N35P112;中文规格书,Datasheet资料

Datasheet

EasyPoint TM

N35P112

Navigation Module

1 General Description

EasyPoint? N35P112 is a miniature joystick module concept based on contact-less, magnetic movement detection. The integrated two-dimensional linear encoder monitors the movement of the magnet incorporated in the knob and provides directly the x and y

coordinates via I2C output. An integrated mechanical push button built in the module provides a “select” function.Figure 1. N35P112-xxxxx-H

2 Key Features

XY coordinates direct read with 8-bit resolution 2.7V to 3.6V operating voltage Down to 1.7V I/O voltage

Lateral magnet movement radius up to 0.5mm High-speed I2C interface

Configurable interrupt output for motion detection Push button feature

3 Applications

The EasyPoint? N35P112 is ideal for small form-factor manual input devices in battery operated equipment, such as Mobile phones, MP3 players, PDAs, GPS receivers, Gaming consoles and Analog joystick replacement.

4 Benefits

High reliability due to magnetic non-contact sensing Low power consumption Two operating modes

-Idle mode

-

Low Power mode

N35P112

Push button GND

I2C Address

GND: 0x40VDDp: 0x41

AS5013Two-dimensional magnetic encoder

Contents

1 General Description (1)

2 Key Features (1)

3 Applications (1)

4 Benefits (1)

5 Pin Assignments (4)

5.1 Pin Descriptions (4)

6 Absolute Maximum Ratings (5)

7 Electrical Characteristics (6)

7.1 Operating Conditions (6)

7.2 Digital IO Pads DC/AC Characteristics (6)

7.3 Switch Characteristics (7)

7.4 Mechanical Specifications (8)

7.5 Recommended Reflow Temperature Profile (8)

8 Using the N35P112 Module (9)

8.1 Powering up the Module (9)

8.2 Registers Initialization (9)

8.3 C Source Code Example (10)

8.3.1 Initialization (10)

8.3.2 Offset Calibration (10)

8.3.3 Dead Zone area (11)

8.3.4 Interrupt Routine (11)

9 XY Coordinates Interpretation (12)

9.1 EasyPoint Operating Principle (12)

9.1.1 Knob Displacement and Register Value Relation (13)

9.2 Operation Principle (14)

10 I2C interface (15)

10.1 Interface Operation (15)

10.2 I2C Electrical Specification (16)

10.3 I2C Timing (17)

10.4 I2C Modes (18)

10.4.1 Automatic Increment of Address Pointer (18)

10.4.2 Invalid Addresses (18)

10.4.3 Reading (18)

10.4.4 Writing (18)

10.4.5 High Speed Mode (21)

10.4.6 Automatic Increment of Address Pointer (22)

10.4.7 Invalid Addresses (22)

10.5 SDA, SCL Input Filters (22)

11 I2C Registers (23)

11.1 Control Register 1 (0Fh) (23)

11.2 X Register (10h) (25)

11.3 Y_res_int Register (11h) (25)

11.4 Xp Register (12h) (25)

11.5 Xn Register (13h) (25)

11.6 Yp Register (14h) (26)

11.7 Yn Register (15h) (26)

11.8 M_ctrl Register (2Bh) (26)

11.9 J_ctrl Register (2Ch) (27)

11.10 T_ctrl Register (2Dh) (27)

11.11 Control Register 2 (2Eh) (27)

11.12 Registers Table (28)

12 Package Drawings and Markings (30)

Datasheet - P i n A s s i g n m e n t s

5 Pin Assignments

5.1 Pin Descriptions

Table 1. Pin Descriptions

Connector Pin #Pin Type Description 1Power VDDp: IO power supply for SCL, SDA, INTn, 1.7V~3.6V

2Power VDD: Core power supply, 2.7V ~ 3.6V

3Power GND

4Bi-directional SDA: I2C bus data, open drain

5Input SCL: I2C bus clock

6Input RESETn: Reset input, active LOW

0: GND → Reset, all registers return to their reset value 1: VDDp → Normal operation mode

7Open drain INTn: Interrupt output, open drain: Active: LOW

Inactive: Hi-Z

8Output SWITCHn: Push button signal output: Not pushed: Open

Pushed: GND

9Input ADDR: I2C Address selection input: 0: GND → 0x40

1: VDDp → 0x41

Datasheet - A b s o lu t e M a x im u m R a ti n g s

6 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 6 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Symbol Parameter Min Max Units Notes

V DD DC supply voltage-0.35V

VDDp Peripheral supply voltage-0.3

5

VDD + 0.3

V SCL, SDA, RESETn, ADDR

V IN Input pin voltage -0.3VDDp + 0.3

V SCL, SDA, RESETn, ADDR - 3.6

I SCR Input current (latchup immunity)-100100mA Norm: JEDEC 78

ESD Electrostatic discharge-±2kV All pins, Norm: MIL 883 E method 3015 T Strg Storage temperature-4085oC

Humidity non-condensing585%

Degrees of protection IP5X Norm: IEC 60529

7 Electrical Characteristics

7.1 Operating Conditions

T AMB = -20 to +70oC, VDD = 3.3V 7.2 Digital IO Pads DC/AC Characteristics

Table 3. Operating Conditions Symbol Parameter

Min Typ

Max Units Notes

VDD

Core Supply voltage

2.7

3.6

V

VDDp Peripheral Supply voltage 1.7VDD V

Input: RESETn

Open drain outputs: SCL, SDA, INTn.

External I2C pull up resistor to be connected to VDDp.IDD S

Maximal average current consumption on VDD,

Pulsed peaks = IDD f

depends on the sampling time ts[ms]3+3760/ts [ms]μA

T AMB = -20 to +50 oC

10+3760/ts [ms]

T AMB = 50 to +70 oC IDD I Current consumption on core supply, Idle mode,

no readout (ts = infinite)

3μA

T AMB = -20 to +50 oC

10T AMB = 50 to +70 oC IDD f Current consumption on core supply,Full Power mode 10continuous current pin VDD Maximum sampling ts = 450μs Tpua Power up time analog 1000Step on VDD to Data_Ready Tconv Conversion time 450Read X/Y coordinate I2C STOP condition to Data_Ready

t P,W Nominal wakeup time 20320T AMB

Ambient temperature range -20

+70

Resolution of XY displacement

8

over 2*dx and 2*dy axis

Table 4. Digital IO Pads DC/AC Characteristics Symbol Parameter

Min

Max

Units

Notes

Inputs: SCL, SDA

V IH High level input voltage 0.7 * VDDp

V I2C V IL Low level input voltage 0.3 * VDDp

V I2C I LEAK Input leakage current 1

μA VDDp = 3.6V Inputs: ADDR, RESETn (JEDEC76)

V IH High level input voltage 0.65 * VDDp

V JEDEC V IL Low level input voltage 0.35 * VDDp

V JEDEC I LEAK Input leakage current

1

μA

VDDp = 3.6V

Outputs: SDA

V OH

High level output voltage

Open drain

Leakage current 1μA High level output

voltage

7.3 Switch Characteristics

V OL1

Low level output voltage

VSS + 0.4

V

-6mA; VDDp > 2V;fast mode V OL3

VDDP * 0.2V

-6mA; VDDp ≤ 2V;fast mode V OL1

VSS + 0.4V

-3mA; VDDp > 2V;high speed V OL3VDDP * 0.2V -3mA; VDDp ≤ 2V;high speed C L Capacitive load 400

pF standard mode ( 100 kHz )400pF fast mode ( 400 kHz )100

pF

high speed mode ( 3.4 MHz )Outputs: INTn (JEDEC76)

V OH High level output voltage Open drain

1μA Leakage current High level output voltage

V OL Low level output voltage

VSS + 0.2V -100μA VSS + 0.45

-2mA C L

Capacitive load

30

pF

standard mode ( 100 kHz )

Table 5. Switch Characteristics

Parameter

Min

Max Units Notes Contact resistance of dome switch 500

m ΩNorm: EIA-364-23Dielectric withstanding voltage

100Vac Norm: EIA-364-20Insulation resistance 100

m ΩNorm: EIA-364-21, 100Vdc

Bouncing (On/Off)

5

ms

Rate: 2 times/sec.

Table 4. Digital IO Pads DC/AC Characteristics Symbol Parameter

Min

Max Units Notes

7.4 Mechanical Specifications

7.5 Recommended Reflow Temperature Profile

Table 6. Mechanical Specifications

Parameter Note Number of operating shafts

Single shaft Shaft material PA46Housing material PA46

Shell material Stainless Steel or Copper alloy

Travel (XY operation)±0.50mm (±10%)Travel (Z push operation)0.20mm (±0.05mm)Directional operating force (XY direction)0.45N (±0.15N)Push operating force (Z direction)

1.80N (±15%)

Vibration

10-500-10Hz 15 minutes, 12 cycles, 3 axes (total 36 cycles)

Operating life – XY direction Each direction > 1 million cycles

Operating life – Push Z direction > 1 million cycles

Shaft strength (XYZ direction)

> 3.0 kgf

Free fall Dispensing Glue

40 drops (2X6 sides + 1X12 edges + 2X8 corners) @ 1.5m drop height to concrete surface, module is assembled to phone mechanics.

Over force

Dispensing Glue 1.5kgf, > 100k cycles

8 Using the N35P112 Module

8.1 Powering up the Module

The N35P112 module has a Power ON Reset (POR) cell to monitor the VDD voltage at startup and reset all the internal registers. After the internal reset is completed, the POR cell is disabled in order to save current during normal operation.

If VDD drops below 2.7V down to 0.2V, the POR cell will not be enabled back, and the registers will not be correctly reseted or can get random values.

Note:It is highly recommended to control the external RESETn signal by applying a LOW pulse of >100ns once VDD has reached 2.7V and VDDp reached 1.7V.

8.2 Registers Initialization

After Power Up, the following sequence must be performed:

1. VDD and VDDp Power up, and reached their nominal values (VDD>

2.7V, VDDp>1.7V).

2. Initialization:

a. RESETn pulse LOW during >100ns, then RESETn HIGH

b. Loop check register [0Fh] until the value F0h or F1h is present (reset finished, registers to default values)

c. Write value 06h into register [2Dh] → Configure T_ctrl scaling factor for 0.5mm knob displacement

3. Perform an Offset Calibration (X and Y coordinate compensation for zero position)

4. Configure the Dead Zone Area for Wake-up function (if needed)

5. Configure the wanted Power Mode and INT function into register [0Fh] (Idle mode / Low Power Mode with Timebase configuration, INT

for Wake-up or Coordinates ready)

6. X Y coordinates are ready to be read.

8.3 C Source Code Example

8.3.1 Initialization

void EasyPoint_init (void)

{

unsigned char Reset_status = 0;

RESETn = 0;Delay_ms(1);// RESETn pulse after power up

RESETn = 1; Delay_ms(1);

while (Reset_status != 0xF0)// Check the reset has been done

{

Reset_status = I2C_Read8(0x40, 0x0F) & 0xFE;

}

I2C_Write8(0x40, 0x2d, 0x06); // Scaling factor for N35 (0.5mm knob travel) }

8.3.2 Offset Calibration

void Offset_Calibrate (void)

{

char i;

int x_cal=0, y_cal=0;

EA = 0;// Disable the MCU interrupts

I2C_Write8(0x40, 0x0F, 0x00);// Low Power Mode 20ms

Delay_ms(1);

I2C_Read8(0x40, 0x11); // Flush an unused Y_reg to reset the interrupt

for (i=0; i<16; i++)// Read 16 times the coordinates and then average

{

while (INTn);// Wait until next interrupt (new coordinates)

x_cal += (signed char) I2C_Read8(0x40, 0x10); // Read X position

y_cal += (signed char) I2C_Read8(0x40, 0x11); // Read Y position }

// offset_X and offset_Y are global variables, used for each coordinate readout in the interrupt routine

offset_X = -(x_cal>>4); // Average X: divide by 16

offset_Y = -(y_cal>>4); // Average Y: divide by 16

EA = 1; // Enable the MCU interrupts

}

分销商库存信息: AMS

N35P112

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