HDSP-3351中文资料
HDSP-Kxxx中文资料
Seven Segment Displays—10mm (0.40 inch), 10mm Slim Font,10.9mm (0.43 inch), 14.2mm (0.56inch),13mm Slim FontReliability DataDescriptionThe following cumulative test results have been obtained from testing performed at HP Optoelec-tronics Division in accordance with the latest revision of MIL- STD-883.Hewlett-Packard tests parts at the absolute maximum rated condi-tions recommended for the device. The actual performance you obtain from HP parts depends on the electrical and environmen-tal characteristics of your applica-Point Typical PerformanceStress Test Total DeviceUnits Total Failure Rate ColorsConditionsHoursTestedFailedMTBF(% /1 K Hours)HER T A = 55°C, I F = 30 mA 420,000630420,000≤0.23 %AlGaAs T A = 55°C, I F = 30 mA 378,000630378,000≤0.26 %Green T A = 55°C, I F = 30 mA 252,000840252,000≤0.40 %Orange T A = 55°C, I F = 30 mA 147,000210147,000≤0.26 %YellowT A = 55°C, I F = 20 mA147,00021147,000≤0.26 %Table 1. Life TestsDemonstrated PerformanceFailure Rate PredictionThe failure rate of semiconductor devices is determined by the junction temperature of thedevice. The relationship between ambient temperature and actual junction temperature is given by the following:T J (°C) = T A (°C) + θJA P AVG where T A = ambient temperature in °CθJA = thermal resistance of junction-to-ambient in °C/wattHDSP-Exxx, HDSP-Fxxx,HDSP-Gxxx, HDSP- Hxxx,HDSP-Kxxx, HDSP-3xxx,HDSP-4xxx, HDSP-5xxx,HDSP-6xxx, HDSP-7xxxtion but will probably be better than the performance outlined in Table 1.P AVG = average power dissipated in wattsThe estimated MTBF and failure rate at temperatures lower than the actual stress temperature can be determined by using anArrhenius model for temperature acceleration. Results of such calculations are shown in the table below using an activation energy of 0.43 eV (reference MIL-HDBK-217).Table 2.Point Typical Performance in Time[2]Performance[1] in Time(90%Confidence) Ambient Temp.Junction Temp.Failure Rate Failure Rate I F(°C)(°C)MTBF[1](%/1K Hours)MTBF[2](%/1K Hours) 3085115457,0000.219%118,0000.850% 751056430000.156%165,0000.605%6595920,0000.109%237,0000.423%55851,344,0000.074%346,0000.289%45752,006,0000.050%516,0000.194%35653,066,0000.033%788,0000.127%25554,809,0000.021%1,236,0000.081% Notes:1.The point typical MTBF (which represents 60% confidence level) is the total device hours divided by the number offailures. In the case of zero failures, one failure is assumed for this calculation.2.The 90% confidence MTBF represents the minimum level of reliability performance which is expected from 90% of allsamples. This confidence interval is based on the statistics of the distribution of failures. The assumed distribution of failures is exponential. This particular distribution is commonly used in describing useful life failures. Refer toMIL-STD-690B for details on this methodology.3. A failure is any LED which does not emit light.Example of Failure Rate Calculation:Assume a device operating 8 hours/day, 5 days a week. The utilization factor, given 168 hours/week is:(8 hours/day) x (5 days/week) ÷ (168 hours/week) = 0.25The point failure rate per year (8760 hours) at 25°C ambient temperature is:(0.021%/1K hours) x 0.25 x (8760 hours/year) = 0.045% per yearSimilarly, 90% confidence level failure rate per year at 25°C:(0.081%/1K hours) x 0.25 x (8760 hours/year) = 0.177% per yearTable 3. Environmental TestsUnits Units Test Name Reference Test Conditions Tested Failed Solder Heat Resistance MIL-STD-883 Method 2003260°C, 3 seconds100 Temperature Cycle MIL-STD-883 Method 1010-55°C to 100°C, 15 min. dwell,260015 min. transfer, 20 cyclesHumidity Storage JIS C 7021 Method B-1185°C, 85% RH, 168 Hours2520Solderability MIL-STD-883 Method 200316 Hours steam aging followed by100solder dip at 260°C for 5 secondsSalt Atmosphere MIL-STD-883 Method 100935°C, 24 Hours100Table 4. Mechanical TestsUnits Units Test Name Reference Test Conditions Tested Failed Terminal Strength MIL-STD-883 Method 2004 Cond. A 1 lb. for 30 sec.110 Lead Strength MIL-STD-883 Method 2004 Cond. B 3 X 90 degree bend, 8 oz.110 Vibration Variable MIL-STD-883 Method 2007 2 Hours for each X, Y, Z axis at220 Frequency20 Gs, 10 to 2k Hz; 20 min. sweep/go/ledFor technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 • Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 • Europe: Call your local HP sales office. • Data subject to change. • Copyright © 1999 Hewlett-Packard Co.5968-7071E (8/99)。
HDSP-G10X资料
Features• Low Power Consumption • Industry Standard Size• Industry Standard Pinout • Choice of Character Size 7.6 mm (0.30 in), 10 mm (0.40 in), 10.9 mm (0.43 in), 14.2 mm (0.56 in), 20 mm (0.80 in)• Choice of ColorsAlGaAs Red, High Efficiency Red (HER), Yellow, Green• Excellent Appearance Evenly Lighted Segments±50° Viewing Angle• Design FlexibilityCommon Anode or Common CathodeSingle and Dual DigitLeft and Right Hand Decimal Points±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display• Excellent for Long Digit String Multiplexing DescriptionThese low current seven segment displays are designed for applica-tions requiring low power consumption. They are tested and selected for their excellent low current characteristics to ensure that the segments are matched at low currents. Drive currents as low as 1 mA per segment are available.Pin for pin equivalent displays are also available in a standard current or high light ambient design. The standard current displays are available in all colors and are ideal for most applica-tions. The high light ambient displays are ideal for sunlight ambients or long string lengths. For additional information see the 7.6 mm Micro Bright Seven Segment Displays, 10 mm Seven Segment Displays, 7.6 mm/10.9 mm Seven Segment Displays, 14.2 mm Seven Segment Displays, 20 mm Seven Segment Displays, or High Light Ambient Seven Segment Displays data sheets.Low Current Seven SegmentDisplays Technical Data HDSP-335x Series HDSP-555x Series HDSP-751x Series HDSP-A10x Series HDSP-A80x Series HDSP-A90x Series HDSP-E10x Series HDSP-F10x Series HDSP-G10x Series HDSP-H10x Series HDSP-K12x, K70x SeriesHDSP-N10x SeriesDevicesAlGaAs HER Yellow Green Package HDSP-HDSP-HDSP-HDSP-Description Drawing A1017511A801A9017.6 mm Common Anode Right Hand Decimal AA1037513A803A9037.6 mm Common Cathode Right Hand Decimal BA1077517A807A9077.6 mm Common Anode ±1. Overflow CA1087518A808A9087.6 mm Common Cathode ±1. Overflow DF10110 mm Common Anode Right Hand Decimal EF10310 mm Common Cathode Right Hand Decimal FF10710 mm Common Anode ±1. Overflow GF10810 mm Common Cathode ±1. Overflow HG10110 mm Two Digit Common Anode Right Hand Decimal XG10310 mm Two Digit Common Cathode Right Hand Decimal YE100335010.9 mm Common Anode Left Hand Decimal IE101335110.9 mm Common Anode Right Hand Decimal JE103335310.9 mm Common Cathode Right Hand Decimal KE106335610.9 mm Universal ±1. Overflow[1]LH101555114.2 mm Common Anode Right Hand Decimal MH103555314.2 mm Common Cathode Right Hand Decimal NH107555714.2 mm Common Anode ±1. Overflow OH108555814.2 mm Common Cathode ±1. Overflow PK121K70114.2 mm Two Digit Common Anode Right Hand Decimal RK123K70314.2 mm Two Digit Common Cathode Right Hand Decimal SN10020 mm Common Anode Left Hand Decimal QN10120 mm Common Anode Right Hand Decimal TN10320 mm Common Cathode Right Hand Decimal UN10520 mm Common Cathode Left Hand Decimal VN10620 mm Universal ±1. Overflow[1]W Note:1. Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagrams L or W.Part Numbering System5082-x xx x-x x x xxHDSP-x xx x-x x x xxMechanical Options[1]00: No mechanical optionColor Bin Options[1,2]0: No color bin limitationMaximum Intensity Bin[1,2]0: No maximum intensity bin limitationMinimum Intensity Bin[1,2]0: No minimum intensity bin limitationDevice Configuration/Color[1]G: GreenDevice Specific Configuration[1]Refer to respective datasheetPackage[1]Refer to Respective datasheetNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative fordetails.2. Bin options refer to shippable bins for a part-number. Color and Intensity Bins are typically restricted to 1 bin per tube (excep-tions may apply). Please refer to respective datasheet for specific bin limit information.Package DimensionsPackage Dimensions (cont.)Package Dimensions (cont.)*The Side View of package indicates Country of Origin.Package Dimensions (cont.)Package Dimensions (cont.)元器件交易网9 Package Dimensions (cont.)10 Internal Circuit DiagramInternal Circuit Diagram (cont.)Absolute Maximum RatingsAlGaAs Red HERHDSP-A10X/E10X/HDSP-751X/Yellow GreenH10X/K12X/N10X/335X/555X/HDSP-A80X HDSP-A90X Description F10X, G10X Series K70X Series Series Series Units Average Power per Segment or DP375264mW Peak Forward Current per 45mA Segment or DPDC Forward Current per15[1]15[2]mA Segment or DPOperating Temperature Range-20 to +100-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment 3.0V or DPLead Solder Temperature for 3Seconds (1.60 mm [0.063 in.] below 260°C seating plane)Notes:1. Derate above 91°C at 0.53 mA/°C.2. Derate HER/Yellow above 80°C at 0.38 mA/°C and Green above 71°C at 0.31 mA/°C.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions315600I F = 1 mA A10x3600I F = 5 mA330650I F = 1 mAF10x, G10x3900I F = 5 mA390650I F = 1 mA E10x Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)3900I F = 5 mA400700I F = 1 mAH10x, K12x4200I F = 5 mA270590I F = 1 mA N10x3500I F = 5 mA1.6I F = 1 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA1.82.2I F = 20 mA Pk All Devices Peak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2 mV mV/°CV F/Segment or DPA10x255F10x, G10x320E10x340Thermal Resistance LED RθJ-PIN°C/W/SegH10x, K12x Junction-to-Pin400N10x430High Efficiency RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions160270I F = 2 mA 751x1050I F = 5 mA200300I F = 2 mA Luminous Intensity/Segment[1,2]I V mcd(Digit Average)1200I F = 5 mA335x, 555x,K70x270370I F = 2 mA1480I F = 5 mA1.6I F = 2 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA2.1 2.5I F = 20 mA Pk All Devices Peak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DP751x200335x Thermal Resistance LED RθJ-PIN280°C/WJunction-to-Pin555x, K70x345YellowDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250420I F = 4 mA(Digit Average)I V mcd1300I F = 10 mA1.7I F = 4 mAForward Voltage/Segment or DP V F 1.8V I F = 5 mA A80x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK583nmDominant Wavelength[3,5]λd581.5585592.5nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinGreenDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250475I F = 4 mA(Digit Average)I V mcd1500I F = 10 mA1.9I F = 4 mAForward Voltage/Segment or DP V F 2.0V I F = 10 mA A90x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK566nmDominant Wavelength[3,5]λd571577nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is the single wavelength which defines the color of thedevice.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. The yellow (HDSP-A800) and Green (HDSP-A900) displays are categorized for dominant wavelength. The category is designated by anumber adjacent to the luminous intensity category letter.Intensity Bin Limits (mcd)AlGaAs RedHDSP-A10xIV Bin Category Min.Max.E0.3150.520F0.4280.759G0.621 1.16H0.945 1.71I 1.40 2.56J 2.10 3.84K 3.14 5.75L 4.708.55HDSP-E10x/F10x/G10xIV Bin Category Min.Max.D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-H10x/K12xIV Bin Category Min.Max.C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50HDSP-N10xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued HERHDSP-751xIV Bin Category Min.Max.B0.1600.240C0.2000.300D0.2500.385E0.3150.520F0.4280.759G0.621 1.16HDSP-751xIV Bin Category Min.Max.B0.2400.366C0.3000.477D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-555x/K70xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued YellowHDSP-A80xIV Bin Category Min.Max.D0.2500.385E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60GreenHDSP-A90xIV Bin Category Min.Max.E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60Electrical/OpticalFor more information on electrical/optical characteristics, please see Application Note 1005.Contrast Enhancement For information on contrast enhancement, please see Application Note 1015.Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs, please refer to Application Note 1027.Note:All categories are established for classification of products. Productsmay not be available in all categories. Please contact your localAgilent representatives for further clarification/information.Color Categories/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788 6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6271 2451India, Australia, New Zealand: (+65) 6271 2394Japan: (+81 3) 3335-8152(Domestic/International), or0120-61-1280(Domestic Only)Korea: (+65) 6271 2194Malaysia, Singapore: (+65) 6271 2054Taiwan: (+65) 6271 2654Data subject to change.Copyright © 2003 Agilent Technologies, Inc.Obsoletes 5988-8412ENSeptember 24, 20035989-0080EN。
HDSP-0981-FF300中文资料
DevicesPart Number HDSP-ColorDescriptionFront View0781High-Efficiency Red Numeric, Right Hand DP A 0782Low Power Numeric, Left Hand DP B 0783Over Range ±1C 0784HexadecimalD 0791High-Efficiency Red Numeric, Right Hand DP A 0792High Brightness Numeric, Left Hand DP B 0793Over Range ±1C 0794HexadecimalD 0881YellowNumeric, Right Hand DP A 0882Numeric, Left Hand DP B 0883Over Range ±1C 0884HexadecimalD 0981High-Performance GreenNumeric, Right Hand DP A 0982Numeric, Left Hand DP B 0983Over Range ±1C 0984HexadecimalDHDSP-078x HDSP-079x HDSP-088x HDSP-098xFeatures• Three Character Options Numeric, Hexadecimal, Over Range• Three ColorsHigh Efficiency Red, Yellow,High Performance Green• 4x 7 Dot Matrix Character • High Efficiency Red, Yellow and High Performance Green • Two High Efficiency Red OptionsLow Power, High Brightness • Performance Guaranteed Over Temperature• High Temperature Stabilized • Memory Latch/Decoder/DriverTTL Compatible• Categorized for Luminous IntensityDescriptionThese standard solid state displays have a 7.4 mm (0.29 inch) dot matrix character and an on-board IC with data memory latch/decoder and LED drivers in a glass/ceramic package.The hermetic HDSP-078x,-079x/-088x displays utilize a solder glass frit seal. The HDSP-098X displays utilize an epoxy glass-to-ceramic seal.The numeric devices decode posi-tive BCD logic into characters “0-9,” a “–” sign, decimal point,and a test pattern. Thehexadecimal devices decodeGlass/Ceramic Numeric and Hexadecimal Displays for Industrial Applications Technical Datapositive BCD logic into 16characters, “0-9, A-F.” An input is provided on the hexadecimal devices to blank the display (all LEDS off) without losing the contents of the memory.The over range device displays “±1” and right hand decimal point and is typically driven via external switching transistors.COUNTRY CODEPackage DimensionsAbsolute Maximum RatingsNotes:1. The nominal thermal resistance of a display mounted in a socket that is soldered onto a printed circuit board isRθJA=50°C/W/device. The device package thermal resistance is RθJ-PIN = 15°C/W/device. The thermal resistance device pin-to-ambient through the PC board should not exceed 35°C/W/device for operation up to T A = +100°C.2. Voltage values are with respect to device ground, pin 6.3. These displays are categorized for luminous intensity with the intensity category designated by a letter code located on the back ofthe display package. Case temperature of the device immediately prior to the light measurement is equal to 25°C.Electrical/Optical Characteristics T A = –55°C to +100°CNotes:4. The luminous intensity at a specific operating ambienttemperature, I v(T A), may be approximated from the following exponential equation: I v(T A)=I v(25°C) e[k(T-25°C)].Device KHDSP-078 Series–0.0131/°CHDSP-079x SeriesHDSP-088x Series–0.0112/°CHDSP-098x Series–0.0104/°C 5. The dominant wavelength, λd, is derived from the CIE chroma-ticity diagram and represents the single wavelength whichdefines the color of the device.6. The HDSP-088X and HDSP-098X series devices are categor-ized as to dominant wavelength with the category designated by a number on the back of the display package.7. All typical values at V CC = 5.0 V and T A = 25°C.Operational ConsiderationsElectricalThese devices use a modified4x7 dot matrix of light emitting diodes to display decimal/ hexadecimal numeric informa-tion. The high efficiency red and yellow displays use GaAsP/GaP LEDs and the high performance green displays use GaP/GaP LEDs. The LEDs are driven by constant current drivers, BCD information is accepted by the display memory when the enable line is at logic low and the data islatched when the enable is atlogic high. Using the enable pulsewidth and data setup and holdtimes listed in the RecommendedOperating Conditions allows datato be clocked into an array ofdisplays at a 6.7MHz rate.The decimal point input is activelow true and this data is latchedinto the display memory in thesame fashion as the BCD data.The decimal point LED is drivenby the on-board IC.The blanking control input on thehexadecimal displays blanks(turns off) the displayedinformation without disturbingthe contents of display memory.The display is blanked at aminimum threshold level of 2.0volts. When blanked, the displaystandby power is nominally 250mW at T A = 25°C.The ESD susceptibility of the ICdevices is Class A of MIL-STD-883 or Class 2 of DOD-STD-1686and DOD-HDBK-263.AMechanicalThese displays are hermetically sealed for use in environments that require a high reliability device. These displays are designed and tested to meet a helium leak rate of5x10-8cc/sec.These displays may be mounted by soldering directly to a printed circuit board or insertion into a socket. The lead-to-lead pin spacing is 2.54 mm (0.100 inch) and the lead row spacing is 15.24 mm (0.600 inch). These displays may be end stacked with 2.54 mm (0.100 inch) spacing between outside pins of adjacent displays. Sockets such as Augat 324-AG2D (3 digits) or Augat 508-AG8D (one digit, right anglemounting) may be used.The primary thermal path forpower dissipation is through thedevice leads. Therefore, to insurereliable operation up to anambient temperature of +100°C,it is important to maintain abase-to-ambient thermalresistance of less than35°C watt/device as measured ontop of display pin 3.For further information onsoldering and post soldercleaning, see Application Note1027, Soldering LEDComponents.PreconditioningThese displays are 100% pre-conditioned by 24 hour storage at125°C, at 100°C for the HDSP-098x Series.Contrast EnhancementThese display devices aredesigned to provide an optimumON/OFF contrast when placedbehind an appropriate contrastenhancement filter. For furtherinformation on contrastenhancement, see ApplicationNote 1015, ContrastEnhancement for LEDDisplays.Over Range DisplayThe over range devices display“±1” and decimal point. Thecharacter height and packageconfiguration are the same as thenumeric and hexadecimaldevices. Character selection isobtained via external switchingtransistors and current limitingresistors.Absolute Maximum RatingsDescription Symbol Min Max Unit Storage Temperature, Ambient T S–65+125°C Operating Temperature, Ambient T A–55+100°C Forward Current, Each LED I F10mA Reverse Voltage, Each LED V R5VPackage DimensionsLuminous Intensity per LED(Digit Average) at T= 25°C Figure 3. Typical Driving Circuit.Notes:0: Line switching transistor in Figure 7 cutoff.1: Line switching transistor in Figure 7 saturated.X: ‘don’t care.’Electrical Characteristics T A = –55°C to +100°CColor Bin Limits (Dominant Wavelength)Note:Bin categories are established for classification of products. Productsmay not be available in all bin categories. Please consult your localAgilent Technologies representative./semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only)Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand,Philippines, Indonesia: (+65) 6755 2044Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc.Obsoletes 5964-6390EJuly 14, 20045988-2261EN。
HDSP-311E资料
DescriptionThis 10.16 mm (0.4 inch) LED single digit seven segment display uses industry standard size package and pinout. The device is available in either common anode or common cathode. The choice of colors includes High Efficiency Red (HER), Green, AlGaAs Red, and Yellow. The gray face displays are suitable for indoor use.Devices HERGreenAlGaAs Red Yellow DescriptionPackage Drawing HDSP-311E HDSP-311G HDSP-311A HDSP-311Y Common Anode Right A Hand DecimalHDSP-313EHDSP-313GHDSP-313AHDSP-313YCommon Cathode Right BHand DecimalFeatures•Industry standard size•Industry standard pinout10.16 mm (0.4 inch) character height DIP lead on 2.54 mm•Choice of colorsHigh Efficiency Red (HER), Green, AlGaAs Red, and Yellow •Excellent appearanceEvenly lighted segments gray package gives optimum contrast± 50 ft. viewing angle •Design flexibilityCommon anode right hand decimal point or common cathode right hand decimal point •Categorized for luminous intensity Green and yellow categorized for colorApplications•Suitable for indoor use•Not recommended for industrial application, i.e.,operating temperature requirements exceeding +85˚C or below –25˚C [1]•Extreme temperature cycling not recommendedNote:1.For additional details, please contact your local Avago sales office or an authorized distributor.HDSP-311x/313x10.16 mm (0.4 inch) Single Digit General Purpose Seven Segment DisplayData SheetPart Numbering SystemNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Avago representative for details.2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information.5082 -X X X X-X X X X X HDSP-X X X X-X X X X XMechanical Options [1]00: No Mechanical Option Color Bin Options [1,2]0: No Color Bin LimitationMaximum Intensity Bin [1,2]0: No Maximum Intensity Bin Limitation Minimum Intensity Bin [1,2]0: No Minimum Intensity Bin Limitation Device Configuration/Color [1]A: AlGaAs RedE: High Efficiency Red G: Green Y: YellowDevice Specific Configuration [1]Refer to Respective Datasheet Package [1]Refer to Respective DatasheetPackage Drawing AFRONT VIEW TOP END VIEWDIMENSIONS IN MILLIMETERS (INCHES)Package Drawing BFRONT VIEW RIGHT SIDECOUNTRY113108721193.14 COMPIN No.12378910111314CONNECTION CATHODE A CATHODE F COMMON ANODE CATHODE E CATHODE D CATHODE DP CATHODE C CATHODE G CATHODE B COMMON ANODEPINS 4, 5, 6, 12: NO PINHDSP-311E/311G/311Y/311ACOMMON ANODE RIGHT HAND DECIMALInternal Circuit Diagram1097542163.8 COMPIN NO.12345678910CONNECTION ANODE G ANODE F COMMON CATHODEANODE E ANODE D ANODE DP ANODE C COMMON CATHODEANODE B ANODE AHDSP-313E/313G/313Y/313ACOMMON CATHODE RIGHT HAND DECIMALGreen Devices HDSP-ParameterSymbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 1.25 3.20mcd I F = 10 mA Forward Voltage V F 2.06V I F = 10 mA 1.802.25 2.60V I F = 20 mAPeak Wavelength λPEAK 568nm Dominant Wavelength λd 573nm Reverse VoltageVR5VI R = 100 µA311G 313GAbsolute Maximum Ratings at T A = 25˚C HERGreenAlGaAs Red Yellow DescriptionHDSP-31xE HDSP-31xG HDSP-31xA HDSP-31xY Units Power Dissipation Segment 65653052mW Forward Current Segment25[1]25[2]15[3]20[4]mA Peak Forward Current per Segment 1001008080mA (1/10 Duty Factor at 10 KHz)Operating Temperature Range –35 to +85–35 to +85–35 to +85–35 to +85˚C Storage Temperature Range–35 to +85–35 to +85–35 to +85–35 to +85˚C Reverse Voltage per Segment or DP5555V Wave Soldering Temperature for 3 seconds 250250250250˚C(at 2 mm Distance from the Body)Notes:1.Derate above 25˚C at 0.33 mA/˚C.2.Derate above 25˚C at 0.33 mA/˚C.3.Derate above 25˚C at 0.2 mA/˚C.4.Derate above 25˚C at 0.27 mA/˚C.Electrical/Optical Characteristics at T A = 25˚C High Efficiency Red (HER)Devices HDSP-ParameterSymbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 1.49mcd I F = 5 mA 1.253.20mcd I F = 10 mA Forward Voltage V F 2.05 2.40V I F = 20 mAPeak Wavelength λPEAK 635nm Dominant Wavelength λd 620nm Reverse VoltageVR5VI R = 100 µA311E 313EYellow Devices HDSP-ParameterSymbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 0.86mcd I F = 5 mA 0.801.50mcd I F = 10 mA Forward Voltage V F2.15 2.60V I F = 20 mAPeak Wavelength λPEAK 595nm Dominant Wavelength λd 590nm Reverse VoltageVR5VI R = 100 µA311Y 313YAlGaAs Red Devices HDSP-ParameterSymbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 4.54mcd I F = 5 mA 3.207.50mcd I F = 10 mA Forward Voltage V F 1.85 2.00V I F = 20 mAPeak Wavelength λPEAK 660nm Dominant Wavelength λd 643nm Reverse VoltageVR5VI R = 100 µA311A313AColor Bin Limits (nm at 10 mA)Dominant Wavelength (nm)Color Bin Min.Max.Note:1.Tolerance for each bin limit is 1 nm.Intensity Bin Limits (mcd at 10 mA)Bin HER/Green YellowAlGaAs Red Name Min.[1]Max.[1]Min.[1]Max.[1]Min.[1]Max.[1]G NA NA 0.801 1.250NA NA H 1.251 2.000 1.251 2.000NA NA I 2.001 3.200 2.001 3.200NA NA J 3.201 5.050NA NA 3.201 5.050K NA NA NA NA 5.0518.000LNA NANANA8.00112.650Note:1.Tolerance for each bin limit is ± 10%.Figure 1. Maximum allowable average or DC current vs. ambient temperature.Figure 2. Forward current vs. forward voltage.Figure 3. Relative luminous intensity vs. DC forward current.High Efficiency Red (HER)Figure 4. Relative efficiency (luminousintensity per unit current) vs. peak current.30T A – AMBIENT TEMPERATURE – °C M A X I M U M D C C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VI F – F O R W A R D C U R R E N T P E R S E G M E N T – m A2.52.01.51.00.50510********I F – FORWARD CURRENT FOR SEGMENT – mAR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 10 m A )35R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A )1.4005101520253035404550I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA0.20.40.60.81.01.2Figure 7. Relative luminous intensity vs. DC forward current.Figure 8. Relative efficiency (luminous intensity per unit current) vs. peak current.Figure 5. Maximum allowable average or DC current vs. ambient temperature.Figure 6. Forward current vs. forward voltage.Green302520151050020*********T A – AMBIENT TEMPERATURE – °CM A X I M U M D C C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VI F – F O R W A R D C U R R E N T P E R S E G M E N T – m A3.02.52.01.51.00.500510********I F – FORWARD CURRENT FOR SEGMENT – mAR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 10 m A )35R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A )05101520253035404550I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA0.20.40.60.81.01.2Figure 9. Maximum allowable average or DC current vs. ambient temperature.Figure 10. Forward current vs. forward voltage.Figure 11. Relative luminous intensity vs. DC forward current.Figure 12. Relative efficiency (luminous intensity per unit current) vs. peak current.AlGaAs RedT A – AMBIENT TEMPERATURE – °C M A X I M U M D C C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VI F – F O R W A R D C U R R E N T P E R S E G M E N T – m AR E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A )05101520253035404550I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA0.20.40.60.81.01.23.02.52.01.51.00.500510********I F – FORWARD CURRENT FOR SEGMENT – mAR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 10 m A )3511Figure 13. Maximum allowable average orDC current vs. ambient temperature.Figure 14. Forward current vs. forward voltage.Figure 15. Relative luminous intensity vs. DCforward current.Figure 16. Relative efficiency (luminous intensity per unit current) vs. peak current.Yellow2520151050T A – AMBIENT TEMPERATURE – °CM AX IMUMD CCUR RE NTP ERSE G M E N T–mAV F – FORWARD VOLTAGE – V I F – F O R W A R D C U R R E N T P E R S E G M E N T – m A 3.52.52.01.51.00.50051015202530I F – FORWARD CURRENT FOR SEGMENT – mARE L A T I V E L U M I N O U SIN T E N S I T Y (N O RM ALIZ E D TO1A T1m A)353.0R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A ) 1.4005101520253035404550I PEAK – PEAK FORWARD CURRENT PER SEGMENT – mA 0.20.40.60.81.01.2For product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-0000EN5988-2969EN May 18, 2006。
HDSP-G101-DF000中文资料
Features• Low Power Consumption • Industry Standard Size• Industry Standard Pinout • Choice of Character Size7.6 mm (0.30 in), 10 mm (0.40 in), 10.9 mm (0.43 in), 14.2 mm (0.56 in), 20 mm (0.80 in)• Choice of ColorsAlGaAs Red, High Efficiency Red (HER), Yellow, Green• Excellent Appearance Evenly Lighted Segments±50° Viewing Angle• Design FlexibilityCommon Anode or Common CathodeSingle and Dual DigitLeft and Right Hand Decimal Points±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display• Excellent for Long Digit String Multiplexing DescriptionThese low current seven segment displays are designed for applica-tions requiring low power consumption. They are tested and selected for their excellent low current characteristics to ensure that the segments are matched at low currents. Drive currents as low as 1 mA per segment are available.Pin for pin equivalent displays are also available in a standard current or high light ambient design. The standard current displays are available in all colors and are ideal for most applica-tions. The high light ambient displays are ideal for sunlight ambients or long string lengths. For additional information see the 7.6 mm Micro Bright Seven Segment Displays, 10 mm Seven Segment Displays, 7.6 mm/10.9 mm Seven Segment Displays, 14.2 mm Seven Segment Displays, 20 mm Seven Segment Displays, or High Light Ambient Seven Segment Displays data sheets.Low Current Seven SegmentDisplays Technical Data HDSP-335x SeriesHDSP-555x SeriesHDSP-751x SeriesHDSP-A10x Series HDSP-A80x Series HDSP-A90x Series HDSP-E10x Series HDSP-F10x Series HDSP-G10x Series HDSP-H10x Series HDSP-K12x, K70x Series HDSP-N10x SeriesHDSP-N40x SeriesDevicesAlGaAs HER Yellow Green Package HDSP-HDSP-HDSP-HDSP-Description Drawing A1017511A801A9017.6 mm Common Anode Right Hand Decimal A A1037513A803A9037.6 mm Common Cathode Right Hand Decimal B A1077517A807A9077.6 mm Common Anode ±1. Overflow C A1087518A808A9087.6 mm Common Cathode ±1. Overflow D F10110 mm Common Anode Right Hand Decimal E F10310 mm Common Cathode Right Hand Decimal F F10710 mm Common Anode ±1. Overflow G F10810 mm Common Cathode ±1. Overflow H G10110 mm Two Digit Common Anode Right Hand Decimal X G10310 mm Two Digit Common Cathode Right Hand Decimal Y E100335010.9 mm Common Anode Left Hand Decimal I E101335110.9 mm Common Anode Right Hand Decimal J E103335310.9 mm Common Cathode Right Hand Decimal K E106335610.9 mm Universal ±1. Overflow[1]L H101555114.2 mm Common Anode Right Hand Decimal M H103555314.2 mm Common Cathode Right Hand Decimal N H107555714.2 mm Common Anode ±1. Overflow O H108555814.2 mm Common Cathode ±1. Overflow P K121K70114.2 mm Two Digit Common Anode Right Hand Decimal R K123K70314.2 mm Two Digit Common Cathode Right Hand Decimal S N10020 mm Common Anode Left Hand Decimal Q N101N40120 mm Common Anode Right Hand Decimal T N103N40320 mm Common Cathode Right Hand Decimal U N10520 mm Common Cathode Left Hand Decimal V N106N40620 mm Universal ±1. Overflow[1]W Note:1. Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagrams L or W.Part Numbering System5082-x xx x-x x x xxHDSP-x xx x-x x x xxMechanical Options[1]00: No mechanical optionColor Bin Options[1,2]0: No color bin limitationMaximum Intensity Bin[1,2]0: No maximum intensity bin limitationMinimum Intensity Bin[1,2]0: No minimum intensity bin limitationDevice Configuration/Color[1]G: GreenDevice Specific Configuration[1]Refer to respective datasheetPackage[1]Refer to Respective datasheetNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative fordetails.2. Bin options refer to shippable bins for a part-number. Color and Intensity Bins are typically restricted to 1 bin per tube (excep-tions may apply). Please refer to respective datasheet for specific bin limit information.Package DimensionsPackage Dimensions (cont.)Package Dimensions (cont.)*The Side View of package indicates Country of Origin.Package Dimensions (cont.)Package Dimensions (cont.)Package Dimensions (cont.)Internal Circuit DiagramInternal Circuit Diagram (cont.)Absolute Maximum RatingsAlGaAs Red - HDSP-HERA10X/E10X/H10X HDSP-751X/Yellow GreenK12X/N10X/N40X335X/555X/HDSP-A80X HDSP-A90X Description F10X, G10X Series K70X Series Series Series Units Average Power per Segment or DP375264mW Peak Forward Current per 45mA Segment or DPDC Forward Current per15[1]15[2]mA Segment or DPOperating Temperature Range-20 to +100-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment 3.0V or DPWave Soldering Temperature for 3Seconds (1.60 mm [0.063 in.] below 250°C seating body)Notes:1. Derate above 91°C at 0.53 mA/°C.2. Derate HER/Yellow above 80°C at 0.38 mA/°C and Green above 71°C at 0.31 mA/°C.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions315600I F = 1 mA A10x3600I F = 5 mA330650I F = 1 mAF10x, G10x3900I F = 5 mA390650I F = 1 mA E10x Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)3900I F = 5 mA400700I F = 1 mAH10x, K12x4200I F = 5 mA270590I F = 1 mAN10x, N40x3500I F = 5 mA1.6I F = 1 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA1.82.2I F = 20 mA PkAll Devices Peak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2 mV mV/°CV F/Segment or DPA10x255F10x, G10x320E10x340Thermal Resistance LED RθJ-PIN°C/W/SegH10x, K12x Junction-to-Pin400N10x, N40x430High Efficiency RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions160270I F = 2 mA 751x1050I F = 5 mA200300I F = 2 mA Luminous Intensity/Segment[1,2]I V mcd(Digit Average)1200I F = 5 mA335x, 555x,K70x270370I F = 2 mA1480I F = 5 mA1.6I F = 2 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA2.1 2.5I F = 20 mA Pk All Devices Peak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DP751x200335x Thermal Resistance LED RθJ-PIN280°C/WJunction-to-Pin555x, K70x345YellowDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250420I F = 4 mA(Digit Average)I V mcd1300I F = 10 mA1.7I F = 4 mAForward Voltage/Segment or DP V F 1.8V I F = 5 mA A80x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK583nmDominant Wavelength[3,5]λd581.5585592.5nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinGreenDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250475I F = 4 mA(Digit Average)I V mcd1500I F = 10 mA1.9I F = 4 mAForward Voltage/Segment or DP V F 2.0V I F = 10 mA A90x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK566nmDominant Wavelength[3,5]λd571577nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is the single wavelength which defines the color of thedevice.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. The yellow (HDSP-A800) and Green (HDSP-A900) displays are categorized for dominant wavelength. The category is designated by anumber adjacent to the luminous intensity category letter.AlGaAs RedIntensity Bin Limits (mcd)AlGaAs RedHDSP-A10xIV Bin Category Min.Max.E0.3150.520F0.4280.759G0.621 1.16H0.945 1.71I 1.40 2.56J 2.10 3.84K 3.14 5.75L 4.708.55HDSP-E10x/F10x/G10xIV Bin Category Min.Max.D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-H10x/K12xIV Bin Category Min.Max.C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50HDSP-N10xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued HERHDSP-751xIV Bin Category Min.Max.B0.1600.240C0.2000.300D0.2500.385E0.3150.520F0.4280.759G0.621 1.16HDSP-751xIV Bin Category Min.Max.B0.2400.366C0.3000.477D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-555x/K70xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued YellowHDSP-A80xIV Bin Category Min.Max.D0.2500.385E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60GreenHDSP-A90xIV Bin Category Min.Max.E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60Electrical/OpticalFor more information on electrical/optical characteristics, please see Application Note 1005.Contrast Enhancement For information on contrast enhancement, please see Application Note 1015.Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs, please refer to Application Note 1027.Note:All categories are established for classification of products. Productsmay not be available in all categories. Please contact your localAgilent representatives for further clarification/information.Color Categories/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788 6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6271 2451India, Australia, New Zealand: (+65) 6271 2394Japan: (+81 3) 3335-8152(Domestic/International), or0120-61-1280(Domestic Only)Korea: (+65) 6271 2194Malaysia, Singapore: (+65) 6271 2054Taiwan: (+65) 6271 2654Data subject to change.Copyright © 2005 Agilent Technologies, Inc.Obsoletes 5988-8412ENJanuary 19, 20055989-0080EN。
【3351dp型差压变送器】
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LDWB闅旂 娓╁害鍙橀€佸櫒浜у搧涓 殑鐑 數闃汇€佺儹鐢靛伓淇″彿鍙橀€佸櫒鍙 笌鐑 數闃汇€佺儹鐢靛伓娓╁害浼犳劅鍣ㄩ厤鍚堬紝瀹屾垚娓╁害鐨勫彉閫佸拰闅旂 浼犺緭婊¤冻鐢ㄦ埛鏈 湴鐩戣 涓庤繙绋嬫暟鎹 噰闆嗙殑闇€姹傘€?LDWB闅旂 娓╁害鍙橀€佸櫒鍙 互涓庡悇绉嶆俯搴﹀彉閫佸櫒銆佹祦閲忓彉閫佸櫒銆佸帇鍔涘彉閫佸櫒銆佹恫浣嶅彉閫佸櫒绛?4VDC渚涚數鐨勪袱绾垮埗鍙橀€佸櫒閰嶅 锛屽畬鎴愬悜鍙橀€佸櫒棣堢數銆佸彇鍥炲弬鏁颁俊鍙枫€侀殧绂昏浆鎹㈣緭鍑虹殑宸ヤ綔銆?銆€銆€鏈 郴鍒椾骇鍝佹寜鍥介檯鐢电 鍏煎 鎬ф爣鍑嗚 璁?閲囩敤鍥介檯涓婂悓琛屼笟鍏 鐨勮皟鍒跺紡鍙樺帇鍣ㄩ殧绂绘妧鏈?瀹屾垚杈撳叆銆佽緭鍑恒€佺數婧愮殑鐩镐簰闅旂 ,鍦ㄦā鍧楀唴閮ㄧ殑鐢佃矾璁捐 涓?浠ヤ綆鍔熻€椼€佷綆娓╂紓鎶€鏈 负鍩虹 ,閲囩敤楂樺搧璐ㄥ厓鍣ㄤ欢,浣夸骇鍝佽兘澶熼暱鏈熺ǔ瀹氬伐浣?鍚屾椂浜у搧璁炬湁杈撳叆淇濇姢銆佸共鎵版姂鍒躲€侀殧绂荤瓑鍔熻兘.銆€銆€LDWB闅旂 娓╁害鍙橀€佸櫒浜у搧澶栧舰鍒嗕负閲囩敤DIN35瀵艰建寮忓崱瑁呮柟寮忓拰绗﹀悎DDZ-III鍨嬫灦瑁呭紡涓ょ 缁撴瀯,铻烘爴寮忕 瀛愬畨瑁呬娇鐢ㄦ柟渚裤€?/p>LDWB闅旂 娓╁害鍙橀€佸櫒浣跨敤鏂规硶LDWB闅旂 娓╁害鍙橀€佸櫒涓昏 涓嶥CS銆丳LC绛夊伐涓氭祴鎺х郴缁熼厤鍚堜娇鐢ㄣ€傜敤鏉ュ畬鍠勫拰琛ュ厖绯荤粺妯℃嫙I/O鎻掍欢鍔熻兘锛屽 鍔犵郴缁熼€傜敤鎬у拰鐜板満鐜 涓嬬殑鍙 潬鎬с€?nbsp;LDWB闅旂 娓╁害鍙橀€佸櫒浜у搧涓 殑鐑 數闃汇€佺儹鐢靛伓淇″彿鍙橀€佸櫒鍙 笌鐑 數闃汇€佺儹鐢靛伓娓╁害浼犳劅鍣ㄩ厤鍚堬紝瀹屾垚娓╁害鐨勫彉閫佸拰闅旂 浼犺緭婊¤冻鐢ㄦ埛鏈 湴鐩戣 涓庤繙绋嬫暟鎹 噰闆嗙殑闇€姹傘€?nbsp;LDWB闅旂 娓╁害鍙橀€佸櫒鍙 互涓庡悇绉嶆俯搴﹀彉閫佸櫒銆佹祦閲忓彉閫佸櫒銆佸帇鍔涘彉閫佸櫒銆佹恫浣嶅彉閫佸櫒绛?4VDC渚涚數鐨勪袱绾垮埗鍙橀€佸櫒閰嶅 锛屽畬鎴愬悜鍙橀€佸櫒棣堢數銆佸彇鍥炲弬鏁颁俊鍙枫€侀殧绂昏浆鎹㈣緭鍑虹殑宸ヤ綔銆?/span>CWG60绾㈠ 娴嬫俯浠?/span>CWG60绾㈠ 娴嬫俯浠 粙缁?/h2>CWG60绾㈠ 娴嬫俯浠 槸鐭跨敤鏈 川瀹夊叏闃茬垎鐢垫皵浜у搧锛屽彲鍦ㄦ湁鍙 噧绮夊皹鎴栨皵浣撶垎鐐稿嵄闄╃殑鐜 涓 娇鐢ㄣ€傚箍娉涘簲鐢ㄤ簬鍚勮 涓氱殑娓╁害鐨勬祴閲忋€?/p>CWG60绾㈠ 娴嬫俯浠 叿鏈夊皬宸с€佸潥鍥恒€佷娇鐢ㄦ柟渚匡紝鍝嶅簲鏃堕棿蹇 瓑鐗圭偣锛屼笉鍒?s 鍗冲彲璇诲彇鐗╀綋琛ㄩ潰娓╁害銆傚ぇ灞忓箷娑叉櫠鏄剧ず鍣ㄥ姞LED鑳屽厜浣垮悇绉嶅弬鏁拌 鏁扮洿瑙傘€傜幆琛屾縺鍏夌瀯鍑嗗彂灏勭巼鍙 皟锛屾棤椤绘帴瑙﹀嵆鍙 畨鍏ㄦ祴閲忕儹鐨勩€佸嵄闄╃殑鎴栭毦浠ユ帴瑙︾殑鐗╀綋琛ㄩ潰娓╁害銆傛祴閲忕簿搴﹂珮(1鈩?銆侀噸澶嶆€уソ(0.5%)銆佹祴閲忚寖鍥村 (-32锝?00鈩?銆傚彲鍗佸垎鏂逛究鍦伴€夋嫨鏈€澶у€笺€佹渶灏忓€笺€佸樊鍊笺€佸钩鍧囧€兼樉绀哄彲浠绘剰璁剧疆瓒呴珮銆佷綆闄愭姤璀︼紝鍙 鎺ョ孩澶栦紶鎰熷櫒鎺㈤拡锛岃繕鍙 瓨鍌?2涓 祴鐐圭殑娓╁害鏁版嵁銆?/span>CWG60绾㈠ 娴嬫俯浠 骇鍝佸瀷鍙?/h2>鍨嬪彿锛欳WG60绾㈠ 娴嬫俯浠?/p>C——浜у搧绫诲瀷浠ｅ彿锛屾祴瀹氫华鍣 紱W——浜у搧绗 竴鐗瑰緛锛屾祴閲忔俯搴︼紱G——浜у搧绗 簩鐗瑰緛锛屽厜瀛?锛?/p>60——涓诲弬鏁帮紝娴嬮噺鑼冨洿CWG60绾㈠ 娴嬫俯浠 €傜敤鑼冨洿閫傜敤鍦烘墍锛欳WG60绾㈠ 娴嬫俯浠 €傜敤浜庣叅鐭夸簳涓嬪嵄闄╁満鎵€锛屼互闈炴帴瑙︽柟寮忔祴閲忎簳涓嬪悇绉嶉毦浠ユ祴閲忕墿浣撳強瑁呭 锛堝 鐓ゅ眰鎴栧博鐭冲 闈 €佺數鏈恒€佹按娉点€侀槻鐖嗗紑鍏炽€佽繍杈撶毊甯︾瓑锛夎〃闈㈡俯搴︺€?/p>浣跨敤鐜 锛?鐜 娓╁害锛?鈩冿綖40鈩冿紱鐩稿 婀垮害锛?le;96%锛?/p>澶ф皵鍘嬪姏锛?0kPa锝?10kPa锛?/p>璐 瓨娓╁害锛?40鈩冿綖+60鈩冦€?/p>CWG60绾㈠ 娴嬫俯浠 弬鏁?/h2>宸ヤ綔娓╁害锛?锝?0鈩?br />娴嬮噺鑼冨洿锛?32锝?00鈩?br />绮? 搴︼細1鈩?br />閲?澶?鎬э細0.5%鍝嶅簲鏃堕棿锛?00ms闃茬垎鍨嬪紡锛欵xib鈪犵熆鐢ㄦ湰瀹夊瀷鐢垫簮鐢靛帇锛?V DC(涓撶敤灞傚彔鐢垫睜1鑺?鏈€楂樺紑璺 數鍘嬶細9.8V鏈€澶х煭璺 數娴侊細1.2ACWG550绾㈠ 娴嬫俯浠?/span>CWG550绾㈠ 娴嬫俯浠 骇鍝佷粙缁?/h2>CWG550绾㈠ 娴嬫俯浠 槸涓€绉嶉潪鎺ヨЕ寮忛珮绮惧害绾㈠ 娓╁害妫€娴嬩华鍣 紝鍏锋湁浣撶Н灏忋€侀噸閲忚交銆佺簿搴﹂珮銆侀槻灏樸€侀槻娼 €佷娇鐢ㄦ柟渚跨瓑鐗圭偣銆侰WG550绾㈠ 娴嬫俯浠 富瑕侀€傜敤浜庡瓨鍦ㄦ槗鐕冦€佹槗鐖嗗彲鐕冩€ф皵浣撴贩鍚堢墿鐨勫伐浣滅幆澧冧腑锛岄潪鎺ヨЕ蹇 €熸祴閲忕墿浣撹〃闈㈢殑娓╁害銆?/p>CWG550绾㈠ 娴嬫俯浠 €傜敤鑼冨洿閫傜敤鍦烘墍锛欳WG550绾㈠ 娴嬫俯浠 €傜敤浜庣叅鐭夸簳涓嬪嵄闄╁満鎵€锛屼互闈炴帴瑙︽柟寮忔祴閲忎簳涓嬪悇绉嶉毦浠ユ祴閲忕墿浣撳強瑁呭 锛堝 鐓ゅ眰鎴栧博鐭冲 闈 €佺數鏈恒€佹按娉点€侀槻鐖嗗紑鍏炽€佽繍杈撶毊甯︾瓑锛夎〃闈㈡俯搴︺€?/p>浣跨敤鐜 锛?鐜 娓╁害锛?鈩冿綖40鈩冿紱鐩稿 婀垮害锛?le;96%锛?/p>澶ф皵鍘嬪姏锛?0kPa锝?10kPa锛?/p>璐 瓨娓╁害锛?40鈩冿綖+60鈩冦€?/p>CWG550绾㈠ 娴嬫俯浠 弬鏁?/h2>娴嬫俯鑼冨洿锛氾紙-18锝?425锛夆剝锛?br />娴嬮噺绮惧害锛氬厑璁歌 宸 紝璇绘暟鍊肩殑±2%锛?br />閲嶅 绮惧害锛氳 鏁板€肩殑±1%锛?br />鍝嶅簲鏃堕棿锛?le;500ms锛?br />宸ヤ綔娉㈡ 锛?7锝?8)μm锛?br />杈愬皠绯绘暟锛?.95锛?br />娓╁害鍒嗚鲸鐜囷細1鈩冿紝娓╁害鏄剧ず锛?浣峀CD锛?br />璺濈 绯绘暟锛?0锛?锛?br />闃茬垎鍨嬪紡锛欵xib鈪狅紝鐢垫睜缁勶細7×(2/3)F300 mAh锛?br />杩炵画宸ヤ綔鏃堕棿锛氾紴10h锛?br />闃叉姢绛夌骇锛欼P54,澶栧舰灏哄 锛?00×35×235mm锛?br />閲嶉噺锛?.3kg锛?br />閰嶅 璁惧 鍗曚綋鍏呯數鍣ㄣ€?/p>以下是附加文档，不需要的朋友下载后删除，谢谢班主任工作总结专题8篇第一篇:班主任工作总结小学班主任特别是一年级的班主任，是一个复合性角色。
HDSP-523Y中文资料
14.2 mm (0.56 inch) General Purpose Two Digit Seven Segment Displays Technical DataHDSP-52xE Series HDSP-52xG Series HDSP-52xY SeriesFeatures•Industry Standard Size •Industry Standard Pin-Out 15.24 mm (0.6 in.) DIP Leads on 2.54 mm (0.1 in.) Centers •Choice of Colors Red, Green, Yellow •Mitered FontMitered Corners on Segments •Gray Face PaintGray Package Gives Optimum Contrast•±50° Viewing Angle •Design FlexibilityCommon Anode or Common Cathode•Categorized for Luminous Intensity•Green and Yellow Categorized for ColorApplications•Suitable for Indoor Use •Not Recommended forIndustrial Applications, i.e.Operating Temperatures Requirements Exceeding 85°C or Below -35°C [1]•Extreme Temperature Cycling NotRecommended [2]DescriptionThese 14.2 mm (0.56 inch) two digit displays use industry standard size and pin-out. The devices are available as either common anode or common cathode. These gray-faceddisplays are available in a choice of high efficiency red (HER),green, or yellow colors. TheDevicesHER HDSP-Green HDSP-Yellow HDSP-Description521E 521G 521Y Common Anode Right Hand Decimal 523E523G523YCommon Cathode Right Hand DecimalNotes:1.For industrial applications, it is recommended to use HDSP-5521/5523/5621/5623/5721/5723.2. For details, please contact your local Agilent sales office or an authorized distributor.HDSP-521x and HDSP-523xseries are suitable for indoor use.These parts are subjected to Outgoing Quality Assurance (OQA) inspection with AQL of 0.065% for functional and visual/cosmetic rejects.Part Numbering SystemNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative for details.2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information.5082 -X X X X-X X X X X HDSP-X X X X-X X X X XMechanical Options [1]00: No Mechanical Option Color Bin Options [1,2]0: No Color Bin LimitationMaximum Intensity Bin [1,2]0: No Maximum Intensity Bin Limitation Minimum Intensity Bin [1,2]0: No Minimum Intensity Bin Limitation Device Configuration/Color [1]E: High Efficiency Red G: Green Y: YellowDevice Specific Configuration [1]Refer to Respective Datasheet Package [1]Refer to Respective DatasheetPackage DimensionsCOLOR BINNING (NOTE 3)2.54TOP END VIEWFRONT VIEWNOTES:1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).2. TOLERANCE IS 0.25 mm (0.01 INCH) UNLESS OTHERWISE STATED.3. FOR GREEN AND YELLOW ONLY.LUMINOUS INTENSITY CATEGORYInternal Circuit DiagramCOMMON ANODECOMMON CATHODECOMMON ANODE COMMON CATHODE PIN FUNCTION PIN1 E CATHODE NO. 12 D CATHODE NO. 13 C CATHODE NO. 14DP CATHODE NO. 15 E CATHODE NO. 26 D CATHODE NO. 27G CATHODE NO. 28 C CATHODE NO. 29DP CATHODE NO. 210 B CATHODE NO. 211 A CATHODE NO. 212 F CATHODE NO. 2123456789101112FUNCTION13DIGIT NO. 2 ANODE1314DIGIT NO. 1 ANODE1415 B CATHODE NO. 11516 A CATHODE NO. 11617G CATHODE NO. 11718 F CATHODE NO. 118E ANODE NO. 1D ANODE NO. 1C ANODE NO. 1DP ANODE NO. 1E ANODE NO. 2D ANODE NO. 2G ANODE NO. 2C ANODE NO. 2DP ANODE NO. 2B ANODE NO. 2A ANODE NO. 2F ANODE NO. 2DIGIT NO. 2 CATHODEDIGIT NO. 1 CATHODEB ANODE NO. 1A ANODE NO. 1G ANODE NO. 1F ANODE NO. 1Absolute Maximum Ratings at T A=25°CHER Green YellowHDSP-521E HDSP-521G HDSP-521Y Parameter HDSP-523E HDSP-523G HDSP-523Y Units Average Power per Segment or DP62.510545mW Peak Forward Current per Segment or DP909060mA (1/10 Duty Cycle, 0.1 ms Pulse Width)DC Forward Current per Segment or DP[1]25[1]30[3]20[2]mA Reverse Voltage per Segment or DP555V Operating Temperature-35 to +85-35 to +85-35 to +85°C Storage Temperature-35 to +85-35 to +85-35 to +85°C Wave Soldering Temperature for 3 seconds[4]250250250°C (2 mm [0.063 in.] below Body)Notes:1.Derate above 25°C at 0.33 mA/°C.2. Derate above 25°C at 0.27 mA/°C.3. Derate above 40 celcius at 0.35 mA/celcius.4. Not recommended to be soldered more than 2 times. Minimum interval between solderings is 15 minutes. Total soldering time notto exceed 5 seconds.Optical/Electrical Characteristics at T A=25°CHigh Efficiency RedDevices Test HDSP-Parameter Symbol Min.Typ.Max.Units Conditions Luminous Intensity/Segment I v 2.28 4.007.69mcd I F = 10 mA(Segment Average)[1,2]Forward Voltage/Segment or DP V F 2.05 2.60V I F = 20 mA 521E Peak WavelengthPEAK640nm523E Dominant Wavelength[3]d628nm I F = 10 mA Reverse Voltage/Segment or DP[4]V R 5.0V I R = 100 µATemperature Coefficient of⌬V F/°C-2mV/°CV F/Segment or DPGreenDevices Test HDSP-Parameter Symbol Min.Typ.Max.Units Conditions Luminous Intensity/Segment I v 2.28 3.50 5.13mcd I F = 10 mA(Segment Average)[1,2]Forward Voltage/Segment or DP V F 2.0 2.4V I F = 10 mA 521G Peak WavelengthPEAK568nm523G Dominant Wavelength[3]d564.5570576.5nm I F = 10 mA Reverse Voltage/Segment or DP[4]V R 5.0V I R = 100 µATemperature Coefficient of⌬V F/°C-2mV/°CV F/Segment or DPYellowDevices Test HDSP-Parameter Symbol Min.Typ.Max.Units Conditions Luminous Intensity/Segment I v 1.52 2.30 5.13mcd I F = 10 mA(Segment Average)[1,2]Forward Voltage/Segment or DP V F 2.1 2.4V I F = 20 mA 521Y Peak WavelengthPEAK589nm523Y Dominant Wavelength[3]d582.0587592.0nm I F = 10 mA Reverse Voltage/Segment or DP[4]V R 5.0V I R = 100 µATemperature Coefficient of⌬V F/°C-2mV/°CV F/Segment or DPNotes:1.Case temperature of the device immediately prior to the intensity measurement is 25°C.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, d, is derived from the CIE chromaticity diagram and represents the single wavelength which defines thecolor of the device.4. Typical specification for reference only. Do not exceed absolute maximum ratings.Intensity Bin Limits[1] (mcd at 10 mA)Yellow GREEN HER Bin Name Min.[2]Max.[2]Min.[2]Max.[2]Min.[2]Max.[2]F 1.52 2.28NA NA NA NAG 2.28 3.42 2.28 3.42 2.28 3.42H 3.42 5.13 3.42 5.13 3.42 5.13I NA NA NA NA 5.137.69 Notes:1. Bin categories are established for classification of products. Products may not be available in all bin categories.2. Tolerance for each bin limit is ±10%.Color Categories (Dominant Wavelength)GREENBin Name Min.[2]Max.[2]3570.5573.52573.5576.5YELLOWBin Name Min.[2]Max.[2]2587.00589.503584.50587.00Notes:1.Bin categories are established for classification of products. Products may not be availablein all bin categories.2. Tolerance for each bin limit is ±1 nM.Contrast EnhancementFor information on contrast enhancement, please see Application Note 1015.Soldering/CleaningCleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from thechlorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride,etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs please refer to Application Note 1027.Device ReliabilityFor reliability information, please see the reliability data sheet 14.2 mm (0.56 inch) General Purpose Two Digit Seven Segment Display.Figure 3. Relative Luminous Intensity vs. DC Forward Current.Figure 4. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current.R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 10 m A )I F – DC FORWARD CURRENT – mAηV – R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A P E R S E G M E N T )0.6I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA1.61.41.31.10.90.80.71.01.21.5Figure 1. Maximum Allowable DC Current vs. Ambient Temperature.Figure2. Forward Current vs.Forward Voltage.I D C – M A X I M U M D C C U R R E N T P E R S E G M E NT – m A0T A – AMBIENT TEMPERATURE – °C 403010205152535I F – F O R W A R D C U R R E N T P E R S E G M E N T– m AV F – FORWARD VOLTAGE – V/semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc. Obsoletes 5988-0376ENJuly 17, 20045988-5378EN。
HDSP-2133资料
DevicesHigh HighEfficiency Performance Yellow RedGreen Orange HDSP-2131HDSP-2132HDSP-2133HDSP-2179DescriptionThe HDSP-2131 (yellow), HDSP-2179 (orange),HDSP-2132 (high efficiency red) and the HDSP-2133(green) are eight-digit, 5 x 7 dot matrix, alphanu-meric displays. The 5.0 mm (0.2 inch) high characters are packaged in a standard 7.64 mm (0.30 inch) 32pin DIP. The on-board CMOS IC has the ability to decode 128 ASCII characters, which are permanently stored in ROM. In addition, 16 programmable symbols may be stored in an on-board RAM. Seven brightness levels provide versatility in adjusting the display intensity and power consumption. The HDSP-213x and HDSP-2179 are designed for stan-dard microprocessor interface techniques. The display and special features are accessed through a bidirectional eight-bit data bus. These features make the HDSP-213x and HDSP-2179 ideally suited for applications where a hermetic, low power alpha-numeric display is required.Features•Wide operating temperature range -55°C to +85°C •Smart alphanumeric display – On-board CMOS IC – Built-in RAM – ASCII decoder – LED drive circuitry •128 ASCII character set •16 user definable characters •Programmable features– Individual character flashing – Full display blinking– Multi-level dimming and blanking – Self test– Clear function•Read/write capability •Full TTL compatibility•HDSP-2131/-2133/-2179 useable in night vision lighting applications•Categorized for luminous intensity •HDSP-2131/2133 categorized for color •Excellent ESD protection •Wave solderable •X-Y stackable •RoHS compliantHDSP-2131, HDSP-2132, HDSP-2133, HDSP-2179Eight Character 5.0 mm (0.2 inch) Glass/Ceramic Intelligent 5x7 Alphanumeric Displays for Military ApplicationsData SheetPackage Dimensions1. ALL DIMENSIONS ARE IN mm (INCHES).2. UNLESS OTHERWISE SPECIFIED, TOLERANCE IS ± 0.30 mm (0.015 INCH).3. FOR GREEN AND YELLOW DEVICES ONLY.4. LEADS ARE COPPER ALLOY, SOLDER DIPPED.Absolute Maximum RatingsSupply Voltage, V DD to Ground[1]-0.3 to 7.0 VOperating Voltage, V DD to Ground 5.5 VInput Voltage, Any Pin to Ground-0.3 to V DD +0.3 VFree Air Operating Temperature Range, T A-55°C to +85°CStorage Temperature, T S-55°C to +100°CCMOS IC Junction Temperature, T J (IC)+150°CSoldering Temperature [1.59 mm (0.063 in.) Below Body]Solder Dipping260°C for 5 secsWave Soldering250°C for 3 secsESD Protection @ 1.5 kΩ, 100 pF V Z = 4 kV (each pin)Notes:1. Maximum voltage is with no LEDs illuminated.2. 20 dots ON in all locations at full brightness.ESD WARNING: STANDARD CMOS HANDLING PRECAUTIONS SHOULD BE OBSERVED WITH THE HDSP-2131, HDSP-2132, HDSP-2133, AND HDSP-2179.Character SetRecommended Operating ConditionsParameter Symbol Minimum Nominal Maximum UnitsSupply Voltage V DD 4.5 5.0 5.5VElectrical Characteristics over Operating Temperature Range4.5 < V DD <5.5 V (unless otherwise specified)25°C25°CParameter Symbol Min.Typ.[1]Max.[1]Max.[2]Units Test Conditions Input Leakage I I-10.0+10.0µA V IN = 0 to V DD, (Input without Pullup)pins CLK, D0-D7,A0-A4Input Current I IP-30.0111830µA V IN = 0 to V DD, (Input with Pullup)pins RST, CLS, WR,RD, CE, FLI DD Blank I DD (BLK)0.5 1.5 2.0mA V IN = V DDI DD 8 digits I DD(V)200255330mA"V" on in all 812 Dots/Character[3]locationsI DD 8 digits I DD(#)300370430mA"#" on in all 820 Dots/Character[3]locationsInput Voltage High V IH 2.0V DD V V DD = 5.5 V+0.3Input Voltage Low V IL GND0.8V V DD = 4.5 V-0.3 VOutput Voltage High V OH 2.4V V DD = 4.5 V,I OH = -40 µA Output Voltage Low V OL0.4V V DD = 4.5 V,D0-D7I OL = 1.6 mA Output Voltage Low0.4V V DD = 4.5 V,CLK I OL = 40 µA Thermal Resistance R q J-PIN11°C/WIC Junction-to-PINNotes:1.V DD = 5.0 V.2.Maximum I DD occurs at -55°C.3.Average I DD measured at full brightness. See Table 2 in Control Word Section for I DD at lower brightness levels. Peak I DD = 28/15 x Average I DD (#).Optical Characteristics at 25°C[4]V DD = 5.0 V at Full BrightnessHigh Efficiency Red HDSP-2132Description Symbol Minimum Typical Units Luminous Intensity Character Average (#)I V 2.57.5mcd Peak Wavelength l PEAK635nm Dominant Wavelength l d626nmOrange HDSP-2179Description Symbol Minimum Typical Units Luminous Intensity Character Average (#)I V 2.57.5mcd Peak Wavelength l PEAK600nm Dominant Wavelength l d602nmYellow HDSP-2131Description Symbol Minimum Typical Units Luminous Intensity Character Average (#)I V 2.57.5mcd Peak Wavelength l PEAK583nm Dominant Wavelength l d585nmHigh Performance Green HDSP-2133Description Symbol Minimum Typical Units Luminous Intensity Character Average (#)I V 2.57.5mcd Peak Wavelength l PEAK568nm Dominant Wavelength l d574nmNote:4.Refers to the initial case temperature of the device immediately prior to the light measurement.DDReferenceNumber Symbol Description Min.[1]Units1t ACC Display Access TimeWrite210Read230ns2t ACS Address Setup Time to Chip Enable10ns3t CE Chip Enable Active Time[2,3]Write140Read160ns4t ACH Address Hold Time to Chip Enable20ns5t CER Chip Enable Recovery Time60ns6t CES Chip Enable Active Prior to Rising Edge of[1,2]Write140Read160ns7t CEH Chip Enable Hold Time to Rising Edge ofRead/Write Signal[2,3]0ns8t W Write Active Time100ns9t WD Data Valid Prior to Rising Edge of Write Signal50ns10t DH Data Write Hold Time20ns11t R Chip Enable Active Prior to Valid Data160ns12t RD Read Active Prior to Valid Data75ns13t DF Read Data Float Delay10ns–t RC Reset Active Time300nsNotes:1.Worst case values occur at an IC junction temperature of 150°C.2.For designers who do not need to read from the display, the Read line can be tied to V DD and the Write and Chip Enable lines can be tied together.3.Changing the logic levels of the Address lines when CE = “0” may cause erroneous data to be entered into the Character RAM, regardless of the4.The display must not be accessed until after 3 clock pulses (110 µs min. using the internal refresh clock) after the rising edge of the reset line.DDSymbol Description25°C Typical Minimum[1]Units F OSC Oscillator Frequency5728kHz F RF Display Refresh Rate256128HzF FL Character Flash Rate21Hzt ST[7]Self Test Cycle Time 4.69.2Sec Notes:5.F RF = F OSC/224.6.F FL = F OSC/28,672.7.t ST = 262,144/F OSC.Write Cycle Timing DiagramINPUT PULSE LEVELS: 0.6 V to 2.4 VRead Cycle Timing DiagramCharacter FontRelative Luminous Intensity vs. TemperatureINPUT PULSE LEVELS: 0.6 V to 2.4 VOUTPUT REFERENCE LEVELS: 0.6 V to 2.2 V OUTPUT LOADING = 1 TTL LOAD AND 100 pFNOTE: NOT TO SCALETYP.R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 25°C )-550T A – AMBIENT TEMPERATURE – °C85-15651054.03.53.02.01.51.00.5254552.5-35Electrical DescriptionPin Function DescriptionRESET (RST, Pin 5)Reset initializes the display.FLASH (FL, Pin 27)FL low indicates an access to the Flash RAM and is unaffected by thestate of address lines A3-A4.ADDRESS INPUTS Each location in memory has a distinct address. Address inputs (A0-A2)(A0-A4, Pins 28-32)select a specific location in the Character RAM, the Flash RAM or aparticular row in the UDC (User-Defined Character) RAM. A3-A4 are used toselect which section of memory is accessed. Table 1 shows the logic levelsneeded to access each section of memory.Table 1. Logic Levels to Access MemoryFL A4A3Section of Memory A2A1A00X X Flash RAM Character Address100UDC Address Register Don't Care101UDC RAM Row Address110Control Word Register Don't Care111Character RAM Character AddressCLOCK SELECT This input is used to select either an internal (CLS = 1) or external (CLS, Pin 1)(CLS = 0) clock source.CLOCK INPUT/OUTPUT Outputs the master clock (CLS = 1) or inputs a clock (CLS = 0) for slave (CLK, Pin 2)displays.WRITE (WR, Pin 3)Data is written into the display when the WR input is low and the CE inputis low.CHIP ENABLE (CE, Pin 4)This input must be at a logic low to read or write data to the display andmust go high between each read and write cycle.input is low.DATA Bus (D0-D7,The Data bus is used to read from or write to the display.Pins 11-14, 19-22)GND(SUPPLY) (Pin 17)This is the analog ground for the LED drivers.GND(LOGIC) (Pin 18)This is the digital ground for internal logic.V DD(POWER) (Pin 16)This is the positive power supply input.F i g u r e 1. H D S P -213x /-2179 i n t e r n a l b l o c k d i a g r a m .11eight 5 x 7 dot matrixcharacters. The major user accessible portions of the dis-play are listed below:ASCII decoder, a 16 character UDC RAM, a UDC Address Register, a Control Word Register, and the refreshcircuitry necessary to synchron-ize the decoding and driving ofCharacter RamFigure 2 shows the logic levels needed to access the HDSP-213x/-2179 Character RAM. During a normal access the CE = “0” and either RD = “0” or WR = “0”.However, erroneous data may be written into the Character RAM if the Address lines are unstable when CE = “0” regardless of the logic levels of the RD or WR lines.Address lines A 0-A 2 are used to select the location in the Charac-ter RAM. Two types of data can be stored in each Character RAM location: an ASCII code or a UDC RAM address. Data bit D 7 is used to differentiate between an ASCII character and a UDC RAMaddress. D 7 = 0 enables the ASCII decoder and D 7 = 1 enables the UDC RAM. D 0-D 6 are used to input ASCII data and D 0-D 3 are used to input a UDC address.Figure 2. Logic levels to access the character RAM.Display Internal Block DiagramFigure 1 shows the internal block diagram of the HDSP-213x/-2179display. The CMOS IC consists of an 8 byte Character RAM, an 8bit Flash RAM, a 128 characterCharacter RAM This RAM stores either ASCII character data or a UDC RAM address.Flash RAMThis is a 1 x 8 RAM which stores Flash data.User-Defined Character RAM This RAM stores the dot pattern for custom characters.(UDC RAM)User-Defined Character This register is used to provide the address to the UDC RAM when the user is writing or Address Registerreading a custom character.(UDC Address Register)Control Word RegisterThis register allows the user to adjust the display brightness, flash individual characters, blink, self test, or clear the display.CE FL A 4A 3A 2A 1A 0RST WR RD CHARACTER ADDRESSSYMBOL IS ACCESSED IN LOCATIONSPECIFIED BY THE CHARACTER ADDRESS ABOVE 0100011111011UNDEFINEDCONTROL SIGNALSCHARACTER RAM ADDRESSCHARACTER RAM DATA FORMATWRITE TO DISPLAY READ FROM DISPLAY UNDEFINED000 = LEFT MOST 111 = RIGHT MOSTD 7D 6D 5D 4D 3D 2D 1D 00128 ASCII CODEXXXUDC CODE1DISPLAY0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CAREDIG 0DIG 1DIG 2DIG 3DIG 4DIG 5DIG 6DIG 7001010011100101110111000UDC RAM and UDC Address Register Figure 3 shows the logic levels needed to access the UDC RAM and the UDC Address Register. The UDC Address Register is eight bits wide. The lower four bits (D0-D3) are used to select one of the 16 UDC locations. The upper four bits (D4-D7) are not used. Once the UDC address has been stored in the UDC Address Register, the UDC RAM can be accessed.To completely specify a 5 x 7 character requires eight write cycles. One cycle is used to store the UDC RAM address in the UDC Address Register. Seven cycles are used to store dot data in the UDC RAM. Data is entered by rows. One cycle is needed to access each row. Figure 4 shows the organization of a UDC character assuming the symbol to be stored is an “F.” A0-A2 are used to select the row to be accessed and D0-D4 are used to transmit the row dot data. The upper three bits (D5-D7) are ignored. D0 (least significant bit) corresponds to the right most column of the 5 x 7 matrix and D4 (most significant bit) corresponds to the left most column of the 5 x 7 matrix.Flash RAMFigure 5 shows the logic levels needed to access the Flash RAM. The Flash RAM has one bit associated with each location of the Character RAM. The Flash input is used to select the Flash RAM. Address lines A3-A4 are ignored. Address lines A0-A2 are used to select the location in the Flash RAM to store the attribute. D0 is used to store or remove the flash attribute. D0 = “1” stores the attribute and D0 = “0” removes the attribute.When the attribute is enabledthrough bit 3 of the Control Word and a "1" is stored in the Flash RAM, the corresponding character will flash at approximately 2 Hz.The actual rate is dependent onthe clock frequency. For anexternal clock the flash rate canbe calculated by dividing the clockfrequency by 28,672.Figure 4. Data to load “F” into the UDC RAM.Figure 3. Logic levels to access a UDC character.CEFL A4A3A2A1A0RST WR RD100011001X X X11UNDEFINEDCONTROL SIGNALSUDC ADDRESS REGISTER ADDRESSUDC ADDRESS REGISTER DATA FORMATWRITE TO DISPLAYREAD FROM DISPLAYUNDEFINED000 = ROW 1110 = ROW 7D7D6D5D4D3D2D1D0X UDC CODEX X XFL A4A3A2A1A0011ROW SELECTUDC RAM ADDRESSUDC RAM C CDATA FORMAT O OL L1 50 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARED7D6D5D4D3D2D1D0X DOT DATAX XCERST WR RD100011011UNDEFINEDCONTROL SIGNALSWRITE TO DISPLAYREAD FROM DISPLAYUNDEFINEDC C C C CO O O O OL L L L L1 2 3 4 5D4D3D2D1D0UDC CHARACTER HEX CODE1 1 1 1 1 ROW 1 •••••1F1 0 0 0 0 ROW2 •101 0 0 0 0 ROW 3 •101 1 1 1 0 ROW 4 ••••1D1 0 0 0 0 ROW 5 •101 0 0 0 0 ROW 6 •101 0 0 0 0 ROW 7 •10IGNORED0 = LOGIC 0; 1 = LOGIC 1; * = ILLUMINATED LED1213Control Word RegisterFigure 6 shows how to access the Control Word Register. This is an eight bit register which performs five functions. They are Bright-ness control, Flash RAM control,Blinking, Self Test and Clear.Each function is independent of the others. However, all bits are updated during each Control Word write cycle.Brightness (Bits 0-2)Bits 0-2 of the Control Word adjust the brightness of the display. Bits 0-2 are interpreted as a three bit binary code with code (000) corresponding to maximum brightness and code (111) corresponding to a blanked display. In addition to varying the display brightness, bits 0-2 also vary the average value of I DD . I DD can be calculated at any bright-ness level by multiplying the percent bright-ness level by the value of I DD at the 100%brightness level. These values of I DD are shown in Table 2.Flash Function (Bit 3)Bit 3 determines whether the flashing character attribute is on or off. When bit 3 is a “1,” the output of the Flash RAM ischecked. If the content of a loca-tion in the Flash RAM is a “1,” the associated digit will flash at approximately 2 Hz. For anexternal clock, the blink rate can be calculated by driving the clock frequency by 28,672. If the flash enable bit of the Control Word is a “0,” the content of the Flash RAM is ignored. To use this function with multiple display systems see the Reset section.Blink Function (Bit 4)Bit 4 of the Control Word is used to synchronize blinking of all eight digits of the display. When this bit is a “1” all eight digits of the display will blink at approxi-mately 2 Hz. The actual rate is dependent on the clock frequency.For an external clock, the blink rate can be calculated by dividing the clock frequency by 28,672.This function will override the Flash function when it is active.To use this function with multiple display systems see the Reset section.Figure 5. Logic levels to access the flash RAM.Figure 6. Logic levels to access the control word register.Table 2. Current Requirements at Different Brightness Levels Symbol D 2D 1D 0% Brightness 25°C Typ.Units I DD (V)000100200mA 00180160mA 01053106mA 0114080mA 1002754mA 1012040mA 111326mACE FL A 4A 3A 2A 1A 0RST WR RD 0100011XX011UNDEFINEDREMOVE FLASH ATSPECIFIED DIGIT LOCATION STORE FLASH ATSPECIFIED DIGIT LOCATIONCONTROL SIGNALS FLASH RAM ADDRESS FLASH RAM DATA FORMAT0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CAREWRITE TO DISPLAY READ FROM DISPLAY UNDEFINEDD 7D 6D 5D 4D 3D 2D 1D 0XXXXXXX01CHARACTER ADDRESS000 = LEFT MOST 111 = RIGHT MOSTFL A 4A 3A 2A 1A 001000111XXX1011UNDEFINEDCONTROL SIGNALSCONTROL WORD ADDRESSCONTROL WORD DATA FORMAT0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARE0 DISABLE FLASH 1 ENABLE FLASH BRIGHTNESS CONTROL LEVELS 0 DISABLE BLINKING 1 ENABLE BLINKING0 NORMAL OPERATION1 CLEAR FLASH AND CHARACTER RAMS 0 X NORMAL OPERATION; X IS IGNORED 1 X START SELF TEST; RESULT GIVEN IN X X = 0 FAILED X = 1 PASSED WRITE TO DISPLAY READ FROM DISPLAY UNDEFINEDD 7D 6D 5D 4D 3D 2D 1D 0CSSBLFB000100%00180%01053%01110010120%11013%1110%BBSelf Test Function (Bits 5, 6)Bit 6 of the Control Word Register is used to initiate the self test function. Results of the internal self test are stored in bit 5 of the Control Word. Bit 5 is a read only bit where bit 5 = “1” indicates a passed self test and bit 5 = “0”indicates a failed self test.Setting bit 6 to a logic 1 will start the self test function. The built-in self test function of the IC consists of two internal routines which exercises major portions of the IC and illuminates all of the LEDs. The first routine cycles the ASCII decoder ROM through all states and performs a checksum on the output. If the checksum agrees with the correct value, bit 5 is set to “1.” The second routine provides a visual test of the LEDs using the drive circuitry. This is accomplished by writing checkered and inverse checkered patterns to the display. Each pattern is displayed for approxi-mately 2 seconds.During the self test function the display must not be accessed. The time needed to execute the self test function is calculated by multiplying the clock period by 262,144. For example, assume a clock frequency of 58 KHz, then the time to execute the self test function frequency is equal to (262,144/58,000) = 4.5 second duration.At the end of the self test function, the Character RAM is loaded with blanks, the Control Word Register is set to zeros except for bit 5, and the Flash RAM is cleared and the UDC Address Register is set to all ones.Clear Function (Bit 7)Bit 7 of the Control Word will clear the Character RAM and the Flash RAM. Setting bit 7 to a "1" will start the clear function. Three clock cycles (110 µs min. using theinternal refresh clock) arerequired to complete the clearfunction. The display must not beaccessed while the display is beingcleared. When the clear functionhas been completed, bit 7 will bereset to a “0.” The ASCII charactercode for a space (20H) will beloaded into the Character RAM toblank the display and the FlashRAM will be loaded with “0”s. TheUDC RAM, UDC Address Register,and the remainder of the ControlWord are unaffected.Display ResetFigure 7 shows the logic levelsneeded to Reset the display. Thedisplay should be Reset on Power-up. The external Reset clears theCharacter RAM, Flash RAM,Control Word and resets theinternal counters. After the risingedge of the Reset signal, threeclock cycles (110 µs min. using theinternal refresh clock) arerequired to complete the resetsequence. The display must not beaccessed while the display is beingreset. The ASCII Character codefor a space (20H) will be loadedinto the Character RAM to blankthe display. The Flash RAM andControl Word Register are loadedwith all "0"s. The UDC RAM andUDC Address Register are un-affected. All displays whichoperate with the same clocksource must be simultaneouslyreset to synchronize the Flashingand Blinking functions.Mechanical and ElectricalConsiderationsThe HDSP-213x/-2179 is a 32 pindual-in-line package with 24external pins, which can bestacked horizontally and verti-cally to create arrays of any size.The HDSP-213x/-2179 is designedto operate continuously from-55°C to +85°C with a maximumof 20 dots ON per character.Illuminating all thirty-five dots atfull brightness is notrecommended.The HDSP-213x/-2179 isassembled by die attaching andwire bonding 280 LED chips and aCMOS IC to a ceramic sub-strate.A glass window is placed over theceramic substrate creating an airgap over the LED wire bonds. Asecond glass window creates anair gap over the CMOS IC. Thispackage construction makes thedisplay highly tolerant to temper-ature cycling and allows wavesoldering and visual inspection ofthe IC.The inputs to the CMOS IC areprotected against static dischargeand input current latchup. How-ever, for best results standardCMOS handling precautionsshould be used. Prior to use, theHDSP-213X should be stored inFigure 7. Logic levels to reset the display.Figure 8. Maximum power dissipation vs.ambient temperature derating based onT J MAX = 125°C.CERST WR RD0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARENOTE:IF RST, CE, AND WR ARE LOW, UNKNOWNDATA MAY BE WRITTEN INTO THE DISPLAY.FL01X X X X XA4 -A0D7 -D0PD–POWERDISSIPATION–WT A– AMBIENT TEMPERATURE –°C4.03.01.02.01415Soldering and Post Solder Cleaning Instructions for the HDSP-213x/-2179The HDSP-213x/-2179 may be hand soldered or wave soldered with lead-free solder. When hand soldering it is recommended that an electronically temperature con-trolled and securely grounded soldering iron be used. For best results, the iron tip temperature should be set at 315°C (600°F).For wave soldering, a rosin-based RMA flux can be used. The solder wave temperature should be set at 245°C ± 5°C (473°F ± 9°F), and dwell in the wave should be set between 11/2 to 3 seconds for optimum soldering. The preheat temperature should not exceed 105°C (221°F) as measured on the solder side of the PC board.Proper handling is imperative to avoid excessive thermal stresses to component when heated.Therefore, the solder PCB must be allowed to cool to room temperature, 25°C, before handling.For further information on soldering and post soldercleaning, see Application Note 1027, Soldering LED Components.antistatic packages or conductive material. During assembly, a grounded conductive work area should be used, and assemblypersonnel should wear conductive wrist straps. Lab coats made of synthetic material should be avoided since they are prone to static charge buildup. Input current latchup is caused when the CMOS inputs are subjected to either a voltage below ground (V IN < ground) or to a voltage higher than V DD (V IN > V DD ) and when a high current is forced into the input. To prevent input cur-rent latchup and ESD damage,unused inputs should be con-nected either to ground or to V DD .Voltages should not be applied to the inputs until V DD has been applied to the display. Transient input voltages should be eliminated.Thermal ConsiderationsThe HDSP-213x/-2179 has been designed to provide a low thermal resistance path from the CMOS IC to the 24 package pins. This heat is then typically conducted through the traces of the user’s printed circuit board to free air. For most applications no additional heatsinking is required.The maximum operating IC junction temperature is 150°C.The maximum IC junction tem-perature can be calculated using the following equation:T J (IC) MAX = T A+ (P D MAX) (R q J-PIN + R q PIN-A )WhereP D MAX = (V DD MAX) (I DD MAX)I DD MAX = 370 mA with 20 dots ON in eight character locations at 25°C ambient. This value is from the Electrical Characteristics table.P D MAX = (5.5 V) (0.370 A)= 2.04 W Ground ConnectionsTwo ground pins are provided to keep the internal IC logic ground clean. The designer can, when necessary, route the analog ground for the LED drivers sep-arately from the logic ground until an appropriate ground plane is available. On long interconnects between the display and the host system, the designer can keep voltage drops on the analogground from affecting the display logic levels by isolating the two grounds.The logic ground should be con-nected to the same ground poten-tial as the logic interface circuitry.The analog ground and the logic ground should be connected at a common ground which canwithstand the current introduced by the switching LED drivers.When separate ground connec-tions are used, the analog ground can vary from -0.3 V to +0.3 V with respect to the logic ground.Voltage below -0.3 V can cause all dots to be on. Voltage above +0.3V can cause dimming and dot mismatch.ESD SusceptibilityThese displays have ESD sus-ceptibility ratings of CLASS 3 per DOD-STD-1686 and CLASS B per MIL-STD-883C.BOTTOM SIDE OF PC BOARD TIME – SECONDST E M P E R A T U R E – °CTOP SIDE OF PC BOARDCONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)PREHEAT SETTING = 150°C (100°C PCB)SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)AIR KNIFE ANGLE = 40°NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTL Y COOLED BEFORE EXERTING MECHANICAL FORCE.Figure 9. Recommended wave soldering profile for lead-free Smart Display.Intensity Bin LimitsIntensity Range (mcd)Bin Min.Max.G 2.50 4.00H 3.41 6.01I 5.129.01J 7.6813.52K 11.5220.28Note: Test conditions as specified in Optical Characteristic table.Color Bin Limits Color Range (nm)Color Bin Min.Max.Green1576.0580.02573.0577.03570.0574.04567.0571.5Yellow3581.5585.04584.0587.55586.5590.06589.0592.5Note: Test conditions as specified in OpticalCharacteristic table.For product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes 5989-3182EN AV02-0190EN March 6, 2007Contrast EnhancementWhen used with the proper con-trast enhancement filters, the HCMS-213x/-2179 series displays are readable daylight ambients.Refer to Application Note 1029Luminous Contrast and Sunlight Readability of the HDSP-235x Series Alphanumeric Displays for Military Applications for information on contrast en-hancement for daylight ambients.Refer to Application Note 1015Contrast Enhancement Techniques for LED Displays for information on contrast enhancement in moderate ambients.Night Vision LightingWhen used with the proper NVG/DV filters, the HDSP-2131, HDSP-2179 and HDSP-2133 may be used in night vision lighting applica-tions. The HDSP-2131 (yellow),HDSP-2179 (orange) displays are used as master caution and warning indicators. The HDSP-2133 (high per-formance green)displays are used for general instrumenta-tion. For a list of NVG/DV filters and a discussion on night vision lighting technol-ogy, refer to Application Note 1030 LED Displays and Indicators and Night Vision Imaging System Lighting. An external dimming circuit must be used to dim these displays to night vision lighting levels to meet NVIS radiance requirements. Refer to AN 1039Dimming HDSP-213x Displays to Meet Night Vision Lighting Levels.。
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Features• Low Power Consumption • Industry Standard Size• Industry Standard Pinout • Choice of Character Size7.6 mm (0.30 in), 10 mm (0.40 in), 10.9 mm (0.43 in), 14.2 mm (0.56 in), 20 mm (0.80 in)• Choice of ColorsAlGaAs Red, High Efficiency Red (HER), Yellow, Green• Excellent Appearance Evenly Lighted Segments±50° Viewing Angle• Design FlexibilityCommon Anode or Common CathodeSingle and Dual DigitLeft and Right Hand Decimal Points±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display• Excellent for Long Digit String Multiplexing DescriptionThese low current seven segment displays are designed for applica-tions requiring low power consumption. They are tested and selected for their excellent low current characteristics to ensure that the segments are matched at low currents. Drive currents as low as 1 mA per segment are available.Pin for pin equivalent displays are also available in a standard current or high light ambient design. The standard current displays are available in all colors and are ideal for most applica-tions. The high light ambient displays are ideal for sunlight ambients or long string lengths. For additional information see the 7.6 mm Micro Bright Seven Segment Displays, 10 mm Seven Segment Displays, 7.6 mm/10.9 mm Seven Segment Displays, 14.2 mm Seven Segment Displays, 20 mm Seven Segment Displays, or High Light Ambient Seven Segment Displays data sheets.Low Current Seven SegmentDisplays Technical Data HDSP-335x SeriesHDSP-555x SeriesHDSP-751x SeriesHDSP-A10x Series HDSP-A80x Series HDSP-A90x Series HDSP-E10x Series HDSP-F10x Series HDSP-G10x Series HDSP-H10x Series HDSP-K12x, K70x Series HDSP-N10x SeriesHDSP-N40x SeriesDevicesAlGaAs HER Yellow Green Package HDSP-HDSP-HDSP-HDSP-Description Drawing A1017511A801A9017.6 mm Common Anode Right Hand Decimal A A1037513A803A9037.6 mm Common Cathode Right Hand Decimal B A1077517A807A9077.6 mm Common Anode ±1. Overflow C A1087518A808A9087.6 mm Common Cathode ±1. Overflow D F10110 mm Common Anode Right Hand Decimal E F10310 mm Common Cathode Right Hand Decimal F F10710 mm Common Anode ±1. Overflow G F10810 mm Common Cathode ±1. Overflow H G10110 mm Two Digit Common Anode Right Hand Decimal X G10310 mm Two Digit Common Cathode Right Hand Decimal Y E100335010.9 mm Common Anode Left Hand Decimal I E101335110.9 mm Common Anode Right Hand Decimal J E103335310.9 mm Common Cathode Right Hand Decimal K E106335610.9 mm Universal ±1. Overflow[1]L H101555114.2 mm Common Anode Right Hand Decimal M H103555314.2 mm Common Cathode Right Hand Decimal N H107555714.2 mm Common Anode ±1. Overflow O H108555814.2 mm Common Cathode ±1. Overflow P K121K70114.2 mm Two Digit Common Anode Right Hand Decimal R K123K70314.2 mm Two Digit Common Cathode Right Hand Decimal S N10020 mm Common Anode Left Hand Decimal Q N101N40120 mm Common Anode Right Hand Decimal T N103N40320 mm Common Cathode Right Hand Decimal U N10520 mm Common Cathode Left Hand Decimal V N106N40620 mm Universal ±1. Overflow[1]W Note:1. Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagrams L or W.Part Numbering System5082-x xx x-x x x xxHDSP-x xx x-x x x xxMechanical Options[1]00: No mechanical optionColor Bin Options[1,2]0: No color bin limitationMaximum Intensity Bin[1,2]0: No maximum intensity bin limitationMinimum Intensity Bin[1,2]0: No minimum intensity bin limitationDevice Configuration/Color[1]G: GreenDevice Specific Configuration[1]Refer to respective datasheetPackage[1]Refer to Respective datasheetNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative fordetails.2. Bin options refer to shippable bins for a part-number. Color and Intensity Bins are typically restricted to 1 bin per tube (excep-tions may apply). Please refer to respective datasheet for specific bin limit information.Package DimensionsPackage Dimensions (cont.)Package Dimensions (cont.)*The Side View of package indicates Country of Origin.Package Dimensions (cont.)Package Dimensions (cont.)Package Dimensions (cont.)Internal Circuit DiagramInternal Circuit Diagram (cont.)Absolute Maximum RatingsAlGaAs Red - HDSP-HERA10X/E10X/H10X HDSP-751X/Yellow GreenK12X/N10X/N40X335X/555X/HDSP-A80X HDSP-A90X Description F10X, G10X Series K70X Series Series Series Units Average Power per Segment or DP375264mW Peak Forward Current per 45mA Segment or DPDC Forward Current per15[1]15[2]mA Segment or DPOperating Temperature Range-20 to +100-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment 3.0V or DPWave Soldering Temperature for 3Seconds (1.60 mm [0.063 in.] below 250°C seating body)Notes:1. Derate above 91°C at 0.53 mA/°C.2. Derate HER/Yellow above 80°C at 0.38 mA/°C and Green above 71°C at 0.31 mA/°C.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions315600I F = 1 mA A10x3600I F = 5 mA330650I F = 1 mAF10x, G10x3900I F = 5 mA390650I F = 1 mA E10x Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)3900I F = 5 mA400700I F = 1 mAH10x, K12x4200I F = 5 mA270590I F = 1 mAN10x, N40x3500I F = 5 mA1.6I F = 1 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA1.82.2I F = 20 mA PkAll Devices Peak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2 mV mV/°CV F/Segment or DPA10x255F10x, G10x320E10x340Thermal Resistance LED RθJ-PIN°C/W/SegH10x, K12x Junction-to-Pin400N10x, N40x430High Efficiency RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions160270I F = 2 mA 751x1050I F = 5 mA200300I F = 2 mA Luminous Intensity/Segment[1,2]I V mcd(Digit Average)1200I F = 5 mA335x, 555x,K70x270370I F = 2 mA1480I F = 5 mA1.6I F = 2 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA2.1 2.5I F = 20 mA Pk All Devices Peak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DP751x200335x Thermal Resistance LED RθJ-PIN280°C/WJunction-to-Pin555x, K70x345YellowDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250420I F = 4 mA(Digit Average)I V mcd1300I F = 10 mA1.7I F = 4 mAForward Voltage/Segment or DP V F 1.8V I F = 5 mA A80x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK583nmDominant Wavelength[3,5]λd581.5585592.5nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinGreenDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250475I F = 4 mA(Digit Average)I V mcd1500I F = 10 mA1.9I F = 4 mAForward Voltage/Segment or DP V F 2.0V I F = 10 mA A90x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK566nmDominant Wavelength[3,5]λd571577nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is the single wavelength which defines the color of thedevice.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. The yellow (HDSP-A800) and Green (HDSP-A900) displays are categorized for dominant wavelength. The category is designated by anumber adjacent to the luminous intensity category letter.AlGaAs RedIntensity Bin Limits (mcd)AlGaAs RedHDSP-A10xIV Bin Category Min.Max.E0.3150.520F0.4280.759G0.621 1.16H0.945 1.71I 1.40 2.56J 2.10 3.84K 3.14 5.75L 4.708.55HDSP-E10x/F10x/G10xIV Bin Category Min.Max.D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-H10x/K12xIV Bin Category Min.Max.C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50HDSP-N10xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued HERHDSP-751xIV Bin Category Min.Max.B0.1600.240C0.2000.300D0.2500.385E0.3150.520F0.4280.759G0.621 1.16HDSP-751xIV Bin Category Min.Max.B0.2400.366C0.3000.477D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-555x/K70xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued YellowHDSP-A80xIV Bin Category Min.Max.D0.2500.385E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60GreenHDSP-A90xIV Bin Category Min.Max.E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60Electrical/OpticalFor more information on electrical/optical characteristics, please see Application Note 1005.Contrast Enhancement For information on contrast enhancement, please see Application Note 1015.Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs, please refer to Application Note 1027.Note:All categories are established for classification of products. Productsmay not be available in all categories. Please contact your localAgilent representatives for further clarification/information.Color Categories/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788 6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6271 2451India, Australia, New Zealand: (+65) 6271 2394Japan: (+81 3) 3335-8152(Domestic/International), or0120-61-1280(Domestic Only)Korea: (+65) 6271 2194Malaysia, Singapore: (+65) 6271 2054Taiwan: (+65) 6271 2654Data subject to change.Copyright © 2005 Agilent Technologies, Inc.Obsoletes 5988-8412ENJanuary 19, 20055989-0080EN。