STPS1H100A

®1/7Table 1: Main Product CharacteristicsI F(AV) 1 A V RRM 100 V T j (max)175°C V F (max)0.62 VSTPS1H100HIGH VOLTAGE POWER SCHOTTKY RECTIFIERREV. 5Table 3: Absolute Ratings (limiting values)Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 100V I F(RMS)RMS forward voltage 10A I F(AV)Average forward currentT L = 160°C δ = 0.51A I FSM Surge non repetitive forward current tp = 10ms sinusoidal 50A I RRM Repetitive peak reverse current tp = 2µs F = 1kHz square 1A I RSM Non repetitive peak reverse current tp = 100µs square 1A P ARM Repetitive peak avalanche power tp = 1µs Tj = 25°C1500W T stg Storage temperature range-65 to + 175°C T j Maximum operating junction temperature *175°C dV/dtCritical rate of rise of reverse voltage10000V/µs* : thermal runaway condition for a diode on its own heatsinkdPtot dTj ---------------1Rth j a –()------------------------->August 2004FEATURES AND BENEFITS■Negligible switching losses■High junction temperature capability ■Low leakage cuurent■G ood trade-off between leakage current and forward voltage drop■Avalanche capability specifiedDESCRIPTIONSchottky rectifiers designed for high frequency miniature Switched Mode Power Supplies such as adaptators and on board DC/DC converters.Packaged in SMA or SMB.Table 2: Order CodesPart Number Marking STPS1H100A S11STPS1H100UG11捷多邦，您值得信赖的PCB打样专家！STPS1H1002/7Table 4: Thermal Resistance Table 5: Static Electrical Characteristics Pulse test:* tp = 5 ms, δ < 2%** tp = 380 µs, δ < 2%To evaluate the conduction losses use the following equation: P = 0.54 x I F(AV) + 0.08 I F 2(RMS)Symbol ParameterValue Unit R th(j-l)Junction to leadSMA 30°C/WSMB25Symbol Parameter Tests conditions Min.Typ Max.Unit I R *Reverse leakage currentT j = 25°CV R = V RRM 4µA T j = 125°C0.20.5mAV F **Forward voltage dropT j = 25°CI F = 1A 0.77VT j = 125°C 0.580.62T j = 25°C I F = 2A0.86T j = 125°C0.650.7Figure 1: Average forward power dissipation versus average forward currentFigure 2: Average forward current versus ambient temperature (δ = 0.5)Figure 3: Normalized avalanche power derating versus pulse durationFigure 4: Normalized avalanche powerderating versus junction temperatureSTPS1H1003/7Figure 5: Non repetitive surge peak forward current versus overload duration (maximum values) (SMA)Figure 6: Non repetitive surge peak forward current versus overload duration (maximum values) (SMB)Figure 7: Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy printed circuit board,e(Cu)=35µm, recommended pad layout) (SMA)Figure 8: Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy printed circuit board,e(Cu)=35µm, recommended pad layout) (SMB)Figure 9: Reverse leakage current versus reverse voltage applied (typical values)Figure 10: Junction capacitance versus reverse voltage applied (typical values)STPS1H1004/7Figure 11: Forward voltage drop versus forward current (maximum values)Figure 12: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35µm) (SMA)Figure 13: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35µm) (SMB)STPS1H100 Figure 14: SMA Package Mechanical DataFigure 15: SMA Foot Print Dimensions(in millimeters)5/7STPS1H100Figure 16: SMB Package Mechanical DataFigure 17: SMB Foot Print Dimensions (in millimeters)6/7STPS1H1007/7Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners© 2004 STMicroelectronics - All rights reservedSTMicroelectronics group of companiesAustralia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of AmericaTable 6: Ordering Information■Band indicates cathode ■Epoxy meets UL94, V0Ordering type Marking Package Weight Base qty Delivery mode STPS1H100A S11SMA 0.068 g 5000Tape & reel STPS1H100UG11SMB 0.107 g 2500Tape & reelTable 7: Revision HistoryDate Revision Description of ChangesJul-20034ALast update.Aug-20045SMA package dimensions update. Reference A1 max.changed from 2.70mm (0.106inc.) to 2.03mm (0.080).。