三星规格书(中文版)
三星15M规格书
℃ 23A(at 25 ), 60% at 250 cycle
2.5V
3.10 Cell weight
45.0g max
3.11 Cell dimension
3.12 Operating temperature (surface temperature)
charge. Standard rated discharge capacity
≥ 1,450mAh
7.3 Initial internal impedance
Initial internal impedance measured at AC 1kHz after standard charge.
Percentage as an index of the capacity at 25 (=1,450mAh) is 100%. 7.5 Temperature dependence of charge capacity
- 2/14 -
-SAMSUNG SDI Confidential Proprietary –
℃ measured with discharge current of 1500mA with 2.5V cut-off at 25 within 1hour
after the standard charge. Standard discharge capacity
≥ 1,450mAh
7.3 Standard rated discharge capacity
6.2 Measuring equipment
(1) Amp-meter and volt-meter
The amp-meter and volt-meter should have an accuracy of the grade 0.5 or higher.
三星陶瓷电容规格书
1.0
1.0
1.5
1.0 1.2 1.5 1.8
1.0 1.2 1.5 1.8
1.1 1.3 1.6 2.0
Capacitance Step
2.2
2.2
3.3
2.2 2.7 3.3 3.9
2.2 2.7 3.3 3.9
Symbol D G I J K
Rated Voltage(Vdc) 200V 500V 1000V 2000V 3000V
Multilayer Ceramic Capacitor
●7 THICKNESS OPTION
Symbol N A B C D E
Description of the Code Standard thickness (please refer to standard thickness table on next page) Thinner than standard thickness Thicker than standard thickness Standard Thickness High Q ( Low ` D.F ` ) Sn-100% (High-Q) Sn-100% (General)
● Application - High Frequency Circuit(Tuner, VCO, PAM etc) - General Power Supply Circuit(SMPS etc) - DC-DC Converter - General Electronic Circuit
Capacitance Change (ΔC : %)
± 15 ± 15
+22 ~ -82
Operation Temperature Range
三星5630 LED灯珠 第二代规格书
Rev:ISSUE NO :LED APPROVEDApproved rank :V F (AZ,A1,A2,A3,A4)CIE(P1,P2,P3,P4,P5,P6,P7,P8,P9,PA)I (S1,S2,S3)Contents1.Product Outline----------------------------------------------32.Absolute Maximum Rating-------------------------------33.Characteristics----------------------------------------------34.Chromaticity Diagram-------------------------------------45.Typical Characteristic Graph----------------------------56.Outline Drawing&Dimension--------------------------67.Reliability Test Items&Conditions-------------------78.Solder Conditions--------------------------------------------89.Taping Dimension--------------------------------------------9bel Structure-----------------------------------------------1011.Lot Number----------------------------------------------------1012.Reel Packing Structure------------------------------------1113.Aluminum Vinyl Bag-----------------------------------1214.Precaution For Use-----------------------------------------1315.Hazard Substance Analysis(SGS)------------------1516.Hazard Substance Analysis(SVHC)------------------2117.Revision History----------------------------------------------35P0=P1+P2+P3+P4+P5+P6+P7+P8+P9+PAV F CIE I vP7,P8,P9,PA S1,S2,S35.Typical Characteristics Graph*These graphs show typical values.(Ts :25℃)(I F =65mA)(I F =65mA)Anode MarkLand PatternRecommended8.Solder Conditions1)Reflow Conditions(Pb Free)Reflow Frequency:2times max.2)For Manual SolderingNot more than5seconds@MAX300℃,under soldering iron.9.Taping DimensionPKG direction in carrier tape pocketAnode Mark(Cutting)Quantity:The quantity/Reel to be Max.2,000pcs,.Cumulative Tolerance:Cumulative tolerance/10pitches to be±0.2㎜Adhesion Strength of Cover Tape:Adhesion strength to be0.1-0.7N when the tape is turned off from the carrier tape at10℃angle to be the carrier tape.Packaging:P/N,Manufacturing data code no.and quantity to be indicated ondamp proof Package.LEVEL 2aAZP1S1SPMWHT541MD5WAP0S0AZP1S101II I IIIIIII I IIIIIII III III II IIIIII I IIIIIII I IIIIIIIIGLAW94001/1001/2,000pcsIIIIII I IIIIIII III IIII I III I III I III III IIIIII Silica gel&Humidity Indicator Card in Aluminum Vinyl Bag14.Precaution for Use(취급상주의사항)1)For over-current-proof function,customers are recommended to apply resistors toprevent sudden change of the current caused by slight shift of the voltage. 과전류방지를위해전압의미세한이동에의해야기되는전류의순간변화를방지하기위해저항등의설치를권장함.2)This device should not be used in any type of fluid such as water,oil,organicsolvent,etc.When washing is required,IPA is recommended to use. 제품은물,오일,유기물과같은액체타입에서의사용은제한되며,세정이필요할시에는IPA사용을권장함.3)When the LEDs illuminate,operating current should be decided after considering theambient maximum temperature. LED의발광시,동작전류는주변최고온도를고려하여결정되어야함.4)LEDs must be stored in a clean environment.If the LEDs are to be stored for3months or more after being shipped fromSamsung Electronics,they should be packed by a sealed container with nitrogen gas injected.(Shelf life of sealed bags:12months,temp.~40℃,~90%RH)LED의보관은청정한환경에서보존되어져야하며,만약삼성전자로부터공급받는후3개월또는그이상보관이필요하다면질소가스를동봉한보존용기에보관되어야함.(보존bag의수명:12개월,보존온도~40℃,습도~90%RH)5)After storage bag is open,device subjected to soldering,solder reflow,or otherhigh temperature processes must be:보존Bag이개봉된후에,납땜이나reflow등의높은온도에노출되는제품은다음의사항에부합되어야함.a.Mounted within672hours(28days)at an assembly line with a condition of nomore than30℃/60%RH,a.제품은30℃/60%RH보다같거나낮은조립조건에서672시간(28일)이내에조립해야함.b.Stored at<10%RH.b.10%이하의상대습도에서보관되어야함.6)Repack unused Products with anti-moisture packing,fold to close any opening andthen store in a dry place.사용하지않은제품은방습팩에넣어개봉부위를닫아서다시포장한후,건조한장소에서보관할것을권장함.7)Devices require baking before mounting,if humidity card reading is>60%at23±5℃. 만약습도표시카드의수치가23±5℃에서60%이상이라면,제품실장전에baking하여야함.8)Devices must be baked for1hour at65±5℃,if baking is required. 만약baking이필요하다면,제품은65±5℃에서1시간정도baking되어야함.9)The LEDs are sensitive to the static electricity and surge.It is recommended touse a wrist band or anti-electrostatic glove when handling the LEDs.LED는정전기및서지에민감한제품이므로,LED제품을다룰시에는정전기방지장갑이나손목밴드를사용하기를권장함.If voltage exceeding the absolute maximum rating is applied to LEDs,it may cause damage or even destruction to LED devices.만약절대허용치를초과하는전압이LED에가해지면,LED소자는파괴되거나손상될수있음.Damaged LEDs may show some unusual characteristics such as increase in leakcurrent,lowered turn-on voltage,or abnormal lighting of LEDs at low current.손상된제품은누설전류의증가,Turn on전압의저하,저전류에서의점등불량등의이상거동을보일수있음.10)Risk of Sulfurization(or Tarnishing)Samsung Electronic's lead frame based package products(such as mid power and HV AC)contain silver(Ag)plated lead frames.Silver may turn black(or tarnish)when exposed to substances such as sulfur,chlorine,or other halogen compounds.삼성전자의리드프레임은Ag(은)을도금한Package제품입니다.황(S),염소(Cl),또는다른할로겐화합물들에노출시Ag(은)은검정(또는어두운색)으로바뀔수있으니주의바랍니다.Sulfurization of the lead frame may result in reduction of lumen output,color shift and an open circuit in some extreme cases.리드프레임의황화(Sulfurization)는광량저하,색좌표변화및심한경우회로내의LED무등(Open)불량을일으킬수도있습니다.Do not store or use such lead frame LED's together with oxidizing substances listed above.The following examples could be sources of such substances:rubber,corrugate paper,solder cream etc.LED를아래의목록으로만들어진산화성물질들과함께리드프레임을저장하거나사용하지마십시오.황화(Sulfurization)의근원일수있습니다.:고무,일반종이,남땜크림등15.Hazard Substance Analysis-SGS16.Hazard Substance Analysis-SVHC(REACH)。
三星5630二代灯珠规格书
W1, W2, W3, W4, W5, W6, W7, W8, W9, WA, WB, WC, WD, WE, WF, WG
W5, W6, W7, W8, W9, WA, WB, WC
W6, W7, WA, WB
V1, V2, V3, V4, V5, V6, V7, V8, V9, VA, VB, VC, VD, VE, VF, VG
SAMSUNG ELECTRONICS
95, Samsung2-Ro, Giheung-Gu, Yongin-City, Gyeonggi-Do 446-711, KOREA
1 / 48
Contents
1. Product Code Information 2. Characteristics 3. Typical Characteristics Graph 4. Outline Drawing & Dimension 5. Reliability Test Items & Conditions 6. Solder Conditions 7. Tape & Reel 8. Label Structure 9. Packing Structure 10. Precaution For Use 11. Hazard Substance Analysis Report Revision History
Q1, Q2, Q3, Q4, Q5 Q6, Q7, Q8, Q9, QA
Q1, Q2, Q3, Q4, Q5, Q6
P1, P2, P3, P4, P5 P6, P7, P8, P9, PA
P1, P2, P3, P4, P5, P6
5 / 48
2) Chromaticity Region & Coordinates
三星产品资料(CE)中文版
—1,000m～10,000m —1,000m～40,000m 5V±5%，12V±5% 2.0 A 5.2 W 5.6 W 4.4 W 1 W 1 W 26.1 101.5 147 610
15
1TB HD103SI/CEC SATA 3.0 Gbps 5,400 RPM 512bytes per sector 8.9 ms 5.52 ms 166 MB/sec 300 MB/sec 12 sec 1 sector in 10 bits 50,000 2.5 bel 2.8 bel 2.8 bel
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2TB HD203WI/CEC SATA 3.0 Gbps 5,400 RPM 512bytes per sector 8.9 ms 5.52 ms 166 MB/sec 300 MB/sec 14 sec 1 sector in 10 bits 50,000 2.6 bel 2.9 bel 2.8 bel
三星电子致力于更好的满足客户需求，从产品开发阶段到商业生产提供技术支持。三星硬 盘独立的CE团队，DEST团队等，将竭诚与客户合作，为客户提供最优秀的产品。
Samsung Eco-Green HDD 视频监控系统的最佳存储解决方案
硬盘配置 规格 型号 接口 转速 磁道 性能指标 平均寻道时间 响应时间 数据传输率 内部传输率 外部传输率 磁盘等待时间 可靠性参数 不可修复读错误 循环启停周期 噪声控制 空闲时 随机读时 随机写时 环境参数 环境温度(℃) 工作时 空闲时 相对湿度 工作时 空闲时 抗振管理 工作时 空闲时 使用海拔高度 工作时 空闲时 节能指标 电压 瞬间启动时电流 寻轨时功耗 读/写时功耗 空闲时功耗 等待时功耗 休眠时功耗 物理参数 高度（毫米） 宽度（毫米） 长度（毫米） 重量（克）
三星电容规格书
三星电容规格书三星电容规格书是指三星集团所生产的电容器产品的详细规格说明书。
下面将为您介绍三星电容规格书中常见的内容。
一、产品介绍三星电容规格书的第一部分是产品的介绍。
这部分通常包括产品名称、型号、外观尺寸、重量等基本信息。
同时，还会介绍产品的应用领域，例如通信设备、电子产品、汽车电子、医疗设备等，并解释为什么该产品适用于该领域。
二、产品特性三星电容规格书的第二部分是产品的特性介绍。
这部分通常包括电容器的电气特性和机械特性。
电气特性包括容量、精度、短时升温性能、稳定性等参数的介绍。
机械特性则包括外观特征、封装形式、连接方式等信息。
此外，还会介绍产品的工作温度范围、湿度条件等环境要求。
三、性能曲线和测试方法三星电容规格书的第三部分是性能曲线和测试方法。
这部分通常会给出电容器在不同工作电压、频率下的电容值曲线图和电阻值曲线图，并解释测试方法和测试条件。
这样用户就可以根据自己的需求选择合适的电容器。
四、质量保证和可靠性三星电容规格书的第四部分是质量保证和可靠性的介绍。
这部分通常包括产品的质量认证情况，如ISO 9001认证、ISO 14001认证等。
同时还会介绍产品的可靠性指标，如寿命、抗震动、抗湿热等性能。
此外，还会介绍三星公司的技术和质量管理体系，以确保产品的可靠性和稳定性。
五、包装和运输三星电容规格书的最后一部分是产品的包装和运输说明。
这部分通常会介绍产品的包装方式、包装材料、包装数量等信息，以及产品的运输方式、运输温度范围等要求。
同时还会提供产品的标签和批次号等信息，方便用户在使用和追溯过程中进行识别。
总结通过三星电容规格书，用户可以了解三星电容器产品的各种规格和性能指标，以便根据自己的需求选择合适的产品。
对于使用三星电容器的客户来说，这份规格书是非常重要的参考资料，它能够帮助用户了解产品的特性、性能以及质量保证等方面的信息，从而使用户能够更好地使用和维护产品。
三星电容规格书
■INTRODUCTIONMLCC(Multilayer Ceramic Capacitor)is SMD(Surface Mounted Device)type capacitor that is used in wide ranges of capacitance.MLCC is paid more attentions than other capacitors due to the better frequency characteristics,higher reliability,higher withstanding voltage and so on.MLCC is made of many layers of ceramic and inner electrodes like sandwich.Pd was used for inner electrodes.But the price of Pd was skyrocketed and Pd was replaced by the BME(Base Metal Electrode),which reduced the total cost of MLCC.This inner electrode is connected to outer termination for surface mounting,which is composed of three layers,Cu or Ag layer,Ni plating layer,and SnPb or Sn plating layer.Most of MLCCs become Pb free by the environmental issue at present.MLCC is divided into two classes.Class I(C0G,etc)is the temperature compensating type.It hasa small TCC(Temperature Coefficient of Capacitance)and a better frequency performance.Therefore,it is used in RF applications such as cellular phone,tuner,and so on.Class II(X7R, X5R,Y5V,etc)is the high dielectric constant type,which is used in general electronic circuit.Especially high capacitance MLCC is replacing other capacitors(Tantalum and Aluminum capacitor)due to the low ESR(Equivalent Series Resistance)value.■FEATURE AND APPLICATION●Feature-Miniature Size-Wide Capacitance and Voltage Range-Highly Reliable Performance-Tape&Reel for Surface Mount Assembly-Low ESR-High Q at High Frequencies-Stable Temperature Dependence of Capacitance●Application-High Frequency Circuit(Tuner,VCO,PAM etc)-General Power Supply Circuit(SMPS etc)-DC-DC Converter-General Electronic Circuit■STRUCTURE■APPEARANCE AND DIMENSIONDIMENSION(mm)CODE EIA CODEL W T(MAX)BW 0302010.6±0.030.3±0.030.3±0.030.15±0.05050402 1.0±0.050.5±0.050.5±0.050.2+0.15/-0.1 100603 1.6±0.10.8±0.10.8±0.10.3±0.2210805 2.0±0.1 1.25±0.1 1.25±0.10.5+0.2/-0.3 311206 3.2±0.2 1.6±0.2 1.6±0.20.5+0.2/-0.3 321210 3.2±0.3 2.5±0.2 2.5±0.20.6±0.3431812 4.5±0.4 3.2±0.3 3.2±0.30.8±0.3552220 5.7±0.4 5.0±0.4 3.2±0.3 1.0±0.3■PREVIOUS PART NUMBERINGSymbol EIA Code TemperatureCoefficient(PPM/℃)※TemperatureCharacteristicsOperationTemperature RangeC C0G(CH)0±30C Δ-55~+125℃P P2H -150±60P ΔR R2H -220±60R ΔS S2H -330±60S ΔT T2H -470±60T ΔU U2J -750±120U ΔLS2L+350~-1000SL▶CLASS Ⅰ(Temperature Compensation)TemperatureCharacteristicsbelow 2.0pF 2.2~3.9pF above 4.0pFabove 10pFC ΔC0G C0G C0G C0G P Δ-P2J P2H P2H R Δ-R2J R2H R2H S Δ-S2J S2HS2H T Δ-T2J T2H T2H U Δ-U2JU2JU2JSymbol EIA Code Capacitance Change(ΔC :%)OperationTemperature RangeA X5R ±15-55~+85℃B X7R ±15-55~+125℃FY5V+22~-82-30~+85℃▶CLASS Ⅱ(High Dielectric Constant)SAMSUNG Multilayer Ceramic Capacitor Type(Size)Capacitance Temperature Characteristics Nominal Capacitance Capacitance Tolerance Rated Voltage Thickness Option Packaging Type CAPACITANCE TEMPERATURE CHARACTERISTICS ※Temperature Characteristics ☞K :±250PPM/℃J :±120PPM/℃H :±60PPM/℃G :±30PPM/℃●●●●●●●●●Temperature CharacteristicsSymbol Tolerance Applicable Capacitance &RangeC0G(NPO)or T.C SeriesB ±0.1pF 0.5~3pF C±0.25pF 0.5~10pF D ±0.5pF F ±1pF 6~10pFG ±2%E-24Series for over 10pF J ±5%K±10%A(X5R)B(X7R)J ±5%E-12SeriesK ±10%M ±20%F(Y5V)Z-20%~+80%E-6Series CAPACITANCE TOLERANCE The nominal capacitance value is expressed in pico-Farad(pF)and identified by three-digit number,first two digits represent significant figures and last digit specifies the number of zeros to follow.For values below 1pF,the letter "R"is used as the decimal point and the last digit becomes significant.example)100:10×10o =10pF 102:10×102=1000pF020:2×10o =2pF1R5:1.5pFNOMINAL CAPACITANCE ●●※Please consult us for special tolerances.RATED VOLTAGE ●PACKAGING TYPE THICKNESS OPTION Symbol Description of the CodeN Standard thickness (please refer to standard thickness table on next page)A Thinner than standard thickness B Thicker than standard thicknessC Standard Thickness High Q (Low `D.F `)D Sn-100%(High-Q)ESn-100%(General)※Please Consult us for other termination type.●●Series Capacitance StepE-3 1.02.24.7E-6 1.01.52.23.34.76.8E-12 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.88.2E-241.0 1.2 1.5 1.82.2 2.73.3 3.94.75.66.88.21.11.31.62.02.43.03.64.35.16.27.59.1※Standard Capacitance is "Each step ×10n "▶STANDARD CAPACITANCE STEP■NEW PART NUMBERING●PRODUCT ABBREVIATION Symbol Product AbbreviationCLSAMSUNG Multilayer Ceramic Capacitor●SIZE(mm)Symbol Size(mm)Length Width 030.60.305 1.00.510 1.60.821 2.0 1.231 3.2 1.632 3.2 2.543 4.5 3.2555.75.0SAMSUNG Multilayer Ceramic Capacitor Size(mm)Capacitance Temperature Characteristic Nominal Capacitance Capacitance Tolerance Rated Voltage Thickness Option Product &Plating Method Samsung Control Code Reserved For Future Use Packaging Type ●●●●●●●●●●●●CAPACITANCE TEMPERATURE CHARACTERISTICSymbol Temperature Characteristics Temperature RangeCClassⅠCOG C△0±30(ppm/℃)-55~+125℃P P2H P△-150±60R R2H R△-220±60S S2H S△-330±60T T2H T△-470±60U U2J U△-750±60L S2L S△+350~-1000AClassⅡX5R X5R±15%-55~+85℃B X7R X7R±15%-55~+125℃F Y5V Y5V+22~-82%-30~+85℃※Temperature CharacteristicTemperatureCharacteristicsBelow2.0pF 2.2~3.9pF Above4.0pF Above10pF CΔC0G C0G C0G C0GPΔ-P2J P2H P2HRΔ-R2J R2H R2HSΔ-S2J S2H S2HTΔ-T2J T2H T2HUΔ-U2J U2J U2JJ:±120PPM/℃,H:±60PPM/℃,G:±30PPM/℃●NOMINAL CAPACITANCENominal capacitance is identified by3digits.The first and second digits identify the first and second significant figures of the capacitance. The third digit identifies the multiplier.'R'identifies a decimal point.●ExampleSymbol Nominal Capacitance1R5 1.5pF10310,000pF,10nF,0.01μF104100,000pF,100nF,0.1μF●CAPACITANCE TOLERANCE Symbol Tolerance Nominal CapacitanceA ±0.05pF Less than 10pF (Including 10pF)B ±0.1pFC ±0.25pFD ±0.5pF F ±1pF F ±1%More than 10pF G ±2%J ±5%K ±10%M ±20%Z+80,-20%●RATEDVOLTAGE●THICKNESS OPTIONType Symbol Thickness(T)Spec 060330.30±0.03 100550.50±0.05 160880.80±0.102012A0.65±0.10 C0.85F 1.25±0.103216C0.85±0.15 F 1.25±0.15 H 1.6±0.203225F 1.25±0.20H 1.6I 2.0J 2.54532F 1.25±0.20H 1.6I 2.0J 2.5L 3.2±0.305750F 1.25±0.20H 1.6I 2.0J 2.5L 3.2±0.30●PRODUCT&PLATING METHODSymbol Electrode Termination Plating TypeA Pd Ag Sn_100%N Ni Cu Sn_100%G Cu Cu Sn_100%●SAMSUNG CONTROL CODE●RESERVED FOR FUTURE USESymbol Description of the codeN Reserved for future use●PACKAGING TYPE▶CAPACITANCE vs CHIP THICKNESS STANDARDDescription0603(0201)1005(0402)1608(0603)2012Type (0805)3216Type (1206)3225Type (1210)4532Type (1812)5750Type (2220)Dimension (mm)L0.6±0.03 1.0±0.05 1.6±0.1 2.0±0.13.2±0.153.2±0.2 3.2±0.34.5±0.45.7±0.4W 0.3±0.030.5±0.050.8±0.1 1.25±0.1 1.6±0.15 1.6±0.22.5±0.23.2±0.3 5.0±0.4T0.3±0.030.5~±0.050.8±0.10.65±0.10.85±0.11.25±0.10.85±0.15 1.25±0.15 1.6±0.21.25±0.2 1.6±0.22.0±0.22.5±0.21.25±0.21.6±0.22.0±0.22.5±0.21.6±0.22.0±0.22.5±0.2C A P ACIT A N CER A N G E (p F )SL 50V -0.5~2400.5~10000.5~10001100~15001600~27000.5~27003000~56006200~8200-----------C,TC (Except SL,UJ)25V 0.5~470.5~2200.5~1000--3300~82001500~36003900~68007500~10000-----100000-----50V -0.5~1800.5~10000.5~560620~10001100~33000.5~22002400~4700-560~1000011000~2200024000~47000-1000~1300015000~2200024000~4700062000~680004300093000130000C A P A C I T A N C E R A N G E (n F )A (X5R)6.3V 102202200--10000--10000---22000---47000--4700010V101001000--2200--4700~10000---22000------4700016V -47330~470--1000--4700---6800~10000-------25V --------------------50V- 6.8~10------------------B (X7R)6.3V 0.1~1047~100470~1000--1000--6800~10000---22000-------10V0.1~1033~100220~470220~270330~470560~1000-1000~330047001500~220033003900~4700----22000---16V0.1~110~33100~22068~200220~330390~1000330~6801000~15002200~33001500~220033003900~4700---2200----25V -4.7~1047~10039~6882~100150~470100~330470~620680~1000680~150018002200---1000---1000050V -0.22~4.70.22~1000.22~3947~1002201~150220390~1000 2.2~680820~1000--10~1000-----3300~4700F (Y5V)6.3V10~100-2200--10000-----47000--------10V -220~330100~1000--4700-470010000~22000---22000------10000016V -10~220100~100010~680820~10001200~22001000~22002700~4700100003300~68001000015000---22000----25V -10~3322~33010~220270~470560~1000470~10001200~22002700~33001000~33004700~10000-----10000---50V - 2.2~102.2~1002.2~6882~150180~100010~470560~1000-100~1000------10000---■PACKAGING●CARDBOARD PAPER TAPESymbol W F E P1P2P0D tABTypeD i m e n s i o n038.0±0.3 3.5±0.05 1.75±0.12.0±0.052.0±0.05 4.0±0.1Φ1.5+0.1/-00.37±0.030.38±0.030.68±0.03050.6±0.050.65+0.05/-0.1 1.15+0.05/-0.110 4.0±0.11.1MAX1.1±0.21.9±0.221 1.6±0.22.4±0.2312.0±0.23.6±0.2unit :mm●EMBOSSED PLASTIC TAPE●TAPING SIZE●REEL DIMENSIONSymbol A B CDEWtR7"Reel φ178±2.0min.φ50φ13±0.521±0.82.0±0.510±1.50.8±0.21.013"Reelφ330±2.0min.φ70unit :mmSymbol Cardboard Paper TapeEmbossed Plastic Tape7"Reel 4000200013"Reel15000-unit :pcsSize 05(0402)10(0603)21(0805)T ≤0.85mm T ≥1.0mm Quantity 50,00010,000~15,000*10,0005,000●BULK CASE PACKAGING-Bulk case packaging can reduce the stock space and transportation costs.-The bulk feeding system can increase the productivity.-It can eliminate the componentsloss.Symbol A B T C D E Dimension 6.8±0.18.8±0.112±0.1 1.5+0.1/-02+0/-0.14.7±0.1Symbol F W G H L I Dimension31.5+0.2/-036+0/-0.219±0.357±0.35110±0.75±0.35●QUANTITY*Option■CHARACTERISTIC MAP●CLASSⅠTemperature Characteristics Size VoltageCapacitance Range(㎊)SL,UJ05 (0402)50V10 (0603)50V21 (0805)50V31 (1206)50VC(COG)& TC Series03(0201)25V05(0402)25V50V10(0603)25V50V21(0805)25V50V31(1206)25V50V 32(1210)50V100V43(1812)25V50V55(2220)50V101001000100001000001000000100000001000000000.5240270082001000100010000150033004700100018022047820033001800047005604700068000100010000013000043000●CLASSⅡ,A(X5R)Temperature Characteristics Size Voltage Capacitance Range(㎊)A(X5R)0603(0201)6.3V10V1005(0402)6.3V10V16V50V1608(0603)6.3V10V16V2012(0805)6.3V10V16V3216(1206)6.3V10V16V3225(1210)6.3V10V16V4532(1812) 6.3V5750(2220)6.3V10V101001000100001000001000000100000001000000001000010000010000100000004700000220000002200000100000004700000220000004700000047000100006800100000022000001000000470000330000100000001000000068000004700000047000000220000●CLASSⅡ,B(X7R)Temperature Characteristics Size VoltageCapacitance Range(㎊)B(X7R)03(0201)6.3V10V16V05(0402)6.3V10V16V25V50V10(0603)6.3V10V16V25V50V21(0805)6.3V10V16V25V50V31(1206)6.3V10V16V 25V50V10100100010000100000100000010000000100000000100000470004700000470000100000100000047000022000010000003300000100000010000001001000010000000100000100000100100001001000680000033000100003300010000470047002204700002200002200001000004700022022000010000006800039000220100000033000010000010000001000●CLASSⅡ,B(X7R)Temperature Characteristics Size VoltageCapacitance Range(㎊)B(X7R)32(1210)6.3V10V16V25V50V43(1812)10V16V25V50V55(2220)25V50V1010010001000010000010000001000000010000000022000000100000010000470000015000002200000010000001000000047000003300000470000015000002200000680000100000022002200000●CLASSⅡ,F(Y5V)Temperature Characteristics Size VoltageCapacitance Range(㎊)F(Y5V)03(0201) 6.3V05(0402)10V16V25V50V10(0603)6.3V10V16V25V50V21(0805)6.3V10V16V25V50V31(1206)10V16V 25V50V32(1210)6.3V10V16V25V50V43(1812)16V25V50V55(2220)10V330000330001000022000010000220010000003300001000001000002200022001000000220000010000100002200000047000001000000033000001000000100000047000010000470000010000001500000033000001000000100000100000002200000010000220000100000001000000010000000022000001000000010000010000100000010000010000002200470000002200000010100100010000100000100000010000000100000000■RELIABILITY TEST DATANO ITEM PERFORMANCE TEST CONDITION 1APPEARANCE NO ABNORMAL EXTERIOR APPEARANCE THROUGH MICROSCOPE(×10)2INSULATIONRESISTANCE10,000㏁OR500㏁·㎌PRODUCT WHICHEVER ISSMALLER(RATED VOLTAGE IS BELOW16V:10,000㏁OR100㏁·㎌)RATED VOLTAGE SHALL BE APPLIED.MEASUREMENT TIME IS60~120RATED VOLTAGETIME60SEC.3WITHSTANDINGVOLTAGENO DIELECTRIC BREAKDOWN ORMECHANICAL BREAKDOWNCLASSⅠ:300%OF THE RATED VOLTAGE FOR1~5SEC,CLASSⅡ:250%OF THE RATED VOLTAGE FOR1~5SECIS APPLIED WITH LESS THAN50㎃CURRENT4CAPACITANCECLASSⅠWITHIN THE SPECIFIEDTOLERANCECAPACITANCE FREQUENCY VOLTAGE1,000㎊ANDBELOW1㎒±10%0.5~5VrmsMORE THAN1,000㎊1㎑±10%CLASSⅡWITHIN THE SPECIFIEDTOLERANCECAPACITANCE FREQUENCY VOLTAGE10㎌AND BELOW1㎑±10% 1.0±0.2VrmsMORE THAN10㎌120㎐±20%0.5±0.1Vrms5Q CLASSⅠOVER30㎊:Q≥1,000LESS THAN30㎊:Q≥400+20C(C:CAPACITANCE)CAPACITANCE FREQUENCY VOLTAGE1,000㎊ANDBELOW1㎒±10%0.5~5VrmsMORE THAN1,000㎊1㎑±10%6TanδCLASSⅡ1.CHAR:B2.CHAR:FCAPACITANCE FREQUENCY VOLTAGE10㎌AND BELOW1㎑±10% 1.0±0.2VrmsMORE THAN10㎌120㎐±20%0.5±0.1Vrms RATED VOLTAGE DF SPEC6.3V0.05max10V0.05max16V0.035max25V0.025max50V이상0.025max6.3V10V16V25V50V1005-0.125max0.09max(C＜220nF)0.125max(C≥220nF)0.05max0.05max16080.16max0.125max0.09max0.05max(C≤100nF)0.07max(C>100nF)0.05max20120.16max0.125max0.09max0.07max0.05max32160.16max0.125max0.09max0.07max0.05max32250.16max0.125max0.09max0.07max(C≤6.8㎌)0.09max(C>6.8㎌)0.05max45320.16max0.16max0.09max--57500.125max---www.cdindustries.hk*THE INITIAL VALUE OF HIGH DIELECTRIC CONSTANT SERIES SHALL BE MEASUREDAFTER THE HEAT TREATMENT OF150+0/-10℃,1Hr AND SITTING OF48±4hr AT ROOM TEMPERATURE&ROOM HUMIDITY.NO ITEM PERFORMANCE TEST CONDITION14HUMIDITY(STEADYSTATE)APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR TEMPERATURE:40±2℃RELATIVE HUMIDITY:90~95%RHTEST TIME:500+12/-0Hr.MEASURE AT ROOM TEMPERATUREAFTER COOLING FORCLASSⅠ:24±2Hr.CLASSⅡ:48±4Hr.CAPACITANCECHARACTERISTIC CAPACITANCE CHANGECLASSⅠWITHIN±5%OR±0.5㎊WHICHEVERIS LARGERCLASSⅡA,B WITHIN±12.5%F WITHIN±30%QCLASSⅠ30㎊AND OVER:Q≥35010~30㎊:Q≥275+2.5×CLESS THAN10pF:Q≥200+10×CTanδCLASSⅡINSULATIONRESISTANCEMINIMUM INSULATION RESISTANCE:1,000㏁OR50㏁·㎌PRODUCT WHICHEVER ISSMALLER15MOISTURERESISTANCEAPPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR APPLIED VOLTAGE:RATED VOLTAGETEMPERATURE:40±2℃RELATIVE HUMIDITY:90~95%RHTEST TIME:500+12/-0Hr.CURRENT APPLIED:50㎃MAX.<INITIAL MEASUREMENT>CLASSⅡSHOULD BE MEASUREDINITIAL VALUE AFTER BE HEAT-TREATEDFOR1HR IN150℃+0/-10℃AND BE LEFTFOR48±4HR AT ROOM TEMPERATURE.<LATTER MEASUREMENT>CLASSⅠSHOULD BE MEASURED AFTERLEFT FOR24±2HRS IN ROOMTEMPERATURE AND HUMIDITY.CLASSⅡSHOULD BE MEASUREDLATTER VALUE AFTER BEHEAT-TREATED FOR1HR IN150℃+0/-10℃AND BE LEFT FOR48±4HR AT ROOMTEMPERATURE.CAPACITANCECHARACTERISTIC CAPACITANCE CHANGECLASSⅠWITHIN±7.5%OR±0.75㎊WHICHEVERIS LARGERCLASSⅡA,B WITHIN±12.5%FWITHIN±30%WITHIN+30~－40%1005C>0.47μF1608C>1.0μF2012C>4.7μF3216C>10.0μF3225C>22.0μF4532C>47.0μFQCLASSⅠ30㎊AND OVER:Q≥20030㎊AND BELOW:Q≥100+10/3×CTanδCLASSⅡINSULATIONRESISTANCEMINIMUM INSULATION RESISTANCE:500㏁OR25㏁·㎌PRODUCT,WHICHEVER IS SMALLER.CHAR.25VANDOVER16V10V 6.3V4VA,B0.050.05MAX0.05MAX0.075MAX0.1MAXF0.075MAX0.1MAX(C〈1.0㎌)0.125MAX(C≥1.0㎌)0.15MAX0.195MAX0.25MAXCHAR.25VANDOVER16V10V 6.3V4VA,B0.05MAX0.05MAX0.05MAX0.075MAX0.1MAXF0.075MAX0.1MAX(C〈1.0㎌)0.125MAX(C≥1.0㎌)0.15MAX0.195MAX0.25MAX6.3VTanδ0.125MAX*ConditionCLASSⅡ(A,B)1005C≥0.22㎌1608C≥2.2㎌2012C≥4.7㎌3216C≥10.0㎌3225C≥22.0㎌4532C≥47.0㎌5750C≥100.0㎌6.3V Tanδ0.125MAX*ConditionCLASSⅡ(A,B)1005C≥0.22㎌1608C≥2.2㎌2012C≥4.7㎌3216C≥10.0㎌3225C≥22.0㎌4532C≥47.0㎌5750C≥100.0㎌NO ITEM PERFORMANCE TEST CONDITION16HIGHTEMPERATURERESISTANCEAPPEARANCE NO MECHANICAL DAMAGE SHALL OCCURAPPLIED VOLTAGE:150%,200%OF RATED VOLTAGETEST TIME:1000+48/-0Hr.CURRENT APPLIED:50㎃MAX.<INITIAL MEASUREMENT>CLASSⅡSHOULD BE MEASURED INITIALVALUE AFTER BE HEAT-TREATED FOR1HR IN150℃+0/-10℃AND BE LEFT FOR48±4HR AT ROOM TEMPERATURE.<LATTER MEASUREMENT>CLASSⅠSHOULD BE MEASURED AFTERLEFT FOR24±2HRS IN ROOMTEMPERATURE AND HUMIDITY.CLASSⅡSHOULD BE MEASURED LATTERVALUE AFTER BE HEAT-TREATED FOR1HR IN150℃+0/-10℃AND BE LEFT FOR48±4HR AT ROOM TEMPERATURE.(TWICE OF RATED VOLTAGE WILL BEAPPLIED TO ALL SERIES BUT ABOVE)**HOWEVER,A/B는1005C≥0.22㎌SEE(FIG.3)CAPACITANCECHARACTERISTIC CAP.CHANGECLASSⅠWITHIN±3%OR±0.3㎊,WHICHEVER IS LARGERCLASSⅡA,B WITHIN±12.5%FWITHIN±30%WITHIN+30~40%1005C>0.47μF1608C>1.0μF2012C>4.7μF3216C>10.0μF3225C>22.0μF4532C>47.0μFQCLASSⅠ30㎊AND OVER:Q≥35010~30㎊:Q≥275+2.5×CLESS THAN10㎊:Q≥200+10×CTanδCLASSⅡINSULATIONRESISTANCEMINIMUM INSULATION RESISTANCE:1,000㏁OR50㏁·㎌PRODUCTWHICHEVER IS SMALLER17TEMPERATURECYCLEAPPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR CAPACITORS SHALL BE SUBJECTEDTO FIVE CYCLES OF THETEMPERATURE CYCLE AS FOLLOWINGSTEP TEMP.(℃)TIME(MIN)1MIN.RATEDTEMP.+0/-3302252~33MAX.RATEDTEMP.+3/-0304252~3MEASURE AT ROOM TEMPERATUREAFTER COOLING FORCLASSⅠ:24±2Hr.CLASSⅡ:48±4Hr.CAPACITANCECHARACTERISTIC CAP.CHANGECLASSⅠWITHIN±2.5%OR±0.25㎊WHICHEVER ISLARGERCLASSⅡA,B WITHIN±7.5%F WITHIN±20%QCLASSⅠ30㎊AND OVER:Q≥1000LESS THAN30㎊:Q≥400+20×CTanδCLASSⅡTO SATISFY THE SPECIFIEDINITIAL VALUEINSULATIONRESISTANCETO SATISFY THE SPECIFIEDINITIAL VALUECHAR.25VANDOVER16V10V 6.3V4VA,B0.05MAX0.05MAX0.05MAX0.075MAX0.1MAXF0.075MAX0.1MAX(C<1.0㎌)0.125MAX(C≥1.0㎌)0.15MAX0.195MAX0.25MAXCHAR.TEMP.CLASSⅠ125±3℃CLASSⅡA85±3℃B125±3℃F85±3℃*150%Authorization ConditionsCLASSⅡ(A,B,F)1005C>0.47μF1608C≥2.2㎌2012C≥4.7㎌3216C≥10.0㎌3225C≥22.0㎌4532C≥47.0㎌5750C≥100.0㎌■CHARACTERISTIC GRAPH▶CAPACITANCE CHANGE -AGING▶CAPACITANCE -DC VOLTAGE CHARACTERISTICS▶CAPACITANCE -TEMPERATURE CHARACTERISTICS●ELECTRICAL CHARACTERISTICS■APPLICATION MANUAL●Storage Condition▶Storage EnvironmentThe electrical characteristics of MLCCs were degraded by the environment of high temperature or humidity.Therefore,the MLCCs shall be stored in the ambient temperature and the relative humidity of less than40℃and70%,respectively.Guaranteed storage period is within6months from the outgoing date of delivery.▶Corrosive GasesSince the solderability of the end termination in MLCC was degraded by a chemical atmosphere such as chlorine,acid or sulfide gases,MLCCs must be avoid from these gases.▶Temperature FluctuationsSince dew condensation may occur by the differences in temperature when the MLCCs are taken out of storage,it is important to maintain the temperature-controlled environment.●Design of Land PatternWhen designing printed circuit boards,the shape and size of the lands must allow for theproper amount of solder on the capacitor.The amount of solder at the end terminations has a direct effect on the crack.The crack in MLCC will be easily occurred by the tensile stress which was due to too much amount of solder.In contrast,if too little solder is applied,the termination strength will be e the following illustrations as guidelines for proper land design.Recommendation of Land Shape and Size●AdhesivesWhen flow soldering the MLCCs,apply the adhesive in accordance with the following conditions.▶Requirements for AdhesivesThey must have enough adhesion,so that,the chips will not fall off or move during thehandling of the circuit board.They must maintain their adhesive strength when exposed to soldering temperature.They should not spread or run when applied to the circuit board.They should harden quickly.They should not corrode the circuit board or chip material.They should be a good insulator.They should be non-toxic,and not produce harmful gases,nor be harmful when touched.▶Application MethodIt is important to use the proper amount of adhesive.Too little and much adhesive will cause poor adhesion and overflow into the land,respectively.▶Adhesive hardening CharacteristicsTo prevent oxidation of the terminations,the adhesive must harden at160℃or less,within2minutes or less.●Mounting▶Mounting Head PressureExcessive pressure will cause crack to MLCCs.The pressure of nozzle will be300g maximum during mounting.▶Bending StressWhen double-sided circuit boards are used,MLCCs first are mounted and soldered onto one side of the board.When the MLCCs are mounted onto the other side,it is important to support the board as shown in the illustration.If the circuit board is not supported,the crack occur to the ready-installed MLCCs by the bending stress.●FluxAlthough the solderability increased by the highly-activated flux,increase of activity in flux may also degrade the insulation of the chip capacitors.To avoid such degradation,it is recommended that a mildly activated rosin flux(less than0.2%chlorine)be used.●SolderingSince a multilayer ceramic chip capacitor comes into direct contact with melted solder during soldering,it is exposed to potentially mechanical stress caused by the sudden temperature change.The capacitor may also be subject to silver migration,and to contamination by the flux.Because of these factors,soldering technique is critical.▶Soldering MethodsMethodClassificationReflow soldering-Overall heating-Infrared rays -Hot plate-VPS(vapor phase)-Local heating-Air heater -Laser-Light beamFlow soldering-Single wave -Double wave-*We recommend the reflow soldering method.▶Soldering ProfileTo avoid crack problem by sudden temperature change,follow the temperature profile in the adjacentgraph.30025020015010050℃Reflow Soldering 30025020015010050℃60~120sec 3~4secFlow Soldering▶Manual SolderingManual soldering can pose a great risk of creating thermal cracks in chip capacitors.The hotsoldering iron tip comes into direct contact with the end terminations,and operator's carelessnessmay cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor.Therefore the soldering iron must be handled carefully,and close attention must be paid to the selection of the soldering iron tip and to temperature control of the tip.▶Amount ofSolder▶CoolingNatural cooling using air is recommended.If the chips are dipped into solvent for cleaning, the temperature difference(△T)must be less than100℃6-6.CleaningIf rosin flux is used,cleaning usually is unnecessary.When strongly activated flux is used, chlorine in the flux may dissolve into some types of cleaning fluids,thereby affecting the chip capacitors.This means that the cleaning fluid must be carefully selected,and should always be new.▶Notes for Separating Multiple,Shared PC Boards.A multi-PC board is separated into many individual circuit boards after soldering has been completed.If the board is bent or distorted at the time of separation,cracks may occur in the chip capacitors.Carefully choose a separation method that minimizes the bending of the circuit board.■CROSS REFERENCEP/N COMPANY SAMSUNG AVX JOHANSON KEMET KYOCERA MURATA NOVACAP PANASONIC ROHMTAIYO-YUDENTDK VITRAMON①COMPANY MODEL(MLCC)CL--C CM GRM-ECJ MCH MK C VJ②SIZE (EIA/JIS)0201(0603)03---0333-Z-0630603-0402(1005)050402R0704020536040201510510050402 0603(1608)100603R14060310539060311810716080603 0805(2012)210805R1508052140080522121220120805 1206(3216)311206R181********-6120633131632161206 1210(3225)321210S4112103242-2121043232532251210 1808(4520)421808R29180842-1808---45201808 1812(4532)431812S4318124343-21812-4343245321812 2220(5750)55--22205544-12221--5505650-③TEMPERATURE CHARACTERISTIC COG(NPO)C A N G CG COG/CH N C A C COG/CH A P2H(N150)P S--P P2H-P-P PH-R2H(N220)R1--R R2H-R-R RH-S2H(N330)S3--S S2H-S-S SH-T2H(N470)T O--T T2H-T-T TH-U2J(N750)U Z--U U2J-U UJ U UJ-S2L L Y--SL SL-G SL SL SL-X7R B C W R(X)X7R X7R B B C BJ X7R(B)Y(X) Z5U E E Z U-Z5U Z-E-Z5U U Y5V F G Y V Y5V Y5V Y F F F Y5V-④NOMINAL CAPACITANCE EX)103=10,000㎊221=220㎊225=2,200,000㎊=2.2㎌1R5=1.5㎊010=1㎊⑤CAPACITANCE TOLERANCE B:±0.1㎊C:±0.25㎊D:±0.5㎊F:±1%G:±2%J:±5%K:±10%M:±20%Z:-20~+80%⑥RATED VOLTAGE6.3V Q6-906 6.3-0J-J0J-10V P Z10081010-1A4L1A-16V O Y160416161601C3E1C J 25V A3250325252501E2T1E X 50V B5500550505001H5U1H A 100V C110111*********A1-2A B 200V D220122002002012D---C 250V E V--250250251---2E-500V G7501-500500501----E 630V H---630630----2J-1000V I A102-10001K102---3A G 2000V J G202-20002K202---3D-3000V K H302-30003K302---3F H 4000V-J-4000-402-----⑦TERMINATIONNICKEL BARRIER N T V C A(GRM)N-(MCH)--X Ag/Pd P1--B(GR)P-(MC)--F⑧PACKAGEBULK(VINYL)B9(NONE)-B PB*X-B B B PAPER TAPING C2,4T,R-T,L PT T E,V,W K,L T T C,P PLASTIC TAPING E1,3E,U-H,N PT-F,Y P,Q T-T,R BULK CASE P7--C PC-C C--G。
三星电容规格书
三星电容规格书1. 引言本规格书旨在介绍三星电容的详细规格和特性。
三星电容是一种高质量、可靠性强的电子元件，广泛应用于各种电路和设备中。
本文将从技术参数、材料特性、封装形式以及应用领域等方面对三星电容进行全面介绍。
2. 技术参数2.1 电容值三星电容提供多种不同的电容值，范围从几皮法到数百微法。
具体的电容值取决于产品型号和系列。
2.2 额定电压每个三星电容都有一个额定电压，表示其能够承受的最大工作电压。
额定电压可以从几伏到数百伏不等。
2.3 容差三星电容的容差指标表明了其实际值与标称值之间的允许偏差范围。
常见的容差包括±5%、±10%等。
2.4 工作温度范围三星电容适用于不同的工作温度范围，常见的工作温度范围包括-40℃至+85℃、-55℃至+125℃等。
2.5 极性部分三星电容是极性电容，需要按照正确的极性连接。
而非极性电容则不受极性限制。
3. 材料特性3.1 介质材料三星电容的介质材料通常采用高质量的聚合物或陶瓷材料。
这些材料具有良好的绝缘性能和稳定性，以确保电容的长期可靠运行。
3.2 极板材料三星电容的极板通常采用优质金属，如铝或钽。
这些金属具有良好的导电性和耐腐蚀性，以确保电容在工作中能够提供稳定可靠的电流传输。
3.3 封装材料三星电容的封装材料通常采用环保型塑料或金属外壳。
这些封装材料具有良好的机械强度和耐高温特性，以保护内部元件并提供稳定的外部连接。
4. 封装形式4.1 表面贴装型（SMD）三星电容可提供表面贴装型封装，方便在PCB上进行自动化焊接。
常见的封装形式有0805、1206、1210等，具体尺寸取决于电容的电容值和额定电压。
4.2 插件型三星电容也可提供插件型封装，适用于手工焊接或特殊应用场景。
插件型封装通常具有引脚，可直接插入PCB或插座中。
5. 应用领域5.1 通信设备三星电容广泛应用于各种通信设备，如手机、无线路由器、基站等。
其高质量和稳定性能确保了通信设备的可靠运行和优秀的信号传输质量。
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７．电容厚度编码：
3 = 0.30 עA = 0.65 עM = 1.15ע 5 = 0.50 עC = 0.85 עF = 1.25ע 8 = 0.80 עD = 1.00 עH = 1.60ע
I = 2.00ע J = 2.50ע L= 3.20ע
July 2006
MUTLAYER CERAMIC CAPACITORS
The specification and designs contained herein may be subject to change without notice.
QS 9000/ISO 9001
Registered by BSI to QS 9000 or ISO 9001 under BSI’s accreditation by UKAS for Certification. Registration NO : FM25309(2002. 2. 28)
6.Low ESL Capacitors
Packaging Specification
67
Reliability Test Condition
71
1.Appearance
2.Insulation Resistance
3.Withstanding Voltage
4.Capacitance
5.Q Factor / Tan Ҝ
Q = 1.25*ע V = 2.50*ע
８．电容内电极 ／ 端子 ／ 电镀编码：
Ａ＝常规产品 钯／银／镍屏蔽／锡 １００％ Ｎ＝常规产品 镍／铜／镍屏蔽／锡 １００％ Ｇ＝常规产品 铜／铜／镍屏蔽／锡 １００％ Ｌ＝低侧面产品 镍／铜／镍屏蔽／锡 １００％
９．产品编码：
Ａ ＝阵列（２－元素） Ｌ ＝ＬＩＣＣ Ｂ ＝阵列（４－元素） Ｎ ＝常规 Ｐ ＝自动 Ｃ＝高频
ＩＩ类
A=X5R F=Y5V B=X7R X=X6S
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４．电容容量编码：
电容容量用三位数表示，前面两位为有效数字，第三位为有效数字后＂Ｏ＂的位数 如：１０５ ＝ １０ ０００００ （单位ｐＦ） 如果中间一位为Ｒ 则表示＂．＂ 如：３Ｒ３ ＝ ３．３ｐＦ
５．电容精度编码：
B=ž0.1ؐ F =ž1ؐ, ž1%* C=ž0.25ؐ G=ž2% D=ž0.5ؐ J =ž5%
2.5ž0.2
2.5ž0.2
2.5ž0.3
2.5ž0.3
2.0ž0.2
2.0ž0.2
3.2ž0.3
3.2ž0.3
5.0ž0.4
3.2ž0.3
BW 0.2+0.15/-0.1
0.3ž0.2 0.5+0.2/-0.3 0.5+0.2/-0.3
Part Numbering System
CL 10 A 105 K Q 8 N N N C
1 2 3 4 5 6 7 8 9 10 11
１．系列编码：
ＣＬ＝积层陶瓷电容
２．尺寸编码 英寸（毫米）
03=0201(0603) 05=0402(1005) 10=0603(1608) 14=0504(1410)
6.Temperature Coefficient of Capacitance
7.Adhesive Strength of Termination
8.Bending Strength
9.Solderability
10.Resistance to Soldering Heat
11. Vibration Test
工作温度范围（℃）
-55 ~ +125 -55 ~ +125 -55 ~ +125 -55 ~ +125 -55 ~ +125 -55 ~ +125 -55 ~ +125
工作温度范围（℃）
-55 ~ +85 -55 ~ +125 -55 ~ +105 -30 ~ +85
电容步骤 2.2
2.2
3.3
2.2 2.7 3.3 3.9
1. RoHS Compliance and restriction of Br The following restricted materials are not used in packaging materials as well as products in compliance with the law and restriction. - Cd, Pb, Hg, Cr+6, As, Br and the compounds, PCB, asbestos - Bromic materials : PBBs, PBBOs, PBDO, PBDE, PBB
1.25
ž0.15
1808(4520)
0.85
ž0.15
1.00
ž0.15
1.10
ž0.10
1.15
ž0.10
1812(4532)
1.25
ž0.15
1.60
ž0.20
0.85
ž0.10
0.90
ž0.10
1.10
ž0.10
1.15
ž0.10
2220(5750)
1.25
ž0.20
1.35
ž0.15
编码
H U I J *V F H I F H I J L F H I J L
ž0.20
2.50
ž0.20
3.20
ž0.30
4 5
Part Numbering System
外型尺寸：
特征：
．尺寸的大小从：从０４０２到２２２０； ．ＰＣＢ高可靠公差和高速自动芯片更换； ．大电容范围； ．大温度补偿和电压范围：从ＣＯＧ到Ｙ５Ｖ和从６．３Ｖ到５０Ｖ； ．高可靠性性能； ．高电阻端子金属； ．表面贴装组件的带料和料盘
12.Humidity (Steady State)
13.Moisture Resistance
14.High Temperature Resistance
15. Thermal Cycle
16.Recommended Soldering Method
Application Manual for Surface Mounting
１０．特殊编码：
预留的用途
１１．包装编码：
Ｂ＝散装 Ｏ＝纸版箱料带，１０英寸料盘 Ｅ＝压花纸版箱，７英寸料盘 Ｐ＝散装箱 Ｄ＝纸版箱料带，１３英寸料盘（１００００ｅａ） Ｆ＝压花纸版箱，１３英寸料盘 Ｃ＝纸版箱料带，７英寸料盘 Ｌ＝纸版箱料带，１３英寸料盘（１５，０００ｅａ） Ｓ＝压花纸版箱，１０英寸料盘
BSI OHS 54734
BSI FM 90588
BSI EMS 66454
BSI OHS 54734
PHILIPPINES TIANJIN(CHINA)
BSI FM 62262
BSI EMS 77354
UL A14163
CNAB 02103SI0055ROL
CCEMS 012RO
THAILAND BSI
温度系数范围（ｐｐｍ／℃） 0 ž30 -150 ž60 -220 ž60 -330 ž60 -470 ž60
-750 ž120 -1000 ~ +350
电容变化（℃） ž15 ž15 ž22
-82 ~ +22
4.7
4.7
6.8
4.7 5.6 6.8 8.2
ƚƚƚ
尺寸 0201(0603) 0402(1005) 0603(1608) 0805(2012)
WE WILL PROVIDE A CUSTOMER WITH HIGH RELIABLE PRODUCTS AND SERVICES
003
We, Samsung, declare that our component MLCC is produced in accordance with EU RoHS directive.
Ｉ类
符号 C P R S T U L
ƚ
ＩＩ类
符号
A B X F
ＥＩＡ编码 C0G P2H R2H S2H T2H U2J S2L
ＥＩＡ编码 X5R X7R X6S Y5V
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系列 ＴＣ
E-3 Y5V
X5R E-6 X7R
X6S
1.0
1.0
1.5
E-12
C0G TC series
1.0
1.2 1.5
1.8
K =ž10% M=ž20%
Z =+80/-20%
*For Values Ƃ 10ؐ, F=ž1ؐ Values ͼ 10ؐ, F=ž1%
６．额定电压编码：
R=4V O =16V B =50V E = 250V I = 1000V Q=6.3V A =25V C=100V G = 500V J = 2000V P =10V L =35V D =200V H = 630V K= 3000V
应用领域
Ӌ仪器仪表，数码相机，液晶显示器，电视机，汽车导航系统，内存模块，掌上电脑，游戏机
结构和尺寸
L
T
W
BW
编码 05 10 21
31
32 42 43 55
（ＥＩＡ）编码 0402 0603 0805
1206
1210 1808 1812 2220
L 1.0ž0.05 1.6ž0.1 2.0ž0.1 2.0ž0.15 3.2ž0.2
1206(3216)
1210(3225)
编码
3 5 8 A C D F *Q C D E P F H C 9 E M F S