Deformation Twinning in Nanocrystalline Aluminum

Deformation Twinning in Nanocrystalline Aluminum
Deformation Twinning in Nanocrystalline Aluminum

DOI: 10.1126/science.1083727

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that are normally FCC,such as gold,to maintain local,close-packed arrangements that are compatible with the constraints imposed by the surrounding environment.This result establishes a physically useful connection between dislocations and grain boundaries,the two most fundamental mi-crostructural elements underpinning the be-havior of polycrystalline materials.

References and Notes

1.A.P.Sutton,R.W.Balluf?,Interfaces in Crystalline Materials (Clarendon Press,Oxford,1995).

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5.H.Van Swygenhoven,Science 296,66(2002).

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A 198,205(1949).

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C.B.Carter,Scripta Mater.35,837(1996).

24.Here,we specify the boundary using the CSL notation

(25),where ?refers to the reciprocal density of coincident sites of two interpenetrating lattices re-lated by a rotation,?.

25.H.Grimmer,W.Bollmann,D.H.Warrington,Acta

Crystallogr.A30,197(1974).

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Mater.Sci.Forum 207-209,209(1996).

28.This work is supported by the U.S.Department of

Energy,in part by the Of?ce of Basic Energy Sciences,Division of Materials Sciences,under contract DE-AC04-94AL85000.

26February 2003;accepted 15April 2003

Deformation Twinning in Nanocrystalline Aluminum

Mingwei Chen,1*En Ma,2Kevin J.Hemker,1Hongwei Sheng,2

Yinmin Wang,2Xuemei Cheng 3

We report transmission electron microscope observations that provide evi-dence of deformation twinning in plastically deformed nanocrystalline alumi-num.The presence of these twins is directly related to the nanocrystalline structure,because they are not observed in coarse-grained pure aluminum.We propose a dislocation-based model to explain the preference for deformation twins and stacking faults in nanocrystalline materials.These results underscore a transition from deformation mechanisms controlled by normal slip to those controlled by partial dislocation activity when grain size decreases to tens of nanometers,and they have implications for interpreting the unusual mechanical behavior of nanocrystalline materials.The extremely high strength and hardness of nanocrystalline materials relative to their coarse-grained counterparts suggest that normal dislocation activity—the dominant plastic deformation mode of ductile coarse-grained materials—is suppressed in nanocrys-talline grains.The resulting high strength of nanocrystalline materials may give rise to unique plastic deformation mechanisms

that are not seen in coarse-grained materials (1–7).Twinning in aluminum,which has been suggested by recent molecular dynamics (MD)simulations (7,8),is an interesting case.Deformation twins have been observed in face-centered cubic (fcc)metals,such as copper and nickel (9–11),when deformed at subambient temperatures and/or high strain rates,but deformation twins have not been experimentally confirmed in single or poly-crystalline pure aluminum (7,8,11,12),even when shock-loaded at low temperatures (13,14).The appearance of Shockley partial dis-locations at a crack tip of aluminum has been regarded as an indication of deformation twinning (15),but supporting evidence for this claim has not been forthcoming.

Nanocrystalline aluminum films with thickness of ?200and ?400nm were pre-pared by physical vapor deposition of pure aluminum (99.9%)onto oxidized (001)sili-con and sodium chloride substrates that were cooled with liquid nitrogen.The deposition was performed at a pressure of ?5?10?8torr and a deposition rate of 5to 10nm/min.To suppress columnar grain structures,we interrupted the deposition for 1min at ?20-nm thickness intervals during film growth.Texture was negligible in these films,as in-dicated by x-ray diffraction analysis.The as-deposited films had grain sizes in the range of 10to 35nm (Fig.1A).High-resolution trans-mission electron microscope (HRTEM)ob-servations with a point-to-point resolution of 0.2nm revealed that most of the nanograins were separated by high-angle boundaries and

that no grain boundary phases were present in these samples.Occasionally,growth twins were observed with the twin boundary ap-pearing as a perfectly flat interface (Fig.1B).Such sharp interfaces have been previously

1

Department of Mechanical Engineering,2Depart-ment of Materials Science and Engineering,3Depart-ment of Physics and Astronomy,Johns Hopkins Uni-versity,Baltimore,MD 21218,USA.

*To whom correspondence should be addressed.E-mail:mwchen@https://www.360docs.net/doc/129179785.html,

Fig.1.Microstructure of as-prepared nanocrys-talline aluminum.(A )Bright-?eld TEM micro-graph showing nanocrystalline grains with sizes ranging from 10to 35nm.No dislocations or deformation twins can be seen.(B )HRTEM image of a growth ?3{111}twin boundary (marked by a white arrow).

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observed in deposited or annealed aluminum and have been referred to as the ?3{111}twin boundary (16,17).

The nanocrystalline aluminum films were deformed by microindentation and by manual grinding to allow the introduction of large plastic strains and to facilitate TEM observa-tions of the deformation defects.We chose these methods because the thin films cannot be tested in compression,and they fail with little plastic deformation in tension (18).The indented samples were thinned from the back using tripod polishing,dimpling,and finally low-temperature ion milling.The insert in Fig.2A shows a bright-field TEM micro-graph of a micro-indent with the fourfold

geometry.No cracks can be seen,even at the corners of the indent,indicating that the for-mation of the indent is fully plastic.Around the edges of the indent,planar defects with two parallel flat boundaries were seen in a number of grains and were identified as de-formation twins.The width and orientation of the twin bands vary from grain to grain.The twinning seems to occur preferentially in smaller grains and propagates across the en-tire grain.An example is shown in the HRTEM micrograph of Fig.2B,together with a fast Fourier transform (FFT)pattern.The deformation twin can be recognized by the mirror symmetry between the band and the matrix in the atomic resolution image,in which the bright spots correspond to individ-ual atomic columns.The twin boundaries are determined to be parallel to one set of the {111}planes.In addition,the HRTEM image reveals that the deformation twin boundaries are several atomic planes thick,caused by twinning dislocations that are tilted relative to the electron beam and not clearly imaged.A large number of dislocations rather than de-formation twinning were found in coarse-grained aluminum deformed under the same indenter as shown in Fig.2C,confirming the grain-size dependence of the twinning mechanism.

To rule out the possibility that deforma-tion twinning can only be induced under the very high pressures generated by a diamond indenter (19),we used a different deforma-tion scheme.Freestanding nanocrystalline aluminum films were released from sodium chloride substrates and manually ground into small fragments with an agate mortar and pestle in pure methanol for ?1min.This procedure is generally used to crush materials for TEM observations by applying complex stresses.These stresses are much lower than those generated by a sharp diamond indenter.The original film thickness was ?200nm,whereas the thickness of the fragments used for subsequent TEM observations was mea-sured to be less than 100nm by electron energy loss spectroscopy.The reduction in thickness appears to result from large plastic deformation,and the bright-field TEM mi-crograph in Fig.3A illustrates the features of the heavily deformed nanocrystalline alumi-num.The high density of planar defects that is shown in this figure is not seen in the as-deposited samples and is found to appear preferentially in smaller grains.Some of the defects were confirmed to be deformation twins by HRTEM.In these cases,multiple narrow twins often resided in a single grain,and the twinning planes were determined to be of the {111}type (Fig.3B).The FFT pattern of Fig.3B demonstrates the twin re-lationship among the bands and the matrix (Fig.3C).The multiple twins are highlighted in the Fourier-filtered image (Fig.3D)for

a

Fig. 2.(A )TEM micrograph of deformation twins around an indent in nanocrystalline alu-minum.The inset shows the indent with the fourfold geometry.(B )HRTEM micrograph showing a deformation twin in (A)with parallel boundaries.This atomic resolution image cor-responds to the [110]direction and illustrates the mirror symmetry between the twin and the matrix.The morphological feature of the grain boundary at the twin band indicates that the twinning results in plastic deformation.The inset shows a FFT pattern con?rming the twin relationship between the band and the matrix.(C )Dislocations with a grain boundary (GB)around an indent in coarse-grained pure alumi-num and no evidence of deformation

twinning.

Fig.3.TEM micrographs of nanocrystalline alu-minum deformed by manually grinding.(A )A high density of planar defects in a bright-?eld image.Such defects are not observed in the as-deposited nanocrystalline aluminum.(B )Multiple deformation twins and stacking faults in a [110]-oriented nanograin.(C )The FFT pat-tern showing the twin relationship among the narrow bands and matrix.(D )A Fourier-?ltered image from inside the white box in (B)for a close-up view of the deformation twins (T)and stacking faults (S).

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selected region in Fig.3B.Stacking faults,dislocations,and microbands were also ob-served in the samples.

The TEM observations provide direct experimental evidence confirming the MD predictions of twinning during plastic defor-mation of nanocrystalline aluminum (7,8).Regarding the twinning mechanism of fcc materials,several models have been proposed in which deformation twins are created by stacking faults led by 1/6?112?Shockley partial dislocations (20–23).The preference for twinning and stacking fault formation in nanocrystalline grains can be understood by comparing the critical shear stress needed to nucleate a perfect dislocation (1/2?110?)with an approximation of the source size equal to the grain size (D ),?N ,with that required to initiate the Shockley partial (1/6?112?)twinning dislocation to generate stacking faults and deformation twins,?p .Such a comparison can be made using for-mulations given by classical dislocation the-ory (22,23),where

?N ?

2??b N

D

(1)

and

?P ?

2??b P D ??b P

(2)

Here ?is the shear modulus (?35GPa for aluminum),?is the stacking fault energy [104to 142mJ/m 2for aluminum (7)],and b N and b P are the magnitudes of the Burgers vectors of the perfect dislocation and the Shockley partial dis-location,respectively.The parameter ?reflects the character of the dislocation [??0.5and 1.5for edge and screw dislocations,respectively (23)]and contains the scaling factor between the length of the dislocation source and the grain size.The grain boundaries are taken as dislocation sources,as predicted by computer simulations for nanocrystalline grains (6–8,12,24).When the grain size becomes smaller than a critical value,D c ,determined by equating Eqs.1and 2

D c ?

2??(b N ?b P )b P

?

(3)

?p becomes smaller than ?N .Taking ??1,the estimated D c is approximately 10to 15nm for aluminum.For simplicity,this model for nanocrystalline materials does not include the influence of elastic anisotropy,the small Peierls-Nabarro stress,localized stress con-centrations,and the interactions of disloca-tions with grain boundaries.Nevertheless,the predictions given by this simple model shed light on the experimentally observed trends in several ways.First,twinning becomes a pre-ferred deformation mode in aluminum with a grain size on the order of 10nm,which is consistent with our HRTEM observations of deformation twins in the grains with sizes of

?10to 20nm.The model also provides a physical explanation of the preferential gen-eration of partial dislocations,which results in the formation of stacking faults and defor-mation twins in nanocrystalline grains as sug-gested by computer simulations (6–8,12,24).Second,the ?p estimated from Eq.2is much higher than ?N in large aluminum grains,which is in agreement with the dom-inance of the normal dislocation plasticity in conventional aluminum.Third,for other fcc materials with lower ?and higher ?,the D c values are much larger and can be used to interpret the observation that deformation and growth twins are found in nanocrystalline copper and nickel (9,25–27)at D c values that are more than twice that of aluminum.Fourth,the generation of twin interfaces and stacking faults offers an alternative interpre-tation to dislocation pile-up at grain bound-aries to explain the continuous grain-size strengthening,as suggested by Eq.2,and the strain hardening of nanocrystalline materials (25–27).

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28.We thank F.R.N.Nabarro for valuable discussion.

This work was partially supported by the NSF (Divi-sion of Material Research grant 210215)and was conducted at the Electron Microscopy Center at Johns Hopkins University.The Johns Hopkins Electron Microscopy Facility is made possible by grants from the W.M.Keck Foundation and NSF.

21February 2003;accepted 4April 2003Published online 24April 2003;10.1126/science.1083727

Include this information when citing this paper.

n -Type Conducting CdSe Nanocrystal Solids

Dong Yu,Congjun Wang,Philippe Guyot-Sionnest*

A bottleneck limiting the widespread application of semiconductor nanocrystal solids is their poor conductivity.We report that the conductivity of thin ?lms of n -type CdSe nanocrystals increases by many orders of magnitude as the occupation of the ?rst two electronic shells,1S e and 1P e ,increases,either by potassium or electrochemical doping.Around half-?lling of the 1S e shell,a peak in the conductivity is observed,indicating shell-to-shell transport.Introducing conjugated ligands between nanocrystals increases the conductivities of these states to ?10?2siemens per centimeter.During the past decade,it has become appar-ent that solids of monodispersed nanocrystals provide the opportunity for developing mate-rials with novel properties (1,2).In particu-lar,semiconductor nanocrystals (3)offer

great promise for fabricating optoelectrical devices (4–6).In these “artificial atoms,”the inorganic cores allow precise tuning of the discrete electronic states by size confinement.To stabilize against sintering,retain solubili-ty,and maintain good optical properties,the surfaces are capped by organic ligands,as in the prototypical CdSe system (7).However,these ligands and traps on the nanocrystal surfaces are thought to inhibit electronic

James Franck Institute,University of Chicago,5640South Ellis Avenue,Chicago,IL 60637,USA.*To whom correspondence should be addressed.E-mail:pgs@https://www.360docs.net/doc/129179785.html,

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程序设计基础实践课目标要求

程序设计基础 课程实践目标要求 一、课程实践目标 程序设计基础课程实践是督促和检验学生程序设计综合能力的教学环节,通过课程实践使学生综合使用所学过的C语言程序设计知识,掌握结构化程序设计的基本思路和方法,在所掌握的基本知识和技能的基础上,进一步提高自学能力和查找资料的能力,解决一定程度的复杂的结构化程序设计问题,加深对所学知识的理解与掌握,增强学生利用自己所学知识解决实际问题的能力,为以后的程序开发打下基础。 课程实践的目的和要求: 1、使学生巩固和加强《C语言程序设计》课程的理论知识。 2、使学生掌握C语言的基本概念、语法、语义和数据类型的使用特点。 3、使学生掌握C语言程序设计的方法及编程技巧,能正确使用C语言编写程序。 4、进一步理解和运用结构化程序设计的思想和方法;学会利用传统流程图或N-S图表示算法。 5、使学生掌握调试程序的基本方法及上机操作方法。 6、掌握书写程序设计开发文档的能力,使学生学会撰写课程实践总结报告。课程实践的思想和方法还可以作为学生做毕业论文时的参考资料。 7、通过查阅手册和文献资料,培养学生独立分析问题和解决问题的能力。为学生做毕业设计打好基础。 8、初步掌握开发一个小型实用系统的基本方法:结合实际应用的要求,使课程实践既覆盖知识点,又接近工程实际需要。通过激发学习兴趣,调动学生主动学习的积极性,并引导他们根据实际编程要求,训练自己实际分析问题的能力及编程能力,并养成良好的编程习惯。 9、培养学生的创新能力和创新思维。学生可以根据指导书和相关文献上的参考算法,自己设计出相应的应用程序。 10、培养学生良好的程序设计风格。在实际编程中,为了提高编程质量,对空行、空格和注释均有要求。学生在课程实践书写代码时,应该严格按要求处理,以便建立良好的程序设计风格。 二、课程实践内容 1.基本要求 ⑴课程实践题目选一,可以协商合作,但每名同学必须完成每个功能函数,甚至每条语句的作用。只有了解了整个程序设计思路,每个函数、设置每条语句的作用,才达到开“计算机与程序设计语言”这门课的目的。

小学joinin剑桥英语单词汇总

JOIN IN 学生用书1 Word List Starter Unit 1.Good afternoon 下午好 2.Good evening 晚上好 3.Good morning 早上好 4.Good night 晚安 5.Stand 站立 Unit 1 6.count [kaunt] (依次)点数 7.javascript:;eight [eit] 八 8.eleven [i'levn] 十一 9.four [f?:] 四 10.five [faiv] 五 11.flag [fl?g] 旗 12.guess [ges] 猜 13.jump [d??mp] 跳 14.nine [nain] 九 15.number ['n?mb?] 数字 16.one [w?n] 一 17.seven ['sevn] 七 18.six [siks] 六 19.ten [ten] 十 20.three [θri:] 三 21.twelve [twelv] 十二 22.two [tu:] 二 23.your [ju?] 你的 24.zero ['zi?r?u] 零、你们的 Unit 2 25.black [bl?k] 黑色26.blue [blu:] 蓝色 27.car [kɑ:] 小汽车 28.colour ['k?l?] 颜色 29.door [d?:] 门 30.favourite [feiv?rit]javascript:; 特别喜爱的 31.green [gri:n] 绿色 32.jeep [d?i:p] 吉普车 33.orange ['?:rind?] 橙黄色 34.pin k [pi?k] 粉红色 35.please [pli:z] 请 36.purple ['p?:pl] 紫色 37.red [red] 红色 38.white [wait] 白色 39.yellow ['jel?u] 黄色 Unit 3 40.blackboard ['bl?kb?:d] 黑板 41.book [buk] 书 42.chair [t???] 椅子 43.desk [desk] 桌子 44.pen [pen] 钢笔 45.pencil ['pensl] 铅笔 46.pencil case [keis] 笔盒 47.ruler ['ru:l?] 尺、直尺 48.schoolbag [sku:l] 书包 49.tree [tri:] 树 50.window ['wind?u] 窗、窗口 Unit 4 51.brown [braun] 棕色 52.cat [k?t] 猫

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型 号
1N4000 1N4001 1N4002 1N4003 1N4004 1N4005 1N4006 1N4007 1N5100 1N5101 1N5102 1N5103 1N5104 1N5105 1N5106 1N5107 1N5108 1N5200 1N5201 1N5202 1N5203 1N5204 1N5205 1N5206 1N5207 1N5208 1N5400 1N5401 1N5402 1N5403 1N5404 1N5405 1N5406 1N5407 1N5408
25 50 100 200 400 600 800 1000 50 100 200 300 400 500 600 800 1000 50 100 200 300 400 500 600 800 1000 50 100 200 300 400 500 600 800 1000
1
30
≤1
<5
3
DO-41
1.5
75
≤1
<5
3
DO-15
2
100
≤1
<10
3
3
150
≤0.8
<10
3
DO-27
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1N系列稳压管

快恢复整流二极管

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G ENERAL PURPOSE RECTIFIERS – P LASTIC P ASSIVATED J UNCTION 1.0 M1 M2 M3 M4 M5 M6 M7 SMA/DO-214AC G ENERAL PURPOSE RECTIFIERS – G LASS P ASSIVATED J UNCTION S M 1.0 GS1A GS1B GS1D GS1G GS1J GS1K GS1M SMA/DO-214AC 1.0 S1A S1B S1D S1G S1J S1K S1M SMB/DO-214AA 2.0 S2A S2B S2D S2G S2J S2K S2M SMB/DO-214AA 3.0 S3A S3B S3D S3G S3J S3K S3M SMC/DO-214AB F AST RECOVERY RECTIFIERS – P LASTIC P ASSIVATED J UNCTION MERITEK ELECTRONICS CORPORATION

U LTRA FAST RECOVERY RECTIFIERS – G LASS P ASSIVATED J UNCTION

S CHOTTKY B ARRIER R ECTIFIERS

S WITCHING D IODES Power Dissipation Max Avg Rectified Current Peak Reverse Voltage Continuous Reverse Current Forward Voltage Reverse Recovery Time Package Part Number P a (mW) I o (mA) V RRM (V) I R @ V R (V) V F @ I F (mA) t rr (ns) Bulk Reel Outline 200mW 1N4148WS 200 150 100 2500 @ 75 1.0 @ 50 4 5000 SOD-323 1N4448WS 200 150 100 2500 @ 7 5 0.72/1.0 @ 5.0/100 4 5000 SOD-323 BAV16WS 200 250 100 1000 @ 7 5 0.8 6 @ 10 6 5000 SOD-323 BAV19WS 200 250 120 100 @ 100 1.0 @ 100 50 5000 SOD-323 BAV20WS 200 250 200 100 @ 150 1.0 @ 100 50 5000 SOD-323 BAV21WS 200 250 250 100 @ 200 1.0 @ 100 50 5000 SOD-323 MMBD4148W 200 150 100 2500 @ 75 1.0 @ 50 4 3000 SOT-323-1 MMBD4448W 200 150 100 2500 @ 7 5 0.72/1.0 @ 5.0/100 4 3000 SOT-323-1 BAS16W 200 250 100 1000 @ 7 5 0.8 6 @ 10 6 3000 SOT-323-1 BAS19W 200 250 120 100 @ 100 1.0 @ 100 50 3000 SOT-323-1 BAS20W 200 250 200 100 @ 150 1.0 @ 100 50 3000 SOT-323-1 BAS21W 200 250 250 100 @ 200 1.0 @ 100 50 3000 SOT-323-1 BAW56W 200 150 100 2500 @ 75 1.0 @ 50 4 3000 SOT-323-2 BAV70W 200 150 100 2500 @ 75 1.0 @ 50 4 3000 SOT-323-3 BAV99W 200 150 100 2500 @ 75 1.0 @ 50 4 3000 SOT-323-4 BAL99W 200 150 100 2500 @ 75 1.0 @ 50 4 3000 SOT-323- 5 350mW MMBD4148 350 200 100 5000 @ 75 1.0 @ 10 4 3000 SOT-23-1 MMBD4448 350 200 100 5000 @ 75 1.0 @ 10 4 3000 SOT-23-1 BAS16 350 200 100 1000 @ 75 1.0 @ 50 6 3000 SOT-23-1 BAS19 350 200 120 100 @ 120 1.0 @ 100 50 3000 SOT-23-1 BAS20 350 200 200 100 @ 150 1.0 @ 100 50 3000 SOT-23-1 BAS21 350 200 250 100 @ 200 1.0 @ 100 50 3000 SOT-23-1 BAW56 350 200 100 2500 @ 70 1.0 @ 50 4 3000 SOT-23-2 BAV70 350 200 100 5000 @ 70 1.0 @ 50 4 3000 SOT-23-3 BAV99 350 200 100 2500 @ 70 1.0 @ 50 4 3000 SOT-23-4 BAL99 350 200 100 2500 @ 70 1.0 @ 50 4 3000 SOT-23-5 BAV16W 350 200 100 1000 @ 75 0.86 @ 10 6 3000 SOD-123 410-500mW BAV19W 410 200 120 100 @ 100 1.0 @ 100 50 3000 SOD-123 BAV20W 410 200 200 100 @ 150 1.0 @ 100 50 3000 SOD-123 BAV21W 410 200 250 100 @ 200 1.0 @ 100 50 3000 SOD-123 1N4148W 410 150 100 2500 @ 75 1.0 @ 50 4 3000 SOD-123 1N4150W 410 200 50 100 @ 50 0.72/1.0 @ 5.0/100 4 3000 SOD-123 1N4448W 500 150 100 2500 @ 7 5 1.0 @ 200 4 3000 SOD-123 1N4151W 500 150 75 50 @ 50 1.0 @ 10 2 3000 SOD-123 1N914 500 200 100 25 @ 20 1.0 @ 10 4 1000 10000 DO-35 1N4148 500 200 100 25 @ 20 1.0 @ 10 4 1000 10000 DO-35 LL4148 500 150 100 25 @ 20 1.0 @ 10 4 2500 Mini-Melf SOT23-1 SOT23-2 SOT23-3 SOT23-4 SOT23-5 SOT323-1 SOT323-2 SOT323-3 SOT323-4 SOT323-5

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