +3.3VDC ±5% +3.14 +3.30 +3.47 Volts -12VDC ±10% -10.80 -12.00 -13.20 Volts +5VSB

±5%

+4.75

+5.00

+5.25

Volts

(1)

At +12 VDC peak loading, regulation at the +12 VDC output can go to ± 10%.

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3.2.2. Remote Sensing

The +3.3 VDC output should have provisions for remote sensing to compensate for excessive cable drops. The default sense should be connected to pin 11 of the main power connector. The power supply should draw no more than 10 mA through the remote sense line to keep DC offset voltages to a minimum.

3.2.3. Typical Power Distribution

DC output power requirements and distributions will vary based on specific system options and implementation. Significant dependencies include the quantity and types of processors, memory, add-in card slots, and peripheral bays, as well as support for advanced graphics or other features. It is ultimately the responsibility of the designer to define a power budget for a given target product and market.

SFX Power Distribution Tables

Table 3. Typical Power Distribution for a 90W SFX Configuration

Output Min. Current (amps) Max. Current (amps) Peak Current

(amps) +12 VDC 0.0 1.5 4.8 +5 VDC 1.0 11.0 +3.3 VDC 0.3 6.0 -12 VDC 0.0 0.2 +5 VSB 0.0 1.0 1.5

Table 4. Typical Power Distribution for a 120W SFX Configuration

Output Min. Current (amps) Max. Current (amps) Peak Current (amps) +12 VDC 0.2 3 6 +5 VDC 1.0 12.0 +3.3 VDC 0.3 6.0 -12 VDC 0.0 0.2 +5 VSB 0.0 1.0 2.0

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Page 12 Table 5. Typical Power Distribution for a 150 W SFX Configuration Output

Min. Current

(amps)

Max. Current

(amps)

Peak Current

(amps)

+12 VDC 0.2 5 8

+5 VDC 1.0 14.0

+3.3 VDC 0.3 12.0

-12 VDC 0.0 0.3

+5

VSB

0.0 1.5 2.0

SFX12V Power Distribution Tables

Table 6. Typical Power Distribution for a 160W SFX12V Configuration Output

Min. Current

(amps)

Max. Current

(amps)

Peak Current

(amps)

+12 VDC 2.0 8.0 10.0

+5 VDC 1.0 12.01

+3.3 VDC 0.5 16.71

-12 VDC 0.0 0.3

+5

VSB

0.0 1.5 2.0

1. Total combined output of 3.3V and 5V is < 61W.

Table 7. Typical Power Distribution for 180W SFX12V Configuration

Output Min. Current

(amps)

Max. Current

(amps)

Peak Current

(amps)

+12

VDC

2.0 10.0 1

3.0

+5 VDC 1.0 12.01

+3.3 VDC 0.5 16.71

-12 VDC 0.0 0.3

+5

VSB

0.0 1.5 2.0

1. Total combined output of 3.3V and 5V is < 61W

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3.2.

4. Power Limit / Hazardous Energy Levels

Under normal or overload conditions, no output shall continuously provide 240 VA under any conditions of load including output short circuit, per the requirement of UL 1950/CSA 950 / EN 60950/IEC 950.

3.2.5. Efficiency

3.2.5.1. General

The power supply should be a minimum of 68% efficient under maximum rated load. The efficiency of the power supply should be met over the AC input range defined in Table 1, under the load conditions defined in Section 3.2.3, and under the temperature and operating conditions defined in Section 7.

3.2.5.2. Energy Star

The “Energy Star” efficiency requirements of the power supply depend on the intended system configuration. In the low-power Energy Star state, the AC input power is limited to 30 W or 15% of the rated maximum DC output power for the configuration, whichever is greater, for output power between 200W and 400W. Power supplies with output power less than 200W, the AC input power is limited to 15W. While a minimum power supply efficiency of 58% is often recommended at Energy Star operating levels, compliance to the guideline will depend on the system’s DC power consumption. In cases where the system Energy Star power consumption for each DC output is known, the system designer should provide this information to assist the power supply designer.

3.2.5.3. Blue Angel, RAL-UZ 78

To help meet the Blue Angel system requirements, the +5VSB standby supply efficiency should be as high as possible. Standby efficiency is measured with the main outputs off (PS_ON# high state). To meet Blue Angel system requirements, the AC input power shall not exceed 5 W when the main outputs are in the “DC disabled” state with 500 mA load on +5VSB and a 230 VAC/50 Hz input.

3.2.6. Output Ripple/Noise

The output ripple/noise requirements listed in Table 8 should be met throughout the load ranges specified in Section 3.2.3 and under all input voltage conditions as specified in Section 3.1. Ripple and noise are defined as periodic or random signals over a frequency band of 10 Hz to 20 MHz. Measurements shall be made with an oscilloscope with 20 MHz bandwidth. Outputs

should be bypassed at the connector with a 0.1 μF ceramic disk capacitor and a 10 μF electrolytic capacitor to simulate system loading. See Figure 1.

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Table 8. DC Output Noise/Ripple

Output

Max. Ripple & Noise

(mV pp )

+12 VDC 120 +5 VDC 50 +3.3 VDC 50 -12 VDC 120

+5 VSB

50

Use Tektronix TDS460 Oscilloscope or equivalent and a P6046 probe or equivalent.

10uf - United Chemi-con, 293D106X0025D2T or equivalent

Figure 1. Differential Noise Test Setup

3.2.7. Output Transient Response

Table 9 summarizes the expected output transient step sizes for each output. The transient load slew rate is = 1.0 A/μs.

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Table 9. DC Output Transient Step Sizes

Output

Max. step size

(% of rated output amps per Sec 3.2.3) (1)

Max. step size

(amps)

+12 VDC 50% +5 VDC 30% +3.3 VDC 30% -12 VDC 0.1 A

+5 VSB

0.5 A

(1)

For example, for a rated +5 VDC output of 14 A, the transient step would be 30% × 14 A = 4.2 A

Output voltages should remain within the regulation limits of Table 2, Section 3.2.1 for instantaneous changes in load as specified in Table 9 and for the following conditions: ? Simultaneous load steps on the +12 VDC, +5 VDC, and +3.3 VDC outputs (all steps occurring in the same direction)

? Load-changing repetition rate of 50 Hz to 10 kHz ? AC input range per Section 3.1 ? Capacitive loading per Table 10

3.2.8. Capacitive Load

The power supply should be able to power up and operate with the regulation limits defined in Table 2, Section 3.2.1 with the following capacitances simultaneously present on the DC outputs.

Table 10. Output Capacitive Loads

Output Capacitive load (μF)

+12 VDC 5,000 +5 VDC 10,000 +3.3 VDC 6,000 -12 VDC 350 +5 VSB

350

3.2.9. Closed-loop Stability

The power supply shall be unconditionally stable under all line/load/transient load conditions

including capacitive loads specified in Section 3.2.8. A minimum of 45 degrees phase margin and 10 dB gain margin is recommended at both the maximum and minimum loads.

3.2.10. +5 VDC / +3.3 VDC Power Sequencing

The +12 VDC and +5 VDC output levels must be equal to or greater than the +3.3 VDC output at all times during power-up and normal operation. The time between the +12 VDC or +5 VDC output reaching its minimum in-regulation level and +3.3 VDC reaching its minimum in-regulation level must be ≤ 20 ms.

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3.2.11. Voltage Hold-up Time

The power supply should maintain output regulation per Section 3.2.1 despite a loss of input power at the low-end nominal range—115 VAC / 57 Hz or 230 VAC / 47 Hz—at maximum continuous output load as applicable for a minimum of 17 ms.

3.3. Timing / Housekeeping / Control

PS_ON#

PWR_OK

PWR_OK Sense Level = 95% of nominal

timing_3_5_12b

+12VDC +5VDC +3.3VDC

O/P's

}

VAC

Figure 2. Power Supply Timing

Notes: T1 is defined in Section 3.3.4. T2 is defined in Section 3.3.5. T3, T4, T5, and T6 are defined in Table 11

3.3.1. PWR_OK

PWR_OK is a “power good” signal. It should be asserted high by the power supply to indicate that the +12 VDC, +5VDC, and +3.3VDC outputs are above the under voltage thresholds listed in Table 2 of Section 3.2.1 and that sufficient mains energy is stored by the converter to

guarantee continuous power operation within specification for at least the duration specified in Section 3.2.11, “Voltage Hold-up Time.” Conversely, PWR_OK should be de-asserted to a low state when any of the +12 VDC, +5 VDC, or +3.3 VDC output voltages falls below its under voltage threshold, or when mains power has been removed for a time sufficiently long such that power supply operation cannot be guaranteed beyond the power-down warning time. The

electrical and timing characteristics of the PWR_OK signal are given in Table 11 and in Figure 2.

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Table 11. PWR_OK Signal Characteristics

Signal Type +5 V TTL compatible Logic level low < 0.4 V while sinking 4 mA

Logic level high

Between 2.4 V and 5 V output while sourcing 200 μA High-state output impedance 1 k ? from output to common PWR_OK delay 100 ms < T 3 < 500 ms PWR_OK rise time

T 4 ≤ 10 ms AC loss to PWR_OK hold-up time T 5 ≥ 16 ms Power-down warning

T 6 ≥ 1 ms

3.3.2. PS_ON#

PS_ON# is an active-low, TTL-compatible signal that allows a motherboard to remotely control the power supply in conjunction with features such as soft on/off, Wake on LAN ?, or wake-on-modem. When PS_ON# is pulled to TTL low, the power supply should turn on the four main DC output rails: +12VDC, +5VDC, +3.3VDC, and -12VDC. When PS_ON# is pulled to TTL high or open-circuited, the DC output rails should not deliver current and should be held at zero potential with respect to ground. PS_ON# has no effect on the +5VSB output, which is always enabled whenever the AC power is present. Table 12 lists PS_ON# signal characteristics. The power supply shall provide an internal pull-up to TTL high. The power supply shall also provide de-bounce circuitry on PS_ON# to prevent it from oscillating on/off at startup when activated by a mechanical switch. The DC output enable circuitry must be SELV-compliant.

Table 12. PS_ON# Signal Characteristics

Min. Max. V IL , Input Low Voltage

0.0 V 0.8 V I IL , Input Low Current (Vin = 0.4 V) -1.6 mA V IH , Input High Voltage (Iin = -200 μA) 2.0 V V IH open circuit, Iin = 0

5.25 V

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PS_ON# Voltage

Figure 3. PS_ON# Signal Characteristics

3.3.3. +5 VSB

+5 VSB is a standby supply output that is active whenever the AC power is present. It provides a power source for circuits that must remain operational when the five main DC output rails are in a disabled state. Example uses include soft power control, Wake on LAN, wake-on-modem, intrusion detection, or suspend state activities.

The +5 VSB output should be capable of delivering a minimum of 1.0 A at +5 V ± 5% to external circuits. Because trends indicate a growing demand for standby power, it is recommended that designs be scalable to 2.0 A to meet future needs. The power supply must be able to provide the required power during a "wake up" event. If an external USB device generates the event, there may be peak currents as high as 2.5A lasting no more than 500mS. Over current protection is required on the +5 VSB output regardless of the output current rating. This ensures the power supply will not be damaged if external circuits draw more current than the supply can provide.

3.3.

4. Power-on Time

The power-on time is defined as the time from when PS_ON# is pulled low to when the +12 VDC, +5 VDC, and +3.3 VDC outputs are within the regulation ranges specified in Section

3.2.1. The power-on time shall be less than 500 ms (T1 < 500 ms).

+5 VSB shall have a power-on time of two seconds maximum after application of valid AC voltages.

3.3.5. Rise Time

The output voltages shall rise from ≤10% of nominal to within the regulation ranges specified in Section 3.2.1 within 0.1 ms to 20 ms (0.1 ms ≤ T2≤ 20 ms).

There must be a smooth and continuous ramp of each DC output voltage from 10% to 90% of its final set point within the regulation band, while loaded as specified in Section 3.2.3. The smooth turn-on requires that, during the 10% to 90% portion of the rise time, the slope of the turn-on

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waveform must be positive and have a value of between 0 V/ms and [Vout, nominal / 0.1] V/ms. Also, for any 5 ms segment of the 10% to 90% rise time waveform, a straight line drawn between the end points of the waveform segment must have a slope ≥ [Vout, nominal / 20] V/ms.

3.3.6. Overshoot at Turn-on / Turn-off

The output voltage overshoot upon the application or removal of the input voltage, or the assertion/de-assertion of PS_ON#, under the conditions specified in Section 3.1, shall be less than 10% above the nominal voltage. No voltage of opposite polarity shall be present on any output during turn-on or turn-off.

3.3.7. Reset after Shutdown

If the power supply latches into a shutdown state because of a fault condition on its outputs, the power supply shall return to normal operation only after the fault has been removed and the PS_ON# has been cycled OFF/ON with a minimum OFF time of 1 second.

3.3.8. +5 VSB at AC Power-down

After AC power is removed, the +5 VSB standby voltage output should remain at its steady state value for the minimum hold-up time specified in Section 3.2.11 until the output begins to

decrease in voltage. The decrease shall be monotonic in nature, dropping to 0.0 V. There shall be no other perturbations of this voltage at or following removal of AC power.

3.4. Output Protection

3.4.1. Over Voltage Protection

The over voltage sense circuitry and reference shall reside in packages that are separate and distinct from the regulator control circuitry and reference. No single point fault shall be able to cause a sustained over voltage condition on any or all outputs. The supply shall provide latch-mode over voltage protection as defined in Table 13.

Table 13. Over Voltage Protection

Output Min. Nom. Max. Unit +12 VDC 13.4 15.0 15.6 Volts +5 VDC 5.74 6.3 7.0 Volts +3.3 VDC

3.76

4.2

4.3

Volts

3.4.2. Short-circuit Protection

An output short circuit is defined as any output impedance of less than 0.1 ohms. The power supply shall shut down and latch off for shorting the +3.3 VDC, +5 VDC, or +12 VDC rails to return or any other rail. Shorts between main output rails and +5 VSB shall not cause any

damage to the power supply. The power supply shall either shut down and latch off or fold back

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for shorting the negative rails. +5 VSB must be capable of being shorted indefinitely, but when the short is removed, the power supply shall recover automatically or by cycling PS_ON#. The power supply shall be capable of withstanding a continuous short-circuit to the output without damage or overstress to the unit (for example, to components, PCB traces, connectors) under the input conditions specified in Section 3.1.

3.4.3. No-load Operation

No damage or hazardous condition should occur with all the DC output connectors disconnected from the load. The power supply may latch into the shutdown state.

3.4.4. Over Current Protection

Overload currents applied to each tested output rail will cause the output to trip before reaching or exceeding 240 VA. For testing purposes, the overload currents should be ramped at a minimum rate of 10 A/s starting from full load.

3.4.5. Over-Temperature Protection

As an option the power supply may include an over-temperature protection sensor, which can trip and shut down the power supply at a preset temperature point. Such an overheated condition is typically the result of internal current overloading or a cooling fan failure. If the protection circuit is non-latching, then it should have hysteresis built in to avoid intermittent tripping.

3.4.6. Output Bypass

The output return may be connected to the power supply chassis. The return will be connected to the system chassis by the system components.

4. Mechanical

4.1. Labeling / Marking

The following is a non-inclusive list of suggested markings for each power supply unit. Product regulation stipulations for sale into various geographies may impose additional labeling requirements.

? Manufacturer information: manufacturer's name, part number, and lot date code, etc., in human-readable text and/or bar code formats

? Nominal AC input operating voltages (100-127 VAC and 200-240 VAC) and current rating certified by all applicable safety agencies (Section 7) ? DC output voltages and current ratings

? Access warning text (“Do not remove this cover. Trained service personnel only. No user serviceable components inside.”) in English, German, Spanish, French, Chinese, and Japanese with universal warning markings

模具买卖合同协议书范本

编号:_______________ 本资料为word版本,可以直接编辑和打印, 感谢您的下载 模具买卖合同协议书范本 甲方:___________________ 乙方:___________________ 日期:___________________

甲方:________________________________________ 乙方:________________________________________ 签订口期:年月口 (以下简称甲方) 出卖人: 住所地: 法定代表人: 买受人:(以下简称乙方) 住所地:广东东莞长安 法定代表人: 甲、乙双方根据〈〈中华人民共和国合同法》等有关法律规定,在平等、自愿的基础上,经充分协 商,就乙方购买甲方产品达成以下买卖合同条款。 一、产品名称、型号、数量 二、产品质量 1、质量标准:模具合格率达到95%以上 2、乙方对产品质量有异议的,应当在收到产品后五日内提出确有证据的书面异议并通知到甲方; 逾期不提出异议的,视为甲方产品质量符合本合同约定要求。但乙方使用甲方产品的,不受上述期限限制,视为甲方产品符合合同约定要求。

三、产品价款 1、产品总价:万 2、甲方产品的包装费用、运输费用、保险费用及交付时的上下列支费用等按下列约定承担: 甲方产品的包装物由甲方提供,包装费用由甲方承担。 甲主产品的运输由甲方办理,运输费用由乙方承担。 甲方产品的保险由乙方办理,保险费用由乙方承担。 甲方产品交付时的上下力支费用由甲方承担。 乙方承担的上述费用,乙方应当在甲方交货前一次性给付甲方0 四、产品交付甲方产品交付方式为:甲方代办托运 产品交付地点为甲方所在地,交货时间为合同生效后天,若乙方对甲方产品有特殊要求的, 甲方应当在乙方提供相关确认文件后天内交货。但乙方未能按约定付款甲方有权拒绝交货, 乙方未能及时提供相应文件的,甲方有权延期交货。 在合同约定期限内甲方违约未能及时交货的,产品的灭失、毁损的风险由甲方承担;产品交付后 或乙方违约致使甲方拒绝交货、延期交货的,产品的灭失、毁损的风险由乙方承担。 五、争议解决 本合同履行过程中产生争议的,双方可协商解决。协商不成的,应向甲方所在地人民法院提起诉 讼解决。 六、明示条款: 甲、乙双方对本合同的条款已充分阅读,完全理解每一条款的真实意思表示,愿意签订并遵守本合同的全部约定。

文言文中“文”与“言”的关系

关于文言文教学的浅略思考 语文组钱东梅文言文作为经典文学作品具有永恒的价值,尤其是我们选编入教材当中的一些名著名篇。它们跨越了古今,穿越了时空,对我们有着很重要的文学价值和意思,能够引起不同时代的读者的共鸣。而这种共鸣并非是无缘由的产生的。只有在理解文本的基础上才会产生。绝大多数的文言文本因时空的限制,古今语言的发展变化,学生在理解它们的意义和语境上产生了一定的难度,中国古代的经典文言作品,一是很多词语古今异义,一词多义,词义色彩的变化等等,导致学生很难读懂;二是因为时空的间隔,对于文本的理解需要一些知识背景,年代背景作为铺垫。而正是这些基础知识的缺乏,导致学生在学习文言文是遇到很多困难。有些学生甚至对文言文产生了厌恶心理,觉得一学习文言文就昏昏欲睡。因此,要让学生对学习文言文感兴趣,并有信心去学好文言文,就需要老师在教学过程中很好的处理好“言”的问题,只有弄懂了文章讲的是什么意思才会有学习的动力。而要让学生觉得学习文言文有意义,必然要让他从中学到一些知识,这就需要对文言文“文”的掌握。因此,教好文言文,让学生学好文言文就需要处理好“文”与“言”的关系。 在语文文言文教学中,一直存在着如何正确处理好“文”与“言”的关系这一难题。在教学过程当中,我们也想将文言文讲的生动形象,讲出风采。但是,无形当中,学生学习知识还要为了应付考试,尤其是对高中生来说极为重要的高考。所以在高考这一指挥棒下,我们老师在文言文教学的过程中有意无意的将重点偏向了“言”。而且偏向较为严重。对于一些课文,学生学完之后,老师抽出的重点也仅仅是一些文言重点实词和虚词的掌握。而对于文言文的“文”方面却很少涉及。所谓“文言文”,显而易见,既有“文”又有“言”,所谓“文”是指字词句中所蕴含的思想感情、文化底蕴等人文因素;所谓“言”是指字词句本身的意义或作用。二者都很重要,不可偏其一。离开“言”,古今汉语意义的差异导致文章无法理解;离开“文”,只剩下字词的意义,又会扼杀学生学习文言文的兴趣,将课堂变得枯燥无味。所以“文言兼顾”是非常必要的。 我觉得在文言文教学当中,既要重视“文”,又要重视“言”,在教学过程中可以通过精心的设计教案和上课思路将两者很好的融合在一起,做到“文言融合”。那么如何将文言融合了?我觉得应该在“言”的基础上深入对“文”的理解;在对“文”的掌握中巩固“言”的意义或作用。就拿《陈情表》这篇文章来举例,这篇文言文情感充沛,感情真挚,情感丰富。我们不仅要让学生掌握“闵”、“茕茕”、“吊”、“除”、“薄”、“矜”、“以”、“于”等实词虚词的意思,还应该引导学生深切的感受作者至真至诚的忠孝之情,血浓于水的亲情。从文章情感切入,提出疑问,李密是如何打动晋武帝让他暂且辞官侍奉祖母的?一下子抓住学生,从情感上激发学生学习文章的兴趣。那么接下来学生学习文言知识的积极性和主动性就会大大提高了。在弄懂“言”的基础上,通过提问如“李密非得辞官侍奉祖母的原因有哪些?”来深入理解李密至真至诚的忠孝之情。找出相关重要语句,重点解释说明,这又巩固了“言”的知识。这样“文言融合”既掌握了“言”的知识,又把握了“文”的内容,有助于提高文言文的教学效果。 学生学习文言文,除了掌握“文”和“言”之外,最好是将所学的知识运用到平时的语言运用或者写作当中。但如何运用这就需要我们对文本有着更深入的了解,因此学习文言文时,对于文言作品的时代背景和写作背景也是有必要了解,甚至是把握的。如学习《师说》,教师不仅要引导学生理解文章的大意,还要让学生了解到作者当时的写作背景。唐代仍在沿袭魏晋以来的门阀制度,贵族子弟都入弘文馆、崇文馆和国子学。他们无论学业如何,都有官可做。韩愈写《师说》的社会背景,可以从柳宗元《答韦中立论师道书》中的一段话里看出。柳宗元说:“由魏晋氏以下,人益不事师。今之世不闻有师,有,辄哗笑之,以为狂人。独韩愈奋不顾流俗,犯笑侮,收召后学,作《师说》,因抗颜而为师。世果群怪聚骂,指目

模具合同范本大全

模具合同范本大全 合同一是买卖双方在经济活动中对基建产品约定的价格,由双方通过谈判,以合同形式确定,大家看看下面的模具合同范本哦! 模具合同范本一 A方(发包方): B方(承包方): 为了更好地对生产模具车间开料组管理,提高生产效率,提高板材利用率。经AB双方共同协商,决定将开料组由B 方承包经营。为明确双方的权利、义务,特订立本合同: 一、承包方式 A方将权属于A方的生产模具车间开料组承包给B方为A 方代加工。承包期内,A方提供场地,设备及生产线;一切开支包括原材料、设备、耗材、辅材、水费、电费、设备维修费等费用均由A方负责支付,B方只承担人工工资。 二、承包期限 合同承包期限为一年,从____年____月____日起至______年____月____日止。 三、承包产品价格 每月裁板_____,保底______元,超出平方数,按每平方____元支付。 四、A方权限: 1、A方有权对B方进行各种行政管理,如卫生、安全等。

禁止在模具车间内吸烟,避免火灾的发生,如因此造成事故,由B方包赔一切损失。 2、A方有权对B方的生产环境、劳动保护进行监督,A方发现B方有违规行为,有权终止合同或给予经济制裁。 3、A方每天给B方下达生产任务,B方应按A方要求保质保量、按时完成生产任务,A方有权对B方因延误交货进行经济处罚,影响生产进度的每延误一次扣B方_____元,造成A方延期的一切费用由B方承担。 五、B方责任: 1、B方在生产经营中,必须服从A方的管理,及时完成A 方下达的生产任务,按A方的一切规章制度进行生产。 2、B方有责任对A方提供的设备、设施进行定期保养、维护,对设备出现异常应尽早汇报,由于B方操作失误造成设备损坏,责任由B方承担。 3、B方必须将每天的生产报表数据提供给A方,由A方核算部根据B方的产量进行核算加工费。B方不得私自承接外单位的货源,一经发现,每次扣罚_____元。 4、B方开料组所有工作人员的人身安全,如发生意外,由B方承担,A方不承担任何责任。 5、B方在承包期间不得将模具车间转包他人。六、结算及发放方式 1、结算方式:当月B方将生产报表交给A方核算部,由A

言外之意

浅谈言外之意 语言,在我们的生活中,像饮食起居一样不可或缺,是人类是最复杂最重要的交际工具。语言现象丰富复杂。语言的意义在理论上可以分为两个层次,一个是属于语义学研究的范围,研究的是语言符号以经济符号的组合与现实世界,人类经验的关系;有了这一层次的知识技能,但是在言语交际中我们往往会发现很多时候仅靠字面意思我们往往不能充分理解对方传达的意思。所以另一层次是语用义的层次,涉及语言形式与语境。语境包含物理语境,话语语境以及说话者和受话者的背景知识。进入语言交际的句子不再是孤立的语言单位,它是话语中的一个片段,反映与语境,特别是说话者相关的人类特定经验的信息。 言外之意,顾名思义就是说话或写文章没有明说而使人能体会出来的意思。在上面的三个语境中,说话者和受话者之间的背景知识是言外之意的基础言外之意是语言发展而来一种特殊的积极运用语言进行表达的一种交际方式,主要是根据日常生活常识推理,而根据推理可以得出的信息就不必在会话中出现,内容丰富,生动有趣。 言外之意这一个成语出自欧阳修《六一诗话》:“必能状难写之景,如在目前,含不尽之意,见于言外,然后为至矣。”宋·叶梦得《石林诗话》:“七言难于气象雄浑,句中有力而纡余,不失言外之意。”可见古人很早就懂得说含有言外之意的句子。中国不论绘画诗歌,都讲究一个“意境”,追求言有尽而意无穷的境界,这是文人气质水平的体现。在古诗里不胜枚举,如在《古诗十九首》里一首思妇诗“冉冉孤生竹,结根泰山阿。与君为新婚,菟丝附女萝。”菟丝是女萝都是柔弱的蔓生植物,以上四句是主人公说自己本无兄弟姐妹,犹如孤生之竹,未出嫁时依靠父母,犹如孤竹托根于泰山。出嫁之后,也不得依靠,好像以柔弱的菟丝依附着柔弱的女萝,暗指关系不牢靠。另一方面,古诗中的用典也是一种言外之意。如杜牧的《泊秦准》中“商女不知亡国恨,隔江犹唱《后庭花》”诗中的《后庭花》歌曲名,是引用的一个典故,南朝陈后主所作的《玉树后庭花》,被后人称为为“亡国之音”。诗人所处的晚唐时期正值国运衰微之际,而这些统治者不以国事为重,反而聚集于酒楼之中欣赏靡靡之音,怎能不使诗人产生历史可能重演的隐忧?所以,诗人这里是借陈后主因荒淫享乐终致亡国的历史讽刺晚唐那些醉生梦死的统治者不从中汲取教训。用典严谨,以典入诗别有意趣表达了诗人的愿望或情感,而增加词句之形象、含蓄与典雅,增加意境的内涵与深度力透纸背,掷地有声! 语言和文化密切相关。由于语言的产生可发展,人类文化才得以传承和发展,语言既是文化的载体,又是文化的真实写照。不同的语言反映了不同民族特定的文化风貌,思维方式.价值观念。语言又是一种社会现象,是社会交际需要和实践的产物。中国的和文化由来已久,我们讲求言语交际艺术,不直接表达。社会文化所决定的得体原则在日常会话中起作用。如在小辈和长辈,陌生人之间,在我们的社会中不宜直接提要求,发命令,所以常用言外之意的委婉方式表达自己的要求。我们总认为把话说得太直接不好,要委婉含蓄。但这种方式有的时候又把话说得不痛不痒,达不到说话者希望达到的效果。这已经成为一种集体无意识,有时你也说不上为什么要这样说。 在人们说话的时候的分别实施了三种行为,分别是言内行为,言外行为和言后行为。言内行为便是说出话语的行为,言外行为是说话人的话语要达到的目的

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(1)模具必须按甲方提供的图纸及要求制造,保证模具啤出符合要求的制件;(2)模具必须按照制作项目列明的要求制作,且必须有合理可靠地冷却系统; (3)更详尽的技术要求见附表,模具也应符合甲方在向乙方提供的其他的技liuxue86术资料中明示的技术要求以及质量要求; (4)乙方制作的模具应保证万啤次以上的使用寿命。 四、制造工期: (1)工作期为天(第一次交符合功能装配的样品),即于_____年___月___日前提供全部首样; (2)首样交付后,甲方未提出改模,乙方于15天内(即于_____年___月___日前)提出向甲方交付合格模具; 五、模具验收以及交付:(1)模具验收的依据: 1.甲方确认的产品零件图; 2.双方商定,并经甲方确认的技术工艺方案,双方确认的模具技术要求。 3.模具设计图纸以及电子文档;

模具合同范本

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理解言外之意

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模具合同范本

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1、甲方责任: ⑴甲方需付给乙方预付款的同时,及时向乙方提供图纸,并在乙方接受图纸并开始生产 时,不经与乙方协商,不得提出对图纸进行较大的形状、结构、尺寸等改动,如因必要原因必须修改,甲乙双方可另得商定变更费用和模具交付日期。 ⑵甲方在乙方试模调整期间,需及时参与提供部件配合情况信息和意见。以便乙方对模 具及时调整。 2、乙方责任: ⑴乙方应按本事同之规定执行制模和试模及交付使用的日期。 ⑵由甲方所指定的所有图纸及信息归甲方所有,乙方有保密责任,保证不透露或泄露 任何与产品有关的任何信息给第三方。如乙方泄秘则造成的损失由乙方全部承担。 六、本合同未尽事宜,由甲乙双方协商解决。 七、本合同如需变更或解除,须经甲乙双方书面同意。 八、违约责任:按《中华人民共同国合同法》规定处理。 九、本合同一式两份,甲乙双方各执一份,自双方盖章签字且在甲方40% 预付款汇出至乙方之日起生效。 甲方:乙方: 签字:签字: 盖章:盖章: 日期:日期: 开户行:开户行: 税号:税号: 帐号:帐号:

模具加工合同范本(完整版)

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2. 买方负责交付给卖方执行本合同所需的产品设计图纸和其他相关技术资料,并且负责技术方面的支持工作。 3. 对交付给卖方的产品设计图纸和相关技术资料,买方具有唯一的解释权,当发生歧义时,卖方应征询买方意见,由买方确认。 4. 卖方完成模具的设计和制造后,由买方去卖方现场对模具进行验证确认或由卖方提供产品样品到买方进行验证确认。本合同中所指模具包含产品本身的模具及后续生产所需的夹治具和模具。 卖方权利及责任如下: 1. 卖方负责根据买方提供的产品设计图纸和其他相关技术资料进行模具的设计和制造,卖方负责按照合同规定按时完成符合买方设计要求的模具。 2. 卖方负责按时按量提供认证及样板测试、试产所需的产品。同时卖方必须提供相关产品的详细的检验测试报告供买方确认。如需修/改模, 送板时同时也要附检验测试报告(注明修改的地方)

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塑胶模具合同范本(完整版) 备注:该合同书文本主要阐明合作框架下每个条款,并根据当事人一致协商达成协议,同时也明确各方的权利和义务,对当事人具有法律约束力而制定。文档可根据实际情况进行修改和使用。 合同号:签约时间:签约地点: 甲方:乙方: 地址:地址: 电话:电话: 甲乙双方为确保明确双方权利义务,经充分协商,遵循平等,互惠互利的合作诚意,特订立本合同。依据本合同制定的有关附件、补充协议及相关修订书,是本合同的有效组成部份,具有相同的法律效力。 1、乙方根据甲方提供的样品或图纸来设计制造模具。 2、在生产中,甲方如需修改样品或图纸,应及时通知乙方,由此产生的费用由甲方负责。 3、乙方如需对结构、工艺、制造技术进行调整和改动,应事先通知甲方,甲方认可后进行。

4、模具交付甲方使用后,如非正常使用,导致模具损伤,维修费用由甲方负责。 二、质量要求: 1、我司提供模架、模芯材料(在正常情况下使用,模具保证使用30万次)。 2、模具及附件均采用公制通用标准制造。 3、模具试用于双方确认的机台及相关的技术指标。 三、付款方式: 1、合同签订后甲方应3天内付总金额的。 2、样件合格时付合同剩余总金额的余款,即人民币元。 3、更改图纸或样件造成的费用由客户负责。 4、保修期限:模具验收合格后,正常条件下使用一年内进行无偿保修。 四、交货期限: 1、在客户图纸确认及收到预付款后天首试。 五、模型所有权: 1、模型的所有权属于甲方。

跨文化交际行为的言后意义

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模具保管合同范本

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言外之意专项练习

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模具制作合同范本(标准版)

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1)乙方按照甲方要求负责模具设计,计算模具日产能力,并需得到甲方确认方可制作。 2)模具设计所需图纸资料由甲方提供给乙方使用的,须经甲方确认后方可使用。 三、技术要求以及质量要求 1)模具必须按甲方提供的图纸及要求制造,保证模具啤出符合要求的制件; 2)模具必须按照制作项目列明的要求制作,且必须有合理可靠的冷却系统; 3)更详尽的技术要求见附表,模具也应符合甲方在向乙方提供的其他的技术资料中明示的技术要求以及质量要求; 4)乙方制作的模具应保证____万次以上的使用寿命。 四、制造工期 1)工作期为35天(第一次交符合功能装配的样件),即于____年____月____日前提供全部首样; 2)首样交付后,甲方未提出改模,乙方于____天

内(即于____年____月____日前)向甲方交付合格模具; 五、模具验收以及交付 1)模具验收的依据: 1.甲方确认的产品零件图; 2.双方商定,并经甲方确认的技术工艺方案,双方确认的模具技术要求。 3.模具设计图纸以及电子文档。 2)模具验收合格规定: 1.甲方连续试产5天或产量达到____件以上,日产能力偏差不超过设计要求的5%,模具无异常,制件合格率98%以上,甲方出具模具验收检验合格报告。 2.乙方交模后,由于甲方原因____天内不投(试)产,模具视为合格处理并由甲方出具模具检验报告,办理结算付款手续。 3.乙方交试模样件后,由于甲方原因____天内不能检验确认的模具视为合格处理并由甲方出具模具检验报告,办理结算付款手续。

学会分析言外之意答案

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开模合同范本

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