HT7825中文资料

HT78XX Series500mA TinyPower TM LDOSelection TablePart No.Output VoltageTolerancePackageHT7818 1.8V ±2%SOT-89TO-92HT7825 2.5V HT7827 2.7V HT7830 3.0V HT7833 3.3V HT78505.0VBlock DiagramRev.1.001March 2,2007Features·Output voltage ranges:Fixed range of 1.8V,2.5V,2.7V,3.0V,3.3V,5.0V type.·Highly accuracy:±2%·Low voltage drop:360mV (typ.),V OUT =5.0V at 500mA·Guaranteed output current:500mA·Low quiescent current:5m A (typ.)·Current limiting·Over-temperature shutdown ·SOT-89,TO-92PackagesApplications·Battery powered systems ·Personal Digital Assistants ·Peripheral cards·PCMCIA cards·Personal Communication EquipmentGeneral DescriptionThe HT78XX series of positive,linear regulators fea-tures low quiescent current (5m A typ.)with low dropout voltage,making them ideal for battery applications.The devices are capable of supplying 500mA of output cur-rent continuously.They are available with several fixed output voltages ranging from 1.8V to 5.0V.Although designed primarilyas fixed voltage regulators,these devices can be used with external components to obtain variable voltages and currents.These rugged devices have Thermal Shutdown and Current Limiting to prevent device failure under the ²Worst ²of operatingconditions.Pin AssignmentAbsolute Maximum Ratings*Maximum Supply Voltage ............................up to 8.5V Storage Temperature ..........................-50°C to 125°COperating Temperature .........................-40°C to 85°CNote:These are stress ratings only.Stresses exceeding the range specified under ²Absolute Maximum Ratings ²maycause substantial damage to the device.Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.²*²Absolute maximum ratings indicate limits beyond which damage to the device may occur.Operating Ratings in-dicate conditions for which the device is intended to be functional,but do not guarantee specific performance limits.The guaranteed specifications apply only for the test conditions listed.Thermal InformationSymbolParameterPackage Max.Unit q JAThermal Resistance (Junction to Ambient)(Assume no ambient airflow,no heat sink)SOT-89200°C/W TO-92200°C/W P DPower DissipationSOT-890.50W TO-920.50WNote:P D is measured at Ta=25°CRev.1.002March 2,2007Electrical Characteristics Tj=25°C,V IN=V OUT+1.0V,I O=1mA,unless otherwise specified Symbol Parameter Test Conditions Min.Typ.Max.UnitV IN Input Voltage¾¾¾8VD V OUT Output Voltage Tolerance¾-2¾2%I SS Quiescent Current I O=0mA¾57m AD V LOAD Load Regulation(Note1)1mA£I OUT£500mA¾0.0040.008%/mAV DROP Dropout Voltage(Note2)D V OUT=2%I OUT=500mAV O£1.8V¾8001200mV2.5V£V O£2.7V¾5006503.0V£V O£5.0V¾360500D V LINE Line Regulation V OUT+1.0V£V IN£8.0V¾0.20.3%/VI LIM Current Limit(Note3)D V OUT=10%500¾¾mATemperature Coefficient-40°C<Ta<85°C¾±0.8¾mV/°C Note: 1.Load regulation is measured at a constant junction temperature,using pulse testing with a low ON time and is guaranteed up to the maximum power dissipation.Power dissipation is determined by the input/outputdifferential voltage and the output current.Guaranteed maximum power dissipation will not be available over the full input/output range.The maximum allowable power dissipation at any ambient temperature isP D=(T J(MAX)-Ta)/q JA.2.Dropout voltage is defined as the input voltage minus the output voltage that produces a2%change in theoutput voltage from the value at V IN=V OUT+1V with a fixed load.3.Current limit is measured by pulsing for a short time.Application CircuitsBasic CircuitsTypical Application Circuits·High output current positive voltage regulatorRev.1.003March2,2007·Increased Output voltage CircuitV=V(1+R2R1)+I R2OUT XX SS ·Dual Supply CircuitV=V+VOUT1XX2XX1V=VOUT2XX2·Tracking Voltage Regulator-V=V x R RO O A BRev.1.004March2,2007Package Information3-Pin SOT-89Outline DimensionsSymbolDimensions in milMin.Nom.Max.A173¾181B64¾72C90¾102D35¾47E155¾167F14¾19G17¾22H¾59¾I55¾63J14¾17Rev.1.005March2,20073-Pin TO-92Outline DimensionsSymbolDimensions in milMin.Nom.Max.A170¾200B170¾200C500¾¾D11¾20E90¾110F45¾55G45¾65H130¾160I8¾18a4°¾6°Rev.1.006March2,2007Product Tape and Reel SpecificationsReel DimensionsSOT-89Symbol Description Dimensions in mmA Reel Outer Diameter180±1.0B Reel Inner Diameter62±1.5C Spindle Hole Diameter12.75+0.15D Key Slit Width 1.9±0.15T1Space Between Flange12.4+0.2T2Reel Thickness17-0.4Rev.1.007March2,2007TO-92Reel Dimensions(Unit:mm)Rev.1.008March2,2007Carrier Tape DimensionsSOT-89Symbol Description Dimensions in mmW Carrier Tape Width 12.0+0.3-0.1P Cavity Pitch8.0±0.1E Perforation Position 1.75±0.1F Cavity to Perforation(Width Direction) 5.5±0.05D Perforation Diameter 1.5+0.1D1Cavity Hole Diameter 1.5+0.1P0Perforation Pitch 4.0±0.1P1Cavity to Perforation(Length Direction) 2.0±0.10A0Cavity Length 4.8±0.1B0Cavity Width 4.5±0.1K0Cavity Depth 1.8±0.1t Carrier Tape Thickness0.30±0.013C Cover Tape Width9.3Rev.1.009March2,2007TO-92Carrier Tape DimensionsTO-92Symbol Description Dimensions in mm I1Taped Lead Length(2.5)P Component Pitch12.7±1.0P0Perforation Pitch12.7±0.3P2Component to Perforation(Length Direction) 6.35±0.4F1Lead Spread 2.5+0.4-0.1F2Lead Spread 2.5+0.4-0.1D h Component Alignment0±0.1W Carrier Tape Width 18.0+1.0-0.5W0Hold-down Tape Width 6.0±0.5W1Perforation Position9.0±0.5W2Hold-down Tape Position(0.5)H0Lead Clinch Height16.0±0.5H1Component Height Less than24.7D0Perforation Diameter 4.0±0.2t Taped Lead Thickness0.7±0.2H Component Base Height19.0±0.5Note:Thickness less than0.38±0.05mm~0.5mmP0Accumulated pitch tolerance:±1mm/20pitches.()Bracketed figures are for consultation onlyRev.1.0010March2,2007HT78XX SeriesRev.1.0011March 2,2007Holtek Semiconductor Inc.(Headquarters)No.3,Creation Rd.II,Science Park,Hsinchu,TaiwanTel:886-3-563-1999Fax:886-3-563-1189Holtek Semiconductor Inc.(Taipei Sales Office)4F-2,No.3-2,YuanQu St.,Nankang Software Park,Taipei 115,TaiwanTel:886-2-2655-7070Fax:886-2-2655-7373Fax:886-2-2655-7383(International sales hotline)Holtek Semiconductor Inc.(Shanghai Sales Office)7th Floor,Building 2,No.889,Yi Shan Rd.,Shanghai,China 200233Tel:86-21-6485-5560Fax:86-21-6485-0313Holtek Semiconductor Inc.(Shenzhen Sales Office)5/F,Unit A,Productivity Building,Cross of Science M 3rd Road and Gaoxin M 2nd Road,Science Park,Nanshan District,Shenzhen,China 518057Tel:86-755-8616-9908,86-755-8616-9308Fax:86-755-8616-9722Holtek Semiconductor Inc.(Beijing Sales Office)Suite 1721,Jinyu Tower,A129West Xuan Wu Men Street,Xicheng District,Beijing,China 100031Tel:86-10-6641-0030,86-10-6641-7751,86-10-6641-7752Fax:86-10-6641-0125Holtek Semiconductor Inc.(Chengdu Sales Office)709,Building 3,Champagne Plaza,No.97Dongda Street,Chengdu,Sichuan,China 610016Tel:86-28-6653-6590Fax:86-28-6653-6591Holtek Semiconductor (USA),Inc.(North America Sales Office)46729Fremont Blvd.,Fremont,CA 94538Tel:1-510-252-9880Fax:1-510-252-9885Copyright Ó2007by HOLTEK SEMICONDUCTOR INC.The information appearing in this Data Sheet is believed to be accurate at the time of publication.However,Holtek as-sumes no responsibility arising from the use of the specifications described.The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification,nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise.Holtek ¢s products are not authorized for use as critical components in life support devices or systems.Holtek reserves the right to alter its products without prior notification.For the most up-to-date information,please visit our web site at .元器件交易网。