pcb行业专用英语
PCB行业的专业英语
2011-04-28 17:42:13
1、印制电路:printed circuit
2、印制线路:printed wiring
3、印制板:printed board
4、印制板电路:printed circuit board (pcb)
5、印制线路板:printed wiring board(pwb)
6、印制元件:printed component
7、印制接点:printed contact
8、印制板装配:printed board assembly
9、板:board
10、单面印制板:single-sided printed board(ssb)
11、双面印制板:double-sided printed board(dsb)
12、多层印制板:mulitlayer printed board(mlb)
13、多层印制电路板:mulitlayer printed circuit board
14、多层印制线路板:mulitlayer prited wiring board
15、刚性印制板:rigid printed board
16、刚性单面印制板:rigid single-sided printed borad
17、刚性双面印制板:rigid double-sided printed borad
18、刚性多层印制板:rigid multilayer printed board
19、挠性多层印制板:flexible multilayer printed board
20、挠性印制板:flexible printed board
21、挠性单面印制板:flexible single-sided printed board
22、挠性双面印制板:flexible double-sided printed board
23、挠性印制电路:flexible printed circuit (fpc)
24、挠性印制线路:flexible printed wiring
25、刚性印制板:flex-rigid printed board, rigid-flex printed board
26、刚性双面印制板:flex-rigid double-sided printed board, rigid-flex double-sided printed
27、刚性多层印制板:flex-rigid multilayer printed board, rigid-flex multilayer printed board
28、齐平印制板:flush printed board
29、金属芯印制板:metal core printed board
30、金属基印制板:metal base printed board
31、多重布线印制板:mulit-wiring printed board
32、陶瓷印制板:ceramic substrate printed board
33、导电胶印制板:electroconductive paste printed board
34、模塑电路板:molded circuit board
35、模压印制板:stamped printed wiring board
36、顺序层压多层印制板:sequentially-laminated mulitlayer
37、散线印制板:discrete wiring board
38、微线印制板:micro wire board
39、积层印制板:buile-up printed board
40、积层多层印制板:build-up mulitlayer printed board (bum)
41、积层挠印制板:build-up flexible printed board
42、表面层合电路板:surface laminar circuit (slc)
43、埋入凸块连印制板:b2it printed board
44、多层膜基板:multi-layered film substrate(mfs)
45、层间全内导通多层印制板:alivh multilayer printed board
46、载芯片板:chip on board (cob)
47、埋电阻板:buried resistance board
48、母板:mother board
49、子板:daughter board
50、背板:backplane
51、裸板:bare board
52、键盘板夹心板:copper-invar-copper board
53、动态挠性板:dynamic flex board
54、静态挠性板:static flex board
55、可断拼板:break-away planel
56、电缆:cable
57、挠性扁平电缆:flexible flat cable (ffc)
58、薄膜开关:membrane switch
59、混合电路:hybrid circuit
60、厚膜:thick film
61、厚膜电路:thick film circuit
62、薄膜:thin film
63、薄膜混合电路:thin film hybrid circuit
64、互连:interconnection
65、导线:conductor trace line
66、齐平导线:flush conductor
67、传输线:transmission line
68、跨交:crossover
69、板边插头:edge-board contact
70、增强板:stiffener
71、基底:substrate
72、基板面:real estate
73、导线面:conductor side
74、元件面:component side
75、焊接面:solder side
76、印制:printing
77、网格:grid
78、图形:pattern
79、导电图形:conductive pattern
80、非导电图形:non-conductive pattern
81、字符:legend
82、标志:mark
PCB基材类词汇中英文对照:
1、基材:base material
2、层压板:laminate
3、覆金属箔基材:metal-clad bade material
4、覆铜箔层压板:copper-clad laminate (ccl)
5、单面覆铜箔层压板:single-sided copper-clad laminate
6、双面覆铜箔层压板:double-sided copper-clad laminate
7、复合层压板:composite laminate
8、薄层压板:thin laminate
9、金属芯覆铜箔层压板:metal core copper-clad laminate
10、金属基覆铜层压板:metal base copper-clad laminate
11、挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film
12、基体材料:basis material
13、预浸材料:prepreg
14、粘结片:bonding sheet
15、预浸粘结片:preimpregnated bonding sheer
16、环氧玻璃基板:epoxy glass substrate
17、加成法用层压板:laminate for additive process
18、预制内层覆箔板:mass lamination panel
19、内层芯板:core material
20、催化板材:catalyzed board ,coated catalyzed laminate
21、涂胶催化层压板:adhesive-coated catalyzed laminate
22、涂胶无催层压板:adhesive-coated uncatalyzed laminate
23、粘结层:bonding layer
24、粘结膜:film adhesive
25、涂胶粘剂绝缘薄膜:adhesive coated dielectric film
26、无支撑胶粘剂膜:unsupported adhesive film
27、覆盖层:cover layer (cover lay)
28、增强板材:stiffener material
29、铜箔面:copper-clad surface
30、去铜箔面:foil removal surface
31、层压板面:unclad laminate surface
32、基膜面:base film surface
33、胶粘剂面:adhesive faec
34、原始光洁面:plate finish
35、粗面:matt finish
36、纵向:length wise direction
37、模向:cross wise direction
38、剪切板:cut to size panel
39、酚醛纸质覆铜箔板:phenolic cellulose paper copper-clad
laminates(phenolic/paper ccl)
40、环氧纸质覆铜箔板:epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)
41、环氧玻璃布基覆铜箔板:epoxide woven glass fabric copper-clad laminates
42、环氧玻璃布纸复合覆铜箔板:
epoxide cellulose paper core, glass cloth surfaces copper-clad laminates 43、环氧玻璃布玻璃纤维复合覆铜箔板:
epoxide non woven/woven glass reinforced copper-clad laminates
44、聚酯玻璃布覆铜箔板:ployester woven glass fabric copper-clad laminates
45、聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates
46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板:
bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates 47、环氧合成纤维布覆铜箔板:epoxide synthetic fiber fabric copper-clad laminates
48、聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glass copper-clad laminates
49、超薄型层压板:ultra thin laminate
50、陶瓷基覆铜箔板:ceramics base copper-clad laminates
51、紫外线阻挡型覆铜箔板:uv blocking copper-clad laminates
PCB线路设计词汇中英文对照:
1、原理图:shematic diagram
2、逻辑图:logic diagram
3、印制线路布设:printed wire layout
4、布设总图:master drawing
5、可制造性设计:design-for-manufacturability
6、计算机辅助设计:computer-aided design.(cad)
7、计算机辅助制造:computer-aided manufacturing.(cam)
8、计算机集成制造:computer integrat manufacturing.(cim)
9、计算机辅助工程:computer-aided engineering.(cae)
10、计算机辅助测试:computer-aided test.(cat)
11、电子设计自动化:electric design automation .(eda)
12、工程设计自动化:engineering design automaton .(eda2)
13、组装设计自动化:assembly aided architectural design. (aaad)
14、计算机辅助制图:computer aided drawing
15、计算机控制显示:computer controlled display .(ccd)
16、布局:placement
17、布线:routing
18、布图设计:layout
19、重布:rerouting
20、模拟:simulation
21、逻辑模拟:logic simulation
22、电路模拟:circit simulation
23、时序模拟:timing simulation
24、模块化:modularization
25、布线完成率:layout effeciency
26、机器描述格式:machine descriptionm format .(mdf)
27、机器描述格式数据库:mdf databse
28、设计数据库:design database
29、设计原点:design origin
30、优化(设计):optimization (design)
31、供设计优化坐标轴:predominant axis
32、表格原点:table origin
33、镜像:mirroring
34、驱动文件:drive file
35、中间文件:intermediate file
36、制造文件:manufacturing documentation
37、队列支撑数据库:queue support database
38、元件安置:component positioning
39、图形显示:graphics dispaly
40、比例因子:scaling factor
41、扫描填充:scan filling
42、矩形填充:rectangle filling
43、填充域:region filling
44、实体设计:physical design
45、逻辑设计:logic design
46、逻辑电路:logic circuit
47、层次设计:hierarchical design
48、自顶向下设计:top-down design
49、自底向上设计:bottom-up design
50、线网:net
51、数字化:digitzing
52、设计规则检查:design rule checking
53、走(布)线器:router (cad)
54、网络表:net list
55、计算机辅助电路分析:computer-aided circuit analysis
57、目标函数:objective function
58、设计后处理:post design processing (pdp)
59、交互式制图设计:interactive drawing design
60、费用矩阵:cost metrix
61、工程图:engineering drawing
62、方块框图:block diagram
63、迷宫:moze
64、元件密度:component density
65、巡回售货员问题:traveling salesman problem
66、自由度:degrees freedom
67、入度:out going degree
68、出度:incoming degree
69、曼哈顿距离:manhatton distance
70、欧几里德距离:euclidean distance
72、阵列:array
73、段:segment
74、逻辑:logic
75、逻辑设计自动化:logic design automation
76、分线:separated time
77、分层:separated layer
78、定顺序:definite sequence
PCB基本英语
流程 Board cut 开料Carbon printing 碳油印刷Inner dry film 内层干膜Peelable blue mask 蓝胶 Inner etching 内层蚀刻 ENIG(Electroless nickel immersion gold) 沉镍金Inner dry film stripping 内层干膜退膜HAL(hot air leveling) 喷锡 AOI(Automatic Optical Inspection)自动光学检测 OSP(Organic solderability preservative)有机保焊Pressing 压板Punching 啤板Drilling 钻孔Profiling 外形加工Desmear 除胶渣,去钻污 E-Test 电性测试PTH 镀通孔,沉铜FQC(final quality control) 最终品质控制 Panel plating 整板电镀FQA(Final quality audit) 最终品质保证 Outer dry film 外层干膜Packing 包装Etching 蚀刻IPQA(In-process quality audit) 流程QA Tin stripping 退锡IPQC(In-process quality control) 流程QC EQC(QC after etching)蚀检QC IQC(Incoming quality control) 来料检查 Solder mask 感阻MRB(material review board) 材料评审委员会Component mark 字符QA(Quality assurance) 品质保证Physical Laboratory 物理实验室QC(Quality control) 品质控制
PCB工程资料中常见的英文缩写汇总
工程圖檔資料中常見的英文縮寫匯總 ?AOI : Automatic Optical Inspection 自動光學檢測 ?SMD : Surface Mount Devices 表面安裝設備 ?SMB : Surface Mount Board 表面安裝板 ?SMT : Surface Mount Technology 表面安裝技術 ?MIL : Military Standard 美國軍用標准 ?LPI : Liquid Photo Imageable Solder Mask 液態感光阻焊油 ?SMOBC : Solder Mask On Bare Copper 裸銅覆蓋阻焊工藝 ?OSP : Organic Solderability Preservative 焊錫性有機保護劑 ?PTI : Proof Tracking Index 耐電壓起痕指數 ?CTI : Comparative Tracking Index 相對漏電起痕指數 ?HASL : Hot Air Solder Leveling 噴錫HAL : Hot Air Leveling 噴錫?PCB : Printed Circuit Board 印制電路板 ?PWB : Printed Wiring Board 印制線路板 ?CCL : Copper-clud laminat 覆銅箔層壓板 ?FPC: Flexible printed board 柔性线路板简称,又称软板 ?CAD : Computer Aided Design 計算機輔助設計 ?CAM : Computer Aided Manufacturing 計算機輔助制造 ?CAT : Computer Aided Testing 計算機輔助測試 ?PTH : Plated Through Hole 鍍通孔 ?IC : Integrated Circuit 集成線路 ?UL : Under Writers Laboratories 美國保險商實驗室 ?CNS : Chinese National Standards 中國國家標准 ?BGA : Ball Grid Array 球柵陣列 ?BUM : Build-up Multilayer 積層法多層板 ?CFR : Code of Federal Regularations 聯邦法規全書 ?AQL : Acceptable Quality Level 允收品質水准 ?LDI : Laser Direct Imaging 鐳射直接成像 ?HDI : High Density Interconnection –-Build-up Multilayer 高密度互連積層多層板
制造业工厂常用英文与缩写词汇大全
一:常用術語 Hon Hai 鴻海 CMM Component module move 機動元件整合 CEM Contract Manu faction service 合約委托代工 IBSC Internet Business Solution Center 國際互聯網應用中心 PCEG Personal Computer Enclosure group 個人電腦外設事業群(FOXTEQ)CCBG Connector& cable business group CPBG Competition business group ESBG Enterprise system business group 鴻富錦事業群 SABG system assembly business group 系統組裝事業群 NWE Net Work Enclosure NSE Network system enclosure NSG Network system group NFE Network flexible enclosure Foxcavity = HZ = Hong Zhun 鴻準 Stamping tool shop I 沖模一廠 Stamping tool shop II 沖模二廠 Prototype workshop 樣品中心 Steel factory 裁剪廠 PCE molding tooling workshop PCE塑模廠 Hua Nan test and measurement center 華南檢測中心 MPE mobile phone enclosure MPE MBE mobile phone and notebook enclosure 明塑厂 MGE Alloy magnesium alloy enclosure 鎂合金 Engineer standard 工標 Document center (database center)資料中心 Design Center 設計中心 Painting 烤漆(廠) Assembly組裝(廠) Stamping 沖壓(廠) Education and Training教育訓練 proposal improvement/creative suggestion提案改善 Technological exchange and study 技術交流研習會 Technology and Development Committee 技術發展委員會 BS Brain Storming 腦力激蕩 QCC Quality Control Circle 品質圈 PDCA Plan Do Check Action 計劃執行檢查總結 DCC delivery control center 交貨管制中心 3C Computer 電腦類產品 Consumer electronics 消費性電子產品 Communication 通訊類產品 Core value(核心价值) Love 愛心
PCB专业术语翻译英语
PCB专业术语(英语) PCB printed circuit board 印刷电路板,指空的线路板 PCBA printed circuit board assembly 印刷电路板组件,指完成元件焊接的线路板组件 PWA Printed Wire Assembly, Aperture list Editor:光圈表编辑器。 Aperture list windows:光圈表窗口。 Annular ring:焊环。 Array:拼版或陈列。 Acid trip:蚀刻死角。 Assemby:安装。 Bare Bxnel:光板,未进行插件工序的PCB板。 Bad Badsize:工作台,工作台有效尺寸。 Blind Buried via:盲孔,埋孔。 Chamfer:倒角。 Circuit:线路。 Circuit layer:线路层。 Clamshell tester:双面测试机。 Coordinates Area:坐标区域。 Copy-protect key:软件狗。 Coutour:轮廓。 Draw:一种圆形的光圈,但只是用于创建线路,不用于创建焊盘。
Drill Rack:铅头表。 Drill Rack Editor:铅头表编辑器。 Drill Rack window:铅头表窗口。 D Code:Gerber格式中用不着于表达光圈的代码。 Double-sided Biard:双面板。 End of Block character(EOB):块结束符。 Extract Netlist:提取网络。 Firdacial:对位标记。 Flash:焊盘,来源于早期矢量光绘机,在矢量光绘机中,焊盘是光通过光圈“闪出”(Flash)而形成的。 Gerber Data:从PCB CAD系统到PCB生产过程中最常用的数据格式。Grid :栅格。 Graphical Editor:图形编辑器。 Incremental Data:增量数据。 Land:接地层。 Layer list window:层列表窗口。 Layer setup Area:层设置窗口。 Multilayer Board:多层板。 Nets:网络。 Net End:网络端点。 Net List:网络表。 Pad:焊盘。 Pad shaving:焊盘缩小。
PCB工程部专业英语词汇
PCB 工程部专业英文词汇 词汇 1.板料: material 2.最低限度: minimum 或者min. 3.最大限度: maximum 或者max. 4.基准点(零点) datum point 5.周期Date code 6.V-cut余厚V-cut remain thickness 7.抢电铜皮(假铜)dummy copper 8.实物板actual board 9.外形及尺寸错误dimension error 10.异常情形error data file 11.焊锡面与零件面对位偏差misregistration 12.孔塞plug hole 13.要求requirement 14.缺少miss 15.偏公差uneven tolerance 16.补偿compensation 17.表面处理surface treatment 18.无铅喷锡Lead free HAL 19.金手指斜边bevel of G/F 20.制程能力process capability 21.建议,暗示suggest 22.确保ensure 23.满足,达到meet 24.为了in order to 25.交货期delivery date 26.绿油桥solder mask bridge 或者solder mask dam 27.根据according to 28.单边3mil per side 3 mil 29.直径diameter 30.半径radius 31.小于3mil less than 3mil 32.高于3mil more than 3 mil 33.压合结构stacking structure 或者stack_up 34.附件:attached file 35.样品:sample 36.文档:Document 37.答复:answer; reply 38.规格:spec 39.与...同样的:the same as 40.前版本:previous version(old version) 41.生产:production 42.确认:confirm 43.再次确认:confirm again 44.工程问题:engineering query(EQ) 45.尽快:as soon as possible 46.生产文件:production Gerber 47.联系某人:contact somebody 48.提交样板:submit sample 49.交货期:delivery date 50.电测成本:ET(electrical test)cost 51.通断测试:Open and short testing 52.参考:refer to 53.IPC标准:IPC standard 54.IPC二级:IPC class 2 55.可接受的:acceptable 56.允许:permit 57.制造:manufacture 或者fabricate 58.修改:revision 59.公差:tolerance 60.忽略:ignore 61.工具孔:tooling hole 62.安装孔:mounting hole 63.元件孔:component hole
工厂术语 英语
CORPORATE COMMON ABBREVIATION 常用语缩写 1 Organization组织 1-1 HQ Head Quarter 总公司 1-2Chairmen主席 1-3Lite-On Group光宝集团 1-4 President 总裁 1-5Executive Vice President 常务副总裁 1-6Vice President副总裁 1-7HR Human Resource人力资源部 1-8FIN Finance 财务 1-9Sales 销售 1-10R&D Research & Developing 研发部 1-11QA 质量保证QA DQA CS 1-12MIS Management Information System资讯管理系统1-13Pur 采购Purchasing 1-14IMD Image management division 影像管理事业部 1-15ITS information technology system 计算机部 1-16QRA quality reliability assurance 品保部 1-17MFG manufacturing 制造部 1-18PMC production &material control 生(产)物(料)管(理) 1-19 PRO Procuremnet 采购开发部
1-20 PMO Plant Manager Office 厂长室 1-21 CEO Chief Executive Officer 执行总裁 2 Materials 材料 2-1PC Production Control 生产控制 2-1-1MPS Mass Production Schedule 量产计划 2-1-2FGI Finished goods Inventory 成品存货 2-1-3UTS Units To Stock存货单元 2-1-4WIP Working In Process Inventory在制品 2-1-5C/T Cycle Time 循环时间,瓶颈 2-1-6WD Working Days 工作天 2-1-7MTD Month To Days 月初到今日(例如总表整理) 2-1-8YTD Year To Days 年初到今日 2-1-9 SO Sales Order 销售单 2-1-10MO Manufacture Order 制造单 2-1-11 BTO Build To Order 订单生产 2-1-12 P/N part number 料号 2-1-13 FCST Forecast 预测计划 2-1-14 W/O Working Order 工单 2-1-15 P/O Purchasing Order 采购单 2-1-16 VDS Vendor Delivery Schedule 厂商送货进度表2-1-17 D/C Delivery Order 交货单 2-2 MC Material Control材料控制
PCB中英文对照
PCB线路板工艺流程及中英文对照(2009/04/08 13:56) 目录:公司动态 浏览字体:大中小流程简介:开料--钻孔--干膜制程--压合--减铜--电镀--塞孔--防焊(绿漆/绿油) --镀金--喷锡--成型--开短路测试--终检--雷射钻孔 A. 开料( Cut Lamination) a-1 裁板( Sheets Cutting) a-2 原物料发料(Panel)(Shear material to Size) B. 钻孔(Drilling) b-1 内钻(Inner Layer Drilling ) b-2 一次孔(Outer Layer Drilling ) b-3 二次孔(2nd Drilling) b-4 雷射钻孔(Laser Drilling )(Laser Ablation ) b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling) C. 干膜制程( Photo Process(D/F)) c-1 前处理(Pretreatment) c-2 压膜(Dry Film Lamination) c-3 曝光(Exposure) c-4 显影(Developing) c-5 蚀铜(Etching) c-6 去膜(Stripping) c-7 初检( Touch-up) c-8 化学前处理,化学研磨( Chemical Milling ) c-9 选择性浸金压膜(Selective Gold Dry Film Lamination) c-10 显影(Developing ) c-11 去膜(Stripping ) Developing , Etching & Stripping ( DES ) D. 压合Lamination d-1 黑化(Black Oxide Treatment) d-2 微蚀(Microetching) d-3 铆钉组合(eyelet ) d-4 叠板(Lay up) d-5 压合(Lamination) d-6 后处理(Post Treatment) d-7 黑氧化( Black Oxide Removal ) d-8 铣靶(spot face) d-9 去溢胶(resin flush removal) E. 减铜(Copper Reduction) e-1 薄化铜(Copper Reduction) F. 电镀(Horizontal Electrolytic Plating) f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating) f-3 低于1 mil ( Less than 1 mil Thickness )
pcb 专业术语 中英文对照四
pcb 专业术语中英文对照四 六、电气互连 1、表面间连接:interlayer connection 2、层间连接:interlayer connection 3、内层连接:innerlayer connection 4、非功能表面连接:nonfunctional interfacial connection 5、跨接线:jumper wire 6、节(交)点:node 7、附加线:haywire 8、端接(点):terminal 9、连接线:terminated line 10、端接:termination 11、连接端:pad, land 12、贯穿连接:through connection 13、支线:stub 14、印制插头:tab 15、键槽:keying slot 16、连接器:connector 17、板边连接器:edge board connector 18、连接器区:connector area 19、直角板边连接器:right angle edge connector 20、偏槽口:polarizing slot 21、偏置端接区:offset terminal area 22、接地:ground 23、端接隔离(空环):terminal clearance 24、连通性:continuity 25、连接器接触:connector contact 26、接触面积:contact area 27、接触间距:contact spacing 28、接触电阻:contact resistance 29、接触尺寸:contact size 30、元件引腿(脚):component lead 31、元件插针:component pin 32、最小电气间距:minimum electrical spacing 33、导电性:conductivity 34、边卡连接器:card-edge connector 35、插卡连接器:card-insertion connector 36、载流量:current-carrying capacity
PCB专业英语1
Printed Circuit Board ENGLISH Training PCB专业英语培训教材 本培训针旨在介绍PCB基本的专业英语,并对PCB专业英语分以下几个部分: 1.P CB 分类 2.P CB 材料 3.P CB 生产流程 4.水处理 5.P CB 检验 6.主要设备 7.工程设计 8.元器件组装 1.PCB Sort (PCB 分类): Single sided board(单面板) Double sided Board(双面板) Multilayer Board(多层板) Rigid board(刚性板) flexible board(挠性板) flex-rigid board(刚挠结合板) metal base PCB(金属基板) Blind board(盲孔板) buried board(埋孔板) bare board (裸板) Quick turn prototype(样板) 2.PCB Material(PCB 材料): Copper clad laminate(CCL)(覆铜板) PREPREG(半固化片) Epoxy resin(环氧树脂) Copper foil(铜箔) PTFE (Polytetralluoetylene) Teflon(聚四氟乙烯) dielectric constant(介电常数)Flexible copper clad(挠性覆铜板) silver film(银盐片) diazo film(重氮片) Solder mask(阻焊) Dry film(干膜) legend ink(字符油墨) peelable solder mask(可 剥离阻焊) flux(助焊剂) additive(添加剂) 3.PCB Process(PCB 生产流程) : Wet process(湿法流程) Dry process(干法流程) FOR MULTILAYER MANUFACTURE PROCESS(多层线路板生产流程): Laminate cut(覆铜板) scrubbing(擦板) Image transfer(图形转移) internal layer (内层) Exposure(曝光) Developing(显影) ETCHING(蚀刻) black / brown oxygen (黑/棕化) lay up(叠层) Laminating(层压) Drilling(钻孔) scrubbing(擦
工厂专业英语术语
工厂专业英语术语 Assembly line组装线Layout布置图Conveyer流水线物料板Rivet table拉钉机Rivet gun拉钉枪Screw driver起子Pneumatic screw driver气动起子worktable 工作桌OO BA开箱检查fit together组装在一起fasten锁紧(螺丝) fixture 夹具(治具) pallet栈板b arcode条码barcode scanner条码扫描器fuse together熔合fuse machine热熔机repair修理operator作业员QC品管supervisor 课长ME制造工程师MT制造生技cos metic inspect外观检查inner parts inspect内部检查thumb screw大头螺丝lbs. inch 镑、英寸EMI gasket导电条 front plate前板rear plate后板chassis 基座bezel panel面板 power button电源按键reset button重置键Hi-pot test of SPS高源高压测试Voltage switch of SPS 电源电压接拉键sheet metal parts 冲件 plastic parts塑胶件SOP制造作业程序material check list物料检查表work cell工作间trolley台车carton纸箱sub-line支线left fork叉车personnel resource departmen t 人力资源部production department生产部门planning department企划部QC Secti on品管科 stamping factory冲压厂painting factory烤漆厂molding factory成型厂common e quipment常用设备uncoiler and straightener整平机 punching machine 冲床robot机械手hydraulic machine油压机 lathe车床planer |'plein?|刨床miller铣床grinder磨床 linear cutting线切割electrical sparkle电火花welder电焊机 staker=reviting machine铆合机position职务president董事长 general manager总经理special assistant manager特助 factory director厂长department director部长 deputy manager | =vice manager副理section supervisor课长 deputy section supervisor =vice section superisor副课长 group leader/supervisor组长line supervisor线长 assistant manager助理to move, to carry, to handle搬运 be put in storage入库pack packing包装to apply oil擦油 to file burr 锉毛刺final inspection终检to connect material接料 to reverse material 翻料wet station沾湿台Tiana天那水 cleaning cloth抹布to load material上料to unload material卸料 to return material/stock to退料scraped |'skr?pid|报废 scrape ..v.刮;削deficient purchase来料不良manufacture procedure制程deficient manufacturing procedure制程不良oxidation |' ksi'dei?n|氧化scratch刮伤dents压痕 defective upsiding down抽芽不良defective to staking铆合不良 embedded lump镶块feeding is not in place送料不到位 stamping-missing漏冲production capacity生产力 education and training教育与训练proposal improvement提案改善 spare parts=buffer备件forklift叉车trailer=long vehicle拖板车 compound die合模die locker锁模器pressure plate=plate pinch压板bolt螺栓administration/general affairs dept总务部automatic screwdriver电动启子thicknes s gauge厚薄规
PCB&FPC专业英语
PCB专用词语 A a A.O.I(Automatic Optical Inspection) 自动光学检查Acceptable quality level (AQL) 可接受质量水平Accuracy 精确度 Activating 活化 Active carbon treatment 活性碳处理 After Pressed Thickness 压板后之厚度Alignment 校直,结盟 Annular ring 锡圈 Anti-Static Bag 静电胶袋 Apparatus 设备,仪器 Area 面积 Artwork 菲林 Artwork Drawing 菲林图形 Artwork Film 原装菲林 Artwork Modification 菲林修改 Artwork No. 菲林编号 Assembly 组装,装配 Axis 轴 B b Backplane 背板 Back-up 垫板 Baking 烘板 Ball Grid Array (BGA) 球栅阵列 Bare board 裸板 Base Copper 底铜 Base material 基材 Bevelling 斜边 Black Oxide 黑氧化 Blind via hole 盲孔 Blistering 起泡/水泡 Board Cutting 开料 Board Thickness 板厚 Bottom side 底层 Breakaway tab 打断点 Brushing 磨刷 Build-up 积层 Bullet pad 子弹盘 Buried hole 埋孔 C c C/M(Component Marking) 元件字符
制造业工厂常用英文与缩写词汇大全
一:常用术语 Hon Hai 鸿海 CMM Component module move 机动元件整合 CEM Contract Manu faction service 合约委托代工 IBSC Internet Business Solution Center 国际互联网应用中心 PCEG Personal Computer Enclosure group 个人计算机外设事业群(FOXTEQ)CCBG Connector& cable business group CPBG Competition business group ESBG Enterprise system business group 鸿富锦事业群 SABG system assembly business group 系统组装事业群 NWE Net Work Enclosure NSE Network system enclosure NSG Network system group NFE Network flexible enclosure Foxcavity = HZ = Hong Zhun 鸿准 Stamping tool shop I 冲模一厂 Stamping tool shop II 冲模二厂 Prototype workshop 样品中心 Steel factory 裁剪厂 PCE molding tooling workshop PCE塑模厂 Hua Nan test and measurement center 华南检测中心 MPE mobile phone enclosure MPE MBE mobile phone and notebook enclosure 明塑厂 MGE Alloy magnesium alloy enclosure 镁合金 Engineer standard 工标 Document center (database center)资料中心 Design Center 设计中心 Painting 烤漆(厂) Assembly组装(厂) Stamping 冲压(厂) Education and Training教育训练 proposal improvement/creative suggestion提案改善 Technological exchange and study 技术交流研习会 Technology and Development Committee 技术发展委员会 BS Brain Storming 脑力激荡 QCC Quality Control Circle 质量圈 PDCA Plan Do Check Action 计划执行检查总结 DCC delivery control center 交货管制中心 3C Computer 计算机类产品 Consumer electronics 消费性电子产品 Communication 通讯类产品 Core value(核心价值) Love 爱心
PCB专业用语 中英文对照
一、综合词汇 1、印制电路:printed circuit 2、印制线路:printed wiring 3、印制板:printed board 4、印制板电路:printed circuit board(pcb) 5、印制线路板:printed wiring board(pwb) 6、印制元件:printed component 7、印制接点:printed contact 8、印制板装配:printed board assembly 9、板:board 10、单面印制板:single-sided printed board(ssb) 11、双面印制板:double-sided printed board(dsb) 12、多层印制板:mulitlayer printed board(mlb) 13、多层印制电路板:mulitlayer printed circuit board 14、多层印制线路板:mulitlayer prited wiring board 15、刚性印制板:rigid printed board 16、刚性单面印制板:rigid single-sided printed borad 17、刚性双面印制板:rigid double-sided printed borad 18、刚性多层印制板:rigid multilayer printed board 19、挠性多层印制板:flexible multilayer printed board 20、挠性印制板:flexible printed board 21、挠性单面印制板:flexible single-sided printed board
电子工厂专业英语词汇
、冲压、喷漆等专业词汇 Assembly line组装线 Layout布置图 Conveyer流水线物料板 Rivet table拉钉机 Rivet gun拉钉枪 Screw driver起子 Electric screw driver电动起子Pneumatic screw driver气动起子worktable 工作桌 OOBA开箱检查 fit together组装在一起 fasten锁紧(螺丝) fixture 夹具(治具) pallet栈板 barcode条形码 barcode scanner条形码扫描仪fuse together熔合 fuse machine热熔机 repair修理 operator作业员 QC品管 supervisor 课长 ME制造工程师 MT制造生技 cosmetic inspect外观检查 inner parts inspect内部检查thumb screw大头螺丝 lbs.inch镑、英寸 EMI gasket导电条 front plate前板 rear plate后板 chassis |'∫?si| 基座 bezel panel面板 power button电源按键 reset button重置键 Hi-pot test of SPS高源高压测试Voltage switch of SPS 电源电压接柆键 sheet metal parts 冲件plastic parts塑料件 SOP制造作业程序 material check list物料检查表 work cell工作间 trolley台车 carton纸箱 sub-line支线 left fork叉车 Personnel resource department 人力资源部 production department生产部门 planning department企划部 QC Section品管科 stamping factory冲压厂 painting factory烤漆厂 molding factory成型厂 common equipment常用设备 uncoiler and straightener整平机 punching machine 冲床 robot机械手 hydraulic machine油压机 lathe车床 planer |'plein |刨床 miller铣床 grinder磨床 driller钻床 linear cutting线切割 electrical sparkle电火花 welder电焊机 staker=reviting machine铆合机 position职务 president董事长 general manager总经理 special assistant manager特助 factory director厂长 department director部长 deputy manager |'depjuti| =vice manager副理 section supervisor课长 deputy section supervisor =vice section supervisor副课长 group leader/supervisor组长 line supervisor线长 assistant manager助理 to move, to carry, to handle搬运 be put in storage入库 pack packing包装 to apply oil擦油 to file burr 锉毛刺 final inspection终检 to connect material接料 to reverse material 翻料 wet station沾湿台 Tiana天那水 cleaning cloth抹布 to load material上料 to unload material卸料 to return material/stock to退料 scraped |'skr?pid|报废 scrape ..v.刮;削 deficient purchase来料不良 manufacture procedure制程 deficient manufacturing procedure 制程不良 oxidation |' ksi'dei n|氧化 scratch刮伤 dents压痕 defective upsiding down抽芽不良 defective to staking铆合不良 embeded lump|in'bed| |l mp|镶块 feeding is not in place送料不到位 stamping-missing漏冲 production capacity生产力 education and training教育与训练 proposal improvement提案改善 spare parts=buffer备件 forklift叉车 trailer=long vehicle拖板车
PCB术语中英文对照表 精华版
Adhesion 附着力 Annular Ring 孔环 AOI(automatic optical inspection)自动光学检测 AQL(acceptable quality level)可接受的质量等级 B²it(buried bump interconnection technology) 埋入凸块焊点互连技术BBH(buried blind hole) 埋盲孔 BGA(ball grid array) 球栅阵列 Blister 起泡 Board Edges 板边 Burr 毛头/毛刺 BUM(Build-up multilayer) 积层式多层板 BVH(buried/blind via hole)埋/盲导通孔 CAD(computer aided design) 计算机辅助设计 CAM(computer aided manufacturing) 计算机辅助制造 Carbon oil 碳油 CEM(composite epoxy material) 环氧树脂复合板材 chamfer 倒角 Characteristic impedance 特性阻抗 CNC(computerized numerical control)计算机化数字控制 Conductor Crack 导体破裂 Conductor Spacing 导线间距 connector 连接器 Copper foil 铜箔(皮) Crazing 微裂纹(白斑) Delamination 分层 Dewetting 半润湿(缩锡) DFM(design for manufacturing)可制造性设计 DIP(dual in-line package) 双列直插式组件 Dk(dielectric constant)介电常数 DRC(design rule checking) 设计规则检查 drawing 图纸 ECN(engineering change notice) 工程更改通知 ECO(engineering change order) 工程更改指令 E glass 电子级玻璃 entek OSP处理 Epoxy resin 环氧树脂 ESD(electrostatic discharge) 静电释放 Etched Marking 蚀刻标记 Flatness 翘曲度 Foreign Inclusion 外来夹杂物 Flame resistant 阻燃性 FR-2(flame-retardant 2) 耐燃酚醛纸基板 FR-3(flame-retardant 3) 耐燃环氧纸基板
PCB专业术语翻译(英语)
PCB专业术语(英语) PCBprinted circuitboard 印刷电路板,指空得线路板 PCBA printed circuit boardassembly印刷电路板组件,指完成元件焊接得线路板组件 PWA PrintedWire Assembly, Aperturelist Editor:光圈表编辑器。 Aperturelistwindows:光圈表窗口. Annular ring:焊环。 Array:拼版或陈列. Acid trip:蚀刻死角。 Assemby:安装. Bare Bxnel:光板,未进行插件工序得PCB板。 Bad Badsize:工作台,工作台有效尺寸. BlindBuried via:盲孔,埋孔。 Chamfer:倒角。 Circuit:线路。 Circuitlayer:线路层。 Clamshell tester:双面测试机. Coordinates Area:坐标区域. Copy—protect key:软件狗。 Coutour:轮廓。 Draw:一种圆形得光圈,但只就是用于创建线路,不用于创建焊盘。 Drill Rack:铅头表。 Drill Rack Editor:铅头表编辑器。 DrillRackwindow:铅头表窗口。 DCode:Gerber格式中用不着于表达光圈得代码。 Double—sided Biard:双面板。 Endof Block character(EOB):块结束符。 Extract Netlist:提取网络. Firdacial:对位标记. Flash:焊盘,来源于早期矢量光绘机,在矢量光绘机中,焊盘就是光通过光圈“闪出”(Fla sh)而形成得。 Gerber Data:从PCBCAD系统到PCB生产过程中最常用得数据格式. Grid:栅格。 GraphicalEditor:图形编辑器. Incremental Data:增量数据。 Land:接地层。 Layer list window:层列表窗口. Layer setup Area:层设置窗口. Multilayer Board:多层板。 Nets:网络。 NetEnd:网络端点。 Net List:网络表。 Pad:焊盘。 Pad shaving:焊盘缩小。