台积电常用英语
台积电常用英语
台积电常用英语台积电常用英语NO. 英文中译NO. 英文中译1 FAB 工厂45 Wait 等待2 Office 办公室46 Run 执行3 Clean Room 洁净室47 Hold 暂停4 Gowning Room 更衣室48 Release Lock 解除锁定5 Air Shower 风浴49 Priority 优先顺序6 Department 部门50 Hot Run 急件7 Section 课别51 Super Hot Run 超级急件8 Location 区域名称52 Stage ID 站别编号9 Bay 间隔/隔间53 Process 制程/过程10 Manufacturing (MFG) 制造部54 Procedure 步骤/程序11 Diffusion 扩散55 Recipe 程式12 ETCH (Etcher) 蚀刻56 Quantity 数量13 PHOTO 黄光57 Load 下货;装货14 Thin Film (TF) 薄膜58 Track In Time 入帐时间15 Implant ( IMP ) 离子植入区59 Unload 收货;卸货16 Chemical VaporDeposition (CVD)化学气象沉淀60 Data Collection 资料收集17 Physics VaporDeposition (PVD)物理气象沉淀61 Result 结果18 Sputter (SPUT) 金属溅镀区62 Track Out Time 出帐时间19 CMP 晶片正面研磨区63 Scratch 刮伤20 After DevelopInspection (ADI)显影后检查64 Broken 破片21 Hood 酸槽65 Scrap 报废22 After Etch Inspection(AEI)蚀刻后检查66 Operation 操作23 Furnace 炉管67 M.O. (Miss Operation)错误操作24 Mask 光罩68 Equipment ID 机台编号25 Backside Grinding(BG)晶背研磨区69EquipmentStatus机台状态26 WAT(Wafer AcceptTest)晶片接收侦测70PM (PreventiveMaintenance)机台定期保养27 Technician (TE) 技术员71 Alarm 警鸣28 Supervisor 课长72 Comment 注解29 Equipment Engineer(EE)设备工程师73 Certify 技能认证30 Process Engineer(PE)制程工程师74 Decertify 取消认证31 General OperationRule(GOR)厂区(一般)操作规则75 Recertify 重新认证32 Area Operation Rule(AOR)区域操作规则76 Automation 自动化33 Standard OperationProcedure(SOP)标准操作流程77 Add 增加34 Operation Index(OI) 操作准则78 Delete 删除35 Temporary EngineerChange Notice(TECN)临时工程变更通知单79 Move 移动36 Production Notice(PN)制造通报80 Remove 移除37 Log Sheet 工作记录单81 Abort 放弃/中止38 Wafer 晶片82 Cancel 取消/废除39 Wafer transfer 晶片转换83 Close 关闭视窗40 Sorter 晶片分类机84 Inform 通知41 Computer IntegrateManufacture(CIM)电脑整合制造85 Confirm 确认42 ON-Line 与电脑连线86 Copy 副本/复制43 OFF-Line 不与电脑连线87 Query 查询44 Password 密码88 Reserve 预约89 GUI(Graphic ofUser Interface)图象使用者介面104 UnReserve 取消预约90 OPI (OperatorInterface)操作介面105 Backup 备用91 Rework 重做106 Destination 取货地点92 e-Runcard 电子化流程卡107 Receive 接收93 Housekeeping 环境整理108 Slow 慢94 Split 分批109 Start 开始95 Child Lot ID 子批批号110 Stop 停止96 Recover Runcard 复机制程更改单111 Success 成功97 Runcard 流程卡112 Due Date 到期日98 OCAP(Out of control actionplan)异常状况处理单113 Finish Date 完成日期99 Monitor 测机114 Yield 良率100 Power 电源115 Lot ID 批号101 Hallway 自动搬运系统116 Lot Dispatch 派工102 Lot Box 晶盒117 Merge 合并103 Lot 批货118 Cassette 晶舟。
电子厂常用英语
电子厂常用英语在电子厂工作，掌握一些常用的英语词汇和表达方式是非常重要的。
这不仅有助于提高工作效率，还能促进与国际团队的沟通。
以下是一些电子厂中常用的英语词汇和表达：1. 组件（Component）：电子厂中的基本单元，如电阻（Resistor）、电容（Capacitor）、晶体管（Transistor）等。
2. 电路板（Circuit Board）：用于组装电子组件的基板，常见的有印刷电路板（Printed Circuit Board, PCB）。
3. 焊接（Soldering）：将电子组件固定在电路板上的过程。
4. 测试（Testing）：对电子设备进行功能和性能的检验，确保其符合设计要求。
5. 质量控制（Quality Control）：确保产品符合质量标准的过程。
6. 故障诊断（Troubleshooting）：识别并解决电子设备中的问题。
7. 维修（Maintenance）：定期检查和修复电子设备，以保持其良好运行状态。
8. 生产线（Assembly Line）：用于组装电子设备的流水线。
9. 库存管理（Inventory Management）：跟踪和管理电子厂中的物料和成品。
10. 供应链（Supply Chain）：涉及原材料采购、生产、分销和销售的整个流程。
11. 环境控制（Environmental Control）：确保电子厂的生产环境符合安全和健康标准。
12. 工艺流程（Process Flow）：描述电子设备生产过程中的各个步骤。
13. 产品生命周期（Product Life Cycle）：从产品开发到市场退出的整个过程。
14. 技术规格（Technical Specifications）：详细描述电子设备性能和功能的文档。
15. 项目管理（Project Management）：规划、组织和监督电子项目从开始到结束的全过程。
16. 持续改进（Continuous Improvement）：不断寻找提高生产效率和产品质量的方法。
集成电路专业英语
集成电路专业英语一、单词1. Integrated Circuit (IC)- 英语释义：A set of electronic circuits on one small flat piece (chip) of semiconductor material, typically silicon.- 用法：常作为名词短语使用，可在句中作主语、宾语等。
例如：The development of integrated circuits has revolutionized the electronics industry.（集成电路的发展使电子工业发生了革命性的变化。
）2. Semiconductor- 英语释义：A material which has a conductivity between that of an insulator and that of most metals, either due to the addition of an impurity or because of temperature effects.- 用法：作名词，例如：Silicon is a widely used semiconductor in integrated circuit manufacturing.（硅是集成电路制造中广泛使用的半导体。
）3. Transistor- 英语释义：A semiconductor device used to amplify or switch electronic signals and electrical power.- 用法：作名词，如：The transistor is a keyponent in integrated circuits.（晶体管是集成电路中的一个关键元件。
）4. Chip- 英语释义：A small piece of semiconducting material (usually silicon) on which an integrated circuit is fabricated.- 用法：作名词，可指集成电路芯片。
电子产品常用英文词汇
电子产品常用英文词汇一、常见电子电气类英文单词1.功率power2.电压voltage3.电流current4.频率frequency5.效率efficiency6.波形waveform7.交流alternating-current8.直流direct-current9.适配器 adaptor10. 转换器 converter11. 逆变器 inverter12. 充电器 charger13. 控制器 controller14. 启动器 jump starter15. 器件device16. 元件component17. 电容器capacitor18. 电阻resistor19. 电感inductor20. 二极管diode21. 稳压二极管 zener22. 三极管audion23. 场效应管 MOSFEET(Metel-Oxide-Semiconductor Field Effect Transistor)24. 变压器 transformer25. 光藕 optical coupler26. 保险丝 fuse27. 半导体semiconductor28. 瓷片电容 ceramic capacitor29. 电解电容 electrolytic C30. 电感 inductance31. 电容 capacitance32. 电阻 resistance33. 感性的 inductive34. 容性的 capacitive35. 阻性的 resistive36. 阻抗impedance37. 纯正弦波 pure sine wave38. 修正正弦波 modified sine wave39. 方波 square wave40. 恒流源 constant current source41. 恒压源 constant voltage source42. 纹波电流 ripple current43. 涌入电流 inrush current44. 空载电流 no-load current45. 电网 power system46. 死区时间dead time47. 浮充电压 float charge voltage48. 正向电压forward voltage drop49. 续流二极管 freewheel diode50. 肖特基二极管 schottky51. 整流桥 bridge rectifier52. 超快速整流器 ultra fast rectifier53. 检测电阻 sense resistor54. 振荡电阻 timing resistor55. 散热片thermal slug/heat sink/ radiator56. 断路器breaker57. 过流保护器 circuit breaker58. 自由运行 free running59. 满负载 full load60. 过载 overload61. 轻载 light load62. 加载 upload63. 静态 static （state）64. 动态 dynamic （state）65. 稳态的 steady66. 静电 static electricity67. 电源调整率line regulation68. 负载调整率load regulation69. 满载效率 full load efficiency70. 最佳效率 optimum efficiency71. 输出效率 output efficiency72. 峰值效率 peak efficiency73. 标称效率 declared efficiency74. 视在功率 apparent power75. 有功功率 active power76. 无功功率 reactive power77. 功率因数 power-factor78. 耗散功率 power dissipation79. 空载损耗 no-load loss80. 关断状态 off state81. 电源工作电压 operating supply voltage82. 电压参考 voltage reference83. 参考值 reference value84. 反馈feedback85. 产品型号part number86. 掉电power down87. 上电power up88. 电源正常 power good89. 欠压锁定 under voltage lock out (UVLO)90. 上拉 pull up91. 下拉 pull down92. 上升沿 rising edge93. 下降沿 falling edge94. 上限 upper limit95. 下限 lower limit96. 极性 polarity97. 藕合 coupling98. 故障 malfunction99. 原理图 schematic diagram100. 封装footprint101. 设计流程 design cycle102. 设计余量 design margin二、常用电源类英文缩写SPS： switching power supplyPWM: pulse width modulationZCS： zero current switchingZVT: Zero Voltage TransitionPFC: Power Factor CorrectionRMS: Root mean square （均方根）THD: Total Harmonic Distortion (总谐波失真)OVP: Over Voltage ProtectionOCP: Over Current ProtectionOTP: Over Temperature ProtectionMCU: Micro Controller unitTVS: Transient voltage suppressorPCB: Printed circuit boardSMT: surface mounting technologyECR: Engineering Change RequestECN: Engineering Change noticeFMEA: Failure Mode Efficiency AnalysisIC: integrated circuitIE: Industrial EngineeringIT: information technologyAQL: Acceptable Quality LevelQA: Quality AssuranceQC: Qualty ControlIQC: Incoming Quality controlIPQC: In- process Quality control三、变压器类常用材料1. 磁芯：magnetic core2. 骨架：bobbin3. 导线：wire4. 绝缘胶带：insulation tape5. 挡带: margin tape6. 铜箔： copper foil7. 磁环： annular core8. 铁氟龙套管：teflon tube9. 绝缘套管：empire tuble10. 凡立水：varnish11. 气隙：gap12. 绕组：winding13. 初级绕组：primary coil14. 次级绕组：secondary coil15. 电感量: inductance16. 漏感： Leakage inductance17. 耐压：HI-POT18. 绝缘电阻: insulation resistance19. 匝数：turns四、工艺工程类常用英文词汇1. 技术规范：technical regulation2. 规范：specification3. 检修技术：service technic4. 焊接工艺：bonding technology5. 表面安装：surface mounting6. 元件面：component side7. 焊接面：solder side8. 元件孔：component hole9. 安装孔：mounting hole10. 工艺流程图：engineering flow sheet11. 故障指示：failure indication12. 锡焊： tin-lead bonding13. 装配：assembly14. 接插件：socket connector15. 连接器：connector16. 端子：terminal17. 端子壳：housing18. 插座：socket19. 插座盖：socket cover20. 点烟座：cigarette lighter socket21. 点烟头：cigar plug22. 接线座：wire holder23. 接线端子：wire connecting terminal24. 接线器：wire connector25. 线材规格：wire gauge26. 电烙铁： electric solding iron27. 烙铁头：solder horn28. 焊锡： soldering tin29. 焊盘： Pad30. 无铅： Lead Free31. 波峰焊：wave soldering32. 回流焊：reflow soldering33. 老化：burn-in/aging34. 极性： Polarity35. 正级：Positive pole36. 负极：negative pole37. 硬件:hardware38. 软件：software39. 通风孔：vent40. 支撑架/轴承：bearing41. 工艺：technics42. 夹具：fixture43. 冲压模具：die44. 注塑模具：injection mould45. 材料：material46. 扭矩：torque47. 应力：stress48. 强度:strength49. 机壳：enclosure50. 紧固件：fastener51. 螺栓：bolt52. 螺母：nut53. 螺丝：screw54. 垫片：washer55. 套筒扳手：socket key/ socket spanner56. 剪钳：wire cutter57. 剥线皮钳：wire stripper58. 裁线机：wire shear59. 防护罩：guard60. 环氧树脂:epoxy resin61. 玻璃纤维：glass fiber62. 光面：shiny side63. 粗糙面：matte side64. 处理面：treated side。
半导体、微电子专业英语单词
半导体、微电子专业英语单词半导体、微电子专业英语单词汇总有关半导体、微电子的专业英语单词都有哪些呢?以下是店铺整理的半导体、微电子专业英语单词汇总，欢迎参考!半导体、微电子专业英语单词11. acceptance testing (WAT: wafer acceptance testing)2. acceptor: 受主，如B，掺入Si中需要接受电子3. ACCESS：一个EDA(Engineering Data Analysis)系统4. Acid：酸5. Active device：有源器件，如MOS FET(非线性，可以对信号放大)6. Align mark(key)：对位标记7. Alloy：合金8. Aluminum：铝9. Ammonia：氨水10. Ammonium fluoride：NH4F11. Ammonium hydroxide：NH4OH12. Amorphous silicon：α-Si，非晶硅(不是多晶硅)13. Analog：模拟的14. Angstrom：A(1E-10m)埃15. Anisotropic：各向异性(如POLY ETCH)16. AQL(Acceptance Quality Level)：接受质量标准，在一定采样下，可以95%置信度通过质量标准(不同于可靠性，可靠性要求一定时间后的失效率)17. ARC(Antireflective coating)：抗反射层(用于METAL等层的光刻)18. Antimony(Sb)锑19. Argon(Ar)氩20. Arsenic(As)砷21. Arsenic trioxide(As2O3)三氧化二砷22. Arsine(AsH3)23. Asher：去胶机24. Aspect ration：形貌比(ETCH中的深度、宽度比)25. Autodoping：自搀杂(外延时SUB的浓度高，导致有杂质蒸发到环境中后，又回掺到外延层)26. Back end：后段(CONTACT以后、PCM测试前)27. Baseline：标准流程28. Benchmark：基准29. Bipolar：双极30. Boat：扩散用(石英)舟31. CD： (Critical Dimension)临界(关键)尺寸。
日月光中心和日月光半导体
日月光中心和日月光半导体英文回答：I am going to talk about two companies in the semiconductor industry United Microelectronics Corporation (UMC) and TSMC (Taiwan Semiconductor Manufacturing Company). Both of these companies are based in Taiwan and are major players in the global semiconductor market.UMC, also known as United Microelectronics Corporation, is a leading global semiconductor foundry. It was foundedin 1980 and has its headquarters in Hsinchu, Taiwan. UMC provides advanced process technologies and manufacturing services for a wide range of applications, including consumer electronics, communication devices, and automotive electronics.TSMC, on the other hand, stands for Taiwan Semiconductor Manufacturing Company. It is the world's largest dedicated independent semiconductor foundry. TSMCwas founded in 1987 and is also headquartered in Hsinchu, Taiwan. The company offers a comprehensive portfolio of semiconductor manufacturing services, including advanced packaging, design services, and testing solutions.Both UMC and TSMC play a crucial role in the semiconductor industry, but they have their own unique strengths and areas of expertise. UMC, for example, has a strong focus on specialty technologies and offers a wide range of process options to meet the diverse needs of its customers. The company has a reputation for deliveringhigh-quality products and has a strong customer base in various industries.TSMC, on the other hand, is known for its advanced process technologies and manufacturing capabilities. The company invests heavily in research and development to stay at the forefront of semiconductor technology. TSMC has a strong track record of delivering cutting-edge products and has partnerships with many leading semiconductor companies around the world.In terms of market share, TSMC is the clear leader in the semiconductor foundry industry, with a significant advantage over UMC. TSMC's market capitalization is also much higher than that of UMC, reflecting its dominant position in the market.In conclusion, both UMC and TSMC are major players in the semiconductor industry, but TSMC is the clear leader in terms of market share and technological capabilities. Both companies have their own unique strengths and cater to different customer needs. With the increasing demand for semiconductors in various industries, these companies will continue to play a crucial role in driving innovation and technological advancements.中文回答：我要谈论的是半导体行业中的两家公司联电（United Microelectronics Corporation，UMC）和台积电（Taiwan Semiconductor Manufacturing Company，TSMC）。
SMT术语中英文对照
SMT术语中英文对照第一篇：SMT术语中英文对照SMT术语中英文对照AI :Auto-Insertion 自動插件AQL :acceptable quality level 允收水準ATE :automatic test equipment 自動測試ATM :atmosphere 氣壓BGA :ball grid array 球形矩陣CCD :charge coupled device 監視連接元件(攝影機)CLCC :Ceramic leadless chip carrier 陶瓷引腳載具COB :chip-on-board 晶片直接貼附在電路板上cps :centipoises(黏度單位)百分之一CSB :chip scale ball grid array 晶片尺寸BGACSP :chip scale package 晶片尺寸構裝CTE :coefficient of thermal expansion 熱膨脹系數DIP :dual in-line package 雙內線包裝(泛指手插元件)FPT :fine pitch technology 微間距技術FR-4 :flame-retardant substrate 玻璃纖維膠片(用來製作PCB材質)IC :integrate circuit 積體電路IR :infra-red 紅外線Kpa :kilopascals(壓力單位)LCC :leadless chip carrier 引腳式晶片承載器MCM :multi-chip module 多層晶片模組MELF :metal electrode face 二極體MQFP :metalized QFP 金屬四方扁平封裝NEPCON :National Electronic Package andProduction Conference 國際電子包裝及生產會議PBGA:plastic ball grid array 塑膠球形矩陣PCB:printed circuit board 印刷電路板PFC :polymer flip chipPLCC:plastic leadless chip carrier 塑膠式有引腳晶片承載器Polyurethane 聚亞胺酯(刮刀材質)ppm:parts per million 指每百萬PAD(點)有多少個不良PAD(點)psi :pounds/inch2 磅/英吋2PWB :printed wiring board 電路板QFP :quad flat package 四邊平坦封裝SIP :single in-line packageSIR :surface insulation resistance 絕緣阻抗SMC :Surface Mount Component 表面黏著元件SMD :Surface Mount Device 表面黏著元件SMEMA :Surface Mount EquipmentManufacturers Association 表面黏著設備製造協會SMT :surface mount technology 表面黏著技術SOIC :small outline integrated circuitSOJ :small out-line j-leaded packageSOP :small out-line package 小外型封裝SOT :small outline transistor 電晶體SPC :statistical process control 統計過程控制SSOP :shrink small outline package 收縮型小外形封裝TAB :tape automaticed bonding 帶狀自動結合TCE :thermal coefficient of expansion 膨脹(因熱)係數Tg :glass transition temperature 玻璃轉換溫度THD :Through hole device 須穿過洞之元件(貫穿孔)TQFP :tape quad flat package 帶狀四方平坦封裝UV :ultraviolet 紫外線uBGA :micro BGA 微小球型矩陣cBGA :ceramic BGA 陶瓷球型矩陣PTH :Plated Thru Hole 導通孔IA Information Appliance 資訊家電產品MESH 網目OXIDE 氧化物FLUX 助焊劑LGA(Land Grid Arry)封裝技術LGA封裝不需植球，適合輕薄短小產品應用。
上海台积电、应聘英文单词考试(normal)
英文 FAB Office Clean Room Gowning Room Air Shower Department Section Location Bay Manufacturing (MFG) Diffusion ETCH (Etcher) PHOTO Thin Film (TF) Implant ( IMP ) Chemical Vapor Deposition (CVD) Physics Vapor Deposition (PVD) Sputter (SPUT) CMP After Develop Inspection (ADI) Hood After Etch Inspection (AEI) Furnace Mask Backside Grinding (BG) WAT(Wafer Accept Test) Technician (TE) Supervisor Equipment Engineer (EE) Process Engineer (PE) General Operation Rule (GOR) Area Operation Rule (AOR) Standard (SOP) Operation Procedure
英文
中译
Wait 等待 Run 执行 Hold 暂停 Release Lock 解除锁定 Priority 优先顺序 Hot Run 急件 Super Hot Run 超级急件 Stage ID 站别编号 Process 制程/过程 Procedure 步骤/程序 Recipe 程式 Quantity 数量 Load 下货;装货 Track In Time 入帐时间 Unload 收货;卸货 Data Collection 资料收集 Result 结果 Track Out Time 出帐时间 Scratch 刮伤 Broken 破片 Scrap 报废 Operation 操作 M.O. (Miss Operation) 错误操作 Equipment ID 机台编号 Equipment Status 机台状态 PM (Preventive Maintenance) 机台定期保养 Alarm 警鸣 Comment 注解 Certify 技能认证 Decertify 取消认证 Recertify Automation Add Delete Move Remove Abort Cancel Close Inform Confirm Copy Query Reserve UnReserve Backup Destination Receive Slow Start Stop Success Due Date Finish Date Yield Lot ID Lot Dispatch Merge Cassette 重新认证 自动化 增加 删除 移动 移除 放弃/中止 取消/废除 关闭视窗 通知 确认 副本/复制 查询 预约 取消预约 备用 取货地点 接收 慢 开始 停止 成功 到期日 完成日期 良率 批号 派工 合并 晶舟
台积电 纳米 -回复
台积电纳米-回复台积电（英文名称：Taiwan Semiconductor Manufacturing Company Limited，简称TSMC）是全球最大的集成电路生产制造厂商之一。
公司总部位于中国台湾，在全球范围内拥有多个生产基地。
作为一家知名的代工制造公司，台积电为全球范围内许多大型半导体公司提供制造服务，并且在纳米技术领域处于领先地位。
台积电的纳米技术一直以来备受瞩目。
所谓纳米技术，是指将材料的尺寸缩小到纳米级别的技术，其中一纳米等于十亿分之一米。
在半导体制造领域，纳米技术对芯片的性能提升具有重要意义。
台积电在纳米技术领域的研发和生产取得了一系列重要的突破。
首先，台积电在纳米级别的制造工艺上取得了巨大的进步。
随着半导体工艺的发展，芯片上的晶体管数量越来越多，而晶体管的尺寸也越来越小。
纳米技术的出现使得晶体管的尺寸可以进一步缩小，从而实现更高的封装密度和更低的功耗。
台积电通过不断研究和创新，成功地将晶体管的尺寸缩小到亚纳米级别，为客户提供了更高性能的芯片。
其次，台积电在纳米级别的工艺控制上也取得了显著的成果。
纳米级别的制造工艺对于工艺控制的要求非常高，因为微小的杂质和不均匀性都可能对芯片的性能造成影响。
台积电通过引入先进的工艺控制技术，包括多重光刻、电子束曝光和化学机械抛光等，提高了工艺的可控性和一致性，从而有效地降低了制造过程中的杂质和缺陷。
第三，台积电在材料和设备技术上的创新也为纳米技术的发展做出了重要贡献。
纳米级别的制造需要高纯度的材料和精密的设备。
台积电利用自身在半导体制造方面的经验和专业知识，不断改进和创新材料和设备，使其能够满足纳米级别制造的要求，确保产品的质量和可靠性。
此外，台积电还积极推动纳米技术在各个领域的应用。
除了半导体制造，纳米技术还可以应用于医疗、能源、材料和环境等领域。
台积电通过与合作伙伴的紧密合作，不断探索和开发新的应用场景，推动纳米技术在各个领域的创新和应用。
工厂品管常用英语
零件材料类的专有名词CPU: central processing unit(中央处理器)IC: Integrated circuit(集成电路)Memory IC: Memory Integrated circuit（记忆集成电路）RAM: Random Access Memory（随机存取存储器）DRAM: Dynamic Random Access Memory（动态随机存取存储器）SRAM: Staic Random Access Memory（静态随机存储器）ROM: Read-only Memory（只读存储器）EPROM:Electrical Programmable Read-only Memory（电可抹只读存诸器）EEPROM: Electrical Erasbale Programmable Read-only Memory（电可抹可编程只读存储器）CMOS: Complementary Metal-Oxide-Semiconductor（互补金属氧化物半导体）BIOS: Basic Input Output System（基本输入输出系统）Transistor：电晶体LED:发光二极体Resistor：电阻Variator：可变电阻Capacitor:电容Capacitor array：排容Diode：二极体Transistor：三极体Transformer：变压器（ADP）Oscillator：频率振荡器（0sc）Crystal：石英振荡器XTAL/OSC:振荡产生器（X）Relay：延时器Sensor：感应器Bead core：磁珠Filter:滤波器Flat Cable：排线Inductor：电感Buzzer：蜂鸣器Socket：插座Slot：插槽Fuse：熔断器Current：电流表Solder iron：电烙铁Magnifying glass：放大镜Driver：螺丝起子Oven：烤箱TFT:液晶显示器Oscilloscope：示波器Connector：连接器PCB:printed circuit board（印刷电路板）PCBA: printed circuit board assembly（电路板成品）PP:并行接口HDD:硬盘FDD:软盘PSU:power supply unit（电源供应器）SPEC:规格Attach:附件Case: 机箱，盖子Cover：上盖Base：下盖Bazel：面板（panel）Bracket：支架，铁片Lable：贴纸Guide：手册Manual：手册，指南Card：网卡Switch：交换机Hub：集线器Router：路由器Sample：样品Gap：间隙Sponge：海绵Pallet：栈板Foam：保利龙Fiber：光纤Disk：磁盘片PROG:程序Barcode：条码System：系统System Barcode：系统条码M/B:mother board：主板CD-ROM:光驱FAN:风扇Cable：线材Audio：音效K/B:Keyboard（键盘）Mouse：鼠标Riser card：转接卡Card reader：读卡器Screw：螺丝Thermal pad：散热垫Heat sink：散热片Rubber：橡胶垫Rubber foot：脚垫Bag：袋子Washer：垫圈Sleeve：袖套Config：机构Label hi-pot：高压标签Firmware label：烧录标签Metal cover：金属盖子Plastic cover：塑胶盖子Tape for packing：包装带Bar code：条码Tray：托盘Collecto：集线夹Holder：固定器,L铁Connecter：连接器IDE:集成电路设备，智能磁盘设备SCSI:小型计算机系统接口Gasket：导电泡棉AGP:加速图形接口PCI:周边组件扩展接口LAN:局域网USB:通用串形总线架构Slim：小型化COM:串型通讯端口LPT:打印口，并行口Power cord：电源线I/O:输入，输出Speaker：扬声器EPE:泡棉Carton：纸箱Button：按键，按钮Foot stand：脚架部门名称的专有名词QS:Quality system品质系统CS:Coutomer Sevice 客户服务QC:Quality control品质管理IQC:Incoming quality control 进料检验LQC:Line Quality Control 生产线品质控制IPQC:In process quality control 制程检验FQC:Final quality control 最终检验OQC:Outgoing quality control 出货检验QA:Quality assurance 品质保证SQA:Source(supplier) Quality Assurance 供应商品质保证(VQA) CQA：Customer Quality Assurance客户质量保证PQA:Process Quality Assurance 制程品质保证QE:Quality engineer 品质工程CE:component engineering零件工程EE:equipment engineering设备工程ME:manufacturing engineering制造工程TE:testing engineering测试工程PPE:Product Engineer 产品工程IE:Industrial engineer 工业工程ADM:Administration Department行政部RMA:客户退回维修CSDI:检修PC:producing control生管MC:mater control物管GAD:General Affairs Dept总务部A/D:Accountant /Finance Dept会计LAB:Laboratory实验室DOE:实验设计HR:人资PMC:企划RD:研发W/H:仓库SI:客验PD:Product Department生产部PA:采购(PUR:Purchaing Dept)SMT:Surface mount technology 表面粘着技术MFG:Manufacturing 制造MIS:Management information system 资迅管理系统DCC:document control center 文件管制中心厂内作业中的专有名词QT:Quality target品质目标QP:Quality policy目标方针QI:Quality improvement品质改善CRITICAL DEFECT:严重缺点（CR）MAJOR DEFECT:主要缺点（MA）MINOR DEFECT:次要缺点（MI）MAX:Maximum最大值MIN:Minimum最小值DIA:Diameter直径DIM:Dimension尺寸LCL:Lower control limit管制下限UCL:Upper control limit管制上限EMI:电磁干扰ESD:静电防护EPA:静电保护区域ECN:工程变更ECO:Engineering change order工程改动要求（客户）ECR:工程变更需求单CPI:Continuous Process Improvement 连续工序改善Compatibility：兼容性Marking：标记DWG:Drawing图面Standardization：标准化Consensus：一致Code：代码ZD:Zero defect零缺点Tolerance：公差Subject matter：主要事项Auditor：审核员BOM:Bill of material物料清单Rework：重工ID：identification识别,鉴别,证明PILOT RUN: (试投产)FAI:首件检查FPIR：First Piece Inspection Report首件检查报告FAA:首件确认SPC：统计制程管制CP:capability index（准确度）CPK:capability index of process(制程能力)PMP:制程管理计划（生产管制计划）MPI:制程分析DAS:Defects Analysis System 缺陷分析系统PPB：十亿分之一Flux：助焊剂P/N:料号L/N：Lot Number批号Version：版本Quantity：数量Valid date：有效日期MIL-STD：Military-Standard军用标准ICT: In Circuit Test (线路测试)ATE：Automatic Test Equipment自动测试设备MO:Manafacture Order生产单T/U: Touch Up (锡面修补)I/N:手插件P/T:初测F/T: Function Test (功能测试-终测)ASY:组立P/K:包装TQM:Total quality control全面品质管理MDA:manufacturing defect analysis制程不良分析(ICT) RUN-IN:老化实验HI-pot：高压测试FMI：Frequency Modulation Inspect高频测试DPPM: Defect Part Per Million(不良率的一种表达方式：百万分之一) 1000PPM即为0.1% Corrective Action: (CAR改善对策)ACC：允收REJ:拒收S/S：Sample size抽样检验样本大小SI-SIV：Special I-Special IV特殊抽样水平等级CON：Concession / Waive特采ISO:国际标准化组织ISA：Industry Standard Architecture工业标准体制结构OBA:开箱稽核FIFO:先进先出PDCA:管理循环Plan do check action计划，执行，检查，总结WIP:在制品（半成品）S/O: Sales Order (业务订单)P/O: Purchase Order (采购订单)P/R: Purchase Request (请购单)AQL:acceptable quality level允收品质水准LQL;Limiting quality level最低品质水准QVL:qualified vendor list合格供应商名册AVL ：认可的供货商清单(Approved Vendor List)QCD: Quality cost delivery（品质，交期，成本）MPM:Manufacturing project management制造专案管理KPI:Key performance indicate重要绩效指标MVT:Manufacturing Verification Test制造验证试产Q/R/S：Quality/Reliability/Service质量/可靠度/服务STL:ship to line（料到上线）NTF:No trouble found误判CIP:capacity improvement plan（产能改善计划）MRB:material review board（物料审核小组）MRB:Material reject bill退货单JIT:just in time（即时管理）5S:seiri seiton seiso seiketsu shitsuke（整理，整顿，清扫，清洁，修养）SOP:standard operation process（标准作业程序）SIP:Specification inspection process制程检验规格TOP: Test Operation Process (测试作业流程)WI: working instruction（作业指导书）SMD:surface mounting device（表面粘着原件）FAR:failure aualysis report故障分析报告CAR:Corrective action report改善报告BPR：企业流程再造 (Business Process Reengineering) ISAR ：首批样品认可(Initial Sample Approval Request)- JIT：实时管理 (Just In Time)QCC ：品管圈 (Quality Control Circle)Engineering Department (工程部)TQEM: Total Quality Environment Management(全面品质环境管理)PD: Production Department (制造)LOG: Logistics (后勤支持)Shipping: (进出口)AOQ：Average Output Quality平均出货质量AOQL：Average Output Quality Level平均出货质量水平FMEA：failure model effectiveness analysis失效模式分析CRB: Change Review Board (工程变更会议)CSA：Customer Simulate Analysis客户模拟分析SQMS：Supplier Quality Management System供应商品质管理系统QIT: Quality Improvement Team 品质改善小组QIP：Quality Improvement Plan品质改善计划CIP：Continual Improvement Plan持续改善计划M.Q.F.S: Material Quality Feedback Sheet (来料品质回馈单) SCAR: Supplier Corrective Action Report (供货商改善对策报告) 8D Sheet: 8 Disciplines sheet ( 8D单)PDCA：PDCA (Plan-Do-Check-Action) (管理循环)MPQ: Material Packing Quantity (物料最小包装量)DSCN: Delivery Schedule Change Notice (交期变更通知) QAPS: Quality Assurance Process Sheet (品质工程表)DRP ：运销资源计划 (Distribution Resource Planning)DSS：决策支持系统 (Decision Support System)EC ：电子商务 (Electronic Commerce)EDI ：电子资料交换 (Electronic Data Interchange)EIS ：主管决策系统 (Excutive Information System)ＥＲＰ：企业资源规划 (Enterprise Resource Planning)FMS ：弹性制造系统 (Flexible Manufacture System)KM ：知识管理 (Knowledge Management)4L ：逐批订购法 (Lot-for-Lot)LTC ：最小总成本法 (Least Total Cost)LUC ：最小单位成本 (Least Unit Cost)MES ：制造执行系统 (Manufacturing Execution System)MPS ：主生产排程 (Master Production Schedule)MRP ：物料需求规划 (Material Requirement Planning)MRPⅡ：制造资源计划 (Manufacturing Resource Planning)OEM ：委托代工 (Original Equipment Manufacture)ODM ：委托设计与制造 (Original Design & Manufacture) OLAP：线上分析处理 (On-Line Analytical Processing)OLTP：线上交易处理 (On-Line Transaction Processing)OPT ：最佳生产技术 (Optimized Production Technology) PDCA：PDCA管理循环 (Plan-Do-Check-Action)PDM：产品数据管理系统 (Product Data Management))RCCP：粗略产能规划 (Rough Cut Capacity Planning)SCM ：供应链管理 (Supply Chain Management)SFC ：现场控制 (Shop Floor Control)TOC：限制理论 (Theory of Constraints)TQC ：全面品质管制 (Total Quality Control)FYI/R:for your information/reference仅供参考ASAP:尽快S/T:Standard time标准时间TPM:total production maintenance：全面生产保养ESD Wrist strap：静电环IT:information technology信息技术，资讯科学CEO：Chief Executive Officer执行总裁COO：Chief Operaring Officer首席业务总裁SWOT：Strength,Weakness,Opportunity,Threat优势﹐弱点﹐机会﹐威胁Competence：专业能力Communication：有效沟通Cooperation：统御融合Vibration Testing：振动测试IDP：Individual Development Plan个人发展计划MRP：Material Requirement Planning物料需求计划MAT'S：Material材料LRR：Lot Rejeet Rate批退率ATIN：Attention知会3C：Computer ,Communication , Consumer electronic消费性电子5W1H：When , Where , Who , What , Why , Ho5M:Man , Machine , Material , Method , Measurement人,机器,材料,方法,测量4MIE:Man,Material,Machine,Method,Environment人力,物力,财务,技术,时间(资源)7M1I:Manpower , Machine , Material , Method,Market , Management , Money , Information人力，机器，材料，方法, 市场，管理，资金，资讯1 Accuracy 准确度2 Action 行动3 Activity 活动4 Analysis Covariance 协方差分析5 Analysis of Variance 方差分析6 Approved 承认7 Attribute 计数值8 Average 平均数9 Balance sheet 资产负债对照表10 Binomial 二项分配11 Brainstorming Techniques 脑力风暴法12 Cause and Effect Matrix 因果图(鱼骨图)13 CL:Center Line 中心线14 Check Sheets 检查表15 Complaint 投诉16 Conformity 合格（符合）17 Control 控制18 Control chart 控制(管制)图19 Correction 纠正20 Correlation Methods 相关分析法21 CPI: continuouse Process Improvement 连续工序改善22 Cross Tabulation Tables 交叉表23 CS: Customer Sevice 客（户）服（务）中心24 DSA: Defects Analysis System 缺陷分析系统25 Data 数据 Description:品名26 DCC: Document Control Center 文控中心27 Decision 决策、判定28 Defects per unit 单位缺点数29 Description 描述30 Device 装置31 Do 执行32 DOE: Design of Experiments 实验设计33 Element 元素34 Engineering recbnology 工程技35 Environmental 环境36 Equipment 设备37 Estimated accumulative frequency 计算估计累计数38 EV: Equipment Variation 设备变异39 External Failure 外部失效,外部缺陷40 FA: Failure Analysis 失效分析41 Fact control 事实管理42 Fatigue 疲劳43 FMEA: Failure Mode and Effect Analysis失效模式与效果分析44 FPY: First-Pass Yield （第一次通过）合格率45 FQA: Final Quality Assurance 最终品质保证46 FQC: Final Quality control 最终品质控制47 Gauge system 测量系统48 Grade 等级49 Histogram 直方图50 Improvement 改善51 Initial review 先期审查52 Inspection 检验53 Internal Failure 内部失效、内部缺陷54 IPQC: In Process Quality Control 制程品质控制55 IQC: Incomming Quality Control 来料品质控制56 IS International Organization for Standardization 国际标准化组织57 LCL: Lower Control limit 管制下限58 LQC: Line Quality Control 生产线品质控制59 LSL: Lower Size Limit 规格下限60 Machine 机械61 Manage 管理62 Materials 物料63 Measurement 测量64 Median 中位数65 MSA: Measurement System Analysis 测量系统分析66 Occurrence 发生率67 Operation Instruction 作业指导书68 Organization 组织69 Parto 柏拉图70 PPM:Parts per Million （百万分之）不良率71 Plan 计划72 Policy 方针73 Population 群体74 PQA: Process Quality Assurance 制程品质保证75 Practice 实务(践)76 Prevention 预防77 Probability 机率78 Probability density function 机率密度函数79 Procedure 流程80 Process 过程81 Process capability analysis 制程能力分析（图）82 Process control and Process capability制程管制与制程能力83 Product 产品84 Production 生产85 Projects 项目86 QA: Quality Assurance 品质保证87 QC: Quality Control 品质控制88 QE: Quality Engineering 品质工程89 QFD: Quality Function Desgin 品质机能展开(法)90 Quality 质量91 Quality manual 品质手册92 Quality policy 品质政策(质量方针)93 Random experiment 随机试验94 Random numbers 随机数95 R:Range 全距（极差）96 Reject 拒收97 Repair 返修98 Repeatusility 再现性99 Reproducibility 再生性100 Requirement 要求101 Responsibilities 职责102 Review 评审103 Reword 返工104 Rolled yield 直通率105 RPN: Risk Priority Number 风险系数106 Sample 抽样,样本107 Sample space 样本空间108 Sampling with replacement 放回抽样109 Sampling without replacement 不放回抽样110 Scatter diagram 散布图分析111 Scrap 报废112 Simple random sampling 简单随机取样113 Size 规格114 SL: Size Line 规格中心线115 Stratified random sampling 分层随机抽样116 SOP: Standard Operation Procedure 标准作业书117 SPC: Statistical Process Control 统计制程管制118 Specification 规范119 SQA: Source(Supplier) Quality Assurance 供货商品质保证120 Stage sampling 分段随机抽样121 Standard Deviation 标准差122 Sum of squares 平方和123 Taguchi-method 田口(试验)方法124 Theory 原理125 TQC: Total Quality Control 全面品质控制126 TQM: Total Quality Management 全面品质管理127 Traceablity 追溯128 Training 培训129 UCL: Upper Control Limit 管制（控制）上限130 USL: Upper Size Limit 规格上限131 Validation 确认132 Variable 计量值133 Verification 验证134 Version 版本135 VOC: Voice of Customer 客户需求136 VOE: Voice of Engineer 工程需求137 Inventory stock report:庫存清单报告138 Sales order report:出货报告质量人员名称类QC quality control 品质管理人员FQC final quality control 终点质量管理人员IPQC in process quality control 制程中的质量管理人员OQC output quality control 最终出货质量管理人员IQC incoming quality control 进料质量管理人员TQC total quality control 全面质量管理POC passage quality control 段检人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员QE quality engineering 质量工程人员质量保证类FAI first article inspection 新品首件检查FAA first article assurance 首件确认CP capability index 能力指数CPK capability process index 模具制程能力参数SSQA standardized supplier quality audit 合格供货商质量评估FMEA failure model effectiveness analysis 失效模式分析FQC运作类AQL Acceptable Quality Level 运作类允收质量水平S/S Sample size 抽样检验样本大小ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的MIN Minor 轻微的Q/R/S Quality/Reliability/Service 质量/可靠度/服务P/N Part Number 料号L/N Lot Number 批号AOD Accept On Deviation 特采UAI Use As It 特采FPIR First Piece Inspection Report 首件检查报告PPM Percent Per Million 百万分之一制程统计品管专类SPC Statistical Process Control 统计制程管制SQC Statistical Quality Control 统计质量管理GRR Gauge Reproductiveness & Repeatability 量具之再制性及重测性判断量可靠与否DIM Dimension 尺寸DIA Diameter 直径N Number 样品数其它质量术语类QIT Quality Improvement Team 质量改善小组ZD Zero Defect 零缺点QI Quality Improvement 质量改善QP Quality Policy 目标方针TQM Total Quality Management 全面质量管理RMA Return Material Audit 退料认可7QCTools 7 Quality Control Tools 品管七大手法通用之件类ECN Engineering Change Notice 工程变更通知(供货商)ECO Engineering Change Order 工程改动要求(客户)PCN Process Change Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Standard Inspection Procedure 制程检验标准程序SOP Standard Operation Procedure 制造作业规范IS Inspection Specification 成品检验规范BOM Bill Of Material 物料清单PS Package Specification 包装规范SPEC Specification 规格DWG Drawing 图面系统文件类ES Engineering Standard 工程标准CGOO China General PCE龙华厂文件IWS International Workman Standard 工艺标准ISO International Standard Organization 国际标准化组织GS General Specification 一般规格部类PMC Production & Material Control 生产和物料控制PCC Product control center 生产管制中心PPC Production Plan Control 生产计划控制MC Material Control 物料控制DC Document Center 资料中心QE Quality Engineering 质量工程(部)QA Quality Assurance 质量保证(处)QC Quality Control 质量管理(课)PD Product Department 生产部LAB Laboratory 实验室IE Industrial Engineering 工业工程R&D Research & Design 设计开发部生产类PCs Pieces 个(根,块等)PRS Pairs 双(对等)CTN Carton 卡通箱PAL Pallet/skid 栈板PO Purchasing Order 采购订单MO Manufacture Order 生产单D/C Date Code 生产日期码ID/C Identification Code (供货商)识别码SWR Special Work Request 特殊工作需求L/N Lot Number 批号P/N Part Number 料号OEM Original Equipment Manufacture 原设备制造PC Personal Computer 个人计算机CPU Central Processing Unit 中央处理器A.S.A.P As Soon As Possible 尽可能快的E-MAIL Electrical-Mail 电子邮件N/A Not Applicable 不适用QTY Quantity 数量I/O input/output 输入/输出NG Not Good 不行,不合格C=0 Critical=0 极严重不允许APP Approve 核准,认可,承认CHK Check 确认ASS'Y Assembly 装配,组装T/P True Position 真位度5WIH When, Where, Who, What, Why, How to6M Man, Machine, Material, Method, Measurement, Message4MTH Man, Material, Money, Method, Time, How 人力,物力,财务,技术,时间(资源) SQA Strategy Quality Assurance 策略质量保证DQA Design Quality Assurance 设计质量保证MQA Manufacture Quality Assurance 制造质量保证SSQA Sales and service Quality Assurance 销售及服务质量保证LRR Lot Reject Rate 批退率SPS Switching power supply 电源箱DT Desk Top 卧式(机箱)MT Mini-Tower 立式(机箱)DVD Digital Video DiskVCD Video Compact DiskLCD Liquid Crystal DisplayCAD Computer Aided DesignCAM Computer Aided ManufacturingCAE Computer Aided EngineeringPCB Printed Circuit Board 印刷电路板CAR Correction Action Report 改善报告NG Not Good 不良WDR Weekly Delivery Requirement 周出货要求PPM Percent Per Million 百万分之一TPM Total Production Maintenance 全面生产保养MRP Material Requirement Planning 物料需计划OS Operation System 操作系统TBA To Be Assured 待定,定缺D/C Drawing ChangeP/P Plans & ProcedureEMI Electrical-Music Industry 电子音乐工业Electrical Magnetic Interference 电子干扰RFI Read Frequency Input 读频输入MMC Maximum Material ConditionMMS Maximum Material SizeLMC Least Material ConditionLMS Least Material SizeLED lighting-emitting diode 发光二极管QBR Quarter Business RecordCIP Continuous improvement processFGI Forecasted Goal InventoryCNC Computerized numeral controllerB2C Business to customerB2B Business to businessAVL Approved vendor listPOP Procedure of packagingEOL End of lifeVDCS Vender defect correcting sheetPDCS Process defect correcting sheetGRN Goods receiving noteA/R Accounting receivableA/P Accounting payable专业词汇通用类president董事长operator作业员position职务general manager总经理special assistant 特助deputy manager |'depjuti| =vice manager副理deputy supervisor =vice supervisor副课长group leader组长line leader线长supervisor 课长responsible department负责单位Human Resources Department人力资源部Head count 人头数production department生产部门planning department企划部QC Section品管课stamping factory冲压厂painting factory烤漆厂molding factory成型厂administration/general affairs dept./总务部production unit生产单位meeting minutes会议记录distribution department分发单位subject主题conclusion结论decision items决议事项pre-fixed finishing date预定完成日Color management 颜色管理Visual management 目视管理production capacity生产力first count初盘first check初盘复棹second count 复盘second check复盘复核quantity of physical inventory second count 复盘点数量physical inventory盘点数量physical count quantity账面数量difference quantity差异量spare parts physical inventory list备品盘点清单cause analysis原因分析waste materials废料description品名specification 规格model机种work order工令revision版次remark备注registration登记registration card登记卡to control管制application form for purchase请购单consume, consumption消耗to notify通知to fill in填写to collect, to gather收集statistics统计cosmetic inspection standard 外观检验规范computer case 计算机外壳(组件)personal computer enclosure 计算机机箱产品front plate前板rear plate后板chassis |'∫æsi| 基座bezel panel面板Hood 上盖base pan 基座bezel 面板riser card 扩充卡flat cable 排线TOP driver cage 上磁架bottom driver cage 下磁架resin film 树脂膜raw materials原料materials物料steel plate钢板roll/coil material卷料spare parts =buffer备品plastic parts塑料件sheet metal parts/stamping parts 冲件material check list物料检查表finished product成品semi-finished product半成品good product/accepted goods/ accepted parts/good parts良品defective product/non-good parts不良品disposed goods处理品warehouse/hub仓库packing material包材basket蝴蝶竺plastic basket胶筐flow chart流程窗体production tempo生产进度现状lots of production生产批量manufacture procedure制程to revise, modify修订to switch over to, switch—to, switching over切换engineering bottleneck, project difficulty工程瓶颈glove(s)手套glove(s) with exposed fingers割手套Band-Aid创可贴Industrial alcohol工业酒精broom扫把mop拖把vacuum cleaner吸尘器rag 抹布garbage container灰箕garbage can垃圾箱garbage bag垃圾袋liaison联络单rags抹布lamp holder灯架to mop the floor拖地to clean a table擦桌子air pipe 气管delivery deadline交货期die worker模工production, to produce生产equipment设备resistance电阻beacon警示灯coolant冷却液crusher破碎机club car高尔夫球车plate电镀power button电源按键reset button重置键forklift叉车Workshop traveler 天车trailer =long vehicle拖板车Hydraulic trolley手压车hydraulic hand jack油压板车casing = containerization装箱velocity速度patent专利coordinate坐标supply and demand供求career card履历卡barricade隔板carton box纸箱to pull and stretch拉深work cell/work shop工作间sub-line支线bottleneck 瓶颈模具工程类plain die简易模pierce die冲孔模forming die成型模progressive die连续模stage die工程模compound die复合模shearing die剪边模riveting die铆合模feature die公母模male die公模female die母模cavity型控母模core模心公模die change 换模to fix a die装模to repair a die修模punch set上模座punch pad上垫板punch holder上夹板stripper pad脱料背板up stripper上脱料板upper plate上模板lower plate下模板die pad下垫板die holder下夹板die set下模座bottom block下垫脚bottom plate下托板(底板)upper supporting blank上承板upper padding plate blank上垫板top plate上托板（顶板）top block上垫脚stripping plate内外打(脱料板) outer stripper外脱料板inner stripper内脱料板lower stripper下脱料板punch冲头insert入块(嵌入件)deburring punch压毛边冲子groove punch压线冲子stamped punch字模冲子round punch圆冲子special shape punch异形冲子bending block折刀roller滚轴baffle plate挡块located block定位块supporting block for location定位支承块air cushion plate气垫板air-cushion eject-rod气垫顶杆trimming punch切边冲子stiffening rib punch = stinger 加强筋冲子ribbon punch压筋冲子reel-stretch punch卷圆压平冲子guide plate定位板sliding block滑块sliding dowel block滑块固定块die locker锁模器pressure plate =plate pinch压板thickness gauge厚薄规cutting die, blanking die冲裁模die block模块folded block折弯块sliding block滑块location pin定位销lifting pin顶料销die plate, front board模板padding block垫块stepping bar垫条panel board镶块to load a die装上模具to unload a die 御模具active plate活动板lower sliding plate下滑块板upper holder block上压块upper mid plate上中间板spring box弹簧箱spring-box eject-rod弹簧箱顶杆spring-box eject-plate弹簧箱顶板bushing block衬套cover plate盖板guide pad导料块pilot导正筒trim剪外边pierce剪内边pocket for the punch head挂钩槽slug hole废料孔radius半径shim/wedge/heel/pad/spacer/gasket楔子torch-flame cut火焰切割set screw止付螺丝form block折刀round pierce punch =die button圆冲子shape punch =die insert异形子stock located block定位块metal plate钣金miller铣床grinder磨床tolerance公差score =groove压线sliding block滑块lathe车active plate活动板baffle plate挡块cover plate盖板groove punch压线冲子air-cushion eject-rod气垫顶杆spring-box eject-plate弹簧箱顶板capability能力parameter参数factor系数driller钻床set up die架模height of die setting up架模高度analog-mode device类模器inner guiding post内导柱inner hexagon screw内六角螺钉dowel pin固定销coil spring弹簧lifter pin顶料销eq-height sleeves =spool等高套筒pin销lifter guide pin浮升导料销guide pin导正销wire spring圆线弹簧outer guiding post外导柱stop screw止付螺丝located pin定位销outer bush外导套press specification冲床规格die height闭模高度flow mark流痕welding mark溶合痕post screw insert螺纹套筒埋值self tapping screw自攻螺丝stripper plate脱料板piston活塞handle mold手持式模具flash mold溢流式模具positive mold挤压式模具split mold分割式模具die lifter举模器top stop上死点bottom stop下死点one stroke一行程to continue, cont.连动to grip(material)吸料location lump, locating piece, location block定位块reset复位to file burr 锉毛刺embedded lump |in'bed| mp|镶块 |lstamping-missing漏冲to tight a bolt拧紧螺栓to loosen a bolt拧松螺栓punched hole冲孔to cut edge =side cut =side scrap 切边to bending折弯to pull, to stretch拉伸engraving, to engrave刻印stamping 油印to stake铆合designing, to design设计design modification 设计修改成gauge(or jig)治具pedal踩踏板stopper阻挡器flow board流水板torque扭矩spline =the multiple keys花键quenching淬火tempering回火annealing退火carbonization碳化alloy合金tungsten high speed steel钨高速的moly high speed steel钼高速的forming成型(抽凸,冲凸)draw hole抽孔bending折弯emboss凸点dome凸圆semi-shearing半剪stamp mark冲记号deburr or coin压毛边punch riveting冲压铆合side stretch侧冲压平reel stretch卷圆压平groove压线stamp letter冲字(料号)tick-mark nearside正面压印tick-mark farside反面压印冲压类punch, press冲punching machine 冲床hydraulic machine油压机jack升降机decoiler整平机manufacture management制造管理stamping, press冲压feeder送料机rack, shelf, stack料架taker取料机to reverse material 翻料to load material上料to unload material卸料to return material/stock to退料scraped |'skræpid|报废scrape ..v.刮;削robot机械手production line流水线packaging tool打包机packaging打包成型类well type蓄料井insulated runner绝缘浇道方式hot runner热浇道runner plat浇道模块valve gate阀门浇口band heater环带状的电热器spindle阀针spear head刨尖头slag well冷料井cold slag冷料渣air vent排气道welding line熔合痕eject pin顶出针knock pin顶出销return pin回位销反顶针sleeve套筒stripper plate脱料板insert core放置入子runner stripper plate浇道脱料板guide pin导销eject rod (bar)（成型机）顶业捧subzero深冷处理three plate三极式模具runner system浇道系统stress crack应力电裂orientation定向sprue gate射料浇口，直浇口nozzle射嘴sprue lock pin料头钩销(拉料杆) slag well冷料井side gate侧浇口edge gate侧缘浇口tab gate搭接浇口film gate薄膜浇口flash gate闸门浇口slit gate缝隙浇口fan gate扇形浇口dish gate因盘形浇口diaphragm gate隔膜浇口ring gate环形浇口submarine gate潜入式浇口tunnel gate隧道式浇口pin gate针点浇口runner less无浇道sprue less 无射料管方式long nozzle延长喷嘴方式spur浇口;溶waste废料board广告牌sliding rack滑料架to impose lines压线to compress, compressing压缩character die字模to feed, feeding送料material change, stock change材料变更feature change 特性变更prepare for, make preparations for 准备rotating speed, revolution转速abnormal handling异常处理组装类Assembly line组装线Layout布置图Conveyer流水线运输带Rivet machine拉钉机Rivet gun拉钉枪Screw driver起子Electric screw driver电动起子Hydraulic machine 液压机Pneumatic screw driver气动起子automation自动化to stake, staking, riveting铆合add lubricant oil加润滑油argon welding氩焊cylinder油缸robot机械手conveying belt输送带transmission rack输送架to draw holes抽孔bolt螺栓nut 螺母screw 螺丝identification tag标示单screwdriver plug起子插座automatic screwdriver电动启子to move, to carry, to handle搬运be put in storage入库packing包装staker = riveting machine铆合机fit together组装在一起fasten锁紧(螺丝)fixture 夹具(治具)pallet/skid栈板barcode条形码barcode scanner条形码扫描仪fuse together熔合fuse machine/heat stake热熔机processing, to process加工delivery, to deliver 交货to return delivery to. to send delivery back to return of goods退货easily damaged parts易损件standard parts标准件to lubricate润滑spring 弹簧spare tools location/buffer手工备品仓spare molds location模具备品仓tox machine自铆机烤漆类phosphate皮膜化成viscosity涂料粘度alkalidipping脱脂main manifold主集流脉organic solvent有机溶剂demagnetization去磁;消磁high-speed transmission高速传递heat dissipation热传rack上料volatile挥发性degrease脱脂rinse水洗alkaline etch龄咬desmot剥黑膜D.I. rinse纯水次Chromate铬酸处理Anodize阳性处理seal封孔scraped products报放品disposed products处理品dismantle the die折模auxiliary function辅助功能heater band 加热片thermocouple热电偶derusting machine除锈机degate打浇口dryer烘干机induction感应induction light感应光response =reaction =interaction感应ram连杆edge finder巡边器concave凸convex凹cold slug冷块blush 导色gouge沟槽;凿槽satin texture段面咬花witness line证示线grit沙砾granule =pellet =grain细粒sand blasting喷沙grit maker抽粒机。
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台积电常用英语
NO. 英文中译NO. 英文中译
1 FAB 工厂45 Wait 等待
2 Office 办公室46 Run 执行
3 Clean Room 洁净室47 Hold 暂停
4 Gowning Room 更衣室48 Release Lock 解除锁定
5 Air Shower 风浴49 Priority 优先顺序
6 Department 部门50 Hot Run 急件
7 Section 课别51 Super Hot Run 超级急件
8 Location 区域名称52 Stage ID 站别编号
9 Bay 间隔/隔间53 Process 制程/过程
10 Manufacturing (MFG) 制造部54 Procedure 步骤/程序
11 Diffusion 扩散55 Recipe 程式
12 ETCH (Etcher) 蚀刻56 Quantity 数量
13 PHOTO 黄光57 Load 下货;装货
14 Thin Film (TF) 薄膜58 Track In Time 入帐时间
15 Implant ( IMP ) 离子植入区59 Unload 收货;卸货
16 Chemical Vapor
Deposition (CVD)
化学气象沉淀60 Data Collection 资料收集
17 Physics Vapor
Deposition (PVD)
物理气象沉淀61 Result 结果
18 Sputter (SPUT) 金属溅镀区62 Track Out Time 出帐时间
19 CMP 晶片正面研磨区63 Scratch 刮伤
20 After Develop
Inspection (ADI)
显影后检查64 Broken 破片
21 Hood 酸槽65 Scrap 报废
22 After Etch Inspection
(AEI)
蚀刻后检查66 Operation 操作
23 Furnace 炉管67 M.O. (Miss
Operation)
错误操作
24 Mask 光罩68 Equipment ID 机台编号
25 Backside Grinding
(BG)
晶背研磨区69
Equipment
Status
机台状态
26 WAT(Wafer Accept
Test)
晶片接收侦测70
PM (Preventive
Maintenance)
机台定期保养
27 Technician (TE) 技术员71 Alarm 警鸣
28 Supervisor 课长72 Comment 注解
29 Equipment Engineer
(EE)
设备工程师73 Certify 技能认证
30 Process Engineer
(PE)
制程工程师74 Decertify 取消认证
31 General Operation
Rule
(GOR)
厂区(一般)操作规
则
75 Recertify 重新认证
32 Area Operation Rule
(AOR)
区域操作规则76 Automation 自动化
33 Standard Operation
Procedure
(SOP)
标准操作流程77 Add 增加
34 Operation Index(OI) 操作准则78 Delete 删除
35 Temporary Engineer
Change Notice
(TECN)
临时工程变更通知
单
79 Move 移动
36 Production Notice
(PN)
制造通报80 Remove 移除
37 Log Sheet 工作记录单81 Abort 放弃/中止
38 Wafer 晶片82 Cancel 取消/废除
39 Wafer transfer 晶片转换83 Close 关闭视窗
40 Sorter 晶片分类机84 Inform 通知
41 Computer Integrate
Manufacture
(CIM)
电脑整合制造85 Confirm 确认
42 ON-Line 与电脑连线86 Copy 副本/复制
43 OFF-Line 不与电脑连线87 Query 查询
44 Password 密码88 Reserve 预约
89 GUI(Graphic of
User Interface)
图象使用者介面104 UnReserve 取消预约
90 OPI (Operator
Interface)
操作介面105 Backup 备用
91 Rework 重做106 Destination 取货地点
92 e-Runcard 电子化流程卡107 Receive 接收
93 Housekeeping 环境整理108 Slow 慢
94 Split 分批109 Start 开始
95 Child Lot ID 子批批号110 Stop 停止
96 Recover Runcard 复机制程更改单111 Success 成功
97 Runcard 流程卡112 Due Date 到期日
98 OCAP
(Out of control action
plan)
异常状况处理单113 Finish Date 完成日期
99 Monitor 测机114 Yield 良率100 Power 电源115 Lot ID 批号101 Hallway 自动搬运系统116 Lot Dispatch 派工102 Lot Box 晶盒117 Merge 合并103 Lot 批货118 Cassette 晶舟。