AM26LS32
AM26LV32CD资料

–0.8–0.6–0.4–0.20.20.40.60.811.2 1.4 1.6 1.822.22.4–1V IC – Common-Mode Input Voltage – VNotRecommendedIncreased Receiver Input SensitivityFigure 8. V IC Versus V ID Receiver Sensitivity LevelsPACKAGING INFORMATIONOrderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)AM26LV32CD ACTIVE SOIC D 1640Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM AM26LV32CDR ACTIVE SOIC D 162500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM AM26LV32CNSLE OBSOLETE SO NS 16None Call TI Call TIAM26LV32CNSRACTIVESONS162000Pb-Free (RoHS)CU NIPDAULevel-2-260C-1YEAR/Level-1-235C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -May not be currently available -please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead (Pb-Free).Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean "Pb-Free"and in addition,uses package materials that do not contain halogens,including bromine (Br)or antimony (Sb)above 0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makesno representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM4-Mar-2005Addendum-Page 1IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
AM26LS31中文资料

50% Duty Cycle tTLH, tTHL
MOTOROLA ANALOG IC DEVICE DATA
3
元器件交易网
AM26LS31
OUTLINE DIMENSIONS
D SUFFIX PLASTIC PACKAGE CASE 751B–05 (SO–16) ISSUE J
2
MOTOROLA ANALOG IC DEVICE DATA
元器件交易网
AM26LS31
Figure 1. Three–State Enable Test Circuit and Waveforms
To Scope (Input) 3.0 V or Gnd Input Inv Output To Scope Output
≈ 1.5 V tPLZ(E) Output 0.5 V ≈ 1.5 V
Figure 2. Propagation Delay Times Input to Output Waveforms and Test Circuit
Scope (Output) Scope (Input) Inv Output 200 5.0 V
Outputs
ORDERING INFORMATION
Device AM26LS31PC MC26LS31D*
© Motorola, Inc. 1995
Operating Temperature Range TA = 0 to +70°C
Package Plastic DIP SO–16
L = Low Logic State H = High Logic Stan–Inv Output 3.0 V Enable CL = 30 pF 75
AM26LS31驱动资料

≈ 1.5 V tPLZ(E) Output 0.5 V ≈ 1.5 V
Figure 2. Propagation Delay Times Input to Output Waveforms and Test Circuit
Scope (Output) Scope (Input) Inv Output 200 5.0 V
t 100 µA Requirement
D SUFFIX PLASTIC PACKAGE CASE 751B (SO–16)
Complementary Outputs for Balanced Line Operation High Output Drive Capability Advanced LS Processing PNP Inputs for MOS Compatibility
NOTES: 1. Only one output may be shorted at a time. 2. See EIA Specification EIA–422 for exact test conditions. 3. Circuit in three–state condition.
AM26LV32C中文资料

IMPORTANT NOTICETexas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current.TI warrants performance of its semiconductor products and related software to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.Certain applications using semiconductor products may involve potential risks of death, personal injury, or severe property or environmental damage (“Critical Applications”).TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS.Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI products in such applications requires the written approval of an appropriate TI officer. Questions concerning potential risk applications should be directed to TI through a local SC sales office.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards should be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Nor does TI warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used.Copyright © 1995, Texas Instruments Incorporated。
Texas Instruments DS26LS32系列四线差分接收器产品说明书

DS26LS32AC,DS26LS32C,DS26LS32M,DS26LS33M SNLS352C–MAY1999–REVISED FEBRUARY2013 DS26LS32AC/DS26LS32C/DS26LS32M/DS26LS33M Quad Differential Line ReceiversCheck for Samples:DS26LS32AC,DS26LS32C,DS26LS32M,DS26LS33MFEATURES DESCRIPTIONThe DS26LS32and DS26LS32A are quad differential •High Differential or Common-Mode Inputline receivers designed to meet the RS-422,RS-423 Voltage Ranges of±7V on the DS26LS32andand Federal Standards1020and1030for balanced DS26LS32A and±15V on the DS26LS33and unbalanced digital data transmission.•±0.2V Sensitivity Over the Input Voltage RangeThe DS26LS32and DS26LS32A have an input on the DS26LS32and DS26LS32A,±0.5Vsensitivity of200mV over the input voltage range of Sensitivity on the DS26LS33±7V and the DS26LS33has an input sensitivity of •DS26LS32and DS26LS32A Meet All500mV over the input voltage range of±15V.Requirements of RS-422and RS-423The DS26LS32A differs in function from the popular •6k Minimum Input Impedance DS26LS32and DS26LS33in that input pull-up and•100mV Input Hysteresis on the DS26LS32and pull-down resistors are included which prevent output DS26LS32A,200mV on the DS26LS33oscillation on unused channels.•Operation From a Single5V Supply Each version provides an enable and disable functioncommon to all four receivers and features TRI-STATE •TRI-STATE Outputs,with Choice ofoutputs with8mA sink capability.Constructed using Complementary Output Enables for Receivinglow power Schottky processing,these devices are Directly onto a Data Busavailable over the full military and commercialoperating temperature ranges.Logic DiagramPlease be aware that an important notice concerning availability,standard warranty,and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.All trademarks are the property of their respective owners.PRODUCTION DATA information is current as of publication date.Copyright©1999–2013,Texas Instruments Incorporated Products conform to specifications per the terms of the TexasDS26LS32AC,DS26LS32C,DS26LS32M,DS26LS33MSNLS352C–MAY1999–REVISED Connection DiagramFor Complete Military Product Specifications,refer to the appropriate SMD or MDS.Figure1.Dual-In-Line Package(Top View)D Package or NFG0016E PackageFigure2.20-Lead Ceramic Leadless Chip CarrierTruth Table(1)ENABLE ENABLE Input Output 01X Hi-Z See note below.(2)V ID≥V TH(Max)1V ID≤V TH(Min)0(1)Hi-Z=TRI-STATE(2)Note:Input conditions may be any combination not defined for ENABLE and ENABLE.2Submit Documentation Feedback Copyright©1999–2013,Texas Instruments IncorporatedDS26LS32AC,DS26LS32C,DS26LS32M,DS26LS33M SNLS352C–MAY1999–REVISED FEBRUARY2013These devices have limited built-in ESD protection.The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.Absolute Maximum Ratings(1)(2)Supply Voltage7V Common-Mode Range±25V Differential Input Voltage±25V Enable Voltage7V Output Sink Current50mA Maximum Power Dissipation(3)at25°CCavity Package1433mW Molded DIP Package1362mW SOIC Package(4)DS26LS321002mW DS26LS32A1051mW Storage Temperature Range−65°C to+165°C Lead Temperature(Soldering,4seconds)260°C (1)“Absolute Maximum Ratings”are those values beyond which the safety of the device cannot be guaranteed.They are not meant toimply that the device should be operated at these limits.The table of“Electrical Characteristics”provides conditions for actual device operation.(2)If Military/Aerospace specified devices are required,please contact the TI Sales Office/Distributors for availability and specifications.(3)Derate cavity package9.6mW/°C above25°C;derate molded DIP package10.9mW/°C above25°C.(4)Derate SOIC Package8.01mW/°C for DS26LS328.41mW/°C for DS26LS32AOperating ConditionsMin Max Units Supply Voltage,(V CC)DS26LS32M,DS26LS33M(MIL) 4.5 5.5V DS26LS32C,DS26LS32AC(COML) 4.75 5.25V Temperature,(T A)DS26LS32M,DS26LS33M(MIL)−55+125°C DS26LS32C,DS26LS32AC(COML)0+70°CElectrical Characteristics(1)(2)(3)over the operating temperature range unless otherwise specifiedSymbol Parameter Conditions Min Typ Max Units V TH Differential Input Voltage V OUT=V OH or DS26LS32,DS26LS32A,−7V≤V CM≤+7V−0.2±0.070.2VV OL DS26LS33,DS26LS33A,−15V≤V+15V−0.5±0.140.5VCMR IN Input Resistance−15V≤V CM≤+15V(One Input AC GND) 6.08.5kΩI IN Input Current(Under V IN=15V,Other Input−15V≤V IN≤+15V 2.3mATest)V=−15V,Other Input−15V≤V IN≤+15V−2.8mAINV OH Output High Voltage V CC=MIN,ΔV IN=1V,Commercial 2.7 4.2VV ENABLE=0.8V,I OH=−440μA Military 2.5 4.2VV OL Output Low Voltage V CC=Min,ΔV IN=−1V,I OL=4mA0.4VV ENABLE=0.8V I OL=8mA0.45VV IL Enable Low Voltage0.8VV IH Enable High Voltage 2.0VV I Enable Clamp Voltage V CC=Min,I IN=−18mA−1.5V(1)All currents into device pins are shown as positive,all currents out of device pins are shown as negative,all voltages are referenced toground,unless otherwise specified.All values shown as max or min are so classified on absolute value basis.(2)All typical values are V CC=5V,T A=25°C.(3)Only one output at a time should be shorted.Copyright©1999–2013,Texas Instruments Incorporated Submit Documentation Feedback3DS26LS32AC,DS26LS32C,DS26LS32M,DS26LS33MSNLS352C–MAY1999–REVISED Electrical Characteristics(1)(2)(3)(continued)over the operating temperature range unless otherwise specifiedSymbol Parameter Conditions Min Typ Max Units I O OFF-State(High V CC=Max V O=2.4V20μAImpedance)OutputV O=0.4V−20μA CurrentI IL Enable Low Current V IN=0.4V−0.36mAI IH Enable High Current V IN=2.7V20μAI SC Output Short-Circuit V O=0V,V CC=Max,ΔV IN=1V−15−85mA CurrentI CC Power Supply Current V CC=Max,All V IN=GND,DS26LS32,DS26LS32A5270mAOutputs Disabled DS26LS33,DS26LS33A5780mAI I Input High Current V IN=5.5V100μAV HYST Input Hysteresis T A=25°C,V CC=5V,DS26LS32,DS26S32A100mVV CM=0V DS26LS33,DS26LS33A200mV Switching CharacteristicsV CC=5V,T A=25°CDS26LS32/DS26LS33DS26LS32A/DS26LS33ASymbol Parameter Conditions UnitsMin Typ Max Min Typ Maxt PLH Input to Output C L=15pF17252335nst PHL17252335nst LZ ENABLE to Output C L=5pF20301530nst HZ15222025nst ZL ENABLE to Output C L=15pF15221422nst ZH15221522ns AC TEST CIRCUIT AND SWITCHING TIME WAVEFORMSFigure3.Load Test Circuit for TRI-STATE Outputs4Submit Documentation Feedback Copyright©1999–2013,Texas Instruments IncorporatedDS26LS32AC,DS26LS32C,DS26LS32M,DS26LS33M SNLS352C–MAY1999–REVISED FEBRUARY2013Diagram shown for ENABLE low.Pulse generator for all pulses:Rate=1.0MHz;Z O=50Ω;t r≤6ns;t f≤6.0ns.Figure4.Propagation DelayS1and S2of load circuit are closed except where shown.Pulse generator for all pulses:Rate=1.0MHz;Z O=50Ω;t r≤6ns;t f≤6.0ns.Figure5.Enable and Disable TimesTYPICAL APPLICATIONSFigure6.Two-Wire Balanced Interface—RS-422Figure7.Single Wire with Driver Ground Reference—RS-423Copyright©1999–2013,Texas Instruments Incorporated Submit Documentation Feedback5DS26LS32AC,DS26LS32C,DS26LS32M,DS26LS33MSNLS352C–MAY1999–REVISED REVISION HISTORYChanges from Revision B(February2013)to Revision C Page •Changed layout of National Data Sheet to TI format (5)6Submit Documentation Feedback Copyright©1999–2013,Texas Instruments IncorporatedPACKAGING INFORMATION(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement.(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andAddendum-Page 1continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 2IMPORTANT NOTICETexas Instruments Incorporated(TI)reserves the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46,latest issue,and to discontinue any product or service per JESD48,latest issue.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.TI’s published terms of sale for semiconductor products(/sc/docs/stdterms.htm)apply to the sale of packaged integrated circuit products that TI has qualified and released to market.Additional terms may apply to the use or sale of other types of TI products and services.Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such reproduced rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements. 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Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death(e.g.,life support,pacemakers,defibrillators,heart pumps,neurostimulators,and implantables).Such equipment includes,without limitation,all medical devices identified by the U.S.Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.TI may expressly designate certain products as completing a particular qualification(e.g.,Q100,Military Grade,or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers’own risk.Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection.Designer will fully indemnify TI and its representatives against any damages,costs,losses,and/or liabilities arising out of Designer’s non-compliance with the terms and provisions of this Notice.Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2018,Texas Instruments Incorporated。
AM26C32MDREP中文资料

FEATURESAM26C32... D PACKAGEDESCRIPTION/ORDERINGINFORMATIONAM26C32-EPQUADRUPLE DIFFERENTIAL LINE RECEIVERSLLS870–NOVEMBER 2007•Low Power,I CC =10mA Typ•Controlled Baseline •±7V Common-Mode Range With ±200mV Sensitivity–One Assembly •Input Hysteresis ...60mV Typ –One Test Site•t pd =17ns Typ–One Fabrication Site•Operates From a Single 5V Supply •Extended Temperature Performance of –55°C to 125°C•3-State Outputs•Enhanced Diminishing Manufacturing Sources •Input Fail-Safe Circuitry(DMS)Support•Improved Replacements for AM26LS32•Enhanced Product-Change Notification •Qualification Pedigree (1)•Meets or Exceeds the Requirements of ANSI TIA/EIA-422-B,TIA/EIA-423-B,and ITU Recommendation V.10and V.11(1)Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over anextended temperature range.This includes,but is not limited to,Highly Accelerated Stress Test (HAST)or biased 85/85,temperature cycle,autoclave or unbiased HAST,electromigration,bond intermetallic life,and mold compound life.Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.The AM26C32is a quadruple differential line receiver for balanced or unbalanced digital data transmission.The enable function is common to all four receivers and offers a choice of active-high or active-low input.The 3-state outputs permit connection directly to a bus-organized system.Fail-safe design specifies that if the inputs are open,the outputs always are high.The AM26C32devices are manufactured using a BiCMOS process,which is a combination of bipolar and CMOS transistors.This process provides the high voltage and current of bipolar with the low power of CMOS to reduce the power consumption to about one-fifth that of the standard AM26LS32,while maintaining ac and dc performance.The AM26C32is characterized for operation over the extended temperature range of –55°C to 125°C.ORDERING INFORMATION (1)T APACKAGE (2)ORDERABLE PART NUMBER TOP-SIDE MARKING –55°C to 125°C SOIC –DReel of 2500AM26C32MDREP26C32EP(1)For the most current package and ordering information,see the Package Option Addendum at the end of this document,or see the TI website at .(2)Package drawings,thermal data,and symbolization are available at /packaging .Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PRODUCTION DATA information is current as of publication date.Copyright ©2007,Texas Instruments IncorporatedProducts conform to specifications per the terms of the Texas On products compliant to MIL-PRF-38535,all parameters are Instruments standard warranty.Production processing does not tested unless otherwise noted.On all other products,production necessarily include testing of all parameters.processing does not necessarily include testing of all parameters.AM26C32-EPQUADRUPLE DIFFERENTIAL LINE RECEIVERSLLS870–NOVEMBER 2007FUNCTION TABLE (each receiver)ENABLES DIFFERENTIALOUTPUTINPUT YG G H X H V ID ≥V IT+X L H H X ?V IT–<V ID <V IT+X L ?H X L V ID ≤V IT–X L L XLHZ2Submit Documentation Feedback Copyright ©2007,Texas Instruments IncorporatedLOGIC DIAGRAM(POSITIVELOGIC)SCHEMATICSAM26C32-EPQUADRUPLE DIFFERENTIAL LINE RECEIVERSLLS870–NOVEMBER2007 Copyright©2007,Texas Instruments Incorporated Submit Documentation Feedback3ABSOLUTE MAXIMUM RATINGS (1)RECOMMENDED OPERATING CONDITIONSAM26C32-EPQUADRUPLE DIFFERENTIAL LINE RECEIVERSLLS870–NOVEMBER 2007over operating free-air temperature range (unless otherwise noted)MINMAXUNIT V CC Supply voltage (2)7V A or B inputs –1114V V I Input voltage rangeG or G inputs–0.5V CC +0.5V V ID Differential input voltage range –1414V V O Output voltage range –0.5V CC +0.5V I O Output current±25mA D package 73θJA Package thermal impedance (3)(4)°C/W PW package 108T J Operating virtual junction temperature150°C Lead temperature 1,6mm (1/16inch)from case for 10seconds 260°C T stg Storage temperature range–65150°C(1)Stresses beyond those listed under "absolute maximum ratings"may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)All voltage values,except differential output voltage,V OD ,are with respect to network GND.Currents into the device are positive and currents out of the device are negative.(3)Maximum power dissipation is a function of T J (max),θJA ,and T A .The maximum allowable power dissipation at any allowable ambient temperature is P D =(T J (max)–T A )/θJA .Operating at the absolute maximum T J of 150°C can affect reliability.(4)The package thermal impedance is calculated in accordance with JESD 51-7.MINNOMMAX UNIT V CC Supply voltage 4.555.5V V IH High-level input voltage 2V V IL Low-level input voltage 0.8V V IC Common-mode input voltage ±7V I OH High-level output current –6mA I OL Low-level output current 6mA T AOperating free-air temperature–55125°C4Submit Documentation Feedback Copyright ©2007,Texas Instruments IncorporatedELECTRICAL CHARACTERISTICS SWITCHING CHARACTERISTICSAM26C32-EP QUADRUPLE DIFFERENTIAL LINE RECEIVERSLLS870–NOVEMBER2007over recommended ranges of V CC,V IC,and operating free-air temperature(unless otherwise noted)PARAMETER TEST CONDITIONS MIN TYP(1)MAX UNITV O=V OH(min),V IC=–7V to7V0.2V IT+Differential input high-threshold voltage VI OH=–440µA V IC=0to5.5V0.1V O=0.45V,V IC=–7V to7V–0.2(2)V IT–Differential input low-threshold voltage VI OL=8mA V IC=0to5.5V–0.1(2)V hys Hysteresis voltage(V IT+–V IT–)60mVV IK Enable input clamp voltage V CC=4.5V,I I=–18mA–1.5VV OH High-level output voltage V ID=200mV,I OH=–6mA 3.8VV OL Low-level output voltage V ID=–200mV,I OL=6mA0.20.3VOff-state(high-impedance state)outputI OZ V O=V CC or GND±0.5±5µAcurrentV I=10V,Other input at0V 1.5I I Line input current mAV I=–10V,Other input at0V–2.5I IH High-level enable current V I=2.7V20µAI IL Low-level enable current V I=0.4V–100µAr I Input resistance One input to ground1217kΩI CC Supply current V CC=5.5V1015mA(1)All typical values are at V CC=5V,V IC=0,and T A=25°C.(2)The algebraic convention,in which the less positive(more negative)limit is designated minimum,is used in this data sheet forcommon-mode input voltage.over recommended ranges of operation conditions,C L=50pF(unless otherwise noted)(1)All typical values are at V CC=5V,T A=25°C.Copyright©2007,Texas Instruments Incorporated Submit Documentation Feedback5PARAMETER MEASUREMENT INFORMATIONTEST CIRCUITVOLTAGE WAVEFORMS0 V OutputV OH V OL2.5 V −2.5 V 50%InputC L = 50 pF (see Note A)InputTEST CIRCUITV CCV ID = ±VOLTAGE WAVEFORMSPLZ Measurement: S1 to V CC PHZ Measurement: S1 to GND G G(see Note B)Output(with V ID = 2.5 V)Output(with V ID = −2.5 V)3 V0 V 3 V0 VV OH V OLV OHV OL AM26C32-EPQUADRUPLE DIFFERENTIAL LINE RECEIVERSLLS870–NOVEMBER 2007A.C L includes probe and jig capacitance.Figure 1.Switching Test Circuit and Voltage WaveformsA.C L includes probe and jig capacitance.B.The input pulse is supplied by a generator having the following characteristics:PRR =1MHz,duty cycle ≤50%,t r =t f =6ns.Figure 2.Enable/Disable Time Test Circuit and Output Voltage Waveforms6Submit Documentation Feedback Copyright ©2007,Texas Instruments IncorporatedPACKAGING INFORMATIONOrderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)AM26C32MDREP ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM V62/07648-01XEACTIVESOICD162500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information maynot be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF AM26C32-EP :•Catalog:AM26C32•Military:AM26C32MNOTE:Qualified Version Definitions:•Catalog-TI's standard catalog product •Military -QML certified for Military and Defense Applications PACKAGE OPTION ADDENDUM18-Sep-2008Addendum-Page 1IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandClocks and Timers Digital ControlInterface MedicalLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityRFID TelephonyRF/IF and ZigBee®Solutions Video&ImagingWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2008,Texas Instruments Incorporated。
AM26LS31

IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third–party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Mailing Address:Texas InstrumentsPost Office Box 655303Dallas, Texas 75265Copyright 2002, Texas Instruments Incorporated。
AM26LS31MJB中文资料

TA
Operating free-air temperature
AM26LS31C AM26LS31M
AM26LS31C AM26LS31M
MIN NOM MAX UNIT
4.75
5 5.25
V
4.5
5 5.5
2
V
0.8 V
–20 mA
20 mA
0
70
°C
–55
125
Electrical Characteristics(1)
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
ICC Supply current
VCC = MIN, VCC = MIN, VCC = MIN,
VCC = MIN,
VCC = MAX, VCC = MAX, VCC = MAX, VCC = MAX VCC = MAX,
II = –18 mA IOH = –20 mA IOL = 20 mA VO = 0.5 V VO = 2.5 V VI = 7 V VI = 2.7 V VI = 0.4 V
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Output
Input Network
Amplifier
Hysteresis
Level Translator
Level Translator
Amplifier
* Note that the surface mount MC26LS32D device uses the same die as in the plastic DIP * AM26LS32DC device, but with an MC prefix to prevent confusion with the package suffix.
–
–
–
Rin
6.0 K
–
p p Input Balance and Output Level (– 7.0 V VIC 7.0 V, VIH = 2.0 V, See Note 3) (IO = – 0.4 mA, VID = 0.4 V) (IO = 8.0 mA, VID = – 0.4 V)
VOH
IIH
µA
–
–
20
–
–
100
VIK
–
–
– 1.5
V
Power Supply Current (VIL = 0 V) (All Inputs Grounded)
ICC
–
–
70
mA
NOTES: 1. All currents into device pins are shown as positive, out of device pins are negative. All voltages referenced to ground unless otherwise noted. 2. Differential input threshold voltage and guaranteed output levels are done simultaneously for worst case. 3. Refer to EIA–422/3 for exact conditions. Input balance and guaranteed output levels are done simultaneously for worst case. 4. Only one output at a time should be shorted.
2
MOTOROLA ANALOG IC DEVICE DATA
AM26LS32
SWITCHING CHARACTERISTICS (VCC = 5.0 V and TA = 25°C, unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
tPHL(D)
–
tPLH(D)
–
tPLZ
–
tPHZ
–
tPZH
–
tPZL
–
ns
–
30
–
30
ns
–
35
–
35
–
30
–
30
Figure 1. Switching Test Circuit and Wave for Propagation Delay Differential Input to Output
• Four Independent Receiver Chains • Three–State Outputs • High Impedance Output Control Inputs
(PIA Compatible)
• Internal Hysteresis – 30 mV (Typical) @ Zero Volts Common Mode • Fast Propagation Times – 25 ns (Typical) • TTL Compatible • Single 5.0 V Supply Voltage • Fail–Safe Input–Output Relationship. Output Always High When Inputs
Order this document by AM26LS32/D
QUAD EIA-422/423 Line Receiver with Three-State Outputs
Motorola′s Quad EIA–422/3 Receiver features four independent receiver chains which comply with EIA Standards for the Electrical Characteristics of Balanced/Unbalanced Voltage Digital Interface Circuits. Receiver outputs are 74LS compatible, three–state structures which are forced to a high impedance state when Pin 4 is a Logic “0” and Pin 12 is a Logic “1.” A PNP device buffers each output control pin to assure minimum loading for either Logic “1” or Logic “0” inputs. In addition, each receiver chain has internal hysteresis circuitry to improve noise margin and discourage output instability for slowly changing input waveforms. A summary of AM26LS32 features include:
p p Input Bias Current (VCC = 0 V or 5.25) (Other Inputs at –15 V Vin + 15 V) Vin = + 15 V Vin = – 15 V
p p Input Resistance ( –15 V Vin + 15 V)
IIB(D)
–
MOTOROLA ANALOG IC DEVICE DATA
Inputs A
1– 2+
Outputs A 3 3–State Control 4 Output C 5
Inputs C
6+ 7–
GND 8
16 VCC – 15
Inputs B + 14
13 Output B 3–State
12 Control 11 Output D
D SUFFIX PLASTIC PACKAGE
CASE 751B (SO–16)
PC SUFFIX PLASTIC PACKAGE
CASE 648
PIN CONNECTIONS
Representative Block Diagram
Differential Inputs
Three–State Control Inputs
–
–
Differential Input Threshold Voltage (Note 2)
p p (– 7.0 V VIC 7.0 V, VIH = 2.0 V) q (IO = – 0.4 mA, VOH 2.7 V) p (IO = 8.0 mA, VOL 0.45 V)
VTH(D)
–
–
–
–
VCC
4.75 to 5.25
Vdc
TA
0 to + 70
°C
VICR
– 7.0 to + 7.0
Vdc
VIDR
6.0
Vdc
ELECTRICAL CHARACTERISTICS (Unless otherwise noted, minimum and maximum limits apply over recommended temperature and power supply voltage ranges. Typical values are for TA = 25°C, VCC = 5.0 V and VIC = 0 V. See Note 1.)
Are Open, Terminated or Shorted
• 6.0 k Minimum Input Impedance
AM26LS32
QUAD EIA–422/3 LINE RECEIVER WITH
THREE–STATE OUTPUTS
SEMICONDUCTOR TECHNICAL DATA
Symbol
Value
Unit
VCC
7.0
Vdc
VICM
± 25
Vdc
VID
± 25
Vdc
VI
7.0
Vdc
IO
50
mA
Tstg
– 65 to + 150
°C
TJ
+ 150
°C
RECOMMENDED OPERATING CONDITIONS
Rating
Symbol
Value
Unit
Power Supply Voltage Operating Ambient Temperature Input Common Mode Voltage Range Input Differential Voltage Range
Propagation Delay Time – DIfferential Inputs to Output (Output High to Low) (Output Low to High)