SW2103_Datasheet_v1.1_release
Mode: SW2103 (V1.1) https://www.360docs.net/doc/d813218508.html,
第 1 页 共 12 页 SW2103
Datasheet
Designed for Type-C Logic Detect and Control
Version 1.1
珠海智融科技有限公司
ZHUHAI ISMARTWARE TECHNOLOGY CO., LTD.
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Table of Content
1. General Description (4)
2. Applications (4)
3. Features (4)
4. Schematic Circuit Diagram (5)
5. Application Function Description (5)
6. Pin Configuration and Function (6)
6.1 Pin Configuration (6)
6.2 Pin Descriptions (6)
7. Absolute Maximum Ratings (7)
8. SWB (Single Wire Bus) (8)
8.1 Write Timing (8)
8.2 Read Timing (9)
9. Register List (10)
9.1 REG 00: Mode Configure (10)
9.2 REG 01:CTRL Register (10)
9.3 REG 02: IRQ Indication (11)
10. Mechanical and Packaging (11)
10.1 Package Summary (11)
10.2 Package Outline and Dimensions (12)
1. General Description
SW2103 is a USB Type-C logic detect and control IC, equipment with BC1.2 DCP support. It could realize the function of enabling the traditional USB device to support the transformation of Type-C interface. SW2103 uses CC pins to determine port attach/detach status and orientation, role type and current mode, provides VBUS enable signal output. It provides PMODE pin for current mode configure, swap key for role which makes it convenient in power bank applications. It also provides single wire bus which make it easy to dynamically configure role and current mode for phone and pads. It supports Battery Charging Spec BC1.2 for DCP. It is compatible with Apple mode and Samsung mode.
T he SW2103 have an alternate configuration as a DFP or UFP according to the Type-C specifications. The CC logic block monitors the CC1 and CC2 pins for pullup or pulldown resistances to determine when a USB port have been attached, the orientation of the cable, and the role detected. The CC logic detects the Type-C current mode as standard, 1.5A or 3.0A depending on the role detected. VBUS detection is implemented to determine a successful attach in UFP and DRP.
2. Applications
?Power Bank
?Power Supply Adapter
?Car Charger
?Mobile phone and Pads
3. Features
?Support USB Type-C specification 1.1
?Support Strong-DRP/DRP/DFP/UFP role
?Support Type-C standard, 1.5A and 3A mode
?Support VBUS enable signal output, can be as USB ID control signal
?Provide key swap for Type-C role
?Provide VCONN power
?Support Dead Battery
?Support BC1.2 DCP
?Support Apple & Samsung device
?Support YD/T 1591-2009 Chinese telecommunication industry standard
?Single wire bus (rate < 5kbps)
?Under-V oltage lock out protection
?Available in QFN16 (3×3mm) package
?Operating voltage: 2.7V~6V(without DP/DM)
4. Schematic Circuit Diagram
SW2103
VBUS
VCC
GND
IRQ
CC2_TACH
CC1CC2
Vbus_En
SWB Type-C receptacle
50k
AP
1uF
GND
GND
VBUS
CC2
CC1GPIO
IRQ
Analog Switch
TX+TX-RX+RX-TX1+TX1-RX1+RX1-TX2+TX2-RX2+RX2-Micro-B receptacle D+D-GND
VBUS ID DP DP DM DM VBUS DM DP ID GND
Vbat
ID
VBUS SEL
SEL SEL 10k
10k
2.2k
Phone&Pad Application Diagram
5. Application Function Description SW2103 support DFP/StrDRP/DRP/UFP role.
When it attached with Type-C device successfully, the
VBUS_EN and CC2_TACH will change according to role and orientation.
SW2103_Role_Function
Application Scene (SW2103 VS device)
Detach
Attached
SW2103 role
device role SW2103 role device role Adapter VS Adapter
DFP
(VBUS_EN=LOW CC2_TACH=LOW)
DFP
detached
detached
Adpater VS Powerbank /phone/u-disk
StrDRP or DRP
or UFP
DFP
(VBUS_EN=HIGH
CC2_TACH=HIGH)
UFP
Powerbank VS Adapter
StrDRP
(VBUS_EN=LOW CC2_TACH=LOW)
DFP
UFP
(VBUS_EN=LOW CC2_TACH=HIGH) DFP
Powerbank VS Powerbank
StrDRP rand role
(CC2_TACH=HIGH)
rand role
Powerbank VS phone /u-disk
DRP or UFP
DFP
(VBUS_EN=HIGH CC2_TACH=HIGH) UFP
phone VS adapter /powerbank DRP
(VBUS_EN=LOW CC2_TACH=LOW)
DFP or StrDRP
UFP
(VBUS_EN=LOW CC2_TACH=HIGH)
DFP
phone VS phone
DRP rand
rand
phone VS u-disk UFP
DFP
(VBUS_EN=HIGH CC2_TACH=HIGH) UFP
u-disk VS adapter /powerbank/phone
UFP
(VBUS_EN=LOW
CC2_TACH=LOW)
DFP or StrDRP
or DRP
UFP
(VBUS_EN=LOW CC2_TACH=HIGH)
DFP
A: in this table, the cable orientation attached with SW2103 is CC2.
6. Pin Configuration and Function
6.1 Pin Configuration
QFN16 Top View
12
34
1211109
8
76513
14
15
16GND PAD
IRQ PMODE VBUS_EN
SWB
N C
V B U S
N C
V C C
CC2_TACH
CC2CC1DP
N C D M D _S E L
N C
6.2 Pin Descriptions
Item Name Type Function Description
1 IRQ O Open drain output, Interrupt output to AP 2
PMODE
I
Power level mode setting
Float : standard
GND : 1.5A
VCC : 3.0 A
3 VBUS_EN O Push-pull output, Control signal of VBUS
4 SWB IO Open drain input-output, Single wire bus
5 NC NC /
6 VBUS I Type-C VBUS input
7 VCC PI Power supply
8 NC NC /
9 CC2_TACH O Open drain output, Indication of CC2 tach, provide Type-C cable orientation identification
10 CC2 IO Type-C configure channel CC2
11 CC1 IO Type-C configure channel CC1
12 DP IO BC1.2 Host DP
13 NC NC /
14 DM IO BC1.2 Host DM
15 D_SEL I Digital input, Type-C role swap key. More than 3 times low level (>32ms) in 3 second will enable role swap.
16 NC NC /
7. Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise specified)
Parameters Symbol MIN Max Unit Input Supply V oltage VCC -0.3 10 V Type-C VBUS Supply Voltage VBUS -0.3 20 V Type-C interface Signal CC1,CC2 -0.3 10 V
Storage Temperature Range -40 +150 ℃Electronic Static Discharge(HBM) ESD 4 KV
【Notice】Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability
Recommended Operation Conditions
Parameters Symbol MIN Typical Max Unit Input supply Voltage VCC 2.7 6 V Type-C VBUS Supply voltage VBUS 3.3 5 6 V Operation Temperature -40 125 ℃
8. SWB (Single Wire Bus)
Within the 32 host clock cycle and after read/write command is sent out, if the host cannot receive the effective response, the device is regarded as read/write failure and should resend the command.
SWB adopts high byte order for sending data. During the first phase, the 7th represents for parity check code. The write command concludes the register address and data written which contains 16 bits parity check code. The read command concludes the register address which contains 8 bits parity check code. Similarity, responding to write command in the device and during the first phase, the 7th represents for the address received by the device and parity check code of the data, and the 8th always be the 0. Responding to read command in the device and during the first phase, the 7th represents for the parity check code of the received address, and the 8th presents for the read data of a total of 8 bits parity check code results.
During the first phase, the 9th and the 4th in register and data are generated from the logical invert by the one bit before the adjacent.
8.1 Write Timing
Example: Register address is D8h, Write Data is 75h
sync code 010b
device
address
10b
first phase
second phase register address D8h
write data 75h
write
third phase
parity
check
Request
from
host
antilogic
phase
antilogic
phase
Host Write Timing Diagram
Goodparity
sync code 010b
device
address
10b
parity
check
good
parity
check
from
device
antilogic
phase
first phase Slave Respond to the Write Timing Diagram
8.2 Read Timing
Example: Register address is D8h, read data is 75h
Request
sync code 010b
device
address
10b read
parity
check
from
host
first phase
antilogic
phase
second phase register address D8h
antilogic
phase
Host Reading Timing Diagram
Goodparity
second phase
sync code 010b
device
address
10b
Good
parity
check
from
device
first phase
parity
check
antilogic
phase
read data 75h
antilogic
phase
Slave Respond to the Read Timing Diagram
9. Register List
9.1 REG 00: Mode Configure
Default: 0x00H
Bit Description R/W Default
7-6 BC1.2 default mode
0: apple divider 1 mode;
1: apple divider 2 mode;
x: reserved
The default value is determined by internal memory status.
R/W -
5 IRQ enable
0: IRQ disable
1: IRQ enable
R/W 0x0
4 AP mode only for power level
0: device mode
1: AP mode
In device mode, the power level is determined by PMODE pin.
In AP mode, the power level is determined by register configuration.
R/W 0x0
3-2 CC default role mode
0: UFP;
1: DFP;
2: DRP;
3: strong DRP;
The default value is determined by internal memory status.
R/W -
1-0 UFP power level info
0: standard power
1: 1.5A
2: 3.0A
3: reserved
R -
9.2 REG 01:CTRL Register
Default: 0x00H
Bit Description R/W Default 7-6 / / /
5-4 CC current role under DRP mode
0:untach;
1: UFP;
2: DFP;
3: reserved
R -
3-2 DFP configure power level
0: standard power
1: 1.5A
2: 3.0A
R/W 0x0
3: reserved
1 EMARKER exist
0: not exist
1: exist
If emarker exist, host can get this status through read this bit.
R -
0 Role swap indication
0: nothing
1: role swap enable
In AP mode writing 1 to this bit to enable role swap; in device mode
it indicates role swap enabled when this bit is set to 1.
R/W -
9.3 REG 02: IRQ Indication
Default: 0x00H
Bit Description R/W Default
7-5 IRQ indication
0: dfp tach
1: ufp tach
2: dfp detach
3: ufp detach
4: ufp pwr level change
R -
4-1 / / /
0 IRQ pending bit
0: nothing
1: IRQ is pending
This bit is cleared by writing 1 to this bit.
R/W 0x0
10. Mechanical and Packaging
The following pages include mechanical packaging information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document.
10.1 Package Summary
10.2 Package Outline and Dimensions