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(完整版)罗宾斯《管理学》内容概要,中英文对照

(完整版)罗宾斯《管理学》内容概要,中英文对照

(完整版)罗宾斯《管理学》内容概要,中英文对照罗宾斯《管理学》内容概要第一篇导论1章管理者和管理1、组织组织(organization)的定义:对完成特定使命的人们的系统性安排组织的层次:操作者(operatives)和管理者(基层、中层、高层)2、管理者和管理管理者(managers)的定义:指挥别人活动的人管理(management)的定义:同别人一起或者通过别人使活动完成得更有效的过程。

管理追求效率(efficiency)和效果(effectiveness)管理职能(management functions):计划(planning)、组织(organizing)、领导(leading)、控制(controlling)管理者角色(management roles):人际关系角色(interpersonal roles)、信息角色(information roles)、决策角色(decision roles) 成功的管理者和有效的管理者并不等同,在活动时间上,有效的管理者花费了大量的时间用于沟通,而网络联系(社交等)占据了成功的管理者很大部分时间。

管理者在不同的组织中进行着不同的工作。

组织的国别、组织的类型、组织的规模以及管理者在组织中的不同层次决定了管理者的角色扮演、工作内容以及职能和作用。

2章管理的演进1、20世纪以前的管理:亚当·斯密的劳动分工理论(division of labor)产业革命(industrial revolution)2、多样化时期(20世纪):科学管理(scientific management):弗雷德里克·泰勒一般行政管理理论(general administrative theory):亨利·法约尔(principles of management)、马克斯·韦伯(bureaucracy) 人力资源方法(human resources approach):权威的接受观点(acceptance view of authority),霍桑研究,人际关系运动(卡内基、马斯洛),行为科学理论家(behavioral science theorists) 定量方法(quantitative approach)3、近年来的趋势(20世纪后期):趋向一体化过程方法(process approach)系统方法(systems approach):封闭系统和开放系统(closed systems)权变方法(contingency approach):一般性的权变变量包括组织规模、任务技术的例常性、环境的不确定性、个人差异4、当前的趋势和问题(21世纪):变化中的管理实践全球化(globalization)工作人员多样化(work force diversity)道德(morality)激励创新(innovations)和变革(changes)全面质量管理(total quality management, TQM):由顾客需要和期望驱动的管理哲学授权(delegation)工作人员的两极化(bi-modal work force)3章组织文化与环境:管理的约束力量1、组织组织文化(organizational culture)被用来指共有的价值体系。

高达SEED机体资料14

高达SEED机体资料14

概述与技术资料(General and Technical Data)中文译名:M1A异端类型:宇宙用量产型MS制造方:奥布所属方:奥布尺寸:未知重量:未知动力提供:电池能量包驾驶舱:驾驶员一名,位于驱干的标准驾驶舱装备和设计特点:无首次服役: C.E.71年固定武器:“Igelstellung”75cm自动对空巴尔干炮塔×2,连续发射,固定在头部(手部)可选武器:71-44式改狙击型光束步枪×1;70式光束剑×1,装备在左肩后,手持使用外加装备武器:无技术和历史记录(Technical and Historical Notes)本机是奥布用以防卫自国的静止轨道空间站“天之御柱”而开发的M1 Astray的宇宙战用衍生机。

首台机体于C.E.71年6月初完成,同年6月16日奥布陷落后,由萨哈克家负责“天之御柱”的管理及运用,M1A Astray的生产也在同时进行着,量产出来的部分机体也被装载在草剃号上。

由于M1A预定是在无重力及低重力情况下的宇宙空间作战而设计的,所以与M1 Astray 相比,脚部的机构被大幅简化了。

因此,在重力条件下M1A甚至连自机的重量也无法承担,相对的,它对姿态控制的对应能力则很高,AMBAC机动时的反应也提高了30%;由于增设及强化了推进器,还装备了存有推进剂和冷却材料的储藏罐,使得本机的空间机动性能大幅提高。

此外,为在防卫空间站时提高各机的配合,技术人员对M1A头部的V字型天线也进行了大型化处理,令本机在轨道上的电子通信能力进一步增强。

由于涂装相似,使本机经常与P02 Astray "Blue Frame"混同。

本机的主武器是71-44式改狙击型光束步枪,它是专为在轨道上进行超长距离射击用而开发的,载有可根据地球周边磁场来计算光束偏向差并进行瞄准补正的系统及高精度探测器,在最合适的条件下有效射程长达400千米,具有极高的命中精度。

LCD液晶屏幕行业英语专用词

LCD液晶屏幕行业英语专用词

英文专有名词介绍1. General (一般专有名词)英文专有名词中文说明(数字表示有详注)LCD (Liquid Crystal Display) 液晶显示器*注.Glass, substrate or glass substrate 玻璃基版*注.TFT(Thin Film Transistor) 薄膜晶体管*注.Panel 面板Array 排列,指在玻璃基板上做TFT的制程LCD-ArrayCell 液晶填充制程…….分为LCD-FEOL(Cell前段)LCD-BEOL(Cell后段含Cell Tester)Module 模块,指后段组装制程LCMMonitor 监视器PixelXGA: eXtended Graphics Array=1024*768Pixels SXGA: Super XGA=1280*1024Pixels 像素*注.PS. 像素越多表示分辨率越高Computer 计算机Notebook 笔记型计算机(简称为NB)RGB (Red, Green, Blue) 指红绿蓝三原色PM (Preventive Maintenance) 预防保养Quality 品质Standard 标准(指作业标准或品质指针)Material 材料Yield 良率CIM (Computer Integration Manufacturing) 计算机整合制造(指以计算机系统整合制造流程)FA (Factory Automation) 工厂自动化Exit 出口Precaution 预防措施Warning 警告Emergency 紧急Alarm 警报2. Clean Room (洁净室专有名词)英文专有名词中文说明Clean room 洁净室***注.Particle 微粒子***注.HEPA (High Efficient Particulate Air) filter 高效能粒子空气过滤网Contamination 污染Temperature (TEMP) 温度Humidity 湿度Pressure 压力UPW (Ultra-Pure Water) 超纯水DIW (De-Ionized Water) 去离子水IPA (Isopropyl Alcohol) 异丙醇Sticky mat 脚踏黏垫***注.Cleanliness 洁净度ESD (Electro-static Discharge) 静电破坏***注.Laminar flow 层流(流体力学名词)Turbulent flow 扰流(流体力学名词)Alcohol 酒精Acetone 丙酮Particle 微粒子Dust 灰尘Gowning room 换衣间***注.Raised floor (grating floor) 高架地板***注.Air shower 气浴室***注.Prohibit 禁止Clean suit (bunny suit, dust-free garment) 无尘衣***注.Glove 手套Hairnet 网帽Hood 头罩Mask 口罩Clean shoes (dust-free shoes, boots) 无尘鞋3. Factory Automation (工厂自动化专有名词)英文专有名词中文说明Vehicle 运输工具或载具AGV (Automatic Guided Vehicle) 自动搬运车MGV (Manual Guided Vehicle) 人力搬运车Clean lifter 天井传送车LIM (Linear Induction Motor) Carrier 线性感应马达传送载具OHS (Overhead Shuttle) 天车或称轨道车Stocker (clean depot) 存放Cassette(架子)的暂存区Battery 电池Bay 作业区Bumper 保险杠Charger 充电器Controller 控制器Conveyor 输送带Crane 吊车(在Stocker内)FFU (Fan Filter Unit) 风扇过滤器Host 主机I/O (Input / Output) 输入/输出Inter-bay 作业区和作业区之间Intra-bay 作业区之内IR (Infra-Red) 红外线IRIF(Infra-Red InterFace) 红外线界面Load 进料Unload 卸货Magnetic tape AGV路径所使用的磁条POSEIDON 海神生产操作系统Retrieve 【计算机】检索,撷取(数据)RTM (Rotary Transfer Machine) 旋转传送机SCARA arm AGV之传送手臂Reset 重新设定Transportation 传输*注.OPI(Operation POSEIDON Instruction)海神生产操作系统专有名词介绍英文专有名词中文说明Recipe 程序,制程参数Stock out 将Cassette取出Request 请求,要求Transfer 传送,运送Instruction 命令,指令Select 选择Cancel 取消Operation 作业,操作Support 支援Process 制程Start 开始Comp. Completion的缩写,意指完成Batch 批量Lot 指生产在线的在制品或产品,简称「货」ID (Identity) 识别码(如Lot ID or Chip ID)Sheet 片(Array区玻璃基版计数单位)***注. Chip 片(Cell区玻璃计数单位)***注. Inspection 检验Defect 缺陷Production 生产Hold 留置在当站制程(如有品质问题时)Release 将hold住的货放行,释出Equipment 设备(简称为EQP)Tool 工具,机台WIP (Work In Process) 在制品(制程在制品)Maintenance 维修保养Cassette 装在制品的架子***注.Empty 空的Reserve 预约Report 报告Scrap 报废Rework 重工Log on 登帐Log off 除帐Note 批注5. Array段制程专有名词介绍英文专有名词中文说明Material 材料Metal 金属Target 靶MoW (Moly-tungsten) 钨化钼Mo (Molybdenum) 钼ITO (Indium Tin Oxide) 铟锡氧化物Al (Aluminum) 铝AlNd(Aluminum and Neodymium Alloy) 铝和钕的合金以上皆为溅镀机金属靶的材料之一Reticle or Mask 光罩Detergent (LH-300) 界面活性剂的一种(清洗机用来清洗玻璃表面用LH-300为供货商型号)LAL-50 含NH4F与HF,为清洗机用来清洗玻璃表面氧化层的化学溶液O3(Ozone)臭氧,主要为各制程用来清除有机物的污染或残留NBA (1-butyl Acetate) 乙酸正丁酯,主要用来清洗旋转涂布光阻时残留在玻璃边缘的光阻液Resist or Photo Resist 光阻(简称PR)HMDS Hexamethyldisilazane的简写,为一种化学中间体,用以增加光阻涂布时对芯片表面之附着力AC-1 带静电防止剂(ESD-Preventer),在上光阻机内使用,防止静电产生,破坏玻璃组件TMAH (供货商型号为KTM-25) Tetra-Methyl Ammonium Hydroxide的简写,为厂内所使用之显影液Oxalic Acid (H2C2O4) 草酸,湿蚀刻机中用来蚀刻5PEP中的a-ITO膜DHF 成份为49%氢氟酸HF,主要为湿蚀刻机中用来蚀刻7PEP中的SiNx膜ITO-Etchant 成份中含盐酸HCl及硝酸HNO3,主要用来蚀刻7PEP中的Poly-ITOBHF 成份中含氟化铵NH4F及HF,主要用来蚀刻7PEP中的SiONAl-Etchant 成份中含乙酸CH3COOH、磷酸H3PO4及硝酸HNO3,主要用来蚀刻Mo/Al/Mo的沈积层IPA 异丙醇Isopropyl Alcohol的简称,主要用来作为设备擦拭液,在去光阻制程中亦用来清除玻璃基板上的有机残留物(如光阻或去光阻液)N-300 去光阻液,N-300为厂商型号,成份为单乙醇铵与单丁醚的混合物(Process) Gas (制程)气体…目前大多数种类的气体,多为提供CVD,Sputter及干蚀刻电浆源之用SiH4硅甲烷……制程气体(泄漏有爆炸危险)NH3氨……制程气体N2O 笑气……制程气体PH3磷化氢……制程气体N2氮气……制程气体,常用为破真空Vent或吹干的媒介H2氢气……制程气体NF3氟化氮……制程气体,常用为清除CVD反应室壁沈积硅Si媒介Kr 氪气……制程气体,用来轰击溅镀机上的金属靶Ar 氩气……制程气体,用来轰击溅镀机上的金属靶或常用为加热设备的热传媒介O2常用来作电浆的基本组成,BCl3氯化硼……制程气体,在干蚀刻中用以作为蚀刻AlNd的电浆源SF6氟化硫……制程气体,常用的主要干蚀刻电浆源以为提供蚀刻主原料氟的来源He 氦气……制程气体,混合在其它制程气体中,共同形成电浆源,使电浆组成分布均匀Cl2氯气……制程气体HCl 氯化氢……制程气体,蚀刻n+时的电浆源之一CF4四氟化碳……制程气体,常用的主要干蚀刻电浆源以为提供蚀刻主原料氟的来源Equipment 机台(仪器)Vender 厂商Cleaner 清洗机***注.CVD (Chemical Vapor Deposition) 化学气相沉积***注. Sputter 溅镀机***注. Coater 上光阻机***注.Pre-bake 预烘***注.Stepper 步进式曝光机***注. Exposure 曝光Backside-Exposure 背面曝光Titler 刻号机,厂内部分的显影机具有此功能,将玻璃基板的Chip ID, Glass ID及Veri-Code曝出,以为人员及机台办认之用Edge Remover 简称ER,指在旋转涂布光阻后,用NBA洗净残留在玻璃边缘的光阻Edge Exposure 边缘曝光,指在显影前将玻璃基板边缘光阻较厚的部分再曝光,以防曝光量不足,造成光阻在显影后残留Developer 显影机***注.Hard bake 硬烤***注.Etcher 蚀刻机Wet Etch 湿蚀刻***注.Dry Etch 干蚀刻***注.Plasma 电浆***注.RIE (Reactive ion etching) 反应性离子蚀刻***注. PE (Plasma Etch) 电浆蚀刻机***注ICP (Inductive Coupled Plasma) 电感偶式电浆蚀刻机***注Stripper 去光阻机***注O3 Asher 为去光阻机的模块之一,用来去除制程的有机残留**注Tester 测试机Anneal 回火***注.AMSR (Sheet Resistance) 沈积膜的电阻值测试设备ATOS (Open/Short Tester) 断短路测试机ATTG (TEG Tester or TFT DeviceMeasurement)TFT的电性测试设备ATAR (Array Tester) Array Defect的测试设备ALSR (Laser Repair) 雷射修补机ANNI (Anneal Oven) 回火设备AMGI (Particle Counter) 微粒子侦测,侦测玻璃表面微粒子数目及大小分布AMOR; AMKL (Pattern Inspection) 图案或线路检验设备; 主要在检视沈积膜后、曝光后、蚀刻后及去光阻后表面的线路图案检查(前者简称Orbo, 后者简称KLA)AMSP (Surface Profiler) 表面轮廓检查机,测量线路图案的高低分布状况,亦可藉此求得蚀刻速率(简称KLA-Tencor)AMOV (CD/Overlay) 量测设备用以测量关键线宽CD, 及藉量测Box重迭状况来检视Stepper的精度**注AMSH (Microscope) 高倍显微镜,主要在检视曝光后、蚀刻后及去光阻后表面的线路图案检查(简称Olympus)AMEL; AMOT (Film Thickness) 膜厚量测仪(前者简称Sopra, 后者简称Nano)AMVI (Visual Inspection) 目视检查机,Array段制程的最后出货前检查CJ 指高压水洗MS 指超音波水洗Conveyor 传送Spin 旋转(如Spin Dryer:高速旋干器)Chamber 反应室(如CVD, Sputter或干蚀刻)Load Lock简称LL 闭锁,为大气进入真空或真空进入大气的媒介Heat 加热Cool 冷却Probe (测试机的)探针Process 制程Spec 制程的品质标准Pin-Hole 针点小凹陷PEP (photo engraving process) 完成一次黄光制程叫做一个PEPMI 第一次沈积的(阐极)金属膜如MoWMII 第二次沈积的(源极和汲极)金属膜如MoAlMo a-Si (amorphous silicon) 非结晶硅,TFT沈积层之一n+ (或n+a-Si) 掺杂磷的非结晶硅,TFT沈积层之一SiON (应写为SiOxNy 因O,N的比例不一定)氮氧化硅,TFT沈积层之一SiNx (x为Si与N的比例) 氮化硅,TFT沈积层之一Cleaning 清洗(Cleaner的动作称为Cleaning)Brush 清洗机所使用之软刷DI; DI water; Deionized Water 去离子水UPW 超纯水Vent 破真空,真空环境下的玻璃送至LoadLock闭锁时,通入氮气平衡压力,以防止剧烈的气压变化造成破片Purge 用CF或NF系列的气体通入CVD清除器壁累积的硅Rinse 水洗Veri-Code 光学办认码**注Vacuum 真空Deposition 沉积Wet etching 湿蚀刻Dry etching 干蚀刻Plasma 电浆RIE (Reactive Ion Etching) 反应式离子蚀刻机**注ICP (Inductive Coupled Plasma) 电感偶式电浆蚀刻机**注PE (Plasma Etch) 电浆蚀刻机**注Uniformity 均匀性(类似(大-小)/平均值的概念)Etching Rate 蚀刻速率(=蚀刻厚度/时间)Anneal 回火Laser repair 雷射修补Inspection 检视Pre-bake 预烤Coating 上光阻Exposure 曝光Develop 显影Alignment 对准CD (critical dimension) 关键尺寸(线路关键处的线宽或间距)Overlay 重迭Cure 烘烤Bake 烘烤6.Cell段制程专有名词介绍英文专有名词中文说明Material 材料PI (polyimide) 聚亚醯胺CF (Color Filter) 彩色滤光片Detergent 洗剂γ- Butyrolactoneγ-丁内酯, 简称γ液, 用于清除APR版上的PIRubbing cloth 配向布, 为棉类材质, 用于rubbing机台, 使基板产生配向, 使用前须先挑除杂质, 称为挑布Seal 框胶, 功能在于围住液晶不外漏及避免水气进入, 使用前须先调配, 称为调胶Spacer 或MP(Micro Pearl) 间隙球, 功能在于维持CF与TFT两块玻璃间之间隙距离PS (Photo Spacer) 功能与普通的Spacer相同, 一般用于大尺寸产品, 且可得到较好的cell gapTransfer 或Conductive Paste 或Ag paste 银胶或称导电胶UV sealant UV 胶, 用于两块玻璃基板组合时假固定用Polyfron 均压纸, 基板压合时使用, 用于分隔基板, 可使压力均匀分布以及减少杂质所造成的损害LC (Liquid Crystal) 液晶Polarizer 偏光膜Equipment 设备CDA (Compressed Dry Air) 压缩高压干燥空气DIW, DI water 去离子水, 纯水Control box 电源控制箱Valve 阀门, 控制阀Breaker 电源开关, 继电器Chamber 槽Clean booth 洁净工作台Process 制程FEOL (Front End of Line) cell 前段BEOL (Back End of Line) cell 后段Scribe (1st scribe, 2nd scribe) 切割(有一次切割及二次切割) Break (1st break, 2nd break) 裂片(有一次裂片及二次裂片) Grind 研磨PI Print , PI coater PI 印刷PI Prebake PI 预烤PI Post-bake PI 后烤Rubbing 配向Seal Pattern, Seal dispense 框胶涂布Spacer Sprayer Spacer 散布Jig Press Jig 压合Alignment 对位, 对准Cure 键结硬化Seal Pre-bake Seal 预烤Vacuum Anneal 真空回火Injection 注射(LC-Injection:注入液晶) End Seal 封口胶Polarizer Lamination 偏光片贴合7.Module(模块)段制程专有名词英文专有名词中文说明Cell cell 完成后的在制品(货) Backlight 背光板Bezel 外框Driver IC 驱动集成电路Soldering 焊接Assembly 组装Aging 老化Packing 包装Chip 芯片Tape 胶带Screw 螺丝FPC (Flexible Printed Cable) 可挠性印刷线路PCB (Printed Circuit Board) 印刷电路板TAB (Tape Automated Bonding) 卷带式晶粒接合OLB (Outer Lead Bonding) 外引脚接合ILB (Inner Lead Bonding) 内引脚接合COG (Chip on Glass) 芯片接合在玻璃ACF (Anisotropic Conductive Film) 异方性导电膜7. 日常使用的英文名词英文专有名词中文说明Organization:ProcessManufacturing Department ManagerSection Manager SupervisorLine LeaderOperator 组织方面:制程制造部经理协理(公司中称为主任)管理者(公司中称为Coordinator)组长(公司中称为Keyman)作业员Sick Leave 病假Accident Leave 事假Take a Day off 休息一天AWOL(absence without official leave) 旷工(没有请假)Performance Evaluation:PoorFairGoodExcellentOutstandingImprove 绩效考核:表现差的普通表现好的优秀卓越有待改进Quality Control:品管:IQC=Incoming Quality Control IPQC=In-Process Quality Control OQC=Outgoing Quality Control M.R.B.=Material Review Board WaiveC.A.R.=Correct Action Report F.M.A.=Failure Mode Analysis MO=Misoperation 进料品管制程中质量管理出料品管特采改善措施报告操作错误(人为失误)。

职称中英文对照

职称中英文对照

计算机硬件Computer, Hardware高级硬件工程师 Senior Hardware Engineer硬件工程师 Hardware Engineer其他Others计算机软件Computer, Software高级软件工程师 Senior Software Engineer软件工程师 Software EngineerERP技术/开发应用 ERP Application R&D/Implementation 系统集成工程师 System Integration Engineer系统分析员 System Analyst系统工程师 System Engineer系统架构设计师 System Architecture Design数据库工程师/管理员 Database Engineer/Administrator 计算机辅助设计工程师Computer Aided Design Engineer其他Others互联网开发及应用Internet互联网软件开发工程师 Internet/E—Commerce Software Engineer多媒体/游戏开发工程师 Multimedia/Game Development Engineer网站营运经理/主管 Web Operations Manager/Supervisor 网络工程师 Network Engineer网站架构设计师 Web Architecture Design网站维护工程师 Web Maintenance Engineer系统管理员/网络管理员 System Manager/Webmaster网站策划Web Producer网站编辑 Web Editor网页设计/制作/美工 Web Designer/Production/Creative 网络信息安全工程师 Information Security Engineer智能大厦/综合布线 Intelligent Building/Structure Cabling其他OthersIT-管理IT—Management首席技术执行官CTO/首席信息官CIO Chief Technology Officer CTO/Chief Information Officer CIO技术总监/经理 Technical Director/Manager信息技术经理/主管 IT Manager/Supervisor信息技术专员 IT Specialist项目总监Project Director项目经理 Project Manager项目主管 Project Supervisor项目执行/协调人员 Project Specialist / Coordinator其他Others IT-品管、技术支持及其它IT-QA, Technical Support。

信息管理与信息系统专业 英语

信息管理与信息系统专业 英语

信息管理与信息系统专业英语英文回答:Information Management and Information Systems.Information management is the collection, storage, organization, and dissemination of information. It is a critical function for any organization, as it allows for the effective use of information to make decisions and achieve goals. Information systems are the tools and technologies used to manage information. They can range from simple spreadsheets to complex enterprise resource planning (ERP) systems.The field of information management and information systems is constantly evolving, as new technologies emerge and new ways of working are developed. This has led to a growing demand for professionals with the skills and knowledge to manage information effectively.Skills and Knowledge Required for Information Management and Information Systems Professionals.Professionals in the field of information management and information systems typically need to have the following skills and knowledge:A strong understanding of information management concepts and principles.Proficiency in a variety of information systems software applications.Excellent communication and interpersonal skills.The ability to work independently and as part of a team.A strong work ethic and a commitment to excellence.Career Opportunities for Information Management and Information Systems Professionals.There are a wide range of career opportunitiesavailable for professionals with skills and knowledge in information management and information systems. Some of the most common job titles include:Information manager.Information systems manager.Database administrator.Systems analyst.Business analyst.Project manager.Professionals in these roles can work in a variety of industries, including healthcare, finance, manufacturing, and government.Education and Training for Information Management and Information Systems Professionals.There are a variety of educational and training programs available for professionals who want to work inthe field of information management and information systems. Some of the most common programs include:Bachelor's degree in information management or information systems.Master's degree in information management orinformation systems.MBA with a concentration in information management or information systems.Certificate programs in information management or information systems.Professional Development for Information Management and Information Systems Professionals.In order to stay up-to-date on the latest trends and technologies in the field of information management and information systems, professionals should pursue ongoing professional development. This can be done through a variety of activities, such as:Attending conferences and workshops.Reading industry publications.Taking online courses.Participating in online forums and discussion groups.中文回答:信息管理与信息系统专业。

常用职称职位英文翻译

常用职称职位英文翻译

常用职称职位英文翻译董事长Board Chairman总经理General Manager副总经理Vice General Manager总经理秘书Secretary总经理助理General Manager's Assistant市场营销部经理Manager of Marketing Department 销售部经理Sales Manager餐饮部经理Food and Bererage Manager客房部经理Housekeeper康乐部经理Recreation Dept Manager财务部经理Financial Controller人事部经理Personnel Manager工程部经理Chief Engineer保安部经理Chief Security Officer办公室主任Director of Executive Office大堂副理Asst Manager物资经理Logistic & Purchasing Dept.Manager会计Accountant销售工程师Sales Engineer生产经理Production Dept.Manager销售工程师Sales Engineer工会主席Labour Union chairman操作工Operator库管员Warehouse Keeper技术工程师Technicial Engineer销售一部经理Sales Dept.Manager接待员Receiptionalist配料员Operator保洁员Purifier人事经理助理HR Assistant炊事员Canteen Worker会计Accountant质保经理QC Dept.Manager机械师Machinist工程主管Facilities Supervisor采购员Buyer车间班长Group Leader叉车司机Driver机修工Operator采购主管Purchase Manage综合管理部Colligation and Management Dep财务部部长Finance Dep.Minister市场部部长助理Market Dep.Minister's assistant生产部部长助理Produce Dep. Ministarls assistant研发工程师Develop Engineer业务主办Operation Direct计划员Programmer更夫Bellman技术服务部经理Technical Service Dept.Manager物资内勤Secretary技术服务工程师Technician Service Engineer销售二部经理Sales Dept.Manager车间主管Production Supervisor内勤Secretary出纳Cashier检验员hecker市场部经理Marketing Dept.Manager区域销售经理Regional Sales ManagerIT工程师IT Engineer研磨工Operator司机Driver清扫工Purifier人力资源部经理Human Resources Manager文员Clerk财务经理Finance Dept.Manager技术发展部经理Technical Development Dept.Manager电工Electrician送货员Deliveryman挤压工Operator行政经理Administrative Dep.Manager运输协调员Traffic Coordinator副总工程师Vice - Chief Engineer综合管理部部长Colligation and Management Dep.Minister网络主管Network Manage综合管理部总务Colligation and Management Dep.General Affair 市场部部长Market Dep.Minister市场部项目总理Market Dep.Item Manager质保部Quantity Engineer工艺员Engineer调度员Dispatcher秘书Secretary工作职能中英文对照(做名片时很有用)作者:惟一日期:2006-06-27字体大小: 小中大计算机/互联网/通讯Technology/Internet高级硬件工程师Senior Hardware Engineer硬件工程师Hardware EngineerIC设计/应用工程师IC Design/Application Engineer电子/电路工程师Electronics/Circuit Engineer系统分析员System Analyst高级软件工程师Senior Software Engineer软件工程师Software Engineer互联网软件开发工程师Internet/E-Commerce Software Engineer多媒体/游戏开发工程师Multimedia Software/Game Development Engineer 系统工程师System EngineerERP技术/应用顾问ERP Technical/Application Consultant数据库工程师/管理员Database Engineer/Administrator网站营运经理/主管Web Operations Manager/Supervisor网络工程师Network Engineer系统管理员/网络管理员System Manager/Webmaster网页设计/制作Web Designer/Production网站策划/编辑Web Planner/Editor信息技术经理/主管IT Manager/Supervisor信息技术专员IT Specialist通信技术工程师Communications Engineer数据安全工程师Information Security Engineer系统集成/支持System Integration/Support智能大厦/综合布线Intelligent Building/Structure Cabling首席技术执行官CTO/VP Engineering技术总监/经理Technical Director/Manager项目经理Project Manager项目主管Project Supervisor项目执行/协调人员Project Specialist / Coordinator技术支持经理Technical Support Manager技术支持工程师Technical Support Engineer品质经理QA Manager软件测试工程师Software QA Engineer硬件测试工程师Hardware QA Engineer测试员Test Engineer技术文员/助理Technical Clerk/Assistant其他Other销售Sales销售总监Sales Director销售经理Sales Manager销售主管Sales Supervisor商务经理Business Manager渠道/分销经理Channel/Distribution Manager渠道/分销主管Channel/Distribution Supervisor客户经理Sales Account Manager销售行政经理/主管Sales Admin. Manager/Supervisor区域销售经理Regional Sales Manager店长/卖场经理Store Manager销售代表Sales Representative / Executive电话销售Telesales经销商Distributor医药代表Pharmaceutical Sales Representative销售工程师Sales Engineer售前/售后技术服务经理Technical Service Manager售前/售后技术服务主管Technical Service Supervisor售前/售后技术服务工程师Technical Service Engineer售后/客服经理(非技术)Customer Service Manager售后/客服主管(非技术)Customer Service Supervisor售后/客服专员(非技术)Customer Service Executive销售助理Sales Assistant / Trainee商务专员/助理Business Executive/Assistant其他Others市场/公关/广告Marketing/PR/Advertising市场/广告总监Marketing/Advertising Director/VP市场/营销经理Marketing Manager市场/营销主管Marketing Supervisor市场/营销专员Marketing Executive/Communication市场助理Marketing Assistant / Trainee产品/品牌经理Product/Brand Manager产品/品牌主管Product/Brand Supervisor产品/品牌专员Product/Brand Executive市场通路经理/主管Trade Marketing Manager/Supervisor促销经理Promotion Manager促销主管/督导Promotion Supervisor促销员/导购Promotions Specialist市场分析/调研人员Market Analyst/ Research Analyst公关/会务经理Public Relations Manager公关/会务主管Public Relations 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General Information

General Information

Ceramic DC Disc, RFI and Safety CapacitorsVishay Cera-MiteIN ACCORDANCE WITH IEC RECOMMENDATIONS CERAMIC CAPACITORS ARE SUBDIVIDED INTO TWO CLASSES:•CERAMIC CLASS 1 or low-K capacitors are mainly manufactured of titanium dioxide or magnesium silicate •CERAMIC CLASS 2 or high-K capacitors contain mostly alkaline titanatesMAIN FEATURESCLASS 1CLASS 2APPLICATION For temperature compensation of frequencydiscriminating circuits and filters, coupling anddecoupling in high-frequency circuits where lowlosses and narrow capacitance tolerances aredemanded. As RFI and safety capacitors.As coupling and decoupling capacitors for suchapplication where higher losses and a reducedcapacitance stability are required.As RFI and safety capacitorsPROPERTIES Temperature Dependence Capacitance High stability of capacitance. Low dissipationfactor up to higher frequencies. Definedtemperature coefficient of capacitance, positiveor negative, linear and reversible. High insulationresistance. No voltage dependence. Highlong-term stability of electrical values.High capacitance values with small dimensions.Non-linear dependence of capacitance ontemperature.DC VOLTAGECAPACITANCE DEPENDENCENone Increasing with εDISSIPATION FACTOR TAN δmax. 0.0015 (T ypical) max. 0.035 (Typical) INSULATION RESISTANCE min. 10 000 MΩ to 200 000 MΩmin. 10 000 MΩ to 200 000 MΩCAPACITANCE TOLERANCES < 10 pF:± 0.25 pF, ± 0.5 pF, ± 1 pF≥ 10 pF:± 2 %, ± 5 %, ± 10 %, ± 20 %± 10 %, ± 20 %, (+ 50 - 20) %, (+ 80 - 20) %RATED VOLTAGE100 V DC up to 15 kV DC100 V DC up to 15 kV DCS TANDARDS AND SPECIFICATIONSGENERAL STANDARDSIEC 60062Marking codes for resistors and capacitorsIEC 60068Basic environmental testing procedures Special Standards for Ceramic CapacitorsEN 130600 and IEC 60384-8Fixed capacitors of ceramic dielectric, class 1 EN 130700 and IEC 60384-9Fixed capacitors of ceramic dielectric, class 2 Standards for Special Application PurposesUL 1414UL 1283CSA C22.2EN 132400IEC 60384-14.2IEC 60065RFI - and safety capacitorsCeramic DC Disc, RFI and Safety CapacitorsVishay Cera-MiteNote1.Climatic test conditions: Temperature 20 °C to 25 °C2.Relative humidity 50 % to 70 %Note1.E6 values preferredMEASURING AND TESTING CONDITIONSCAPACITANCE AND DISSIPATION FACTORClass 1C ≥ 1000 pF: 1 kHz, 1 to 5 V RMS C < 1000 pF: 1 MHz, 1 to 5 V RMS Class 2C ≥ 100 pF: 1 kHz, 1.0 ± 0.2 V RMS C < 100 pF: 1 MHz, 1.0 ± 0.2 V RMS INSULATION RESISTANCERated voltage< 100 V:≥ 100 V to < 500 V:≥ 500 V: measuring voltage = (10 ± 1) V measuring voltage = (100 ± 15) V measuring voltage = (500 ± 50) V 60 ± 5 sDIELECTRIC STRENGTHRated voltage≤ 500 V: > 500 V:T est time:Test voltage = 2.5 • UR Test voltage = 1.5 • UR 2 sNOMINAL VALUE SERIES ACCORDING TO IEC 60063E6 (± 20 % TOLERANCE)E12 (± 10 % TOLERANCE)E24 (± 5 % TOLERANCE)100100100110120120130150150150160180180200220220220240270270300330330330360390390430470470470510560560620680680680750820820910Vishay Cera-MiteCeramic DC Disc, RFI and Safety Capacitorsthe two digits are the significant figures of the figures of the capacitance'Divider' - Number of zeros following the Decimal point of the Number of zeros followingBasis is the Capacitance given in µFCAPACITANCE CODING SYSTEM acc. to IEC 60062CAPACITANCE VALUECODE CAPACITANCE VALUEp330.33 pF 3p3 3.3 pF 33p 33 pF 330p 330 pF n33330 pF (0.33 nF)3n33300 pF (3.3 nF)33n 33 000 pF (33 nF)330n 330 000 pF (330 nF)µ330.33 µF 3µ33.3 µFCAPACITANCE TOLERANCECODE< 10 pF: in pF≥ 10 pF: in %C ± 0.25-D ± 0.5-J ± 5K ± 10M ± 20Y + 50/- 20Z + 80/- 20P+ 100/- 0CAPACITANCE CODING SYSTEM acc. to CERA-MITE STANDARDCODE CAPACITANCE VALUE DIVIDER Q 68 e.g. 0.000068= 68 pF'Quad'= Q T 68 0.00068= 680 pF 'Triple'= T D 68 0.0068= 6800 pF 'Double'= D S 680.068= 68 000 pF'Single'= SCERAMIC DIELECTRIC CODING SYSTEMCLASS 1CLASS 2INDUSTRY CODEEIA CODE CODE LETTEREIA CODECODE LETTERP100C0K ----X5F B NP0C0G A X7R C N750U2J U X7S C N1000M3K V Y5U E N1500P3K W Y5V F N2000R3L ----Z5UEN2200R3L X N2500R3M ----N2800--------N3300S3N Y N4700T3MZCeramic DC Disc, RFI and Safety Capacitors Vishay Cera-Mite TEMPERATURE CHARACTERISTIC OF CAPACITANCE FOR CLASS 1 AND CLASS 2Vishay Cera-MiteCeramic DC Disc, RFI and Safety CapacitorsCLASS 1 CERAMIC TYPETEMPERATURE COEFFICIENT OF THE CAPACITANCEΔC = Capacitance changeα = Temperature coefficient in 10-6/°C ΔJ = Temperature change in °CVOLTAGE DEPENDENCE OF CAPACITANCENoneFREQUENCY DEPENDENCE OF CAPACITANCEsee page 8DISSIPATION FACTOR- For values greater than 50 pF: see data sheet.- For lower values the dissipation factor is calculated according to the type of ceramic (rated temperature coefficient) underconsideration of the capacitance acc. to EN 130600.- The dissipation factor as well as the measuring method to be agreed between manufacturer and user for values lower than 5 pF.Ceramic DC Disc, RFI and Safety CapacitorsVishay Cera-MiteCLASS 2 CERAMIC TYPECAPACITANCE CHANGE VS. TEMPERATURE (TYPICAL)CERAMIC DIELECTRIC: X5F AND X5RCERAMIC DIELECTRIC: Y5R AND Y5SCERAMIC DIELECTRIC: X7R AND X7SCERAMIC DIELECTRIC: Y5U AND Y5VCERAMIC DIELECTRIC: Z5UVishay Cera-MiteCeramic DC Disc, RFI and Safety CapacitorsCLASS 2 CERAMIC TYPECAPACITANCE CHANGE VS. FREQUENCY (TYPICAL)CAPACITANCE DEGREASE VS. DC VOLTAGE BIAS (TYPICAL)Ceramic DC Disc, RFI and Safety Capacitors Vishay Cera-MiteCAPACITANCE “AGING” OF CERAMIC CAPACITORSFollowing the final heat treatment, all class 2 ceramic capacitors reduce their capacitance value. According to logarithmic law, this is due to their special crystalline construction. This change is called “aging”. If the capacitors are heat treated (for example when soldering), the capacitance increases again to a higher value deaging, and the aging process begins again.Note:The level of this deaging is dependent on the temperature and the duration of the heat; an almost complete deaging is achieved at the upper category temperature in one hour. These conditions also form the basis for reference measurements when testing. The capacitance changeper time decade (aging constant) differs for the various types of ceramic, but typical values can be taken from the table below.CERAMIC MATERIAL X5F X7R X7S Y5U Y5V Z5U AGING KONSTANT k- 1.5 %- 2.0 %- 3.0 %- 2.0 %- 2.5 %- 2.8 %k = 100 • (C t1 - C t2)C t1 • log10 (t1/t2)C t2 = C t1 • (1 - k/100 • log10 [t1/t2])t1, t2 = measuring time point (h)C t1, C t2 = capacitance values for the times t1, t2 k = aging constant (%)REFERENCE MEASUREMENTDue to aging, it is necessary to quote an age for reference measurements which can be related to the capacitance with fixed tolerance. According to EN 130700, this time period is 1000 hours.If the shelf-life of the capacitor is known, the capacitance for t = 1000 h can be calculated with the aging constant.In order to avoid the influence of aging, it is important to deage the capacitors before stress-testing. The following procedure is adopted (see also EN 130700):Deaging at upper category temperature, 1 hourStorage for 24 hours at normal climate temperatureInitial measurementStressDeaging at upper category temperature, 1 hourStorage for 24 hours at normal climate temperatureFinal measurementVishay Cera-MiteCeramic DC Disc, RFI and Safety CapacitorsCOMPONENT CLIMATIC CATEGORYThe large number of possible combinations of tests and severities may be reduced by the selection of a few standard groupings according to IEC 60068-1First set: Two digits denoting the minimum ambient temperature of operation (Cold test)Second set: Three digits denoting the maximum ambient temperature (Dry heat test)Third set: Two digits denoting the number of days of thedamp heat steady state test (Ca)Category examples acc. T o IEC 60068-125/085/0425/085/2140/085/2155/125/2155/125/5665- 65 °C 55- 55 °C 40- 40 °C 25- 25 °C 10- 10 °C 000 °C 05+ 5 °C 155+ 155 °C 125+ 125 °C 110+ 110 °C 90+ 90 °C 85+ 85 °C 80+ 80 °C 75+ 75 °C 70+ 70 °C 65+ 65 °C 60+ 60 °C 55+ 55 °C5656 Days 2121 Days 1010 Days 04 4 Days00The component is not required to be exposed to damp heatCeramic DC Disc, RFI and Safety Capacitors Vishay Cera-MiteSTORAGEThe capacitors must not be stored in a corrosive atmosphere, where sulphide or chloride gas, acid, alkali or salt are present. Exposure of the components to moisture, should be avoided. The solderability of the leads is not affected by storage of up to 24 months (temperature + 10 °C to + 40 °C, relative humidity up to 60 % RH). Class 2 Ceramic Dielectric Capacitors are also subject to aging see previous page.SOLDERINGSOLDERING SPECIFICATIONSSoldering test for capacitors with wire leads: (according to IEC 60068-2-20, solder bath method)SOLDERABILITY RESISTANCE TO SOLDERING HEAT Soldering T emperature(235 ± 5) °C(260 ± 5) °CSoldering Duration(2 ± 0.5) s(10 ± 1) sDistance from Component Body≥ 2 mm≥ 5 mmSOLDERING RECOMMENDATIONSSoldering of the component should be achieved using a silver-bearing SN type solder. Ceramic capacitors are very sensitive to rapid changes in temperature (Thermal shock) therefore the solder heat resistance specification (see above table) should not sensitive to be exceeded. Subjecting the capacitor to excessive heating may result in thermal shocks that can crack the ceramic body. Similarly, excessive heating can cause the internal solder junction to melt.CLEANINGThe components should be cleaned immediately following the soldering operation with vapor degreasers.SOLVENT RESISTANCEThe coating and marking of the capacitors are resistant to the following test method:IEC 60068-2-45 (Method XA)MOUNTINGWe do not recommend modifying the lead terminals, e.g. bending or cropping. This action could break the coating or crack the ceramic insert. If however, the lead must be modified in any way, we recommend support of the lead with a clamping fixture next to the coating.CAUTIONWhen Sinusiodal or ripple voltage applied to DC Ceramic Disc Capacitors, be sure to maintain the Peak-to-peak value or the peak value of the sum of both AC + DC within the Rated voltage Limits. When the voltage is started to apply the circuit or it is stopped applying, an irregular voltage may be generated because of resonance effects. Be sure to use the capacitor during this transient periode within it’s rated voltage.When rectangular or Pulse Wave Voltage is applied to DC Ceramic Disc Capacitors,the Self-heating generated by the capacitor is higher than the sinusoidal application with the same frequency.The allowable voltage rating for the rectangular or pulse wave corresponds approximately with the allowable voltage of sinusoidal wave with the double fundamental frequency. The allowable voltage varies,depending on the voltage and the waveform. Diagrams of the limiting values are available for each Capacitor Series on request. The surface Temperature of the capacitors must not exceed the upper limit of it’s Rated Operating Temperature. During operation in a High frequency circuit or a Pulse signal circuit, the capacitor itself generate heat due to dielectric losses. Applied voltage should be the load such as self-generated heat within 20 °C on the condition of environmental temperature 25 °C.Note, that excessive heat may lead to deterioration of the capacitor’s characteristics and reliability.AOQ - AVERAGE OUTGOING QUALITYIn the final control all lots (100 % lot-by-lot) are tested on Sample Base.All possible defects are classified into Minor and Major Defects.They are defined as follows:MAJOR DEFECTSDefects from witch is to assume or known that they create dangerous situations for HumansDefects which may create considerable property damageDefects from which is to expect that the pertain equipment will fail.Defects which create essential reduction of the usability for the planned application.Lots with Major Defects always will be rejected.It is essential: Target = Zero DefectMINOR DEFECTSDefects which don’t create essential reduce the usability for the planned application.Defects which affect the usability, function or assembly of the pertain equipment slightlydefects which increase substantial the internal (Vishay’s) rejects.Minor Defects shall not exceed the acceptance of the required sampling plan otherwise the lot will be rejected.The AOQ is calculated on a quarterly basis for mechanical and electrical defects.All lots with major defects and all lots with more minor defects as accepted in the relevant sampling plan will be rejected. That will be set to the ratio with the number of tested parts.Actual the AOQ isAOQ mechanical:< 50 ppmAOQ electrical: < 150 ppmThese values are the End of Line Quality. The customer may expect lower AOQ levels.RELIABILITYBecause of controlled manufacturing processes the quality of the ceramic capacitors is maintained on a high level.The reliability data will be determined from the results of electrical endurance tests according the relevant national or international specification.The endurance tests are performed on the upper category temperature and with applied load according the relevant specification. The applied voltage is up to 1.5 times of rated voltage. It depends on the specification.As failure criterion is fixed:Short circuit during test, 2 times the required limits according the relevant specification.Base for reliability calculation is the international specification IEC 61709The failure rate of our ceramic capacitors isCD Capacitors Class 1 Ceramic Dielectric: 100 fitCD Capacitors Class 2 Ceramic Dielectric: 500 fitAC Line Rated Capacitors: 5 fitDetailed information is available on request.PRODUCTION FLOWCHARTWIRE LEAD OPTIONSRadial leaded capacitors may be ordered with various wire lead options by adding appropriate suffix code to the catalog part number.Example: 564R30GAD22 GJ (Suffix Code) specifies:#20 AWG wire; LS = 0.375"; Inside Crimp; Short Cut Lead Length.Notes• Popular wire lead form options are described above; consult factory for other available forms.• Practical consideration may limit wire options depending on capacitor size - verify special requirements with factory.100 V DC TO 1000 V DC CAPACITORS SUFFIX CODES FOR VARIOUS LEAD SPACING (LS) AND WIRE SIZE (AWG) VOLT CAPACITORSWire form Description Fig.Lead Length 0.200" (5.0)0.250" (6.3)0.300" (7.5)0.375" (9.5)0.400" (10.0)#22AWG #24AWG #22AWG #24AWG #22AWG #22AWG #22AWG Straight wire Fig.11Long 'LL'MA PA UB UA BK BJ BL Steeple wire Fig.12Long 'LL'Cut 'CL'CL PT CJ CH CA CK CB NB PK NK NG NC ND NE Step wire Fig.14Long 'LL'Cut 'CL'VD VK VB PQ VF VG VH PG PU PR PL PH PS PJ Inside crimpFig.15Long 'LL'Cut 'CL'JQ JT JC JF JL JS JP JAJDJKJYJRJJJB2 kV DC TO3 kV DC CAPACITORS SUFFIX CODES FOR VARIOUS LEAD SPACING (LS) AND WIRE SIZE (AWG) VOLT CAPACITORS Wire form Description Fig.Lead Length 0.250" (6.3)0.300" (7.5)0.375" (9.5)0.400" (10.0)0.500" (12.7)0.750" (19)#20AWG #22AWG #20AWG #22AWG #20AWG #22AWG #20AWG #22AWG #20AWG #22AWG #20AWG Straight wire Fig.11Long 'LL'AA UB AE BK AJ BJ AD BL AM BM AB Inline wire Fig.13Long 'LL'Cut 'CL'XW XY UC UE UG UJ UL UM UQ US -XX XZ DU UF UH UK UN UP UR UT -Inside crimpFig.15Long 'LL'Cut 'CL'GB JC GC JL GN JS GD JP GF JN -GEJKJHJRGJJJJGJBGMJM-WIRE INFORMATION#20 AWG 0.032" (0.81) Copper Wire #22 AWG 0.025" (0.64) Copper Wire#24 AWG0.020" (0.51) Copper Clad Steel WireLEAD LENGTH INFORMATION• Standard Long Lead “LL” Length = 1.250" (32 mm) minimum• Cut Lead “CL” Length may be user specified; if unspecified, Vishay Cera-Mite supplies 0.187" (4.8 mm) EIA standard • Cut Lead Lengths are measured from bottom of wire seating plane (wire support point on circuit board)• Minimum Cut Lead Lengths “CL min” are contained in wire figures 12 thru 15• Cut Lead Length Tolerance: + 0.031"/- 0.015" (0.8/- 0.4 mm)STANDARD LEAD CONFIGURATIONSStrai g ht Fi g. 11 Steeple Fi g. 12 Inline Fi g. 13Step Low Volta g e Fi g. 14 Inside Crimp Fi g. 15PACKAGING OPTIONSParts will be BULK packaged in cartons or plastic bags unless optional packaging is specified.Consult factory for other packaging options such as TAPED and REELED or AMMOPACK.TAPE AND REEL OPTIONSRadial leaded parts may be ordered with Tape and Reel packaging by adding appropriate suffix code to part number. Example: 562R5GAS10QR (Suffix C ode) specifies: #22 AWG wire; Straight Lead Form; LS = 5 mm; Tape and Reel per EIA 468B.TAPE AND REEL PACKAGINGPART NUMBER SUFFIXTAPE AND REEL SUFFIX CODES FOR VARIOUS WIRE FORMS & SIZEST & R FigureLS(mm)Max. DiscDiameter(in) (mm)T & RStandardFig.16Straight wireFigure 11Steeple wireFigure 12Inline wireFigure 13Step wireFigure 14Inside crimp wireFigure 15#20AWG#22AWG#24AWG#22AWG#24AWG#20AWG#22AWG#22AWG#24AWG#20AWG#22AWG#24AWGA 5.00.49012.4C-M QG QA QB TK WK XA ZA VC VQ RA RE RB EIA QH QR QD TR TX XB XN VZ VE RC RR LAB7.50.53013.5C-M QP QK---XG ZC--RP RK-EIA QS QF---XH XR--RX RL-C10.50.70818.0C-M QQ QM---XJ XS--RQ RM-EIA AP QX---XK XT--RJ RU-D7.50.70818.0C-M QW QN---XL XU--RW RN-EIA AQ QE---XM XV--RV RD-WIRE INFORMATION#20 AWG0.032" (0.81) Copper Wire#22 AWG0.025" (0.64) Copper Wire#24 AWG0.020" (0.51) Copper Clad Steel WireTAPE AND REEL OPTIONSFi g . AFi g . BFi g . CFi g . DLead Space LS 5.0 mm Pitch0.5" (12.7 mm)Available Series Disc Diameter 12.4 mm or less Series100 V DC to 3 kV DCLead Space LS 7.5 mm Pitch(15.0 mm)Available Series Disc Diameter 13.5 mm or less Series100 V DC to 3 kV DCand AC Rated CapsLead Space LS 10.0 mm Pitch1.0" (25.4 mm)Available Series Disc Diameter 18.0 mm or less Series100 kV DC to 6 kV DCand AC Rated CapsLead Space LS 7.5 mm Pitch30.0 mmAvailable Series Disc Diameter 18.0 mm or less Series100 V DC to 6 kV DC and AC Rated CapsPACKAGING OPTIONSReel PackagingAmmo PackagingTAPE AND REEL OPTIONSITEMCODE Fi g . A Fi g . B Fi g . C Fi g . D Dimensions (mm)Pitch of component P 12.715.025.430.0Pitch of sprocket hole P 012.7 ± 0.315.0 ± 0.312.7 ± 0.415.0 ± 0.4Lead spacingF 5.0 + 0.8/- 0.27.5 ± 1.010.0 ± 1.07.5 ± 1.0Length from hole center to component center P 2 6.35 ± 1.37.5 ± 1.5-7.5 ± 1.5 Length from hole center to component lead P 1 3.85 ± 0.73.75 ± 1.07.7 ± 1.5 3.75 ± 1.0Disc DiameterD See individual product specificationDeviation along tape, left/right ΔS0 ± 1.30 ±2.0Component alignment Δh 0 ±1.0Carrier Tape width W 18.0 ± 0.5Position of sprocket holeW 19.0 ± 0.5Height to component body (Lead Fig. 11)H 20.0 + 1.5/- 1.020.0 + 1.5/- 1.018.0 + 2.0/- 1.020.0 + 1.5/- 1.0Height to seating plane (Lead Fig. 12 to 15)H 16.0 ± 0.5Protrusion Length P 3 3.0 max.Diameter of Sprocket hole D 0 4.0 ± 0.2Total Tape thicknesst 10.6 ± 0.3Total thickness, Tape & Lead wire t 2 1.5 max.Portion to cutL 11.0 max.Hold down Tape width W 011.5 max.Hold down Tape positionW 21.5 ± 1.5Consult us for other packaging options,such as ammo pack cartons.ORDERING CODE CATALOGUE PART NUMBER DC CAPACITORS564R5GA D68VJSERIES RATED VOLTAGE CERAMIC CODE CAPACITANCE VALUE WIRE/TAPEOPTIONS DIVIDER VALUE561R All Class 1 Dielectricand 1000 V DC Precisionand 1 kV DC Low DF 562R General purpose100 V DC thru 1000 V DCClass 2 Dielectric565R Dual Parallel Discs564R High voltage2 kV DC thru 7.5 kV DC 615R High voltage10 kV DC thru 15 kV DC R' indicates anRoHS compliant component none= 100 V1= 1000 V2 = 2000 V3= 3000 V5 = 500 V10 = 1 kV DC20 = 2 kV DC30 = 3 kV DC60= 6 kV DC75 = 7.5 kV DC100 = 10 kV DC150 = 15 kV DCSee on theindividualDatasheets'Quad'= Q'T riple'= T'Double'= D'Single'= SNumber of zeros following theDecimal point of the Capacitancevaluee.g. 0.000068= 68 pF0.00068= 680 pF0.0068= 6800 pF0.068= 68 000 pFBasis is the Capacitancegiven in µFthe two digitsare thesignificantfigures of theCapacitance(Optional)ORDERING CODE CATALOGUE PART NUMBER AC LINE RATED CAPACITORS 440L S10AM-RSERIESCAPACITANCE VALUE WIRE/TAPEOPTIONSROHS DIVIDER VALUE440L X1/Y1Safety Approved 30LV X1/Y2Safety Approved 30LVSX1/Y2Safety Approved 25Y X1/Y2Safety Approved 125L X1/Y4Safety Approved 20VL X2EMI Filter'Quad'= Q'Triple'= T'Double'= D'Single'= SNumber of zeros following the Decimal point ofthe Capacitance valuee.g. 0.00001= 10 pF0.0001= 100 pF0.001= 1000 pF0.01= 10 000 pFBasis is the Capacitancegiven in µFthe two digitsare the significantfigures of theCapacitance(Optional)'R' indicatesan RoHScompliantcomponentCUSTOM DESIGNSVishay Cera-Mite’s most popular 100 Volt to 15 000 Volt values and constructions are shown as standard part numbers in this catalog. Many other values and lead styles are available. Other capacitance ranges and styles are available on request. Various wire lead forms and packaging options are detailed on the previous pages. Part numbers for custom capacitors consist of an 18-character designator assigned by our application engineering group. Vishay Cera-Mite will provide a certified outline drawing and complete part number covering custom options specified. Customer approval of the outline is usually requested to guarantee satisfaction. All performance characteristics shown in this catalog apply to the options unless otherwise stated on the outline drawing.Notes• Wire leaded DC rated, disc capacitors are marked with a code identifying the manufacturer, capacitance, tolerance, voltage, and type of ceramic.• Specially types such as AC rated are marked as described on the individual datasheets.ORDERING CODE CUSTOM PART PART NUMBER564R Y5PJR303EE680K SERIESTEMP.CHARACT.WIRE LEAD AND PACKAGING CODE RATED VOLTAGE COATINGMATERIAL BODY SIZECAPACITANCE VALUE TOL.561R All Class 1 Dielectricand 1000 V DC Precision and 1 kV DC Low DF 562R General purpose100 V DC thru 1000 V DC Class 2 Dielectric 565R Dual Parallel Discs 564R High voltage2 kV DC thru 7.5 kV DC 615R High voltage10 kV DC thru 15 kV DC R' indicates anRoHS compliant componentsee T able on page 4 and on individual datasheetssee T able on pages 14 to 16First two digits are significant numbers Last digit specifies the numbers of zeros (Voltage given in 'Volts')E = Epoxy A =PhenolicDisc diameter code LetterFirst two digits are significant numbers Last digit specifies thenumbersofzeros For values below 10 pF ,use Letter 'R'For values decimal point e.g. 2R2 =2.2 pFsee Table on page 4MARKING INFORMATIONCMY5R (OR C)01M1 KV MANUFACTURER IDENTIFICATION TEMPERATURE COEFFICIENT CAPACITANCECAPACITANCE TOLERANCE VOLTAGE“Cera-Mite ®” or the identification “CM”See chart on page 4Expresssed in pF or µF .Example: 680 = 680 pF 0047 = 0.0047 µFC = ± 0.25 pFD = ± 0.5 pF J = ± 5 %K = ± 10 %M = ± 20 %P = + 100 % to - 0 %Y = - 20 % to + 50 %Z = - 20 % to + 80 %Rating normally DC volts. AC voltage rating markedAC or ~;If no voltage is marked,part is 500 V DC。

英语日常用语——技术资料和图纸

英语日常用语——技术资料和图纸

英语日常用语——技术资料和图纸TECHNICAL DOCUMENTS AND DRAWINGS1 We completed this task according to the drawing number SD-76.我们按照图号SD-76的图纸完成了这项工作。

2 According to the technical standard (norm, rules of operation), the erection (alignment, testing )work is now getting on .安装(校准、试验)工作正在根据技术标准(规范、操作规程)进行。

3 This is a plot plan (general layout ,general arrangement, detail ,section, erection ,flow sheet, PID, assembly, civil, electrical, control and instrumentation, projection, piping, isometric ) drawing.这是一张平面布置(总平面、总布置、细部、剖面、安装、流程、带仪表控制点的管道、装配、土建、电气、自控和仪表、投影、配管、空视)图。

4 That is a general (front, rear, side, left, right, top, vertical, bottom, elevation, auxiliary, cut-away, birds eye) view.那是全视(前视、后视、侧视、左视、右视、顶视、俯视、底视、立视、辅助、内部剖视、鸟瞰)图。

5 How many drawings are there in the set?这套图纸有几张?6 Is this a copy for reproduction? 这是一份底图吗?7 What is the edition of this drawing? 这张图纸是第几版?8 Is this drawing in effect? 这张图纸有效吗?9 Is this a revised edition? 这是修订版吗?10 Will it to be revised yet? 这图还要修订吗?11 Are there some modifications (revisions) on the drawing?这张图上有些修改(修正)吗?12 The information to be placed in each title block of a drawing include: drawing number, drawing size, scale, weight, sheet number and number ofsheets, drawing title and signatures of persons preparing, checking and approving the drawing.每张图纸的图标栏内容包括:图号、图纸尺寸、比例、重量、张号和张数、图标、以及图纸的制图、校对、批准人的签字。

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1.1. General rulesAll exhibitors must abide by the site regulations including the closing hours of the exhibition. Exhibitors must not enter the exhibition halls before 12 noon on 18 September 2011.Please refer to the show schedule in the General Information, for the exhibition opening and closing time. Electricity will be connected and disconnected accordingly.We strongly advise against bringing children under the age of 12 to the show.The use of any means of transport (bikes, scooters, etc.) in the exhibition halls is strictly forbid-den.1.2. PricesAll prices specified in the exhibitor manual exclude VAT at 19.6 %.1.3. Fire regulationsSmoking inside the exhibition halls is strictly prohibited except in the designated areas.1.4. InsuranceThe exhibitors are insured by the organiser for civil liability, which means that they are insured for any damage or loss caused to third parties. The organiser accepts no financial or legal lia-bility for any form of risks involving the exhibitor’s personal belongings and exhibits. Exhibitors must take out their own insurance policy if they wish to insure against these risks.In the event of damage or loss, the exhibitor must inform the insurance company thereof within three days from the date on which they become aware of such damage or loss.1.5. Photography, video shooting and sound recordingNo photography, video recording, or sound recording is allowed in the exhibition halls.All forms of video or sound recordings of exhibition samples or booths (including sketches) are prohibited.In the event of breaches of the above, Messe Frankfurt France S.A.S. shall be entitled to confis-cate sketches as well as exposed or recorded material.The exhibitor is, however, entitled to make video and sound recordings or drawings of his own stand and exhibits during the fair.The exhibitor permits the organiser to take photos of any stand. The photos must be taken by the organiser himself or by the official fair photographer and will be used as information for visitors and for the promotional purposes of the Messe Frankfurt Group.1.1. General rulesAll exhibitors must abide by the site regulations including the closing hours of the exhibition.Exhibitors must not enter the exhibition halls before 12 noon on 18 September 2011.Please refer to the show schedule in the General Information, for the exhibition opening and closing time. Elec-tricity will be connected and disconnected accordingly.We strongly advise against bringing children under the age of 12 to the show.The use of any means of transport (bikes, scooters, etc.) in the exhibition halls is strictlyforbidden.1.2. PricesAll prices specified in the exhibitor manual exclude VAT at 19.6 %.1.3. Fire regulationsSmoking inside the exhibition halls is strictly prohibited except in the designated areas.1.4. InsuranceThe exhibitors are insured by the organiser for civil liability, which means that they are insured for any damage or loss caused to third parties. The organiser accepts no financial or legalliability for any form of risks involving the exhibitor’s personal belongings and exhibits.Exhibitors must take out their own insurance policy if they wish to insure against these risks.In the event of damage or loss, the exhibitor must inform the insurance company thereof within three days from the date on which they become aware of such damage or loss.1.5. Photography, video shooting and sound recordingNo photography, video recording, or sound recording is allowed in the exhibition halls.All forms of video or sound recordings of exhibition samples or booths (including sketches) are prohibited.In the event of breaches of the above, Messe Frankfurt France S.A.S. shall be entitled toconfiscate sketches as well as exposed or recorded material.The exhibitor is, however, entitled to make video and sound recordings or drawings of his own stand and exhi-bits during the fair.The exhibitor permits the organiser to take photos of any stand. The photos must be taken by the organiser himself or by the official fair photographer and will be used as information for visitors and for the promotional purposes of the Messe Frankfurt Group.11.6. Delivery and dismantlingThe organiser shall not accept any responsibility for the delivery and dispatching of exhibition material.Carriers may enter the exhibition halls between 7 am and 12 noon on 18 September 2011 (no entry for carriers after 12 noon) and between 8 am and 9:30 am on 19 September 2011. From 20 to 22 September 2011, deliveries may be made between 8:30 am and 9:30 am.On the last day of the exhibition, carriers will not be permitted to enter the exhibition halls before 4:30 pm. Removal of exhibition material starts at 4:30 pm on 22 September 2011. The organiser will not be liable for any loss or damage to exhibition or booth material left behind at the exhibition venue.During the dismantling, all objects left on the exhibition-site and not claimed from the Organiser’s Office before 6:30 pm will be destroyed one week after the end of the exhibition. Within that period, all objects claimed at the office of Messe Frankfurt France S.A.S. will be sent back to the exhibitor at his expense and risk.On the last day of the exhibition, exhibitors are not permitted to start dismantling their booth before 4:30 pm. Exit forms will not be delivered.1.7. NoiseThe noise level arising from presentations in the booth, etc. should be maintained below 30 dB. In the event of complaints by other exhibitors, the organiser has the right to prohibit any activities that cause noise or disturbance.1.8. CateringRegarding safety and health rules and regulations, exhibitors can only use the caterer approved by the operator of the exhibition venue.No other food supplier will be authorised to deliver any food to the exhibition ground. Elior is the approved caterer on-site.1.9. Exhibitors listingThe organiser will in no case be held liable for any omissions, reproduction errors, misprints or other which may occur in the lists of exhibitors that the organiser may be led to publish.As of 7 June 201122. Technical Information2.1. SecurityPlease note the following security regulations for booth decoration:• Materials used for curtains and hangings must be fire resistant, non-inflammable or hardly inflammable.• Elements for decoration must be made of materials that are either fire resistant or non-inflam-mable or must be treated to ensure they are fire-proof.• There are no requirements for exhibits in terms of fire reaction.2.2. Booth design*All booths will be designed by the official contractor.The exhibitors can close up to 50% maximum of the front side of their booth.Exhibitors with a corner booth will be allowed to close off the side of the booth for free, adding low panels:• 100 W x 160 H cm for fabrics and denim booth construction.• 100 W x 100 H cm for apparel sourcing construction.2.3. Booth equipment*No item included in the standard equipment can be exchanged for different items. Even if the exhibitor does not need all of those items, no refund will be given.2.4. Additional booth equipmentExhibitors wishing to add additional equipment (e.g. chairs or rods) and those who need addi-tional booth equipment for their modified booth layout (see § 2.6.) should refer to the Messe Frankfurt France exhibitor website, section «Your equipment».Please note the following deadlines:• Until 28 July 2011, additional booth equipment orders will be accepted.• From 29 July to 19 August 2011, a 30% charge will be added to the additional equipment invoice.• From 20 August 2011, onward, no further orders for additional booth equipment will be accepted.Cancellation of orders will only be accepted until 19 August 2011.Please note that changes made or additional equipment added to the booth layout by hand will not be considered. All orders must be made on the Messe Frankfurt France exhibitor website.Important: Requests for refunds for non-delivered equipment must be made immediately to the Technical Desk. Claims will not be accepted after the Technical Desk has closed (Monday 19 September 2011 at 11 am).2.5. On-site ordersThose exhibitors who miss the deadline of the 19 August 2011 will be able to order additional booth equipment on-site at the Additional Orders Desk on 18 September 2011 from 12 noon to 7 pm, and on 19 September 2011 from 8 am to 11 am.However, a 30% extra charge will be invoiced when placing the order.Important: cancellation of orders will not be accepted on-site.2.6. Booth alterations*Exhibitors wishing to remove or change the location of any standard facility (rod, chair, etc.) in their booth should contact the organiser before the following dates:• Any notifications concerning booth layout changes will be accepted until the 19 August 2011. • From 20 August 2011 onward, no more layouts will be sent to exhibitors and no requests for booth alteration can be considered.Only 2 booth layouts will be sent to you free of charge. Each additional layout: 80€ excl. tax. Only the booth structure (e.g. lights, rods or panels) is affected by the changes to the booth sketch. Therefore, furniture will not be shown on the sketch.Reminder: High booth panels cannot be removed:• 2.50 m H for fabrics booth construction.• 2.25 m H for denim and apparel sourcing booth construction.Please note that those rules marked with * do not apply to raw space exhibitors.2.7. Booth decorationAll decorative items must be placed inside the booth.Supports, decoration or swatches affixed to the low partition walls (1.60 m H for fabrics and denim booth construction, 1.00 m H for apparel sourcing booth construction) may not extend beyond 10 cm outside the booth.Exhibitors can only use their partition wall areas for their decoration.No decoration must be attached to the ceiling element.The pillars outside the booth cannot be used for decoration.No decoration will be permitted in the aisle and on the fascia and sign boards.Reminder: posters, other decorative items and traces of scotch tape must be removed after the fair.2.8. DamagesThe organiser guarantees that the booth panels will be delivered in good condition. Exhibitors are therefore liable for any damage caused to their booth structure. However, if damage is ascertained on arrival, this must immediately be reported to the Technical Desk.No nails, screws or staples may be driven into the wall elements. The use of self-adhesive posters adhered over the entire surface of the wall panels, foam adhesive tape and silver foil is prohibited.To avoid damage to the booth structure from decoration work, you are strongly advised to use the adhesive tape exclusively that will be handed out free of charge on the move-in day at the Welcome Desk. The use of any other adhesive tape can damage the booth panels.4。

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