bq2083
ASTM A780A780M-09 热浸镀锌层的损坏及无覆层区域的检修
Designation:A 780/A 780M –09Standard Practice forRepair of Damaged and Uncoated Areas of Hot-Dip Galvanized Coatings 1This standard is issued under the fixed designation A 780/A 780M;the number immediately following the designation indicates the year of original adoption or,in the case of revision,the year of last revision.A number in parentheses indicates the year of last reapproval.A superscript epsilon (´)indicates an editorial change since the last revision or reapproval.This standard has been approved for use by agencies of the Department of Defense.1.Scope*1.1This practice describes methods that may be used to repair damaged hot-dip galvanized coatings on hardware,structural shapes,and other products fabricated prior to hot-dip galvanizing,and uncoated areas remaining after initial hot-dip galvanizing.The damage may be the result of welding or cutting (flame),in which case the coating will be damaged predominantly by burning.This practice can also be used to repair hot-dip galvanized coatings damaged by excessively rough handling during shipping or erection.Requirements concerning the renovation of uncoated areas remaining after initial hot-dip galvanizing are contained within the applicable material specification.1.2This practice describes the use of low melting point zinc alloy repair rods or powders made specifically for this purpose,the use of paints containing zinc dust,and the use of sprayed zinc (metallizing).1.3The extent of repair shall be limited to an area mutually agreeable to the contracting parties.Similarly,contracting parties shall agree to the repair method to be used.1.4This specification is applicable to orders in either inch-pound units (as A 780)or in SI units (as A 780M).Inch-pound units and SI units are not necessarily exact equivalents.Within the text of this specification and where appropriate,SI units are shown in brackets.Each system shall be used independently of the other without combining values in any way.1.5This standard does not purport to address the safety problems,if any,associated with its use.It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.2.Referenced Documents 2.1ASTM Standards:2A 902Terminology Relating to Metallic Coated Steel Prod-uctsD 520Specification for Zinc Dust Pigment2.2Society for Protective Coatings (SSPC)Documents:3SSPC-PA2Measurement of Dry Paint Thickness with Mag-netic GagesSSPC-SP2Hand Tool CleaningSSPC-SP5/NACE No.1White Metal Blast Cleaning SSPC-SP10/NACE No.2Near-White Blast Cleaning SSPC-SP11Power Tool Cleaning to Bare Metal3.Terminology3.1Definitions —For definitions of terms used in this practice,refer to Terminology A 902.4.Materials4.1Properties —The material used for repairs shall have the following characteristics:4.1.1One application of the material shall provide a coating thickness of at least 2.0mils (50.8µm).4.1.2The applied coating shall provide barrier protection and shall preferably be anodic to steel.4.1.3Application of the coating material shall be possible under shop or field conditions.4.2Types —There are three types of material that possess the required properties and may be used to repair damaged galvanized coatings,as follows:1This practice is under the jurisdiction of ASTM Committee A05on Metallic-Coated Iron and Steel Products and is the direct responsibility of Subcommittee A05.13on Structural Shapes and Hardware Specifications.Current edition approved May 1,2009.Published May 2009.Originally approved in st previous edition approved in 2006as A 780–01(2006).2For referenced ASTM standards,visit the ASTM website,,or contact ASTM Customer Service at service@.For Annual Book of ASTM Standards volume information,refer to the standard’s Document Summary page on the ASTM website.3Available from Society for Protective Coatings (SSPC),4024th St.,6th Floor,Pittsburgh,PA 15222-4656,.*A Summary of Changes section appears at the end of this standard.Copyright ©ASTM International,100Barr Harbor Drive,PO Box C700,West Conshohocken,PA 19428-2959,UnitedStates.4.2.1Zinc-Based Solders—Zinc alloy solders are to be used for repairs.The most common types of solders are zinc-cadmium,zinc-tin-lead,and zinc-tin-copper alloys.Zinc-cadmium and zinc-tin-lead alloys have liquidus temperatures in the ranges from518to527°F(270to275°C)and446to500°F (230to260°C),respectively.(The liquidus temperature is that temperature above which an alloy is completely molten.)The zinc-tin-copper alloys have a liquidus temperature in the range from660to670°F(349to354°C),but they are applied while in a semisolid state in the preferred application temperature range from480to570°F(250to300°C).The solders can be used in rod form or as powders.Annex A1describes the use of zinc-based solders.4.2.2Paints Containing Zinc Dust—These are usually based on organic binders,pre-mixed and formulated specifi-cally for use on steel surfaces.Paints containing zinc dust,with concentrations of zinc dust in the range of65to69%or above 92%in the driedfilm,are considered equally effective for the repair of damaged galvanized coatings.The repair paint to be used shall be selected by the galvanizer,unless the purchaser specifies a particular concentration or paint system.Corrosion resistance and service performance are very dependent on the properties of the paint system,the extent of surface prepara-tion,and skills of individual applicators.Annex A2describes the use of paints containing zinc dust.Specification D520 describes the zinc dust component of these paints.4.2.3Sprayed Zinc—This method involves the application of a zinc coating by spraying the surface to be repaired with droplets of molten metal using wire or ribbon,or powder processes.Annex A3describes the use of sprayed zinc.4.3For further information,reference may be made to the papers,procedures,and specifications in Refs.(1)through(4) (see list of references at the end of this practice).5.Keywords5.1coatings—zinc;galvanized coating repair;galvanized coatings;touch-up;zinc coating repair;zinc coatingsANNEXES(Mandatory Information)A1.REPAIR USING ZINC-BASED ALLOYSA1.1Clean the surface to be reconditioned using a wire brush,a light grinding action,or mild blasting.To ensure that a smooth reconditioned coating can be effected,surface prepa-ration shall extend into the surrounding,undamaged galva-nized coating.A1.2If the area to be reconditioned includes welds,first remove all weldflux residue and weld spatter(of a size that cannot be removed by wire brushing or blast cleaning)by mechanical means,such as chipping,grinding,or power scaling,etc.A1.3Preheat the cleaned area to be reconditioned to at least 600°F(315°C).Do not overheat the surface beyond750°F (400°C),nor allow the surrounding galvanized coating to be burned.Wire brush the surface to be reconditioned during preheating.Pre-flux,if necessary.A1.4Rub the cleaned,preheated area with the repair stick to deposit an evenly distributed layer of the zinc alloy.When powdered zinc alloys are used,sprinkle the powder on the cleaned,preheated surface and spread out with a spatula or similar tool.The thickness of the applied coating shall be as agreed upon between the contracting parties.A1.5When the repair has been effected,removeflux residue by rinsing with water or wiping with a damp cloth. A1.6Take thickness measurements with either a magnetic, electromagnetic,or eddy-current gage to ensure that the applied coating is as specified.A2.REPAIR USING PAINTS CONTAINING ZINC DUSTA2.1Preparation of the damaged surface will be influenced by the type of paint selected and the anticipated service conditions.Experience shows that in general,organic zinc-rich systems are tolerant of marginal surface preparation.Most organic paints containing zinc dust are not critical of climatic or atmospheric conditions for curing.The following general guidelines shall apply:A2.1.1Surfaces to be reconditioned with paints containing zinc dust shall be clean,dry,and free of oil,grease,preexisting paint,and corrosion by-products.A2.1.2Where anticipated,field service conditions include immersion,blast clean the surface in accordance with SSPC-SP10/NACE No.2near white metal.For less criticalfield exposure conditions,clean the surface to bare metal,in accordance with SSPC-SP11,as a minimum.Where circum-stances do not allow blast or power tool cleaning,it is permissible to hand tool areas clean in accordance with SSPC-SP2.To ensure that a smooth reconditioned coatingcanbe effected,surface preparation shall extend into the undam-aged galvanized coating.The method and extent of surface preparation shall be mutually agreeable to the contracting parties.A2.1.3If the area to be reconditioned includes welds,first remove all weld flux residue and weld spatter (of a size that cannot be removed by wire brushing or blast cleaning)by mechanical means,such as chipping,grinding,or power scaling,etc.A2.1.4Spray or brush-apply the paints containing zinc dust to the prepared area.Apply the paint as in accordance with themanufacturer’s printed instructions in a single application employing multiple passes to achieve a dry film thickness to be agreed upon between the contracting parties.Allow adequate curing time before subjecting repaired items to service condi-tions in accordance with the manufacturer’s printed instruc-tions.A2.1.5Take thickness measurements with either a mag-netic,electromagnetic,or eddy-current gage to ensure that the applied coating is as specified in accordance with SSPC-PA2.A3.REPAIR USING SPRAYED ZINC (METALLIZING)A3.1Surfaces to be reconditioned by zinc metallizing shall be clean,dry and free of oil,grease,and corrosion products.A3.2If the area to be reconditioned includes welds,first remove all flux residue and weld spatter of a size or type that cannot be removed by blast cleaning by mechanical means,that is,chipping,etc.A3.3Blast clean the surface to be reconditioned in accor-dance with SSPC-SP5/NACE No.1,white metal.A3.4To ensure that a smooth reconditioned coating can be effected,surface preparation shall be extended into the sur-rounding undamaged galvanized coating.A3.5Apply the coating to the clean and dry surface bymeans of metal-spraying pistols fed with either zinc wire or zinc powder.Apply the sprayed coating as soon as possible after surface preparation and before visible deterioration of the surface has occurred.A3.6The surface of the sprayed coating shall be of uniform texture,free of lumps,coarse areas,and loosely adherent particles.A3.7The nominal thickness of the sprayed zinc coating shall be previously agreed upon between the contracting parties.A3.8Take thickness measurements with either a magnetic,electromagnetic,or eddy-current gage to ensure that the applied coating is as specified.REFERENCES(1)Van Eijnsbergen,J.F.H.,et al,“Reconditioning Damaged Galvanized Surfaces,’’6th International Conference on Hot Dip Galvanizing,Interlaken,June 1961,pp.128–141.(2)SSPC-Paint-20,“Zinc Rich Coatings,Type I Inorganic,Type II Organic,’’Steel Structures Painting Council,4400Fifth Ave.,Pitts-burgh,PA 15213,1979.(3)MIL-P-21035(Ships),Military Specification,“Paint,High Zinc Dust Content,Galvanizing Repair,’’Amendment 1,ernment Printing Office,Washington,DC,1970.(4)“Recommended Practices for Fused Thermal Sprayed Deposits,’’American Welding Society,Inc.,550N.W.LeJeune Rd.,Miami,FL 33135,1975.SUMMARY OF CHANGESCommittee A05has identified the location of selected changes to this standard since the last issue (A 780–01(2006))that may impact the use of this standard.(May 1,2009)(1)Revised 1.4and changed designation to make standard applicable in bothunits.ASTM International takes no position respecting the validity of any patent rights asserted in connection with any item mentioned in this ers of this standard are expressly advised that determination of the validity of any such patent rights,and the risk of infringement of such rights,are entirely their own responsibility.This standard is subject to revision at any time by the responsible technical committee and must be reviewed everyfive years and if not revised,either reapproved or withdrawn.Your comments are invited either for revision of this standard or for additional standards and should be addressed to ASTM International Headquarters.Your comments will receive careful consideration at a meeting of the responsible technical committee,which you may attend.If you feel that your comments have not received a fair hearing you should make your views known to the ASTM Committee on Standards,at the address shown below.This standard is copyrighted by ASTM International,100Barr Harbor Drive,PO Box C700,West Conshohocken,PA19428-2959, United States.Individual reprints(single or multiple copies)of this standard may be obtained by contacting ASTM at the above address or at610-832-9585(phone),610-832-9555(fax),or service@(e-mail);or through the ASTM website ().。
BQ2083DBT;BQ2083DBTR-V1P2;BQ2083DBTR-V1P2G4;中文规格书,Datasheet资料
38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20
VSSD N/C N/C CLKOUT XCK1 XCK2 FILT VDDA VSSA VSSA SR1 SR2 MRST N/C LED1 LED2 LED3 LED4 LED5
NC − No internal connection AVAILABLE OPTIONS TA PACKAGE 38-PIN TSSOP (DBT)
APPLICATIONS D Notebook PCs D Medical and Test Equipment D Portable Instrumentation DESCRIPTION
The bq2083−V1P2 SBS-compliant gas gauge IC for battery pack or in-system installation maintains an accurate record of available charge in Li-ion or Li-polymer batteries. The bq2083−V1P2 monitors capacity and other critical parameters of the battery pack and reports the information to the system host controller over a serial communication bus. It is designed to work with the bq29311 analog front-end (AFE) protection IC to maximize functionality and safety and minimize component count and cost in smart battery circuits. Using information from the bq2083−V1P2, the host controller can manage remaining battery power to extend the system run time as much as possible.
氟橡胶热缩管
氟橡胶热缩管介绍由氟橡胶和高分子弹性体经辐射改性制成，可长期在高温下使用，耐柴油、航空燃油、耐高温流体。
可用于军工车辆、高铁动车、舰船设备或商用线缆终端、分离结合处等的防护。
特点耐油耐溶剂高阻燃、柔软富有弹性收缩温度：90℃～170℃使用温度：-65℃～200℃热缩倍率：2:1环保标准：RoHS标准颜色：黑色技术指标性能指标测试方法/条件拉伸强度≥8.2MPa ASTM D 638断裂伸长率≥250% ASTM D 638热老化后断裂伸长率≥200% 250℃×168h阻燃性15秒内自熄ASTM D 2671纵向收缩率-10%～+10% ASTM D 2671热冲击无裂纹、无滴落300℃×4h击穿强度≥7.9kV/mm ASTM D 2671体积电阻率≥109Ω.cm ASTM D 876结构示意图规格表全缩后尺寸（mm）标准包装规格供货内径D(mm)内径d 壁厚w (米/盘) Φ2.4 ≥2.4 ≤1.2 0.51±0.08 200Φ3.2 ≥3.2 ≤1.6 0.76±0.13 100 Φ4.8 ≥4.8 ≤2.4 0.89±0.18 50 Φ6.4 ≥6.4 ≤3.2 0.89±0.18 50 Φ9.5 ≥9.5 ≤4.8 0.89±0.18 50 Φ12.7 ≥12.7 ≤6.4 0.89±0.18 50 Φ19.1 ≥19.1 ≤9.5 1.07±0.21 30 Φ25.4 ≥25.4 ≤12.7 1.25±0.30 30 Φ38.1 ≥38.1 ≤19.1 1.40±0.38 30 Φ50.8 ≥50.8 ≤25.4 1.65±0.43 30 注：可按要求订制特殊尺寸及包装。
宝钢热镀锌产品相近牌号对照表
-
SS 550
H220PD+Z,H220PD+ZF
H220PD+Z,+ZF
-
-
-
H260PD+Z,H260PD+ZF
H260PD+Z,+ZF
-
-
-
H300LAD+Z,H300LAD+ZF
H300LAD+Z,+ZF
-
-
-
H340LAD+Z(HSA340Z), H340LAD+ZF
H180YD+Z,+ZF
-
-
-
H220YD+Z，H220YD+ZF
H220YD+Z，+ZF
-
-
-
H260YD+Z，H260YD+ZF
H260YD+Z，+ZF
-
-
-
H180BD+Z,H180BD+ZF
H180BD+Z,+ZF
-
-
-
H220BD+Z,H220BD+ZF
H220BD+Z,+ZF
-
-
-
H260BD+Z,H260BD+ZF
SGC340
SS 275
S320GD+Z,S320GD+ZF
S320GD+Z,+ZF
FeE320GZ, ZF
-
-
S350GD+Z(StE345-2Z) S350GD+ZF
S350GD+Z,+ZF
BQ8011引脚功能
10, SDATA : 从bq29311数据传输
11,19,38, VSSD : 负电源 数字地
12, SAFE : 输出额外的安全保护级别，如保险丝熔断
15, SBMC : 开漏双向引脚，用于从BQ8011时钟数据传输16, SMBD : 数据漏极开路双向引脚，用于从BQ8011处理和传输的数据
17, DISP : 显示控制LED驱动器通过LED5 LED1
18, EVENT: 输入从bq8011 XALERTPLAY LED显示，每个可驱动外部发光二极管
26; MRST : 主复位输入，高电平有效
27, 28 SR1 SR2 用小型检测电阻连接 监控电池充电和放电电流
29,30 VSSA: 负电源 模拟地
31, VDDA : 正电源
32, FILT : 模拟输入连接到外部PLL滤波器
33, XCK2 : 32.768 kHz晶体振荡器输出
34, XCK1 : 32.768 kHz晶体振荡器输入
35, CLK OUT 32.768 kHz的输出至bq29311
BQ8011和BQ2083的功能基本相同,只有少许的区别，一个是外置EEP，一个是内置EEP(一般和BQ29311/BQ29310组合使用)是由美国德州仪器生产,都是属于带单片机的电池参数监控芯片,可准确记录负责的锂离子或锂聚合物的详细使用参数..
以上芯片38个引脚且功能大体相同,以下是各脚位功能:
1, VIN : 从bq29311单电池电压输入
2; TS : 热敏电阻电压输入连接来监控温度
3; OC : 模拟自动ADC输入偏移补偿;应该连接到VSSA
笔记本电池充电接口定义问题
笔记本电池充电接口定义问题最简单使用后背接口，只要连接4根线：电源、地线、SCL、SDA（笔记本电池接口处的“电池连接”认证脚2和1脚要连好，SCL、SDA是I2C总线的两根线）。
连接了这些线以后，笔记本即可与电池通讯、充电、放电、正常使用。
A230电池接口详细解释：1：地线2：电池连接确认脚此脚功能是告诉主机，电池连接上了。
方法是将2脚连接到1脚，笔记本就知道电池已经连上。
SDA（DATA，或作D）此脚是I2C总线的数据线。
4：SCL（CLOCK，或作C）7关于第5脚，测量了一下笔记本这端接口第5脚的确是接地。
但电池这端的第5脚测起来却有10V电压。
估计是电池下拉端口，告诉电池已经连接到笔记本，还有电池端的第6脚也有5V电压。
估计电池本身对保护板也有供电。
或者是充电状态指示电平。
[同意下拉的说法，如果接地了，不应该是充电状态指示电平吧？6：+5V:如果电池连接到了主机，主机会将稳压后的正5伏输出一路给电池保护电路使用，此路电流很小，只够电池保护板使用。
不同的笔记本电池设计的不一样，供给电池保护电路的+5V一般有三种：第一种是5V稳压电路在电池内，这是比较常见的设计，带检电钮和电量指示灯的一般是这种；第二种是电池供电给主机，主机将稳压后的5V再输出给电池，A230就属于这一种；第三种是电池保护电路在笔记本电脑主机中，电池内部只有一个I2C的EEPROM，还有温度等传感器传输到主机，电池内没有保护电路和大功率开关管。
7：空脚!8：电池电源脚此脚连接电池输出与主机，充、放电均通过此接口。
笔记本电池接口定义,通讯问题电源正负极pins,通讯pin,id识别pin,控制pin等等你如果是用BQ2060做的,是双线通讯协议,一般来说,接口PIN以下几脚是必须有的:1.PACK+(电池的输出正极)2.PACK-(电池的输出负极)3.SDA(系统数据)4.SCL(系统时钟)还有一些根据不同的电池是可选的,如NTC(热敏电阻)ID(识别电阻端子)一般来说,每个型号的电池接口定义是不一样的,但相同品牌电脑电池的接口基本是类似的,并且接口定义顺序也大概相同.xx100笔记本电池接口定义xx100笔记本电池接口定义:电池接口向上,从电池腹面由左往右分别为GND,SMBC,SMBD,TH,B/I,ID,B+拆下电池测量只有GND与B/I接口有5V电压,接通GND与B/I接口,测量GND与B+能得到电池电压!SMBC,SMBD分别为与笔记本数据通讯的时钟和数据引脚,TH为电池温度引脚,ID本人还未搞懂是什么用途,从充电到放电和待机都没发现有什么电压变化.同型号的电池接口都不一样,但总的来说都包含:正负级,SMData,SMClk,Ts,等]使用现成的专用芯片,如最流行的BQ系列芯片:BQ2060A,BQ2083,BQ2085,BQ204，有的电池将充电部分做到电池里面去了,如COMPAQ笔记本电脑的不少电池都是如此.xx笔记本电池!!!笔记本电池通通通!!!笔者因主持研发笔记本电池测试系统(即所谓的电池老化柜),感觉在学习和实践中都走了弯路,浪费了不少时间和精力,故此想写点什么,也许可以帮助后来者省却一点弯路.第一个误区是直奔锂电池原理.实际上很少有将原理讲得透彻的资料,即使将清楚了,初学者也大都看不透彻.那么,先想想什么好呢?一块电池,根本作用还是给电脑供电.所以最基本的想法是将一节的电芯(cell)串在一起,就象将几节电池串在一起给手电筒供电一样,确实,笔记本电池里就是将几节电池串在一起的.当然,要是如此简单就没有什么好说的了.现在的笔记本电池都是所谓智能(smartbattery)的了,她能告诉电脑:我现在还剩余多少容量,现在的电压是多少,电流是多少,按现在的放电速率我还能用多长时间,我是否该充电了,充电应该用多大的电流、电压,充电是否充过头了,放电是否放过头了,温度是否过高,等等.电池要提供这些所谓的智能信息,就要在电池中增加一个电路.这个电路通常都使用现成的专用芯片,如最流行的BQ系列芯片:BQ2060A,BQ2083,BQ2085,BQ2040等,这些芯片检测流入和流出电芯的电流,算出上面所谓的智能信息.这个电路还要增加一个功能:保护功能.上面说了电路能检测出充电是否充过头了,放电是否放过头了.既然知道充过头了,就要使充电电源充不到电芯上去;放电放过头了,就要切断电芯对外放电.温度过高了,就要是电池停下来.这就是所谓的保护功能.最后一个功能就是通讯,电池准备了这些信息,总要发送出去吧.所以通讯少不了.按上所说,通常的电池其实主要是检测部分,能检测出来信息,保护功能实现自然简单,无非是开关而已.当然有的电池将充电部分做到电池里面去了,如COMPAQ笔记本电脑的不少电池都是如此.所以,初学者可以先学习具体的电池检测芯片,如BQ2060A,(注意,不要从BQ2050开始,理解了BQ2060A,回过头来才好理解BQ2050.")先不必看BQ2060是如何检测那些智能信息的,先看BQ2060都检测出了哪些信息?这些检测出来的信息存放在什么地方了?在BQ2060的DATASHEET中,有个Table3."bq2060Registerfunctions,这里存放了BQ2060检测出来智能信息的.这些信息就是所谓的SmartBatteryData(智能电池数据),它们都被定义成标准了(见SmartBatteryDataSpecfication).BQ2050中检测出来的信息没有这么丰富,它不符合这个标准.BQ2040,BQ2083,BQ2085都符合这个标准,检测出来的信息也是这些.下面解释一下BQ2060检测出来信息的意思.1、静态信息:静态信息不是检测出来的,而是生产厂家自己写进去的,它一般写在24C01中,BQ2060从24C01中读到它自己里面去.ManufactureDate,ManufactureName,DeviceName,Devicechemistry,Specificatio nInfo,DesignVoltage,DesignCapacity,RemaingCapacityAlarm, RemaingTimeAlarm, BatteryMode.这些信息不言自明.2、"动态信息:动态信息中有些是检测出来的,有些是纯粹计算出来的,目的就是免去用户自己计算了.检测的:Voltage,Current,Temperature,AverageCurrent,RemaingCapacity,FullChargeCapa city,BatteryStatus.计算的:RelativeStateOfCharge,AbsoluteStateOfCharge,RunTimeToEmpty,AverageTimeT oEmpty,AverageTimeToFull,CycleCount..信息ChargingVoltage,ChargingCurrent告诉充电器应该用多大的充电电流给它充电,在多大的电压处应该变成恒压充电.AtRate, AtRateTimeToFull, AtRateTimeToEmpty, AtRateOK纯粹是帮用户计算信息用的.3、每个厂家的特定信息:标准SmartBattery Data Specfication之外的一些信息.这些信息只有5项,不同厂家不一样,对于BQ2060就是VCELL1-4和PackConfigureation.对于BQ2085,PackConfigureation的意义就和BQ2060不大一样.4、ManufactureAccess,标准SmartBatteryDataSpecfication之外,厂家特定的操作,如BQ2060的Seal,读写EEPROM,Calibration等,都是通过它来完成的.具体每一项信息的意义论坛中有人翻译了BQ2060的DATASHEET,在此不在重复.BQ2060是如何检测那些智能信息的呢?简单地说,将是将一个电阻串接到电芯上,检测流过这个电阻上的电流的大小就可以知道充了多少电,放了多少电.充电充的是电荷、放电放的也是电荷,所以检测电流就知道充了多少电,放了多少电.至于电压、温度的检测更简单了,用的A/D转换就可以,BQ2060中就是这样做的.BQ2060检测到信息后就要作出一些判断,如温度是否高了,我是否该充电了,充电应该用多大的电流、电压,充电是否充过头了,放电是否放过头了.电池无论如何也不知道多高温度属于高了,多大电流是过流了,所以,人为地先设定个标准,这样电池就可以判断了.这些标准生产厂家就放在24C01中,BQ2083,BQ2085放在它们自身的DATAFLASH中了.而BQ2050则是死设定,厂家智能用外围的电阻,电容等硬件设定,它不用EEPROM或DATA FLASH,比较死板.(其实BQ2050的功能简单多了,好多判断都没有.)检测到异常情况,BQ2060就可简单地向外发个出发电平,以关断充电或放电开关,这样保护功能就简单地实现了.实际上,大都用BQ2060的电池没有使用BQ2060提供的保护功能,而是另外加了芯片做保护,如M14."另加的芯片和BQ2060自然有些功能是重复的,但没办法,谁让另加芯片了呢.下面就是通讯方式问题,SMBUS其实就是I2C的子集,主要是时序上比I2C要求严格些.若你不写程序,简单地将SMBUS混同I2C就可以了.当你看懂了BQ2060,不要以为所有的电量检测芯片都是如此,BQ2060是与标准Smart Battery Data Specfication兼容的芯片,即所谓的SBSV1."1-Campliant,其实BQ2050就不兼容这个标准.BQ2050提供的信息少了不少,通讯方式也不同(DQ).COMPAQ Evo系列电脑的电池就是采用BQ2050H的,所以要增加PIC来增加一些功能.(当然里面还有充电功能.)还有比较流行的芯片是M37516 + 4494,这个方案比较原始,M37516就是个通用的MCU,其实用PIC、AVR等好多MCU都可以代替,它的特点就是有A/D,PWM,I2C接口.在M37516中写程序,实现BQ2060的功能,自然就可以不用BQ2060了.当然用M37516写程序来实现肯定没有使用专用芯片简单.使用M37516的电池可以是SBS V1."1-Campliant,也可以不是的.很多电池既使用了PIC,又使用了BQ2060,或BQ20等,这多数是厂家故弄玄虚.如果它也是使用SMBUS接口,很可以省掉PIC的.还有个电池解密问题,即unseal问题,BQ2060因为外接EEPROM,所以unseal 总是能实现的,虽然比较麻烦,但总是可以的,而BQ则几乎不可能,除非你知道厂家设置的unseal密码,否则,写程序用枚举方法解密一块电池要小一年时间.很多OEM电池厂家都想将就电池改写数据就以就充新地买.还有电池检测(老化)问题.检测设备有检测电芯级的,有检测电池板级的.经过前者检测出来的电池即使是合格的,但实际上电池也可能是不合格的,因为电板可能有问题而没有被检测出来.而经过后者检测出合格的电池,才是真正合格的电池.大多数电池不用时你也可以直接在电池接口处测量到电压,而有的电池不接到电脑上你是测量不到电压,即所谓的电池没有打开,如COMPAQ Evo系列.在此解释一下Capacity Relearn.其实电池的relearn-cycle或Conditioning-cycle都是充放电过程,Calibration就是充放电过程.这个过程如下:1、"先将电池充满.2、放电放完(这个过程中不能有充电)3、再充满电.CapacityRelearn就是重新确定FCC.因为在过程1的结束,BQ2060将DCR`复位为0,在过程2中DCR从0开始不断增加,当放电结束时,用DCR更新FCC.在BQ2060的DATASHEEET中将这个过程说得比较难懂,而BQ2050中说得比较清楚.下次再聊聊笔记本电池的充电问题.免费提供ATMEGA406笔记本电池方案,可以用在山寨笔记本和各品牌的替代电池,同时解决IBM、dell带数字认证的问题!!!需要请联系:笔记本电池接口上的:C,D,S.P是啥意思+,-是电池输出的正极与负极, D是数据线,C是时钟线,T是有一电阻与-连接.松下笔记本电池采用三菱M37516的方案.很多公司采用BQ系列方案基本功能：具有过充、过放、过流、过温、休眠和通迅协议等功能。
bq208x 板载偏移校准与补偿说明书
Application ReportSLUA304 - January 2004 bq2083 and bq2085 Board Offset Characterization andCompensationPortable Power Products/Battery ManagementABSTRACTThe bq208x (bq2083, bq2084, and bq2085) products are high-precision advanced gasgauge products for battery monitoring and management. Because the current signal ismeasured through a small sense resistor (< 20 mΩ) to minimize power loss, compensationfor the ADC input offset is critical for the accuracy of the measurement. This application notediscusses common issues associated with board offset characterization, data analysis, anddata flash configuration. The article uses bench data in the step by step description. Layoutguidelines for low board offset are discussed at the end of the article.1The Need for Board Offset CompensationThe sigma delta ADC of bq208x, used as a coulomb counter (CC), integrates battery current to report important battery status, such as remaining capacity, state of charge, current, and learned full capacity. The current signal is small due to the small sense resistor used in series withbatteries. For example, 10-mA current produces only 100 µV across a 10-mΩ sense resistor.Therefore, offset (internal and external) to the IC all need to be calibrated and compensated.Failure to compensate offset can result in an inaccurate current and battery capacity report. For example, gas gauge (GG) can falsely report current and capacity change (more thanself-discharge) when the battery pack is removed from the system or has no load attached.The bq208x automatically calibrates internal CC offset each time the device enters the sleepmode. During calibration, bq208x places an internal short across the differential current inputs and measures the CC output. The resulting offset value is saved in the data flash forcompensation. See application note SLVA148 for a detailed description.Board offset is system-level offset, often caused by component mismatch and noise coupling.Like any other offset, board offset varies from system to system and has dependency ontemperature. Board offset needs to be characterized in the product development phase. Thenumber of boards and measurement samples should be of sufficient quantity to adequatelyrepresent the distribution of board offset. Data analysis yields programming values for Digital Filter (DF 0x2C) and Board Offset (DF 0xd7 in bq2084 and DF 0xC6 in bq2083/5).1SLUA3043bq2083 and bq2085 Board Offset Characterization and Compensation VPACKGNDbq2931XVBAT VCCVREGVDDVSS Pack+Pack−Bat+Bat−bq208xFigure 2.Measuring Board Offset With Power on Bat+ and Bat– IntroducesError From IC Operation CurrentVPACKGNDVBAT VCCVREGVDDVSS Pack−Bat+Bat−bq208xPack+bq2931XFigure 3.Powering ICs From Pack+ and Pack– Allows theIC Current to Bypass the Sense ResistorSLUA3044bq2083 and bq2085 Board Offset Characterization and CompensationIt is also recommended to take at least 10 boards for board-offset characterization, and make at least 5 measurement samples on each board. Of course, more samples always yield better data quality. Table 1 is an example of offset collected from bq2083/bq29311 gas gauge board using EVSW. As the data shows, there are variations from board to board, and even on repeated measurements on each board. The average of all the numbers is calculated and programmed into Board Offset data flash location.Table 1.Example of Data From Bench Characterization of Board Offset12345TOTAL AVERAGE112148147551121113−37634 6.837−4−314721 4.24−6−362320.45121680945961617911197214.47111010135499.88103014330692763119 3.810315164134610.2Totalσ6.14TOTAL AVERAGE7.56In addition to the mean value, the standard deviation of the board offset also needs to becalculated to cover the variance of the offset. Standard deviation (σ) is a statistic measurement of how spread out the distribution is. It is defined as s 2+S (x *m )2nwhere µ is the mean and n is the number of samples. Microsoft Excel uses function stdev() to calculate standard deviation. Input all the numbers into this function.Digital Filter, also referred to as Deadband , is a programmable parameter in bq208x to prevent false signal detection with no charge or discharge current through the sense resistor. Gas gauge does not measure charge or discharge counts below this threshold. This threshold needs to be selected based on the standard deviation of the board offset. So, how do we link the standard deviation to the program value of Digital Filter ?Typically, offset distribution can be described as Gaussian distribution, shown in Figure 4. The Y axis represents the probability density function, and x is the offset measurement with meannormalized to 0. The peak value of the distribution occurs when X = mean value. It is also shown that the probability of the offset having values in a certain range is just equal to the area under the curve of Figure 4 in that range. Our interest is how to program the Digital Filter threshold so that the probability of having offset outside the range is statistically small. Table 2 provides the area outside the number of σ. For example, if the Digital Filter uses 6x σ, the probability of counting capacity due to board offset is equal to 4.3 ppm. The adopted industry-wide standard for quality control is 6σ and therefore is recommended in this case. Using the data in Table 1 as an example, the Digital Filter = 6.14 x 0.584 µV x 6 = 21.5 µV.SLUA3045bq2083 and bq2085 Board Offset Characterization and Compensation For current reporting, bq2083/5 has a fixed 3-mA deadband, while bq2084 has a programmable data flash location Current Deadband (DF 0x7b). To avoid reporting current when there is no load, the 6σ value divided by the sense resistor needs to be less than the current deadband. For a 10−m Ω sense resistor, the 6σ needs to be less than 30 µV.−3s −2s−s0s2s3sX.00135.0214.1359.3413.3413.1359.0214.00135f g (X)Gaussian or “Normal”DistributionFigure 4.Gaussian Distribution FunctionTable 2.Area Outside +K σ Represents the Probability of |x| Greater than K σK AREA OUTSIDE +K s10.31720.04630.00364.3ppm3Layout to Minimize Board OffsetPCB layout plays a critical role in reducing board offset and its variants. The most important component is the decoupling capacitor on Vdda/Vssa. As shown in Table 3, removing the Vdda capacitor increases the offset mean by 5 times, and standard deviation by almost 3 times.Although it may be the worst case scenario, bad component selection and/or bad layout can make the capacitor disappear from the circuit for high-frequency noise. To make the decoupling capacitor effective, the ESR (equivalent series resistor) and ESL (equivalent series inductance)need to be small. Ceramic capacitors usually meet this requirement. For high-frequency noise, it is beneficial to parallel a small capacitor, such as 68 pF, with a large-value capacitor like 0.1 µF,since a small-value capacitor has better high-frequency performance. On the layout side, the designer usually pays greater attention to shorting the trace between the decoupling capacitor and Vdd. The connection between the capacitor and Vss is often neglected, although it is equally important, and needs to follow the same guidelines. The bottom line is that ac impedance between the Vdds and Vssa needs to be minimized in order to reduce noise coupling.SLUA3046bq2083 and bq2085 Board Offset Characterization and CompensationTable 3.Removing the Decoupling Capacitor Increases the Board Offset and its VarianceEVM 12345678910Mean Board #19891110987888.78Board #24473856894 6.00Mean7.25σ6.38Vdda cap removed 12345678910Mean Board #1−28−34−26−32−37−30−32−30−33−27−30.9Board #2−40−43−42−30−37−41−24−36−45−44−38.2Mean−34.55σ6.38The routing between the current sense inputs and sense resistor also requires carefulconsideration. The key is to prevent any differential signal coupling into the current sense line.The following guidelines need to be followed.1.Ensure that the current-sense leads to bq208x are good Kelvin connections.2.Keep the three current-sense decoupling capacitors (C16, C18, and C23 in Figure 5) arevery close to bq208x.3.If the current-sense leads are long, ensure that the 100-Ω resistors (R20 and R21 inFigure 5) are near the IC in a symmetrical pattern with the three capacitors.4.Route the signals from the sense resistor as a differential pair. Use the same length andnumber of vias for each line.To SR1R130.020 W 1 WSense ResistorC160.1 m FR20100 WR21100 WC180.1 m FC200.1 m FC230.1 m FTo SR2Figure 5.Recommended Decoupling Circuit for Current Sense Lines4ConclusionBoard offset is a common issue in gas gauge design. However, bq208x products provideautomatic compensation for its effect, and the value can be programmed for individual design.The bench characterization can yield reliable data for the data flash program. A thoughtful layout provides an even further preventive measure in minimizing the board offset. If the offset still remains an issue, consider checking the CC offset and ADC offset calibration procedure,covered in application note SLVA148.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2004, Texas Instruments Incorporated。
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Temp Sensor 512 Bytes Config. Flash EPROM
ADC Voltage Integrating ADC Coulomb Counting
Sense Resistor (10 mΩ - 20 mΩ)
Pack−
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Remaining Capacity Indication 38-Pge in Li-Ion and Li-Polymer Batteries Supports the Smart Battery Specification (SBS) V1.1 Works With the TI bq29311 Analog Front End (AFE) Protection IC to Provide Complete Pack Electronics for 10.8-V or 14.4-V Battery Packs With Few External Components Based on a Powerful Low-Power RISC CPU Core With High-Performance Peripherals Integrated Flash Memory Eliminates the Need for External Configuration EEPROM Measures Charge Flow Using a High Resolution 16-Bit Integrating Converter − Better Than 3-nVh of Resolution − Self-Calibrating − Offset Error Less Than 1-µV Uses 16-Bit Delta Sigma Converter for Accurate Voltage and Temperature Measurements Programmable Cell Modeling for Maximum Battery Fuel Gauge Accuracy
APPLICATIONS D Notebook PCs D Medical and Test Equipment D Portable Instrumentation DESCRIPTION
The bq2083−V1P2 SBS-compliant gas gauge IC for battery pack or in-system installation maintains an accurate record of available charge in Li-ion or Li-polymer batteries. The bq2083−V1P2 monitors capacity and other critical parameters of the battery pack and reports the information to the system host controller over a serial communication bus. It is designed to work with the bq29311 analog front-end (AFE) protection IC to maximize functionality and safety and minimize component count and cost in smart battery circuits. Using information from the bq2083−V1P2, the host controller can manage remaining battery power to extend the system run time as much as possible.
Copyright 2003, Texas Instruments Incorporated
bq2083-V1P2
SLUS573 − JULY 2003
DESCRIPTION (CONTINUED)
The bq2083−V1P2 uses an integrating converter with continuous sampling for the measurement of battery charge and discharge currents. Optimized for coulomb counting in portable applications, the self-calibrating integrating converter has a resolution better than 3-nVh and an offset measurement error of less than 1-µV (typical). For voltage and temperature reporting, the bq2083−V1P2 uses a 16-bit A-to-D converter. In conjunction with the bq29311, the onboard ADC also monitors individual cell voltages in a battery pack and allows the bq2083−V1P2 to generate the control signals necessary to implement the cell balancing and the required safety protection for Li-ion and Li-polymer battery chemistries. The bq2083−V1P2 supports the Smart Battery Data (SBData) commands and charge-control functions. It communicates data using the System Management Bus (SMBus) 2-wire protocol. The data available include the battery’s remaining capacity, temperature, voltage, current, and remaining run-time predictions. The bq2083−V1P2 provides LED drivers and a push-button input to depict remaining battery capacity from full to empty in 20%, 25%, or 33% increments with a 3-, 4-, or 5-segment display. The bq2083−V1P2 contains 512 bytes of internal data flash memory, which store configuration information. The information includes nominal capacity and voltage, self-discharge rate, rate compensation factors, and other programmable cell-modeling factors used to accurately adjust remaining capacity for use-conditions based on time, rate, and temperature. The bq2083−V1P2 also automatically calibrates or learns the true battery capacity in the course of a discharge cycle from programmable near full to near empty levels. The bq29311 AFE protection IC provides power to the bq2083−V1P2 from a 3 or 4 series Li-ion cell stack, eliminating the need for an external regulator circuit.
38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20
VSSD N/C N/C CLKOUT XCK1 XCK2 FILT VDDA VSSA VSSA SR1 SR2 MRST N/C LED1 LED2 LED3 LED4 LED5
NC − No internal connection AVAILABLE OPTIONS TA PACKAGE 38-PIN TSSOP (DBT)
bq2083-V1P2
SLUS573 − JULY 2003
SBSĆCOMPLIANT GAS GAUGE IC FOR USE WITH THE bq29311
FEATURES D Provides Accurate Measurement of Available D D D Drives 3-, 4-, or 5-Segment LED Display for D
BLOCK DIAGRAM
Pack+ Charge/Discharge Power FETs Supply Voltage SMBus LDO bq29311 bq2083−V1P2 Glueless Interface Cell Inputs Safety Control Level Translator + − + Li-Ion − Cells + −