集成电路的发展史

集成电路的发展史

主讲单位: CECC实验室

主讲人: 陈田

主要听众: 驰创电子

世界半导体发展史

1947

Bell Labs invents transistor on December 23. Its first commercial use is in products for the hearing impaired.

1948

Bell Labs grows single germanium crystal, offering more uniform electrical conduction and fewer defects.

1949

International Rectifier ships first commercial semiconductor devices. First chess-playing machine built by Claude Shannon.

1950

The grown junction transistor becomes the first devise with enough predictability and dependability to use in

a range of consumer goods.

1951

Univac delivers a computer to the census bureau.

1952

Texas Instruments (TI) enters the semiconductor business.

Motorola establishes a solid state electronics R&D lab in Phoenix to capitalize on the recent inventions of the transistor.

IBM unveils the 701, the first computer to store electronic programs.

1953

Motorola applies for its first semiconductor related patent to develop low cost transistors for audio power stages of radio communication receivers and auto radios.

1954

Transistor radio, developed by Texas Instruments and sold by the IDEA Co. of Ohio, hits the market.

TI develops the silicon junction transistor. Its higher melting point makes it ideal for space and military use.

Bell Labs introduces an all-transistor computer.

1955

Bells Labs introduces photoresist, a technique still used today to mass produce batches of identical circuits.

1956

General Electric introduces first solid-state silicon switches.

1957

"Explorer," the first U.S. orbiting satellite, uses transistor technology.

Fairchild Semiconductor becomes the first company to work exclusively with silicon.

The semiconductor industry surpasses $100 million in sales for the first time.

1958

Cray introduces all-transistor supercomputer.

Texas Instruments’Jack Kilby demonstrates first integrated circuit (IC).

U.S. Air Force incorporates semiconductors in Minutemen Missile design. The Pentagon and NASA quickly become two of the industry’s major customers.

1959

National Semiconductor opens in Danbury, Connecticut.

Fairchild Semiconductor’s Robert Noyce commercializes process for making ICs.

1960

Digital Equipment Corp. produces the first mini-computer, known as the PDP-1.

AT&T invents the first modem.

1961

TI builds the first integrated circuit computer.

Motorola is the first to use the epitaxial method, developed by Bell Labs, to mass produce semiconductors.

This low-cost technique made the auto alternator a reasonably priced and more durable replacement for the auto generator.

Motorola is the first to use the epitaxial method, developed by Bell Labs, to mass produce semiconductors.

1962

Motorola Corp. introduces the first transistorized walkie-talkie known as the Handi-Talkie HT-200.

1963

Companies begin shipping integrated circuits.

1964

Texas Instruments provides the first ICs used in a consumer product, a hearing aid.

IBM unveils the System/360, the first family of computers.

The semiconductor industry surpasses $1 billion in sales for the first time.

1965

Gordon Moore predicts exponential growth (biannual doubling) in chip power. It becomes known as "Moore’s Law.“

1966

Hewlett-Packard introduces the first solid-state oscilloscope. Silicon technology makes the key electronics test instrument lighter and smaller.

1967

Texas Instruments invents handheld calculator.

Motorola introduces the Quasar line of all-transistor color TVs.

1968

Andy Grove, Robert Noyce and Gordon Moore create Intel Corp. That same year Intel introduces the first 1k RAM.

1969

Apollo mission lands first men on the moon aided by a variety of semiconductors.

Advanced Micro Devices incorporates with $100,000.

1970

Intel introduces DRAM. This chip becomes the memory component of computers and other electronics, and

a source of trade strife when the U.S. later accuses the Japanese of "dumping," a term for selling products

below market price.

1971

Intel invents SRAM and EPROM and introduces microprocessors, which enable the "brains" of a computer to be on one chip for the first time.

Shortly after Intel introduces the 4004, TI introduces a single-chip microprocessor.

Alan Shugart of IBM invents the floppy disk.

1972

Hewlett-Packard introduces the first scientific pocket calculator. It sent slide rule manufacturers out of

business.

1973

Price scanner introduced. The UPC symbol becomes ubiquitous.

Motorola introduces the portable cellular radio-telephone, the precursor to the modem cell phone.

1974

Bell Labs invents and IBM uses electron beams in chip production.

Zilog introduces the Z-80 microprocessor.

Motorola introduces the 6800 microprocessor.

Xerox invents the built-in mouse.

1975

Altair, the first personal computer, goes on market.

Bill Gates and Paul Allen launch Microsoft.

1976

Steve Wozniak and Steve Jobs found Apple Computer.

The first word-processing program, Electric Pencil, is unveiled.

1977

U.S. semiconductor company pioneers form Semiconductor Industry Association.

Monolithic Memories Inc. invents field programmable logic, the first logic devise that can be programmed by users.

SIA takes over administration of the Semiconductor Trade Statistics Program (STSP); now known as the World Semiconductor Trade Statistics (WSTS).

1978

SIA forms 6 major committees on: trade policy, education, worker safety, trade statistics, investment and capital formation, and a technical advisory committee.

Micron opens in Boise, Idaho as a semiconductor design consulting firm.

TI introduces the first single-chip speech synthesizer. Its first use: The Speak & Spell Toy.

1979

Motorola introduces the 16-bit microprocessor. Its two-million-calculations-per-second capability is adopted by Apple Computer for its Macintosh PCs.

Bell Labs introduces a single-chip digital signal processor that performs speech compression, filtering, error corrections and other functions much faster and better than multiple chips.

The semiconductor industry surpasses $10 billion in sales.

1980

SIA commissions a major research study by Chase Financial Policy on the cost of capital in the

semiconductor industry; which finds U.S. firms facing significant disadvantages compared to their

international competitors.

IBM enters the PC business with a line of desktop PCs, later to become the single largest use for

microprocessors.

Motorola introduces first pager to incorporate a microprocessor,allowing longer battery life and the ability to have more pagers on a network.

1981

In response to SIA advocacy efforts, the U.S. and Japan lower semiconductor tariffs to 4.2 percent.

Hewlett-Packard introduces the first scientific pocket calculator. It sent slide rule manufacturers out of

business.

LSI Logic introduces gate array, the first semi-custom chip.

SIA helps gain approval of the federal R&D tax credit.

1982

SIA forms Semiconductor Research Corp. (SRC) to plan, direct and fund pre-competitive silicon research programs at major universities.

Xilinx invents field programmable gate arrays, chips that can be customized by the user.

VLSI introduces standard cells, predefined circuit elements for custom chips.

1983

Motorola’s first cellular phone comes to market.

AMD introduces INT. STD. 1000.

SIA efforts lead to creation of U.S. Japan Working Group on High Tech to resolve trade issues.

The SIA Japan Chapter, made up of senior level executives from SIA member companies doing business in Japan, is created to provide and industry-to-industry dialogue between Japanese and American companies.

1984

Chip Protection Act becomes law, creating the first new form of intellectual property protection in the United States since the 19th century.

The SIA-supported Trade and Tariff Act of 1984 becomes law, authorizing negotiation of high tech trade issues and tariff elimination.

Congress revises antitrust laws to allow joint R&D consortia.

IBM develops a one-million bit RAM.

Anti-lock brakes begin using microcontrollers.

Apple introduces the Macintosh computer.

1985

U.S. and Japanese governments agree to eliminate tariffs on semiconductors. SIA files petition with U.S.

government, citing unfair Japanese market barriers.

Intel drops out of DRAM business.

1986

At the urging of SIA, U.S. and Japan sign agreement to end dumping practices and open Japan’s market; yet nine of eleven U.S. DRAM manufacturers leave market, and Japan overtakes U.S. as the world’s leading semiconductor producer.

Japanese firms lose $4 billion in quest for semiconductor dominance.

Compaq unveils 386-based PCs.

Bell Labs introduces neural network chips that mimic the way some brain cells retrieve stored information and solve problems.

1987

SIA forms SEMATECH, a consortium of chip manufacturers dedicated to improving manufacturing

technology.

At the urging of SIA, U.S. imposes $300 million in trade sanctions against Japan for failing to comply with antidumping agreement.

U.S. EPROM manufacturers regain worldwide lead; next to DRAM, EPROMs are most critical commodity product.

1988

With the SIA’s encouragement, the U.S. Congress approves the formation of the National Advisory

Committee on Semiconductors (NACS).

Reduced Instruction Set Chip (RISC) technology becomes available commercially, allowing faster, less memory-intensive programming options.

After meeting with the SIA, the Electronic Industries Association of Japan (EIAJ) forms the Users Committee of Foreign Semiconductors (UCOM) in an effort to provide greater access for foreign suppliers in the Japan market.

The U.S. semiconductor industry reinforces its commitment to the Japan market by opening an SIA office in Tokyo, Japan.

1989

The SIA and EIAJ establish a consumer task force to discuss methods to increase foreign chip sales to Japanese consumer equipment makers.

SIA commissions a three-year $3.5 million reproductive health study to determine if some chemicals used in chip plants cause health problems.

Members of the SIA’s Health and Safety Committee and EIAJ initiate annual meetings to discuss

semiconductor safety and environmental issues. These meetings are the precursor to the international ESH conferences, beginning in 1984.

1990

SIA’s Technology Strategy Committee is created to track industry technology requirements and make

recommendations to the industry.

Panasonic Palmcorder is introduced using LSI Logic chips. LSI was the first U.S. company to design a chip specifically for a Japanese company’s consumer product.

Internet use tops 100,000.

1991

Japan & U.S. announce new trade agreement committing Japan to open its market to foreign

semiconductors and providing a strong deterrent to dumping.

SIA is presented the prestigious "E Award" by U.S. Secretary of Commerce Robert Mosbacher for the

association’s outstanding efforts to increase American exports.

1992

SIA’s reproductive health study recommends phasing out some chemicals used in manufacturing chips.

Technology experts gather to design a 15-year roadmap for national semiconductor research needs; known as the National Technology Roadmap.

Microsoft introduces Windows 3.1.

1993

Through the efforts led by the SIA, U.S. overtakes Japan in worldwide chip sales.

IBM and Motorola introduce RISC chip for PCs.

Harris Corp. introduces Monster Power ICs (MCT). They help motorized products from refrigerators to jet fighters operate more efficiently.

1994

The SIA succeeds in achieving Congressional approval of the Uruguay Round of multilateral trade

negotiations that establishes the World Trade Organization (WTO), lowers semiconductor tariffs, strengthens intellectual property protection, and maintains effective antidumping provisions.

U.S. Labor Department ranks the semiconductor industry as America’s second safest, reflecting a dramatic reduction in work-related injury and illness rates among domestic semiconductor workers.

The semiconductor industry surpasses $100 billion sales.

1995

Foreign share of Japanese market exceeds 20 percent for the first time.

SIA explores the rapidly growing Chinese market in its document,"Semiconductors in China: Defining

American Interest."

The SIA and EIAJ jointly announce the Emerging Applications Cooperative Project and other efforts to

stimulate major design-ins and other business opportunities in Japan for foreign semiconductor

manufacturers.

1996

U.S. fabrication facility growth explodes as chips become increasingly prevalent in new consumer products.

High-end chips make computer networking, telephone communications and internet connections faster and smarter.

U.S. and Japan approve new trade agreement on semiconductors as foreign share in Japan approaches 30 percent. Agreement calls for the establishment of the World Semiconductor Council (WSC).

AT&T spins off Lucent, the portion of the telephone giant once known as Bell Labs.

SIA members negotiate memorandum on global warming with U.S. Environmental Protection Agency.

Companies agree to continue reducing their usage of ozone-depleting chemicals.

1997

SIA unveils the Focus Center Program. The new consortium is designed to tackle technology roadblocks by focusing on long-term research (eight years and beyond).

A new edition of the National Technology Roadmap is released worldwide.

The SIA, working with the U.S. government and 38 other countries, accounting for more than 92 percent of the global trade and information technology products, creates the Information Technology Agreement (ITA).

The ITA eliminates duties on chips, computers and telecommunications equipment.

1998

SIA creates a Workforce Strategy Committee to address the critical need of an increased and educated workforce.

The SIA and its coalition partners successfully lobbies to secure passage of the "American Competitiveness and Workforce Improvement Act of 1998," which nearly doubles the number of foreign engineers and

scientists whole will be eligible to work for technology companies in the U.S.

New SIA study shows that the semiconductor industry is the No. 1driver of

growth for the U.S. economy, providing jobs for 260,000 people and creating an additional 1.4 millions jobs for people who provide goods and services for the industry.

U.S. chip companies command more than 50 percent of the global market.

The SIA and a coalition of high technology companies successfully lobby to secure the Securities Litigation Uniform Standard Act of 1998, which makes federal court the sole venue for hearing class action suits on securities fraud allegations against companies with rapid fluctuations in stock prices and eliminates frivolous lawsuits in state courts.

The WSC receives the 1998 Climate Protection Award from the U.S.Environmental Protection Agency.

1999

1999became known as the "year of recovery" for the semiconductor industry. Sales shift the demand from PCs to communications products.

The SIA and member companies lobby extensively to achieve the top 1999 legislative priority with the

passage of the Y2K bill to limit frivolous lawsuits against American businesses and industries.

The 1st two Focus Centers become fully operational at UC Berkeley and

Georgia Tech.

The U.S. and China agreed to the terms of China’s accession to the WTO.

SIA establishes a presence in China by joining other electronic associations in the U.S. Information

Technology Office in Beijing (USITO).

SIA successfully lobbies for an R&D tax credit extension for an additional five years.

2000

In 2000, the technology roadmap becomes international and the 2000 International Roadmap for Semiconductors (ITRS) is released.

Worldwide semiconductor sales exceed $200 billion for the first time in

semiconductor history.

The semiconductor industry becomes recognized by the US Bureau of Labor and ranked 2nd in the nation for the lowest injury and illness rate out of 208 durable goods manufacturing industries.

The SIA lobbies extensively for passage of Permanent Trade Relations legislation with China in order to ensure that China lowers its tariffs on semiconductors, respects intellectual property rights, allows semiconductor

companies to sell directly to China without using middlemen, and eliminates investment barriers, among other measures.

SIA Board funds a major initiative to increase the number of undergraduate engineers interested in

semiconductor careers.

SIA establishes a Scientific Advisory Committee (SAC), an independent panel commissioned to review existing industry data to address allegations of cancer risks among semiconductor employees.

2001

China formally joined the WTO on terms advocated by the SIA.

Two additional Focus Centers were created: "Materials, Structures and Devices" and Circuits, Systems and Software."

The National Science Foundation sees a 8 percent increase in funding.

As a result of SIA’s efforts, China begins to provide intellectual property protection for registered IC designs and eliminate its tariffs on semiconductors.

2002

SIA successfully lobbies Congress to appropriate $10.5 billion for science and technology at the Defense

Department, a 12 percent increase over the prior year, along with a 2 percent increase for the Department of Energy’s Science Office.

SIA is instrumental in helping to assure that harmful legislation requiring expensing of employee stock options or minimum holding periods for executive stock grants is not enacted.

SIA scores a major victory in streamlining U.S. export controls when the President eliminates MTOPS controls on commercial export of microprocessors.

SIA helps secure Congressional passage of a $25 million technology talent expansion program that SIA had strongly advocated.

SIA embarks on Worker Health Project to determine and further minimize any potential risks to our employees.

SIA successfully advocated Congressional approval of Trade Promotion Authority (TPA).

SIA releases the 2002 International Technology Roadmap for Semiconductors (ITRS)

SIA publishes a commemorative book, Beyond Imagination, chronicling the semiconductor industry since its inception.

SIA honors Dr. Gordon Moore with its first-ever Lifetime Achievement Award.

2000

In 2000, the technology roadmap becomes international and the 2000 International Roadmap for Semiconductors (ITRS) is released.

Worldwide semiconductor sales exceed $200 billion for the first time in

semiconductor history.

The semiconductor industry becomes recognized by the US Bureau of Labor and ranked 2nd in the nation for the lowest injury and illness rate out of 208 durable goods manufacturing industries.

The SIA lobbies extensively for passage of Permanent Trade Relations legislation with China in order to ensure that China lowers its tariffs on semiconductors, respects intellectual property rights, allows semiconductor

companies to sell directly to China without using middlemen, and eliminates investment barriers, among other measures.

SIA Board funds a major initiative to increase the number of undergraduate engineers interested in

semiconductor careers.

SIA establishes a Scientific Advisory Committee (SAC), an independent panel commissioned to review existing industry data to address allegations of cancer risks among semiconductor employees.

2001

China formally joined the WTO on terms advocated by the SIA.

Two additional Focus Centers were created: "Materials, Structures and Devices" and Circuits, Systems and Software."

The National Science Foundation sees a 8 percent increase in funding.

As a result of SIA’s efforts, China begins to provide intellectual property protection for registered IC designs and eliminate its tariffs on semiconductors.

2002

SIA successfully lobbies Congress to appropriate $10.5 billion for science and technology at the Defense

Department, a 12 percent increase over the prior year, along with a 2 percent increase for the Department of Energy’s Science Office.

SIA is instrumental in helping to assure that harmful legislation requiring expensing of employee stock options or minimum holding periods for executive stock grants is not enacted.

SIA scores a major victory in streamlining U.S. export controls when the President eliminates MTOPS controls on commercial export of microprocessors.

SIA helps secure Congressional passage of a $25 million technology talent expansion program that SIA had strongly advocated.

SIA embarks on Worker Health Project to determine and further minimize any potential risks to our employees.

SIA successfully advocated Congressional approval of Trade Promotion Authority (TPA).

SIA releases the 2002 International Technology Roadmap for Semiconductors (ITRS)

SIA publishes a commemorative book, Beyond Imagination, chronicling the semiconductor industry since its inception.

SIA honors Dr. Gordon Moore with its first-ever Lifetime Achievement Award.

中国半导体发展史

1947年，美国贝尔实验室发明了半导体点接触式晶体管，从而开创了人类的硅文明时代。

1956年，我国提出“向科学进军”，根据国外发展电子器件的进程，提出了中国也要研究半导体科学，把半导体技术列为国家四大紧急措施之一。

1957年，北京电子管厂通过还原氧化锗，拉出了锗单晶。中国科学院应用物理研究所和二机部十局第十一所开发锗晶体管。当年，中国相继研制出锗点接触二极管和三极管（即晶体管）。

1958年，美国德州仪器公司和仙童公司各自研制发明了半导体集成电路（IC）之后，发展极为迅猛，从SSI （小规模集成电路）起步，经过MSI（中规模集成电路），发展到LSI（大规模集成电路），然后发展到现在的VLSI（超大规模集成电路）及最近的ULSI（特大规模集成电路），甚至发展到将来的GSI（甚大规模集成电路），届时单片集成电路集成度将超过10亿个元件。

1959年，天津拉制出硅（Si）单晶。

1960年，中科院在北京建立半导体研究所，同年在河北建立工业性专业化研究所――第十三所（河北半导体研究所）。

1962年，天津拉制出砷化镓单晶（GaAs），为研究制备其他化合物半导体打下了基础。

1962年，我国研究制成硅外延工艺，并开始研究采用照相制版，光刻工艺。

1963年，河北省半导体研究所制成硅平面型晶体管。

1964年，河北省半导体研究所研制出硅外延平面型晶体管。

1965年12月，河北半导体研究所召开鉴定会，鉴定了第一批半导体管，并在国内首先鉴定了DTL型（二极管――晶体管逻辑）数字逻辑电路。1966年底，在工厂范围内上海元件五厂鉴定了TTL电路产品。这些小规模双极型数字集成电路主要以与非门为主，还有与非驱动器、与门、或非门、或门、以及与或非电路等。标志着中国已经制成了自己的小规模集成电路。

1968年，组建国营东光电工厂（878厂）、上海无线电十九厂，至1970年建成投产，形成中国IC产业中的“两霸”。

1968年，上海无线电十四厂首家制成PMOS（P型金属－氧化物半导体）电路（MOSIC）。拉开了我国发展MOS电路的序幕，并在七十年代初，永川半导体研究所（现电子第24所）、上无十四厂和北京878厂相继研制成功NMOS电路。之后，又研制成CMOS电路。

七十年代初，IC价高利厚，需求巨大，引起了全国建设IC生产企业的热潮，共有四十多家集成电路工厂建成，四机部所属厂有749厂（永红器材厂）、871（天光集成电路厂）、878（东光电工厂）、4433厂（风光电工厂）和4435厂（韶光电工厂）等。各省市所建厂主要有：上海元件五厂、上无七厂、上无十四厂、上无十九厂、苏州半导体厂、常州半导体厂、北京半导体器件二厂、三厂、五厂、六厂、天津半导体（一）厂、航天部西安691厂等等。

1972年，中国第一块PMOS型LSI电路在四川永川半导体研究所研制成功。

1973年，我国7个单位分别从国外引进单台设备，期望建成七条3英寸工艺线，最后只有北京878厂，航天部陕西骊山771所和贵州都匀4433厂。

1976年11月，中国科学院计算所研制成功1000万次大型电子计算机，所使用的电路为中国科学院109厂（现中科院微电子中心）研制的ECL型（发射极耦合逻辑）电路。

1982年，江苏无锡的江南无线电器材厂（742厂）IC生产线建成验收投产，这是一条从日本东芝公司全面引进彩色和黑白电视机集成电路生产线，不仅拥有部封装，而且有3英寸全新工艺设备的芯片制造线，不但引进了设备和净化厂房及动力设备等“硬件”，而且还引进了制造工艺技术“软件”。这是中国第一次从国外引进集成电路技术。第一期742厂共投资2.7亿元（6600万美元），建设目标是月投10000片3英寸硅片的生产能力，年产2648万块IC成品，产品为双极型消费类线性电路，包括电视机电路和音响电路。到1984年达产，产量达到3000万块，成为中国技术先进、规模最大，具有工业化大生产的专业化工厂。

1982年10月，国务院为了加强全国计算机和大规模集成电路的领导，成立了以万里副总理为组长的“电子计算机和大规模集成电路领导小组”，制定了中国IC发展规划，提出“六五”期间要对半导体工业进行技术改造。

1983年，针对当时多头引进，重复布点的情况，国务院大规模集成电路领导小组提出“治散治乱”，集成电路要“建立南北两个基地和一个点”的发展战略，南方基地主要指上海、江苏和浙江，北方基地主要指北京、天津和沈阳，一个点指西安，主要为航天配套。

1986年，电子部厦门集成电路发展战略研讨会，提出“七五”期间我国集成电路技术“531”发展战略，即普及推广5微米技术，开发3微米技术，进行1微米技术科技攻关。

1988年，871厂绍兴分厂，改名为华越微电子有限公司。

1988年9月，上无十四厂在技术引进项目，建了新厂房的基础上，成立了中外合资公司――上海贝岭微电子制造有限公司。

1988年，在上海元件五厂、上无七厂和上无十九厂联合搞技术引进项目的基础上，组建成中外合资公司――上海飞利浦半导体公司（现在的上海先进）。

1989年2月，机电部在无锡召开“八五”集成电路发展战略研讨会，提出了“加快基地建设，形成规模生产，注重发展专用电路，加强科研和支持条件，振兴集成电路产业”的发展战略。

1989年8月8日，742厂和永川半导体研究所无锡分所合并成立了中国华晶电子集团公司。

1990年10月，国家计委和机电部在北京联合召开了有关领导和专家参加的座谈会，并向党中央进行了汇报，决定实施九O八工程。

1991年，首都钢铁公司和日本NEC公司成立中外合资公司――首钢NEC电子有限公司。

1995年，电子部提出“九五”集成电路发展战略：以市场为导向，以CAD为突破口，产学研用相结合，以我为主，开展国际合作，强化投资，加强重点工程和技术创新能力的建设，促进集成电路产业进入良性循环。

1995年10月，电子部和国家外专局在北京联合召开国内外专家座谈会，献计献策，加速我国集成电路产业发展。11月，电子部向国务院做了专题汇报，确定实施九0九工程。

1997年7月17日，由上海华虹集团与日本NEC公司合资组建的上海华虹NEC电子有限公司组建，总投资为12亿美元，注册资金7亿美元，华虹NEC主要承担“九0九”工程超大规模集成电路芯片生产线项目建设。

1998年1月，华晶与上华合作生产MOS圆片合约签定，有效期四年，华晶芯片生产线开始承接上华公司来料加工业务。

1998年1月18日，“九0八”主体工程华晶项目通过对外合同验收，这条从朗讯科技公司引进的0.9微米的生产线已经具备了月投6000片6英寸圆片的生产能力。

1986年，电子部厦门集成电路发展战略研讨会，提出“七五”期间我国集成电路技术“531”发展战略，即普及推广5微米技术，开发3微米技术，进行1微米技术科技攻关。

1988年，871厂绍兴分厂，改名为华越微电子有限公司。

1988年9月，上无十四厂在技术引进项目，建了新厂房的基础上，成立了中外合资公司――上海贝岭微电子制造有限公司。

1988年，在上海元件五厂、上无七厂和上无十九厂联合搞技术引进项目的基础上，组建成中外合资公司――上海飞利浦半导体公司（现在的上海先进）。

1989年2月，机电部在无锡召开“八五”集成电路发展战略研讨会，提出了“加快基地建设，形成规模生产，注重发展专用电路，加强科研和支持条件，振兴集成电路产业”的发展战略。

1989年8月8日，742厂和永川半导体研究所无锡分所合并成立了中国华晶电子集团公司。

1990年10月，国家计委和机电部在北京联合召开了有关领导和专家参加的座谈会，并向党中央进行了汇报，决定实施九O八工程。

1991年，首都钢铁公司和日本NEC公司成立中外合资公司――首钢NEC电子有限公司。

1995年，电子部提出“九五”集成电路发展战略：以市场为导向，以CAD为突破口，产学研用相结合，以我为主，开展国际合作，强化投资，加强重点工程和技术创新能力的建设，促进集成电路产业进入良性循环。

1995年10月，电子部和国家外专局在北京联合召开国内外专家座谈会，献计献策，加速我国集成电路产业发展。11月，电子部向国务院做了专题汇报，确定实施九0九工程。

1997年7月17日，由上海华虹集团与日本NEC公司合资组建的上海华虹NEC电子有限公司组建，总投资为12亿美元，注册资金7亿美元，华虹NEC主要承担“九0九”工程超大规模集成电路芯片生产线项目建设。

1998年1月，华晶与上华合作生产MOS圆片合约签定，有效期四年，华晶芯片生产线开始承接上华公司来料加工业务。

1998年1月18日，“九0八”主体工程华晶项目通过对外合同验收，这条从朗讯科技公司引进的0.9微米的生产线已经具备了月投6000片6英寸圆片的生产能力。

1998年1月，中国华大集成电路设计中心向国内外用户推出了熊猫2000系统，这是我国自主开发的一套EDA系统，可以满足亚微米和深亚微米工艺需要，可处理规模达百万门级，支持高层次设计。

1998年2月，韶光与群立在长沙签订LSI合资项目，投资额达2.4亿元，合资建设大规模集成电路（LSI）微封装，将形成封装、测试集成电路5200万块的生产能力。

1998年2月28日，我国第一条8英寸硅单晶抛光片生产线建成投产，这个项目是在北京有色金属研究总院半导体材料国家工程研究中心进行的。

1998年3月16日，北京华虹集成电路设计有限责任公司与日本NEC株式会社在北京长城-饭店举行北京华虹NEC 集成电路设计公司合资合同签字仪式，新成立的合资公司其设计能力为每年约200个集成电路品种，并为华虹NEC生产线每年提供8英寸硅片两万片的加工订单。

1998年4月，集成电路“九0八”工程九个产品设计开发中心项目验收授牌，这九个设计中心为信息产业部电子第十五研究所、信息产业部电子第五下四研究所、上海集成电路设计公司、深圳先科设计中心、杭州东方设计中心、广东专用电路设计中心、兵器第二一四研究所、北京机械工业自动化研究所和航天工业771研究所。这些设计中心是与华晶六英寸生产线项目配套建设的。

1998年6月，上海华虹NEC九0九二期工程启动。

1998年6月12日，深港超大规模集成电路项目一期工程――后工序生产线及设计中心在深圳赛意法微电子有限公司正式投产，其集成电路封装测试的年生产能力由原设计的3.18亿块提高到目前的7.3亿块，并将扩展的10亿块的水平。

1998年10月，华越集成电路引进的日本富士通设备和技术的生产线开始验收试制投片，-该生产线以双极工艺为主、兼顾Bi-CMOS工艺、2微米技术水平、年投5英寸硅片15万片、年产各类集成电路芯片1亿只能力的前道工序生产线及动力配套系统。

1998年3月，由西安交通大学开元集团微电子科技有限公司自行设计开发的我国第一个-CMOS微型彩色摄像芯片开发成功，我国视觉芯片设计开发工作取得的一项可喜的成绩。

1999年2月23日，上海华虹NEC电子有限公司建成试投片，工艺技术档次从计划中的0.5微米提升到了0.35微米，主导产品64M同步动态存储器（S－DRAM）。这条生产线的建-成投产标志着我国从此有了自己的深亚微米超大规模集成电路芯片生产线。