SN54HC4040中文资料
SN54LS32FK中文资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9557401QCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC 5962-9557401QDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC 5962-9557401QDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30501B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/30501B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/30501BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30501BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30501BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30501BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30501SCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30501SCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30501SDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30501SDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SN5432J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN5432J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54LS32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54LS32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54S32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54S32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN7432N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN7432N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN7432N3OBSOLETE PDIP N14TBD Call TI Call TISN7432N3OBSOLETE PDIP N14TBD Call TI Call TISN7432NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN7432NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS32D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DBRE4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DBRE4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4ACTIVE SOIC D1450Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)SN74LS32DG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS32J OBSOLETE CDIP J14TBD Call TI Call TISN74LS32J OBSOLETE CDIP J14TBD Call TI Call TISN74LS32N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS32N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS32N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS32N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS32NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS32NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS32NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32NSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32NSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74S32N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S32N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S32N3OBSOLETE PDIP N14TBD Call TI Call TISN74S32N3OBSOLETE PDIP N14TBD Call TI Call TISN74S32NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S32NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S32NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ5432J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ5432J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ5432W ACTIVE CFP W141TBD Call TI Level-NC-NC-NCSNJ5432W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54LS32FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS32FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS32W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54LS32W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54S32FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S32FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCSNJ54S32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ54S32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ54S32W ACTIVE CFP W141TBD Call TI Level-NC-NC-NCSNJ54S32W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54AHCT541中文资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9685801Q2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 5962-9685801QRA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC 5962-9685801QSA ACTIVE CFP W201TBD Call TI Level-NC-NC-NC SN74AHCT541DBLE OBSOLETE SSOP DB20TBD Call TI Call TISN74AHCT541DBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74AHCT541NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74AHCT541NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541PW ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541PWE4ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHCT541PWLE OBSOLETE TSSOP PW20TBD Call TI Call TISN74AHCT541PWR ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541PWRE4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541PWRG4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54AHCT541FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54AHCT541J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SNJ54AHCT541W ACTIVE CFP W201TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54LS123中文资料

RETRIGGERABLE MONOSTABLE MULTIVIBRATORSThese dc triggered multivibrators feature pulse width control by three meth-ods. The basic pulse width is programmed by selection of external resistance and capacitance values. The LS122 has an internal timing resistor that allows the circuits to be used with only an external capacitor. Once triggered, the ba-sic pulse width may be extended by retriggering the gated low-level-active (A)or high-level-active (B) inputs, or be reduced by use of the overriding clear.•Overriding Clear Terminates Output Pulse•Compensated for V CC and T emperature Variations•DC Triggered from Active-High or Active-Low Gated Logic Inputs •Retriggerable for Very Long Output Pulses, up to 100% Duty Cycle •Internal Timing Resistors on LS122SN54/74LS122 (TOP VIEW)(SEE NOTES 1 THRU 4)SN54/74LS123 (TOP VIEW)(SEE NOTES 1 THRU 4)NOTES:1.An external timing capacitor may be connected between C ext and R ext /C ext (positive).2.To use the internal timing resistor of the LS122, connect R int to V CC .3.For improved pulse width accuracy connect an external resistor between R ext /C ext and V CC with R int open-circuited.4.To obtain variable pulse widths, connect an external variable resistance between R int /C ext and V CC .R ext/CR ext/C ext 11ĂRext/2CLRC extNC Ċ NO INTERNAL CONNECTION.。
SN54LS245中文资料

SN54LS245, SN74LS245SN54LS245, SN74LS245PACKAGING INFORMATIONAddendum-Page 1(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)Addendum-Page 2(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN54LS245, SN54LS245-SP, SN74LS245 :•Catalog: SN74LS245, SN54LS245•Military: SN54LS245•Space: SN54LS245-SPNOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense Applications•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based applicationAddendum-Page 3TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LS245DBR SSOP DB 202000330.016.48.27.5 2.512.016.0Q1SN74LS245DWR SOIC DW 202000330.024.410.813.0 2.712.024.0Q1SN74LS245NSRSONS202000330.024.48.213.02.512.024.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74LS245DBR SSOP DB202000367.0367.038.0 SN74LS245DWR SOIC DW202000367.0367.045.0SN74LS245NSR SO NS202000367.0367.045.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46,latest issue,and to discontinue any product or service per JESD48,latest issue.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949requirements,mainly for automotive use.In any case of use of non-designated products,TI will not be responsible for any failure to meet ISO/TS16949.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Applications Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2014,Texas Instruments Incorporated。
SN54HC373中文资料

元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
SN54HC354J资料

IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
SNJ54HC74中文资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-8405601VCA ACTIVE CDIP J141None Call TI Level-NC-NC-NC 5962-8405601VDA ACTIVE CFP W141None Call TI Level-NC-NC-NC 84056012A ACTIVE LCCC FK201None Call TI Level-NC-NC-NC 8405601CA ACTIVE CDIP J141None Call TI Level-NC-NC-NC 8405601DA ACTIVE CFP W141None Call TI Level-NC-NC-NC JM38510/65302B2A ACTIVE LCCC FK201None Call TI Level-NC-NC-NC JM38510/65302BCA ACTIVE CDIP J141None Call TI Level-NC-NC-NC JM38510/65302BDA ACTIVE CFP W141None Call TI Level-NC-NC-NC SN54HC74J ACTIVE CDIP J141None Call TI Level-NC-NC-NC SN74HC74ADBLE OBSOLETE SSOP DB14None Call TI Call TISN74HC74D ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74HC74DBLE OBSOLETE SSOP DB14None Call TI Call TISN74HC74DBR ACTIVE SSOP DB142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74HC74DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC74DT ACTIVE SOIC D14250Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74HC74N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74HC74N3OBSOLETE PDIP N14None Call TI Call TISN74HC74NSR ACTIVE SO NS142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74HC74PW ACTIVE TSSOP PW1490Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIMSN74HC74PWLE OBSOLETE TSSOP PW14None Call TI Call TISN74HC74PWR ACTIVE TSSOP PW142000Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIMSN74HC74PWT ACTIVE TSSOP PW14250Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIM SNJ54HC74FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NC SNJ54HC74J ACTIVE CDIP J141None Call TI Level-NC-NC-NC SNJ54HC74W ACTIVE CFP W141None Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-May not be currently available-please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead(Pb-Free).Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean"Pb-Free"and in addition,uses package materials that do not contain halogens, including bromine(Br)or antimony(Sb)above0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54F02资料

元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
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PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)85004012A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 8500401EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 8500401FA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SN54HC4040J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCSN74HC4040D ACTIVE SOIC D1640Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74HC4040DBLE OBSOLETE SSOP DB16TBD Call TI Call TISN74HC4040DBR ACTIVE SSOP DB162000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74HC4040DR ACTIVE SOIC D162500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74HC4040DT ACTIVE SOIC D16250Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74HC4040DWR OBSOLETE SOIC DW16TBD Call TI Call TISN74HC4040N ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74HC4040N3OBSOLETE PDIP N16TBD Call TI Call TISN74HC4040NSR ACTIVE SO NS162000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74HC4040PW ACTIVE TSSOP PW1690Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIMSN74HC4040PWLE OBSOLETE TSSOP PW16TBD Call TI Call TISN74HC4040PWR ACTIVE TSSOP PW162000Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIMSN74HC4040PWT ACTIVE TSSOP PW16250Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIM SNJ54HC4040FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54HC4040J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54HC4040W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。