ECLAMP2357N-TCT中文资料

PROTECTION PRODUCTS PRELIMINARY

PROTECTION PRODUCTS - EMIClamp TM EMI Filter and ESD Protection for Secure Digital Card Interfaces

Description

Applications

Mechanical Characteristics

Touch Screen Display Interfaces

Secure Digital (SD) Memory Card Interfaces Multimedia Card Interfaces (MCI) Color LCD Panel Protection

Cell Phone Handsets and Accessories

16 pin QFN

RoHS/WEEE Compliant

Nominal Dimensions: 3.0 x 3.0 x 1.0 mm Lead Pitch: 0.5mm Lead Finish: Matte Tin Marking: Marking Code

Packaging: Tape and Reel per EIA 481 EMI/RFI filter with integrated ESD protection ESD protection to IEC 61000-4-2 (ESD) Level4,

±15kV (air), ±8kV (contact)

Filter performance: >30dB attenuation at 1.8GHz TVS working voltage: 5V Resistor: 100? +/? 15%

Component Capacitance: 10pF (VR = 0V) EMI & ESD protection for six lines

Dedicated ESD protection for four lines

Solid-state technology

Package Configuration

PIN Configuration

Features

The EClamp TM 2357N is a low pass filter array with integrated TVS diodes. It is designed to suppress unwanted EMI/RFI signals and provide electrostatic discharge (ESD) protection in portable electronic

equipment. They have been optimized for protection

protection of touch screen displays, secure digital (SD)card interfaces, and color LCD panels card interfaces, and color LCD panels in cellular phones and other portable electronics.

The device consists of six pi filter circuits comprised of

TVS diodes for ESD protection, and a resistor capacitor network for EMI/RFI filtering. A series resistor value of 100? and a component capacitance value of 10pF are used to achieve 20dB minimum attenuation from 1.0GHz to 3GHz. The device also includes 4 discrete TVS diodes for dedicated ESD protection. All of the TVS diodes provide effective suppression of ESD voltages in excess of ±15kV (air discharge) and ±8kV (contact discharge) per IEC 61000-4-2, level 4.

Maximum Ratings

Electrical Characteristics

n i t a R l o b m y S e u l a V s t i n U )

r i A (2-4-00016C E I r e p D S E )t c a t n o C (2-4-00016C E I r e p D S E V D S E 02-/+21-/+V

k e r u t a r e p m e T n o i t c n u J T J 521o

C e r u t a r e p m e T g n i t a r e p O T p o 58+o t 04-o

C e

r u t a r e p m e T e g a r o t S T G

T S 0

51+o t 55-o

e t e m a r a P l o b m y S s o i t i d C n n o m u m i n i M l a c i p y T m

u m i x a M s t i n U e g a t l o V f f O -d n a t S e s r e v e R S V T V M W R 5

V e g a t l o V n w o d k a e r B e s r e v e R S V T V R B I t A m 1=6801V t n e r r u C e g a k a e L e s r e v e R S V T I R V M W R V 3.3=5

.0A μe c n a t s i s e R s e i r e S l a t o T R e n i L h c a E 58001511s m h O e

c n a t i c a p a C l a t o T C n

i ,d n G o t t u p n I e n i L h c a E V R z H M 1=f ,V 0=0

p e

c n a t i c a p a C l a t o T C n

i ,d n G o t t u p n I e

n i L h c a E V R z

H M 1=f ,V 5.2=2151F

Typical Insertion Loss S21 (Each Filter)

Analog Crosstalk (Each Line)

ESD Clamping (+8kV Contact)ESD Clamping (-8kV Contact)

Capacitance vs. Reverse Voltage

(Normalized to 0 volts)

Series Resistance vs. Temperature (Normalized to 25 Degrees Celcius)

00.2

0.4

0.6

0.8

1.2

Reverse Voltage - V R (V)

C a p a c i t a n c e - C J (p F

)

0.70.8

0.9

1.0

1.1

1.2

-40

-30

-20

-10

Temperature (*C)

S e r i e s R e s i s t a n c e (O h m )

START 030 MHz CH1 S21 LOG

6 dB / REF 0 dB

START . 030 MHz 3 STOP 000 .000 000 MHz

CH1 S21 LOG

6 dB / REF 0 dB

1: -8.5294 dB 285.697 MHz

2: -18.060 dB 900 MHz

3: -31.328 dB 1.8 GHz

4: -32.019 dB 2.5 GHz

0 dB -6 dB -12 dB -18 dB -24 dB -30 dB

-36 dB -42 dB

GHz MHz GHz

MHz MHz

Applications Information

Device Connection

The EClamp2357N is comprised of six circuits each consisting of a low pass filter for EMI/RFI suppression and dual TVS diodes for ESD protection. It also includes 4 lines of TVS diodes for ESD protection of power lines or high speed I/O lines. The device is housed in a 16-pin Quad Flat No-Lead (QFN) package. Electrical connection is made via 16 pins located at the bottom of the device. A center tab serves as the ground connection. Pin connections are noted in the table to the right. The device is designed for easy PCB routing as shown in the application examples. All path lengths should be kept as short as possible to minimize the effects of parasitic inductance in the board traces. Matte Tin Lead Finish

Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small com-pared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint.

Pin Identification and Configuration (Top Side View)

n i P n o i t a c i f i t n e d I

01,9,7,5,4,3s e n i L

d e t c e t o r P

S E/I M

t u p n I

61,41,2

1,1

1,2,1s e n i L

d e t c e t o r P

S E/I M

t u p t u

1,3

1,8

,6s e n i L

d e t c e t o r P

S E

t u p t u

O/t u p n I

b a T r e t n e C d n u o r G

Pin Configuration and Schematic

5678

16151413

Typical Applications

Outline Drawing - 16L QFN

Contact Information

Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012Phone: (805)498-2111 FAX (805)498-3804

Marking

Ordering Information

Top View Showing Device Marking

Tape and Reel Specification

Notes:

1) YYWW = Date Code

2) Pin 1 indicated by bevel on the ground pad

e b m u N t r a P r e p y t Q l e e R e z i S l e e R T

C T .N 7532p m a l C E 0

003h

c n I 7Bottom View Showing

Pin 1 Identifier

Tape Specifications

Device Orientation in Tape

1234

6781211109

1514131234

5678

1211109

16151413EClamp and EMIClamp are marks of Semtech Corpora-tion