集成电路IO设计课程教学大纲

天津大学《集成电路IO设计》课程教学大纲

课程代码：2040657 课程名称：集成电路IO设计

学时：48 学分： 3

学时分配：授课：24 课堂研讨会：24 实验：实践：

实践（周）：课后学习

更新时间：授课学院：电子信息工程

适用专业：电子科学与技术，集成电路设计

先修课程：模拟／射频集成电路，数字集成电路

一．课程简介

学生将学习集成电路输入/输出电路的基础知识和设计原则。课程结束后，学生将了解在大规模集成电路设计背景下的IO电路/模块的概念和设计方面的考虑。

二．教学基本要求

本课程介绍输入/输出电路的功能、意义、以及设计原则。IO设计包括封装，ESD和缓冲电路。要求掌握IO电路对高速集成电路和射频（RF）集成电路的性能的影响。

三．教学内容

第一章：集成电路封装Packaging

第一节：集成电路与封装的产业背景

第二节：封装方式与发展趋势

第三节：封装对高速及射频电路特性的影响

第二章：CMOS电路的ESD保护

第一节：ESD机理

第二节：IC电路的ESD保护方法

第三节：ESD在高速及射频电路中的应用

第三章：I/O Buffer设计

第一节：Buffer的作用和对系统的影响

第二节：高速电路Buffer设计

第三节：射频电路Buffer设计

四．学时分配

五．评价与考核方式

研讨会（Seminars）60%, 期末大作业（Final project）40%

六．教材与主要参考资料

1．W. Greig, Integrated Circuit Packaging, Assembly and Interconnections, Springer, 2007

2．O. Semenov, ESD Protection Device and Circuit Design for Advanced CMOS Technologies, Springer, 2008

3．Papers from IEEE Xplore

TU Syllabus for Integrated Circuit IO Design

Code: 2040657 Title: Integrated Circuit

IO Design Semester Hours: 48 Credits: 3

Semester Hour

Structure Lecture：24 Seminar：24

Offered by: Electronic Information

Engineering

Date: 2015-1

for: Electronic Science and Technology，Integrated Circuit Design Prerequisite: Analog/RF Circuit Design, Digital Circuits

1. Objective

Students will learn the basics and design principles of Input/Output Circuits for IC systems. After the course, students will understand the concepts and design considerations of the IO circuits/modules in the whole picture of the large scale integrated circuits.

2. Requirements

This course introduces the function, significance, and design principles of Input/Output Circuits. The IO design includes subjects of packaging, ESD and buffers. The course will put emphasis on the IO impact on the performance of the high-speed and radio-frequency (RF) ICs.

3. Topics

Chapter 1: Packaging of Integrated Circuits

Section 1: Introduction of IC and package

Section 2: Trend of IC package

Section 3: Impact of package on high-speed and RF IC

Chapter 2: ESD protection of Integrated Circuits

Section 1: Principle of ESD protection

Section 2: ESD protection circuits

Section 3: Application of ESD protection circuits in high-speed and RF IC Chapter 3: Buffers of Package of Integrated Circuits

Section 1: Basics and functions of IO buffers

Section 2: Buffer design in the high-speed IC

Section 3: Buffer design in the radio-frequency IC

4. Semester Hour Structure

5. Grading

Seminars 60%, Final project 40%

6. Text-Book & Additional Readings

4．W. Greig, Integrated Circuit Packaging, Assembly and Interconnections, Springer, 2007

5．O. Semenov, ESD Protection Device and Circuit Design for Advanced CMOS Technologies, Springer, 2008

6．Papers from IEEE Xplore