BLM21P系列

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2812引脚图及原理

2812引脚图及原理

图1 主要元件位置示意图开发板采用一个TPS767D301芯片为整个系统供电,采用一个LED作为上电指示,添加了手动复位功能,将2812的全部引脚引出,开发板主要元件及其位置如图1所示。

标号功能描述P1~P4 DSP引脚引出P5 XMP/MCnP6 JTAGP7 电源输入表1 开发板插接件P1~P4将2812的全部有用引脚引出,以便用于扩展。

每个插接件的第一脚用方形焊盘表示。

下面图表分别描述了P1~P4的引脚排列及每个引脚的功能。

图2 P1的引脚排列引脚功能引脚功能1ADCINA72ADCINA63ADCINA54ADCINA4 5ADCINA36ADCINA2 7ADCINA18ADCINA0 9ADCINB110ADCINA0 11ADCINB312ADCINB2 13ADCINB514ADCINB4 15ADCINB716ADCINB6 17 3.3V_IO18GND 19MDRA20XA0 21MDXA22XD0 23MCLKRA24XD1 25XD226MFSXA 27MFSRA28MCLKXA 29 3.3V_IO30XD3 31GND32XD4 33SPICLKA34SPISTEA 35XD536XD6 37SPISIMOA38SPISOMI 39XRDn40XA1 41XZCS0AND1n42PWM7 43 3.3V_IO44GND表2 P1引脚功能描述图3 P2引脚排列引脚功能引脚功能1GND2 3.3V_IO 3XHOLDAn4T4CTRIP 5XWE6XA37CANTA8XZCS2n 9CANRA10SCITB 11SCIRB12PWM1 13PWM214PWM3 15PWM416XD12 17XD1318PWM519PWM620T1PWM 21XA422T2PWM 23CAP124CAP225XA526CAP327T1CTRIP28XA629GND30 3.3V_IO 31T2CTRIP32TDIRA33TCLKINA34XA735XCLKOUT36XA837C1TRIP38C2TRIP39C3TRIP40XA9表3 P2引脚功能描述图3 P3的引脚排列引脚功能引脚功能1 3.3V_IO2GND3XREADY4RESETn5XHOLDn6XA187SCIRA8XA179SCITA10XA1611XINT212XNMI/XINT13 13XINT114XA1515XD1516 3.3V_IO 17XA1418XA1319XPLLDISn20XD1421XA1222XZCS6AND7n 23XA1124XA10表4 P3引脚功能描述图5 P4引脚排列引脚功能引脚功能1XA22T3CTRIP3XD114GND5TCLKINB6XD107XD98TDIRB9XD810GND11C6TRIP12 3.3V_IO13C4TRIP14C5TRIP15CAP516CAP617T4PWM18CAP419T3PWM20XD721PWM1222XRW23PWM1024PWM1125PWM826PWM9表5 P4引脚功能描述P5为DSP的XMP/MCn选择跳线,P5不短接时,XMP/MCn引脚被下拉到GND,DSP 工作在微控制器模式,当P5被短接时DSP工作在微处理器模式。

BLM21AG102SN1磁珠规格书

BLM21AG102SN1磁珠规格书

EG
For GHz Band General Use (Low DC Resistance Type)
HB
HD
For GHz Band High-speed Signal Lines
HE
GA
For High-GHz Band High-speed Signal Lines
GG
For High-GHz Band General Use
Type DC Bias Characteristics Improved Type
Ferrite Bead Single Type
eDimensions (LgW)
Code
Dimensions (LgW)
03
0.6g0.3mm
15
1.0g0.5mm
18
1.6g0.8mm
21
2.0g1.25mm
31
0402
For High Speed Signal (Sharp impedance characteristics)
For Large Current For Standard
GHz Range
For High Speed Signal
For Standard (Low DC
Resistance Type)
1400±40%
1000±25%
2000±40%
1800±25%
2700±40%
120±25%
145 (Typ.)
220±25%
270 (Typ.)
120±25%
-
150±25%
-
220±25%
-
330±25%
-
470±25%

BLM21PG300SN1磁珠规格书

BLM21PG300SN1磁珠规格书

yElectrode Expressed by a letter.
Ex.)
Code
S/T
A
W
Electrode Sn Plating Au Plating
Ag/Pd
uCategory Code Z H
For Automotive
Category Infotainment
Powertrain, Safety
0402
For High Speed Signal (Sharp impedance characteristics)
For Large Current For Standard
GHz Range
For High Speed Signal
For Standard (Low DC
Resistance Type)

Chip Ferrite Bead for Automotive Part Numbering
oPackaging
Code
Packaging
K
Embossed Taping (ø330mm Reel)
L
Embossed Taping (ø180mm Reel)
B
Bulk
Impedance (Ω)
at 100MHz
at 1GHz
10 (Typ.)
-
70 (Typ.)
-
120±25%
-
240±25%
-
10 (Typ.)
-
70 (Typ.)
-
120±25%
-
220±25%
-
600±25%
-
1000±25%
-
600±25%

什么是宫颈癌原位癌 宫颈癌原位癌治疗

什么是宫颈癌原位癌 宫颈癌原位癌治疗

什么是宫颈癌原位癌宫颈癌原位癌治疗什么是宫颈癌原位癌宫颈癌原位癌一般指宫颈原位癌宫颈原位癌,病变细胞几乎或全部战局上皮全程,细胞核异常增大,核质比例显著增大,核型不规那么,染色较深,核分裂相增多,细胞拥挤,无极性。

手术是早期宫颈癌的有效治疗方法。

子宫颈锥形切除术和子宫颈截除术可治愈一些病例。

主要适用于希望生孩子的青年妇女。

其他的病人应采用单纯性子宫切除术。

宫颈癌原位癌简介宫颈原位癌:病变细胞几乎或全部占据上皮全层,细胞核异常增大,核质比例显著增大,核型不规那么,染色较深,核分裂相增多,细胞拥挤,无极性。

宫颈癌原位癌治疗指1.手术治疗:手术是早期宫颈癌的有效治疗方法。

子宫颈锥形切除术和子宫颈截除术可治愈一些病例。

主要适用于希望生孩子的青年妇女。

其他的病人应采用单纯性子宫切除术。

上海医科大学妇产医院从1952年—1985年共收治宫颈浸润癌1165例,其中根治手术1049例,其五年生存率Ia期(早浸润)100%,Ib,期(浸润癌)97.6±0.6%。

疗效居国内先进水平。

2.放射治疗:可用于各期子宫浸润癌。

根治性放疗包括腔内镭疗和子宫旁组织的外照射。

镭疗应给予6000—7000伦琴的剂量。

3.化学治疗:①大剂量顺铂疗法:第一天静点生理盐水1000—2022毫升,第二天给予顺铂(PDD)80—120mg/米2,同时挣点生理盐水4000—5000毫升,加甘露醇250毫升利尿,并重复水化3—5天。

③BLM—P方案:BLM20mg/m2,I.V,第1—3天;CD—DP60mg/m2,I.V,第1天,每21天重复,有效率:36%。

4.中药治疗:①血蛊回生汤:处方:三棱、莪术、黄药子、茜草、白头翁、半枝莲、桂枝、茯苓各20g,黄柏、黄芩、丹皮、赤芍、红花、桃仁各15g。

加减:便血、里急后重,去黄芩,加生地榆20g、鸦胆子14粒(用糖水送服,日服4次);尿频、尿痛、尿血者去桂枝、茜草,加夏枯草、白茅根各20g,甘草梢25g。

ZingOEM开发板硬件手册

ZingOEM开发板硬件手册

ZingOEM平台硬件用户手册Ver:1.0修订记录版本修订日期修订内容0.9 2012年9月17日用户手册初始版本1.0 2012年10月20日更新内容和统一格式威视锐旗下品牌http:// - 2 -目录修订记录 ............................................................................................................................................ - 2 -1 产品概述 ........................................................................................................................................ - 4 -2 相关文档 ........................................................................................................................................ - 5 -3 结构框图 ........................................................................................................................................ - 6 -4 配套信息 ........................................................................................................................................ - 7 -5 开发板硬件资源............................................................................................................................. - 8 - 5.1 Zynq-7000 XC7Z020-1CLG484芯片...................................................................................... - 9 - 5.2 DDR3内存颗粒 ..................................................................................................................... - 10 - 5.2 系统时钟源 ........................................................................................................................... - 13 - 5.4 SDIO连接器 .......................................................................................................................... - 14 - 5.5 USB2.0 ULPI收发器............................................................................................................. - 15 - 5.6 10/100/1,000 MHz的三速以太网口 .................................................................................. - 18 - 5.7 USB_UART接口 ................................................................................................................... - 19 - 5.8 CAN总线接口 ....................................................................................................................... - 20 - 5.9 I2C总线接口.......................................................................................................................... - 20 - 5.10 RTC实时时钟...................................................................................................................... - 21 - 5.11 XADC接口 .......................................................................................................................... - 22 - 5.12 FMC连接器 ......................................................................................................................... - 23 - 5.13 HDMI接口........................................................................................................................... - 25 -5.14 用户I/O ............................................................................................................................... - 27 -6 Zing开发板UCF列表 ................................................................................................................. - 29 -1 产品概述Zing是一块由北京威视锐公司推出的基于赛灵思可扩展处理平台架构的高性能开发板。

陶瓷贴片电容丶贴片电感丶片式磁珠命名规则与基本知识

陶瓷贴片电容丶贴片电感丶片式磁珠命名规则与基本知识

陶瓷贴片电容、贴片电感.片式磁珠muRuta村田命名规则与基本知识一、村田陶瓷贴片电容知识M名衣示法如卜:片状独们盹瓷电容器GRM 15.3R7K 225KE15D•GRM—农示儀锡电极:卄通貼片期瓷12容•常用的村} 11容就是GRM艸通贴片海瓷电容与GNM卄通贴片搏容:•18——衣示尺寸(长*宽):1.6*0.8mm即内通用尺对衣示是(K*审)1.6*0.8mm (单位为mm:c词阿卜通用尺、J A示是用英寸0603 (单位为inch;,卜J E询常用代码仃03、15、18、21、31、32、42、43、55〕;,II 体的对应值如卜I03-...0.6*0.3mm- (0201)15——1.0*0.5mm~-040218-...1.6*0.8mm- (0603)21-—2.0# 1.25mm——080531一“3.2* 1.6mm—120632-—3.2* 1.5mm一・121042一.5*2.0mm——180843 …45*3・2mm•—181255—5.7 拿5・0mm——2220•8——衣示用度(T:: 0.8mm常用厚度村田代码仃5、6、8、9、B、C、E:'h貝㈱对应值如卜:5-…0.5mm 6-…0.6mm 8-…0.8mm 9-…0.9mm B-…1.25mm C-…1.6mm E -—2.5mm•R7——农示材质:X7R常用材质村t:代码有5C、R6、R7、F5等,R体的对应值如卜:5C--COG/NPO/CHR6——X5RR7——X7RF5・——Y5V5C I仆温度是・55度一+125必温度系敌是0+・30ppm/gR6 I作泪度是・55度一H85度,SH度系数是+-15%:R7 1作温度是・55度一H25度,温度系数好+15%:F5 I作fiU是・30度—85度.温度系数是+22 -82%lOOpfW卜小容fi*L般采比5C材頂,100PF—luf人一般采用R7材质,luf以上一股采用R6材质,櫛S®求不禹的般采用F5材质。

EMC元器件介绍

EMC元器件介绍

Array
3A 6A
大电流
2500
100MHz
2000
Impedance(Ω )
500MHz
1500
1000
1GHz 500
高频段
3GHz 0 1
深圳顺络电子股份有限公司
HZ1608U102
GZ1608U102
10
100
1000
Frequency(MHz)
电性参数
参数 Z (阻抗)
测试仪器
测试频率
Example Nominal Value
121
120Ω
102
1000Ω
⑤ 包装 T 盘装
⑥ 无铅产品 F
深圳顺络电子股份有限公司
HPZ 系列
产品编号方式
HPZ 1608 D 221 -R60 T F ① ② ③④ ⑤ ⑥ ⑦
① 类型 HPZ 高频大电流磁珠
④ 公称阻抗值
Example 300 121 102
信号线 或电源线
信号线 或电源
线
滤波器选型
输出阻抗


High
输 入 阻 抗
Low
深圳顺络电子股份有限公司
内容
1、EMC基本概念 电磁兼容定义 电磁干扰三要素 滤波元件
2、顺络电子EMC元器件 磁珠 三端EMI滤波器 共模扼流器
深圳顺络电子股份有限公司
顺络电子EMC电子元器件
Nominal Value 30Ω 220Ω 1000Ω
②外形尺寸 (长×宽) (mm)
1005 [0402] 1.0×0.5
1608 [0603] 1.65×0.8 2012 [0805] 2.0×1.25

DSP28335开发板原理图

DSP28335开发板原理图

F28335
GPIO76/XD3 GPIO77/XD2 GPIO78/XD1 GPIO79/XD0 GPIO38/XWE0 XCLOUT VDD VSS GPIO28/SCIRXDA/XZCS6 GPIO34/ECAP1/XREADY VDDIO VSS GPIO36/SCIRXDA/XZCS0 VDD VSS GPIO35/SCITXDA/XR/W XRD GPIO37/ECAP2/XZCS7 GPIO40/XA0/XWE1 GPIO41/XA1 GPIO42/XA2 VDD VSS GPIO43/XA3 GPIO44/XA4 GPIO45/XA5 VDDIO VSS GPIO46/XA6 GPIO47/XA7 GPIO80/XA8 GPIO81/XA9 GPIO82/XA10 VSS VDD GPIO83/XA11 GPIO84/XA12 VDDIO VSS GPIO85/XA13 GPIO86/XA14 GPIO87/XA15 GPIO39/XA16 GPIO31/CANTXA/XA17
直直驱直驱驱
Diode 1N4007 D5 R16 1K/5% Q1 S8550 EPWM2_A EPWM2_B EPWM3_A
LS1 D3 1N4148 Buzzer D3.3V R14 0R/5% D5V 16 15 14 13 12 11 10 9 D5V SOMI SPISOMIA CLK SPICLKA CN1 5 4 3 2 1 R94 10K/5% R95 10K/5% R96 10K/5% R97 10K/5% SD1 D3.3V 11 10 8 7 6 5 4 3 2 1 9 nCD WP DATA1 DATA0 GND CLK VDD GND CMD CD/DATA3 DATA2 PAD4 PAD3 PAD2 PAD1 15 14 13 12 R17 1K/5% R18 1K/5% R19 1K/5% R20 1K/5% R21 1K/5% R74 1K/5% R75 1K/5% D3.3V 3.3VAS
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Continued on the following page.
o This data sheet is applied for CHIP FERRITE BEAD used for General Electronics equipment for your design.
! Note:
1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
Impedance (Ω)
30 Z
R 20
X 10
0
1
10
100
1000
Frequency (MHz)
I Impedance-Frequency Characteristics
BLM21PG300SN1
60
Impedance (Ω)
45
Z 30
R
15
X
0
1
10
100
1000
Frequency (MHz)
I Packaging
Code
Packaging
D
180mm Paper Tape
J
330mm Paper Tape
B
Bulk(Bag)
Minimum Quantity 4000 10000 1000
I Rated Value (p: packaging code)
Part Number
BLM21PG220SN1p BLM21PG300SN1p BLM21PG600SN1p BLM21PG221SN1p BLM21PG331SN1p
/
Noise Suppression Products/EMI Suppression Filters > Chip EMIFILr Inductor Type > Chip Ferrite Beads
Data Sheet
1
Chip EMIFILr Inductor Type Chip Ferrite Beads
2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 2006.3.9
I Impedance-Frequency Characteristics
BLM21PG600SN1
120
I Impedance-Frequency Characteristics
BLM21PG221SN1
400
Impedance (Ω)
90
Z 60
R
30 X
0
1
10
100
1000
Frequency (MHz)
! Note:
1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
BLM21P Series (0805 Size)
I Dimension
0.5±0.2
I Equivalent Circuit
0.85±0.2
2.0±0.2
1.25±0.2
EIA CODE : 0805
(in mm)
(Resistance element becomes dominant at high fdance-Frequency Characteristics
BLM21PG331SN1
600
Impedance (Ω)
300
200
100
0 1
Z R
X
10
100
Frequency (MHz)
1000
Impedance (Ω)
450
Z R
300
150
0 1
X
10
100
Frequency (MHz)
I Notice (Rating) In operating temperatures exceeding +85D, derating of current is necessary for chip Ferrite Beads for which rated current is 1500mA or over. Please apply the derating curve shown in chart according to the operating temperature.
Impedance (at 100MHz/20°C)
Impedance (at 1GHz/20°C)
Rated Current
22ohm±25%
-
6000mA
30ohm(Typ.)
-
3000mA
60ohm±25%
-
3000mA
220ohm±25%
-
330ohm±25%
-
2000mA 1500mA
DC Resistance (max.)
o This data sheet is applied for CHIP FERRITE BEAD used for General Electronics equipment for your design.
! Note:
1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
Notice Solderability of Tin plating termination chip might be deteriorated when low temperature soldering profile where peak solder temperature is below the Tin melting point is used. Please confirm the solderability of Tin plating termination chip before use.
2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 2006.3.9
1
-55°C to +125°C
1
Continued on the following page.
o This data sheet is applied for CHIP FERRITE BEAD used for General Electronics equipment for your design.
0.01ohm 0.015ohm 0.025ohm 0.050ohm 0.09ohm
Operating Temperature Range
Number of Circuits
-55°C to +125°C
1
-55°C to +125°C
1
-55°C to +125°C
1
-55°C to +125°C
[Derating]
6A 6
Derated Current [A]
5
4A 4
3A 3
2.5A
2A 2
1.5A
1.4A 1.2A
1 1A
0
85
125
Operating Temperature [D]
I Impedance-Frequency Characteristics
BLM21PG220SN1
40
1000
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