IRG4BC30FD1中文资料
IRG4BC30FD1
PD - 94773
09/03/03
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V CES = 600V
V CE(on) typ. = 1.59V
@V GE = 15V, I C = 17A
Fast CoPack IGBT
INSULATED GATE BIPOLAR TRANSISTOR WITH HYPERFAST DIODE
Features
Fast: optimized for medium operating frequencies
(1-5 kHz in hard switching, >20kHz in resonant mode). Generation 4 IGBT design provides tighter
parameter distribution and higher efficiency than Generation 3.
IGBT co-packaged with Hyperfast FRED diodes for ultra low recovery characteristics.
Industry standard TO-220AB package.
Benefits
Generation 4 IGBT's offer highest efficiency available. IGBT's optimized for specific application conditions. FRED diodes optimized for performance with IGBT's. Minimized recovery characteristics require less / no snubbing.
IRG4BC30FD1
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IRG4BC30FD1
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Fig. 1 - Typical Load Current vs. Frequency
(For square wave, I=I RMS of fundamental; for triangular wave, I=I PK )
Fig. 2 - Typical Output Characteristics Fig. 3 - Typical Transfer Characteristics
110100
10001
10
CE
C I , C o l l e c t o r -t o -E m i t t e r C u r r e n t (A )
V , Collector-to-Emitter Voltage (V)
110
100
1000
5
6
7
8
9
10
11
12
13
C
I , C o l l e c t o r -t o -E m i t t e r C u r r e n t (A )GE
V , Gate-to-Emitter Voltage (V)
IRG4BC30FD1
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Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
Fig. 5 - Typical Collector-to-Emitter Voltage
vs. Junction Temperature
Fig. 4 - Maximum Collector Current vs. Case
Temperature
1.0
1.5
2.0
2.5
-60
-40
-20
20
40
60
80
100120140160
C E V , C o l l e c t o r -t o -E m i t t e r V o l t a g e (V )
T , Junction Temperature (°C)J
0.01
0.1
1
10
0.00001
0.00010.0010.010.1110
t , Rectangular Pulse Duration (sec)1
t h J
C
T h e r m a l R e s p o n s e (Z )
010
20
30
40
25
50
75
100
125
150
M a x i m u m D C C o l l e c t o r C u r r e n t (A )
T , Case Temperature (°C)C
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Fig. 10 - Typical Switching Losses vs.
Junction Temperature
Fig. 9 - Typical Switching Losses vs. Gate
Resistance Fig. 8 - Typical Gate Charge vs.
Gate-to-Emitter Voltage
Fig. 7 - Typical Capacitance vs.Collector-to-Emitter Voltage 0
10
20
30
40
50
R G , Gate Resistance (?)1600
1700
1800
1900
2000
T o t a l S w i c h i n g L o s s e s (m J
)
1
10
100
1000
V CE , Collector-toEmitter-Voltage(V)
02004006008001000120014001600
18002000C a p a c i t a n c e (p F )
10
20
30
40
50
60
Q G , Total Gate Charge (nC)
2468101214V G E , G a t e -t o -E m i t t e r V o l t a g e (V )
T J , Juntion Temperature (°C)
T o t a l S w i c h i n g L o s s e s (m J )
IRG4BC30FD1
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Fig. 12 - Turn-Off SOA
Fig. 11 - Typical Switching Losses vs.
Collector-to-Emitter Current
110
100
1000
1
10
100
1000
C
CE
V , Collector-to-Emitter Voltage (V)I , C o l l e c t o r -t o -E m i t t e r C u r r e n t (A )Fig. 13 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current
Forward V oltage D rop - V FM (V)
10203040
I C , Collecto-to-Emitter (A)
1000
200030004000500060007000
8000
T o t a l S w i c h i n g L o s s e s (m J )
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Fig. 14 - Typical Reverse Recovery vs. di f /dt
Fig. 15 - Typical Recovery Current vs. di f /dt
Fig. 16 - Typical Stored Charge vs. di f /dt Fig. 17 - Typical di (rec)M /dt vs. di f /dt
1002003004005006007008009001000
di F /dt (A/μs)
255075100125
150
175200t r r (n s )
1002003004005006007008009001000
di F /dt (A/μs)
100200
300400500600
7008009001000Q r r (n C
)
1002003004005006007008009001000
di F /dt (A/μs)
200
400
600
800
1000
1200
1400
d i (r
e c )M / d t (A /μs
)
1002003004005006007008009001000
di F /dt (A/μs)
5
10
15
20
I R R M (A )
IRG4BC30FD1
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Fig. 18a - Test Circuit for Measurement of
I LM , E on , E off(diode), t rr , Q rr , I rr , t d(on), t r , t d(off), t f
t2
Fig. 18b - Test Waveforms for Circuit of Fig. 18a, Defining
E off , t d(off), t f
Fig. 18c - Test Waveforms for Circuit of Fig. 18a,
Defining E on , t d(on), t r
Fig. 18d - Test Waveforms for Circuit of Fig. 18a,
Defining E rec , t rr , Q rr , I rr
IRG4BC30FD1
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Vg GATE SIGNAL
DEVICE UNDER TEST
CURRENT D.U.T.
VOLTAGE IN D.U.T.
CURRENT IN D1
t0t1t2
Fig. 19 - Clamped Inductive Load Test Circuit
Fig. 20 - Pulsed Collector Current
Test Circuit
=
480V
4 X I C @25°C
Fig.18e - Macro Waveforms for Figure 18a's Test Circuit
IRG4BC30FD1
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Notes:
Repetitive rating: V GE =20V; pulse width limited by maximum junction temperature (figure 20). V CC =80%(V CES ), V GE =20V, L=10μH, R G = 23? (figure 19). Pulse width ≤ 80μs; duty factor ≤ 0.1%. Pulse width 5.0μs, single shot.
Energy losses include "tail" and diode reverse recovery, using Diode FD100H06A5.Data and specifications subject to change without notice.
This product has been designed and qualified for the Industrial market.
Qualification Standards can be found on IR’s Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
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TO-220 package is not recommended for Surface Mount Application.
LEAD ASSIGNMENTS 1 - GATE 2 - DRAIN 3 - SOURCE 4 - DRAIN
- B -1.32 (.052)1.22 (.048)
3X
0.55 (.022)0.46 (.018)
2.92 (.115)2.64 (.104)
4.69 (.185)4.20 (.165)
3X
0.93 (.037)0.69 (.027)
4.06 (.160)3.55 (.140)
1.15 (.045) MIN
6.47 (.255)6.10 (.240)
3.78 (.149)3.54 (.139)
- A -10.54 (.415)10.29 (.405)
2.87 (.113)2.62 (.103)
15.24 (.600)14.84 (.584)
14.09 (.555)13.47 (.530)
3X
1.40 (.055)1.15 (.045)
2.54 (.100)
2X
0.36 (.014) M B A M
4
1 2 3
NOTES:
1 DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982. 3 OUTLINE CONFORMS TO JEDEC OUTLINE TO-220AB.
2 CONTROLLING DIMENSION : INCH 4 HEATSINK & LEAD MEASUREMENTS DO NOT INCLUDE BURRS.
TO-220AB Part Marking Information
TO-220AB Package Outline
Dimensions are shown in millimeters (inches)
PART NUMBER
RECTIFIER LOGO EXAMPLE : THIS IS AN IRF1010 WITH ASSEMBLY LOT CODE 9B1M
DATE CODE (YYWW)YY = YEAR WW = WEEK