MC33874BPNA;MC33874BPNAR2;中文规格书,Datasheet资料

Document Number: MC33874Rev. 9.0, 8/2008Freescale Semiconductor Advance Information* This document contains certain information on a new product.Specifications and information herein are subject to change without notice.© Freescale Semiconductor, Inc., 2006-2008. All rights reserved.Quad High Side Switch (Quad 35m Ω)The 33874 is one in a family of devices designed for low-voltage automotive and industrial lighting and motor control applications. Its four low R DS(ON) MOSFETs (four 35m Ω) can control the high sides of four separate resistive or inductive loads.Programming, control, and diagnostics are accomplished using a 16-bit SPI interface. Additionally, each output has its own parallel input for pulse-width modulation (PWM) control if desired. The 33874 allows the user to program via the SPI the fault current trip levels and duration of acceptable lamp inrush or motor stall intervals. Suchprogrammability allows tight control of fault currents and can protect wiring harnesses and circuit boards as well as loads.The 33874 is packaged in a power-enhanced 12 x 12 nonleaded Power QFN package with exposed tabs.Features•Quad 35m Ω high side switches (at 25°C)•Operating voltage range of 6.0V to 27V with standby current < 5.0μA•SPI control of over-current limit, over-current fault blanking time, output OFF open load detection, output ON / O FF control, watchdog timeout, slew rates, and fault status reporting•SPI status reporting of over-current, open and shorted loads, over-temperature, under-voltage and over-voltage shutdown, fail-safe pin status, and program status•Analog current feedback with selectable ratio •Analog board temperature feedback•Enhanced -16V reverse polarity V PWR protection •Pb-free packaging designated by suffix code PNA Figure 1. 33874 Simplified Application DiagramHIGH SIDE SWITCH33874ORDERING INFORMATIONDevice Temperature Range (T A )Package MC33874BPNA/R2- 40°C to 125°C24 PQFNAnalog Integrated Circuit Device Data33874INTERNAL BLOCK DIAGRAMINTERNAL BLOCK DIAGRAMFigure 2. 33874 Simplified Internal Block DiagramGND Programmable Watchdog 279ms–2250msOver-temperatureDetectionLogicSPI 3.0MHzSelectable Over-HS[0:3]:2.8A–10ASelectable Over-currentInternal RegulatorSelectable Slew Rate Gate DriveOver/Under-voltageProtectionHS0VPWRVDDCS SCLKSO SI RST WAKEFS IN0FSIIN3HS1HS0HS1HS2HS3HS2HS3IN1IN2current Low Detection HS[0:3]: 55A or 40ASelectable Output Current HS[0:3]: 1/7200 or 1/21400CSNSRecopy (Analog MUX)V ICV ICI DWNI UPI DWNR DWN Open Load DetectionHigh Detection Selectable Over-current Low Detection0.15ms–155msBlanking Time Temperature FeedbackTEMPV ICAnalog Integrated Circuit Device Data 33874PIN CONNECTIONSPIN CONNECTIONSFigure 3. 33874 Pin ConnectionsTable 1. 33874 Pin DefinitionsA functional description of each pin can be found in the Functional Pin Description section beginning on page 15.Pin NumberPin Name Pin Function Formal Name Definition1CSNS Output Output Current Monitoring The Current Sense pin sources a current proportional to the designated HS0 : H S3 output.2356IN0IN1IN2IN3InputParallel InputsThe IN0 : I N3 high side input pins are used to directly control HS0 : H S3 high side output pins, respectively.4TEMP Output Temperature Feedback This pin reports an analog value proportional to the temperature of the GND flag (pins 14, 17, 23). It is used by the MCU to monitor board temperature.7FS Output Fault Status (Active Low)This pin is an open drain configured output requiring an external pull-up resistor to VDD for fault reporting.8WAKE Input Wake This input pin controls the device mode and watchdog timeout feature if enabled.9RST Input Reset This input pin is used to initialize the device configuration and fault registers, as well as place the device in a low-current Sleep Mode.10CS Input Chip Select (Active Low)This input pin is connected to a chip select output of a master microcontroller (MCU).11SCLK Input Serial Clock This input pin is connected to the MCU providing the required bit shift clock for SPI communication.12SI Input Serial Input This pin is a command data input pin connected to the SPI Serial Data Output of the MCU or to the SO pin of the previous device of a daisy -chain of devices. 13VDDPowerDigital Drain Voltage(Power)This pin is an external voltage input pin used to supply power to the SPI circuit.Transparent Top View of Package132412109876543211123221920211617181514SO GNDHS3HS1NCHS0HS2GND FSI V D DS IS C L KC SR S TW A K EF SI N 3I N 2T E M PI N 1I N 0C S N S GNDVPWRAnalog Integrated Circuit Device Data33874PIN CONNECTIONS14, 17, 23GND Ground GroundThese pins are the ground for the logic and analog circuitry of the device.15VPWR Power Positive Power Supply This pin connects to the positive power supply and is the source of operationalpower for the device.16SO Output Serial Output This output pin is connected to the SPI Serial Data Input pin of the MCU or to the SI pin of the next device of a daisy -chain of devices.18192122HS3HS1HS0HS2OutputHigh Side OutputsProtected 35m Ω high side power output pins to the load.20NC N/A No Connect This pin may not be connected.24FSIInputFail-safe InputThe value of the resistance connected between this pin and ground determines the state of the outputs after a watchdog timeout occurs.Table 1. 33874 Pin Definitions (continued)A functional description of each pin can be found in the Functional Pin Description section beginning on page 15.Pin Number Pin Name Pin Function Formal NameDefinitionAnalog Integrated Circuit Device Data 33874ELECTRICAL CHARACTERISTICSMAXIMUM RATINGSELECTRICAL CHARACTERISTICSMAXIMUM RATINGSTable 2. Maximum RatingsAll voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device.RatingsSymbol Value UnitELECTRICAL RATINGS Operating Voltage Range Steady-State V PWR(SS)-16 to 41V V DD Supply Voltage V DD -0.3 to 5.5V Input / O utput Voltage (1)See note (1)- 0.3 to 7.0V SO Output Voltage (1)V SO - 0.3 to V DD + 0.3V WAKE Input Clamp Current I CL(WAKE) 2.5mA CSNS Input Clamp Current I CL(CSNS)10mA HS [0:3] Voltage Positive Negative V HS41-16VOutput Current (2) I HS[0:3]11A Output Clamp Energy (3) E CL [0:3]85mJ ESD Voltage (4)Human Body Model (HBM) Charge Device Model (CDM)Corner Pins (1, 13, 19, 21)All Other Pins (2-12, 14-18, 20, 22-24)V ESD± 2000± 750± 500VTHERMAL RATINGS Operating Temperature Ambient JunctionT A T J - 40 to 125- 40 to 150°CStorage Temperature T STG- 55 to 150°C Thermal Resistance (5)Junction to Case Junction to AmbientR θJC R θJA <1.030°C/ WPeak Pin Reflow Temperature During Solder Mounting (6)T SOLDERNote 6°CNotes1.Exceeding voltage limits on IN[0:3], , FSI, CSNS, TEMP, SI, SO, SCLK, pins may cause a malfunction or permanentdamage to the device.2.Continuous high side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum outputcurrent using package thermal resistance is required.3.Active clamp energy using single-pulse method (L = 2mH, R L = 0Ω, V PWR = 14V, T J = 150°C initial).4.ESD testing is performed in accordance with the Human Body Model (C ZAP = 100pF, R ZAP = 1500Ω), Charge Device Model (CDM), Robotic (C ZAP = 4.0pF).5.Device mounted on a 2s2p test board per JEDEC JESD51-2.6.Freescale’s Package Reflow capability meets Sn-Pb-free requirements for JEDEC standard J-STD-020A. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL),Go to , search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.Analog Integrated Circuit Device Data33874ELECTRICAL CHARACTERISTICSSTATIC ELECTRICAL CHARACTERISTICSSTATIC ELECTRICAL CHARACTERISTICSTable 3. Static Electrical CharacteristicsCharacteristics noted under conditions 6.0V ≤ V PWR ≤ 27V, 4.5V ≤ V DD ≤ 5.5V, - 40°C ≤ T A ≤ 125°C, GND = 0V, unlessotherwise noted. Typical values noted reflect the approximate parameter means at T A = 25°C under nominal conditions, unless otherwise noted.CharacteristicSymbolMinTypMaxUnitPOWER INPUT (VPWR, VDD)Battery Supply Voltage Range Fully OperationalV PWR6.0–27VV PWR Operating Supply Current Outputs ON, HS[0 : 3] open I PWR(ON)––20mA V PWR Supply CurrentOutputs OFF, Open Load Detection Disabled, WAKE > 0.7 x V DD , RST = V LOGIC HIGHI PWR(SBY)––5.0mASleep State Supply Current (V PWR = 14V, RST < 0.5V, WAKE < 0.5V) T A = 25°C T A = 85°C I PWR(SLEEP)–– 1.0–1050μAV DD Supply Voltage V DD(ON) 4.55.05.5V V DD Supply Current No SPI Communication 3.0MHz SPI Communication (7)I DD(ON)–––– 1.05.0mAV DD Sleep State CurrentI DDSLEEP –– 5.0μA Over-voltage Shutdown Threshold V OV 283236V Over-voltage Shutdown Hysteresis V OVHYS 0.20.8 1.5V Under-voltage Shutdown Threshold (8) V UV 4.75 5.25 5.75V Under-voltage Hysteresis (9)V UVHYS –0.25–V Under-voltage Power-ON ResetV UVPOR ––4.75VNotes7.Not guaranteed in production.8.The under-voltage fault condition is reported to SPI register as long as the external V DD supply is within specification and the V PWRvoltage level does not go below the under-voltage Power-ON Reset threshold.9.This applies when the under-voltage fault is not latched (IN = [0:3]).Analog Integrated Circuit Device Data 33874ELECTRICAL CHARACTERISTICSSTATIC ELECTRICAL CHARACTERISTICSOUTPUTS (HS0, HS1, HS2, HS3)Output Drain-to-Source ON Resistance (I HS = 5.0A, T A = 25°C)V PWR = 6.0V V PWR = 10V V PWR = 13VR DS(ON)––––––553535m ΩOutput Drain-to-Source ON Resistance (I HS = 5.0A, T A = 150°C)V PWR = 6.0V V PWR = 10V V PWR = 13VR DS(ON)––––––946060m ΩOutput Source-to-Drain ON Resistance (10)I HS = 1.0A, T A = 25°C, V PWR = -12VR SD(ON)––70m ΩOutput Overcurrent High Detection Levels (9.0V < V PWR < 16V)SOCH = 0SOCH = 1I OCH0I OCH1443255406648AOvercurrent Low Detection Levels (9.0V < V PWR < 16V) SOCL[2:0] : 000 SOCL[2:0] : 001SOCL[2:0] : 010SOCL[2:0] : 011SOCL[2:0] : 100SOCL[2:0] : 101SOCL[2:0] : 110SOCL[2:0] : 111I OCL0I OCL1I OCL2I OCL3I OCL4I OCL5I OCL6I OCL78.07.16.35.64.63.83.12.2108.97.97.05.84.83.92.81210.79.58.57.05.84.73.4ACurrent Sense Ratio (9.0V < V PWR < 16V, CSNS < 4.5V)DICR D2 = 0 DICR D2 = 1C SR0C SR1––1/72001/21400–––Current Sense Ratio (C SR0) Accuracy Output Current2.0A to 10AC SR0_ACC-17–17%Notes10.Source-Drain ON Resistance (Reverse Drain-to-Source ON Resistance) with negative polarity V PWR .Table 3. Static Electrical Characteristics (continued)Characteristics noted under conditions 6.0V ≤ V PWR ≤ 27V, 4.5V ≤ V DD ≤ 5.5V, - 40°C ≤ T A ≤ 125°C, GND = 0V, unlessotherwise noted. Typical values noted reflect the approximate parameter means at T A = 25°C under nominal conditions, unless otherwise noted.CharacteristicSymbolMinTypMaxUnitAnalog Integrated Circuit Device Data33874ELECTRICAL CHARACTERISTICSSTATIC ELECTRICAL CHARACTERISTICSOUTPUTS (HS0, HS1, HS2, HS3) (continued)Current Sense Ratio (C SR1) Accuracy Output Current10A to 20AC SR1_ACC-19–19%Current Sense Clamp Voltage CSNS Open; I HS[0:3] = 11A V CL(CSNS)4.5 6.07.0VOpen Load Detection Current (11)I OLDC 30–100μA Output Fault Detection Threshold Output Programmed OFF V OFD(THRES)2.03.04.0VOutput Negative Clamp Voltage 0.5A < I HS[0:3] < 2.0A, Output OFF V CL- 20–-16VOver-temperature Shutdown (12)T SD 155175190°C Over-temperature Shutdown Hysteresis (12)T SD(HYS) 5.0–20°CNotes11.Output OFF Open Load Detection Current is the current required to flow through the load for the purpose of detecting the existence ofan open load condition when the specific output is commanded OFF.12.Guaranteed by process monitoring. Not production tested.Table 3. Static Electrical Characteristics (continued)Characteristics noted under conditions 6.0V ≤ V PWR ≤ 27V, 4.5V ≤ V DD ≤ 5.5V, - 40°C ≤ T A ≤ 125°C, GND = 0V, unlessotherwise noted. Typical values noted reflect the approximate parameter means at T A = 25°C under nominal conditions, unless otherwise noted.CharacteristicSymbolMinTypMaxUnitAnalog Integrated Circuit Device Data 33874ELECTRICAL CHARACTERISTICSSTATIC ELECTRICAL CHARACTERISTICSCONTROL INTERFACE (SCLK, SI, SO, IN[0:3], RST, WAKE, FS, CS , FSI)Input Logic High-voltage (13)V IH 0.7 V DD––V Input Logic Low-voltage (13)V IL ––0.2 V DD V Input Logic Voltage Hysteresis (14)V IN(HYS)1008501200mV Input Logic Pull-down Current (SCLK, SI, IN[0:3], V IN >0.2 x V DD )I DWN 5.0–20μA RST Input Voltage RangeV RST 4.5 5.0 5.5V SO, FS Tri-State Capacitance (14)C SO ––20pF Input Logic Pull-down Resistor (RST ) and WAKE R DWN100200400k ΩInput Capacitance (15)C IN– 4.012pF Wake Input Clamp Voltage (16)I CL(WAKE) < 2.5mA V CL(WAKE)7.0–14V Wake Input Forward Voltage I CL(WAKE) = -2.5mA V F(WAKE)- 2.0–- 0.3VSO High-state Output Voltage I OH = 1.0mAV SOH0.8 V DD––VFS , SO Low-state Output VoltageI OL = -1.6mAV SOL–0.20.4VSO Tri-state Leakage Current CS > 0.7 x V DD, 0 < V SO < V DDI SO(LEAK)- 5.00 5.0μAInput Logic Pull-up Current (17)CS , V IN < 0.7 x V DDI UP5.0–20μAFSI Input pin External Pull-down Resistance (18)FSI Disabled, HS[0:3] state according to direct inputs state and SPI INx_SPI bits and A/O_s bit FSI Enabled, HS[0:3] OFFFSI Enabled, HS0 ON, HS[1:3] OFFFSI Enabled, HS0 and HS2 ON, HS1 and HS3 OFF R FS–6.0154006.517Infinite 1.07.019–k ΩTemperature Feedback T A = 25°CT FEED3.83.94.0VTemperature Feedback DeratingDT FEED-7.2-7.5-7.8mV/°CNotes13.Upper and lower logic threshold voltage range applies to SI, CS , SCLK, RST , IN[0:3], and WAKE input signals. The WAKE and RSTsignals may be supplied by a derived voltage referenced to V PWR .14.No hysteresis on FSI and wake pins. Parameter is guaranteed by process monitoring but is not production tested.15.Input capacitance of SI, CS , SCLK, RST , and WAKE. This parameter is guaranteed by process monitoring but is not production tested.16.The current must be limited by a series resistance when using voltages > 7.0V.17.Pull-up current is with CS OPEN. CS has an active internal pull-up to VDD.18.The selection of the RFS must take into consideration the tolerance, temperature coefficient and lifetime duration to assure that the resistance value will always be within the desired (specified) range.Table 3. Static Electrical Characteristics (continued)Characteristics noted under conditions 6.0V ≤ V PWR ≤ 27V, 4.5V ≤ V DD ≤ 5.5V, - 40°C ≤ T A ≤ 125°C, GND = 0V, unlessotherwise noted. Typical values noted reflect the approximate parameter means at T A = 25°C under nominal conditions, unless otherwise noted.CharacteristicSymbol Min Typ Max UnitAnalog Integrated Circuit Device Data33874ELECTRICAL CHARACTERISTICSDYNAMIC ELECTRICAL CHARACTERISTICSDYNAMIC ELECTRICAL CHARACTERISTICSTable 4. Dynamic Electrical CharacteristicsCharacteristics noted under conditions 6.0V ≤ V PWR ≤ 27V, 4.5V ≤ V DD ≤ 5.5V, - 40°C ≤ T A ≤ 125°C, GND = 0V, unlessotherwise noted. Typical values noted reflect the approximate parameter means at T A = 25°C under nominal conditions, unless otherwise noted.CharacteristicSymbolMinTypMaxUnitPOWER OUTPUT TIMING (HS0, HS1, HS2, HS3)Output Rising Slow Slew Rate A (DICR D3 = 0)(19)9.0V < V PWR < 16VSR RA _SLOW0.10.30.75V/μsOutput Rising Slow Slew Rate B (DICR D3 = 0)(20)9.0V < V PWR < 16VSR RB _SLOW0.0150.050.15V/μs Output Rising Fast Slew Rate A (DICR D3 = 1)(19)9.0V < V PWR < 16VSR RA _FAST0.51.53.0V/μsOutput Rising Fast Slew Rate B (DICR D3 = 1)(20)9.0V < V PWR < 16VSR RB _FAST0.0250.31.0V/μsOutput Falling Slow Slew Rate A (DICR D3 = 0)(19)9.0V < V PWR < 16VSR FA _SLOW0.10.30.75V/μsOutput Falling Slow Slew Rate B (DICR D3 = 0)(20)9.0V < V PWR < 16VSR FB _SLOW0.0150.050.15V/μsOutput Falling Fast Slew Rate A (DICR D3 = 1)(19)9.0V < V PWR < 16VSR FA _FAST0.51.53.0V/μsOutput Falling Fast Slew Rate B (DICR D3 = 1)(20)9.0V < V PWR < 16VSR FB _FAST0.0250.31.0V/μsOutput Turn-ON Delay Time in Slow Slew Rate (21)DICR = 0t DLY_SLOW(ON)2.030200μsOutput Turn-ON Delay Time in Fast Slew Rate (21)DICR = 1t DLY_FAST(ON)1.06.0100μsOutput Turn-OFF Delay Time in Slow Slew Rate Mode (22) DICR = 0t DLY_SLOW(OFF)40200800μsOutput Turn-OFF Delay Time in Fast Slew Rate Mode (22) DICR = 1t DLY_FAST(OFF)2050400μsOver-current Low Detection Blanking Time OCLT[1:0]: 00OCLT[1:0]: 01(23)OCLT[1:0]: 10OCLT[1:0]: 11t OCL0t OCL1t OCL2t OCL3108–550.08155–750.15202–950.3msNotes19.Rise and Fall Slew Rates A measured across a 5.0Ω resistive load at high side output = 0.5V to V PWR - 3.5V (see Figure 4, page 12).These parameters are guaranteed by process monitoring.20.Rise and Fall Slew Rates B measured across a 5.0Ω resistive load at high side output = 0.5V to V PWR - 3.5V (see Figure 4). Theseparameters are guaranteed by process monitoring.21.Turn-ON delay time measured from rising edge of any signal (IN[0 : 3], SCLK, CS ) that would turn the output ON to V HS[0 : 3] = 0.5V withR L = 5.0Ω resistive load.22.Turn-OFF delay time measured from falling edge of any signal (IN[0 : 3], SCLK, CS ) that would turn the output OFF to V HS[0 : 3] = V PWR - 0.5V with R L = 5.0Ω resistive load.23.This logical bit is not defined. Do not use.分销商库存信息:FREESCALEMC33874BPNA MC33874BPNAR2。