SP4062-04UTG,SP4062-04UTG,SP4062-04UTG, 规格书,Datasheet 资料

S P 4062

Description

Applications

The SP4062 integrates 4 channels of low capacitance diodes with an additional zener diode to protect sensitive I/O pins against lightning induced surge events and

ESD. This robust device can safely absorb up to 20A per IEC61000-4-5 (t P =8/20μs) without performance degradation and a minimum ±30kV ESD per IEC61000-4-2 international standard. The low loading capacitance makes the SP4062 ideal for protecting high-speed signal pins.

Features

t &4% *&$

±30kV contact, ±30kV air t &'5 *&$ " (t p =5/50ns)t -JHIUOJOH *&$ 20A (t p =8/20μs)

t -PX DBQBDJUBODF PG Q' (TYP) per I/O t -PX MFBLBHF DVSSFOU PG 1μA (MAX) at 3.3V

t &UIFSOFU Interfaces

t $VTUPNFS 1SFNJTF Equipment (CPE)t 7P*1 1IPOFT t 4FU 5PQ #PYFT t 1#9 4ZTUFNT

Functional Block Diagram

GND

1

3

97

5

Pinout

1

3

5

7

9

GND

Life Support Note:

Not Intended for Use in Life Support or Life Saving Applications

The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.Application Example

J1

J8

RJ-45 Connector

*Package is shown as transparent Ethernet PHY Tx+

Tx-

Rx-

Rx+

SP 4062

PHY

?2011 Littelfuse, Inc.

166

SP4062 Series

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause

permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speci?cation is not implied.

Absolute Maximum Ratings

Electrical Characteristics (T OP =25o

C)

Note: 1. Parameter is guaranteed by design and/or device characterization.

Thermal Information

Clamping Voltage vs. I PP

Pulse Waveform

0%

10%

20%30%40%50%60%70%

80%

90%100%110%0.0 5.0 10.0 15.0 20.0 25.0 30.0

Time (μs)

P e r c e n t o f I P P

0 5 10 15 20

Peak Pulse Current-I PP (A)

0.0

2.0

4.0

6.0

10.0

12.0

C l a m p V o l t a g e (V C )

8.0

S P 4062

Capacitance vs. Bias Bias Voltage (V)

C a p a c i t a n c e (p F )

0.0

1.0

2.0

3.0

4.0

5.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0

Soldering Parameters

Ordering Information

Part Numbering System

Part Marking System

SP 4062 04U T G

Series Number of Channels

Package U= μDFN-10

T= Tape & Reel G= Green -Silicon Protection Array (SPA TM )Family of

TVS Diode Arrays

U *4

Product Series

U = SP4062

Assembly Site

Number of Channels Product Characteristics

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold ?ash & metal burr.

4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

5. Package surface matte ?nish VDI 11-13.

?2011 Littelfuse, Inc.

168

SP4062 Series

Package Dimensions — μDFN-1

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