常见工程咨询中英文对照

常见工程咨询中英文对照

问题：客户未告知采用什么标准进行制作与检查。

建议：我们按IPC-6012B Class2与IPC-A-600G Class2 做。

Question 1: Customer doesn’t tell us what standards we should take to manufacture and inspect. Suggestion: We will follow IPC-6012B Class2 &IPC-A-600G Class2.

问题：客户未告知板料类型。

建议：我们将使用FR4．

Question: Customer doesn’t tell us material type.

Suggestion: We will use FR4.

问题：客户要求成品厚度为1.60+/-0.10mm，此公差对六层板而言太紧，难以控制。

建议: 将公差放松到+/-0.15mm.

Question: Customer requires “1.60+/-0.10mm” finished board thickness, the tolerance is too tight for six -layer board., it’s hard to control for us.

Suggestion: Relax the tolerance to be +/-0.15mm.

问题：客户未规定使用何种类型的阻焊油及颜色。

建议: 我们采用普通感光绿色湿油.

Question: Customer doesn’t specify solder mask type and color.

Suggestion: We use normal green LPI.

问题：客户未指定UL 标记与Date code加于何处及以何种方式显示。

建议：见下图，我们将其加于TOP面，以白字显示。

Question: Customer doesn’t specify where and by what display form we should add UL logo and date code.

Suggestion: See below picture, we add them on top side and display them by silk letters.

问题：客户要求线路表面油厚为30um min，线路拐角位为20um min，此要求太高。

建议: 线路油表面厚与线路拐角位油厚分别放松到15um min 与10um min.

Question: Solder mask is required to be 30um min over line and 20um min at corners, it’s too strict. Suggestion: Relax it to be 15um min over line and 10um min at corners,

问题：客户未规定镍金厚度要求。

建议：我们按镍厚2.54um min,金厚0.03—0.08um制作.

Question: Customer doesn’t specify thickness of Ni and gold.

Suggestion: Ni: 2.54um min and gold: 0.03---0.08um.

问题：客户未清楚指明层序。

建议：层序为：

Question: Customer doesn’t indicate layer sequence.

Suggestion: Layer sequence is

问题：客户未规定压板结构。

建议：按下图所示做。

Question: Customer doesn’t specify lay-up structure.

Suggestion: Follow below picture to do.

问题：客户未规定如何对电测试OK的板加注标记。

建议：A）板边划一条黑线。

B）板内盖白色的T印。

Question: Customer doesn’t specify how to take a mark for “E-Test OK” board.

Suggestion: A) Mark a black line at edge-board.

B) Take a white stamp on board.

问题：客户未指定V-CUT标准。

建议：V-CUT角度为30°±5°，余厚为0.40+/-0.10mm。

Question: Customer doesn’t specify V-cut standard.

Suggestion: V-cut angle: 30°±5°, residue thickness: 0.40+/-0.10mm。

问题：客户未指明斜边标准。

建议：按下图所示制作。

Question: Customer doesn’t specify bevel standard.

Suggestion: Follow below picture to do.

问题：请看下图，成品板四个角为直角，运输与包装过程中易造成板间擦伤。

建议：A）将直角改成R1.0mm的圆角。

B）不能更改。

Question: See below picture, four outer corners are rectangular, sharp corners will bring scratching between boards during transportation and packaging.

Suggestion: A) Change the rectangular corners into R1.0mm ones.

B) Take no change.

问题：板上P/N为ABCD，但客户资料上为EFG。

建议：A）将板上的P/N改为EFG.

B）将文件资料上的P/N改为ABCD。

C）不予理会。

Question: Part number is ABCD on board, but EFG in documents.

Suggestion: A) change ABCD into EFG on board.

B) change EFG into ABCD in documents.

C) Let them be.

问题：客户资料上版本为REV. A，但板上为REV.B。

建议：A）将板上版本改为REV. A。

B）将资料上版本改为REV. B.

C）不需做任何更改，允许版本不一致。

Question: Reversion No. is A in documents, but B on board.

Suggestion: A) Change A into B on board.

B) Change B into A in documents.

C) Not take any change, let them be.

钻孔部分

问题：客户未规定孔径公差。

建议：VIA Hole：+0.08/-0.40mm PTH：+/-0.08mm，NPTH：+/-0.05mm，Slot：width+0.08mm，length+/-0.10mm。

Question: Customer doesn’t specify tolerances for holes.

Suggestion: VIA Hole：+0.08/-0.40mm PTH：+/-0.08mm，NPTH：+/-0.05mm，Slot：width+0.08mm，length+/-0.10mm。

问题：客供图纸上“A”处数据与“B”处数据相矛盾，请看下图。

建议：a）按“A”处数据做。

b）按“B”处数据做。

Question: See below picture, the data marked “A” is conflict with “B” on the mechanical drawing.

Suggestion: a) Follow the data marked “A” to do.

b) Foll ow the data marked “B” to do.

问题：见下图，图纸上“A”处数据公差+/-0.05mm，超我司能力。

建议：将其放松到+/-0.10mm。

Question: See below picture, the tolerance(+/-0.05mm) marked “A” is out of our capability.

Suggestion: Relax it to be +/-0.10MM.

问题：图纸上“A”处数据为100.25mm（请看下图），Gerber中此处实测数据为100.34mm。

建议：a）按图纸做。

b）按Gerber做。

Question: See below picture, the data marked “A” is 100.25mm on drawing, but the factual

value is 100.34mm in Gerber.

Suggestion: a) Follow drawing to do.

b) Follow Gerber to do.

问题：请看下图，红色圆圈圈住的Slot宽度为0.65mm，长度为12mm。由于长度比较长，不宜钻出。如果锣出，其宽度又比最小锣刀的直径（0.8mm）还小，也无法锣出。

建议：将Slot宽度改为0.80mm以便锣出。

Question: See below picture, the slot (which is marked with red circle) size is 0.65mmX12mm. As the slot is very long, we have to rout it out, but our smallest rout bit is 0.8mm, it’s impossible to rout the slot out yet.

Suggestion: Change the slot width into 0.8mm.

问题：请看下图，一个0.86mm的孔与一个1.23mm的孔相互重叠。

建议：A）删去0.86mm的孔。

B）删去1.23mm的孔。

Question: See below picture, one 0.86mm hole overlaps another 1.23mm hole.

Suggestion: A) Delete 0.86mm hole.

B) Delete 1.23mm hole.

问题：请看下图，两个相同大小的孔部分重叠。

建议：为避免钻板时易断钻嘴，我们将其改作成Slot。

Question: See below picture, part of one hole overlaps part of another with same size.

Suggestion: Change the two holes into a slot to avoid easy disjunction of drill bit during drilling process.

问题：图纸中有一类孔为3.20mm，但钻带中却为3.25mm。

建议：A）做成3.20mm

B）做成3.25mm

Question: The hole size is 3.20mm on drawing, but 3.25mm in Gerber.

Suggestion: A) Make it as 3.20mm

B) Make it as 3.25mm.

问题：客户要求3.0mmPTH孔完成公差为+0.05/-0mm，此公差超出我司工艺能力。

建议：将公差放松到+0.10/-0mm。

Question: Customer requires +0.05/-0mm for 3.0mm PTH, the tolerance is out of capability.

Suggestion: Relax it to be +0.10/-0mm.

问题：客户没有规定哪些孔为PTH，哪些孔为NPTH。

建议： 3.0mm，4.10mm孔做成NPTH，其余做成PTH。

Ques tion: Customer doesn’t indicate which holes are PTH and which holes are NPTH.

Suggestion: 3.0mm,4.10mm holes are made into NPTH, others are made into PTH.

问题：请看下图，“a”处PTH（1.0mm）与“b”处PTH（2.10mm）的距离只有10mil

（我司工艺能力为14mil），电镀时易渗镀造成两孔短路。

建议：A）将两孔分别往相反方向移动2mil。

B）将两孔Size分别缩小0.05mm，即做成0.95mm与2.05mm。

Question: See below picture, the distance is only 10mil between 1.00mm hole marked “a” and 2.10mm hole marked “b” (it’s 14mil min distance for our normal workmanship), the close distance will easily cause shorts between the two holes in plating process.

Suggestion: A) shift the two hole 2mil away individually towards counter-directions.

B) Reduce 0.05mm for hole sizes, i.e. make them as 0.95mm and 2.05mm.

问题：板上没有NPTH，用PTH做锣板定位孔时易损伤孔壁铜。

建议：A)请看下图，我们于无铜区补加3个2.5mm的NPTH做锣板定位孔。

B) 不允许加NPTH，接受PTH孔铜擦花。

Question: There are no NPTHs in board. Hole copper will be easily hurt if we use PTH as tooling holes in routing process.

Suggestion: A) See below picture, we will add three 2.5mm NPTH in copper-free area and use

them as tooling holes.

B) Not permit to add extra NPTH and accept copper wall being hurt.

问题：请看下图，两个3.0mm的PTH离板边的距离只有10mil。

建议：A）按Gerber做，允许锣板时破孔。

B）将孔往内移动10mil，以免破孔。

Question: See below picture, two 3.0mm PTH are only 10mil away from edge board.

Suggestion: A) Follow Gerber to do and allow broken holes.

B) Shift holes 10mil away towards inside.

内层线路部分

问题：客户要求的底铜厚为2OZ，但最小线宽线距只有5/5mil（我司能力是8/6mil）。

建议：A）将底铜厚改为1OZ。

B）请更改GERBER并重新提供给我们。

C）取消此定单。

Question: Customer requires 2OZ base copper, but the minimum line width/spacing in Gerber is5/5mil (It’s 8/6mil for out capability)

Suggestion: A) Change base copper into 1OZ.

B) Please take changes for patterns and send new Gerber to us.

C) Cancel this order.

问题：见下图，板边一处线路离Outline只有4mil，锣板时会伤线。

建议：将线路内移至离板边12mil。

Question: See below picture, there is a line which is only 4mil way from edge board, it will be hurt during routing process.

Suggestion: Shift it towards inside 12mil away from edge board.

问题：请看下图，3.0mm NPTH钻在铜面上。

建议：A）削铜离孔10—12mil，以保证钻后不露铜。

B）按原装做，允许钻后露铜。

Question: See below picture, there is a 3.0mm NPTH lying in copper plane.

Suggestion: A) Cut suitable copper and keep copper 10—12mil far away from hole to ensure no copper exposure.

B). Follow Gerber and copper exposure is allowable.

问题：内层L2与L5完全相同。

建议：A）L2与L5完全相同是正确的，依原装做即可。

B）L2与L5完全相同是正确的，请提供新GERBER。

Question: We find out layer2 is as same as layer5 entirely.

Suggestion: A) They are right, just follow Gerber to do.

B) They are wrong, please provide us new modified Gerber.

问题：POWER层与GROUND层于红圈处短路，请看下图。

建议：A）正确，依原装做即可

B）错误，请提供新GERBER。

Question: The copper with red circle is short between POWER and GND planes,

Suggestion: A) It’s right, just fol low Gerber.

B) It’s wrong, please provide new Gerber.

问题：内层上有许多孤立PAD。

建议：A）删孤立PAD，以方便我司生产。

B）不可以删，要按GERBER做。

Question: There many isolated pads on inner layers.

Suggestion: A) Delete them to benefit our production process.

B) Not delete, just follow Gerber.

问题：工艺边无铜。

建议：A）为平衡压板时的板厚，我们于工艺边加Dummy copper，并将避开外层各种标记。

B）不可以加。

Question: No copper on breakaway.

Suggestion: A) To balance board thickness during pressing process, we add dummy copper, the copper will keep away from markings on outer layers.

B) Not permit to add extra dummy copper.

外层线路

问题：客户要求的底铜厚为2OZ，但最小线宽线距只有5/5mil（我司能力是6/6mil）。

建议：A）将底铜厚改为1OZ。

B）请更改GERBER并重新提供给我们。

C）取消此定单。

Question: Customer requires 2OZ base copper, but the minimum line width/spacing in Gerber is5/5mil (It’s 8/6mil for out capability)

Suggestion: A) Change base copper into 1OZ.

B) Please take changes and send new Gerber to us.

C) Cancel this order.:

问题：板边一处线路离Outline只有4mil，锣板时会伤线。

建议：将线路内移至离板边8—10mil。

Question: See below picture, there is a line which is only 4mil way from edge board, it will be hurt during routing process.

Suggestion: Shift it towards inside 8--10mil away from edge board.

问题：请看下图，3.0mm NPTH钻在铜面上。

建议：A）削铜离孔8--10mil，以保证干膜封孔。

B）依依原装做，允许钻后露铜。

Question: See below picture, there is a 3.0mm NPTH lying in copper plane.

Suggestion: A) Cut suitable copper and keep copper 8--10mil far away from hole to ensure dry film tenting.

B). Follow Gerber and take 2nd drill process, copper exposure is allowable.

问题：请看下图，3.0mm NPTH离旁边的线路只有4.5mil。

建议：移线离孔8mil，以保证干膜封孔及避免伤线。

Question: See below picture, 3.0mm NPTH is only 4.5mil far away from adjacent line.

Suggestion: Shift the line aside 8mil away from hole to ensure dry film tenting and to avoid line being hurt.

问题：请看下图，3.0mm NPTH离旁边的SMD之PAD只有5mil。

建议：A）削PAD 2mil以保证干膜封孔。

B）依原装做，允许钻后PAD边露铜。

Question: See below picture, 3.0mm NPTH is only 5mil far away adjacent pads of SMD. Suggestion: A) Cut 2mil copper of edg-pad to ensure dry film tenting.

B) Follow Gerber to do and allow copper exposure of edge-pad.

问题：3.0mm NPTH上的PAD单边比孔大6mil。

建议：A）删PAD，以保证干膜封孔。

B）将PAD加大到单边比孔大12mil，以免二钻时PAD剥离板面。

Question: The pad over 3.0MM NPTH is 6mil bigger than hole in all directions.

Suggestion: A) Delete the pad to ensure dry film tenting.

B) Extend the pad to be 12mil bigger than hole in all directions to avoid pad peeling off board during 2nd drilling process.

问题：请看下图，多处SMD之PAD间距小于7mil，无法印制绿油桥,喷锡时严重将严重短路。

建议：A）适当削PAD将间距加大到8mil，以免喷锡时严重短路。

B）将表面处理由喷锡改为沉金。

Question: See below picture, the spacings between many pads of SMDs are less than 7mil, it’s impossible to print solder mask between pads, thus serious shorts occur during HASL process.

Suggestion: A)Cut suitable copper of pads and extend the spacings to be 8mil.

B) Change HASL into immersion gold.

问题：请看下图，KEY PAD 要求印碳油，但PAD间间距只有20mil,无法印制。

建议：适当削PAD，将间距加大到26mil.

Question: See below picture, customer requires us to print carbon oil on key pads, but the spacings are only 20mil between pads, it’s hard to achieve.

Suggestion: Cut a little copper of key pad and extend the spacings to be 26mil.

问题：此板表面处理为沉金，但板上有KEY PAD。KEY PAD是不需要焊接的。

建议：A）KEY PAD上加印蓝胶。

B）不需加印蓝胶。

Question: The surface finish is immersion gold, but there are many key pads. Key pads will not be welded during assembly process.

Suggestion: A) Print peelable solder mask on key pads.

B) Not need to print solder mask on key pads.

问题：客户要求做V-CUT。

建议：请看下图，为防止漏V-CUT，我们补加V-CUT 测试线。

Question: Customer requires us to take V-cut.

Suggestion: See below picture, to avoid V-cut skip we add E-Test patterns.

绿油部分

问题：VIA孔两面都没有开窗。

建议：A）依原装做，允许绿油入孔或塞孔。

B）补加单边大孔4mil的开窗，不允许绿油入孔。

Question: Via holes have no solder mask openings on both sides.

Suggestion: A) Follow Gerber and allow solder mask to enter into or to plug holes.

B) Add solder mask openings which are 4mil bigger than holes in all directions and not allow solder mask to enter into holes.

问题：部分VIA孔只有一面开窗。

建议：A）依原装做，允许绿油入孔但不塞孔。

B）于无开窗的一面补加单边大孔4mil的开窗，不允许绿油入孔。

Question: Some via holes only have solder mask openings on one side.

Suggestion: A) Follow Gerber to do and allow solder mask to enter into but not to plug holes.

B) Not allow solder mask to enter into holes and add openings which are 4mil bigger than holes in all directions.

问题：VIA孔两面开窗单边大孔只有2mil。

建议：A）依原装做，允许绿油入孔但不塞孔

B）将开窗加大到加单边大孔4mil，不允许绿油入孔。

Question: Solder mask openings are only 2mil bigger than via holes in all directions on both sides. Suggestion: A) Follow Gerber and allow solder mask to enter into but not to plug holes.

B) Not allow solder mask to enter into holes and extend openings to be 4mil bigger than holes in all directions.

问题：部分插件孔只有一面开窗。

建议：A）按GERBER做，允许绿油入孔。

B）于无开窗的一面补加单边大孔4mil的开窗，不允许绿油入孔。

Question: There are solder mask openings over component holes only on one side.

Suggestion: A) Follow Gerber and allow solder mask to enter into but not to plug holes.

B) Not allow solder mask to enter into holes and add openings to be 4mil bigger than holes in all directions on another side.

问题：客户要求绿油塞孔，但有部分VIA孔离邻近的SMD之PAD不足6mil，易爆油上PAD。

建议：A）接受些许绿油上PAD。

B）不接受绿油上PAD，将这些过于靠近SMD PAD 的VIA 孔补加单边大孔4mil的开窗，取消塞孔要求。

Question: Customer requires us to plug all via holes with solder mask, but there are some holes which are only 6mil away from adjacent pads used for welding. Solder mask will splash onto the pads

because of high temperature during curing process.

Suggestion: A) Follow Gerber and accept solder mask splashing onto pads.

B) Not permit solder mask to splash onto pads and add solder mask openings over the via

holes which are less than 6mil far away from adjacent pads.

问题：客户提供了PASTE GERBER，但有一处PASTE缺绿油窗，请看下图。

建议：A）此处PASTE补加绿油窗。

B）不需补加绿油窗。

Question: Customer has provided us paste Gerber, but we find out one of paste have no solder mask opening. See below picture.

Suggestion: A) Add solder mask openings for this paste.

B) Just follow Gerber and not need to add solder mask opening for this paste.

问题：客户提供了PASTE GERBER，但有一处PASTE形状与对应的绿油窗不一致，请看下图。建议：A）将绿油窗的形状改做成与PASTE一致。

B）不需修改绿油窗，按原装做。

Question: Customer has provided us paste Gerber, but we find out the figure of one paste is different from the corresponding solder mask opening there. See below picture.

Suggestion: A) Change the figure of solder mask opening into as that of paste.

B) Just follow Gerber and not need to take any change.

问题：请看下图，密集蚀刻字开有绿油窗，喷锡后易发生锡堆积，造成字符不清。

建议：A）取消绿油窗。

B）按GERBER做，允许喷锡后字符不清。

Question: See below picture, the dense etching characters which have solder mask openings will be illegible because of solder pile-up during HASL process.

Suggestion: A) Cancel solder mask openings over the characters, that is to say, we will use solder mask to cover these characters.

B) Just follow Gerber and allow illegible characters after HASL

问题：请看下图，金手指基材区盖有绿油。

建议：金手指区改为开通窗，取消基材上绿油。

Question: See below picture, solder mask covers base material in gold finger area.

Suggestion: Cancel the solder mask.

问题：请看下图，BGA（或邦定位）区VIA孔两面开有绿油窗。

建议：A）取消VIA孔上绿油窗并塞孔。

B）按Gerber做,不允许绿油入孔。

Question: See below picture, via holes have solder mask openings on both sides in BGA(bonding) area. Suggestion: A) Cancel the openings and plug these holes with solder mask.

B) Follow Gerber to do and not allow solder mask to enter into holes.

问题：单元内有两个基准PAD没有开窗,见下图。

建议：A）补加3.0mm的开窗。

B）依GERBER 做。

Question: There are no solder mask openings over fiducial pads in each unit, see below picture. Suggestion: A) Add 3.0mm solder mask openings over pads.

B) Just follow Gerber to do.

字符部分：

问题：大锡面上有字符,见下图。

建议：A）依GERBER做。

B）将字符移开。

C）删去字符。

Question: There are silk characters over soldering plane，see below picture.

Suggestion: A) Follow Gerber to do.

B) Shift characters aside.

C) Delete characters.

问题：白油块处盖在开有绿油窗的PAD上,见下图。。

建议：A）削白油，使油补上PAD。

B）按GEERBER做，允许白油覆盖PAD。

Question: See below picture, silk block covers the pads with solder mask openings.

Suggestion: A) Clip silk block with solder mask openings and not allow silk oil to encroach onto pads.

B) Follow Gerber and allow silk oil to cover the pads.