HLMP-1719F0B02中文资料

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HLMP-C517-X0000中文资料

HLMP-C517-X0000中文资料

DescriptionThese non-diffused lamps are designed to produce a bright light source and smooth radiationpattern. A slight tint is added to the lens for easy color identification.This lamp has been designed with aHLMP-C115, HLMP-C117, HLMP-C123, HLMP-C215, HLMP-C223,HLMP-C315, HLMP-C323, HLMP-C415, HLMP-C423, HLMP-C515,HLMP-C523, HLMP-C615, HLMP-C623Features•Very high intensity •Exceptional uniformity •Microtint lens for color identification•Consistent viewability All colors: AlGaAs RedHigh Efficiency Red Yellow Orange GreenEmerald Green •15° and 25° family•Tape and reel options available •Binned for color and intensity Applications•Ideal for backlighting front panels*•Used for lighting switches •Adapted for indoor and outdoor signsAgilentT-13/4 Super Ultra-Bright LED LampsData Sheet20mil lead frame, enhanced flange, and tight meniscus controls, making it compatible with radial lead automated insertion equipment.Selection GuidePart Number Luminous Intensity Iv (mcd) Color2θ1/2[1]Standoff Leads HLMP-Min.Max.DH AS AlGaAs15No C115290.0–C115-O00xx290.0–C115-OP0xx290.01000.0Yes C117-OP0xx290.01000.025No C12390.2–C123-L00xx90.2–Red15No C215138.0–C215-M00xx138.0–C215-MN0xx138.0400.025No C22390.2–C223-L00xx90.2–C223-MN0xx138.0400.0 Yellow15No C315147.0–C315-L00xx147.0–C315-LM0xx147.0424.025No C32396.2–C323-K00xx96.2–C323-KL0xx96.2294.0 Orange15No C415138.0–C415-M00xx138.0–C415-M0D0xx138.0–C415-MN0xx138.0400.025No C42390.2–C423-L00xx90.2–C423-LM0xx90.2276.0 Green15No C515170.0–C515-L00xx170.0C515-LM0xx170.0490.025No C52369.8–C523-J00xx69.8–C523-KL0xx111.7340.0 Emerald Green15No C61517.0–C615-G00xx17.0–25No C623 6.7–C623-E00xx 6.7–Part Numbering SystemHLMP - C x xx - x x x xxMechanical Options00: Bulk01: Tape & Reel, Crimped Leads02: Tape & Reel, Straight LeadsB2: Right Angle Housing, Even LeadsUQ: Ammo Pack, Horizontal LeadsColor Bin Options0: Full Color Bin DistributionD: Color Bins 4 & 5 onlyMaximum Iv Bin Options0: Open (No Maximum Limit)Others: Please refer to the Iv Bin TableMinimum Iv Bin OptionsPlease refer to the Iv Bin TableViewing Angle & Standoffs Options15: 15 Degree, without Standoffs17: 15 Degree, with Standoffs23: 25 Degree, without StandoffsColor Options1. AS AlGaAs Red2. High Efficiency Red3. Yellow4. Orange5. Green6. Emerald GreenPackage OptionsC: T-1 3/4 (5 mm)Absolute Maximum Ratings at T A = 25°CHighHighDH AS Efficiency Performance AlGaAs Red and Green and ParameterRed Orange Yellow Emerald Green Units DC Forward Current [1]30302030mA Transient Forward Current [2]500500500500mA (10 µsec Pulse)Reverse Voltage (Ir = 100 µA)5555V LED Junction Temperature 110110110110°C Operating Temperature Range –20 to +100–55 to +100–20 to +100°C Storage Temperature Range –55 to +100°CWave Soldering Temperature 250°C for 3 seconds [1.59 mm (0.063 in.) from body]Lead Solder Dipping Temperature 260°C for 5 seconds[1.59 mm (0.063 in.) from body]Notes:1. See Figure 5 for maximum current derating vs. ambient temperature.2. The transient current is the maximum nonrecurring peak current the device can withstand without damaging the LED die and wire bond.Package DimensionsHLMP-Cx15 and HLMP-Cx23HLMP-Cx17(0.039)NOTES:1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).2. LEADS ARE MILD STEEL, SOLDER DIPPED.3. AN EPOXY MENISCUS MAY EXTEND ABOUT 0.5 mm (0.020 in.) DOWN THE LEADS.± 0.20± 0.008)Electrical Characteristics at T A = 25°CForward Reverse Capacitance Speed of ResponseVoltage Breakdown C (pF)Thermalτs (ns)Vf (Volts)Vr (Volts)Vf = 0Resistance Time Constant@ If = 20 mA@ Ir = 100 µA f = 1 MHz RθJ-PIN e-t/τsPart Number Typ.Max.Min.Typ.(°C/W)Typ.HLMP-C115 1.8 2.253021030HLMP-C117HLMP-C123HLMP-C215 1.9 2.651121090HLMP-C223HLMP-C315 2.1 2.651521090HLMP-C323HLMP-C415 1.9 2.654210280HLMP-C423HLMP-C515 2.2 3.0518210260HLMP-C523HLMP-C615 2.2 3.0518210260HLMP-C623Optical Characteristics at T A = 25°CLuminous Color,ViewingIntensity Peak Dominant Angle LuminousIv (mcd)Wavelength Wavelength2θ1/2Efficacy@ 20 mA[1]λpeak (nm)λd[2] (nm)(Degrees)[3]ηvPart Number Min.Typ.Typ.Typ.Typ.(lm/w) HLMP-C1152906006456371180HLMP-C117HLMP-C1239020026HLMP-C215138300635626171459017023HLMP-C315146300583585175009617025HLMP-C415138300600602173809017023HLMP-C515170300568570205956917028HLMP-C61517455585602065662728Notes:1. The luminous intensity, Iv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not bealigned with this axis.2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the device.3. 2θ1/2 is the off-axis angle where the luminous intensity is 1/2 the on-axis intensity.Figure 1. Relative intensity vs. wavelength.Figure 2. Forward current vs. forward voltage (non-resistor lamp).Figure 3. Relative luminous intensity vs. forward current.WAVELENGTH – nmR E L A T I V E I N T E N S I T Y1.00.50I F – F O R W A R DC U R R E N T – m AV F – FORWARD VOLTAGE – VI F – F O R W A R D C U R R E N T – m AV F – FORWARD VOLTAGE – VHIGH EFFICIENCY RED, ORANGE,YELLOW, AND HIGH PERFORMANCEGREEN, EMERALD GREENR E L A T I V E L U M I N O U S I N TE N S I T Y (N O R M A L I Z E D A T 20 m A )I F – DC FORWARD CURRENT – mA R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )0I DC – DC CURRENT PER LED – mA10201.60.80.4515301.2250.20.61.01.4HER, ORANGE, YELLOW, AND HIGH PERFORMANCE GREEN, EMERALD GREENFigure 5. Maximum forward dc current vs. ambient temperature. Derating based on T j MAX = 110°C.Figure 4. Relative efficiency (luminous intensity per unit current) vs. peak current.Figure 6. Relative luminous intensity vs. angular displacement. 15 degree family.R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D A T 20 m A )0I PEAK – PEAK FORWARD CURRENT – mA0.60.8300201001.21.00.20.45020010DH As AlGaAs REDηP E A K – R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D A T 20 m A )I PEAK – PEAK FORWARD CURRENT – mAHER, ORANGE, YELLOW, HIGHPERFORMANCE GREEN, EMERALD GREENI F – F O R W A R D C U R R E NT – m AT A – AMBIENT TEMPERATURE – °C DH As AlGaAs REDI F – F O R W A R D C U R R E N T – m AT A – AMBIENT TEMPERATURE – °CHER, ORANGE, YELLOW, AND HIGH PERFORMANCE GREEN, EMERALD GREEN N O R M A L I Z E D L U M I N O U S I N T E N S I T Y10ANGULAR DISPLACEMENT – DEGREES0.80.60.50.70.2450.10.30.4403530252010515-5-10-15-20-25-30-35-40-450.9Figure 7. Relative luminous intensity vs. angular displacement. 25 degree family.Intensity Bin Limits Intensity Range (mcd)ColorBin Min.Max.L 101.5162.4M 162.4234.6N 234.6340.0O 340.0540.0P 540.0850.0Q 850.01200.0R 1200.01700.0Red/OrangeS 1700.02400.0T 2400.03400.0U 3400.04900.0V 4900.07100.0W 7100.010200.0X 10200.014800.0Y 14800.021400.0Z 21400.030900.0L 173.2250.0M 250.0360.0N 360.0510.0O 510.0800.0P 800.01250.0YellowQ 1250.01800.0R 1800.02900.0S 2900.04700.0T 4700.07200.0U 7200.011700.0V 11700.018000.0W18000.027000.0N O R M A L I Z E D L U M I N O U S I N T E N S I T Y10ANGULAR DISPLACEMENT – DEGREES0.80.60.50.70.2450.10.30.4403530252010515-5-10-15-20-25-30-35-40-450.9Intensity Bin Limits, continuedIntensity Range (mcd) Color Bin Min.Max.E7.612.0F12.019.1G19.130.7H30.749.1I49.178.5J78.5125.7K125.7201.1L201.1289.0 Green/M289.0417.0 Emerald Green N417.0680.0O680.01100.0P1100.01800.0Q1800.02700.0R2700.04300.0S4300.06800.0T6800.010800.0U10800.016000.0V16000.025000.0W25000.040000.0 Maximum tolerance for each bin limit is ± 18%.Color CategoriesLambda (nm)Color Category #Min.Max.6561.5564.55564.5567.5 Green4567.5570.53570.5573.52573.5576.51582.0584.53584.5587.0 Yellow2587.0589.54589.5592.05592.0593.01597.0599.52599.5602.03602.0604.5 Orange4604.5607.55607.5610.56610.5613.57613.5616.58616.5619.5 Tolerance for each bin limit is ± 0.5 nm.Mechanical Option MatrixMechanical Option Code Definition00Bulk Packaging, minimum increment 500 pcs/bag01Tape & Reel, crimped leads, minimum increment 1300 pcs/bag02Tape & Reel, straight leads, minimum increment 1300 pcs/bagB2Right Angle Housing, even leads, minimum increment 500 pcs/bagUQ Ammo Pack, horizontal leads, in 1K minimum incrementNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information./semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only)Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand,Philippines, Indonesia: (+65) 6755 2044Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc.Obsoletes 5965-6165ENovember 11, 20045988-2149EN。

泽安171169产品说明书

泽安171169产品说明书

Eaton 171169Eaton Moeller series xEffect - FRCmM-125 Type A RCCB.Residual current circuit breaker (RCCB), 125A, 2p, 100mA, type G/AGeneral specificationsEaton Moeller series xEffect - FRCmM-125 Type A RCCB1711694015081676538FRCMM-125/2/01-G/A 85 mm 75.5 mm 36 mm 0.28 kg RoHS conformIEC/EN 61008 ÖVE E 8601Product NameCatalog Number EANModel CodeProduct Length/Depth Product Height Product Width Product Weight Compliances CertificationsTwo-poleShort time-delayed10 ms delayed125 A10 kA with back-up fuse 100 mAPulse-current sensitive3 kA (8/20 μs) surge-proof 240 V AC240 V440 V4 kV0.1 A0.1 A50 Hz125 A (max. admissible back-up fuse) A1250 A80 A gG/gL10 kA3 kA184 V AC - 250 V AC24000 operationsApplicationNumber of polesTripping timeAmperage RatingRated short-circuit strength Fault current rating Sensitivity typeImpulse withstand current Type Voltage rating (IEC/EN 60947-2)Rated operational voltage (Ue) - maxRated insulation voltage (Ui)Rated impulse withstand voltage (Uimp) Rated fault current - minRated fault current - maxFrequency ratingShort-circuit ratingLeakage current typeRated residual making and breaking capacity Admissible back-up fuse overload - max Rated short-time withstand current (Icw) Surge current capacityTest circuit rangePollution degreeLifespan, electricalSwitchgear for industrial and advanced commercial applicationsxEffect - Switchgear for industrial and advanced commercial applicationsFRCmM-125Residual current circuit breakersType G/A (ÖVE E 8601)45 mm235 mm (2 SU)70.5 mmDIN railQuick attachment for DIN-rail EN 50022As requiredIP20, IP40 with suitable enclosureIP20Toggle-center postitionTwin-purpose terminals1.5 mm² - 50 mm²1.5 mm² - 16 mm² (2x)1.5 mm²50 mm²1.5 mm² - 16 mm² (2x)1.5 mm² - 5 mm²1.5 mm²16 mm²Finger and hand touch safe, DGUV VS3, EN 50274 Red / green 125 A0 W18 W0 W0 W-25 °C60 °CMeets the product standard's requirements.Meets the product standard's requirements.Meets the product standard's requirements.Meets the product standard's requirements.Meets the product standard's requirements.Does not apply, since the entire switchgear needs to be evaluated.Does not apply, since the entire switchgear needs to be evaluated.Meets the product standard's requirements.Does not apply, since the entire switchgear needs to beFrameWidth in number of modular spacingsBuilt-in width (number of units)Built-in depthMounting MethodMounting positionDegree of protectionStatus indicationTerminals (top and bottom)Terminal capacity (solid wire)Connectable conductor cross section (solid-core) - min Connectable conductor cross section (solid-core) - max Terminal capacity (stranded cable)Connectable conductor cross section (multi-wired) - min Connectable conductor cross section (multi-wired) - max Terminal protectionContact position indicator color Rated operational current for specified heat dissipation (In) Heat dissipation per pole, current-dependentEquipment heat dissipation, current-dependentStatic heat dissipation, non-current-dependentHeat dissipation capacityAmbient operating temperature - minAmbient operating temperature - max10.2.2 Corrosion resistance10.2.3.1 Verification of thermal stability of enclosures10.2.3.2 Verification of resistance of insulating materials to normal heat10.2.3.3 Resist. of insul. mat. to abnormal heat/fire by internal elect. effects10.2.4 Resistance to ultra-violet (UV) radiation10.2.5 Lifting10.2.6 Mechanical impact10.2.7 Inscriptions10.3 Degree of protection of assemblies0.8 mm - 2 mm 10000 operations-25 °C60 °C25-55 °C / 90-95% relative humidity according to IEC 60068-2evaluated.Meets the product standard's requirements.Does not apply, since the entire switchgear needs to be evaluated.Does not apply, since the entire switchgear needs to be evaluated.Is the panel builder's responsibility.Is the panel builder's responsibility.Is the panel builder's responsibility.Is the panel builder's responsibility.Is the panel builder's responsibility.The panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices.Is the panel builder's responsibility. The specifications for the switchgear must be observed.Is the panel builder's responsibility. The specifications for the switchgear must be observed.The device meets the requirements, provided the information in the instruction leaflet (IL) is observed.Additional equipment possible Residual current circuit breaker eaton-rcd-application-guide-br019003en-en-us.pdf eaton-xeffect-frcmm-125-rccb-catalog-ca003020en-en-us.pdfBusbar material thickness Lifespan, mechanical Permitted storage and transport temperature - min Permitted storage and transport temperature - max Climatic proofing10.4 Clearances and creepage distances 10.5 Protection against electric shock10.6 Incorporation of switching devices and components 10.7 Internal electrical circuits and connections 10.8 Connections for external conductors 10.9.2 Power-frequency electric strength 10.9.3 Impulse withstand voltage 10.9.4 Testing of enclosures made of insulating material 10.10 Temperature rise10.11 Short-circuit rating10.12 Electromagnetic compatibility10.13 Mechanical functionFeaturesFitted with:Application notesCatalogsEaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. All Rights Reserved. Eaton is a registered trademark.All other trademarks areproperty of their respectiveowners./socialmediaInterlocking deviceShort-time delayed trippingResidual current circuit breakers FRCmM-125Type G/A (ÖVE E 8601)eaton-xeffect-industrial-switchgear-range-catalog-ca003002en-en-us.pdf DA-DC-03_FRCmMas_frcmmeaton-frcm-dimensions.jpgIL019140ZUdfs_2.dwgdfs_2.stpeaton-xeffect-frcmm-125-rccb-wiring-diagram-002.jpgFunctions Special featuresUsed with Certification reports DrawingsInstallation instructions mCAD modelWiring diagramsCurrent test marks as per inscriptionMaximum operating temperature is 60 °C: Starting at 40 °C, the max. permissible continuous current decreases by 2.2% for every 1 °C。

【运输】小型机配置中英文对照

【运输】小型机配置中英文对照
45 7870 Power Distribution Backplane电源分配背板2
46 7942 PowerVM -Standard Edition高级POWER虚拟化(标准版)8
47 9440 New AIX License Core Counter New AIX License Core Counter8
【关键字】运输
1 9117-MMA Server 1:9117 Model MMA Server 1:9117 Model MMA台1
2 265 AIX Partition Specify AIX分区指示个2
3 1120 Decline Service Agent Install Indicator拒绝安装电子服务代理指示符1
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77 1101 DVD Process No Charge DVD Process No Charge1
78 1404 VIOS Expansion Pack VIOS Expansion Pack1
79 2201 Virtual I/O Server Virtual I/O Server1
26 5680 Activation of 1GB DDR2 POWER6 Memory 1GB DDR2 POWER6内存激活个32
27 5682 Power 570 System Bezel Power 570系统面板个2
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43 6671 Power Cord (9-foot), Drawer to IBM PDU, 250V/10A电源线,2.7米(9英尺),抽屉到IBM PDU,(250伏/10安)条4

HLMP-7xxx中文资料

HLMP-7xxx中文资料

Subminiature Lamps Reliability DataDescriptionThe following cumulative test results have been obtained from testing performed at HP Optoelec-tronics Division in accordance with the latest revision of MIL- STD-883.Hewlett-Packard tests parts at the absolute maximum rated condi-tions recommended for the device. The actual performance you obtain from HP parts depends on the electrical and environmen-tal characteristics of your applica-Point Typical PerformanceStress Test Total DeviceUnits Total Failure Rate ColorsConditionsHoursTestedFailedMTBF(% /1 K Hours)Standard Red T A = 55°C, I F = 50 mA 2,658,0002,21002,658,000≤0.038%HER, Green,T A = 55°C, I F = 30 mA10,423,0007,06310,423,000≤0.010 %Emerald Green,Orange, Yellow,AS and TS AlGaAs YellowT A = 55°C, I F = 20 mA3,218,0002,0983,218,000≤0.031 %Table 1. Life TestsDemonstrated PerformanceFailure Rate PredictionThe failure rate of semiconductor devices is determined by the junction temperature of thedevice. The relationship between ambient temperature and actual junction temperature is given by the following:T J (°C) = T A (°C) + θJA P AVG where T A = ambient temperature in °CθJA = thermal resistance of junction-to-ambient in °C/wattHLMP-Pxxx, Qxxx,6xxx, 70xxtion but will probably be better than the performance outlined in Table 1.P AVG = average power dissipated in wattsThe estimated MTBF and failure rate at temperatures lower than the actual stress temperature can be determined by using anArrhenius model for temperature acceleration. Results of such calculations are shown in the table below using an activation energy of 0.43 eV (reference MIL-HDBK-217).Table 2.Point Typical Performance in Time[2]Performance[1] in Time(90%Confidence) Ambient Temp.Junction Temp.Failure Rate Failure Rate I F(°C)(°C)MTBF[1](%/1K Hours)MTBF[2](%/1K Hours) 30851053,340,0000.030 %1,451,0000.069 % 75954,782,0000.021 %2,077,0000.048 %65856,983,0000.014 %3,033,0000.033 %557510,423,0000.010 %4,527,0000.022 %456515,930,0000.006 %6,919,0000.014 %355524,986,0000.004 %10,852,0000.009 %254540,313,0000.002 %17,509,0000.006 % Notes:1.The point typical MTBF (which represents 60% confidence level) is the total device hours divided by the number offailures. In the case of zero failures, one failure is assumed for this calculation.2.The 90% confidence MTBF represents the minimum level of reliability performance which is expected from 90% of allsamples. This confidence interval is based on the statistics of the distribution of failures. The assumed distribution of failures is exponential. This particular distribution is commonly used in describing useful life failures. Refer to MIL-STD-690B for details on this methodology.3. A failure is any LED which does not emit light.Example of Failure Rate Calculation:Assume a device operating 8 hours/day, 5 days a week. The utilization factor, given 168 hours/week is:(8 hours/day) x (5 days/week) ÷ (168 hours/week) = 0.25The point failure rate per year (8760 hours) at 55°C ambient temperature is:(0.010%/1K hours) x 0.25 x (8760 hours/year) = 0.022% per yearSimilarly, 90% confidence level failure rate per year at 55°C:(0.022%/1K hours) x 0.25 x (8760 hours/year) = 0.048% per yearTable 3. Environmental TestsUnits Units Test Name Reference Test Conditions Tested Failed Infra-red solder HP application note 1028Re-flow at 235°C Peak, above1,9120Re-flow185°C for 90 sec. max.Solder Heat Resistance MIL-STD-883 Method 2003Sn 60, Pb 40, solder at 260°C for3,59605 secondsTemperature Cycle MIL-STD-883 Method 1010-55°C to 100°C, 15 min. dwell,5 min. transfer 20 cycles83080500 cycles83080 Humidity Life JIS C 7021 Method B-1185°C, 85 % RH, 10 mA, 1000 hours1,6800condition CHumidity Life JIS C 7021 Method B-1185°C, 85 % RH, 30 mA, 1000 hours1120condition CHumidity Life JIS C 7021 Method B-1185°C, 85 % RH, 20 mA, 1000 hours1120condition CPower Temperature Automotive specs.-40°C to 85°C, 15 min. dwell, 5 min.Cycle transfer, 20 mA, 5 mins. On/Off20 cycles3360500 cycles3360 Corrosion MIL-STD-883 Method 100935°C, 24 hours380 Salt AtmosphereTable 4. Mechanical TestsUnits Units Test Name Reference Test Conditions Tested Failed Mechanical Shock MIL-STD-883 Method 2002 3 shocks each X1, X2, Y1, Y2, Z1, Z2600axis, 3000 g, 0.3msec. pulseVibration Variable MIL-STD-883 Method 2007 4 cycles, 4 minute each X1, Y1, Y2600 Frequency axis at 20 g minimum, 20 to 2000 HzVibration Fatigue MIL-STD-883 Method 200532 ± 8 hours each X, Y, Z axis at 20 g600minimum, 96 hours total/go/ledFor technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or408-654-8675Far East/Australasia: Call your local HP sales office.Japan: (81 3) 3335-8152Europe: Call your local HP sales office. Data subject to change.Copyright © 1999 Hewlett-Packard Co. Obsoletes 5962-9790E5968-7069E (9/99)。

HLMP-1719F0002中文资料

HLMP-1719F0002中文资料

HLMP-7000, -7019, -7040Package DimensionsA BHLMP-1700, -1719, -1790HLMP-4700, -4719, -4740Note:1. θ1/2 is the typical off-axis angle at which the luminous intensity is half the axial luminous intensity.Part Numbering SystemHLMP-X7XX - X X X XXMechanical Option00: Bulk01: Tape & Reel, Crimped Leads02, BH: Tape & Reel, Straight LeadsA1, B1: Right Angle Housing, Uneven LeadsA2, B2: Right Angle Housing, Even LeadsFH: 2 Iv bins select with Inventory ControlColor Bin Options0: Full color bin distributionB: Color bins 2 & 3 onlyMaximum Iv Bin Options0: Open (No. max. limit)Others: Please refer to the Iv bin TableMinimum Iv Bin OptionsPlease refer to the Iv Bin TableColor Option00: GaP HER19: GaP Yellow40: GaP Green90: GaP GreenPackage Options4: T-13/4 (5 mm)1: T-1 (3 mm)Electrical/Optical Characteristics at T A = 25°CTest Symbol Description T-13/4T-1Min.Typ.Max.Units Conditions V F Forward Voltage47001700 1.7 2.0V 2 mA47191719 1.8 2.547401790 1.9 2.2V R Reverse Breakdown47001700 5.0V I R = 50 µA Voltage47191719 5.047401790 5.0λd Dominant47001700626nm Note 1 Wavelength4719171958547401790569∆λ1/2Spectral Line4700170040nmHalfwidth47191719364740179028τS Speed of Response4700170090ns471917199047401790500C Capacitance4700170011pF V F = 0,4719171915 f = 1 MHz4740179018RθJ-PIN Thermal47001700260[3]°C/W Junction to Resistance47191719290[4]Cathode Lead47401790λPEAK Peak Wavelength47001700635nm Measurement47191719583at peak47401790565ηV Luminous Efficacy47001700145lumens Note 247191719500watt47401790595Notes:1. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and represents the single wavelength which defines thecolor of the device.2. The radiant intensity, I e, in watts per steradian, may be found from the equation I e = I V/ηV, where I V is the luminous intensity incandelas and ηV is luminous efficacy in lumens/watt.3. T-13/4.4. T-1.Absolute Maximum RatingsParameterMaximum RatingUnits Power DissipationRed 24mW(Derate linearly from 92°C at 1.0 mA/°C)Yellow 36Green24DC and Peak Forward Current7mA Transient Forward Current (10 µs Pulse)[1]500mA Reverse Voltage (I R = 50 µA) 5.0VOperating Temperature Range Red/Yellow -55°C to 100°C Green-20°C to 100°CStorage Temperature Range -55°C to +100°C Lead Soldering Temperature 260°C for 5 seconds[1.6 mm (0.063 in.) from body]Note:1. The transient peak current is the maximum non-recurring peak current the devices can withstand without damaging the LED die and wire bonds. It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current.Figure 2. Forward Current vs. Forward Voltage.Figure 3. Relative Luminous Intensity vs. Forward Current.Figure 1. Relative Intensity vs. Wavelength.D C C U R RE N T – m AVOLTAGE – V624810Figure 5. Relative Luminous Intensity vs. Angular Displacement for T-1 Lamp.Figure 4. Relative Luminous Intensity vs. Angular Displacement for T-13/4 Lamp.Maximum tolerance for each bin limit is ±18%.Maximum tolerance for each bin limit is ±18%.Maximum tolerance for each bin limit is ±18%.Tolerance for each bin limit is ±0.5 nm.Mechanical Option MatrixMechanical Option Code Definition00Bulk Packaging, minimum increment 500 pcs/bag01Tape & Reel, crimped leads, min. increment 1300 pcs/bag for T-1 3/4, 1800pcs/bag for T-102Tape & Reel, straight leads, min. increment 1300 pcs/bag for T-1 3/4, 1800pcs/bag for T-1A1T-1, Right Angle Housing, uneven leads, minimum increment 500 pcs/bagA2T-1, Right Angle Housing, even leads, minimum increment 500 pcs/bagB1T-1 3/4, Right Angle Housing, uneven leads, minimum increment 500 pcs/bagB2T-1 3/4, Right Angle Housing, even leads, minimum increment 500 pcs/bagBH T-1, Tape & Reel, straight leads, minimum increment 2000 pcs/bagFH Devices that require inventory control and 2 I v bin selectR1Tape & Reel, crimped leads, reeled counter clockwise, cathode lead leavingthe reel firstNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information./semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/Interna-tional), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2003 Agilent Technologies, Inc. September 10, 20035988-8054EN。

HLMP-1450-B0000中文资料

HLMP-1450-B0000中文资料

Features•Low profile height•Small T-1 size diameter 3.18 mm (0.125 inch)•High intensity •IC compatible•Choice of 3 bright colors High Efficiency Red YellowHigh Performance GreenDescriptionThis family of diffused solid state lamps is especially suited for applications where small package size is required without sacrificing luminous intensity. The HLMP-1350 is a red tinted lamp providing a wide viewing angle. The HLMP-1450 and HLMP-1550 are similar products in yellow and green respectively.HLMP-1350, HLMP-1450, HLMP-1550Selection GuideTestTypical Viewing Luminous Intensity Iv (mcd)Condition Angle [1] (Degrees),Dominant Part Number Min.Typ.Max.(mA)2q 1/2Wavelength [2]HLMP-1350 1.3 2.310.055626HLMP-1350-C00xx 1.3 2.310.055626HLMP-1450 1.4 2.210.055585HLMP-1450-B00xx 1.4 2.210.055585HLMP-1550 1.0 3.120.055569HLMP-1550-A00xx 1.0 3.120.055569HLMP-1550-BC0xx1.62.85.220.055569Notes:1. q 1/2 is the off-axis angle at which the luminous intensity is half the axial intensity.2. The dominant wavelength, l d , is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.Package DimensionsPart Numbering SystemHLMP - x x xx - x x x xxMechanical Option00: Bulk01: Tape & Reel, Crimped Leads02: Tape & Reel, Straight LeadsColor Bin Options0: Full Color Bin DistributionMaximum Iv Bin Options0: Open (no max. limit)Others: Please refer to the Iv Bin TableMinimum Iv Bin OptionsPlease refer to the Iv Bin TableViewing Angle50: 55 degreesColor Options3: GaP HER4: GaP Yellow5: GaP GreenPackage Options1: T-1 (3 mmAbsolute Maximum RatingsParameter HER Yellow Green Units Peak Forward Current906090mA Average Forward Current252025mA DC Current302030mA Reverse Voltage555V Transient Forward Current (10 µsec Pulse)500500500µA LED Junction Temperature110110110°C Operating Temperature Range-55 to +100-55 to +100-20 to +100°C Storage Temperature Range-55 to +100Notes:1. See Figure 5 (HER/Orange), 10 (Yellow), or 15 (Green/Emerald Green) to establish pulsed operating conditions.2. For Red, Orange, and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at0.2 mA/°C.3. For Red, Orange, and Green series derate power linearly from 25°C at 1.8 mW/°C. For Yellow series derate power linearly from 50°C at 1.6 mW/°C.4. The transient peak current is the maximum nonrecurring peak current that can be applied to the device without damaging the LED die and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum Ratings.Electrical Characteristics at T A = 25°CDevice Test Symbol Description HLMP Min.Typ.Max.Units Conditions 2θ1/2Included Angle Between Half135055Deg.Note 1 Intensity Points145055155055λpeak Peak Wavelength1350635nm Note 214505831550565λd Dominant Wavelength1350626nm14505851550569∆λ1/2Spectral Line Halfwidth135040nm145036155028τs Speed of Response135090ns1450901550500C Capacitance135011pF V F = 0145015 f = 1 MHz155018RθJ-PIN Thermal Resistance1350290°C/W Junction to1450Cathode1550LeadV F Forward Voltage1350 1.6 1.9 3.0V I F = 10 mA1450 1.6 2.0 3.01550 1.6 2.1 3.0V R Reverse Breakdown Voltage1350 5.0V I R = 100 µA1450 5.01550 5.0ηv Luminous Efficacy1350145lumens/Note 31450500watt1550595Notes:1.q1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.2.The dominant wavelength, l d, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of thedevice.3.Radiant intensity, I e, in watts/steradian, may be found from the equation I e = I v/h v, where I v is the luminous intensity in candelas and h v is theluminous efficacy in lumens/watt.High Efficiency Red HLMP-1350Figure 2. Forward current vs. forward voltage characteristics.Figure 3. Relative luminous intensity vs. DC forward current.Figure 4. Relative efficiency (luminous intensity per unit current) vs. peak LEDcurrent.WAVELENGTH – nmR E L A T I V E I N T E N S I T Y1.00.50Figure 1. Relative intensity vs. wavelength.Figure 7. Forward current vs. forward voltage characteristics.Figure 8. Relative luminous intensity vs. DC forward current.Figure 9. Relative efficiency (luminous intensity per unit current) vs. peak current.Figure 16. Relative luminous intensity vs. angular displacement.Figure 15. Maximum tolerable peak current vs. pulse duration. (I DC MAX as per MAX ratings)Figure 12. Forward current vs. forward voltage characteristics.Figure 13. Relative luminous intensity vs.forward current.Figure 14. Relative efficiency (luminous intensity per unit current) vs. peak LEDcurrent.Intensity Bin LimitsIntensity Range (mcd) Color Bin Min.Max. Red C 1.5 2.4D 2.4 3.8E 3.8 6.1F 6.19.7G9.715.5H15.524.8I24.839.6J39.663.4K63.4101.5L101.5162.4M162.4234.6N234.6340.0O340.0540.0P540.0850.0Q850.01200.0R1200.01700.0S1700.02400.0T2400.03400.0U3400.04900.0V4900.07100.0W7100.010200.0X10200.014800.0Y14800.021400.0Z21400.030900.0 Maximum tolerance for each bin limit is ±18%.Intensity Bin Limits, continuedIntensity Range (mcd) Color Bin Min.Max. Yellow B 1.6 2.5C 2.5 4.0D 4.0 6.5E 6.510.3F10.316.6G16.626.5H26.542.3I42.367.7J67.7108.2K108.2173.2L173.2250.0M250.0360.0N360.0510.0O510.0800.0P800.01250.0Q1250.01800.0R1800.02900.0S2900.04700.0T4700.07200.0U7200.011700.0V11700.018000.0W18000.027000.0 Maximum tolerance for each bin limit is ±18%.Intensity Bin Limits, continuedIntensity Range (mcd) Color Bin Min.Max. Green A 1.1 1.8B 1.8 2.9C 2.9 4.7D 4.77.6E7.612.0F12.019.1G19.130.7H30.749.1I49.178.5J78.5125.7K125.7201.1L201.1289.0M289.0417.0N417.0680.0O680.01100.0P1100.01800.0Q1800.02700.0R2700.04300.0S4300.06800.0T6800.010800.0U10800.016000.0V16000.025000.0W25000.040000.0 Maximum tolerance for each bin limit is ±18%.Color CategoriesLambda (nm)Color Category #Min.Max.6561.5564.55564.5567.5 Green4567.5570.53570.5573.52573.5576.51582.0584.53584.5587.0 Yellow2587.0589.54589.5592.05592.0593.01597.0599.52599.5602.03602.0604.5 Orange4604.5607.55607.5610.56610.5613.57613.5616.58616.5619.5 Tolerance for each bin limit is ±0.5 nm.Mechanical Option MatrixMechanical Option Code Definition00Bulk Packaging,minimum increment 500 pcs/bag 01Tape & Reel, crimped leads,minimum increment 1300 pcs/bag 02Tape & Reel, straight leads,minimum increment 1300 pcs/bagPrecautions:Lead Forming•The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board.•If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at roomtemperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond.•It is recommended that tooling made to preciselyform and cut the leads to length rather than rely upon hand operation.Soldering Conditions•Care must be taken during PCB assembly and soldering process to prevent damage to LED component.•The closest LED is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoff.•Recommended soldering conditions:•Wave soldering parameter must be set andmaintained according to recommended temperature and dwell time in the solder wave. Customer isadvised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition.•If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process.•Proper handling is imperative to avoid excessive thermal stresses to LED components when heated.Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling.•Special attention must be given to board fabrication,solder masking, surface plating and lead holes size and component orientation to assure solderability.•Recommended PC board plated through hole sizes for LED component leads:Manual Solder Wave Soldering Dipping Pre-heat Temperature 105 °C Max.–Pre-heat Time 30 sec Max.–Peak Temperature 250 °C Max.260 °C Max.Dwell Time3 sec Max.5 sec Max.LED Component Plated Through Lead SizeDiagonal Hole Diameter 0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm (0.018 x 0.018 inch)(0.025 inch)(0.038 to 0.042 inch)0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm (0.020 x 0.020 inch)(0.028 inch)(0.041 to 0.045 inch)Note: Refer to application note AN1027 for more information on soldering LED components.Figure 17. Recommended wave soldering profile.BOTTOM SIDE OF PC BOARD TIME – SECONDST E M P E R A T U R E – °CTOP SIDE OF PC BOARDCONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)PREHEAT SETTING = 150°C (100°C PCB)SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)AIR KNIFE ANGLE = 40°SOLDER: SN63; FLUX: RMANOTE: ALLOW FOR BOARDS TO BESUFFICIENTL Y COOLED BEFORE EXERTING MECHANICAL FORCE.元器件交易网For product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-2811EN5989-4255EN May 31, 2006。

HLMP-PXXX中文资料

HLMP-PXXX中文资料

1-174HDome PackagesThe HLMP-6XXX Series dome lamps for use as indicators use a tinted, diffused lens to provide a wide viewing angle with a high on-off contrast ratio. High brightness lamps use anuntinted, nondiffused lens to provide a high luminous intensity within a narrow radiation pattern.ArraysThe HLMP-66XX Seriessubminiature lamp arrays are available in lengths of 3 to 8elements per array. Theluminous intensity is matched within an array to assure a 2.1to 1.0 ratio.Resistor LampsThe HLMP-6XXX Series 5 volt subminiature lamps with built in current limiting resistors are for use in applications where space is at a premium.Lead ConfigurationsAll of these devices are made by encapsulating LED chips onaxial lead frames to form molded epoxy subminiature lamppackages. A variety of package configuration options is avail-able. These include specialFeatures• Subminiature Flat Top PackageIdeal for Backlighting and Light Piping Applications • Subminiature Dome PackageDiffused Dome for Wide Viewing AngleNondiffused Dome for High Brightness • Arrays• TTL and LSTTLCompatible 5 Volt Resistor Lamps• Available in Six Colors • Ideal for Space Limited Applications • Axial Leads• Available with LeadConfigurations for Surface Mount and Through Hole PC Board MountingDescriptionFlat Top PackageThe HLMP-PXXX Series flat top lamps use an untinted, non-diffused, truncated lens toprovide a wide radiation pattern that is necessary for use in backlighting applications. The flat top lamps are also ideal for use as emitters in light pipe applications.Subminiature LED Lamps Technical Datasurface mount lead configura-tions, gull wing, yoke lead or Z-bend. Right angle lead bends at 2.54 mm (0.100 inch) and 5.08mm (0.200 inch) center spacing are available for through hole mounting. For more information refer to Standard SMT and Through Hole Lead Bend Options for Subminiature LED Lamps data sheet.HLMP-PXXX Series HLMP-QXXX Series HLMP-6XXX SeriesHLMP-70XX Series5964-9350E1-175Device Selection Guide Part Number: HLMP-XXXXPackage Dimensions(A) Flat Top LampsNOTES:1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).2. PROTRUDING SUPPORT TAB IS CONNECTED TO CATHODE LEAD.*Refer to Figure 1 for design concerns.1-176Package Dimensions (cont.)(B) Diffused and NondiffusedFigure 1. Proper Right Angle Mounting to a PC Board to Prevent Protruding Cathode Tab from Shorting to AnodeConnection.NOTES:1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).2. PROTRUDING SUPPORT TAB IS CONNECTED TO CATHODE LEAD.*Refer to Figure 1 for design concerns.(C) ArraysNOTES:1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).2. PROTRUDING SUPPORT TAB IS CONNECTED TO CATHODE LEAD.1-177DH AS High HighStandard AlGaAs Eff.Perf.EmeraldParameterRedRed Red Orange Yellow Green Green Units DC Forward Current [1]50303030203030mA Peak Forward Current [2]10003009090609090mA DC Forward Voltage 6666V (Resistor Lamps Only)Reverse Voltage (I R = 100 µA)5555555V Transient Forward Current [3]2000500500500500500500mA(10 µs Pulse)Operating Temperature Range:-55 to -40 to -55 to +100-40 to -20 to Non-Resistor Lamps +100+100+100+100°CResistor Lamps-40 to +85-20 to +85Storage Temperature Range °CFor Thru Hole Devices260°C for 5 SecondsWave Soldering Temperature [1.6 mm (0.063 in.) from body]For Surface Mount Devices:Convective IR 235°C for 90 Seconds Vapor Phase215°C for 3 MinutesAbsolute Maximum Ratings at T A = 25°C-55 to +100Notes:1. See Figure 5 for current derating vs. ambient temperature. Derating is not applicable to resistor lamps.2. Refer to Figure 6 showing Max. Tolerable Peak Current vs. Pulse Duration to establish pulsed operating conditions.3. The transient peak current is the maximum non-recurring peak current the device can withstand without failure. Do not operate these lamps at this high current.Electrical/Optical Characteristics, TA= 25°CStandard RedDeviceHLMP-Parameter Symbol Min.Typ.Max.Units Test Conditions 60000.5 1.26001Luminous Intensity[1]Iv 1.3 3.2mcd IF= 10 mA6203 to0.5 1.2 6208Forward Voltage VF 1.4 1.6 2.0V IF= 10 mAAll Reverse Breakdown VR 5.012.0V IR= 100 µAVoltageP005Included Angle Between125Half Intensity Points[2]2θ1/2Deg.All90OthersPeak WavelengthλPEAK655nmDominant Wavelength[3]λd640nmSpectral Line Half Width∆λ1/224nmAll Speed of Responseτs15nsCapacitance C100pF VF= 0; f = 1 MHzThermal Resistance RθJ-PIN 170°C/W Junction-to-CathodeLeadLuminous Efficacy[4]ηv65lm/W1-1781-179Device HLMP-ParameterSymbolMin.Typ.Max.Units Test ConditionsP102 4.020.0P1058.630.0Q10122.045.0Q105Luminous IntensityI v22.055.0mcdQ150 1.0 1.8Q155 2.04.0Q101 1.8 2.2I F = 20 mA P205/P505Forward VoltageV F1.82.2V Q101/Q105Q150/Q1551.6 1.8I F = 1 mA All Reverse Breakdown V R5.015.0V I R = 100 µA VoltageP105125Q101/Q150Included Angle Between 2θ1/290Deg.Half Intensity Points [2]Q105/Q15528Peak Wavelength λPEAK 645nm Measured at PeakDominant Wavelength [3]λd 637nm Spectral Line Half Width∆λ1/220nm AllSpeed of Response τs 30ns Exponential Time Constant; e -t/τCapacitance C 30pF V F = 0; f = 1 MHz Thermal Resistance R θJ-PIN170°C/W Junction-to Cathode Lead Luminous Efficacy [4]ηv80lm/WDH AS AlGaAs Red I F = 1 mA I F = 20 mA sDeviceHLMP-Parameter Symbol Min.Typ.Max.Units Test Conditions P202 1.0 5.0P205 1.08.06300 1.010.0IF= 10 mA6305 3.424.07000Luminous Intensity[1]Iv 0.4 1.0mcd IF= 2 mA6600 1.3 5.0VF= 5.0 Volts 66200.8 2.06653 to 1.0 3.0IF = 10 mA6658All Forward Voltage VF 1.5 1.8 3.0V IF= 10 mA(Nonresistor Lamps)66009.613.0I F mA VF= 5.0 V6620 3.5 5.0All Reverse Breakdown VR 5.030.0V IR= 100 µAVoltageP2051256305Included Angle Between2θ1/228Deg.Half Intensity Points[2]All90DiffusedPeak WavelengthλPEAK635nm Measured at PeakDominant Wavelength[3]λd626nmSpectral Line Half Width∆λ1/240nmAll Speed of Responseτs90nsCapacitance C11pF VF= 0; f = 1 MHzThermal Resistance RθJ-PIN 170°C/W Junction-to-CathodeLeadLuminous Efficacy[4]ηv 145lm/WHigh Efficiency RedForward Current(Resistor Lamps)1-180DeviceHLMP-Parameter Symbol Min.Typ.Max.Units Test Conditions P402 1.0 4.0P405Luminous Intensity Iv 1.06mcd IF= 10 mAQ400 1.08Forward Voltage VF 1.5 1.9 3.0V IF= 10 mAAll Reverse Breakdown VR 5.030.0V IR= 100 µAVoltageP405Included Angle Between125Half Intensity Points[2]2θ1/2Deg.Q40090Peak WavelengthλPEAK600nmDominant Wavelength[3]λd602nm Measured at PeakSpectral Line Half Width∆λ1/240nmAll Speed of Responseτs260nsCapacitance C4pF VF= 0; f = 1 MHzThermal Resistance RθJ-PIN 170°C/W Junction-to-CathodeLeadLuminous Efficacy[4]ηv 380lm/WOrange1-181YellowDeviceHLMP-Parameter Symbol Min.Typ.Max.Units Test Conditions P302 1.0 3.0P305 1.0 4.0IF = 10 mA6400 1.09.06405Luminous Intensity[1]Iv3.620mcd70190.40.6IF= 2 mA6700 1.4 5.0VF= 5.0 Volts 67200.9 2.06753 to 1.0 3.0IF = 10 mA6758All Forward Voltage VF 2.0 2.4V IF= 10 mA(Nonresistor Lamps)67009.613.0Forward Current IF mA VF= 5.0 V6720(Resistor Lamps) 3.5 5.0All Reverse Breakdown VR 5.050.0VVoltageP3051256405Included Angle Between2θ1/228Deg.Half Intensity Points[2]All90DiffusedPeak WavelengthλPEAK583nm Measured at PeakDominant Wavelength[3]λd585nmSpectral Line Half Width∆λ1/236nmAll Speed of Responseτs90nsCapacitance C15pF VF= 0; f = 1 MHzThermal Resistance RθJ-PIN 170°C/W Junction-to-CathodeLeadLuminous Efficacy[4]ηv500lm/W1-1821-183High Performance Green Device HLMP-ParameterSymbolMin.Typ.Max.Units Test ConditionsP502 1.0 3.0P505 1.0 5.06500 1.07.0I F = 10 mA6505 4.220.07040Luminous Intensity [1]I v0.40.6mcdI F = 2 mA 6800 1.6 5.0V F = 5.0 Volts 68200.8 2.06853 to 1.03.0I F = 10 mA 6858All Forward Voltage V F2.1 2.7VI F = 10 mA(Nonresistor Lamps)68009.613.0Forward Current I F mAV F = 5.0 V 6820(Resistor Lamps) 3.5 5.0All Reverse Breakdown V R5.050.0VI R = 100 µA VoltageP5051256505Included Angle Between 2θ1/228Deg.Half Intensity Points [2]All 90DiffusedPeak Wavelength λPEAK 565nm Dominant Wavelength [3]λd 569nm Spectral Line Half Width∆λ1/228nm AllSpeed of Response τs 500ns Capacitance C 18pF V F = 0; f = 1 MHz Thermal Resistance R θJ-PIN170°C/W Junction-to-Cathode LeadLuminous Efficacy [4]ηv595lm/WNotes:1. The luminous intensity for arrays is tested to assure a2.1 to 1.0 matching between elements. The average luminous intensity for an array determines its light output category bin. Arrays are binned for luminous intensity to allow I v matching between arrays.2. θ1/2 is the off-axis angle where the luminous intensity is half the on-axis value.3. Dominant wavelength, λd , is derived from the CIE Chromaticity Diagram and represents the single wavelength that defines the color of the device.4. Radiant intensity, I e , in watts/steradian, may be calculated from the equation I e =I v /ηv , where I v is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt.DeviceHLMP-Parameter Symbol Min.Typ.Max.Units Test ConditionsP605Luminous Intensity Iv 1.0 1.5mcd IF= 10 mAQ600 1.0 1.5Forward Voltage VF 2.2 3.0V IF= 10 mAReverse Breakdown VR 5.0V IR= 100 µAVoltageP605Included Angle Between125Half Intensity Points[2]2θ1/2Deg.Q60090Peak WavelengthλPEAK558nmDominant Wavelength[3]λd560nm Measured at PeakSpectral Line Half Width∆λ1/224nmP605/Q600Speed of Responseτs3100nsCapacitance C35pF VF= 0; f = 1 MHzThermal Resistance RθJ-PIN 170°C/W Junction-to-CathodeLeadLuminous Efficacy[4]ηv 656lm/WEmerald Green[1]Note:1. Please refer to Application Note 1061 for information comparing stnadard green and emerald green light ouptut degradation.1-1841-185Standard Red, DH As AlGaAs Red Standard Red and DH ASAlGaAs RedHigh Efficiency Red, Orange,Yellow, and High Performance GreenHER, Orange, Yellow, and High Performance Green,and Emerald GreenLow CurrentFigure 1. Relative Intensity vs. Wavelength.Figure 2. Forward Current vs. Forward Voltage. (Non-Resistor Lamp)Figure 3. Relative Luminous Intensity vs. Forward Current. (Non-Resistor Lamp)1-186Figure 4. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current (Non-Resistor Lamps).Figure 5. Maximum Forward dc Current vs. Ambient Temperature. Derating Based on T J MAX = 110°C (Non-Resistor Lamps).Figure 6. Maximum Tolerable Peak Current vs. Pulse Duration. (I DC MAX as per MAX Ratings) (Non-Resistor Lamps).Standard RedDH As AlGaAs RedStandard Red HER, Orange, Yellow, and HighPerformance GreenDH As AlGaAs RedHER, Orange, Yellow, and High Performance Green,and Emerald Green1-187Figure 9. Relative Intensity vs. Angular Displacement.Figure 7. Resistor Lamp Forward Current vs. Forward Voltage.Figure 8. Resistor Lamp Luminous Intensity vs.Forward Voltage.。

北京华美恒强产品介绍

北京华美恒强产品介绍

电话:010-82780890 传真:010-82890750 网址:
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产品型号 介质密度 信号输出
GGY200 GGY220 音叉开关 液体≥0.7kg/dm³固体≥0.5kg/dm³ GGY200:无源继电器 GGY220:电子开关,PNP/NPN , AC ,DC,高低电平输出
防爆认证
4...20mA HART 通讯协议 260℃ 螺纹,法兰,卫生型连接, 三夹头卡箍锁母压旋 Exd[ia] ⅡCT6
电话:010-82780890 传真:010-82890750 网址:
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产品型号 应用范围
测量量程 测量精度
HMGW701 HMGW702 HMGW703 雷达物(液)位计 液体及固体测量,高温高压强腐蚀性,复杂 过程条件 缆:30m/棒:6m. ±1mm
测量精度 信号输出
防爆认证
0.2%(模拟型), 0.1%FS,0.075%FS (智能型) 螺纹,锁母压旋式连接, 外螺纹旋入式连接,法兰连 接,焊接螺纹连接 ExdⅡCT5 Exia ⅡCT5
产品型号 传感器类型 应用范围 测量量程 结构特点
PMC43,PMC47 智能压力变送器 硅压阻传感器,陶瓷电容传感器 表压,负表压,绝压 最小 0~500Pa 最大 0~35MPa 全不锈钢外壳,适用于洁净条件 充油隔离膜片结构
电话:010-82780890 传真:010-82890750 网址:
3
产品型号 传感器类型 应用范围 测量量程
结构特点 过程连接
PMC73,PMC73F 智能压力变送器 硅压阻传感器 表压,负表压,绝压 0~500Pa 至 0~70MPa 0~2KPa 至 0~35MPa 压铸铝环氧喷涂,高防护等级 4...20mA HART 通讯协议
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HLMP-7000, -7019, -7040Package DimensionsA BHLMP-1700, -1719, -1790HLMP-4700, -4719, -4740Note:1. θ1/2 is the typical off-axis angle at which the luminous intensity is half the axial luminous intensity.Part Numbering SystemHLMP-X7XX - X X X XXMechanical Option00: Bulk01: Tape & Reel, Crimped Leads02, BH: Tape & Reel, Straight LeadsA1, B1: Right Angle Housing, Uneven LeadsA2, B2: Right Angle Housing, Even LeadsFH: 2 Iv bins select with Inventory ControlColor Bin Options0: Full color bin distributionB: Color bins 2 & 3 onlyMaximum Iv Bin Options0: Open (No. max. limit)Others: Please refer to the Iv bin TableMinimum Iv Bin OptionsPlease refer to the Iv Bin TableColor Option00: GaP HER19: GaP Yellow40: GaP Green90: GaP GreenPackage Options4: T-13/4 (5 mm)1: T-1 (3 mm)Electrical/Optical Characteristics at T A = 25°CTest Symbol Description T-13/4T-1Min.Typ.Max.Units Conditions V F Forward Voltage47001700 1.7 2.0V 2 mA47191719 1.8 2.547401790 1.9 2.2V R Reverse Breakdown47001700 5.0V I R = 50 µA Voltage47191719 5.047401790 5.0λd Dominant47001700626nm Note 1 Wavelength4719171958547401790569∆λ1/2Spectral Line4700170040nmHalfwidth47191719364740179028τS Speed of Response4700170090ns471917199047401790500C Capacitance4700170011pF V F = 0,4719171915 f = 1 MHz4740179018RθJ-PIN Thermal47001700260[3]°C/W Junction to Resistance47191719290[4]Cathode Lead47401790λPEAK Peak Wavelength47001700635nm Measurement47191719583at peak47401790565ηV Luminous Efficacy47001700145lumens Note 247191719500watt47401790595Notes:1. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and represents the single wavelength which defines thecolor of the device.2. The radiant intensity, I e, in watts per steradian, may be found from the equation I e = I V/ηV, where I V is the luminous intensity incandelas and ηV is luminous efficacy in lumens/watt.3. T-13/4.4. T-1.ParameterMaximum RatingUnits Power DissipationRed 24mW(Derate linearly from 92°C at 1.0 mA/°C)Yellow 36Green24DC and Peak Forward Current7mA Transient Forward Current (10 µs Pulse)[1]500mA Reverse Voltage (I R= 50 µA) 5.0VOperating Temperature Range Red/Yellow -55°C to 100°C Green-20°C to 100°CStorage Temperature Range -55°C to +100°C Lead Soldering Temperature 260°C for 5 seconds[1.6 mm (0.063 in.) from body]Note:1. The transient peak current is the maximum non-recurring peak current the devices can withstand without damaging the LED die and wire bonds. It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current.Figure 2. Forward Current vs. Forward Voltage.Figure 3. Relative Luminous Intensity vs. Forward Current.VOLTAGE – V624810Maximum tolerance for each bin limit is ±18%.Maximum tolerance for each bin limit is ±18%.Maximum tolerance for each bin limit is ±18%.Tolerance for each bin limit is ±0.5 nm.Mechanical Option MatrixMechanical Option Code Definition00Bulk Packaging, minimum increment 500 pcs/bag01Tape & Reel, crimped leads, min. increment 1300 pcs/bag for T-1 3/4, 1800pcs/bag for T-102Tape & Reel, straight leads, min. increment 1300 pcs/bag for T-1 3/4, 1800pcs/bag for T-1A1T-1, Right Angle Housing, uneven leads, minimum increment 500 pcs/bagA2T-1, Right Angle Housing, even leads, minimum increment 500 pcs/bagB1T-1 3/4, Right Angle Housing, uneven leads, minimum increment 500 pcs/bagB2T-1 3/4, Right Angle Housing, even leads, minimum increment 500 pcs/bagBH T-1, Tape & Reel, straight leads, minimum increment 2000 pcs/bagFH Devices that require inventory control and 2 I v bin selectR1Tape & Reel, crimped leads, reeled counter clockwise, cathode lead leavingthe reel firstNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information./semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/Interna-tional), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2003 Agilent Technologies, Inc. September 10, 20035988-8054EN。

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