CFX12_02_Intro_CFX
合集下载
CFX系列快速操作指南及注意事项
28.确定样品设置后点击“Next”或者 准备运行系统。点击 设备自动打开样品槽，按照设置好的样品位置放置好样品，然后点击 关闭样品槽。热盖闭合后点击 ，设备询问数据存放的位置，确定后开始运行。
29.程序运行时可对PCR程序循环数、样品类型进行实施再编辑，也可编辑新的实验方案或者分析数据。
注意事项：
18.5.3 选择欲使用的样品孔位置后，在 下拉菜单里指定样品类型，此例为standard标准品。
19.5.4在 打勾，为所选样品指定荧光类型（此例为SYBR），根据实验需要，还可在后面的输入扩增基因名称。
20.5.5 根据需要可在 为输入所选样品孔位的样品名称。
21.5.6 如果样品设置有重复，可在 里逐一指定，或者点击 快速设置重复。 中分别填入重复的数量以及起始重复编号， 可指定重复放置的方向，点击 即可。
5.4.1新建或编辑热循环程序时，可在图形或文字区域输入各步骤设定温度、时间值。
6.4.2 ：插入一个普通温控步骤；
7.4.3 ：插入温度梯度步骤；
8.4.4 ：插入热循环范围，须在插入后输入循环起始步骤和循环次数；
9.4.5 ：插入熔解曲线分析步骤；
10.4.6 ：插入荧光采集步骤；
11.4.7 ：对当前温控步骤的变温速率及方式进行调节；
12.4.8 ：删除当前温控步骤；
13.4.9 里应输入PCR反应液体积（此例为25微升）
14.4.10 编辑好热循环程序后点击OK保存。
15.确定热循环程序后点击“Next”或 标签进入样品位置及类型设定。“Create New”可新建样品设置，“Select”可调用已有样品设置，“Express load”下拉菜单可选择各种标准样品设置，“Edit Selected”可对选中的热循环程序进行编辑。新建和编辑按下面步骤进行：
29.程序运行时可对PCR程序循环数、样品类型进行实施再编辑，也可编辑新的实验方案或者分析数据。
注意事项：
18.5.3 选择欲使用的样品孔位置后，在 下拉菜单里指定样品类型，此例为standard标准品。
19.5.4在 打勾，为所选样品指定荧光类型（此例为SYBR），根据实验需要，还可在后面的输入扩增基因名称。
20.5.5 根据需要可在 为输入所选样品孔位的样品名称。
21.5.6 如果样品设置有重复，可在 里逐一指定，或者点击 快速设置重复。 中分别填入重复的数量以及起始重复编号， 可指定重复放置的方向，点击 即可。
5.4.1新建或编辑热循环程序时，可在图形或文字区域输入各步骤设定温度、时间值。
6.4.2 ：插入一个普通温控步骤；
7.4.3 ：插入温度梯度步骤；
8.4.4 ：插入热循环范围，须在插入后输入循环起始步骤和循环次数；
9.4.5 ：插入熔解曲线分析步骤；
10.4.6 ：插入荧光采集步骤；
11.4.7 ：对当前温控步骤的变温速率及方式进行调节；
12.4.8 ：删除当前温控步骤；
13.4.9 里应输入PCR反应液体积（此例为25微升）
14.4.10 编辑好热循环程序后点击OK保存。
15.确定热循环程序后点击“Next”或 标签进入样品位置及类型设定。“Create New”可新建样品设置，“Select”可调用已有样品设置，“Express load”下拉菜单可选择各种标准样品设置，“Edit Selected”可对选中的热循环程序进行编辑。新建和编辑按下面步骤进行：
multiphase_cfx12
• Possible to change default model constants • Possible to over-ride with user’s own sub-model, using CEL. • Both may be done on a per-domain or per-wall basis.
G
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RPI Wall Boiling: Sub Models
• Several Sub Models: • Nucleation site density (Lemmart and Chawla)
n = nref ((Twall − Tsat ) / ∆Tref )1.805 nref = 7.9376 m −2 , ∆Tref = 10 K
d dep = d ref exp(− (Tsat − Tliq ) Tref )
• Bubble Departure Diameter (Tolubinsky and Kostanchuk)
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RPI Wall Boiling: Sub Models
• Sub-Model Defaults – Originally tuned for pressurised water – May need retuning for other situations
RPI Wall Boiling Model • Determines Heat Flux Partition at Wall:
G
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ANSYS, Inc. Proprietary
RPI Wall Boiling: Sub Models
• Several Sub Models: • Nucleation site density (Lemmart and Chawla)
n = nref ((Twall − Tsat ) / ∆Tref )1.805 nref = 7.9376 m −2 , ∆Tref = 10 K
d dep = d ref exp(− (Tsat − Tliq ) Tref )
• Bubble Departure Diameter (Tolubinsky and Kostanchuk)
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ANSYS, Inc. Proprietary
RPI Wall Boiling: Sub Models
• Sub-Model Defaults – Originally tuned for pressurised water – May need retuning for other situations
RPI Wall Boiling Model • Determines Heat Flux Partition at Wall:
cfx快速梯度荧光定量pcr仪正式版(18页)
选中全部 孔, 点击Clear Wells 。清除所用孔信息 。
编 辑 Plate
样品放置 位置
选择正确 荧光信号名称
设置样品 类型
加载荧光信 号名称, 输 入基因名字
输入样品处 理信息
设置平行反复
设置标准品 起始浓度
设置相对 定量信息
编 辑 Plate
确定内参基因
确定样品处理组对照
试验结果分析-标准曲线
Protocol- 试 验 反 应 程 序 设 置
点击Edit进入编辑界面 。 依据实际反应体系, 更改sample volume 。 依据预混液条件更改预变性温度 、时间及延伸时间。
Plate设 置
在Express Loading下拉菜单中直接加载全板扫描 Qu ick Plate_96_wells_SYBR Only适适用于一个反应管中仅有SYBR或FAM 探针 Qu ick Plate_ 9 6 _ wells_ All Channels适 适 用 于 一 个 反 应 管 中 含 有 多 条 探 针
。
试验结果分析-熔解曲线
在Melt Curve下查看熔解曲线 鼠标右击图片区域可Copy或保留为图片格式 。
熔解曲线 原始图
熔解曲线 负导图
Tm值
试验结果分析-标准曲线
在Melt Curve Data下查看Tm值 。 鼠标右击可将数据输出到Excel表。
试验结果分析-相对定量
在Gene Expr ee s ion里查看相对定量结果 鼠 标 右 击 相 对 定 量 数 据 区 域 可 将 数 据 输 出 至 Excel表
在 Quantifi cation下 可 查 看 扩 增 曲 线 , 标 准 曲 线 鼠标右击图片区域可Copy或保留为图片格式 。
编 辑 Plate
样品放置 位置
选择正确 荧光信号名称
设置样品 类型
加载荧光信 号名称, 输 入基因名字
输入样品处 理信息
设置平行反复
设置标准品 起始浓度
设置相对 定量信息
编 辑 Plate
确定内参基因
确定样品处理组对照
试验结果分析-标准曲线
Protocol- 试 验 反 应 程 序 设 置
点击Edit进入编辑界面 。 依据实际反应体系, 更改sample volume 。 依据预混液条件更改预变性温度 、时间及延伸时间。
Plate设 置
在Express Loading下拉菜单中直接加载全板扫描 Qu ick Plate_96_wells_SYBR Only适适用于一个反应管中仅有SYBR或FAM 探针 Qu ick Plate_ 9 6 _ wells_ All Channels适 适 用 于 一 个 反 应 管 中 含 有 多 条 探 针
。
试验结果分析-熔解曲线
在Melt Curve下查看熔解曲线 鼠标右击图片区域可Copy或保留为图片格式 。
熔解曲线 原始图
熔解曲线 负导图
Tm值
试验结果分析-标准曲线
在Melt Curve Data下查看Tm值 。 鼠标右击可将数据输出到Excel表。
试验结果分析-相对定量
在Gene Expr ee s ion里查看相对定量结果 鼠 标 右 击 相 对 定 量 数 据 区 域 可 将 数 据 输 出 至 Excel表
在 Quantifi cation下 可 查 看 扩 增 曲 线 , 标 准 曲 线 鼠标右击图片区域可Copy或保留为图片格式 。
cfx参数
11.2. Command-Line Options and Keywords for cfx5solve
The command-line options for cfx5solve are described below. To see command-line help, run cfx5solve -help.
Command-Line Options -file <file>
Alternative form le <file>
Usage the run from the specified CFX-Solver results file. The mesh from the CFX-Solver input file is used unless the -use-mesh-from-iv option is also specified. Only one -continue-from-file argument can be supplied. See Continuing the History in the CFX-Solver Modeling Guide for more details.
-ansys-install ation <directory>
-ansys-jobname <name>
-ansys-license <licensekey>
-ansys-restart <file>
Causes the flow solver to write a backup file every <elapsed time -bak-elapsed-t frequency> hours, minutes, -baket ime <elapsed seconds, et cetera. Elapsed time <elapsed time time must be in quotes and have units in frequency> frequency> square brackets. For example: -baket “10 [min]” or -baket “5 [hr]”. -batch Starts CFX-Solver in batch mode (that is, without starting the CFX-Solver Manager interface). Reads Command Language from the named file, and uses it to provide
The command-line options for cfx5solve are described below. To see command-line help, run cfx5solve -help.
Command-Line Options -file <file>
Alternative form le <file>
Usage the run from the specified CFX-Solver results file. The mesh from the CFX-Solver input file is used unless the -use-mesh-from-iv option is also specified. Only one -continue-from-file argument can be supplied. See Continuing the History in the CFX-Solver Modeling Guide for more details.
-ansys-install ation <directory>
-ansys-jobname <name>
-ansys-license <licensekey>
-ansys-restart <file>
Causes the flow solver to write a backup file every <elapsed time -bak-elapsed-t frequency> hours, minutes, -baket ime <elapsed seconds, et cetera. Elapsed time <elapsed time time must be in quotes and have units in frequency> frequency> square brackets. For example: -baket “10 [min]” or -baket “5 [hr]”. -batch Starts CFX-Solver in batch mode (that is, without starting the CFX-Solver Manager interface). Reads Command Language from the named file, and uses it to provide
CFX_Intro_12.0_WS_TOC
Disclaimer Notice:
This document has been reviewed and approved in accordance with the ANSYS, Inc. Documentation Review and Approval Procedures. “This ANSYS Inc. software product (the Program) and program documentation (Documentation) are furnished by ANSYS, Inc. under an ANSYS Software License Agreement that contains provisions concerning non-disclosure, copying, length and nature of use, warranties, disclaimers and remedies, and other provisions. The Program and Documentation may be used or copied only in accordance with the terms of that License Agreement.”
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Table of Contents
Ansys 12.0 CFX 官方教程 12
– Flow though propellers, axial turbine blades, radial pump impellers, etc.
Translational motion:
– Train moving in a tunnel, longitudinal sloshing of fluid in a tank, etc.
General rigid-body motion
– Boat hulls, etc.
Boundary deformations
– Flap valves, flexible pipes, blood vessels, etc.
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Topics Domain Motion
– Rotating Fluid Domains
Single Frame of Reference Multiple Frames of Reference
– Frame Change Models – Pitch Change
Training Manual
Moving Zones
Overview of Moving Zones
Training Manual
Many engineering problems involve flows through domains which contain moving components Rotational motion:
x
Domain
Mesh Deformation – Domain changes shape as a function of time
Translational motion:
– Train moving in a tunnel, longitudinal sloshing of fluid in a tank, etc.
General rigid-body motion
– Boat hulls, etc.
Boundary deformations
– Flap valves, flexible pipes, blood vessels, etc.
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Topics Domain Motion
– Rotating Fluid Domains
Single Frame of Reference Multiple Frames of Reference
– Frame Change Models – Pitch Change
Training Manual
Moving Zones
Overview of Moving Zones
Training Manual
Many engineering problems involve flows through domains which contain moving components Rotational motion:
x
Domain
Mesh Deformation – Domain changes shape as a function of time
Ansys_12.0_CFX_官方教程__10(Heat Transfer)
• The radiation only interacts with the boundaries of the domain
– Optically thick/dense means that the fluid absorbs and re-emits the radiation
• For optically thick media the P1 model is a good choice
– Many combustion simulations fall into this category since combustion gases tend to absorb radiation – The P1 models gives reasonable accuracy without too much computational effort
1) Rosseland Model (Diffusion Approximation Model) 2) P-1 Model (Gibb’s Model/Spherical Harmonics Model) 3) Discrete Transfer Model (DTM) (Shah Model) 4) Monte Carlo Model (not available in the ANSYS CFD-Flo product)
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Heat Transfer
Governing Equations
Training Manual
• For multicomponent flows, reacting flows and radiation modeling additional terms are included in the energy equation
– Optically thick/dense means that the fluid absorbs and re-emits the radiation
• For optically thick media the P1 model is a good choice
– Many combustion simulations fall into this category since combustion gases tend to absorb radiation – The P1 models gives reasonable accuracy without too much computational effort
1) Rosseland Model (Diffusion Approximation Model) 2) P-1 Model (Gibb’s Model/Spherical Harmonics Model) 3) Discrete Transfer Model (DTM) (Shah Model) 4) Monte Carlo Model (not available in the ANSYS CFD-Flo product)
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Heat Transfer
Governing Equations
Training Manual
• For multicomponent flows, reacting flows and radiation modeling additional terms are included in the energy equation
cfx超频参数
cfx超频参数CFX超频参数，也被称为CPU超频参数，指的是一些用于控制CPU运行速度的设置，可以让CPU以更高的频率运行，从而提升计算性能。
CPU超频主要有两种方式，一种是通过BIOS设置超频参数，另一种是使用专业的CPU 超频工具来设置参数。
下面介绍一些常见的CFX超频参数，以及它们的作用和设置方法。
1.主频主频是CPU的工作频率，以MHz为单位，每秒钟可以进行多少次数据处理。
通过提高主频可以提高CPU的运行速度，从而提升计算性能。
CFX超频设置中，主频有时也被称为基础频率（Base Frequency），可以通过BIOS设置或CPU超频工具来调整。
2.倍频倍频是指CPU内部时钟信号的倍数，也是提高CPU频率的一种方式。
在主频不变的情况下，提高倍频可以增加CPU的运行速度。
CFX超频设置中，倍频通常通过BIOS设置来调整，不同型号的CPU支持的倍频不同。
3.电压CPU电压指的是CPU芯片内部工作时所需要的电压，不同的CPU型号和频率需要不同的电压。
一般情况下，提高CPU的频率需要增加电压来保证稳定性。
电压是CPU超频中比较重要的一个参数，过高的电压可能会损坏CPU，而过低的电压会导致稳定性问题。
调整电压需要非常小心，最好在厂家推荐的范围内进行设置。
4.温度监控超频后CPU温度会比正常运行时更高，因此需要注意CPU的散热问题。
CFX超频设置中通常包括温度监控功能，可以实时监测CPU的温度并调整风扇转速以保持散热效果。
需要注意的是，超频会增加CPU的热量产生，尤其是在高压和高频率下。
因此，保持良好的散热是超频成功的关键之一。
5.超频测试超频后的CPU需要经过稳定性测试，以确保其能够稳定运行。
CFX超频设置中通常有稳定性测试功能，可以进行自动化测试评估CPU的性能表现和稳定性。
测试的方法有多种，例如使用硬件监测工具记录CPU的温度、电压、频率等参数，并进行多个小时的不断运行，以确定CPU是否能够稳定工作。
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• By completing the operation from the previous page, notice the linkage here is only at the Model level and above. • In this case there would be no thermal/structurnch and CFX Workflow
The Workbench Environment
Training Manual
• For most situations the Workbench GUI is divided into 2 primary sections (there are other optional sections we’ll see in a moment):
• Unfulfilled: missing upstream data. • Attention required: may need to correct this or upstream cells.
Training Manual
• Refresh required: upstream data has changed. Need to refresh cell. An update will also refresh the cell and regenerate any output data (e.g. mesh, results). • Update required: the data has changed and the output of the cell must be regenerated. • Up to date. • Input changes pending: cell is locally up to date but may change when the next update is performed due to upstream changes. • Interrupted: solver was manually stopped before it finished. Can use Resume or Update to continue to solving. • Pending: a batch process is in progress
• By dropping applications and/or analyses into various locations in the schematic, an overall analysis project is defined. • “Connectors” indicate the level of collaboration between systems. • In the example shown a structural system is dragged and dropped onto a thermal system at the Model cell (A4). • Before completing the operation notice there are a number of optional “drop” locations that will provide various types of linkage between systems (continued next page).
Training Manual
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Workbench and CFX Workflow
The Project Schematic
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Workbench and CFX Workflow
The Project Schematic
• Identifying cell states:
Workbench and CFX Workflow
The Project Schematic
Training Manual
• In this example a Static Structural analysis type is selected for the project schematic. • From the toolbox the selection can be dragged and dropped onto the schematic or simply double clicked.
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Workbench and CFX Workflow
The Project Schematic
Training Manual
• A schematic can also be constructed by RMB and choosing to “Transfer Data To New” or “Transfer Data From New”. • In using the RMB transfer feature all transfer possibilities (upstream and downstream) are displayed. • These selections will vary depending on which cell in a particular system you highlight.
• Notice too each system block is given an alphabetic designation (A, B, C, etc.).
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The Toolbox
The Project Schematic
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Workbench and CFX Workflow
• Blocks of cells can be deleted by RMB menu selection.
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Workbench and CFX Workflow
The Project Schematic
Training Manual
– Various applications that can be accessed to build, or expand, analysis systems.
• Custom Systems:
– Predefined analysis systems for coupled applications (FSI, thermalstress, etc.). Users can also create their own predefined systems.
Notice, the candidate “drop” location indicates data will be shared from fields A2 to A4, and transferred from A6.
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Chapter 2 Introduction to Workbench and CFX Workflow
Introduction to CFX
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Workbench and CFX Workflow
The Project Schematic
Training Manual
• By dropping the structural system at the “Solution” level we obtain a structural system that is coupled to the thermal solution.
• Design Exploration:
– Parametric management and optimization tools.
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Workbench and CFX Workflow