LED照明设计手册_美国Cree公司

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LED照明设计手册_美国Cree公司

LED照明设计手册_美国Cree公司

LED照明设计手册_美国Cree公司LED照明设计手册完全版本文详细讨论LED照明系统设计的六个设计步骤:(1) 确定照明需求;(2) 确定设计目标估计光学;(3 ) 热和电气系统的效率;(4) 计算需要的LED数量;(5) 对所有的设计可能都予以考虑,从中选择最佳设计;(6) 完成最后步骤。

虽然本文以一个室内照明设计为例,但所述的设计过程可以用于任何LED 照明设计中。

现在的照明应用LED,具有普通照明所需的亮度、效率、使用寿命、色温以及白点稳定性。

因此,绝大多数普通照明应用设计中都采用这类LED,包括路面、停车区以及室内方向照明。

在这些应用中,由于无需维护(因为LED的使用寿命比传统灯泡的要长得多)且能耗降低,所以基于LED的照明降低了总体拥有成本(TCO)。

全世界有200亿以上的灯具使用白炽、卤素或荧光灯。

其中许多灯具用作方向照明,但都是采用在所有方向发光的灯。

美国能源部(DOE)称,在新住宅建筑里,嵌顶灯是安装最普遍的照明灯。

此外,DOE报告称,采用非反射灯的嵌顶灯一般效率只有50%,就是说,这类灯所产生光的一半都浪费到灯具内了。

相反,照明级LED具有至少50,000小时的高效、方向性照明。

利用照明级LED的所有优点设计的室内照明有以下优点:1 功效超过所有白炽灯和卤素灯具2 能与甚至最好的CFL(紧凑荧光)嵌顶灯的性能相媲美3 与这些灯具相比,需要维修前的寿命要长5到50倍4 降低光对环境的影响:不含汞、电站污染小、垃圾处理费用低。

照明还是灯?在普通照明中设计LED需要在两种方法间作出选择,是设计基于LED的完整的照明,还是设计安装到已有灯具上的基于LED的灯。

一般来说,一个完整的照明设计,其光学、热和电气性能要好于式样翻新的灯,因为现有灯具不会约束设计。

对目标应用,到底是新照明的总体系统性能重要还是式样翻新的灯的方便性更重要,这要由设计师来决定。

针对已有照明的设计方法如果目标应用采用构造新型LED照明更好,那么就设计照明的光输出,使其相当于或者超过现有照明匹配具有多种优点。

Cree DS30 Luxeon V Star LED产品说明书

Cree DS30 Luxeon V Star LED产品说明书

power light source Luxeon V Star• • • • • • • •TMTechnical Data DS302Portable (flashlight, bicycle) Architectural Detail Lighting DecorativeFiber Optic Alternative Medical ApplicationsLCD Backlights / Light GuidesLuxeon is a revolutionary, energy efficient and ultra compact new light source, combining the lifetime and reliability advantages of Light EmittingDiodes with the brightness of conventional lighting.Luxeon Power Light Sources give you total design freedom andunmatched brightness, creating a new world of light.The Luxeon V offers extreme luminous density, providing lumens per package of 4X a standard Luxeon or up to 50X that of alternative solid state light sources creating new opportunities for solid state lighting todisplace conventional lighting technologies.For high volume applications, custom Luxeon power light source designsare available upon request, to meet your specific needs.Luxeon V Star is available in green, blue,royal blue and cyan.Side EmittingOptical Characteristics at 700mA, Junction Temperature, T J = 25o CRadiation Dominant Wavelength [1] λD or Peak Wavelength [2] λP SpectralHalf-Width [3](nm )Temperature Coefficient of Dominant Wavelength(nm /oC) Pattern Color Min. Typ. Max. ∆λ1/2∆λD / ∆ΤJGreen 520 nm 530 nm 550 nm 35 0.04LambertianCyan 490 nm 505 nm 520 nm 30 0.04Blue460 nm 470 nm 490 nm 25 0.04Royal Blue [2]440 nm 455 nm 460 nm 20 0.04Green 520 nm 530 nm 550 nm 35 0.04 Side EmittingCyan 490 nm 505 nm 520 nm 30 0.04 Blue460 nm 470 nm 490 nm 25 0.04Royal Blue [2]440 nm 455 nm 460 nm 20 0.04Optical Characteristics at 700mA,Junction Temperature, T J = 25o C, ContinuedRadiation patternColor Total included angle [4](degree) θ0.90V viewing angle [5](degree) 2θ 1/2Green 150 150Lambertian Cyan 150 150Blue 150 150Royal Blue 150 150Notes: (for all three optical tables)1. Dominant wavelength is derived fromthe CI E 1931 Chromaticity diagram and represents the perceived color. Lumileds maintains a tolerance of ± 0.5nm for dominant wavelength measurements. 2. Royal Blue product is binned by radiometric power and peak wavelength rather than photometric lumens and dominant wavelength.Lumileds maintains a tolerance of ± 2nm for peak wavelength measurements. 3. Spectral width at ½ of the peakintensity.4. Total angle at which 90% of totalluminous flux is captured.5. θ½ is the off axis angle from lampcenterline where the luminous intensity is ½ of the peak value.6. Cumulative flux percent within ± 45°from optical axis.7. Off axis angle from lamp centerlinewhere the luminous intensityreaches the peak value. On axispeak may be higher than off axispeak.8. All products built with I ndium Gallium Nitride (I nGaN).9. Blue and Royal Blue power lightsources represented here are I EC825Class 2 for eye safety .Optical Characteristics at 700mA,Junction Temperature, T J = 25o C, ContinuedRadiation Typical total flux percentwithin first 45°[6]Typical angle ofpeak intensity [7]Pattern Color Cum Φ45° θPEAKGreen <30% 75° - 85° Side Emitting Cyan <30% 75° - 85° Blue <30% 75° - 85°Royal blue<30% 75° - 85°Electrical Characteristics at 700mA, Junction Temperature, T J = 25o CForward Voltage V F (V)[1] Dynamicresistance [2]Temperature coefficient of forwardvoltage [3](mV/o C) Thermal resistance, junction to board Color Min. Typ. Max. (Ω) R D ∆V F / ∆T J(o C/W) R θJ-BGreen5.436.84 8.31 1.0 -4.0 11 Cyan 5.43 6.84 8.31 1.0 -4.0 11 Blue 5.43 6.84 8.31 1.0 -4.0 11 Royal Blue 5.43 6.84 8.31 1.0 -4.011Absolute Maximum RatingsParameterGreen/Cyan/ Blue/Royal BlueDC Forward Current (mA) [1]700Peak Pulsed Forward Current (mA) 1000Average Forward Current (mA)700ESD Sensitivity [2]± 16,000V HBMLED Junction Temperature (oC)135Notes:1. Proper current derating must beobserved to maintain junctiontemperature below the maximum. For more information, consult Luxeon Design Guide, available upon request. 2. LEDs are not designed to be driven in reverse bias. Please consult Lumileds’ Application Brief AB11 for further information.3. Allowable board temperature toavoid exceeding maximum junction temperature at maximum V f limit at 700 mA based on thermal resistance of Star assembly.Aluminum-Core PCB Temperature (o C)[3]70Storage & Operating Temperature (oC) -40 to +120Wavelength Characteristics, T J = 25o C0.00.20.40.60.81.0400450500550600650700Wavelength (nm)R e l a t i v e S p e c t r a l P o w e r D i s t r i b u t i o nGREENCYANBLBLUEROYAL BLUENotes:1. Lumileds maintains a tolerance of± 0.06V on forward voltage measurements.2. Dynamic resistance is the inverse ofthe slope in linear forward voltage model for LEDs. See Figure 3. 3. Measured between 25o C ≤ TJ ≤110o C at I F = 700mA.Figure 1.Relative I ntensity vs. Wavelength.Light Output Characteristics5060708090100110120130140150-20020406080100120Junction Temperature, T J(oC)R e l a t i v e L i g h t O u t p u t (%)Green Photometric Cyan Photometric Blue Photometric Royal Blue RadiometricFigure 2.Relative Light Output vs. Junction Temperature.Figure 2a. Relative Light Output vs. Junction Temperature for White, Green, Cyan, Blue and Royal Blue.Forward Current Characteristics, T J = 25o C1002003004005006007008000.01.02.03.04.05.06.07.08.0V F - Forw ard Voltage (Volts)I F - A v e r a g e F o r w a r d C u r r e n t (m A )Figure 3.Forward Current vs. Forward Voltage.00.20.40.60.811.20I F - Average Forw ard Current (mA)N o r m a l i z e d R e l a t i v e L u m i n o u s F l u x100200300400200 400 600 800Figure 4.Relative Luminous Flux vs. Forward Current at T J = 25o C maintained.Current Derating Curve Figure 5.Maximum Forward Current vs. Ambient Temperature. Derating based on T JMAX = 135 o C.01002003004005006007008000255075100125150T A- Ambient Temperature (οC)I F - F o r w a r d C u r r e n t (m A )R θJ-A =20o C/WR θJ-A=15oC/WNote:Additional heatsinking is required, even for extremely brief periods. Please consult AB05, Luxeon Thermal Design Guide, for additional information.Representative Typical Spatial Radiation PatternLambertian Radiation Pattern 0 1020 30 40 5060 70 80 90 100 -100 -80 -60 -40 -20 0 20406080100Angular Displacement (Degrees) Typical Upper BoundTypical Lower Bound Figure 6.Representative Typical Spatial Radiation Pattern for Luxeon V Star.Side Emitting Radiation PatternFigure 7.Representative Typical Spatial Radiation Pattern for Luxeon V Star.102030405060708090100-120-100-80-60-40-2020406080100120Angular Displacement (Degrees)R e l a t i v e I n t e n s i t y (%)。

Cree 1212 UV LED 产品说明书

Cree 1212 UV LED 产品说明书

Dimensions: [mm]11153283407A212153283407A212153283407A212153283407A212B C(mm)B(mm)± 2,0min.1.5153283407A212T e m p e r a t u r eT pT L153283407A212Cautions and Warnings:The following conditions apply to all goods within the product series of Optoelectronic Components of Würth Elektronik eiSos GmbH & Co. KG:General:•This optoelectronic component is designed and manufactured for use in general electronic equipment.•Würth Elektronik must be asked for written approval (following the PPAP procedure) before incorporating the components into any equipment in fields such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network, etc. where higher safety and reliability are especially required and/or if there is the possibility of direct damage or human injury.•Optoelectronic components that will be used in safety-critical or high-reliability applications, should be pre-evaluated by the customer •The optoelectronic component is designed and manufactured to be used within the datasheet specified values. If the usage and operation conditions specified in the datasheet are not met, the wire insulation may be damaged or dissolved.•Do not drop or impact the components, the component may be damaged•Würth Elektronik products are qualified according to international standards, which are listed in each product reliability report. Würth Elektronik does not warrant any customer qualified product characteristics beyond Würth Elektroniks’ specifications, for its validity and sustainability over time.•The responsibility for the applicability of the customer specific products and use in a particular customer design is always within the authority of the customer. All technical specifications for standard products also apply to customer specific products.•Unless Würth Elektroik has given its express consent, the customer is under no circumstances entitled to reverse engineer, disassemble or otherwise attempt to extract knowledge or design information from the optoelectronic componentProduct specific:Soldering•The solder profile must comply with the technical product specifications. All other profiles will void the warranty.•All other soldering methods are at the customers’ own risk.•The soldering pad pattern shown above is a general recommendation for the easy assembly of optoelectronic component. If a high degree of precision is required for the selected application (i.e. high density assembly), the customer must ensure that the soldering pad pattern is optimized accordingly.Cleaning and Washing:•Washing agents used during the production to clean the customer application might damage or change the characteristics of the optoelectronic component body, marking or plating. Washing agents may have a negative effect on the long-term functionality of the product. •Using a brush during the cleaning process may break the optoelectronic component body. Therefore, we do not recommend using a brush during the PCB cleaning process.Potting:•If the product is potted in the customer application, the potting material might shrink or expand during and after hardening. Shrinking could lead to an incomplete seal, allowing contaminants into the optoelectronic component body, pins or termination. Expansion could damage the components. We recommend a manual inspection after potting to avoid these effects.Storage Conditions:• A storage of Würth Elektronik products for longer than 12 months is not recommended. Within other effects, the terminals may suffer degradation, resulting in bad solderability. Therefore, all products shall be used within the period of 12 months based on the day of shipment.•Do not expose the optoelectronic component to direct sunlight.•The storage conditions in the original packaging are defined according to DIN EN 61760-2.•For a moisture sensitive component, the storage condition in the original packaging is defined according to IPC/JEDEC-J-STD-033. It is also recommended to return the optoelectronic component to the original moisture proof bag and reseal the moisture proof bag again. •The storage conditions stated in the original packaging apply to the storage time and not to the transportation time of the components. Packaging:•The packaging specifications apply only to purchase orders comprising whole packaging units. If the ordered quantity exceeds or is lower than the specified packaging unit, packaging in accordance with the packaging specifications cannot be ensured. Handling:•Violation of the technical product specifications such as exceeding the nominal rated current, will void the warranty.•The product design may influence the automatic optical inspection.•Certain optoelectronic component surfaces consist of soft material. Pressure on the top surface has to be handled carefully to prevent negative influence to the function and reliability of the optoelectronic components.•ESD prevention methods need to be applied for manual handling and processing by machinery.•Resistors for protection are obligatory.•Luminaires in operation may harm human vision or skin on a photo-biological level. Therefore direct light impact shall be avoided. •In addition to optoelectronic components testing, products incorporating these devices have to comply with the safety precautions given in IEC 60825-1, IEC 62471 and IEC 62778•Please be aware that Products provided in bulk packaging may get bent and might lead to derivations from the mechanical manufacturing tolerances mentioned in our datasheet, which is not considered to be a material defect.Please be aware that Products provided in bulk packaging may get bent and might lead to derivations from the mechanical manufacturing tolerances mentioned in ourdatasheet, which is not considered to be a material defect.Würth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODDoK001.0002022-02-21DIN ISO 2768-1mDESCRIPTIONWL-SUTW SMT Ultraviolet TopLEDWaterclear ORDER CODE153283407A212SIZE/TYPE BUSINESS UNIT STATUS PAGETechnical specification:•The typical and/or calculated values and graphics of technical parameters can only reflect statistical figures. The actual parameters of each single product, may differ from the typical and/or calculated values or the typical characteristic line.•On each reel, only one bin is sorted and taped. The bin is defined on intensity, chromaticity coordinate or wavelength and forward voltage.•In order to ensure highest availability, the reel binning of standard deliveries can vary. A single bin cannot be ordered. Please contact us in advance, if you need a particular bin sorting before placing your order.•Test conditions are measured at the typical current with pulse duration < 30ms. •Optical properties are measured according the CIE 127:2007 standard. •Wavelength tolerance under measurement conditions ± 2nm. •Optical intensity tolerance under measurement conditions ±15%. •Forward voltage tolerance under measurement conditions ± 0.1V.•CCT tolerance of x and y coordinate of ± 0.01 and CRI tolerance of ± 2 is allowed.In the characteristics curves, all values given in dotted lines may show a higher deviation than the parameters mentioned above.These cautions and warnings comply with the state of the scientific and technical knowledge and are believed to be accurate and reliable.However, no responsibility is assumed for inaccuracies or incompleteness.The customer has the sole responsibility to ensure that he uses the latest version of this datasheet, which is available on Würth Elektronik’s homepage. Unless otherwise agreed in writing (i.e. customer specific specification), changes to the content of this datasheet may occurwithout notice, provided that the changes do not have a significant effect on the usability of the optoelectronic componentsWürth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 174638 Waldenburg GermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCEPROJECTION METHODDoK001.0002022-02-21DIN ISO 2768-1mDESCRIPTIONWL-SUTW SMT Ultraviolet TopLED WaterclearORDER CODE153283407A212SIZE/TYPEBUSINESS UNITSTATUSPAGEImportant NotesThe following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG:1. General Customer ResponsibilitySome goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general suitability for certain application areas. These statements about suitability are based on our knowledge and experience of typical requirements concerning the areas, serve as general guidance and cannot be estimated as binding statements about the suitability for a customer application. The responsibility for the applicability and use in a particular customer design is always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to investigate and decide whether the device with the specific product characteristics described in the product specification is valid and suitable for the respective customer application or not.2. Customer Responsibility related to Specific, in particular Safety-Relevant ApplicationsIt has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the usual lifetime cannot be completely eliminated in the current state of the art, even if the products are operated within the range of the specifications.In certain customer applications requiring a very high level of safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health it must be ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is caused to third parties in the event of malfunction or failure of an electronic component. Therefore, customer is cautioned to verify that data sheets are current before placing orders. The current data sheets can be downloaded at .3. Best Care and AttentionAny product-specific notes, cautions and warnings must be strictly observed. Any disregard will result in the loss of warranty.4. Customer Support for Product SpecificationsSome products within the product range may contain substances which are subject to restrictions in certain jurisdictions in order to serve specific technical requirements. Necessary information is available on request. In this case the field sales engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.5. Product R&DDue to constant product improvement product specifications may change from time to time. As a standard reporting procedure of the Product Change Notification (PCN) according to the JEDEC-Standard inform about minor and major changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should be contacted. The basic responsibility of the customer as per Section 1 and 2 remains unaffected.6. Product Life CycleDue to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products. As a standard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-Standard we will inform at an early stage about inevitable product discontinuance. According to this we cannot guarantee that all products within our product range will always be available. Therefore it needs to be verified with the field sales engineer or the internal sales person in charge about the current product availability expectancy before or when the product for application design-in disposal is considered. The approach named above does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.7. Property RightsAll the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas, development contracts as well as models or templates that are subject to copyright, patent or commercial protection supplied to the customer will remain with Würth Elektronik eiSos GmbH & Co. KG. Würth Elektronik eiSos GmbH & Co. KG does not warrant or represent that any license, either expressed or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, application, or process in which Würth Elektronik eiSos GmbH & Co. KG components or services are used.8. General Terms and ConditionsUnless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and Conditions of Würth Elektronik eiSos Group”, last version available at .Würth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODDoK001.0002022-02-21DIN ISO 2768-1mDESCRIPTIONWL-SUTW SMT Ultraviolet TopLEDWaterclear ORDER CODE153283407A212SIZE/TYPE BUSINESS UNIT STATUS PAGE。

Cree XLamp CXA1850 LED 产品数据手册说明书

Cree XLamp CXA1850 LED 产品数据手册说明书

CLD-DS88 修订版本2E E .C O M /X L A M PCree ® XLamp ®CXA1850 LED产品说明XLamp ® CXA1850是Cree 的高密度(HD) LED 阵列系列,采用12 mm 光源,使照明设备制造商能够制作以最高比70瓦陶瓷金卤灯(CMH)低50%的功率提供与其相同的光强和照明质量的新一代产品。

此款最新高密度级CXA 阵列可以提供无与伦比的流明密度,因而可降低新一代LED 聚光灯的系统成本。

CXA LED 设计指南提供要将CXA1850 LED 成功应用于灯具设计所需满足要求的基本信息。

特点• 提供4阶和2阶EasyWhite ®分档(色温:2700 K 、3000 K 、3500 K 、4000 K 、5000 K 、5700 K 和6500 K )• 提供ANSI 白光分档(相关色温为4000 K 、5000 K 、5700 K 和6500 K CCT )• 有最小显色指数为70、80及93的规格可选• 正向电压:35 V• 提供85 °C 时的分档和特性• 最大驱动电流:2100 mA • 115°视角,色度分布均匀• 上部焊接连接• 热电偶附着点• NEMA SSL-3 2011标准通量分档• 符合RoHS 规范• 通过UL 认证的元件(E349212)目录特性 .............................................2工作限值 ........................................2通量特性、EasyWhite ® LED 订购代码 和分档 ..........................................3通量特性、ANSI 白光LED 订购代码 和分档 ..........................................5相对光谱功率分布 .............................6电气特性 ........................................6相对光通量 .....................................7典型光强空间分布 .............................8性能组 – 亮度 .................................8性能组 - 色度 ..................................9绘制在CIE 1931色彩空间上的Cree EasyWhite ®分档 ....................11绘制在CIE 1931色彩空间上的Cree ANSI 白光分档 ........................11分档和订购代码格式 .........................12机械尺寸 .......................................12热设计 .........................................13说明 ............................................14包装 .. (15)特性* 请参阅“工作限值”一节。

Cree XLamp MC-E高功率LED系列应用注意事项说明书

Cree XLamp MC-E高功率LED系列应用注意事项说明书

Application NoteQuickly setup your LED Lighting solution with Cree® XLamp® MC-E series Star BoardBy: Suresh ChaudhariThis application note describes how to select Cree XLamp MC-E star board series and covers the complete lighting solution include selection of driver, optics and heatsink.At the end would like to focus on some design tips and demo setup.Table of ContentsIntroduction of Cree® XLamp® MC-E High Power LED1. (1)Cree® Star board with major features and parameters2. (2)How to select Star board based on the system requirement3. (3)Suppliers recommendation for Driver4. (4)Suppliers recommendation for Optics5. (5)Suppliers recommendation for Heatsink6. (6)Design and Application tips7. (6)Demo Setup8. (7)1. Introduction of Cree® XLamp® MC-E High Power LEDThe XLamp MC-E LED is a lighting-class, multi-chip LED that provides high lumen output in a small footprint package. Compared to discrete LEDs, XLamp MC-E LEDs reduce the distance between LED die, creating a small optical source for excellent optical control and efficient color mixing. XLamp MC-E LEDs can reduce LED system complexity by reducing the number of components required.Cree XLamp LEDs bring high performance and quality of light to a wide range of lighting applications, including color-changing lighting, portable and personal lighting, outdoor lighting, indoor directional lighting, and entertainment lighting.Cree MC-E White LED Cree MC-E Color LEDFEATURES∙ Available in white (2600 K – 10,000 K CCT), EasyWhite™, or color (RGBW) ∙ ANSI-compatible neutral and warm white chromaticity bins ∙ Individually addressable LEDs∙ Maximum drive current: 700 mA per LED die ∙ Reflow solderable – JEDEC J-STD-020 ∙ Electrically neutral thermal path ∙RoHS and REACH-compliant2. Cree® Star board with major features and parametersFEATURES∙ 430 lm @ 350mA∙ 700mA - Max Drive Current∙ 12.8V - Typ. Forward Voltage @ 350mA (For series configuration) ∙ 13.6V - Typ. Forward Voltage @ 700mA (For series configuration) ∙ 4-Chip In Series and parallel Circuit ∙ 4-Chip Individually Addressable∙ Star board available in single color – Cool white, Neutral white and Warm white ∙no need of reflowBelow table shows different types of Star board LED configuration, depending on requirement customer can choose series, parallel or individual configuration. As an example we have selected 3 LED in different configuration.Each LED VF(typ)@350mAViewing Angle MCE4WT-A2-0000-00M02-STARIND Individual (Figure3) M 430 MCE4WT-A2-0000-00K02-STARSRSeries ( Figure1) K 370MCE4WT-A2-0000-00M02-STARPstar Parallel (Figure2) 2mm Cool White WC,WD,WG,WF M4303.2V 110deg3. How to select Star board based on the system requirementLED is available in single die or multi die, depending on its application and lux requirement either of them can be selected. Example, Cree MCE series having 4 die in a single chip means you will get more lumens output in a small footprint package so you can use for microscope illumination, high end strobe light like applications.While selecting LED Module please check below parameters as per your application requirement.∙Configuration – Series, parallel and Individual∙ Lumen output∙Output current∙Maximum output power∙Size and dimension∙ Efficiency∙When you selecting LED module please select radiation pattern Lambertain, batwing and side emitting which matches to your application. If the LED is not available in this pattern, then you can use optics to get the required output.Please also ensure whether for your application required binned LED or full distribution, for this example we are not using bin LED as application is not demanding. Depending on application you can select which bin you require like – forward voltage, color, and flux bin.Explained below with an example how to select MC-E star module as per system requirementExample - High Strobe lightingSpecification-1 meter @ 5000 lux.To get 5000 lux at 1 meter, need almost 330lm source.Here we consider height 1meter, viewing angle 14° and overall efficiency 70%.To get 330 lm source alteast need to use 3-4 LED and optics for each led, but with the use of MC-E LED the number of optics, size of MCPCB and manufacturing hours in assembling will reduce to bring down total system cost. Same explained in below picture.Part Number selected for design,Cree MC-E LED - MCE4WT-A2-0000-00K02-STARSRFraen lens - FRC-N1-MCE-0RFind the central spot “on-axis intensity” value from Fraen datasheet.Narrow Beam (Part Number: FRC-N1-MCE-0R), value is 14If the Fraen narrow reflector FRC-N1-MCE-0R is used on a cool white MC-E LED at 350 mA, the typical luminous flux of the “Group K” LED is 370 lumens.The calculation is:(14 candela/lumen) x (370 lumens) = 5180 candela peak on-axis.1 candela at 1-meter distance produces 1 Lux. This means the peak intensity at 1 meter will be 5180 lux.The intensity decreases as a function of the distance squared, so at 2 meters the peak intensity will be 5180 / (22) = 1295 lux. At 3 meters distance, the peak intensity will be 5180 / (32) = 575 lux.Range 1meter 2 meter 3 meter Illuminance 5180 lux 1295 lux 575 luxWith the help of effective reflector can achieve long beam distances (example- 200 meter).Beam photographsOnce you complete the testing and get required output, then you can paste star board with adhesive to heatsink. Then finally this assembly can be fixed with enclosure as a finished product.4. Suppliers recommendation for DriverIf the power consumption of an LED module is higher than the power of a single LED driver when designing, we can use several LED drivers or an external MOSFET to drive the module.LED drivers may need to work with various power supply voltages in illumination circuits, and it may therefore, be better to select an LED drivers that support a wide range of input voltage in order to mitigate any voltage fluctuation problems.Several suppliers including National Semiconductor, Maxim, Zetex and in driver module LIGHTECH and Lumidrives can offer relevant solutions to meet different applications requirements.Cree LED Array Vout, Iout, and Power driver requirements as below.Vout Iout (max) PowerMCE4WT-A2-0000-00K02-STARSR 13.6V 700mA 9.52WLED Driver Selection consideration∙Voltage and Current rating of driver to be selected as per LED’s configuration whether array configuration in Serial, parallel and Individual combination.∙ Efficiency∙Depends on input LED driver topology to be selected–Dc Input -Buck, Boost, Buck-Boost,–AC Input – Flyback, forward, LLC.Depending on the input voltage and output power the choice can be made for LED driver, canbe buck type, boost type, buck/boost type, and also charge-pump type. For power line drivensystem the buck type is chosen, for the single cell battery operated devices the boost type ischosen, for the system which run on both powerline and battery the buck/boost is chosen.Charge pump type is preferred if the output power is less and EMI and other noise issues.Table below show lists of drivers that meet Cree LED Array’s output voltage, output constantcurrent, and power requirements.LED Driver Selection Guide (Iout = 700mA)NOC FOCNational Semiconductor LM3407MY/NOPB350 mA, Constant CurrentOutput Floating BuckSwitching Converter forHigh Power LEDs from thePowerWise® Family4.5V to 30V350mA0.45V to27VBuck78M77351555100Zetex ZXLD1350ET5350mA LED driver withinternal switch7V to 30V 350mA 30V Buck05M21751226470Maxim MAX16803ATE+2MHz, High-BrightnessLED Drivers withIntegrated MOSFET andHigh-Side Current Sense6.5V to 65V700mA63 Buck89K32471552873*LIGHTECH 901010700PLED 10W driver 120-240Vac700mA15V Module73R3502 1797597* Lumidrives MDU9-SC-3570 LED Driver Power Supply 110-240Vac350/700mA4-32V Module20M5601 1712028* Note- Highlighted parts are LED module5. Suppliers recommendation for OpticsSecondary optics is used to modify the output beam of the LED such that the output beam of the finished lamp will efficiently meet the desired photometric specification.How to select the optics∙What is viewing angle required.∙Select beam ( narrow, medium, wide)∙Select radiation pattern ( Batwing, Lambertain, side emitting)∙If you know Illuminance + distance then you can calculate what is angle you need to select for lensTable below show lists of lens that suit with Cree MC-E LED.FOCLedil FA10613_LM1-RSLENS, REAL SPOT,CREE MCE ±10.5° 79R63001817542Fraen FRC-N1-MCE-0RFRC Series 35mm Diameter Reflectors14° - - Ledil FA10680 _CMC-OLENS, OVAL,CREE MCE ±21° x ±10° 79R63211817549Ledil C10686_EVA-MC-WLENS, WIDE, CREEMCE±18.2°79R6139 18175606. Suppliers recommendation for HeatsinkThermal resistance is a measure of the ability of the package to conduct heat from the chip to the environment.How to select the Heatsink∙ Heatsink thermal resistance value should be equal or lower than calculated value ofthermal resistance of board to ambient i.e. Rth(b-a). The lower the value, the higher the thermal performance.∙ Heat sinks should be designed to have a large surface area, use large number of finefins.∙ Material selection - Aluminium is the most common material used as a heat sink.Table below show lists of Heatsinks that equal or less than to Cree MC-E LED thermal resistance.COOLIANCE CML8001-52-10-101 LED HEAT SINK 3°C/W 99R47231847864 WAKEFIELD SOLUTIONS882-100ABLED HEAT SINK2.88°C/W96M8765-Heatsink can be customized as per end product design requirement.7. Design and Application tipsIn order to determine LED systems reliability the system designer must consider thepossible failure modes for each component. It is generally known that one of the weakest parts of an LED system is the LED driver due to the number and types of components they contains and so covered below point which effect LED drivers reliability.An LED drivers’ reliability depends upon:∙The number and quality of components used within the driver design∙Rated wattage of the driver.∙The maximum operating temperature of the electrolytic capacitors used in the driver.∙The overall efficiency of the AC-DC and DC-DC stages of the driver.∙Good driver design where component placement is determined by safety, EMC and thermal considerations.∙ A suitable thermal management system for the driver such as an aluminium case or forced air cooling fan if appropriate.The maximum LED junction temperature (Tj) provided in the data sheet, example Tj-150°C, so at certain ambient temperature you may need to back off the current so thatyou don’t exceed the maximum Tj, always refer d-rating curve graph to know what is the value of ambient and current on particular thermal value.LED drivers are typically constant current drivers that provide stable current for a single LED or LED array. LEDs used in the applications described are usually high-power LEDsof 1W or greater. These high power LEDs can produce a considerable amount of heat inoperation. This heat, if unmanaged, can degrade the lifetime, light output, forward voltageand most importantly dominant wavelength, which shifts with temperature and therefore itis advisable to consider this and incorporate sufficient thermal management into the design. Some of the Drivers work in conjunction with temperature sensors to achieve thethermal protection and management so as to improve the performance of LEDs in a variety of applications.8. Demo SetupBelow set up done for MC-E series star board.To complete the set up need∙Power supply source ( used 24V,1A rating)∙Constant Current LED Driver ( used LM3404 driver)∙Cree Star Board ( used MCE4WT-A2-0000-00K02-STARSR LED array )About element14element14 is a new, innovative information portal and eCommunity specifically built for electronic design engineers. It provides product data, design tools and technology information, whilst incorporating web 2.0 functionality to facilitate communication, interaction, collaboration and information sharing between colleagues around the world. Users can consult experts, discover trends, post blogs, articles and comments in this world-wide forum.element14 is another innovative offering from Premier Farnell plc (LSE:pfl), FTSE 250, a leader in multi-channel distribution and specialty services for electronic design engineers throughout Europe, the Americas and Asia Pacific. It has a stocked range of 450,000+ products, and access to 4,000,000 more items from 3,500 top manufacturers. The company has group sales of £804.4m and over 4,100 employees globally.For more information about the company, please visit 。

CreeXLampCXA3050LED低棚灯参考设计-CreeInc

CreeXLampCXA3050LED低棚灯参考设计-CreeInc
其各自所有者的财产,并不意味着特定的产品和/或供应商的认可、赞助或关联。
Cree, Inc. 4600 Silicon Drive Durham, NC 27703 美国电话:+1.919.313.5300
/Xlamp
XLamp CXA3050低棚灯参考设计
设计方法/目标
在“LED灯具设计指南”1 中,Cree提出了一个用于制作LED灯具和灯的六步骤框架。所有Cree参考设计均采用该框架,下表简要回顾 了本设计指南的主要内容。
基于CXA3050 LED集成阵列的低棚灯具不仅提供了能效方面的 好处,而且其长寿命也降低了通常难以维护的工业和商业应用的 维护成本。
用户完全承担因依赖本应用说明中的任何信息所产生的风险。Cree及其附属公司对有关本文件中的信息或任何按照本参考设计制造的LED灯或灯具(包括但不限于不侵犯 Cree或第三方的知识产权的灯或灯具)不作任何保证或声明,亦不承担任何相关法律责任。如果灯具制造商根据任何Cree应用说明或参考设计进行全部或部分的产品设 计,则该制造商必须全权负责确保其产品符合所有适用的法律和行业要求。
• 完成电路板布局。 • 通过制作灯具原型,来测试各个设计选择。 • 确保设计达到所有设计目标。 • 利用原型来进一步改进灯具设计。 • 记录观察结果和改进想法。
表表11:: Cree六步骤框架
六步骤法
本设计的目标是制作一款基于LED、能够替换商业、工业和仓库应用中的金属卤素和荧光灯具的低棚灯具。作为替换灯具,本设计采用与 目前使用的传统低棚照明类似的外形。
1. 确定照明要求 2. 确定设计目标
步骤
3. 估算光学系统、热系统和电气系统的效率 4. 计算所需的LED数量 5. 考虑所有设计方案并从中选出最佳方案

Cree XLamp XM-L LEDs 数据表说明书

Cree XLamp XM-L LEDs 数据表说明书

JThe following table provides several base order codes for XLamp XM-L LEDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family.ColorCCT RangeBase Order CodesMin Luminous Flux @700 mA (lm)Order Code Min.Max.Group Flux (lm)Cool White5,000 K8,300 K T5260XMLAWT-00-0000-0000T5051 T6280XMLAWT-00-0000-0000T6051Notes:• Cree maintains a tolerance of +/- 7% on flux and power measurements and +/- 2% on CRI measurements.• Typical CRI for Cool White (5,000 K - 8,300 K CCT) is 75.Characteristics Unit Minimum Typical Maximum Thermal Resistance, junction to solder point °C/W 2.5Viewing Angle (FWHM) degrees125Temperature coefficient of voltage mV/°C-3.0ESD Classification (HBM per Mil-Std-883D)Class 2DC Forward Current mA3000 Reverse Voltage V5 Forward voltage (@ 700 mA) V 2.9 3.5 Forward voltage (@ 1500 mA)V 3.1Forward voltage (@ 3000 mA)V 3.35LED Junction Temperature°C150F Relative Spectral Power20406080100400450500550600650700750R e l a t i v e R a d i a n t P o w e r (%)Wavelength (nm)5000K -8300K CCT0%10%20%30%40%50%60%70%80%90%100%255075100125150R e l a t i v e L u m i n o u s F l u xJunction Temperature (ºC)JThe maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics.0200400600800100012001400160018002000220024002600280030002.00 2.20 2.40 2.60 2.80 3.00 3.20 3.40 3.60F o r w a r d C u r r e n t (m A )Forward Voltage (V)l Design050010001500200025003000350020406080100120140M a x i m u m C u r r e n t (m A )Ambient Temperature (ºC)Rj-a = 4°C/W Rj-a = 7°C/W Rj-a = 10°C/W Rj-a = 15°C/WJ20406080100120-100-80-60-40-2020406080100R e l a t i v e L u m i n o u s I n t e n s i t y (%)Angle (º)Typical Spatial Radiation Pattern0%25%50%75%100%125%150%175%200%225%250%275%300%325%350%020040060080010001200140016001800200022002400260028003000R e l a t i v e L u m i n o u s F l u x (%)Forward Current (mA)In testing, Cree has found XLamp XM-L LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used.Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.Profile FeatureLead-Based Solder Lead-Free Solder Average Ramp-Up Rate (Ts max to Tp)3°C/second max.3°C/second max.Preheat: Temperature Min (Ts min ) 100°C 150°C Preheat: Temperature Max (Ts max )150°C 200°C Preheat: Time (ts min to ts max )60-120 seconds60-180 secondsTime Maintained Above: Temperature (T L )183°C 217°C Time Maintained Above: Time (t L )60-150 seconds60-150 secondsPeak/Classification Temperature (Tp)215°C 260°C Time Within 5°C of Actual Peak Temperature (tp)10-30 seconds 20-40 seconds Ramp-Down Rate6°C/second max.6°C/second max Time 25°C to Peak Temperature6 minutes max.8 minutes max.Note: All temperatures refer to topside of the package, measured on the package body surface.Lumen Maintenance ProjectionsCree currently recommends a maximum drive current of 1500 mA for XLamp XM-L white in designs seeking the ENERGY STAR* 35,000 hour lifetime rating (≥ 94.1% luminous flux @ 6000 hours) or 25,000-hour lifetime rating (≥ 91.8% luminous flux @ 6000 hours).Please read the XLamp Long-Term Lumen Maintenance application note for more details on Cree’s lumen maintenance testing and forecasting. Please read the XLamp Thermal Management application note for details on how thermal design, ambient temperature, and drive current affect the LED junction temperature.* These lifetime ratings are based on the current ENERGY STAR Solid State Lighting Luminaires V1.1 (December 12, 2008) and ENERGY STAR Integral LED Lamps V1.0 (December 3, 2009) lumen maintenance criteria.Moisture SensitivityIn testing, Cree has found XLamp XM-L LEDs to have unlimited floor life in conditions ≤30ºC / 85% relative humidity (RH). Moisture testing included a 168 hour soak at 85ºC / 85% RH followed by 3 reflow cycles, with visual and electrical inspections at each stage.Vision Advisory ClaimUsers should be cautioned not to stare at the light of this LED product. The bright light can damage the eye.XLamp XM-L LEDs are tested for luminous flux and placed into one of the following luminous-flux groups:Group Code Min. Luminous Flux@ 700 mA (lm)Max. Luminous Flux @ 700 mA (lm)T5260280 T6280300 U2300320Region x y Region x y Region x y Region x y0A 0.29500.29700B0.29200.30600C0.29840.31330D0.29840.3133 0.29200.30600.28950.31350.29620.32200.30480.3207 0.29840.31330.29620.32200.30280.33040.30680.3113 0.30090.30420.29840.31330.30480.32070.30090.30420R 0.29800.28800S0.28950.31350T0.29620.32200U0.30370.2937 0.29500.29700.28700.32100.29370.33120.30090.3042 0.30090.30420.29370.33120.30050.34150.30680.3113 0.30370.29370.29620.32200.30280.33040.30930.29931A 0.30480.32071B0.30280.33041C0.31150.33911D0.31300.3290 0.31300.32900.31150.33910.32050.34810.32130.3373 0.31440.31860.31300.32900.32130.33730.32210.3261 0.30680.31130.30480.32070.31300.32900.31440.31861R 0.30680.31131S0.30050.34151T0.30990.35091U0.31440.3186 0.31440.31860.30990.35090.31960.36020.32210.3261 0.31610.30590.31150.33910.32050.34810.32310.3120 0.30930.29930.30280.33040.31150.33910.31610.30592A 0.32150.33502B0.32070.34622C0.32900.35382D0.32900.3417 0.32900.34170.32900.35380.33760.36160.33710.3490 0.32900.33000.32900.34170.33710.34900.33660.3369 0.32220.32430.32150.33500.32900.34170.32900.33002R 0.32220.32432S0.31960.36022T0.32900.36902U0.32900.3300 0.32900.33000.32900.36900.33810.37620.33660.3369 0.32900.31800.32900.35380.33760.36160.33610.3245 0.32310.31200.32070.34620.32900.35380.32900.31803A 0.33710.34903B0.33760.3616 0.34510.35540.34630.3687 0.34400.34270.34510.3554 0.33660.33690.33710.34903R 0.33660.33693S0.33810.3762 0.34400.34280.34800.3840 0.34290.33070.34630.3687 0.33610.32450.33760.36165000K5700K6500K8000K0A0B0C0D0R0S0T0U1A1B1C1D2A2B2C2D3A3B1R1S1T1U2R2S2T2U3R3S0.280.290.300.310.320.330.340.350.360.370.380.390.400.280.290.300.310.320.330.340.350.36C C yCCxANSI C78.377AANSI Cool WhiteXLamp XM-L LED Standard Order Codes - WhiteMin. Luminous Flux (lm)@ 700 mA*Chromaticity Regions Kit Number Group Flux (lm)ANSI Cool White (5000 K – 8300 K)T52600A, 0B, 0C, 0D, 0R, 0S, 0T, 0U, 1A, 1B, 1C, 1D, 1R, 1S, 1T, 1U, 2A, 2B, 2C, 2D, 2R, 2S, 2T, 2U, 3A, 3B, 3R, 3S0000T5051 T62800A, 0B, 0C, 0D, 0R, 0S, 0T, 0U, 1A, 1B, 1C, 1D, 1R, 1S, 1T, 1U, 2A, 2B, 2C, 2D, 2R, 2S, 2T, 2U, 3A, 3B, 3R, 3S0000T6051 For other flux and chromaticity combinations, contact Cree or an authorized distributor.* Cree XLamp XM-L order codes specify only a minimum flux bin and not a maximum. Cree may ship reels in flux bins higher than the minimum specified by the order code without advance notice. Shipments will always adhere to the chro-maticity restrictions specified by the order code.All measurements are ±.13 mm unless otherwise indicated.5.005.000.573.020.50.52.83.84.80.5 4.83.80.54.82.7820.50.40.40.40.4 4.74.70.63.9Top View Bottom ViewSide ViewRecommended PCB Solder PadRecommended Stencil Pattern(Shaded Area Is Open)。

cree xte中文规格书

cree xte中文规格书

Q4
100
115
178
308
XTEAWT-00-0000-00000LCE7
Q5
107
123
191
330
XTEAWT-00-0000-00000LDE7
Q4
100
115
178
308
XTEAWT-00-0000-00000BCE7
Q5
107
123
191
330
XTEAWT-00-0000-00000BDF6
Q4
100
115
178
308
XTEAWT-00-0000-00000HCE6
Q5
107
123
191
330
XTEAWT-00-0000-00000HDE5
R2
114
131
203
351
XTEAWT-00-0000-00000HEF4
R3
122
140
217
376
XTEAWT-00-0000-00000HF50
* 25°C 时的通量值为计算值,仅供参考。 * 计算的通量值仅供参考。
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LED照明设计手册完全版本文详细讨论LED照明系统设计的六个设计步骤:(1) 确定照明需求;(2) 确定设计目标估计光学;(3 ) 热和电气系统的效率;(4) 计算需要的LED数量;(5) 对所有的设计可能都予以考虑,从中选择最佳设计;(6) 完成最后步骤。

虽然本文以一个室内照明设计为例,但所述的设计过程可以用于任何LED 照明设计中。

现在的照明应用LED,具有普通照明所需的亮度、效率、使用寿命、色温以及白点稳定性。

因此,绝大多数普通照明应用设计中都采用这类LED,包括路面、停车区以及室内方向照明。

在这些应用中,由于无需维护(因为LED的使用寿命比传统灯泡的要长得多)且能耗降低,所以基于LED的照明降低了总体拥有成本(TCO)。

全世界有200亿以上的灯具使用白炽、卤素或荧光灯。

其中许多灯具用作方向照明,但都是采用在所有方向发光的灯。

美国能源部(DOE)称,在新住宅建筑里,嵌顶灯是安装最普遍的照明灯。

此外,DOE报告称,采用非反射灯的嵌顶灯一般效率只有50%,就是说,这类灯所产生光的一半都浪费到灯具内了。

相反,照明级LED具有至少50,000小时的高效、方向性照明。

利用照明级LED的所有优点设计的室内照明有以下优点:1 功效超过所有白炽灯和卤素灯具2 能与甚至最好的CFL(紧凑荧光)嵌顶灯的性能相媲美3 与这些灯具相比,需要维修前的寿命要长5到50倍4 降低光对环境的影响:不含汞、电站污染小、垃圾处理费用低。

照明还是灯?在普通照明中设计LED需要在两种方法间作出选择,是设计基于LED的完整的照明,还是设计安装到已有灯具上的基于LED的灯。

一般来说,一个完整的照明设计,其光学、热和电气性能要好于式样翻新的灯,因为现有灯具不会约束设计。

对目标应用,到底是新照明的总体系统性能重要还是式样翻新的灯的方便性更重要,这要由设计师来决定。

针对已有照明的设计方法如果目标应用采用构造新型LED照明更好,那么就设计照明的光输出,使其相当于或者超过现有照明匹配具有多种优点。

首先,现有设计已经针对目标应用进行了优化,可以在围绕有关光输出、成本和工作环境而确定设计目标时提供指导。

其次,现有设计的外形尺寸已经得到认可。

如果外形尺寸相同,终端用户转换成LED照明更容易一些。

遗憾的是,有些LED照明制造商错误报告或者夸大了LED照明的效率和使用寿命特性。

在CFL替换灯泡的早期的数年,照明业也遇到了类似问题。

行业标准的缺乏,以及早期产品质量的巨大差异将CFL技术的采用推迟了很多年。

美国能源部意识到了早期LED照明也可能存在相同的标准和质量问题,并且这些问题可能以类似的方式延迟了LED照明的使用。

作为应对措施,美国能源部发起了“DOE SSL商用产品测试计划(CPTP)”,对LED照明制造商声称的指标进行测试。

该计划以匿名方式测试LED照明的下列4个特性:照明光输出(流明)、照明效率(流明每瓦)、相关色温(开氏度)、显色指数。

DOE的CPTP将关注点放在了照明可用光输出上,而不仅仅是照明的光输出上,这为LED照明设计设定了一个很好的先例。

灯的概念可能过时了LED光的使用寿命很长,这就可能使灯的概念变得过时了。

照明级LED不会像电灯泡那样出现灾难性失效。

相反,照明级LED在逐渐退化到其最初光输出通量(也称作流明维持)的70%之前,具有至少5万小时的使用寿命,也就是说连续点亮5.7年!不过,在大多数照明环境下,灯有规律地熄灭。

这一熄灭期足足可以将LED 的使用寿命延长到30年以上,如曲线1所示。

过了这么多年之后,LED照明将“烧尽”,而那时LED照明技术下的照明将更亮、效率更高,与老式LED照明相比很可能要节省TCO。

不要忘记:LED照明的这5万小时使用寿命避免了多少对环境的影响。

送往填埋场的白炽灯泡至少要少25倍,并且能源消耗量要少5倍。

(美国约50%的能源来自燃煤,而燃煤会给空气中释放汞)。

或者,送往处理的含汞C灯泡至少减少5倍。

如前面提到的,不用维护是LED照明的一个重要优点。

因此,设计LED照明,使其使用寿命最长并节省TCO是一个应对LED照明原始成本高这一障碍的极佳策略。

表1列出了设计大功率LED照明的一般步骤。

本文的其余部分依次讨论这些设计步骤。

为了更好地说明这些设计概念,本文给出了一个LED照明取代23W CFL嵌顶灯的计算例子。

不仅对本例,对所有类型照明,本设计步骤都可重复使用。

步骤一:确定照明需求LED照明必须满足或超过目标应用的照明要求。

因此,在建立设计目标之前就必须确定照明要求。

对于某些应用,存在现成的照明标准,可以直接确定要求。

对其它应用,确定现有照明的特性是一个好方法。

表2列出了确定现有照明特性时要考虑的主要特性。

光输出和功率特性始终很关键,而根据应用的不同,其它特性可能重要,也可能不重要。

所有照明公司都可以提供数据文件或文档,详细给出其各种灯具的关键特性。

“潜在关键”的特性要更主观一些,或者在制造商文档里没有列出。

在这种情况下,由设计师确定现有照明的特性。

图1说明了例中CFL嵌顶灯的关键特性。

表3给出了现有照明的全部特性。

步骤二:确定设计目标照明要求确定好了之后,就可以确定LED照明的设计目标了。

与定义照明要求时一样,关键设计目标与光输出和功耗有关。

确保包含了对目标应用也可能重要的其它设计目标,包括工作环境、材料清单(BOM)成本和使用寿命。

表4以LED照明为例列出的设计目标。

步骤三:估计光学系统、热系统和电气系统的效率设计过程中最重要的参数之一是,需要多少个LED才能满足设计目标。

其他的设计决策都是围绕LED数量展开,因为LED数量直接影响光输出、功耗以及照明成本。

查看LED数据手册列出的典型光通量,用该数除设计目标流明,这种方法很诱人。

然而,此方法太简化了,依此设计将满足不了应用的照明要求。

LED的光通量依赖于多种因素,包括驱动电流和结温。

要准确计算所需要的数量,必须首先估计光学、热和电气系统的无效率。

以前原型机设计的个人经验,或者本文提供的例子数量,都可以作为指南来估计这些损失。

本节对估计这些系统损失的过程进行简述。

光学系统效率通过考察光损失估计光学系统的功效。

要估计的两种主要的光损失源为:1.次级光学器件次级光学器件是不属于LED本身的所有光学系统,如LED上的透镜或扩散片。

与次级光学器件相关的损失根据使用的特定元件的不同而变化。

通过各次级光元件的典型光学效率在85%和90%之间。

2.灯具内的光损失当光线在到达目标物之前,打到灯具罩上时,就产生了灯具光损失。

某些光被灯具罩吸收,有些则反射回灯具。

固定物的效率由照明的布局、灯具壳的形状及灯具罩的材料决定。

如图2所示,LED光具有方向性,可达到的效率比全方向照明可能达到的要高得多。

对示例中的照明,如果照明需要次级光学器件,则只存在次级光损失。

次级光学器件的主要目的是改变LED的光输出图像。

曲线2将Cree XLamp XR-E LED 的光束角度与目标灯具的光输出图像进行了比较。

裸LED的光束角度与目标灯具的非常相似,所以不需要次级光学器件。

因此,对本示例照明,不存在次级光学器件引起的光损失。

要计算本CFL示例的灯具损失,我们假定灯具反射杯的反射率为85%,60%的光将打到反射杯上。

因此,光学效率为:热损失LED的相对通量输出随着结温的上升而降低。

大多数LED数据手册都列出了25℃下的典型光通量值,而大多数LED应用都采用较高的结温。

当结温Tj > 25℃时,光通量肯定比LED数据手册给出的值差。

LED数据手册中有一个曲线,给出了相对光输出与结温的关系,例如如曲线3所示的XLamp XR-E白色LED。

该曲线通过选择特定相对光输出或者特定结温,给出了其它特性值。

对本CFL示例,其照明只是为屋顶通风的商业建筑设计的。

本设计基于所列的设计目标,对光输出、功效和使用寿命的优先次序进行了划分。

XLamp XR-E LED额定为5万小时后提供平均70%的流明维持率,结温保持在80℃或以下。

因此,CFL示例的最高合适结温为80℃。

对应的最小相对光通量为85%,如曲线3所示。

这一85%相对光通量是对本例照明热功效估计的值。

电气损失LED驱动电子设备将可用功率源(如墙体插座交流电或电池)转换成稳定的电流源。

这一过程与所有电源一样,效率不会达到100%。

驱动器中的电气损失降低了总体照明效能,因为把输入功率浪费在发热上了,而没有用在发光上。

在开始设计LED系统时,就应考虑到电气损失。

典型LED驱动器的效率在80%到90%之间。

效率高于90%的驱动器的成本要高得多。

要注意,驱动器效率可能随输出负载而变化,如曲线4所示。

应指定驱动器工作在大于50%输出负载下,以使效率最大,并使成本最低。

曲线4示例的LED驱动器效率与负载的关系对于室内应用,驱动器效率87%的估值很好。

室外用或非常长的使用寿命的驱动器,效率可能要低一些。

表5概括了示例照明的光、热和电气系统的效率。

步骤四:计算需要的LED数量实际需要的流明量所有系统效率估算好之后,就可计算要达到设计目标需要的实际LED流明数。

对本计算,只使用光效率(光学和热)。

电气效率只影响总功耗和灯具效能,而不影响照明的光输出量。

示例照明“需要的实际流明”的计算如下:所需的实际流明=目标流明/(光学效率×热效率)=810/(91%×85%)=1,050lm 工作电流另一个需要确定的是LED的工作电流。

工作电流在确定LED照明的效能和使用寿命时很重要。

增加工作电流,则各LED的光输出会变大,因而减少了所需的LED数量。

不过,增加工作电流同时也带来多个缺点,如表6所示。

根据应用的不同,考虑到每个LED流明输出值更高,这些缺点也许可以接受。

对示例照明,使用寿命和功效是最应优先考虑的设计目标,本照明以XLamp XR-E数据手册所列的最小工作电流(350 mA)工作,以最大限度提高LED功效并延长使用寿命。

LED数量工作电流确定之后,就可以计算各LED的流明输出数了。

由于LED的热损失已经在实际需要的流明数计算中考虑到了,故LED供应商文档给出的数量可以直接使用。

对本计算,使用LED订单代码所列的最小通量,而不是使用数据手册给出的典型数量。

大多数LED公司根据最小通量范围销售。

根据此最小数来设计,就可以确保用该LED订单代码制作的所有照明都能满足目标要求。

本例中的照明使用4000K CCT的XLamp XR-E LED,350 mA时的最小光通量为67.2 (P2 flux bin)。

LED的数量计算如下。

LED的数量=实际所需的流明数/每个LED的流明数=1,050 lm / 67.2 lm=16个LED步骤五:考虑所有设计可能并选择最佳设计LED数计算好之后,考虑满足设计目标的所有设计可能。

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