SMP-R010-0.5中文资料
01005 Design Assembleon
©A s s e m b l éo n 1Keeping Cost per placement under control using 01005 componentsJeroen de GrootMarketing Director Assembleon AsiaOctober 13th©A s s e m bl éo n 2Market of microchips (0201 and 01005 size)Cellular phone(Board of main body)0201Small video (DSC, DVC, etc.)©A s s e m b l éo n 3Migration of microchips to modules•Component distribution (source: Murata ):–Now: 70 % of microchips on main board (30 % in modules)–Future (3-5 years from now): 60% of microchips in modules•Reasons for this migration:–Difficult to solder both microchips and large IC ’s at same board –Less RF specific competence needed–Reduced investments at manufacturer of end-products•Less specific production equipment necessary (wire bonders, FC placers, etc.)–Shorter Time-to-market (TTM)•Off-the-shelf functionality–More flexibility in mobile phone design•Diversity based on modular architecture©A s s e m b l éo n 5Design•Traces may have to pass around the component. Stencil printing•Finer grain size of the solder particles in the solder paste •The risk of blocked stencil apertures and bridging•The need for using even thinner stencils ( down to 50 µm)Inspection•Visual inspection and willbecome more difficult and repair is not possibleChallenges for ‘01005’ componentsSource: Philips CFT –February 2003Component placement•Required placement accuracy better than 50 micron (3 sigma)•Special nozzle (with an extremely small nozzle diameter)•Placement force is critical (risk of component cracking)•High resolution vision camera •Positional accuracy of feeder and tape•Measuring / correcting pick-up position Soldering•Poor solder balling.©A s s e m b l éo n 6‘01005’ process challenges•‘01005’ chip size requires thinner stencils ( down to 50 µm ) and does not fit in existing reflow process for applications with mixed components. Extra process steps would be necessary and existing lines must be adapted accordingly.•‘01005’ components can be used in modules & System InPackage (SiP) applications where all the components are small •The available process window for lead free soldering of ‘01005’ is more critical. Due to higher temperatures the risk of flux evaporation is present.©A s s e m b l éo n 9Parallel principle of operation©A s s e m b l éo n 11Factors that influence efficiency•Workload ….•Scheduled downtime–Easy to maintain systems•Unscheduled downtime–Easy to repair/replace systems•Model change–Fast to changeover systems•New product introduction–First time right systems•General operator practice and behavior–Easy to use systems•Supporting processes (e.g. logistics)•...©A s s e m b l éo n 12Requirements –01005 process•Pick process–Feeder indexing accuracy–Auto pick correction at system level•Alignment process–Alignment unit resolution•Placement process–Placement accuracy•Placement force control©A s s e m b l éo n 13Much waste material !Much waste material !©A s s e m b l éo n 19Helping you to reduce PPM levels -1©A s s e m b l éo n 20Helping you to reduce PPM levels -2©A s s e m b l éo n 21Solder Paste Pattern AlignmentGenerally component follows solderpaste offsets in both X and Y direction©A s s e m b l éo n 22Use of pattern entities as fiducialsFigure of M. Nikeshina/Pre-developmentPM1PM2Artwork recognition5.45.8 5.65.053.63.453.83.83.43.13.322.962.62.652.832.42.32.322.162.242.02Interspacing (8×200μm150μm100μm80μm60μm884SMD / cm©A s s e m b l éo n 25Placement accuracy 75 micron©A s s e m b l éo n 26Placement accuracy 50 micron©A s s e m b l éo n 28Typical process failures©A s s e m b l éo n 29Placement force control•Static Component Break Strength–The static 0201 placement force should be lower than 3N. What ’s more, according to the Murata formula, 01005 component break strength is expected to be 43.56% compared with 0201 components . This also suggests that the 01005 “static ” placement force setting should be about 1.5N or less•Impact Force Control–The dynamic behavior of the placement action can also be the cause of chip damage. Therefore, preferably, the peak of the impact force should be lower than the static placement force setting.•Board support & Board Height control–For 0201/01005 placement, it is important to control the placement impact and force, being independent from either board support system (elasticity of the placement point) or board height.settingF =©A s s e m b l éo n 32。
OV5 Homogenizer R20900010 指导手册说明书
Instruction ManualManuale di istruzioniManu el d’instructionsManual de instruccionesBedienungsanleitung指导手册OV5 HomogenizerR20900010General Information / Informazioni Generali / Informations Générales / Información General / Allgemeine Hinweise / 一般信息Before using the unit, please read the following instruction manual carefully.Prima dell’utilizzo dello strumento si raccomanda di leggere attentamente il seguente manuale operativo.Avant d’utiliser l’instrument, il est recommandé de lire atte ntivement le présent manuel d’instructions.Antes de utilizar el instrumento, le recomendamos que lea con atención el siguiente manual de funcionamiento.Bitte lesen Sie vor Inbetriebnahme des Geräts diese Bedienungsanleitung sorgfältig durch在使用本装置之前，请仔细阅读以下使用说明书。
Do not dispose of this equipment as urban waste, in accordance with EEC directive 2002/96/CE.Non smaltire l’apparecchiatura come rifiuto urbano, secondo quanto previsto dalla Direttiva 2002/96/CE.N e pas recycler l’appareil comme déchet solide urbain, conformément à la Directive 2002/96/CE.No tirar el aparato en los desechos urbanos, como exige la Directiva 2002/96/CE.Dieses Gerät unterliegt der Richtlinie 2002/96/EG und darf nicht mit dem normalen Hausmüll entsorgt werden.根据EEC指令2002/96/CE，请不要将本设备作为城市垃圾处理。
MF-RX010U-A5-0中文资料
40 °C 0.099 0.119 0.153 0.147
50 °C 0.088 0.106 0.138 0.131
60 °C 0.077 0.093 0.123 0.115
70 °C 0.066 0.080 0.109 0.099
85 °C 0.050 0.060 0.087 0.074
Product Dimensions
Min.
Max.
4.0
8.0
7.0
9.0
5.5
7.5
6.0
10.5
6.0
9.0
8.0
10.5
7.0
12.0
6.0
10.0
3.0
6.0
3.0
5.5
4.5
6.0
5.4
7.5
3.5
6.5
0.8
2.0
0.8
2.2
0.8
2.0
One Hour Post-Trip Resistance
Ohms at
23 °C
Max.
Lead Solerability ......................................................ANSI/J-STD-002 ..............................................................>95 % coverage
元器件交易网
*RoHS COMPLIANT
2R4X000112K
Features
■ Radial Leaded Devices
■ Fast tripping resettable PTCs
Z550中文资料(Intel)中文数据手册「EasyDatasheet - 矽搜」
UNLESS O THERW ISE AGREED IN W RITING BY INTEL, THE INTEL PRO DUCTS ARE NO T DESIGNED NO R INTENDED FO R ANY APPLICATIO N IN W HICH THE FAILURE O F THE INTEL PRO DUCT CO ULD CREATE A SITUATIO N W HERE PERSO NAL INJURY O R DEATH MAY O CCUR.
Contact your local Inte l sale s office or your distributor to obtain the late st spe cifications and be fore placing your product orde r. Copie s of docum ents which have an orde r num be r and are re fere nce d in this docum en
绿色机器人科技模板
续时而生
LOGO-R系列
LOGO
云系列
产品功能：高亮照明灯，具有照明功能外观简洁，小巧，方便携带多个保护电子电路,保证设备的安全LED电量指标，电量随手掌握
产品参数：○ 型 号：R400/R600/R800/R1000○ 电 芯：国标锂离子○ 输 入：USB 5V / 1A○ 输 出：USB 5V / 1A○ 容 量：4400mAh/6600mAh /8800mAh/10000mAh
绿色机器人模板
高端科技来袭
R系列移动电源
2024新品解析
L心编制而成的，希望大家下载后，能够帮助大家解决实际问题。PPT课件下载后可定制修改，请根据实际需要进行调整和使用，谢谢!
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NUC微控制器产品系列说明书
M251 Feature
。 Arm® Cortex®-M23 。 运行速度可达 48 MHz
M252 Feature
。 USB 2.0 全速设备无需外 挂晶振
M253 Feature
。 USB 2.0 全速设备无需外 挂晶振
。 高达五路 UART 。 CAN FD x1
2
Low Power
TrustZone
AEC-Q100
Market Trend
随着电子应用对低功耗或电池供电的需 求日益增加，现今的应用必须尽量降低 能源消耗，甚至在极端情况下，可能需 要倚赖单颗电池来维持长达 15 至 20 年 运转
低功耗应用情景包含手持式设备、居家、 AIoT、IIoT (工业物联网) 等应用情景， 使用范围十分广泛
(Programmable Serial I/O) • USB 2.0 全速装置无需外挂晶振 • 独立的 RTC 电源 VBAT 管脚
Highlight
• 支持 1.8 V ~ 5.5 V 串行接口，可连接不同电压 装置
*USCI: Universal Serial Control Interface Controller
C
1.8 3.3 5 M253
CU
3.3 5 M071
1.8 3.3 5 M252
U
3.3 5 M051
1.8 3.3 5 M251
3.3 5 Mini51
3.3 5 3.3 5
1.8 3.3 Nano100
M480 M460 M471 M453 M452 M451
E CU E CU
U C
U
Arm9™
01005电阻规格书
Peak : 250
5 ℃ , 5 sec 0
Pre – heat Zone : 150 to 180 ℃, 90±30 sec Soldering Zone : 230℃ or higher , 30±10 sec
11.
Storage Conditions:
Temperature : 5 to 35 ℃ Related Humidity :40 to 75% RH
Packing
Paper
Type
RR01
A
B
W
8.0±0.2
F
E
P1
P2
P0
D0
+0.1
T
0.40±0.1
0.24±0.05 0.45±0.1
3.5±0.05 1.75±0.1 2.0±0.1 2.0±0.05 4.0±0.1 ψ1.5 -0
Type RR
Package Size 01
2 mm pitch 178mm/R 10000
page 6/7
8.4
Peel –off force :
Peel –off force of paper and blister tape is in accordance with “JIS-C5202 ” that is , 0.1 to 0.7 N at a peel-off speed of 300 mm / minute.
E=
P*R
E=Rated Voltage(V) P=Rated Power(W) R=Resistance Value(Ω)
E.G. : What is RR01JTN102 the rated voltage ? RR01JTN102 P:1/32W ; R:102 = 1K Ω = 1000Ω
PMU-A-R010-2.0中文资料
Temperaturabhängigkeit des elektrischen Widerstandes von MANGANIN-Widerständentemperature dependence of the electrical resistance of MANGANIN-resistors1Widerstandswerte gemäß Reihe E6 mit den Zusatzwerten 2 und 5 verfügbarStandard resistance values according to E6 with the additional values of 2 and 51Mindestbestellwerte für abweichende Werte auf Anfrage Minimum order quantity of other values on requestMerkmale / features•5 Watt Dauerleistung5 Watt permanent power•Dauerströme bis 50 A ( 2 mOhm )constant current up to 50 Amps ( 2 mOhm )•Vier-Leiter Messwiderstand resistor with Kelvin connection •vernickelte BondflächenNickel plated bond pads•Bauteilrückseite vergoldet ( 0,2 µm typ. )reverse side covered with gold flash ( 0.2 µm typ. )•Geeignet für Löttemperaturen bis 280 °C / 30 sekoder 250 °C / 5 minmax. solder temperature up to 280 °C / 30 sec or 250 °C / 5 min•Bauteilmontage: Reflow löten auf Substratmounting: reflow soldering on substrateApplikationen / application•Meßwiderstand für Leistungshybridecurrent sensor for power hybrid applications•Frequenzumrichter / frequency converters •Leistungsmodule / power modulesLastminderungskurve power deratingat a d l a c i n h c e t /n e t a D e h c s i n h c e T e t r e w s d n a t s r e d i W s e u l a v e c n a t s i s e r m h O m 005-m h O m 2zn a r e l o T ec n a r e l o t %5,%2,%1t n e i z i f f e o k r u t a r e p m e T )r c t (t n e i c i f f e o c e r u t a r e p m e t )C °06s i b C °02(K /m p p 03<)C °06o t C °02(K /m p p 03<h c i e r e b r u t a r e p m e T e g n a r e r u t a r e p m e t e l b a c i l p p a C °041+s i b C °55-C°041+o t C °55-ti e k r a b t s a l e B yt i c a p a c d a o l W 5d n a t s r e d i w e m r äW r e r e n n I e c n a t s i s e r t a e h l a n r e t n i W /K 8<i h t R g n u n n a p s s n o i t a l o s I e g a t l o v g n i d n a t s h t i w c i r t c e l e i d CA V 001ts a l n n e N r e t n u t ät i l i b a t S )d a o l l a n i m o n (y t i l i b a t s h0002h c a n %5.0<g n u h c i e w b A h 0002r e t f a %5.0<n o i t a i v e d -40-20-1-0.50.51∆20 [%]Bestellbezeichnung / ordering example PMU-A-R010-1.0T yp type Widerstandswert resistance value T oleranz tolerance PMU-A10 mOhm1 %Lage der Bauteile im Gurt parts orientation in the tapeno i t a m r o f n i l e e r d n a e p a t /n o i t a m r o f n i t r u G n o i t a c i f i c e p s /m r o N 3-682C E I h t d i w e p a t /e t i e r b t r u G m m 61e l l o R /e l i e t u a B l h a z n A le e r r e p s t r a pf o o n 0003Standardlayout PMU-C standard layout PMU-CStandardlayout PMU-A standard layout PMU-APMU-A:Vorschlag für die Gestaltung der Löt- und Bondpads PMU-A:proposal for solder and bond pad design PMU-C:Vorschlag für die Gestaltung der Löt- und Bondpads PMU-C:proposal for solder and bond pad designKurve 1:dR/R0 nach 10.000 Zyklen<1 %mittlere Pulsleistung < 0,2 x Pcurve 1:dR/R0 after 10.000 cycles<1 %average pulse power < 0.2 x PKurve 2:dR/R0 nach 1.000.000 Zyklen<1 %mittlere Pulsleistung < 0,2 x Pcurve 2:dR/R0 after 1.000.000 cycles<1 %average pulse power < 0.2 x P。
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Lastminderungskurve power derating curve
SMP-1 / 3 Holland Road, Hurst Green, Oxted, Surrey, RH8 9AX, ENGLAND Tel: +44/01883 717988, Fax: +44/01883 712938, Email: sales@ Website:
Grenzwerte: dR/R0 nach 1.000.000 Belastungszyklen < 1 % mittlere Pulsleistung < 1/10 P0 limits: dR/R0 after 1.000.000 cycles < 1 % average pulsepower < 1/10 P0
• Meßwiderstand für Leistungshybride
current sensor for power hybrid applications
Lastminderungskurve P / PNom 1 0,75 0,5 0,25 0 0 20 40 60 80 100 120 140 160 Kontaktstellentemperatur TK / [°C] terminal temperature TK / [°C]
• Steuergeräte in der
Automobiltechnik controll systems for the automotive market
• Leistungsmodule / power modules • Frequenzumrichter / frequency converters • Schaltnetzteile / switch mode power supplies
Temperaturabhängigkeit des elektrischen Widerstandes von MANGANIN-Widerständen temperature dependence of the electrical resistance of MANGANIN-resistors
Verfügbarkeit:Muster 12/01 Serie ab 3. Quartal 02 availability: samples 12/01 series production 3rd quater02
Technische Änderungen vorbehalten - technical modifications reserved
excellent long term stability
• sehr hohe Pulsbelastbarkeit
high pulse power rating
• Bauteilmontage: Reflow -,Wellen und IR-Löten
mounting: reflow, wave and infrared soldering Applikationen / application
RHOPOINT COMPONENTS LTD
power[W]
Gurtinformation / tape and reel information
Norm / specification Gurtbreite / tape width Anzahl Bauteile (Stk.) parts per reel (pcs) DIN EN 60286-3 12 mm 10000
• Dauerströme bis 14 A ( 5mOhm )
constant current up to 14 Amps ( 5 mOhm )
• sehr kleine Bauform (2010)
extremly small size (2010)
-0.5 -1
T [oC]
• sehr gute Langzeitstabilität
Lötpadvorschlag für Reflowlötung proposal for pcb-layout ( reflow soldering ) Technische Änderungen vorbehalten - technical modifications reserved SMP-2 / 3 Holland Road, Hurst Green, Oxted, Surrey, RH8 9AX, ENGLAND Tel: +44/01883 717988, Fax: +44/01883 712938, Email: sales@ Website:
元器件交易网
Ausgabe / Issue : 17/12/2001
Precision Resistors Typ / type SMP
Technische Daten / technical data
Widerstandswerte Toleranz Temperaturkoeffizient Temperaturbereich Belastbarkeit Innerer Wärmewiderstand ( Folie / Kontakte ) Isolationsspannung Induktivität ( R = 10mOhm ) Stabilität unter Nennlast ( Kontaktstellentemp. = 95 °C ) resistance values tolerance temperature coefficient applicable temperature range load capacity internal heat resistance ( foil / terminals ) dielectric withstanding voltage inductance ( R = 10 mOhm ) tability ( nominal load ) ( Terminal temperature = 95 °C ) 5 mOhm – 1 Ohm 0.5%, 1%, 2%, 5% < ±50 ppm/K ( 20 °C bis 60 °C )* -55 °C bis +135 °C 1 Watt Rthi < 40 K/W 200 V < 10 nH Abweichung < 0.5 % nach 2000 h Deviation < 0.5 % after 2000 h < ±50 ppm/K ( 20 °C to 60 °C )* -55 °C to +1NTS LTD
元器件交易网
Ausgabe / Issue : 17/12/2001
Precision Resistors Typ / type SMP
Querschnitt cross section
Abmessungen (mm ) dimensions ( mm )
Technische Änderungen vorbehalten - technical modifications reserved SMP-3 / 3 Holland Road, Hurst Green, Oxted, Surrey, RH8 9AX, ENGLAND Tel: +44/01883 717988, Fax: +44/01883 712938, Email: sales@ Website:
10000
100
1000
10
pulse energy [J]
100
1
10
0 ,1
1
0 ,0 1
0 ,1
0 ,0 0 1
0 ,0 1 0 ,0 0 0 0 0 1
0 ,0 0 0 0 1
0 ,0 0 0 1
0 ,0 0 1
0 ,0 1
0 ,1
1
10
0 ,0 0 0 1 100
p u ls e w id t h [ s ]
RHOPOINT COMPONENTS LTD
元器件交易网
Ausgabe / Issue : 17/12/2001
Precision Resistors Typ / type SMP
Lötpadvorschlag für Wellenlötung proposal for pcb-layout ( wave soldering )
* gültig für Werte ≥ 10 mOhm Merkmale / features
valid for values ≥ 10 mOhm
• 1 Watt Dauerleistung
1 Watt permanent power
∆R/R20 [%]
1 0.5 -40 -20 20 40 60 80 100 120