30150-33中文资料
浙江皇马化工产品介绍

有机硅用聚醚组成:双烷基封端聚醚类型:非离子性能应用:本产品为双烷基封端聚醚,封端基团可以为甲基、乙酰基、丁基、烯丙基,封端率高,反响活性好,根据分子量、EO、PO比例不同有多种规格。
烯丙基活性基团可以与含氢硅油进展硅氢化反响,合成一系列聚醚改性聚硅氧烷化合物;聚醚末端羟基活泼氢被烷基取代后,进展硅氢化反响时消除了羟基与硅氢键的反响,可以显著提高聚醚改性硅油的质量。
可以用作聚氨酯泡沫匀泡剂、消泡剂、涂料流平剂、织物整理剂、水溶性润滑剂等,广泛应用于聚氨酯、造纸、制药、化纤等行业。
包装:200kg铁桶或塑料桶。
贮运:按无毒、非危险品品贮运,贮存于阴凉、枯燥、通风处,贮存期一年。
组成:烯丙醇聚醚类型:非离子技术指标:注:可根据客户实际需求提供其它相关特殊产品。
性能应用:本品属非离子外表活性剂,溶于水、乙醇和有机溶剂。
带有活性基团,能与活性氢或双键反响,通常被用于改性硅油接枝,提高硅油亲水性,可做涂料的流平剂、润湿剂、扩展剂、消泡剂或者用于聚氨酯匀泡剂。
在农药方面可做铺X剂、消泡剂。
包装:200Kg塑料桶、铁桶或IBC包装。
贮运:按无毒、非危险品储运,储存于阴凉枯燥通风处,密封包装,保质期一年。
一年后,复检合格仍可使用。
组成:丁醇聚醚类型:非离子技术指标:*表示粘度在50℃下测试值注:根据客户实际需求提供其它相关特殊产品。
性能应用:本品属非离子外表活性剂,HMP-514R、HMP-515R、HML-305B不溶于水,其它易溶于水、乙醇和有机溶剂。
具有优良的乳化性,消泡性和润滑性。
在涂料方面可做消泡剂、改性硅油后可做流平剂。
在润滑油方面可做润滑剂。
在金属清洗方面可做脱脂脱油乳化剂等。
包装:200Kg塑料桶、铁桶或IBC包装贮运:按无毒、非危险品储运,储存于阴凉枯燥通风处,密封包装,保质期一年。
一年后,复检合格,仍可使用。
印染助剂原料组成:蓖麻油聚氧乙烯醚类型:非离子〔1〕1%水溶液〔2〕10%活性物在25%BDG溶液中〔3〕1%活性物在5%NaCl溶液性能应用: HMEL系列产品根据EO加成数的不同有多种规格,该系列产品在水中呈分散状或易溶于水、脂肪酸或其它有机溶剂中,具有优良的润滑、乳化、扩散、增容性能,作乳化剂,用于各种植、动、矿物油的乳化。
DIN 53505-2000中文

附录 A
硬度试验方法的适用范围 邵尔 A 依照 DIN 53505 IRHD,低硬度范围 依照 DIN 53519-1,5mm 直径球 IRHD,一般硬度范围 依照 DIN 53519-1,2.5mm 直径球 邵尔 D 依照 DIN 53505 球印硬度 依照 DIN EN ISO 2039-1 软←硬度→硬 图 A.1 :硬度试验方法的适用范围 (各方法之间不存在线性关系)
附录 A 中给出了不同的硬度试验方法的适用范围的概述。
第 2 到 5 页继续
标准编号 DIN 53505:2000-08
第2页 DIN 53505:2000-08
2 引用标准
本标准包括了,通过指定日期或未指定日期引用的来自其它出版物的规定。这些参考标准在本文的相应地方被引 用,并且出版物的名称在下面列出。对于指定日期的引用,只有当经过修改或修订而包括在内时,这些出版物的任何 改动或修订才适用于本标准。对于未指定日期的引用,所涉及到的出版物的最新版本适用。
din51220材料试验机的一般技术要求包括检定及校准橡胶的拉伸应力应变特性的测定采用标准试样进行软橡胶的压痕硬度irhd的测定采用小试样进行软橡胶的压痕硬度irhd的测定通过测量橡胶的硬度进行结晶效应的测定橡胶的低温特性的测定原则及试验方法用来自弹性体及塑料上的试验实例进行随机样本的统计评估塑料及硬橡胶借助于硬度计邵尔硬度测定压痕硬度iso868
德国标准
邵尔 A 及邵尔 D 橡胶硬度试验
2000 年 8 月
ICS 83.060
本标准,连同 DIN EN ISO 868 1998 年 1 月版本,取代了 1987 年 6 月版本。
与国际标准化组织(ISO)所发布的标准中的习惯用法一样,自始至终采用逗号作为十进制标记。
实力专业用品-实力专业用品-实力专业用品说明书

7
DIN Adaptors
DIN Adaptor for RGS SSRs
Installation Instructions
Ordering Key
RGS1DIN
DIN rail adaptor module for mounting the RGS series on DIN rail.
Suffix H8 added to SSR part no. refers to factory mounted DIN clip. Conditions apply. Please ask your Sales representative for further details.
Ordering Key
Ordering Key
RGN - TERMRES
RGN-TERMRES termination resistor to be fitted on the last RG..N on the NRG bus chain. Packing qty. 4 pc.
Specifications are subject to change without notice (30.07.2019)
3-pin socket to mate with RM1E..V.. 4-pin socket to mate with RA2A..C 4-pin socket to mate with RA2A..C
5-pin socket to mate with RA..S 4-pin socket to mate with RKD2..C 2-pin socket to mate with RK2..C
Material Thermal resistance
派克液压中文样本

液压注意 – 用户方责任 错误或不当地选择或使用本样本或有关资料阐述的产品,可能会导致人生伤亡及财产损失! 本样本以及其它由派克汉尼汾公司及其子公司、销售公司与授权分销商所提供的资料,仅供用户专业技术人员在对产品和系统的选型进行深入调查考证时参考。
用户应全面分析自身设备的运行工况、适用的工业标准,并仔细查阅现行的样本,以详细地了解产品及系统的相关信息,通过自己的分析和试验,对产品及系统的独立的最终选择负责,确保能满足自身设备的所有性能、耐用性、维修型、安全性以及预警功能等要求。
对于派克或其子公司或授权分销商而言,应负责按用户提供的技术资料和规范,选择和提供适当的元件或系统,而用户则应负责确定这些技术资料和规范对其设备的所有运行工况和能合理预见的使用工况是否充分和准确。
目录目录页次概述 1 订货代号 2 技术参数 4 变量控制器 5 控制选项 “C”, 压力限定(恒压)变量控制器 5 控制选项 “L”, 负载传感及压力限定变量控制器 6 控制选项 “AM”, 带遥控口的标准型先导式压力限定变量控制器 7 控制选项 “AN”, 带ISO 4401 NG06先导阀安装界面的先导式压力限定变量控制器 8 控制选项 “AE”及“AF”, 带电磁比例调节的先导式压力限定变量控制器 9 控制选项 “AMT”, “ALT”及“LOT”, 带最高压力限定的扭矩限定(恒功率)变量控制器 10 P1性能特性 11典型流量特性 11 典型总效率特性 13 典型轴输入功率特性 15 典型噪声特性 18 典型轴承寿命 20 PD性能特性 22典型流量特性 22 典型总效率特性 24 典型轴输入功率特性 26 典型噪声特性 29 典型轴承寿命 31 安装尺寸 33 P1/PD 018 33 P1/PD 028 36 P1/PD 045 40 P1/PD 060 44 P1/PD 075 49 P1/PD 100 54 P1/PD 140 59 变量控制器安装尺寸 65 可提供的扩展的液压产品 75派克汉尼汾备记派克汉尼汾概述简介, 优点派克汉尼汾简介 • 开式回路用轴向柱塞式变量液压泵 • 中压,连续工作压力280 bar • 高驱动转速型,适用于行走机械; 低噪声型,适用于工业应用 • 静音及高效的控制效能 优点 • 总结构尺寸紧凑 • 低噪声• 流量脉动小,进一步降低噪声• 采用弹性密封,不使用密封垫,从而避免外泄漏的产生• 总效率高,功耗小,减小发热• 采用带无泄漏调节装的简单变量控制器 • 符合SAE 及ISO 标准的安装法兰及油口 • 采用圆锥滚柱轴承,使用寿命长 • 全功率后驱动能力• 后部或侧面油口配置可选• 泄油口的配置对水平安装及驱动轴向上垂直安装均适用• 带有最大及最小排量调节选项 • 具有壳体至吸口单向阀选项,可延长轴封寿命 • 使用、维修方便 脉动容腔技术下列图表所示为侧向油口配置P1/PD 18, 28及45泵采用 “脉动容腔” 技术的效果,脉动容腔可降低泵出口处的压力脉动幅值40-60%,这样,无需增加成本来加装噪声缓冲元件,便可大大降低液压系统的整体噪声,P1系列 PD 系列出口压力p / bar平均压力脉动 / b a rP1 045出口压力脉动2600 rpm 无脉动容腔2600 rpm 带脉动容腔订货代号18 ml, 28 ml, 45ml派克汉尼汾P 类型 01 驱动轴 转向R 5密封材料E 油口配置0 壳体-吸口 单向阀 0 排量调节 018 排量 S 安装法兰 及油口 S 轴封 M 应用范围A 设计系列0 通轴驱动选项 C0控制选项0附加控制选项 00油漆 00修改代号系列 P D * 仅适用于045排量, “S”型安装法兰及油口00 标准型, 无修改M2 按要求修改 代号修改代号 * 适用于028及045排量 ** 仅适用于045排量 代号设计系列 A 现行设计系列5 氟碳橡胶 (FPM) 代号密封材料 A 82-2 SAE A M33x2 M27x2 BSPP 1/4”, 3/8” 101-2 SAE B M42x2 M27x2 BSPP 1/4”, 1/2” 101-2SAE B M48x2M33x2Ø38/25DN51/25BSPP 1/4”, 1/2”B ISO M33x2 M27x2 BSPP 1/4”,3/8”ISO M42x2 M27x2 BSPP 1/4”, 1/2” ISO M48x2M33x2Ø38/25DN51/25BSPP 1/4”, 1/2”代号 018排量 028排量 045排量 安装法兰及油口 安装 法兰 螺纹 油口 辅助 油口 安装 法兰 螺纹 油口 辅助 油口 安装法兰螺纹油口法兰 油口辅助 油口 S 82-2 SAE A SAE 16/12 SAE 4/6 101-2 SAE B SAE 20/12 SAE 4/8 101-2SAE B SAE 24/16Ø38/2561系列SAE 4/10M ISO M33x2 M27x2 M12x1.5 M16x1.5 ISO M42x2 M27x2 M12x1.5 M22x1.5 ISO M48x2M33x2Ø38/25DN51/25M12x1.5M22x1.5代号 018驱动轴 028驱动轴 045驱动轴 01 SAE A 11T 花键SAE B-B 15T 花键 SAE B-B 15T 花键02 SAE 19-1平键Ø0.75” SAE B-B 平键Ø1” SAE B-B 平键Ø1” 08— SAE B 13T 花键 SAE B 13T 花键 04 ISO/DIN 平键, Ø20ISO/DIN 平键, Ø25ISO/DIN 平键, Ø25 06 SAE A 9T 花键— — PD 工业液压用 代号 系列P1 行走机械用 代号 排量 018 18 ml/rev (1.10 in 3/rev) 028 28 ml/rev (1.71 in 3/rev) 045 45 ml/rev (2.75 in 3/rev) 代号 类型 P 开式回路用变量柱塞泵 U*通用 代号应用范围 S 工业液压 (PD) M 行走机械 (P1) R 顺时针 (右转)L 逆时针 (左转)代号 转向 代号 轴封 S 单唇轴封 * 并不具有控制功能,仅在运输时予以防护,详情见第7页的控制说明。
T103规格说明

连续和逻辑控制 连续策略是由从丰富的模拟和逻辑 功能块库调出的功能块连接而成 的。
除了固定功能块外,还有一些支持 在标准模板内采用 ST(结构化文 本)编写用户算法的 ACTION 块。 它们特别适合于实现模件以表示现 场设备如阀门、泵和马达,这些均 可利用
控制系统是以 T103 控制器及 T303 监控单元两个主要部件为基础建立 的。
T103 单元控制器是对成功的 T100 和 T102 控制单元的改进,实现所有 I/O 及连续和逻辑控制,同时具有 强大的顺控功能。
T303 单元监控器在一些工厂子系 统要求策略协调时用来辅助 T103, 此结构直接映射至批量控制 SP88 标准草案中的控制活动模型。
T7540 机 柜 标准机柜满足最具共性的需求,从 安装一台 T103 单元的墙挂式机箱 到安装 4 台 T103 单元和可选 T303 单元监控器的带单独端子区的落地 式机柜。
如果需要一个就地操作员接口,一 台 T1500 盘装工作站或一组 T640 回路处理器可安装于前门上。
所有种类均已预组,且都包括标准 端子单元,系统和变送器供电。供 电及配电部件作为置于安装板上的 分部件被提供,包括用于故障监视 的 LED/继电器单元以及一个用于 RAM 备份的电池/充电器组件。
CPU 选 项 有两种不同的 CPU: T920-标准 CPU;通过前面板端口 (DB9 连结器)支持 MODBUS T921 -具大容量文件系统的高性 能 CPU;通过底板上的专用
插口(RJ45 连结器)支持 MODBUS
CPU 冗 余 只需插入第二个 CPU 和 PSU 即可 完成 CPU冗余的双重化运行可用于 连续控制(无 MODBUS 或顺控选 项)。两个 CPU 以主/备用配置, 其间的高速数据链路提供对控制数 据库的跟踪,以便主 CPU 故障时, 备用单元的切换无振荡。
批准浙江盈华消防检测 公司计量认证产品 参数

GA503-2004《建筑消防设施检测技术规程》第4.8条
59
贮瓶间
60
集流管
61
控制方式
62
选择阀
63
管道
64
喷嘴
65
防护区安全要求
66
启动方式
67
模拟自动启动试验
68
模拟喷气试验
证书号:2004110821L批准日期:2009年 4月 27日 有效期止:2009年8月1日
GA503-2004《建筑消防设施检测技术规程》第4.3条
GB50303-2002《建筑电气工程施工质量验收规范》
2
2
系统设置
3
3
消控室的控制及显示功能
4
4
报警控制器功能
5
5
消火栓显示功能
6
6
自喷显示功能
7
7
管网气体灭火系统显示功能
8
8
火灾报警后对防排烟设施控制功能
9
9
火灾确认后控制功能
10
10
消防控制室
GB50261-1996《自动喷水灭火系统施工及验收规范》(2005年版)第7.2.3条及5.3.2.3条
JGJ/J16-1992 《民用建筑电气设计规范》第11.5.8条GA503-2004《建筑消防设施检测技术规程》第4.4条,第4.5条
GB50084-2001《自动喷水灭火系统设计规范》第10.2.3 10.2.4 10.3.210.3.3条
GB50116-1998《火灾自动报警系统设计规范》第6.3.8条
GB50045-1995《高层民用建筑设计防火规范》(2001年版)第5.4.4条、第6.3.3条、第9.1节
8002301FA中文资料

Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-7603701VEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 5962-7603701VFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC 5962-7603701VFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC 7603701EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 7603701EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 7603701FA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC 7603701FA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC 76038012A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 76038012A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 7603801EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 7603801EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 7603801FA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC 7603801FA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC 8002301EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 8002301EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 8002301FA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC 8002301FA ACTIVE CFP W161TBD Call TI Level-NC-NC-NCJM38510/07906BEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCJM38510/07906BEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCJM38510/07906BFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NCJM38510/07906BFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NCJM38510/30906B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/30906B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/30906BEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCJM38510/30906BEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCJM38510/30906BFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NCJM38510/30906BFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SN54LS257BJ ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54LS257BJ ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54LS258BJ ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54LS258BJ ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54S257J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54S257J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54S258J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54S258J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN74LS257BD ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS257BD ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS257BDE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS257BDE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LS257BDR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS257BDR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS257BDRE4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS257BDRE4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS257BN ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS257BN ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS257BN3OBSOLETE PDIP N16TBD Call TI Call TISN74LS257BN3OBSOLETE PDIP N16TBD Call TI Call TISN74LS257BNE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS257BNE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS257BNSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS257BNSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS257BNSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS257BNSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS258BD ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS258BD ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS258BDE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS258BDE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS258BDR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS258BDR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS258BDRE4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS258BDRE4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS258BN ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS258BN ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS258BN3OBSOLETE PDIP N16TBD Call TI Call TISN74LS258BN3OBSOLETE PDIP N16TBD Call TI Call TISN74LS258BNE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS258BNE4ACTIVE PDIP N1625Pb-Free CU NIPDAU Level-NC-NC-NCOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)(RoHS)SN74LS258BNSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS258BNSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS258BNSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS258BNSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S257D ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S257D ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S257DE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S257DE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S257N ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S257N ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S257N3OBSOLETE PDIP N16TBD Call TI Call TISN74S257N3OBSOLETE PDIP N16TBD Call TI Call TISN74S257NE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S257NE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S258DR OBSOLETE SOIC D16TBD Call TI Call TISN74S258DR OBSOLETE SOIC D16TBD Call TI Call TISN74S258N OBSOLETE PDIP N16TBD Call TI Call TISN74S258N OBSOLETE PDIP N16TBD Call TI Call TISN74S258N3OBSOLETE PDIP N16TBD Call TI Call TISN74S258N3OBSOLETE PDIP N16TBD Call TI Call TISNJ54LS257BFK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS257BFK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS257BJ ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54LS257BJ ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54LS257BW ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54LS257BW ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54LS258BFK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS258BFK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS258BJ ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54LS258BJ ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54LS258BW ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54LS258BW ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54S257FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S257FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SNJ54S257J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54S257J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54S257W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54S257W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54S258FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S258FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S258J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54S258J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54S258W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54S258W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
包装种类代码(cn005)[整理版]
![包装种类代码(cn005)[整理版]](https://img.taocdn.com/s3/m/ac0503f85ff7ba0d4a7302768e9951e79b8969ff.png)
字母码数字码中文名英文名AE 42或43 按扭式喷雾器瓶AerosolAM 31 未加保护玻璃瓶Ampoule, non-protectedAP 31 加保护玻璃瓶Ampoule, protectedAT 42或43 喷雾器AtomizerBA 44或45 桶BarrelBB 91 细绳BobbinBC 29 带有瓶架的板条箱Bottle crate, bottlerackBD 16 板BoardBE 61-65 捆扎BundleBF 42或43 未加保护球形瓶Ballon, non-protectedBG 62-64 袋BagBH 61-65 线束BunchBI 21或25 料箱BinBJ 51 吊桶BucketBK 27 筐BasketBL 65 已压缩包Bale, compressedBN 65 未压缩包Bale, non-compressedBO 32或33 未加保护圆柱形瓶Bottle, non-protected, cyl-indrica BP 42或43 加保护球形瓶Ballon, protectedBQ 32或33 加保护圆柱形瓶Bottle, protected cylindricaBR 16 棒BarBS 42或43 未加保护球形瓶Bottle, non-protected, bulbousBT 13 纸卷BoltBU 44或45 大桶ButtBU 散装In bulkBV 42或43 加保护球形瓶Bottle, protected bulbousBX 21或25 盒BoxBY 16 以堆/束/捆形式的板Board, in bundle/bunch/trussBZ 16 以堆/束/捆形式的钢条Bars, in bundle/bunch/trussCA 22 矩形罐Can, rectangularCB 23或27 装啤酒板条箱Beer crateCC 32或33 盛奶器ChurnCE 27 柳条鱼篮CreelCF 24 保险箱CofferCG 26 笼CageCH 25 箱, 柜ChestCI 21或22 金属罐CanisterCJ 54 屏蔽容器CoffinCK 44或45 木桶CaskCL 14 圈CoilCN ConesCO 43 未加保护的坛Carboy, non-protecteCP 43 加保护的坛Carboy, protectedCQ 罐头CanCR 24-25 板条箱CrateCS 21或25 箱CaseCT 22-24 纸板箱CartonCU 51 杯CupCV 67 包裹CoverCX 32 圆柱形罐Can, cylindricalCY 12 圆筒CylinderCZ 67 帆布CanvasDJ 43 未加保护细颈坛Demijohn, non-protected DP 43 加保护细颈坛Demijohn, protectedDR 34 金属桶DrumEN 67 包, 封EnvelopeFC 23-27 装水果板条箱Fruit crateFD 26 框架板条箱Framed crateFI 44或45 小桶FirkinFL 42或43 细颈瓶FlaskFO 23 底箱FootlockerFP 67 薄膜包装FilmpackFR 26 框架FrameGB 31或35 气瓶Gas bottleGG 粗麻袋Gunny bagGI 16 (支)袈GirderGL 粗麻包Gunny baleGZ 16 以堆/束/捆形式的(支柱)架Girders, in bundle/bunch/trussHG 44或45 大啤酒桶HogsheadHR 23 带盖的篮HamperID 铁桶Iron drumIN 17 锭IngotIZ 17 以堆/束/捆形式的锭Ingots, in bundle/bunch/truss JC 23 矩形五加仑液体罐Jerrican, rectangularJG 41 带柄的水罐JugJR 41 大口瓶JarJT 61或65 黄麻包JutebagJY 33 圆柱形五加仑液体罐Jerrican, cylindricalKG 44或45 小桶(小于30加仑) KegLG 12 木材LogLV 吊装货箱Lift vanLZ 12 以堆/束/捆形式的木材Logs, in bundle/bunch/truss MB 62-64 多用包Multiply bagMC 27 装奶板条箱Milk crateMS 62-64 多层包Multiwall sackMT 67 麻袋MatMX 21 火柴盒Match boxNE 00 无包装Unpacked or unpackaged NS 24 成套器具NestNT 66 网NetNT 集装箱ContainerPA 21-3 小包裹PacketPB 纸袋Paper bagPC 21-23或61-63 包裹ParcelPE 托盘PalletPG 15 金属板PlatePH 41 大水瓶PitcherPI 11 管子PipePK 21-23 包PackagePL 51 桶PailPN 16 厚木板PlankPO 61 袋装PouchPO PolybagPS PiecesPT 41 罐PotPU 27 托盘TrayPU 27 托盘包装Tray packPY 15 以堆/束/捆形式的金属板Plates, in bundle/bunch/truss PZ 11 以堆/束/捆形式的管子Pipes, in bundle/bunch/truss PZ 11 以堆/束/捆形式的厚木板Planks, in bundle/bunch/truss RD 12 钢筋RodRG 14 环RingRL 91 卷筒ReelRO 13 卷钢RollRT 66 红色网RednetRZ 12 以堆/束/捆形式的钢筋Rods, in bundle/bunch/truss SA 65 袋SackSC 27 薄板条箱Shallow crateSD 91 轴SpindleSE 22或23 海运箱Sea-chestSH 61 小包装袋SachetSI SkidSK 26 箱Skeleton caseSL 67 薄衬纸SlipsheetSM 15 薄板金属SheetmetalST 15 薄板SheetSU 21-23或61-63 手提箱SuitcaseSW 67 收缩包装ShrinkwrappedSZ 15 以堆/束/捆形式的薄板Sheets, in bundle/bunch/truss TB 51 盆TubTC 21-23 茶叶箱Tea-chestTD 62-64 收缩管Collapsible tubeTD 61-65 管, 可拆(收缩) Ttube, collapsibleTK 24或25 矩形油箱Tank, rectangularTN 21或22 马口铁TinTO 44或45 大桶TunTR 24或25 衣箱TrunkTS 16 捆TrussTU 11 管TubeTY 34或35 圆柱形油箱Tank, cylindricalTZ 11 以堆/束/捆形式的管Tubes, in bundle/bunch/truss UN UnitVA 35 桶VatVG 06 散装气体(1031毫巴,15/C) Bulk,gas(at 1031 mbar and 15/c)VI 31 小玻璃瓶VialVL 04 散装液体Bulk, liquidVO 03 散装大粒子(颗粒)固体Bulk, solid, large particles("nodules")VP 67 真空包装VacuumpackedVQ 05 散装液化汽(在非正常温度/压力)Bulk,liquefied gas(at abnormaltemperature/pressureVR 02 散装粗粒子(粉状)固体Bulk,solid, granular particles("grains")VY 01 散装微粒子(粉状)固体Bulk, solid, fine particles("powders")WB 42或43 柳条包Wickerbottle WG 编织袋Woven bag。
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Virtual Systems Architecturห้องสมุดไป่ตู้ Technology
Architecture allows OS independent (software) virtualization of hardware functions Provides compatible high performance legacy VGA core functionality Note: GUI (Graphical User Interface) graphics acceleration is pure hardware.
Packaged in: — 352-Terminal Ball Grid Array (BGA) or — 320-Pin Staggered Pin Grid Array (SPGA) 0.35-micron four layer metal CMOS process Split rail design (3.3V I/O and 2.9V core)
Geode™ GXm Processor Internal Block Diagram
Write-Back Cache Unit C-Bus
MMU
Integer Unit
FPU
Internal Bus Interface Unit X-Bus
Integrated Functions
Graphics Pipeline
Memory Controller
Display Controller
PCI Controller
SDRAM Port
CS5530 (CRT/LCD TFT)
PCI Bus
National Semiconductor and Virtual System Architecture are registered trademarks of National Semiconductor Corporation. Geode and VSA are trademarks of National Semiconductor Corporation. For a complete listing of National Semiconductor trademarks, please visit /trademarks.
Display Controller
Video Generator (VG) improves memory efficiency for display refresh with SDRAM Supports a separate MPEG1 video buffer and data path to enable video acceleration in the CS5530 Internal palette RAM for use with the CS5530 Direct interface to CS5530 for CRT and TFT flat panel support which eliminates need for external RAMDAC Hardware frame buffer compressor/decompressor Hardware cursor Supports up to 1280x1024x8 bpp and 1024x768x16 bpp
Provides 16-bit XpressAUDIO subsystem
2
Revision 3.1
元器件交易网
Geode™ GXm Processor
Table of Contents
1.0 Architecture Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Graphics pipeline performance significantly increased over previous generations by pipelining burst reads/writes Accelerates BitBLTs, line draw, text Supports all 256 raster operations Supports transparent BLTs Runs at core clock frequency Full VGA and VESA mode support Special "Driver level” instructions utilize internal scratchpad for enhanced performance
© 2000 National Semiconductor Corporation
元器件交易网
Geode™ GXm Processor Features
General Features
2D Graphics Accelerator
元器件交易网
Geode™ GXm Processor Integrated x86 Solution with MMX Support
April 2000
Geode™ GXm Processor Integrated x86 Solution with MMX Support
PCI Controller
Fixed, rotating, hybrid, or ping-pong arbitration Supports up to three PCI bus masters Synchronous CPU and PCI bus clock frequency Supports concurrency between PCI master and L1 cache
Power Management
Designed to support CS5530 power management architecture CPU only Suspend or full 3V Suspend supported: — Clocks to CPU core stopped for CPU Suspend — All on-chip clocks stopped for 3V Suspend — Suspend refresh supported for 3V Suspend
XpressRAM Subsystem
Memory control/interface directly from CPU 64-Bit wide memory bus Support for: — Two 168-pin unbuffered DIMMs — Up to 16 open banks simultaneously — Single or 16-byte reads (burst length of two)
General Description
The National Semiconductor® Geode™ GXm processor is an advanced 32-bit x86 compatible processor offering high performance, fully accelerated 2D graphics, a 64-bit synchronous DRAM controller and a PCI bus controller, all on a single chip that is compatible with Intel’s MMX technology. The GXm processor core is a proven design that offers competitive CPU performance. It has integer and floating point execution units that are based on sixth-generation technology. The integer core contains a single, six-stage execution pipeline and offers advanced features such as operand forwarding, branch target buffers, and extensive write buffering. A 16 KB write-back L1 cache is accessed in a unique fashion that eliminates pipeline stalls to fetch operands that hit in the cache. In addition to the advanced CPU features, the GXm processor integrates a host of functions which are typically implemented with external components. A full-function graphics accelerator provides pixel processing and rendering functions. A separate on-chip video buffer enables >30 fps MPEG1 video playback when used together with the CS5530 I/O companion chip. Graphics and system memory accesses are supported by a tightly-coupled synchronous DRAM (SDRAM) memory controller. This tightly coupled memory subsystem eliminates the need for an external L2 cache. The GXm processor includes Virtual System Architecture® (VSA™ technology) enabling XpressGRAPHICS and XpressAUDIO subsystems as well as generic emulation capabilities. Software handler routines for the XpressGRAPHICS and XpressAUDIO subsystems can be included in the BIOS and provide compatible VGA and 16bit industry standard audio emulation. XpressAUDIO technology eliminates much of the hardware traditionally associated with audio functions.