EB020GD322DB0W中文资料
GD-X II使用手册说明书
9
PC 设置
(2) 待程序确认安装状态后，Next >( 下一步 ) 变为可点击状态，点击进 入下一步。如果有红色文字提示 Setup requires that the device is...， 请重开关 Sapphire III 或者重新拔插 USB 线。
连接设备 .................................................. 3 环境要求 ............................................... 4 连接数字音源 ........................................... 4 连接其他音频设备（充当前级放大器）...................... 4 连接电源 ............................................... 6 连接耳机 ............................................... 7
(3) 按提示点击 Next >( 下一步 ) 或者 Install( 安装 ) 即可。
10
PC 设置
(4) 安装过程大概需要 3 到 5 分钟。
(5) 若出现安装警告，点击“始终安装此驱动程序软件”。
11
PC 设置
(5) 安装成功时，界面会提示“Preinstallation was successful”， 即安装成功，再点击 Next>( 下一步 ) 退出即可。
附送的 USB 线缆
OTG 线缆
* 功能等同于 OTG 线缆，可在各大电商网站搜索“Lightning 至 USB 转换器”或者“iPhone OTG”等关键字购得
常见中英文菜单翻译
汤soup羹soup高汤thin soup; light soup; clear soup; consommé清汤thin soup; light soup; clear soup; consommé浓汤thick soup; pottage/potage老汤soup stock肉汤broth骨头汤bone broth肉片汤soup with meat slices黄瓜肉片汤soupwith meat and cucumberslices肉片鱼羹slicedmeat with fish paste inbroth丸子汤soup withmeat balls; pork ballssoup氽丸子soup withmeat balls; pork ballssoup肉圆粉丝汤porkballs soup with beannoodles白肺汤pork lungsoup牛肉汤beef soup羊肉汤muttonsoup鸡汤chicken soup;soup with chicken鸡块汤soup withchicken slices; soup withsliced chicken;sliced chicken soup鸡丝汤soup withshredded chicken;shredded chicken soup草菇鸡片汤slicedchicken with mushroomsin soup鸡茸玉米汤cornsoup with mincedchicken鸡茸芦笋汤asparagus soup with mashed chicken鸡茸黄鱼羹yellow croaker potage with minced chicken鸡杂汤chicken giblets soup鸡什汤chicken giblets soup蔬菜鸡什汤chicken giblets soup with vegetables鸭汤duck soup火鸭芥菜汤sliced roasted duck with leaf mustered in soup芥菜鸭汤duck soup with pickled mustard leaves鸭掌汤duck web soup竹笋鸭掌汤du ck’s feet with bamboo shoots in soup鸭肝汤duck liver soup冬菇鸭杂汤duck giblets soup with black mushrooms鸭骨菜汤duck bone soup with vegetables汤泡肫球gizzardballs in soup三鲜汤soup withfish, shrimps and porkballs红鱼汤fish soupwith tomato黄鱼羹yellowcroaker chowder鲫鱼汤soup withgold carp; gold carp soup鱼翅汤soup withshark’s fins鲍鱼汤soup withabalone; abalone soup鲍鱼鸡片汤abalone soup with slicedchicken鲍鱼芦笋汤abalone soup withasparagus干贝汤driedscallop soup; soup withdried scallops燕窝汤bird‘s nestsoup燕窝羹bird‘s nestsoup蛇羹snake soup;soup with snake酸辣汤sour andpepper hot soup豆腐汤bean－cudsoup蔬菜汤vegetablessoup榨菜汤hot pickledtuber mustard soup榨菜肉丝汤hotpickled tuber mustardsoup with shredded pork榨菜粉丝汤hotpickled tuber mustardsoup with bean noodles什锦瓜丁汤assorted meat soup withdiced white gourd鸡蛋羹steamedegg custard鸡蛋汤eggdropsoup; egg soup木须汤eggdropsoup; egg soup蛋花汤eggdropsoup; egg soup蕃茄鸡蛋汤eggsoup with tomatoes锅巴口蘑汤mushroom soup withfried rice crust白豆汤white bean soup玉米羹sweet corn soup面食cooked wheaten food面食cooked wheaten food; food made of flour馒头steamed bread; steamed bun白面馒头steamed bread; steamed bun一屉馒头 a trayful of steamed bread; a trayful of steamed buns馒子steamed bread; steamed bun馍馍steamed bread; steamed bun白面馒steamed bread; steamed bun花卷steamed twisted roll; steamed roll蒸饼steamed cake发面饼leavened pancake烙饼unleavened pancake; flapjack家常饼home－ｓｔｙｌｅpancake薄饼thin pancake荷叶饼lotus－leaf－like pancake; thinpancake锅饼thick pancake饼卷pancake roll葱花饼greenChinese onion pancake;green onion pancake炒饼fried shreddedpancake肉饼fried meat pie;meat pie馅饼fried meat pie;meat pie猪肉馅饼friedpork pie; pork pie三鲜馅饼fried piewith shredded sea foods烧饼baked sesame－seed cake芝麻烧饼bakedsesame－seed cake火烧bakedwheaten cake糖火烧bakedsweeten wheaten cake蜂糕steamedsponge cake米糕steamed ricecake; rice budding年糕New Yearcake made of glutinousrice flour凉糕steamed ricecake served cold insummer丝糕steamed corncake窝头steamed cornbread玉米饼子cornpancake煎饼thin pancakemade of millet flour;millet pancake粽子pyramid－shaped dumpling madeof glutinous rice wrappedinbamboo or reedleaves馕crusty pancake面条noodles切面noodles挂面packaged noodles拉面hand－pulled noodles抻面hand－pulled noodles方便面instant noodles即食面instant noodles通心面macaroni通心粉macaroni细通心粉spaghetti意大利式细面条spaghetti细面条spaghetti米粉条rice －flour noodles面汤water in which noodles have been boiled捞面noodles taken out of the boiling water with a strainer肉丝面noodles with shredded meat肉丝拌面noodles with shredded pork炸酱面noodles withchopped meat infried bean sauce;noodles withsoya bean paste打卤面noodles with meatslices in thickgravy;noodlesserved with thickgravy烩面stewednoodles鸡丝烩面stewed noodleswith chickenshreds凉拌面coldnoodles withsauce凉面coldnoodles withchicken shreds鸡丝凉面cold noodles withchicken shreds芝麻酱面cold noodles withsesame paste麻酱面coldnoodles withsesame paste寿面birthday noodlesa.汤面noodles soup汤面noodles soup;noodles in soup肉丝汤面noodles soup withshredded meat鸡丝汤面noodles soup withshredded chicken三鲜汤面noodles soup withshredded seafoodsb.炒面friednoodles炒面friednoodles; ChowMien肉丝炒面fried noodles withshredded meat牛肉炒面fried noodles withbeef牛肉蔬菜炒面fried noodleswith beef andvegetables鸡丝炒面fried noodles with shredded chicken虾炒面fried noodles with shrimps海鲜炒面fried noodles with sea foods海鲜蔬菜炒面fried noodles with sea foods and vegetables蔬菜炒面fried noodles with vegetables包子steamed bun with stuffing包子steamed stuffed bun; steamed bun with stuffing肉包子steamed bun with meat stuffing; steamed bun with minced pork stuffing肉包steamed bun with meat stuffing; steamed bun with minced pork stuffing猪肉包子steamed bun with pork stuffing三鲜包子steamed bunstuffed withshredded seafoods菜包子steamed bun withvegetable stuffing;steamedvegetable stuffedbun素包子steamed bun withvegetable stuffing;steamedvegetable stuffedbun豆沙包steamed bun withsweetened beanpaste;steamed bunstuffed withmashed red bean蒸包steamed bun withstuffing猪肉蒸包steamed bun withpork stuffing三鲜蒸包steamed bunstuffed withshredded seafoods小笼蒸包steamed stuffedbun by smallbamboo foodsteamer小笼包steamed stuffedbun by smallbamboo foodsteamer蒸饺steameddumpling猪肉蒸饺steamed porkdumpling三鲜蒸饺steameddumpling stuffedshredded seafoods锅贴slightly frieddumpling猪肉锅贴slightly fried porkdumpling三鲜锅贴slightly frieddumpling withshredded seafoods肉卷grilledbun with mincedpork stuffing饺子boileddumpling饺子馅stuffing for dumpling; filling for dumpling饺子皮dumpling wrapper饺子汤water in which dumplings have been boiled速冻饺子instant frozen dumpling猪肉饺子boiled pork dumpling三鲜饺子boiled dumpling with shredded sea foods水饺boiled dumpling手工水饺hand－made boiled dumpling机制水饺machine－made boiled dumpling猪肉水饺boiled pork dumpling韭菜水饺boiled dumpling with Chinese chive三鲜水饺boiled dumpling with shredded sea foods红油水饺boiled dumpling with chili/chili oil馄饨wonton; ravioli soup面球dumpling汤包steamed dumpling filled with minced meat and gravy烧卖steamed dumpling with the dough gathered at the top。
最新ED020侧发光蓝光灯珠规格书460-463.5nm
LED020侧发光蓝光规格书产品型号：YT-020B 蓝光适用于: 顺向电流 IF=20mA目录1.特性2.应用范围3.产品外观尺寸4.最大绝对标称值5.光电特性参数6.典型光电参数曲线7.编带规格8.包装方式9.BIN级范围10.可靠度实验项目及条件11.使用注意事项1、特性:1.1 封装尺寸：3.8x1.0x0.6mm1.2发光颜色：蓝色1.3胶体颜色：无色透明1.4焊接方式：回流焊1.5符合RoHS 标准2、应用范围:2.1手机按键2.2一般应用3、成品外观尺寸:备注：1．所有尺寸均以mm 为单位4、最大绝对标称值(环境温度=25℃)：5.光电特性参数(环境温度=25℃):备注：1.亮度偏差:±5％ 2.电压偏差：±0.033.主波长偏差：±16.典型光电参数曲线40IF(mA)IF(mA)80 604020Vf(V)0.020.0 40.0 60.0 80.0 Ta(°C)100.0 FIG.1 FORWARD CURRENT VS. FORWARD VOLTAGE.FIG.2 MAXIMUM FORWARD DC CURRENT VSAMBIENT TEMPERATURE(Tjmax=105 °C)Half PowerWL=150nmI (RELATIVE LUMINOUS INTENSITY)5.04.03.02.01.00.0 0.020.040.060.080.0If(mA) 100.0400600 FIG.3 RELATIVE LUMINOUS INTENSITY VS. FORWARD CURRENTFIG.4 RELATIVE LUMINOUS INTENSITY VS. WAVELENGTH.50% Power Angle:120°0°le(%)100%80%60%40%20%-90°-60°-30° 0 30° 60°0%90°FIG.5 FAR FIELD PATTERN7. 编带规格:（单位:mm ）包装数量 1000-4000pcs/卷8.包装方式:（单位:mm）9.BIN 级范围正向电压VF（公差：±0.05V）：20MA测试亮度IV（公差：±5%）：10.可靠度实验项目及条件:可靠度实验不合格判定标准：IV：衰减超过 30％VF：变化超过 20％备注：1、同一项实验结果的测试需在 2 个小时之内完成；2、测试必须在每项实验完成后、材料恢复正常环境条件下才能进行.11.使用注意事项11.1焊接SMD LED 灌封胶较软，外力易损坏发光面及塑料壳，焊接时要轻拿轻放。
OB2532中文数据手册
INV＝0V，Comp＝5V 频率抖动范围 EA 的参考电压 EA 的直流增益 最大电缆补偿电流 输出最低电平 输出最高电平 输出拑位电压电平 输出高电平时间 输出低电平时间
VDD＝16V，CL＝0.5nF VDD＝16V，CL＝0.5nF
14 +/-4 1.97 2 60 28 1 8 16 700 35 2.03
输出电流的改变。为了补偿由初级绕组电感变化而带来的改变，开关频率会被内 部环路锁存。如下面的开关频率是
FSW 1 2TDemag
(4)
而 TDemag 反比于电感，则结果是 Lp 与 Fsw 恒定，因此恒流模式下的最大输出功 率和恒定电流不会随着初级电感的改变而改变。 高达+/-10%的初级电感的改变能 够被补偿。 频率抖动对 EMI 的改善 振荡频率的调节会消除噪声。 频 OB2532 可以实现频率抖动(开关频率调节)。 谱扩展最大限度的减小了 EMI，简化了设计。 电流检测和前沿消隐 OB2532 具有逐周期流限功能，通过 CS 脚的检测电阻检测开关电流。前沿消隐 电路砍掉了功率 MOSFET 导通瞬间的电压尖峰， 以至于无需外部检测输入的 RC 滤波器。 PWM 占空周期由电流检测输入电压和误差放大器的输出电压共同决定。 门驱动 太弱的门驱动能力会产 OB2532 使用专用的门驱动器来驱动外部功率 MOSFET。 生高的传导和 MOSFET 开关损耗，而太强会产生 EMI。 一个折中的办法是使用内置的图腾柱门驱动来控制正确的输出能量。 可编程的电缆压降补偿 在 OB2532 内，通过电缆压降补偿来完成好的负载调节。INV 脚上产生的失 调电压通过内部电流流入电阻分压器。此电流反比于 COMP 引脚电压，结果是 它又反比于输出负载电流，因此电缆压降损失能够被补偿。当负载电流从满载下 INV 脚的失调电压会上升。 也可以通过调节电阻分压器来补偿被使 降到空载时， 用的各种电缆上的压降。 保护控制 好的电源系统可靠性是通过丰富的保护特性来完成的， 有逐周期流限(OCP)， VDD 拑位，软启动，和 VDD 欠压锁定(UVLO)。 VDD 由变压器辅助绕组提供。当 VDD 下降到低于 UVLO(ON) 限制时， OB2532 的输出被判断，之后转换器进入重起时序。
台达 IPC-E200 系列嵌入式系统操作手册说明书
中达电通公司版权所有如有改动,恕不另行通知238201209 0215863-56780215863-0003上海电话:(021)6301-2827武汉电话:(027)8544-8475济南电话:(0531)8690-7277乌鲁木齐电话:(0991)4678-141沈阳电话:(024)2334-16123南昌电话:(0791)8625-5010长沙电话:(0731)8549-9156郑州电话:(0371)6384-2772西安电话:(029)8836-0780长春电话:(0431)8892-5060合肥电话:(0551)6281-6777南宁电话:(0771)5879-599北京电话:(010)8225-3225成都电话:(028)8434-2075南京电话:(025)8334-6585厦门电话:(0592)5313-601天津电话:(022)2301-5082重庆电话:(023)8806-0306 杭州电话:(0571)8882-0610广州电话:(020)3879-2175太原电话:(0351)4039-475哈尔滨电话:(0451)5366-0643绵密网络 专业服务中达电通已建立了71个分支机构及服务网点，并塑建训练有素的专业团队，提供客户最满意的服务，公司技术人员能在2小时内回应您的问题，并在48小时内提供所需服务。
400 - 820 - 9595DIAVH-089AG10-012019/08/14台达嵌入式系统操作手册-IPC-E200系列版权说明©Delta Electr onics, Inc. All r ights r eser ved. 台达电子工业股份有限公司保留所有权利本使用手册编撰的所有信息内容属台达电子工业股份有限公司（以下简称「台达」）专属财产，且受到著作权法及所有法律的保护。
台达依著作权法及其他法律享有并保留一切著作权及其他法律的专属权利，非经台达事前同意，不得就本手册的部分或全部任意地仿制、拷贝、誊抄、转译或为其他利用。
dbg2000使用说明
DBG2000命令详解DBG2000定值配置文件说明（XXX_SET）装置型号：XXX-XXX（如RCS－915A）[定值类别（如装置参数）]<定值分类别（可选）>{ 定值名称符号结构位置系数典型值单位限值 } 如保护定值区号 _Set_No 2de 1 1 0 无0-14 母线编号 _Addr 6se 1 1 BUS001 无 6差动起动高定值IHcdzd 2fe 1 100 1 A 0-100额定频率 _Fn 2dc 1 1 0 Hz 50,60 自动打印 _Prn 2bh 1.0 1 0 无否,是跳闸控制字 _mode11 2xe 1 1 0021 无 1*0: 本保护投入*1: 跳I侧开关*2: 跳II侧开关*3: 跳III侧开关*4: 跳IV侧开关*5: 跳I侧母联*6: 跳II侧母联*7: 跳III，IV侧分段依此类推……[定值RAM映象]X> XXXX:XX 如 1> 0000:20[定值读写基地址]写地址:XXXXXX 如写地址:100800读地址:XXXXXX 如读地址:100400Set_Item地址:XXXXXX 如Set_Item地址:100C00[END]说明：1、定值名称长度一般不要超过10个中文字符；2、定值符号的第一个字符若为‘_’则不显示，否则跟在定值名称后一并显示；3、数据结构：第一个字节: 本定值所占字节数第二个字节: d—整型数，f—浮点数，s—ASCII字符，b—位变量，x—十六进制控制字第三个字节: e—编辑对话框，c—下拉可选框，h—控制字选择框4、对于非位变量，定值位置为单个整数，表示该定值类别所处定值RAM映象中的区号；而对于非位变量，定值位置为X.XX类型，小数点前的整数同样表示该定值类别所处定值RAM映象中的区号，而小数点后的整数则表示该位在控制字中所处的位置。
（程序中遇到X.0则新开一控制字变量）；5、定值系数是指实际定值与EEPROM中实际存储定值之间的倍数；6、典型值为保护中的常用合理定值，是为方便调试人员在调试新板时整定定值所设（程序中有“读取典型定值”按钮），注意：下拉可选框的典型值为限值的顺序数（从0开始）；7、定值如果没有单位，则应将定值单位整定为“无”；8、对于整型数或浮点数的编辑框控件，定值限值为“XX.XX－XX.XX”，即从定值的最小值到最大值；对于字符串的编辑框控件，定值限值为一个整数，即该定值所允许的最大字符个数；对于下拉可选框控件，定值限值为一组数据或字符，“XX,XX,…,XX”；9、在十六进制控制字后应紧跟该控制字的位定义，格式为，“*X：该位的描述或定义”，其中X为该定义项在控制字中所处位置；10、定值RAM映象为定值读取的偏移地址和个数“x> XXXX:XX”，其中x为区号，XXXX为该区的偏移地址，XX为该区的内存读取个数（十六进制数），注意对于模拟量为字个数；而对于开关量为字节个数；11、定值读写基地址中写地址为SET_BUF的首地址，即定值写入的首地址；读地址为SET_DATA 的首地址，即定值读入的首地址；Set_Item地址为写定值控制字地址。
最新jstd020d(中英文对照版)资料
J-STD-020DMoisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices非密封固态表面贴装元件湿度/回流焊敏感度分级1 PURPOSE(目的）The purpose of this standard is to identify the classification level of nonhermetic solid state surface mount devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.本标准旨在识别非密封固态表面贴装元件的湿度敏感等级以便其能合适的封装，储存，作业以避免在回流和维修作业中被损伤. This standard may be used to determine what classification/preconditioning level should be used for SMD package qualification. Passing the criteria in this test method is not sufficient by itself to provide assurance of long-term reliability本标准用于判定合格的SMT封装应使用何种等级/预处理水平.依据本测试方法且通过对应判定标准的元件并不能保证其长期可靠性1.1 Scope（范围）This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means plastic encapsulated surface mount packages and other packages made with moisture-permeable materials. The categories are intended to be used by SMD producers to inform users (board assembly operations) of the level of moisture sensitivity of their product devices, and by board assembly operations to ensure that proper handling precautions are applied to moisture/reflow sensitive devices. If no major changes have been made to a previously qualified SMD package, this method may be used for reclassification according to 4.2.此分类程序适用于所有非密封固体表面贴装元件，此部分元件由于吸收湿气而在回流焊接中容易损伤. 本文件所提及的术语“SMD”指的是塑封或本体为吸湿材料的元件.分类的目的是为了让元件制造商能告知元件使用者（PCBA组装）其产品的湿敏等级，确保元件使用者能恰当作业，如果对之前认证过的SMD封装没有重大更改，依据4.2此方法亦可用于元件的再次分类.This standard cannot address all of the possible component, board assembly and product design combinations. However, the standard does provide a test method and criteria for commonly used technologies. Where uncommon or specialized components or technologies are necessary, the development should include customer/manufacturer involvement and the criteria should include an agreed definition of product acceptance.此标准不能涵盖所有与设计，组装相关联的元件.但是，此标准为通用技术提供了一个测试方法和标准. 如果使用特殊技术或特殊元件，则需客户以及相关的制造方定义一个双方同意的产品接受标准.SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version ofJ-STD-020, JESD22-A112 (rescinded), or IPC-SM-786 (rescinded) do not need to be revision unless a change in classification level or a higher peak classification temperature is desired. Annex B provides an overview of major changes from Revision C to Revision D of this document.在使用之前版本J-STD-020，JESD22-A112（已作废），IPC-SM-786（已作废）标准中已分级的湿敏元件除非敏感等级变更或耐温峰值提高，否则无须重新分级.附件B提供了版本C升级到版本D的主要变更.Note: If the procedures in this document are used on packaged devices that are not included in this specification’s scope, the fail ure criteria for such packages must be agreed upon by the device supplier and their end user备注：当封装元件未在本标准规格范围内，如需使用此文件中的流程判定，则不良标准需元件供应商和其客户同意.1.2 Background（背景）The vapor pressure of moisture inside a nonhermetic package increases greatly when the package is exposed to the high temperature of solder reflow. Under certain conditions, this pressure can cause internal delamination of the packaging materials from the die and/or leadframe/substrate, internal cracks that do not extend to the outside of the package, bond damage, wire necking, bond lifting, die lifting, thin film cracking, or cratering beneath the bonds. In the most severe case, the stress can result in external package cracks. This iscommonly referred to as the ‘‘popcorn’’ phenomenon because the internal stress causes the package to bulge and then crack wit h an audible ‘‘pop.’’ SMDs are more susceptible to this problem than through-hole parts because they are exposed to higher temperatures during reflow soldering. The reason for this is that the soldering operation must occur on the same side of the board as the SMD device. For wave-soldered through-hole devices, the soldering operation occurs under the board that shields the devices from the hot solder through-hole devices, the soldering operation occurs under the board that shields the devices from the hot solder Throughhole devices that are soldered using intrusive soldering or ‘‘pin in paste’’ processes may experience the same type of moisture-induced failures as SMT devices.非密封元件封装在回流高温条件下，其内部水蒸气压力猛增.在某一件下，压力将导致封装从内部分层或者内裂，邦定受损。
led020侧发光中英文规格书
东莞市荧月电子科技有限公司020贴片超亮白色发光二极管020 SMD Hyper White Top LED产品型号 Model NO.YT020CW0S1版次 REV NO.:V01版文件编号Document NO.:YT-C030001日期 DATE :2015.3.1020 SMD Hyper White Top LED 020贴片超亮白色发光二极管Features 特征•Package Size ：3.8 (L) ×0.95(W) × 0.6 (T) mm 封装尺寸：3.8(长) ×0.95 (宽) ×0.6 (厚) mm •Silicone Packed 采用硅胶封装•Super long lifetime 超长寿命 •Anti UV防紫外线•White colors are available in(2200K -12000K) 可供白光(2200K-12000K) •High CRI products 高显色性产品•Wide viewing angle (2θ1/2=120°) 宽角度 (2θ1/2=120°)Applications •产品应用•Indoor lighting : Fluorescent lamp, tube •室内照明：日光灯管、灯条•Commercial illumination and displays : •商业照明显示：广告字、广告灯箱 Advertising words, light box•LCD Backlighting •LCD 背光源•Decorative lighting : light strip •装饰照明：柔性灯条 •Automotive interior auxiliary lighting•Other illumination and displays •其它照明和显示类O OTop View 顶视OOOPart No. Description 产品型号说明Packaging Description 包装编号说明:电压代码：Bin Range of Forward Voltage 亮度代码：Bin Range of Luminous Intensity 显指代码：Bin Range of RA BIN 位代码：Bin Range of bin 色温代码：Bin Range of Color CCT 型号代码：Type of LED公司代码：Yingyue -electronic CO.,LTDColor Bin Limit 色度代码;(at I F = 30 mA, T a = 25 OC )Color Bin色坐标-电特性曲线图PACKAGE OUTLINE外形尺寸(Units: mm)(mm)一、PRECAUTONS IN USE LED/使用LED注意事项；LED Soldering condition/ LED焊接条件；1：烙铁焊接：烙铁最高30W尖端温度不超过300℃；焊接时不超过3秒；焊接位至少离胶体2毫米。
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F O ambient temperature
Ordering code: MALAEB020FL210GA0W Capacitors are sleeve-insulated.
Unless otherwise specified, all electrical values apply at Ta = 20 °C, P = 80 to 120 kPa, RH = 45 to 75 %.
0.21
3.5
EB020GD310GB0W
10
8 x 18
0.10
15.90
5.50
0.07
2.0
EB020FL210JB0W
63
22
10 x 18
0.08
5.79
2.50
0.11
3.0
EB020GL222JB0W
47
10 x 25
0.08
2.71
1.17
0.19
3.5
EB020GD247JB0W
2
10 ± 0.4
25
PACKAGING QUANTITIES ENDING OF ORDERING CODE
TAPED AMMO
TAPED ON REEL
CODE
PCS.
CODE
PCS.
...B0W
500
...A0W
500
10 x 18
10.5 x 18.5
73.5 ± 1.6
15 ± 0.75
25
T ELECTRICAL DATA AND ORDERING INFORMATION - EBU
O UR N(V)
CR 100 Hz
(µF)
NOMINAL CASE SIZE
ØDxL (mm)
tan δ 100 Hz max.
RESR 100 Hz
(Ω)
Z 10 kHz max.
(Ω)
IR 100 Hz TUC, 125 °C (mA)
Leakage current (Test conditions: UR, 20 °C)
Resistance
N O T Equivalent series resistance (ESR)
After 5 minutes at UR Calculated from tan δmax.
permitted
8.4
10
1.68 1.80 1.89 1.94 2.00 2.09
11
7.1
LIFETIME MULTIPLIER L (depending on I/IR and Ta)
AMBIENT TEMPERATURE Ta [°C]
45 26 25 22 19 16 13 9.7 7.1 5.0
50 55 60 65 70 75 80 85
40/085/56 GPF
R SELECTION CHART FOR CR, UR AND RELEVANT NOMINAL CASE SIZES (Ø D x L in mm)
O EBU STYLE
CR
UR (Vdc)
F (µF)
16
40
63
10
→
8 x 18
8 x 18
22
→
8 x 18
10 x 18
ΔTο Surface temperature rise of capacitor caused by AC load [°C] L Lifetime multiplier
R ADDITIONAL ELECTRICAL DATA - EBU AND EBT
O PARAMETER
CONDITIONS
F Current
T 47
8 x 18
10 x 18
10 x 25
100
10 x 18
10 x 25
-
O 220
10 x 25
-
-
EBT STYLE
NCR
UR (Vdc/Vac)
(µF)
40/15
63/23
100/35
2.2
8 x 18
8 x 18
8 x 18
3.3
8 x 18
8 x 18
10 x 18
4.7
8 x 18
S 19 13 9.3 6.6 4.7 3.3 2.33 1.65
18 12 8.8 6.2 4.4 3.1 2.19 1.55
N 16 11 7.9 5.6 3.9 2.8 1.97 1.39
G 14 9.6 6.8 4.8 3.4 2.4 1.71 1.21
I 11 8.0 5.7 4.0 2.8 2.0 1.41 1.00
S 9.0 6.4 4.5 3.2 2.3 1.6
6.9 4.9 3.4 2.4 1.7
E 5.0 3.6 2.5 1.8 D3.5 2.5
combination not
1.86 2.00 2.10 2.16 2.23 2.33
13
4.8 3.4
2.05 2.20 2.31 2.37 2.45 2.56
Taped on reel:
RESR
Z IR TUC Ta
Note
equivalent series resistance at 100 Hz, calculated from tan δmax. and CR
R impedance at 10 kHz
rated alternating current (rms) at 100 Hz and TUC
16
3.1
W IR 100 Hz alternating current [A] at upper category temperature TUC taken from data sheet E I User current [A] N Ta Ambient temperature of capacitor [°C]
UNIT
mm µF % Vdc
• EBU with small dimensions
• EBT with low ESR values over a large frequency range
RoHS
COMPLIANT
S APPLICATIONS N • EBU for circuits with changing or unknown polarity
Useful life at 85 °C, rated direct voltage and IR, or voltages from audio frequency mixture
Useful life at 40 °C, rated direct voltage and IR, or voltages from audio frequency mixture
• EBT for audio frequency networks
SIG EBU E 10 to 220
- 10 to + 50
D6.3 to 63
8 x 18 to 10 x 25
EBT
2.2 to 22 - 15 to + 15 40 to 100
Vac
15 to 35
Category temperature range Endurance test at 85 °Cand rated direct voltage
Failure rate (0.8 UR, 40 °C) Based on sectional specification
°C h
h
W h N E10-9/h
3000
- 40 to + 85 1000
5000
70 000
110 000
≤ 90
≤ 50
IEC 60384-4/EN 130300
Climatic category IEC 60068 DIN 40040
A
ØD
L
Ø d 0.8
S S
+
N F
I G DIMENSIONS in millimeters AND PACKAGING QUANTITIES
S MAXIMUM
CASE SIZE
E D x L
SIZE Dmax. x Lmax.
A
S
F min.
D 8 x 18
8.5 x 18.5
73.5 ± 1.6
1.2
32
0.75 0.80 0.84 0.86 0.89 0.93
2.1
27
0.93 1.00 1.05 1.08 1.11 1.16
3.3
23
1.12 1.20 1.26 1.29 1.34 1.40
4.8
18
1.31 1.40 1.47 1.51 1.56 1.63
6.5
14
1.49 1.60 1.68 1.73 1.78 1.86
1
元器件交易网
EBU/EBT
Vishay Roederstein
Aluminum Capacitors Axial Non-Polar Capacitor Styles
DIMENSIONS in millimeters AND AVAILABLE FORMS
Component outlines
QUICK REFERENCE DATA
DESCRIPTION Nominal case size (Ø D x L) Rated capacitance range CR Capacitance tolerance Rated voltage range, direct voltage alternating voltage