Overview Tech OBIEE

合集下载

博视

博视博视：用科技尽览天地博视，英文名为Lecture, 是一个全球领先的科技公司，致力于为人们带来视听的乐趣和新的启发。

自成立以来，博视一直坚持技术创新和产品品质的追求，为用户提供了丰富多样的产品和服务。

本文将从公司背景、产品特色和市场影响等多个方面对博视进行详细介绍。

一、公司背景博视成立于2000年，创始人是一群热爱科技的年轻人。

他们深信科技的力量可以改变人们的生活，并为此毅然决然地投身于科技领域。

经过多年的努力和发展，博视已经成为全球最大的视听技术公司之一。

公司总部位于美国硅谷，拥有数百名顶级科学家和工程师，致力于开发最前沿的技术和产品。

二、产品特色1. 科技先锋：作为一家科技公司，博视始终将技术创新放在首位。

公司拥有深厚的研发实力和雄厚的资金支持，不断推出颠覆性的技术和产品。

例如，最新发布的博视HoloLens，便是一款将增强现实技术与头戴显示器相结合的产品，让用户可以在现实世界中获得虚拟的视觉体验。

这不仅为用户带来了无限的乐趣，还在医疗、教育等领域发挥了重要作用。

2. 产品多样化：博视不仅在视听技术领域有着卓越的表现，还涉足了消费电子、通信设备、智能家居等多个领域。

公司旗下的产品线十分丰富，涵盖了电视、音响、手机、电脑等多个终端设备。

而这些产品不仅在功能上满足了用户的需求，同时也注重用户体验，致力于为用户带来更加便捷、智能的生活体验。

3. 环保节能：博视一直致力于研发更加环保、节能的产品。

公司在产品设计中采用了许多节能技术，例如智能节能模式、低功耗处理器等。

同时，博视还推行了回收计划，鼓励用户对旧设备进行回收和再利用，减少电子垃圾的产生。

这一系列环保措施不仅为用户节约了能源和费用，也对环境保护做出了积极的贡献。

三、市场影响博视作为全球最大的视听技术公司之一，其产品在市场上具有很高的知名度和竞争力。

博视的产品远销全球，成千上万的用户通过博视的产品享受到了高品质的视听体验。

同时，博视在各个领域也取得了重要的成果，其技术在医疗、娱乐、教育等行业得到了广泛应用。

外企急聘：Siebel Tech,Function,EAI,Testing,Consultant,Analytice,PM

★★外企急聘：Siebel Tech, Function, Siebel EAI, Siebel testing★沪/京/杭全球化项目机会：“Siebel ” 上海、杭州、北京、、大连、海外急聘！！！职位需求：testing、technical、ProjectManager、Consultant 、Analytics、EAI项目情况：全球化项目，来自美国、英国、澳大利亚等。

Siebel ConsultantKey Responsibilities1. Strong Sales or Marketing experience2. Strong CRM/ERP related knowledge and experience, consulting across a wide range of Siebelmodules and Products in different industry3. Strong design capabilityKey Requirements1. 3-7 years of Siebel implementation or rollout experiences2. At least 5-7 years successful consultant experience3. Senior consulting role, responsible for implementing Siebel product based project4. Strong understanding of business process5. Ability to design & optimize business process for client6. Ability to present and demonstrate business solutions at the executive level7. Understanding the principles of the software development lifecycle8. Ability to do requirements gathering, gap analysis, functional or technical design9. Excellent communication, presentation and negotiation skills10. Ability to product training to key user group11. Familiar with Siebel application configuration, Business Services12. Familiar with data migration Integration, EIM, EAI, ADM13. Siebel certified BA consultant is preferred14. Bachelor Degree in Computer Science or Engineering related and above; MBA preferable15. Good English proficiency (written and spoken)16. Fast learning capability17. Positive attitude; good team player; able to work under pressure; and willing to travelSiebel TechnicalKey Responsibilities1. Individual will be responsible for assigned projects development in Siebel application configuration, testing and documentation2. Able to possess development experience in object orientedKey Requirements1. At least >3 years Siebel experience2. Ability to work independently on programming/developing projects as well as work in a team environment3. Good experience on Siebel Tools, Siebel eScript or Siebel VB, Business Services4. Good knowledge on Siebel software development life cycle.5. Participate in requirements gathering, gap analysis, functional design6. Ability to do technical design7. Strong object oriented programming knowledge, Java, J2EE, Java script preferred8. Familiar with Siebel application automation, Workflow, Assignment Manager9. Familiar with Siebel EIM, data mapping design, data manipulation10. Familiar with RDBMS SQL, Stored Procedure, Triggers, Views in Oracle or MS SQL server11. Siebel Certified consultant is preferred or finish Siebel Core consultant course12. Bachelor’s degree in Computer Science or Engineering related13. Good English proficiency (written and spoken)14. Fast learning capability15. Positive attitude; good team player; able to work under pressure; and willing to travelSiebel AnalyticsKey Responsibilities1. Strong knowledge and experience on Siebel Analytics based BI system implementation2. Ability to design and developing Siebel Analytics3. Good concepts and experience on Data Warehousing, RDBMS, OLAP, OLTPKey Requirements1. At least >3 years Siebel analytics experience2. Good knowledge of Siebel Analytics, Business Model, Repository, ETL process3. Good experience of ETL tools, Informatica or MS DTS/SSIS4. Good knowledge SQL and Object Oriented programming5. Familiar with reports design and developing6. Familiar with Informatica architecture, transformations7. Familiar with design and developing Informatica workflow8. Siebel certified analytics consultant is preferred or finish the course9. Bachelor’s degree in Computer Science or Engineering related10. Good English proficiency (written and spoken)11. Fast learning capability12. Positive attitude; good team player; able to work under pressure; and willing to travelSiebel EAIKey Responsibilities1. Good knowledge and experience on Siebel EAI2. be familiar with third-party solutionsKey Requirements1. At least 3-5 years Siebel EAI experience2. Senior Siebel EAI Lead or developer, responsible for Siebel System based integration implementation3. Good experience on Siebel enterprise application integration implementation4. Understanding of integration, designing, usage models, exchanging data5. Good knowledge of third party solutions such IBM, TIBCO, WebMethods6. Good experience on EAI Siebel Adapter, UI Data Adapter, Siebel VBC7. Familiar with EAI MQSeries Transport, Java BS, HTTP Transport8. Familiar with Data Mapping9. Familiar with XML integration10. Siebel certified integration champion is preferred or finish related course11. Bachelor’s degree in Computer Science or Engineering related12. Good English proficiency (written and spoken)13. Fast learning capability14. Positive attitude; good team player; able to work under pressure; and willing to travelTest Lead-SiebelOver 6 years work experience1. Strong Communication Skills – Reading / Writing / Listening2. Overall execution responsibility3. Manage offshore team4. Manage communication with onsite team5. Provide functional guidance for “Test Planning” and “Test Execution”6. Test execution7. Issue Resolution8. Act as dedicated (virtual) support for different functional areas9. Strong Siebel KnowledgeTest Analysts-Siebel3 to 5 years1. Strong English Communication Skills – Reading / Writing / Listening2. Analysis of business requirements3. Review of Test Plan & preparation of Test Cases4. Test script execution5. Report test results and defects detected6. Participate in reviews and status meetings7. Strong Siebel KnowledgeTest Engineers-Siebel1 to 3 years1. Strong English Communication Skills – Reading / Writing / Listening2. Test scripts preparation3. Test script execution4. Report test results and defects detected5. Participate in reviews and status meetings6. Strong Siebel Knowledge。

Hexagon Technology Solutions Provider Overview说明书

ASSOCIA TION of MINE SURVEYORSof ZIMBABWEPhumudzo Netshapapame BEng(Mining),ADBPM (UCT)T echnical Sales Specialist CROWN PLAZA MONOMOTAPA HOTEL15, August, 2019Agenda Agenda Itema)Company Overviewb)Life-Of-Mine Survey StrategyCompany OverviewTechnology Solutions Provider•Established leader in information technologies •Solutions drive productivity and quality improvementsGlobal Reach•Broad range of vital industries served•More than 18,000 employees in 50 countries R&D Focused•10-12% of net sales invested in R&D •3,400+ employees in R&D•3,200+ active patentsStrong Financials• 3.3 bn US in sales•23.4% operatingmargin Hexagon at a glanceHexagon businessesGEOSYSTEMSReality-capture solutions used to record distance, monitor movement, guide machines, capture Earth images and create 3D models of landscapes, infrastructure or entire citiesPOSITIONING INTELLIGENCESatellite positioning and correction solutions for land, sea and airAGRICULTURESmart agriculture solutions for automating and improving crop planning and resource utilization for optimum yieldGEOSPATIALGeospatial data management solutions that leverage the power of mapping to enable a holistic understanding of changeMININGIntegrated, digital mine solutions for smarter, safer, more productive minesSAFETY & INFRASTRUCTUREGeospatial-based solutions that streamline operations, accelerate information ﬂows, and optimize resourcesGEOSPATIAL LANDSCAPE Geospatial Enterprise Solutions Industrial Enterprise SolutionsManufacturing solutions that integrate sensing, thinking and acting capabilities – from people to machines – where quality drives productivity Enterprise engineering software solutions that enable smarter design, build and operation of large-scale constructionMANUFACTURING INTELLIGENCE PROCESS, POWER, MARINE MANUFACTURING LANDSCAPE ENGINEERINGLANDSCAPE201519701997200320082010Key CustomersProven and trusted by industry leadersLife-of-Mine Survey StrategyHexagon Mining T echnology SuiteKnowledge ManagementAnalyticsCollaborationIntegrationLife-of-Mine (LOM): Survey IntegrationExploration Modeling Design SchedulingOperationalFleet Management – OP& UGMachine GuidanceHealth & MaintenanceCommunicationsCollision Avoidance Fatigue Monitoring Vehicle InterventionShovel AssistTracking RadarSemi-Autonomous Autonomous Reverse GuidanceAuto-SpotAuto-SteerTotal Stations & LaserScannersAirborne UAV SystemsLong Range RadarScanningPlanningOperations Safety Automation SurveySoftware, HardwareSoftwarePoint-to-Point Integration (API)Enterprise Platform Integration (API)Hexagon Mining Open Pit Survey SolutionProcess and Display Point Cloud DataSENSORSTransformativeTechnology forData Capture,Analysis andDisplaySOFTWARESet flight plan, camera position and dwell timeGenerate data for ortho-photos, 3D models, and point clouds in high density with great accuracySpaced control points increase geo reference accuracy FW-7Process and Display Point Cloud DataCaptured points can be imported into MinePlan 3DData can be transformed for multiple purposes in MP3DProcess and Display Point Cloud DataPoint Cloud Solution: workflow thru MinePlan 3DInstrument(s)•P50•MS60•BLK•Aibot UAVScanRegistration•Cyclone / InfinityPoint CloudAnalysis•“MinePlanReshaper”Mine Planning•MinePlan 3D +Stockpile AnalysisHighwallMonitoring Grade Control Leach PadTailings DamMonitoring RockCharacteristics / Features Tunneling Over/UnderBreakMonitoring andMovementUse Cases ~ TotalMonitoringUAV WorkflowFlightExecutionDataProcessingDataAnalysingActionFlightPlanningDataintegrationHexagonMiningUAVSolutionPoint Cloud Solution: workflow through MinePlan 3DReconciliation: workflow in MinePlan 3D & MinePlan Production InputsEOP Solids Designed Digblock/Cuts planned vs. actual reconciliation ProcessBuild designed solids Clip by EOP solidsReservesExploration Model Grade Control ModelOutputreports and charts Areas of differenceReconciliation: workflow in MinePlan 3D & MinePlan Production▪simple configuration▪modification of inputs▪powerful analysis of variations ▪standardized report formats ▪full integrationLocation ManagementA manageable spatial database thatstores and validates all of anoperations Location position and metadataInventory ManagementGain insights into point in time stocks balances in a number of areas of anoperationReconcile the entire material movement value chain from survey BCM to contained metal recoveryvalues.TargetsCompare multiple schedules against what has actually occurredin the field, from material movement to Availability etc.Activity CostingsGain near real time revenue, cost or profit information within an operation, building costs from the ground upEnterprise ReportingHolistic cross departmental reporting is essential to the understanding the how an organization is performing and enablingpeople to analyze the gapsMANAGEReconciliationHaulage AnalysisAnalyze and turn raw GPS information into meaningful packets of data, TKMPH, compare base haul profiles to what isactually happening in the field•Survey perform pit survey at the bench level •Survey only captures volume of the ore stockpile •The weightometer on crusher is certifiedReconciliation: workflow in HxGN MineEnterprisePlanningProductionMaintenanceHuman ResourcesFinanceSafety Siloed DataBreak down the individual silos in an operation sharing data and information across the business providing greater insights into an operations performanceHolistic ReportsSingle tool for operations to utilise across the organisation. Providing a platform for enterprise toleverage.Blended MetricsUnderstand how different departments affect each other. HR affects Production or Maintenance. Identifytrends across the businessMineEnterprise – A connected systemReconciliation: workflow in HxGN MineEnterpriseHexagon Mining UG Survey Solution•An average of 30% overbreak in UG mining •Delays in mining cycles•Inability to react and reconcileAreas of Opportunity•Automated survey and markups•Overbreak/underbreak profileMOSS: Standardized Blasting Workflow•Automated survey and markups•Overbreak/underbreak profile•Pattern auto generationMOSS: Standardized Blasting Workflow•Automated survey and markups•Overbreak/underbreak profile•Pattern auto generation•Center line, grade and collars in each shot•The Result•Topo survey•Collar markup•Real time updateMOSS: Standardized Blasting Workflow•Integrates with any planning package •Better volume calculations•CMD lidar scansAdditional BenefitsTHANKY UO。

PORTFREEPRODUCTIONPROGRAM

PORTFREEPRODUCTIONPROGRAMIntroductionThe PORTFREEPRODUCTIONPROGRAM is a comprehensive software system designed to streamline and automate the production process for port-free products. This program aims to eliminate the need for ports, such as USB or HDMI ports, in electronic devices by providing alternative methods of data transfer and connectivity. In this document, we will provide a detailed overview of the PORTFREEPRODUCTIONPROGRAM, its features, and the benefits it offers to manufacturers of electronic devices.FeaturesThe PORTFREEPRODUCTIONPROGRAM offers a wide range of features that simplify the production process for port-free products. Some of the key features include:Alternative connectivity methodsThe program provides alternative methods of connectivity, such as wireless connectivity and cloud-based data transfer. This allows electronic devices to communicate and exchange information without the need for physical ports.Streamlined manufacturing processThe PORTFREEPRODUCTIONPROGRAM includes several modules that automate various stages of the manufacturing process. These modules include:•Design module: This module allows manufacturers to design port-free electronic devices using an intuitive and user-friendly interface. Manufacturers can specify thedesired functionality of the device and the program willgenerate the necessary code and configurations.•Testing module: This module automatically tests the performance and functionality of the port-free devices toensure that they meet the required standards. It includes comprehensive testing procedures and generates detailed test reports.•Production module: This module handles the production of the port-free devices, including the assembly of components, quality control, and packaging. It ensures that the devices are manufactured in a timely and efficient manner.Integration with existing systemsThe PORTFREEPRODUCTIONPROGRAM can be seamlessly integrated with existing manufacturing systems, such as enterprise resource planning (ERP) and supply chain management (SCM) systems. This allows manufacturers to leverage their existing infrastructure and processes while benefiting from the additional capabilities offered by the program.Real-time analyticsThe program includes a real-time analytics module that provides manufacturers with valuable insights into the production process. It collects and analyzes data from various stages of the manufacturing process, allowing manufacturers to identify bottlenecks, optimize workflows, and improve overall efficiency and productivity.BenefitsBy implementing the PORTFREEPRODUCTIONPROGRAM, manufacturers can enjoy a wide range of benefits, including: Cost savingsEliminating the need for physical ports in electronic devices can significantly reduce the manufacturing costs. This is because ports can be expensive to produce, assemble, and maintain. By utilizing alternative connectivity methods, manufacturers can save on the costs associated with ports, such as connectors, cables, and related components.Enhanced flexibility and design optionsRemoving ports from electronic devices opens up new possibilities in terms of design and form factor. Manufacturers can create more compact and sleek devices without compromising on functionality. This allows for greater flexibility in product design and differentiation, ultimately resulting in a competitive advantage in the market.Improved user experienceBy providing alternative methods of connectivity, the PORTFREEPRODUCTIONPROGRAM enhances the user experience of electronic devices. Users can enjoy seamless wireless connectivity and transfer data effortlessly. This improves convenience and usability, leading to higher customer satisfaction and loyalty.Future-proofingAs technology continues to evolve, the PORTFREEPRODUCTIONPROGRAM ensures that manufacturers are well-prepared for future advancements. By eliminating reliance on physical ports, manufacturers can adapt to emerging technologies and trends without the need for costly hardware upgrades or modifications.ConclusionThe PORTFREEPRODUCTIONPROGRAM is a powerful software system that revolutionizes the production process for port-free electronic devices. With its range of features and benefits, this program offers manufacturers an efficient and cost-effective solution to produce cutting-edge devices without the need for physical ports. By embracing this program, manufacturers can stay ahead of the competition and meet the ever-increasing demands of the market.。

mechatronics

mechatronicsMechatronics: Bridging the Gap between Mechanical Engineering and ElectronicsIntroductionMechatronics is an interdisciplinary field that combines mechanical engineering, electronics, computer science, and control systems to design and create smart devices. These devices, often found in industrial automation, robotics, and automotive applications, have revolutionized various sectors by enhancing efficiency, precision, and safety. This document provides an overview of mechatronics, its key components, applications, and future prospects.1. Definition and ComponentsMechatronics is a well-balanced integration of mechanical engineering, electronic engineering, computer science, and control engineering. The goal is to design and develop intelligent systems that can both receive and process information, as well as perform physical actions based on thatinformation. Mechatronic systems typically consist of four core components:1.1 Mechanical Components: These include various physical parts such as actuators, sensors, motors, gears, and linkages. Mechanical engineering principles are used to design and optimize these components for specific tasks and environmental conditions.1.2 Electronic Components: Mechatronics heavily relies on electronic components like microcontrollers, sensors, and transducers. These components enable the system to sense, measure, and process data, making informed decisions based on that data.1.3 Computer Science and Software: Mechatronic systems utilize software programs to analyze data, control actuators, and communicate with other devices. Programming languages like C, C++, and PLC ladder logic are commonly used for development.1.4 Control Systems: Control theory plays a crucial role in mechatronics. It involves designing and implementing algorithms and control systems to regulate the behavior andperformance of the mechatronic system. It ensures stability, accuracy, and safety in various applications.2. Applications of Mechatronics2.1 Industrial Automation: Mechatronic systems have transformed industrial processes by increasing efficiency, improving product quality, and reducing human involvement. Industrial robots, assembly lines, and automated guided vehicles are just a few examples of how mechatronics is applied in manufacturing industries.2.2 Robotics: Mechatronics is the backbone of modern robotics. Robots used in healthcare, exploration, home assistance, and even disaster management heavily rely on mechatronic principles. These robots can perform complex tasks with accuracy and precision, enhancing productivity and safety.2.3 Automotive Systems: The automotive industry heavily relies on mechatronics for safety systems, engine control units, and navigation systems. Mechatronic systems enable advanced driver assistance systems (ADAS) like lane-keeping assist, adaptive cruise control, and collision avoidance, improving vehicle safety.2.4 Biomedical Engineering: Mechatronics plays a key role in the design and development of medical devices such as prosthetics, assistive devices, surgical robots, and monitoring systems. These devices enhance patients' quality of life and provide improved medical care.3. Future ProspectsMechatronics is a rapidly growing field with immense potential. The advancements in artificial intelligence, machine learning, and internet of things (IoT) are expected to further revolutionize mechatronic systems. Some potential future prospects include:3.1 Smart Cities: Mechatronics can contribute to the development of smart cities by integrating intelligent systems into urban infrastructure, transportation, and energy management. This can lead to enhanced efficiency, reduced energy consumption, and improved quality of life for residents.3.2 Human-Robot Interaction: As robots become more advanced, mechatronics will play a crucial role in developingintuitive human-robot interaction mechanisms. This includes designing robots that can recognize emotions, understand natural language, and respond accordingly.3.3 Autonomous Systems: Mechatronic systems are the foundation of autonomous vehicles and drones. The future prospects include developing fully autonomous transportation systems that can navigate, interact, and make decisions without human intervention.ConclusionMechatronics brings together mechanical engineering, electronics, computer science, and control systems to create intelligent and efficient systems. Its widespread applications in industrial automation, robotics, automotive systems, and biomedical engineering have had a significant impact on different sectors. The future prospects of mechatronics are promising, with the potential to revolutionize various industries and contribute to the development of smart cities and advanced human-robot interaction mechanisms.。

欧博特纽维尔 IP7000系列产品数据手册说明书

From Product Management Telephone NurembergST-VS ST-VS/MKP1 +49 911 93456 0 12-Jan-2015 Release LetterProduct: DIVAR IP 7000 FamilyVersion: Maintenance Release DOM image v1.0.5This letter contains latest information about the above mentioned Bosch DIVAR IP 7000 Family.1. GeneralDIVAR IP 7000 is an affordable, simple and reliable all-in-one recording, viewing and management solution for network surveillance systems of up to 128 channels (with 32 channels pre-licensed).Running the full Bosch VMS (Video Management System) solution and powered by Bosch Video Recording Manager software, DIVAR IP 7000 is an intelligent IP storage device that eliminates the need for separate NVR (Network Video Recorder) server and storage hardware.It combines advanced recording management and state-of-the-art iSCSI storage into a single cost-effective, plug and play IP recording appliance for IT-minded customers which are seeking for a state-of-the-art “second generation” NVR recording solution.2. Restrictions; Known Issues•Graphics Port: The DVI port must be used for configuration. Do not use the VGA port for configuration.•Initial installation: During initial boot and installation the system must be connected to the network.Please note: All systems come with the same default IP address.•Transcoder: Maximum transcoder source stream resolution is 1920x1080p30•Mobile Video Service: the local MVS needs to be added to the system with the private IP address (not 127.0.0.1), if it shall serve as a fall-back transcoder for Operator Client access.•BVC needs to be upgraded to version 1.6.2 or higher, if it shall serve as replay client for DIVAR IP 7000 appliances with BVMS 5.0.5•VideoSDK needs to be upgraded to 5.81 MR1 or higher, if it shall serve as integration tool for DIVAR IP 3000 appliances with BVMS 5.0.5•3rd party device support restrictions are listed in the Bosch VMS release notes:o /documents/Release_Notes_5.0.5__Release_Note_enUS _16781064459.pdf3. New subcomponent software versions•Bosch VMS 5.0.5.1010 (alternative installation option: BVMS 4.5.9.359)From Product Management Telephone NurembergST-VS ST-VS/MKP1 +49 911 93456 0 12-Jan-2015•Video Recording Manager 3.00.0074•Video Streaming Gateway 5.91.0020•USB-Transcoder Service 5.60.00784. New FeaturesSystem Setup•Initial Setup procedure prompts a selection of two software installation options:o BVMS 5.0.5: recommended for most userso BVMS 4.5.9: recommended if system shall be integrated into existing BVMS 4.5.9 based infrastructureConfiguration Wizard (BVMS 5.0.5)•Remote access: DNS information can be entered in the Basic step. The port rules for router configuration can be retrieved from the detailed report in the last wizard step.•Network address of video devices to be added can be changed, if they are located in a different IP range.•Recording profiles and retention time settings can be changed individually per device or for a selection of devices.Management Server (BVMS 5.0.5)•Additional data: option to record text data together with video streamVideo Streaming Gateway (BVMS 5.0.5)•VSG supports alarm recording triggered by BVMS events5. Applied Changes / Bug FixesBVMS 5.0.5•Tested software/firmware versions, supported devices, bug fixes and change are listed in the Bosch VMS release notes:/documents/Release_Notes_5.0.5__Release_Note_enUS_16781 064459.pdfVideo Recording Manager•Bug fixes and change are listed in the VRM release notes:/downloads/nue-mkp/VRM/3_00/Bosch_Releaseletter_VRM3_00_0073.pdfMobile Video Service•Fixed: correct MVS entry shown in port mapping table for remote access•Fixed: local MVS priority settings prevent system overload•Changed: MVS web page can now be used: https://<system-IP>/mvsFrom Product Management Telephone NurembergST-VS ST-VS/MKP1 +49 911 93456 0 12-Jan-20156. Installation Notes•An upgrade from DOM Image v1.0.1 cannot be performed manually. DOM image v1.0.2 and later require a newer version of the system BIOS•All models are based on Windows Server 2008 R2, 64-bit, Standard Edition7. History7.1 DIVAR IP 7000 DOM image version 1.0.4Restrictions; Known Issues•Graphics Port: The DVI port must be used for configuration. Do not use the VGA port for configuration.•Initial installation: During initial boot and installation the system must be connected to the network.Please note: All systems come with the same default IP address.•Transcoder: Maximum transcoder source stream resolution is 1920x1080p30•ONVIF Support Restrictionso no support for event-based recordingo Audio on some 3rd Party cameras not fully supported which may result in non-availability of audio streamso TCP not supported for ONVIF cameras but with UDP protocol onlyo Motion JPEG is not supportedo VCA is always recorded for Bosch deviceso VCA is not available for ONVIF camerasFrom Product Management Telephone NurembergST-VS ST-VS/MKP1 +49 911 93456 0 12-Jan-2015New subcomponent software versions•BVMS 4.5.9.359•VRM 3.00.0057New FeaturesImage•Added support for 3TB hard drives (DIVAR IP 7000 2U)•Added support for party populated hard drive layouts; 3 to 8 hard drives as part of a RAID 5 configuration (DIVAR IP 7000 2U)Configuration Client and Configuration Wizard•To avoid security issues, a global default password must be set for all devices and all authorization levels (service, live, user) that are not password protected. You can disable this enforced password protection for BVIP devices.•VIP X16 XF E has been moved to Device Family 2 for support of 2nd stream for recording.Deviating from the behaviour of the other devices belonging to Device Family 2, VIP X16 XF Emust use the same stream for all recordings. Although the user can configure stream 1 forcontinuous recording and stream 2 for alarm recording, the second setting will not take effect. After an Bosch VMS upgrade, perform the update of the device family manually.To update the device family:Right-click the device and click Edit Encoder.Click OK.Applied Changes / Bug FixesImage•Fixed: DVD burner permission problem•Fixed: 30days password expiration problem (last fix didn’t apply in every case)•Changed: Client software and documentation updated on the local network share Operator Client•Fixed: Click on find video by event results jumped to wrong playback time.•Fixed: Live video images from NTSC cameras on DVR 670 were squeezed.•Fixed: Sometimes OpClient could crash on loading favorites.•Fixed: ONVIF domes could not be controlled.•Fixed: Under rare circumstances OpClient could crash on logon of dual authorization group.•Fixed: Video viewing via NAT/port mapping routes did not work on Windows XP.•Fixed: Manual focus/iris in automatic mode.•Tested software/firmware versions and supported devices (see BVMS 4.5.9 release notes for details http://144.76.6.227/downloads/support-cctv/DIVAR_IP_3000/BVMS_VERSION_4_5_9_ReleaseNotes.pdf)From Product Management Telephone NurembergST-VS ST-VS/MKP1 +49 911 93456 0 12-Jan-2015 Configuration Client•Fixed: OPC Server Connection for BIS license option was not available.Configuration Collector•Fixed: Config Collector freezed while zipping collected files.VRM•Fixed: Discovery is more stable•Fixed: Reliability of disconnecting transcoders improved•Fixed: Exporting Log-Files large than 100MB•Changed: iSCSI-password is also set on USB-Transcoder7.1 DIVAR IP 7000 DOM image version 1.0.2Restrictions; Known Issues•Graphics Port: The DVI port must be used for configuration. Do not use the VGA port for configuration.•Initial installation: During initial boot and installation the system must be connected to the network.Please note: All systems come with the same default IP address.•ONVIF Support Restrictionso no support for event-based recordingo Audio on some 3rd Party cameras not fully supported which may result in non-availability of audio streamso TCP not supported for ONVIF cameras but with UDP protocol onlyo Motion JPEG is not supportedo VCA is always recorded for Bosch deviceso VCA is not available for ONVIF camerasNew subcomponent software versions•BVMS 4.5.8.151•VSG 5.60.0073• Transcoder 5.60.0073•.NET Framework 4.5New Features•Unlisted Bosch BVIP video devices can be added as generic devices (see BVMS 4.5.5 release notes for details).•Server Lookup improvements (see BVMS 4.5.8 release notes for details).From Product Management Telephone NurembergST-VS ST-VS/MKP1 +49 911 93456 0 12-Jan-2015 •Minor changes in the user and workstation settings (see BVMS 4.5.8 release notes for details).•Client software and documentation can be downloaded from local network share.Applied Changes / Bug Fixes•Fixed: 30days password expiration problem•Fixed: Windows activation problem•Fixed: iSCSI LUN preparation problem•Fixed: firewall rule exceptions•Wizard prompts system reboot option when Network settings are changed•Minor fixes in new subcomponent software versions (BVMS, VRM, VSG, Transcoder)•Minor improvements in the initial installation procedure•Tested software/firmware versions and supported devices (see BVMS 4.5.8 release notes for details → http://144.76.6.227/downloads/support-cctv/DIVAR_IP_3000/BVMS_VERSION_4_5_8_ReleaseNotes_v1.pdf).•Bosch VMS default screen now shows text labels below the icons.•The default network settings now match the default network settings of other Bosch video devices o IP Address: 192.168.0.200o Subnet mask: 255.255.255.0Installation Notes•An upgrade from DOM Image v1.0.1 cannot be performed manually. DOM image v1.0.2 requires a newer version of the system BIOS•All models are based on Windows Server 2008 R2, 64-bit, Standard Edition7.2 DIVAR IP 7000 DOM image version 1.0.1Restrictions; Known Issues•Graphics Port: The DVI port must be used for configuration. Do not use the VGA port for configuration.•Password of limited operational Windows user expires after 30 days:o The password of limited user must be set manually to “never expires” on DIVAR IP 7000 by logging on to the DIVAR IP via remote desktop with user administrator user “BVRAdmin”.In the “Server Manager” the password can be changed to “Password never expires”(Configuration → Local Users and Groups → User (→ user limited)).o For details s. Bosch Security Knowledge Basehttps:///al/12/2/article.aspx?aid=7400&tab=search&bt=4&r= •Default IP Address: The system comes with the following network settingso IP Address: 192.168.178.200o Subnet mask: 255.255.0.0From Product Management Telephone NurembergST-VS ST-VS/MKP1 +49 911 93456 0 12-Jan-2015 •Initial installation: During initial boot and installation the system must be connected to the network.Please note: All systems come with the same default IP address.•Network Settings Change: The DIVAR IP needs to be restarted, if network settings are changed in the Wizard. This applies for the initial setup as well as for changes during standard operation.•Adding Storage: If the wizard stops at Step 8 “Add storage”, because the LUNs aren’t formatted, the LUNs have to be formatted using the Bosch VMS Config Client.•ONVIF Support Restrictionso no support for event-based recordingo Audio on some 3rd Party cameras not fully supported which may result in non-availability of audio streamso TCP not supported for ONVIF cameras but with UDP protocol onlyo Motion JPEG is not supportedo VCA is always recorded for Bosch deviceso VCA is not available for ONVIF camerasNew FeaturesThe DIVAR IP 7000 Family is an all-in-one management solution that comes with BVMS/VRM including Video Streaming Gateway pre-installed and with 32 channels pre-licensed. The system will come with one built-in Transcoder channel.Applied Changes / Bug Fixesn/a。

知名电子公司及其官网

A INTECH(美国英特奇公司)A- INTECH(美国英特奇公司AC TEXAS INSTRUMENTS [T1](美国德克萨斯仪器公司) .ti./AD ANALOG DEVICES(美国模拟器件公司) .analog./AM ADV ANCED MICRO DEVICES（美国先进微电子器件公司）.advantagememory./ AM DA TA-INTERSIL(美国戴特-英特锡尔公司) .datapoint./AN PANASONIC(日本松下电器公司) .panasonic./AY GENERAL INSTRUMENTS[G1](美国通用仪器公司)BA ROHM(日本东洋电具制作所)(日本罗姆公司) .rohmelectronics./BX SONY(日本索尼公司) .sony./CA RCA(美国无线电公司)CA PHILIPS(荷兰菲利浦公司) .semiconductors.philips./CA SIGNETICS(美国西格尼蒂克公司) .spt./CAW RCA(美国无线电公司)CD FAIRCHILD(美国仙童公司) .fairchildsemi./CD RCA(美国无线电公司)CIC SOLITRON(美国索利特罗器件公司)CM CHERRY SEMICONDUCTOR(美国切瑞半导体器件公司) .cherry-semi./CS PLESSEY(英国普利西半导体公司)CT SONY(日本索尼公司) .sony./CX SONY(日本索尼公司) .sony./CXA SONY(日本索尼公司) .sony./CXD SONY(日本索尼公司) .sony./CXK DAEWOO(韩国大宇电子公司)DBL PANASONIC(日本松下电器公司) .panasonic./DN AECO(日本阿伊阔公司)D...C GTE(美国通用电子公司微电路部)EA SIGNETICS(美国西格尼蒂克公司) .spt./EEA THOMSON-CSF(法国汤姆逊半导体公司) .thomson./EF THOMSON-CSF(法国汤姆逊半导体公司) .thomson./EFB PHILIPS(荷兰菲利浦公司) .semiconductors.philips./EGC THOMSON-SGF(法国汤姆逊半导体公司)ESM PHILIPS(荷兰菲利浦公司) .semiconductors.philips./F FAIRCHILD(美国仙童公司) .fairchildsemi./FCM FAIRCHILD(美国仙童公司) .fairchildsemi.G GTE(美国微电路公司)GD GOLD STAR[韩国金星(高尔达)电子公司]GL GOLD STAR[韩国金星(高尔达)电子公司]GM GOLD STAR[韩国金星(高尔达)电子公司]HA HITACHI(日本日立公司) semiconductor.hitachi./HD HITACHI(日本日立公司) semiconductor.hitachi./HEF PHILIPS(荷兰菲利浦公司) .semiconductors.philips./HM,HZ HITACHI(日本日立公司) semiconductor.hitachi./ICL,IG INTERSIL(美国英特锡尔公司)IR,IX SHARP[日本夏普(声宝)公司] .sharp./ITT,JU ITT(德国ITT半导体公司) .ittcannon./KA,KB SAMSUNG(韩国三星电子公司) .sec.samsung./KC SONY(日本索尼公司) .sony./KDA SAMSUNG(韩国三星电子公司) .sec.samsung./KIA,KID KEC(韩国电子公司)KM KS SAMSUNG(韩国三星电子公司) .sec.samsung./L SGS-ATES SEMICONDUCTOR(意大利SGS-亚特斯半导体公司) .st./ L SANYO(日本三洋电气公司) .sanyo./LA SANYO(日本三洋电气公司) .sanyo./LB SANYO(日本三洋电气公司) .sanyo./LC SANYO(日本三洋电气公司) .sanyo./LC GENERAL INSTRUMENTS(GI)(美国通用仪器公司)LF PHILIPS(荷兰菲利浦公司) .semiconductors.philips./LF NATIONAL SEMICONDUCTOR(美国国家半导体公司) .national./LH NATIONAL SEMICONDUCTOR(美国国家半导体公司) .national./ LH LK SHARP[日本夏普(声宝)公司] .sharp./LM SANYO(日本三洋电气公司) .sanyo./LM NATIONAL SEMICONDUCTOR(美国国家半导体公司) .national./ LM SIGNETICS(美国西格尼蒂公司) .spt./LM FAIRCILD(美国仙童公司) .fairchildsemi./LM SGS-ATES SEMICONDUCTOR(意大利SGS-亚特斯半导体公司) .st./ LM PHILIPS(荷兰菲利浦公司) .semiconductors.philips./LM MOTOROLA(美国莫托罗拉半导体产品公司) .motorola./LM SAMSUNG(韩国三星电子公司) .sec.samsung./LP NATIONAL SEMICONDUCTOR(美国国家半导体公司) .national./LR LSC SHARP[日本夏普(声宝)公司] .sharp./M SGS-ATES SEMICONDUCTOR(意大利SGS-亚特斯半导体公司) .st./ M MITSUBISHI(日本三菱电机公司) .mitsubishi./MA ANALOG SYSTEMS(美国模拟系统公司) .analog./MAX （美国）美信集成产品公司.maxim-ic./MB FUJITSU(日本富士通公司) .fujitsu./MBM FUJITSU(日本富士通公司) .fujitsu./MC MOTOROLA(美国莫托罗拉半导体产品公司) .motorola./MC PHILIPS(荷兰菲利浦公司) .semiconductors.philips./MC ANALOG SYSTEMS(美国模拟系统公司) .analog./MF MITSUBISHI(日本三菱电机公司) .mitsubishi./MK MOSTEK(美国莫斯特卡公司)ML PLESSEY(美国普利西半导体公司)ML MITEL SEMICONDUCTOR(加拿大米特尔半导体公司) .mitelsemi./ MLM MOTOROAL(美国莫托罗拉半导体产品公司) .motorola./MM NATIONAL SEMICONDUCTOR(美国国家半导体公司) .national./ MN PANASONIC(日本松下电器公司) .panasonic./MN MICRO NETWORK(美国微网路公司)MP MICRO POWER SYSTEMS(美国微功耗系统公司)MPS MICRO POWER SYSTEMS(美国微功耗系统公司)MSM OKI(美国OKI半导体公司) .oki./MSM OKI(日本冲电气XX) .oki./N NA SIGNETICS(美国西格尼蒂克公司) .spt./NC NITRON(美国NITROR公司)NE SIGNETICS(美国西格尼蒂克公司) .spt./NE PHILIPS(荷兰菲利浦公司) .semiconductors.philips./NE MULLARD(英国麦拉迪公司)NE SGS-ATES SEMICONDUCTOR(意大利SGS-亚特斯半导体公司) .st./NJM NEW JAPAN RADIO(JRC)(新日本无线电公司)OM PANASONIC(日本松下电器公司) .panasonic./OM SIGNETICS(美国西格尼蒂克公司) .spt./RC RAYTHEON(美国雷声公司)RM RAYTHEON(美国雷声公司)RH-IX SHARP[日本夏普(声宝)公司] .sharp./S SIEMENS(德国西门子公司) .siemens./S AMERICAN MICRO SYSTEMS(美国微系统公司)SA PHILIPS(荷兰菲利浦公司) .semiconductors.philips./SAA PHILIPS(荷兰菲利浦公司) .semiconductors.philips./SAA SIGNETICS(美国西格尼蒂克公司) .spt./SAA GENERAL INSTRUMENTS(GI)(美国通用仪器公司)SAA ITT(德国ITT-半导体公司) .ittcannon./SAB SIGNETICS(美国西格尼蒂克公司) .spt./SAB AEG-TELEFUNKEN(德国德律风根公司) .telefunken.de/engl/index_e.aspl SAF SIGNETICS(美国西格尼蒂克公司) .spt./SAK PHILIPS(荷兰菲利浦公司) .semiconductors.philips./SAS HITACHI(日本日立公司) semiconductor.hitachi./SAS AEG-TELEFUNKEN(德国德律风根公司) .telefunken.de/engl/index_e.aspl SAS SIEMENS(德国西门子公司) .siemens./SDA (德国西门子公司) .siemens./SC SIGNETICS(美国西格尼蒂克公司) .spt./SE SIGNETICS(美国西格尼蒂克公司) .spt./SE PHILIPS(荷兰菲利浦公司) .semiconductors.philips./SG SILICON GENERAL(美国通用硅片公司) .ssil./SG MOTOROAL(美国莫托罗拉半导体产品公司) .motorola./SG PHILIPS(荷兰菲利浦公司) .semiconductors.philips./SH FAIRCHILD(美国仙童公司) .fairchildsemi./SI SANKEN(日本三肯电子公司) .sanken-elec.co.jp/SK RCA(美国无线电公司)SL PLESSEY(英国普利西半导体公司)SN MOTOROAL(美国莫托罗拉半导体产品公司) .motorola./SN TEXAS INSTRUMENTS(TI)(德国德克萨斯仪器公司) .ti./SND SSS(美国固体科学公司) .s3./SO SIEMENS(德国西门子公司) .siemens./SP PLESSEY(英国普利西半导体公司)STK SANYO(日本三洋电气公司) .sanyo./STR SANKEN(日本三肯电子公司) .sanken-elec.co.jp/SW PLESSEY(英国普利西半导体公司)T TOSHIBA(日本东芝公司) .toshiba./T GENERAL INSTRUMENTS(GI)(美国通用仪器公司)TA TOSHIBA(日本东芝公司) .toshiba./TAA SIGNETICS(美国西格尼蒂克公司) .spt./TAA SIEMENS(德国西门子公司) .siemens./TAA SGS-ATES SEMICONDUCTOR(意大利SGS-亚特斯半导体公司) .st./TAA PRO ELECTRON(欧洲电子联盟)TAA PHILIPS(荷兰菲利浦公司) .semiconductors.philips./TAA PLESSEY(英国普利西半导体公司)TAA MULLARD(英国麦拉迪公司)TBA FAIRCHILD(美国仙童公司) .fairchildsemi./TBA SIGNETICS(美国西格尼蒂克公司) .spt./TBA SGS-ATES SEMICONDUCTOR(意大利SGS-亚特斯半导体公司) .st./ TBA HITACHI(日本日立公司) semiconductor.hitachi./TBA NEC EIECTRON(日本电气公司) .nec-global./TBA ITT(德国ITT半导体公司) .ittcannon./TBA AEG-TELEFUNKEN(德国德律风根公司) .telefunken.de/engl/index_e.asplTBA PRO ELECTRON(欧洲电子联盟)TBA SIEMENS(德国西门子公司) .siemens./TBA PLESSEY(英国普利西半导体公司)TBA NATIONAL SEMICONDUCTOR(美国国家半导体公司) .national./TBA THOMSON-CSF(法国汤姆逊半导体公司) .thomson./TBA PHILIPS(荷兰菲利浦公司) .semiconductors.philips./TBA MULLARD(英国麦拉迪公司)TC TOSHIBA(日本东芝公司) .toshiba./TCA ITT(德国ITT半导体公司) .ittcannon./TCA SIGNETICS(美国西格尼蒂克公司) .spt./TCA SPRAGUE ELECTRIC(美国史普拉格电子公司)TCA MOTOROAL(美国莫托罗拉半导体公司) .motorola./TCA PRO ELECTRON(欧洲电子联盟)TCA PLESSEY(英国普利西半导体公司)TCA SGS-ATES SEMICONDUCTOR(意大利SGS-亚特斯半导体公司) .st./TCA MULLARD(英国麦拉迪公司)TCA PHILIPS(荷兰菲利浦公司) .semiconductors.philips./TCA AEG-TELEFUNKEN(德国德律风根公司) .telefunken.de/engl/index_e.aspl TCA SIEMENS(德国西门子公司) .siemens./TCM TEXAS INSTRUMENTS[TI](美国德克萨斯仪器公司) .it./TDA SIGNETICS(美国西格尼蒂克公司) .spt./TDA SPRAGUE ELECTRIC(美国史普拉格电子公司)TDA MOTOROLA(美国莫托罗拉半导体公司) .motorola./TDA PRO ELECTRON(欧洲电子联盟)TDA NATIONAL SEMICONDUCTOR(美国国家半导体公司) .national./TDA PLESSEY(英国普利西半导体公司)TDA SIEMENS(德国西门子公司) .siemens./TDA NEC ELECTRON(日本电气公司) .nec-global./TDA AEG-TELEFUNKEN(德国德律风根公司) .telefunken.de/engl/index_e.aspl TDA ITT(德国ITT半导体公司) .ittcannon./TDA HITACHI(日本日立公司) semiconductor.hitachi./TDA SGS-ATES SEMICONDUCTOR(意大利-SGS亚特斯半导体公司) .st./TDA PRO ELECTRON(欧洲电子联盟)TDA PHILIPS(荷兰菲利浦公司) .semiconductors.philips./TDA RCA(美国无线电公司)TDA MULLARD(英国麦拉迪公司)TDA THOMSON-CSF(法国汤姆逊半导体公司) .thomson./TDB THOMSON-CSF(法国汤姆逊半导体公司) .thomson./TDC TRW LSI PRODUCTS(美国TRW大规模集成电路公司)TEA THOMSON-CSF(法国汤姆逊半导体公司) .thomson./TEA PHILIPS(荷兰菲利浦公司) .semiconductors.philips./TL TEXAS INSTRUMENTS(TI)(美国德克萨斯仪器公司) .toshiba./TL MOTOROLA(美国莫托罗拉半导体产品公司) .motorola./TM TOSHIBA(日本东芝公司) .toshiba./TMM TOSHIBA(日本东芝公司) .toshiba./TMS TEXAS INSTRUMENTS(TI)(美国德克萨斯仪器公司) .ti./TP TEXAS INSTRUMENTS(TI)(美国德克萨斯仪器公司) .ti./TP NATIONAL SEMICONDUCTOR(美国国家半导体公司) .national./TPA SIEMENS(德国西门子公司) .siemens./TUA SIEMENS(德国西门子公司) .siemens./U AEG-TELEFUNKEN(德国德律风根公司) .telefunken.de/engl/index_e.aspl UAA SIEMENS(德国西门子公司) .siemens./UC SOLITRON(美国索利特罗器件公司) .solitron./ULN SPRAGUE EIECTRIC(美国史普拉格电子公司) .sharp./ULN SIGNETICS(美国西格尼蒂克公司) .spt./ULN MOTOROLA(美国莫托罗拉半导体产品公司) .motorola./ULS SPRAGUE ELECTRIC(美国史普拉格电子公司) .sharp./ULX SPRAGUE ELECTRIC(美国史普拉格电子公司) .sharp./XR TEXAR INTEGRA TED SYSTEMS(美国埃克萨集成系统公司) .ti./YM Y AMAHA(日本雅马哈公司) .yamaha.co.jp/UA MOTOROLA(美国莫托罗拉半导体产品公司) .motorola./UA SIGNETICS(美国西格尼蒂克公司) .spt./UA PHILIPS(荷兰菲利浦公司) .semiconductors.philips./UA FAIRCHILD(美国仙童公司) .fairchildsemi./UAA THOMSON-CSF(法国汤姆逊半导体公司) .thomson./UPA NEC ELECTRON(日本电气公司) .nec-global./UPB NEC ELECTRON(日本电气公司) .nec-global./UPC NEC ELECTRON(日本电气公司) .nec-global./UPD NEC ELECTRON(日本电气公司) .nec-global./UPD NEC-MIRO(美国NEC电子公司微电脑分部).nec-global./。

集成电路封装技术专家：比尔·摩尔(Bill Moor)人物简介

• 为集成电路封装技术的发展提供了指导
• 促使封装技术不断创新和突破
推动插件式封装、表面贴装封装等技术的发展
• 提高了集成电路的性能和可靠性
• 为封装技术的发展奠定了基础
提出封装集成、系统级封装等技术概念
• 为集成电路封装技术的发展指明了方向
• 促使封装技术向更高层次发展
比尔·摩尔对集成电路封装技术产业发展的影响
比尔·摩尔对科技产业的影响与启示
对科技产业产生了深远影响
启示我们要关注科技产业的发展趋势
• 他的创新精神和领导力为科技产业的发展提供了榜样
• 及时调整发展战略，抓住市场机遇
• 他的成就为科技产业的发展提供了动力
• 注重技术创新和人才培养，提高产业竞争力
比尔·摩尔的个人品质与领导风格
具有创新精神
具有卓越的领导力
• 加入了学校的无线电俱乐部，开始接触电子技术
大学时期，比尔·摩尔进入加州理工学院学习
• 主修电子工程专业，辅修化学和物理
• 1965年获得电子工程学士学位
比尔·摩尔在英特尔公司的职业生涯

1965年，比尔·摩尔加入英特尔公司，担任工程师
• 参与半导体存储器产品的研发
• 对集成电路封装技术产生浓厚兴趣
集成电路封装技术的起源与发展
20世纪60年代，集成电路封装技术诞生
• 集成电路技术的发展，对封装技术提出了更高要求
• 封装技术为保护集成电路芯片，提高可靠性而诞生
20世纪70年代，集成电路封装技术得到进一步发展
• 出现了插件式封装、表面贴装封装等技术
• 提高了集成电路的性能和可靠性
20世纪80年代至今，集成电路封装技术不断发展
集成电路封装技术专家：比尔·摩尔人物简介

如何用英语介绍华为芯片的作文

文章标题Introducing Huawei's Chipset InnovationsHuawei, a global technology leader, has madesignificant strides in the realm of chipset development, revolutionizing the telecommunications and computing landscapes. At the heart of Huawei's technological prowess lies its cutting-edge chipsets, which power a range of devices from smartphones to networking equipment. Thisessay aims to delve into the remarkable advancements and features of Huawei's chipsets, highlighting their significance in the global technology ecosystem.Firstly, it's imperative to understand the fundamental role chipsets play in modern technology. A chipset is a set of integrated circuits designed to perform specific functions, often serving as the brain of electronic devices. Huawei's chipsets are renowned for their superior performance, efficiency, and innovation. The company's research and development teams have invested heavily in chipset technology, resulting in groundbreaking advancements.One of the most notable achievements is Huawei's HiSilicon chipset family. These chipsets are designed and manufactured in-house, allowing Huawei to have greater control over their devices' hardware and software integration. The HiSilicon chipsets are known for their high processing speeds, low power consumption, and advanced features like AI capabilities.Furthermore, Huawei's chipsets are not just limited to smartphones. The company has also made significant contributions to the networking industry with its chipset innovations. Huawei's networking chipsets are designed to provide robust and scalable solutions for data centers, enterprise networks, and telecommunications systems. These chipsets enable high-speed data transmission, improved security, and efficient resource utilization.Another noteworthy aspect of Huawei's chipsets is their adaptability and scalability. The company's chipset designs are flexible enough to be tailored to meet the specific needs of different devices and applications. Whether it's a high-end smartphone or a large-scale networking system,Huawei's chipsets can be optimized to deliver optimal performance.Moreover, Huawei's commitment to sustainability is reflected in its chipset designs. The company strives to use energy-efficient technologies and materials in its chipsets, reducing the overall carbon footprint of its devices. This commitment to environmental responsibility aligns with Huawei's broader vision of building a sustainable digital future.In conclusion, Huawei's chipsets are a testament to the company's technological prowess and innovation. They are not just powerful components that drive Huawei's devices; they are also key enablers of the global technology ecosystem. From smartphones to networking equipment, Huawei's chipsets are shaping the future of telecommunications and computing. As the company continues to invest in research and development, we can expect to see even more remarkable advancements in chipset technology from Huawei in the future.**介绍华为芯片创新**华为作为全球技术领导者，在芯片开发领域取得了重大进展，推动了电信和计算领域的革命性变革。

常见英文缩写

常用英文缩写VIP = very improtant person重要人物IMP (import)进口EXP (export)出口MAX (maximum)最大的、的最大限度的MIN (minimum)最小的，最低限度DOC (document)文件、的单据INT (international)国际的EMS (express mail special)特快传递IRC（International Red Cross）国际红十字会UNESCO（the United Nations Educational,Scientific and Cultural Organization）联合国教科文组织W.C（water closet）CIA(central intelligence agence)美国中情局FBI(feberal bureau of investigation)美国联邦调查局FA(football association)足协WTO 世界贸易组织WHO世界卫生组织UN 联合国UNICEF 联合国教科文组织建筑1.CBD：中央商务区(Central Business District) CBD应具备以下特征：现代城市商务中心，汇聚世界众多知名企业，经济、金融、商业高度集中，众多最好的写字楼、商务酒店和娱乐中心，最完善便利的交通，最快捷的通讯与昂贵的地价。

2.CLD：中央居住区，指由若干个居住区组成的可以满足城市居民居住、教育、购物、娱乐、休闲的大型集中型居住区，国际上普遍称为Central Living District（简称CLD）。

CLD 最重要的两个因素是空间和环境。

3.COD：中央行政区，全称是CentraL OffiCiaL DistriCt ，其名称源于该区内汇集了多家国家部委、机关、办事机构4.MORE：互动商务居住区，英文Mobile Office Residential Edifice的缩写，其文意为移动、办公、居住等意。

1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。

Oracle Answers
Oracle Delivers
• Dynamic problem/opportunity detection and notification • Automated analytic workflows and processes • Tailored delivery for wide range of mobile devices
Interactive Reporting & Dashboards Publishing Ad-hoc Analysis Proactive Disconnected MS Office Plug-in Detection Analytics and Alerts
S e c u r i t y
Simplified Business Model and Abstraction Layer
Agenda
• • • • •
Introductions
Oracle BI Enterprise Edition Overview
Oracle BI Enterprise Edition Demo Workshop Q&A
Private & Confidential: © 2006 Oracle Corporation, all rights reserved.
Presentation Layer • Simplified view • Logical SQL interface Semantic Object Layer • • • • • • Dimensions Hierarchies Measures Calculations Aggregation Rules Time Series Physical Layer • Map Physical Data • Connections • Schema
Financials
A/R & A/P Analysis
Human Resources
Employee Productivity
Triangulated Forecasting
Sales Team Effectiveness Up-sell / Cross-sell
Customer Satisfaction
Primary BI EE End User Options
Complete Range of Insight Delivery Capabilities
Oracle Interactive Dashboards
• Guided experience leads user from insight to action • Intuitive and interactive dashboards/scorecards • Personalized, function-specific and role-based • Ad-hoc data exploration • True business user self sufficiency • Create, modify and author analysis, pivots and dashboards
2
Oracle Business Intelligence Enterprise Edition
Private & Confidential: © 2006 Oracle Corporation, all rights reserved.
3
Fusion Middleware
Private & Confidential: © 2006 Oracle Corporation, all rights reserved.
Orders vs. Available Inventory
Supply Chain
Supplier Performance Spend Analysis Procurement Cycle Times Inventory Availability Employee Expenses BOM Analysis
Private & Confidential: © 2006 Oracle Corporation, all rights reserved.
5
Comprehensive, Integrated BI Suite
Enables single enterprise BI architecture Oracle BI Suite Enterprise Edition Portal for Enterprise Access to all Information
8
Oracle BI Applications
Multi-Source Analytics with Single Architecture
Auto
Comms & Media
Complex Consumer Sector Mfg
Energy
Financial Services
High Tech
Insurance Life & Health Sciences
Resolution Rates Service Rep Effectiveness
Response Rates
Product Propensity Loyalty and Attrition
GL / Balance Compensation Sheet Analysis Analysis
Customer & Product Profitability
Orders vs. Available Inventory
Supply Chain
Supplier Performance Spend Analysis Procurement Cycle Times Inventory Availability Employee Expenses BOM Analysis
Consistent definition of businessmeasures, met源自ics, calculations
Assures enterprise-wide alignment
Private & Confidential: © 2006 Oracle Corporation, all rights reserved.
P&L Analysis Expense Management Cash Flow Analysis
Cycle Time Analysis
Lead Conversion
Service Cost Analysis
Service Trends
Market Basket Analysis
Campaign ROI
Oracle BI Server
Intelligent Caching Services Multidimensional Calculation and Integration Engine Intelligent Request Generation and Optimized Data Access Services
Oracle Business Intelligence Enterprise Edition Hands On Workshop
Nelson Fernandes Principal BI/DW Solution Specialist June 28, 2007
Private & Confidential: © 2006 Oracle Corporation, all rights reserved.
Prebuilt adapters:
Other Operational & Analytic Sources
Oracle BI Suite Enterprise Edition
Private & Confidential: © 2006 Oracle Corporation, all rights reserved.
Balanced Scorecard
Real Time & Predictive
Guided Analytics
Intelligent Workflow
Common Enterprise Information Model Unified Business Intelligence Infrastructure
OLTP & ODS Systems
Data Warehouse Data Mart
SAP, Oracle PeopleSoft, Siebel, Custom Apps
Files Excel XML
Business Process
I n t e g r a t i o n
6
Private & Confidential: © 2006 Oracle Corporation, all rights reserved.
Financials
A/R & A/P Analysis
Human Resources
Employee Productivity
Triangulated Forecasting
Sales Team Effectiveness Up-sell / Cross-sell
Customer Satisfaction
• Schedule & distribute enterprise-class reports • Sophisticate “pixel-perfect” report layout controls
Oracle Reporting & Publishing