BZG04-18中文资料
DATA SHEET
Preliminary speci?cation
Supersedes data of 1996Jun 10
1996Sep 19
DISCRETE SEMICONDUCTORS
BZG04 series
Transient voltage suppressor diodes
handbook, halfpage
M3D168
Transient voltage suppressor diodes BZG04 series
FEATURES
?Glass passivated
?High maximum operating temperature
?Low leakage current
?Excellent stability
?UL 94V-O classified plastic package
?Transient suppressor stand-off voltage range:
8.2to220V for 32 types ?Shipped in 12mm embossed tape.DESCRIPTION
DO-214AC surface mountable
package with glass passivated chip.
The well-defined void-free case is of a
transfer-moulded thermo-setting
plastic.
Fig.1 Simplified outline (DO-214AC; SOD106) and symbol. handbook, 4 columns
MSA473
cathode
band
Top view Side view
,,
,,
k a
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC134).
SYMBOL PARAMETER CONDITIONS MIN.MAX.UNIT
P RSM non-repetitive peak reverse power
dissipation 10/1000μs exponential pulse
(see Fig.4); T j=25°C prior to
surge; see also Fig.2
?300W
T stg storage temperature?65+175°C T j junction temperature?65+175°C
Transient voltage suppressor diodes
BZG04 series
ELECTRICAL CHARACTERISTICS Total series
T j =25°C unless otherwise specified.Per type
T j =25°C unless otherwise specified.
SYMBOL PARAMETER
CONDITIONS
MIN.MAX.UNIT
V F
forward voltage
I F =0.5A; see Fig.3
?
1.2
V
TYPE NUMBER
REVERSE BREAKDOWN VOLTAGE TEMPERATURE COEFFICIENT TEST CURRENT CLAMPING VOLTAGE REVERSE CURRENT
at STAND-OFF VOLTAGE V (BR)R (V)at I test
S Z (%/K)at I test I test (mA)V (CL)R (V)at I RSM (A)
note 1
I R (μA)at V R (V)MIN.
MIN.MAX.MAX.MAX.BZG04-8V29.40.050.095014.820.3208.2BZG04-9V110.40.050.105015.719.159.1BZG04-1011.40.050.105017.017.7510BZG04-1112.40.050.105018.915.9511BZG04-1213.80.050.105020.914.4512BZG04-1315.30.060.112522.913.1513BZG04-1516.80.060.112525.611.7515BZG04-1618.80.060.112528.410.6516BZG04-1820.80.060.112531.09.7518BZG04-2022.80.060.112533.88.9520BZG04-2225.10.060.112538.17.9522BZG04-24280.060.112542.27.1524BZG04-27310.060.112546.2 6.5527BZG04-30340.060.111050.1 6.0530BZG04-33370.060.111054.1 5.5533BZG04-36400.070.121060.7 4.9536BZG04-39440.070.121065.5 4.6539BZG04-43480.070.121070.8 4.2543BZG04-47520.070.121078.6 3.8547BZG04-51580.080.131086.5 3.5551BZG04-56640.080.131094.4 3.2556BZG04-62700.080.1310103.5 2.9562BZG04-68770.080.1310114 2.6568BZG04-75850.090.135126 2.4575BZG04-82940.090.135139 2.2582BZG04-911040.090.135152 2.0591BZG04-100
114
0.09
0.13
5
167
1.8
5
100
Transient voltage suppressor diodes
BZG04 series
Note
1.Non-repetitive peak reverse current in accordance with “IEC 60-1, Section 8” (10/1000μs pulse); see Fig.4.THERMAL CHARACTERISTICS Notes
1.Device mounted on an Al 2O 3 printed-circuit board, 0.7mm thick; thickness of Cu-layer ≥35μm, see Fig.5.
2.Device mounted on an epoxy-glass printed-circuit board, 1.5mm thick; thickness of Cu-layer ≥40μm, see Fig.5.
For more information please refer to the “General Part of associated Handbook”.
BZG04-1101240.090.135185 1.65110BZG04-1201380.090.135204 1.55120BZG04-1301530.090.135224 1.35130BZG04-1501680.090.135249 1.25150BZG04-1601880.090.135276 1.15160BZG04-1802080.090.132305 1.05180BZG04-2002280.090.1323360.95200BZG04-220251
0.09
0.13
2
380
0.8
5
220
SYMBOL PARAMETER
CONDITIONS
VALUE UNIT R th j-tp thermal resistance from junction to tie-point 25K/W R th j-a thermal resistance from junction to ambient
note 1100K/W note 2
150
K/W
TYPE NUMBER
REVERSE BREAKDOWN VOLTAGE TEMPERATURE COEFFICIENT TEST CURRENT CLAMPING VOLTAGE REVERSE CURRENT
at STAND-OFF VOLTAGE V (BR)R (V)at I test
S Z (%/K)at I test I test (mA)V (CL)R (V)at I RSM (A)
note 1
I R (μA)at V R (V)MIN.
MIN.MAX.MAX.MAX.
Transient voltage suppressor diodes
BZG04 series
GRAPHICAL DATA
T j =25°C prior to surge.
Fig.2
Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse).
handbook, halfpage
10?2
10102
103
104
10?1
1
t p (ms)
P ZSM (W)10
MBH452
T j =25°C.
Fig.3
Forward current as a function of forward voltage; typical values.
handbook, halfpage
02
3
1
2
MBH453
I F (A)1
V F (V)
Fig.4
Non-repetitive peak reverse current pulse definition.
In accordance with “IEC 60-1, Section 8”.t 1=10μs.t 2=1000μs.
handbook, halfpage
MGD521
I RSM (%)10090
50
10
t 1
t 2
t
Fig.5 Printed-circuit board for surface mounting.
Dimensions in mm.
MSB213
4.5
2.5
1.25
50
50
Transient voltage suppressor diodes
BZG04 series
PACKAGE OUTLINE
Dimensions in mm.
The marking band indicates the cathode.
Fig.6 DO-214AC; SOD106.
handbook, full pagewidth
MSA414
,
,
,
4.54.3
5.55.13.32.7
2.32.0
2.82.4 1.61.4
0.05
0.2
Transient voltage suppressor diodes BZG04 series
DEFINITIONS
Data sheet status
Objective speci?cation This data sheet contains target or goal speci?cations for product development. Preliminary speci?cation This data sheet contains preliminary data; supplementary data may be published later. Product speci?cation This data sheet contains ?nal product speci?cations.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speci?cation is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the speci?cation.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.