SN54LS299FK中文资料

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SNJ54LS14FK中文资料

InputV T OutputPACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9665801Q2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 5962-9665801QCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC 5962-9665801QDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC 5962-9665801VCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC 5962-9665801VDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC JM38510/31302BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN5414J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54LS14J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSN7414D ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7414DE4ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7414DR ACTIVE SOIC D142500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7414DRE4ACTIVE SOIC D142500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7414N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN7414N3OBSOLETE PDIP N14TBD Call TI Call TISN7414NSR ACTIVE SO NS142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7414NSRE4ACTIVE SO NS142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS14D ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS14DBR ACTIVE SSOP DB142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS14DBRE4ACTIVE SSOP DB142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS14DR ACTIVE SOIC D142500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS14N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS14N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS14NE4ACTIVE PDIP N1425TBD Call TI Call TISN74LS14NSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ5414J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ5414W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54LS14FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS14J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS14W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN54LS245中文资料

SN54LS245, SN74LS245SN54LS245, SN74LS245PACKAGING INFORMATIONAddendum-Page 1(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)Addendum-Page 2(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN54LS245, SN54LS245-SP, SN74LS245 :•Catalog: SN74LS245, SN54LS245•Military: SN54LS245•Space: SN54LS245-SPNOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense Applications•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based applicationAddendum-Page 3TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LS245DBR SSOP DB 202000330.016.48.27.5 2.512.016.0Q1SN74LS245DWR SOIC DW 202000330.024.410.813.0 2.712.024.0Q1SN74LS245NSRSONS202000330.024.48.213.02.512.024.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74LS245DBR SSOP DB202000367.0367.038.0 SN74LS245DWR SOIC DW202000367.0367.045.0SN74LS245NSR SO NS202000367.0367.045.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46,latest issue,and to discontinue any product or service per JESD48,latest issue.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949requirements,mainly for automotive use.In any case of use of non-designated products,TI will not be responsible for any failure to meet ISO/TS16949.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Applications Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2014,Texas Instruments Incorporated。

54ls00芯片手册

54ls00芯片手册【最新版】目录1.54ls00 芯片概述2.54ls00 芯片的主要特性3.54ls00 芯片的引脚功能4.54ls00 芯片的内部结构5.54ls00 芯片的工作原理6.54ls00 芯片的应用实例正文一、54ls00 芯片概述54ls00 是一款 4 位同步十进制计数器，具有多种输入输出方式，可以实现多种计数功能。

该芯片主要应用于数字电路、计算机硬件、通信设备等领域。

二、54ls00 芯片的主要特性1.电源电压范围：54ls00 芯片的工作电压范围为 3V 至 30V，适应性强。

2.时钟输入：芯片有多种时钟输入方式，如 CP（时钟输入）、CLK（时钟锁存输入）等。

3.计数模式：54ls00 支持四种计数模式，分别为二进制、BCD、十进制和异步清零。

4.输出方式：芯片具有多种输出方式，如并行输出、串行输出和异步清零输出等。

三、54ls00 芯片的引脚功能1.CP（时钟输入）：输入时钟信号，用于控制计数器的计数。

2.CLK（时钟锁存输入）：输入时钟信号，用于锁存计数值。

3.EN（使能）：控制计数器的启动和停止。

4.BCD OUT（BCD 输出）：输出计数值的 BCD 编码。

5.PAR（并行输出）：输出计数值的并行信号。

6.SISO（串行输出）：输出计数值的串行信号。

7.OE（输出使能）：控制输出信号的使能。

8.MR（异步清零）：输入异步清零信号，用于清零计数值。

9.VCC（电源正极）：连接电源正极。

10.GND（电源负极）：连接电源负极。

四、54ls00 芯片的内部结构54ls00 芯片内部包含一个 4 位计数器、一个寄存器、一个译码器和多个逻辑门。

计数器用于计数输入时钟信号，寄存器用于存储计数值，译码器用于将计数值转换为 BCD 编码，逻辑门用于实现各种输入输出功能。

五、54ls00 芯片的工作原理1.当 CP（时钟输入）和 CLK（时钟锁存输入）同时为高电平时，计数器计数并锁存当前值。

SN54LS192FK中文资料

Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9558401QEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 5962-9558401QFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC 5962-9558401QFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC 76006012A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 76006012A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 7600601EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 7600601EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 7600601FA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC 7600601FA ACTIVE CFP W161TBD Call TI Level-NC-NC-NCJM38510/01309BEA OBSOLETE CDIP J16TBD Call TI Call TIJM38510/01309BEA OBSOLETE CDIP J16TBD Call TI Call TIJM38510/31508B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/31508B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/31508BEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCJM38510/31508BEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCJM38510/31508BFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NCJM38510/31508BFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NCJM38510/31508SEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCJM38510/31508SEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCJM38510/31508SFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NCJM38510/31508SFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SN54192J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54192J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54193J OBSOLETE CDIP J16TBD Call TI Call TISN54193J OBSOLETE CDIP J16TBD Call TI Call TISN54LS193J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54LS193J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN74192N OBSOLETE PDIP N16TBD Call TI Call TISN74192N OBSOLETE PDIP N16TBD Call TI Call TISN74193N OBSOLETE PDIP N16TBD Call TI Call TISN74193N OBSOLETE PDIP N16TBD Call TI Call TISN74193N3OBSOLETE PDIP N16TBD Call TI Call TISN74193N3OBSOLETE PDIP N16TBD Call TI Call TISN74LS192D OBSOLETE SOIC D16TBD Call TI Call TISN74LS192D OBSOLETE SOIC D16TBD Call TI Call TISN74LS192N OBSOLETE PDIP N16TBD Call TI Call TISN74LS192N OBSOLETE PDIP N16TBD Call TI Call TISN74LS193D ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARSN74LS193D ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARSN74LS193DE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEAROrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LS193DE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARSN74LS193DR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARSN74LS193DR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARSN74LS193DRE4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARSN74LS193DRE4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74LS193J OBSOLETE CDIP J16TBD Call TI Call TISN74LS193J OBSOLETE CDIP J16TBD Call TI Call TISN74LS193N ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS193N ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS193N3OBSOLETE PDIP N16TBD Call TI Call TISN74LS193N3OBSOLETE PDIP N16TBD Call TI Call TISN74LS193NE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS193NE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS193NSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS193NSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS193NSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS193NSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54192J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCSNJ54192J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCSNJ54192W ACTIVE CFP W161TBD Call TI Level-NC-NC-NCSNJ54192W ACTIVE CFP W161TBD Call TI Level-NC-NC-NCSNJ54193J OBSOLETE CDIP J16TBD Call TI Call TISNJ54193J OBSOLETE CDIP J16TBD Call TI Call TISNJ54193W OBSOLETE CFP W16TBD Call TI Call TISNJ54193W OBSOLETE CFP W16TBD Call TI Call TISNJ54LS193FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS193FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS193J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54LS193J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54LS193W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54LS193W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part ina new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN54LS393中文资料

Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.POST OFFICE BOX 655303 • DALLAS, TEXAS 752652POST OFFICE BOX 655303 • DALLAS, TEXAS 75265POST OFFICE BOX 655303 • DALLAS, TEXAS 752654POST OFFICE BOX 655303 • DALLAS, TEXAS 75265POST OFFICE BOX 655303 • DALLAS, TEXAS 752657 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265POST OFFICE BOX 655303 • DALLAS, TEXAS 75265PACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)7802601EA ACTIVE CDIP J 161TBD Call TI Level-NC-NC-NC 7802601FA ACTIVE CFP W 161TBD Call TI Level-NC-NC-NC 7802601FA ACTIVE CFP W 161TBD Call TI Level-NC-NC-NC JM38510/32701B2A ACTIVE LCCC FK 201TBD Call TI Level-NC-NC-NC JM38510/32701B2A ACTIVE LCCC FK 201TBD Call TI Level-NC-NC-NC JM38510/32701BEA ACTIVE CDIP J 161TBD Call TI Level-NC-NC-NC JM38510/32701BEA ACTIVE CDIP J 161TBD Call TI Level-NC-NC-NC JM38510/32702B2A ACTIVE LCCC FK 201TBD Call TI Level-NC-NC-NC JM38510/32702B2A ACTIVE LCCC FK 201TBD Call TI Level-NC-NC-NC JM38510/32702BCA ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC JM38510/32702BCA ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC JM38510/32702BDA ACTIVE CFP W 141TBD Call TI Level-NC-NC-NC JM38510/32702BDA ACTIVE CFP W 141TBD Call TI Level-NC-NC-NC JM38510/32702SCA ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC JM38510/32702SCA ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC JM38510/32702SDA ACTIVE CFP W 141TBD Call TI Level-NC-NC-NC JM38510/32702SDAACTIVE CFP W 141TBD Call TI Level-NC-NC-NC SN54393J OBSOLETE CDIP J 14TBD Call TI Call TI SN54393J OBSOLETE CDIP J 14TBD Call TI Call TISN54LS390J ACTIVE CDIP J 161TBD Call TI Level-NC-NC-NC SN54LS390J ACTIVE CDIP J 161TBD Call TI Level-NC-NC-NC SN54LS393J ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC SN54LS393J ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC SN74390N OBSOLETE PDIP N 16TBD Call TI Call TI SN74390N OBSOLETE PDIP N 16TBD Call TI Call TI SN74393N OBSOLETE PDIP N 14TBD Call TI Call TI SN74393N OBSOLETE PDIP N 14TBD Call TI Call TI SN74393N3OBSOLETE PDIP N 14TBD Call TI Call TI SN74393N3OBSOLETE PDIP N 14TBD Call TI Call TISN74LS390D ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS390D ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS390DE4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS390DE4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS390DR ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS390DR ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS390DRE4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS390DRE4ACTIVESOICD162500Green (RoHS &CU NIPDAULevel-1-260C-UNLIMPACKAGE OPTION ADDENDUM17-Oct-2005Addendum-Page 1元器件交易网Orderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)SN74LS390N ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS390N ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS390N3OBSOLETE PDIP N16TBD Call TI Call TISN74LS390N3OBSOLETE PDIP N16TBD Call TI Call TISN74LS390NE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS390NE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS390NSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS390NSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS390NSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS390NSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS393D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS393D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS393DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS393DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS393DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS393DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS393DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS393DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS393J OBSOLETE CDIP J14TBD Call TI Call TISN74LS393J OBSOLETE CDIP J14TBD Call TI Call TISN74LS393N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS393N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS393N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS393N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS393NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS393NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS393NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS393NSR ACTIVE SO NS142000Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)SN74LS393NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS393NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54393J OBSOLETE CDIP J14TBD Call TI Call TISNJ54393J OBSOLETE CDIP J14TBD Call TI Call TISNJ54393W OBSOLETE CFP W14TBD Call TI Call TISNJ54393W OBSOLETE CFP W14TBD Call TI Call TISNJ54LS390FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS390FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS390J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54LS390J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54LS390W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54LS390W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54LS393FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS393FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS393J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS393J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS393W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54LS393W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN54LS243中文资料

SN54LS590中文资料

IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。

SN54HC393FK中文资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)84100012A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 8410001CA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC 8410001DA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC JM38510/66309BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54HC393J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN74HC393D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC393DBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC393DBRE4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC393DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC393DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC393DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC393DT ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC393DTE4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC393N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74HC393N3OBSOLETE PDIP N14TBD Call TI Call TISN74HC393NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74HC393NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC393NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC393PW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC393PWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC393PWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC393PWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC393PWT ACTIVE TSSOP PW14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC393PWTE4ACTIVE TSSOP PW14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54HC393FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54HC393J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54HC393W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

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