TowerJazz和Crocus合作量产TMR磁传感器
第三版 IO-Link 手册说明书
IO-Link手册第三版请访问：/CN目录引言第4页第1部分：IO-Link简介第5页◆老派传感器第5页◆微型开关量传感器驱动第5页◆I O-Link：开放式低成本传感器接口第5页◆I O-Link节点第5页◆I O-Link系统第6页◆I O-Link接口在IEC 61131-9中被标准化为SDCI第6页◆物理层IO-Link标准化接口第6页◆物理层电气规范第7页◆自动化体系中的IO-Link第7页◆I O-Link：实现智能传感器第7页◆工业传感器生态系统第8页第6部分：提高系统性能第24页◆散热第24页◆测试A第24页◆测试B第24页◆测试C第24页◆热性能第24页◆分立解决方案第25页◆集成解决方案第25页◆选择TVS二极管第25页◆I O-Link保护电路第25页◆65 V（绝对最大值）如何帮助提供保护（对比40 V）第25页◆65 V绝对最大值的保护优势第25页◆小结第26页◆I O-Link信号摆率如何影响IO-Link电缆辐射？第26页引言当今的无风扇可编程逻辑控制器(PLC)和IO-Link®网关系统须消耗大量功率，具体取决于I/O配置（IO-Link、数字输入/输出、模拟输入/输出）。
随着这些PLC演变成新的工业4.0智能工厂，我们必须深谋远虑，实现更智能、更快速、更低功耗的解决方案。
这场革命的核心是一项名为“IO-Link”的新技术，能帮助实现灵活制造，从而改善工厂吞吐量，提高运营效率。
这项激动人心的新技术正使传统传感器转变为智能传感器。
ADI公司提供一系列先进的工厂自动化解决方案，并通过我们的IO-Link技术产品系列进一步改进性能，为实现工业4.0铺路架桥。
MAX22513是该产品系列的最新成员，这是一款微型双通道IO-Link收发器，集成了浪涌保护和DC-DC转换器，可减少热耗散并提高工厂车间传感器的稳定性。
为了帮助我们的客户缩短上市时间，我们与来自IO-Link联盟的软件协议栈供应商合作开发了一系列经过全面验证和测试的参考设计，本手册对此进行了详细说明。
MAX1441 Proximity and Touch Sensor Programmer 使用手册
Maxim > Design Support > Technical Documents > Application Notes > Automotive > APP 5280Maxim > Design Support > Technical Documents > Application Notes > Energy Measurement & Metering > APP 5280Maxim > Design Support > Technical Documents > Application Notes > Sensors > APP 5280Keywords: passive keyless entry, PKE, remote keyless entry, RKE, signal conditioner, low power, proximity sensor, touch sensor, RF ID readers, meter tampering preventionAPPLICATION NOTE 5280MAX1441 Proximity and Touch Sensor Programmer User ManualBy: Youssof FathiDec 21, 2011Abstract: The MAX1441 proximity and touch sensor is designed for capacitive proximity sensing applications, including automotive passive remote keyless entry (PRKE). The sensor has 2-kwords of embedded flash that must be programmed with the user’s application firmware. This programmer was developed to facilitate programming of the MAX1441 flash memory in a production environment. The programmer continuously polls the USB-to-JTAG interface for a communicating MAX1441. Once the MAX1441 device is found, it will erase, program, and verify the embedded flash memory in approximately 3 seconds. It will then start polling for the next MAX1441 to be programmed. Multiple instances of the application can be launched on the same computer.IntroductionFor any manufacturing line, minimizing cost and maximizing efficiency are main concerns. To facilitate achieving this goal, Maxim has developed application software to program the MAX1441 automotive proximity and touch sensor's embedded flash memory in a production environment. The software will continuously poll the JTAG interface through the USB port for a communicating MAX1441. Once theMAX1441 device is found, it will perform a master erase of the flash memory, write the specified firmware into the flash memory, and verify its content. All three operations will be completed in approximately 3 seconds. The MAXQUSBJTAG-KIT device-driver must be properly installed before launching the software.The MAX1441 Programmer Software verifies completion of all the necessary operations before moving forward, guaranteeing that no extra time is spent and that the operation has been completed. Also, no user interaction is necessary with mouse or keyboard for the whole programming sequence. The user only inserts the MAX1441 and removes it after programming is complete, as the software automatically detects the presence or absence of the MAX1441. To avoid hot-plugging the MAX1441, an on/off power switch may be required. It is possible to run multiple instances of the application on the same computer. An available USB port and a MAXQUSBJTAG-KIT is required for each instance. When multiple instances of the application are running, there is no need to know which communication (COM) port the operating system has assigned to a particular socket. The preferred sequence of starting multiple instances of the application is to connect hardware of one instance to a USB port and start the programming for one device before starting the next one.RequirementsThe MAX1441 Programmer software requires the following:a. Windows XP®/Windows Vista®/7 (32 or 64-bit) computer.b. One available USB port for each instance of application running.c. One Maxim USB-to-JTAG board (MAXQUSBJTAG-KIT) for each instance of application running.Figure 1. File contents of the c:\MAX1441 folder.Figure 2. Virtual Communication Port Driver installation.USB-JTAG AdapterAfter the FTDI Virtual Communication Port Driver is installed, connect a MAXQUSBJTAG-KIT (Figure 3) to an available USB port, using a mini-USB connector.Figure 3. The Maxim USB-JTAG adapter (MAXQUSBJTAG-KIT).Once the adapter is found as a new hardware by the operating system, proper drivers installed in the previous step should be loaded. ToFigure 4. A Maxim USB-to-JTAG converter identified as USB Serial Port.Figure 5. Detailed View of C:\MAX1441 folder, indicating the application for direct launch. Figure 6. Screen shown when the MAX1441 Programmer is started directly.Figure 7. Properties window of "MAX1441_Programmer" shortcut.Figure 8. MAX1441 Programmer Search Mode.At this point, the software is actively looking for a MAX1441. The progress bar completes in approximately 13 seconds, and it returns to the beginning if a MAX1441 is not found. The Programmer will terminate and close if any key on the keyboard is pressed.Once a MAX1441 is found, flash memory programming starts and a window similar to the one in Figure 9 will be display.Figure 9. Programming Mode of the MAX1441 Production Programmer.Caution: The MAX1441 interface must NOT be disturbed while programming is in progress (while the yellow window is showing). Any interruption in communication between the programmer and the MAX1441 will cause programming to fail.The Programming line in Figure 9 shows the process progress. The "*" symbols indicate memory erasing, and the periods indicate progress in writing to flash memory. Each period indicates programming of 32 words (64 bytes) of memory. Total number of periods displayed will depend on the size of the application firmware. Once the programming session is completed, a green or a red window will show. If the device programming was successful, a green window will display (Figure 10). The programmer will immediately start searching for the next device to program. If the setup is not disturbed and same device is left in the setup, it will be reprogrammed after approximately 10 seconds. To terminate the application, press the ESC key, and to start reprogramming the same device without further delay, press any other key. If the device is removed from the setup, a window similar to that in Figure 8 will appear and programming willstart as soon as a communicating MAX1441 is reloaded.Figure 10. Pass Status screen of MAX1441 Programmer.If programming of the MAX1441 is not successful, a red window will display (Figure 11). Remove the device and load another one, press any key (but the ESC key) to reprogram the same device, or press the ESC key to terminate the application.Figure 11. Fail Status screen of the MAX1441 Programmer.In addition to displaying the green and red windows to indicate pass or fail programming of flash memory, the programmer will also toggle the OUT1 and OUT2 pins of the MAX1441 to reflect the programming operation progress and results:At the completion of flash-erase operation, both OUT1 and OUT2 pins will be pulled low and released. On the MAX1441 evaluation board, this will cause LED1 and LED2 to blink.If programming the flash is successful, OUT1 pin will be pulled low. On the MAX1441 evaluation board, this will cause LED1 to turn on. OUT1 will be kept low until MAX1441 is removed or next programming cycle is started.If programming the flash is unsuccessful, OUT2 pin will be pulled low. On the MAX1441 evaluation board, this will cause LED2 to turn on. OUT2 will be kept low until MAX1441 is removed or next programming cycle is started.When the programming of the current MAX1441 is complete, remove the device from the socket and insert the next one to be programmed.This application can be utilized in an automated manufacturing environment by using state of OUT1 and OUT2 pins to sort out (bin) the good and bad devices.Caution: While the MAX1441 Programmer is running, do not disconnect the USB cable connecting the Maxim USB-to-JTAG interface board to the computer. Any interruption will cause application to crash.Windows Vista is a registered trademark and registered service mark of Microsoft Corporation.Windows XP is a registered trademark and registered service mark of Microsoft Corporation.Related PartsMAX1441Automotive, Two-Channel Proximity and Touch SensorMAX1441EVSYS Evaluation System for the MAX1441MAXQUSBJTAG-KIT Evaluation Kit for the MAXQ USB-to-JTAG BoardMore InformationFor Technical Support: /supportFor Samples: /samplesOther Questions and Comments: /contactApplication Note 5280: /an5280APPLICATION NOTE 5280, AN5280, AN 5280, APP5280, Appnote5280, Appnote 5280Copyright © by Maxim Integrated ProductsAdditional Legal Notices: /legal。
TPS5450中文资料
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)(2)
VIN
VI
Input voltage range
BOOT PH (steady-state)
ENA
BOOT-PH
DISSIPATION RATINGS(1)(2)
PACKAGE 8 Pin DDA (4-layer board with solder)(3)
THERMAL IMPEDANCE JUNCTION-TO-AMBIENT
30°C/W
(1) Maximum power dissipation may be limited by overcurrent protection. (2) Power rating at a specific ambient temperature TA should be determined with a junction temperature of 125°C. This is the point where
元器件交易网
TPS5450
SLVS757 – MARCH 2007
5-A, WIDE INPUT RANGE, STEP-DOWN SWIFT™ CONVERTER
FEATURES
• Wide Input Voltage Range: 5.5 V to 36 V • Up to 5-A Continuous (6-A Peak) Output
1
2
3
4
5
6
IO - Output Current - A
飞旋(亿升)科技有限公司自主研发的“磁悬浮透平真空泵系统”通过
Enterprises Report ■ 企业报道672019年第10期 《造纸信息》本刊讯 2019年9月7日，由轻工业联合会组织的亿昇（天津）有限公司和天津飞旋科技有限公司（以下简称飞旋（亿昇）科技）共同完成的“磁悬浮透平真空泵系统”项目鉴定会在浙江富阳举行。
鉴定会由轻工业联合会有关领导主持，飞旋（亿昇）科技董事长洪申平致辞。
他首先表达了对鉴定组专家、参会的有关领导的衷心感谢，并介绍了飞旋（亿昇）科技的磁悬浮透平真空泵项目团队，他们最初是由十几名清华学霸组成的创业团队，学历背景强大，团队自主研发的多项核心技术都处于世界先进水平。
中国造纸装备领域知名专家胡楠教授担任本次鉴定委员会主任委员，鉴定委员会成员由来自国内磁悬浮领域的顶级专家、真空泵系统设备专家、造纸行业及造纸装备制造行业的多位专家学者组成。
飞旋（亿昇）科技总工程师沙宏磊向鉴定委员会做了项目汇报。
他详细介绍了由飞旋（亿昇）科技自主研发的高效智能磁悬浮透平真空泵系统的项目研究工作报告、技术报告、技术性能检测报告、用户使用情况、查新报告以及该项目的经济、社会效益。
随后，鉴定委员会进行了热烈讨论和详细的专家质询。
最终，鉴定委员会认为：该项目综合采用高速大承载磁悬浮轴承技术、大功率高防护等级高速永磁电机技术、大功率高速无传感变频控制技术、高效率耐腐蚀三元流叶轮技术、透平真空泵智能控制技术等自主技术，在全球范围内首次集成创新完成了75～1000 kW 系列“高效智能磁悬浮透平真空泵”产品设计和制造，成功应用于造纸行业。
产品具有效率高、噪音低、节能节水、维护简便等优点，节能效率为目前世界最高水平。
鉴定委员会认为项目总体技术达到国际领先水平，一致同意通过鉴定。
并建议进一步加强推广，扩大应用范围。
飞旋（亿昇）科技有限公司起步于2003年，是国内第一家从事磁悬浮轴承技术研究和应用的高科技企业，也是全球唯一一家全部拥有磁悬浮轴承及控制、高速永磁电机、高效率耐腐蚀三元流叶轮技术、高频变速四大核心技术的磁悬浮透平机装备企业，2017年被正式授牌为中国首家也是唯一一家“磁悬浮旋转机械工程技术中心”。
MLX90393_Datasheet_rev001
Part No. Temperature Code Package Code Silicon Version Option Code Packing Format MLX90393 S (-20°C to 85°C) LQ (QFN16 3x3mm) ABA 011 RE (Reel)1. ScopeThis document serves as a specification for a 3-axis magnetometer targeting low-power applications. The IC is based on the Hall-effect and the patented Triaxis® technology from Melexis. The output signals (raw X, Y, Z Magnetic data and Temperature data) will be provided through the I2C fast mode protocol, or via half-duplex SPI (3- or 4-wire). There is an on-board non-volatile memory to store calibration data on-chip.Figure 1: High-level Block DiagramV DDV SS2.Absolute Maximum RatingsThe MLX90393 can withstand the conditions described in the table below for short periods of time; they do not constitute conditions for normal operation.Parameter Remark Min Nom Max Unit V DD_MAX Analog Supply Voltage Limits -0.3 4 VV DD_IO_MAX Digital IO Supply Limits -0.3 min(4, V DD+0.3) V T STORAGE Storage (idle) temperature range -50 125 °C ESD HBM According to AEC-Q100-002 2.5 kV ESD CDM According to AEC-Q100-011-B (QFN) 750 V3.Thermal SpecificationThe MLX90393 has an on-board temperature sensor which measures the temperature of the MLX90393 sensor. The temperature can be read out via the communication protocol in a digital format.Parameter Remark Min Nom Max Unit T RES Temperature sensor resolution 45.2 LSB/°C T25Temperature sensor output at 25°C 46244 LSB16u T LIN Temperature Linearity(1)+/-3 °CT OPERATING Operating temperature range -20 25 85 °C(1)The linearity is defined as the best fit curve through the digital temperature outputs over the entiretemperature range. It includes ADC non-linearity effects.4.Electrical SpecificationThe specifications are applicable at 25degC, unless specified otherwise, and for the complete supply voltage range.(1)Standby current corresponds to the current consumed in the digital, where not the main oscillator isrunning which is used for analog sequencing, but only the low-power oscillator. This standby current is present in Burst mode; whenever the ASIC is counting down to start a new conversion.(2)Idle current is the current that is drawn by the ASIC in the IDLE mode, where it can only receive newcommands on the communication bus, but all other blocks are disabled. The analog (excluding the power-on-reset block) is disconnected, only the digital IO part allows clocking of a few vital gates.5.Timing SpecificationThe specifications are applicable at 25degC, unless specified otherwise, and for the complete supply voltage range.(1)This conversion time is defined as the time to acquire a single axis of the magnetic flux density.When measuring multiple axes, they are obtained through time-multiplexing, i.e. X(t), Y(t+T CONVM) and Z(t+2*T CONVM). The conversion time is programmable through parameters OSR and DIG_FILT for magnetic conversion time and OSR2 for temperature conversion time. The conversion sequence is always TXYZ, the opposite of the ZYXT argument of the command set.(2)The time T INTERVAL is defined as the time between the end of one set of measurements (anycombination of TXYZ) and the start of the following same set of measurements in BURST and WOC mode. As a result of this, the maximum output data rate is not only a function of T INTERVAL but equals 1/(T CONV_BURSTWOC + T INTERVAL).(3)6.Magnetic SpecificationThe specifications are applicable at 25degC, unless specified otherwise, and for the complete supply voltage range.(1)The offset thermal drift is defined as the deviation at 0Gauss from the output with respect to theoutput at 25°C when sweeping the temperature. The highest gradient (µT/°C) typically occurs at 85°C. The spec value is based on characterization on limited sample size at GAIN_SEL=0x7 and RES_XYZ=0x00.(2)The total axis sensitivity is programmable to support different applications, but has no AutomaticGain control on-chip as do the other angular position sensors from Melexis. The highest gain corresponds to at least the minimum +/-4.8mT magnetic measurement range and the magnetic resolution defined by SENS ii.(3)The sensitivity thermal drift is expressed as a band around the sensitivity at 25°C. It is applicable onwafer level trimming, but can be influenced by packaging (overmolding).,RES Z} X YFigure 2: XY axis RMS noise versus conversion time, expressed in mGauss for GAIN_SEL = 0x7Figure 3: Z axis RMS noise versus conversion time, expressed in mGauss for GAIN_SEL = 0x77.Functional SpecificationThe MLX90393 can operate in 3 modes:∙Burst mode: The ASIC will have a programmable data rate at which it willoperate. This data rate implies auto-wakeup and sequencing of the ASIC,flagging that data is ready on a dedicated pin (INT/DRDY). The maximumdata rate corresponds to continuous burst mode, and is a function of thechosen measurement axes. For non-continuous burst modes, the timeduring which the ASIC has a counter running but is not doing an actualconversion is called the Standby mode (STBY).∙Single Measure mode: The master will ask for data via the correspondingprotocol (I2C or SPI), waking up the ASIC to make a single conversion,immediately followed by an automatic return to sleep mode (IDLE) until thenext polling of the master. This polling can also be done by strobing the TRGpin instead, which has the same effect as sending a protocol command for asingle measurement.∙Wake-Up on Change: This mode is similar to the burst mode in the sensethat the device will be auto-sequencing, with the difference that themeasured component(s) is/are compared with a reference and in case thedifference is bigger than a user-defined threshold, the DRDY signal is set onthe designated pin. The user can select which axes and/or temperature fallunder this cyclic check, and which thresholds are allowed.The user can change the operating mode at all time through a specific command on the bus. The device waits in IDLE mode after power-up, but with a proper user command any mode can be set after power-up. Changing to Burst or WOC mode, coming from Single Measure mode, is always accompanied by a measurement first. The top-level state diagram indicating the different modes and some relevant timing is shown below in Figure 4. In the Measure state, the MDATA flag will define which components will be measured (ZYXT). The order of conversion is defined as TXYZ and can not be modified by the user, only the combination of axes is a degree of freedom.Arrows indicated in grey are the direct result of an Exit command. The main difference between STANDBY and WOC_IDLE is that in STANDBY mode, all analog circuitry is ready to make a conversion, but this is accompanied by a larger current consumption than IDLE mode. For burst mode this extra current consumption is justified because the emphasis is more on accurate timing intervals, avoiding the delay of T STBY before conversion and supporting an efficient continuous burst mode without standby overhead.It is the user’s responsibi lity to read back the measured data, the MLX90393 acts as a pure slave. Even in burst mode and WOC mode when the MLX90393 is auto-sequencing, the master will be responsible for collecting the acquired sensor data.TIMEm*T CONVM + T CONVTT ACTIVET STBYT PORFigure 4: Top-level state diagram with indication of timings7.1 Burst modeWhen the sensor is operating in burst mode, it will make conversions at specific time intervals. The programmability of the user is the following:∙ Burst speed (T INTERVAL ) through parameter BURST_DATA_RATE ∙ Conversion time (T CONV ) through parameters OSR, OSR2 and DIG_FILT∙ Axes/Temperature (MDATA) through parameter BURST_SEL or via the command argument (ZYXT)Whenever the MLX90393 has made the selected conversions (based on MDATA), the DRDY signal will be set (active H) on the INT and/or INT/TRG pin to indicate that the data is ready for readback. It will remain high until the master has sent the command to read out at least one of the converted quantities (ZYXT). Should the master have failed to read out any of them by the time the sensor has made a new conversion, the INT/DRDY pin will be strobed low for 10us, and the next rising edge will indicate a new set of data is ready.7.2 Single Measurement modeWhenever the sensor is set to this mode (or after startup) the MLX90393 goes to the IDLE state where it awaits a command from the master to perform a certain acquisition. The duration of the acquisition will be the concatenation of the T STBY, T ACTIVE, m*T CONVM(with m # of axes) and T CONVT. The conversion time will effectively be programmable by the user (see burst mode), but is equally a function of the required axes/temperature to be measured.Upon reception of such a polling command from the master, the sensor will make the necessary acquisitions, and set the DRDY signal high to flag that the measurement has been performed and the master can read out the data on the bus at his convenience. The INT/DRDY will be cleared either when:∙The master has issued a command to read out at least one of the measured components∙The master issues an Exit (EX) command to cancel the measurement∙The chip is reset, after POR (Power-on reset) or Reset command (RT)7.3Wake-Up on Change modeThe Wake-Up on Change (WOC) functionality can be set by the master with as main purpose to only receive an interrupt when a certain threshold is crossed. The WOC mode will always compare a new burst value with a reference value in order to assess if the difference between both exceeds a user-defined threshold. The reference value is defined as one of the following:∙The first measurement of WOC mode is stored as reference value once, as a result of a measurement. This measurement at “t=0” is then the basis for comparison or,∙The reference for acquisition(t) is always acquisition(t-1), in such a way that the INT signal will only be set if the derivative of any component exceeds a threshold.∙The in-application programmability is the same as for burst mode, but now the thresholds for setting the interrupt are also programmable by the user, as well as the reference, if the latter is data(t=0) or data(t-1).8.Digital SpecificationThe supported protocols are I2C and SPI. The SENB/CS pin is used to define the protocol to be used:∙/CS = 0 for SPI, addressing the MLX90393 slave in SPI mode (3- and 4-wire), but releasing this line in between commands (no permanent addressing allowed)∙/CS = 1 for I2C, addressing the MLX90393 slave when the correct address is transmitted over the bus (permanently kept high)To make sure the activity on the SPI bus can not be accidentally interpreted as I2C protocol, programming bits are available in the memory of the MLX90393 to force the communication mode. It concerns the COMM_MODE[1:0] bits with the following effect:8.1Command ListThe MLX90393 only listens to a specific set of commands. Apart from the Reset command, all commands generate a status byte that can be read out. The table below indicates the 10 different commands that are (conditionally) accepted by the MLX90393. The MLX90393 will always acknowledge a command in I2C, even if the command is not a valid command. Interpreting the associated status byte is the method for verification of command acceptance.The argument for the volatile memory access commands (RR/WR) «abc» should be set to 0x0h, in order to get normal read-out and write of the memory.The argument in all mode-starting commands (SB/SW/SM) is a nibble specifying the conversions to be performed by the sensor in the following order «zyxt». For example, if only Y axis and temperature are to be measured in Single Measurement mode the correct command to be transmitted is 0x35h. The sequence of measurement execution on-chip is inverted to «TXYZ», so T will be measured before X, followed by Y and finally Z. By issuing an all-zero «zyxt» nibble, the BURST_SEL value from RAM will be used instead of the empty argument of the command.8.2Status ByteThe status byte is the first byte transmitted by the MLX90393 in response to a command issued by the master. It is composed of a fixed combination of informative bits:∙MODE bitsthese bits define in which mode the MLX90393 is currently set. Whenever a mode transition command is rejected, the first status byte after this command will have the expected mode bit cleared, which serves as an indication that the command has been rejected, next to the ERROR bit. The SM_MODE flag can be the result of an SM command or from raising the TRG pin when TRG mode is enabled in the volatile memory of the MLX90393.∙ERROR bitthis bit is set in case a command has been rejected or in case an uncorrectable error is detected in the memory, a so called ECC_ERROR. A single error in the memory can be corrected (see SED bit), two errors can be detected and will generate the ECC_ERROR. In such a case all commands but the RT (Reset) command will be rejected. The error bit is equally set when the master is reading back data while the DRDY flag is low.∙SED bitthe single error detection bit simply flags that a bit error in the non-volatile memory has been corrected. It is purely informative and has no impact on the operation of the MLX90393.∙RS bitwhenever the MLX90393 gets out of a reset situation –both hard and soft reset –the RS flag is set to highlight this situation to the master in the first status byte that is read out. As soon as the first status byte is read, the flag is cleared until the next reset occurs.D[1:0] bitsthese bits only have a meaning after the RR and RM commands, when data is expected as a response from the MLX90393. The number of response bytes correspond to 2*D[1:0] + 2, so the expected byte counts are either 2, 4, 6 or 8. For commands where no response is expected, the content of D[1:0] should be ignored.8.3SPI CommunicationThe MLX90393 can handle SPI communication at a bitrate of 10Mhz. The SPI communication is implemented in a half-duplex way, showing high similarities with I2C communication, but addressing through the \CS (Chip Select) pin instead of through bus arbitration. The half-duplex nature is at the basis of the supported 3-wire SPI operation. SPI mode 3 is implemented: CPHA=1 (data changed on leading edge and captured on trailing edge, and CPOL=1 (high level is inactive state). The Chip Select line is active-low.The communication is also bundled in bytes, equally MSB first and MSByte first. A command can of course consist of more than 1 byte (refer to Chapter 8.1) as can the response be from the MLX90393 in the form of multiple bytes after the status byte (not shown in Figure 5)COMMAND[7:0]SCL MOSI 1234567812345678MISO/CS STATUS_BYTE[7:0]X (4-wire SPI) or Z (3-wire SPI)Z (3 & 4-wire SPI)ADDNADDFigure 5: SPI communication example8.4 I 2C CommuncationI 2C AddressThe I 2C address is made up of some hard-coded bits and a memory written value as follows:I2C_ADDR[6:0] = {EE_I2C_ADDR[4:0],A 1,A 0} with A i the user-selectable active-high value of the input pads of the MLX90393, referred to the V DD supply system and EE_I2C_ADDR[4:0] default programmed to 03h, but user accessible for overwrite.I 2C PrincipleThe MLX90393 supports I 2C communication in both Standard Mode and Fast Mode. Bytes are transmitted MSB first, and in order to reconstruct words, the bytes need to be concatenated MSByte first. The general principle of communication is always the same:∙ Initiating the communication is always done by the Master (Start condition S)∙ Addressing the Slave (MLX90393) followed by a cleared bit to indicate the Master intends to writesomething to the specific addressed Slave ∙ Acknowledging by the Slave if the transmitted address corresponds to the Slave’s I 2C address. If thelatter isn’t the case, any further activity on the bus except a Sr (Start Repeat) and P (Stop) condition will be ignored by the MLX90393 ∙ Sending a Command Byte by the Master, as depicted in Figure 6. The Slave will always acknowledgethis, even if it is an unrecognized command. A command such as WR and RR consist of more than 1 byte, which can then be transmitted sequentially over the I 2C bus. Referring to Figure 6 the COMMAND byte should then be a sequence of C OMMAND byte1, byte2, etc… ∙ Issuing a Start Repeat (Sr) condition by the Master in order to restart the addressing phase∙Addressing the Slave (MLX90393) followed by a set bit to indicate the Master intends to read something from the specific addressed Slave∙Acknowledging by the Slave if the transmitted address corresponds to the Slave’s I2C address. If the latter isn’t the case, any further activity on the bus except a Sr (Start Repeat) and P (Stop) condition will be ignored by the MLX90393∙Transmitting the Status Byte by the Slave, who is in control of the bus. Following the RR and RM commands the sensor returns additional data bytes after the status byte.∙Acknowledging by the Master if the data is well received∙Generating a Stop condition (P) by the masterThe Master controlled bus activity is shown in blue, the Slave controlled bus activity is shown in orange. In case a command is longer than a single byte (see Table 6), the bytes are transmitted sequentially before generating the Start Repeat (Sr) condition.I2C_ADDR[6:0]W ACKSCOMMAND[7:0]ACKI2C_ADDR[6:0]R ACK Sr STATUS_BYTE[7:0]ACKSCL SDA SCL SDA 123456789123456789123456789P 123456789Figure 6: Default I2C communication example with status byte readbackThe same applies to the Slave responses: following RR and RM commands, the Slave response is more than just the Status Byte. There as well, the data is partitioned in bytes that are transmitted sequentially by the slave. It is the Master’s responsibility to issue enough clocking p ulses to read back all the data. Finding out how many bytes is possible by decoding the Status Byte information, see Section Status Byte.Finally the master is also free to not read back the status byte when issuing a command. In doing so, he loses the ability to see if the command was received properly by the MLX90393. Moreover, the first SM command issued by the master after power-up or reset should have the status byte read back in order to get valid measurement data back.9. Memory MapThe MLX90393 has 1kbit of non-volatile memory, and the same amount of volatile memory. Each memory consists out of 64 addresses containing 16 bit words. The non-volatile memory has automatic 2-bit error detection and 1-bit error correction capabilities per address. The handling of such corrections & detections is explained in Section Status Byte. The memory is split in 2 areas:∙ Customer area [address 0x00h to 0x1Fh] ∙ Melexis area [address 0x20h to 0x3Fh]The RR and WR commands impact the volatile memory only, there no direct access possible to the non-volatile memory. The customer area of the volatile memory is bidirectionally accessible to the customer; the Melexis area is write-protected. Only modifications in the blue area are allowed with the WR command. The adjustments in the customer area can be stored in the permanent non-volatile memory with the STORE command HS, which copies the entire volatile memory including the Melexis area to the non-volatile one. With the HR command the non-volatile memory content can be recalled to the volatile memory, which can restore any modifications due to prior WR commands. The HR step is performed automatically at start-up of the ASIC, either through cold reset or warm reset with the RT command. The above is graphically shown in Figure 7.Figure 7: The memories of the MLX90393, their areas and the impacting commands.The customer area houses 3 types of data:∙Analog configuration bits∙Digital configuration bits∙Informative (free) bitsThe latter can be filled with customer content freely, and covers the address span from (and including) 0x0Ah to 0x1Fh, a total of 352 bits. The memory mapping of volatile and non-volatile memory on address level is identical. The volatile memory map is given in Figure 8.Figure 8: Customer area memory map.The non-volatile memory can only be written (HS store command) if pin VDD is supplied with 3.3V minimum, otherwise the write sequence can not be performed in a reliable way. Additionally, this HS command was designed to be used as one-time calibration, but not as multi write-cycle memory within the application. In case memory is written within the application, the number of write cycles should be kept to a minimum. There is no limit to the write cycles in the volatile memory (WR write command).9.1Parameter DescriptionThe meaning of each customer accessible parameter is explained in this section. The customer area of both the volatile and the non-volatile memory can be written through standard SPI and I2C communication, within the application. No external high-voltages are needed to perform such operations, nor access to dedicated pins that need to be grounded in the application.ANA_RESERVED_LOW : Reserved IO trimming bitsBIST : Enabled the on-chip coil, applying a Z-field [Built-In Self Test]Z_SERIES : Enable all plates for Z-measurementGAIN_SEL[2:0] : Analog chain gain setting, factor 5 between min and max code HALLCONF[3:0] : Hall plate spinning rate adjustmentTRIG_INT_SEL : Puts TRIG_INT pin in TRIG mode when cleared, INT mode otherwise COMM_MODE[1:0] : Allow only SPI [10b], only I2C [11b] or both [0Xb] according to CS pin WOC_DIFF : Sets the Wake-up On Change based on Δ{sample(t),sample(t-1)} EXT_TRIG : Allows external trigger inputs when set, if TRIG_INT_SEL = 0 TCMP_EN : Enables on-chip sensitivity drift compensationBURST_SEL[3:0] : Defines the MDATA in burst mode if SB command argument = 0 BURST_DATARATE[6:0] : Defines T INTERVAL as BURST_DATA_RATE * 20msOSR2[1:0] : Temperature sensor ADC oversampling ratioRES_XYZ[5:0] : Selects the desired 16-bit output value from the 19-bit ADCDIG_FILT[1:0] : Digital filter applicable to ADCOSR[1:0] : Magnetic sensor ADC oversampling ratioSENS_TC_HT[7:0] : Sensitivity drift compensation factor for T < T REFSENS_TC_LT[7:0] : Sensitivity drift compensation factor for T > T REFOFFSET_i[15:0] : Constant offset correction, independent for i = X, Y, ZWOi_THRESHOLD[15:0] : Wake-up On Change threshold, independent for i = X, Y, Z and T10.Packaging Specification10.1QFN packageThe MLX90393 shall be delivered in a QFN package as shown below in Figure 9.XZYFigure 9: Package Outline DrawingThe sensing elements – Hall plates with the patented IMC technology – are located in the center of the die, which on its turn is located in the center of the package. The pinout (in name and function) is given in Table 7 below.11.Standard information regarding manufacturability of Melexisproducts with different soldering processesOur products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods:Reflow Soldering SMD’s (Surface Mount Devices)IPC/JEDEC J-STD-020Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2)∙EIA/JEDEC JESD22-A113Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2)Wave Soldering SMD’s (Surface Mount D evices) and THD’s (Through Hole Devices)∙EN60749-20Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat∙EIA/JEDEC JESD22-B106 and EN60749-15Resistance to soldering temperature for through-hole mounted devicesIron Soldering THD’s (Through Hole Devices)∙EN60749-15Resistance to soldering temperature for through-hole mounted devicesSolderability SMD’s (Surface Mount D evices) and THD’s (Through Hole Devices)∙EIA/JEDEC JESD22-B102 and EN60749-21SolderabilityFor all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board.Melexis recommends reviewing on our web site the General Guidelines soldering recommendation (/Quality_soldering.aspx) as well as trim&form recommendations (/Assets/Trim-and-form-recommendations-5565.aspx).Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: /quality.aspx12.ESD PrecautionsElectronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products.13.Recommended Application Diagram13.1I2CA1A0 I2C Address13.2SPI14.Table of Contents1.Scope (1)2.Absolute Maximum Ratings (2)3.Thermal Specification (2)4.Electrical Specification (2)5.Timing Specification (3)6.Magnetic Specification (6)7.Functional Specification (9)7.1Burst mode (11)7.2Single Measurement mode (12)7.3Wake-Up on Change mode (12)8.Digital Specification (13)8.1Command List (13)8.2Status Byte (14)8.3SPI Communication (15)8.4I2C Communcation (16)I2C Address (16)I2C Principle (16)9.Memory Map (19)9.1Parameter Description (20)10.Packaging Specification (22)10.1QFN package (22)11.Standard information regarding manufacturability of Melexis products with different soldering processes (23)12.ESD Precautions (24)13.Recommended Application Diagram (25)13.1I2C (25)13.2SPI (25)。
TMS320F28335数据手册_引脚图_参数
• Enhanced Control Peripherals – Up to 18 PWM Outputs – Up to 6 HRPWM Outputs With 150 ps MEP Resolution – Up to 6 Event Capture Inputs – Up to 2 Quadrature Encoder Interfaces – Up to 8 32-Bit Timers (6 for eCAPs and 2 for eQEPs) – Up to 9 16-Bit Timers (6 for ePWMs and 3 XINTCTRs)
TMS320F28235PGF
LQFP (176)
24.0 mm × 24.0 mm
TMS320F28234PGF
LQFP (176)
24.0 mm × 24.0 mm
TMS320F28232PGF
LQFP (176)
24.0 mm × 24.0 mm
TMS320F28335PTP
• Boot ROM (8K × 16) – With Software Boot Modes (Through SCI, SPI, CAN, I2C, McBSP, XINTF, and Parallel I/O) – Standard Math Tables
• Clock and System Control – On-Chip Oscillator – Watchdog Timer Module
1.1 Features
施耐德Modicon M258可编程控制器产品目录
M258 可编程控制器都标配 4 路电压或电流模拟量输入 (12 位分辨率)。
<பைடு நூலகம்温度控制
此外还提供2、4或6通道以及12或16位不同分辨分辨率的扩展模块。 M258可编程控制器性能强大，能够连接多达200个模拟量I/O和/或温度模块，从而减
2
少了对设备需求的限制。
模拟量控制功能
< 速度控制
最多8通道高速 计数
软件组态
所有 M258
置和编程功能旨在降低成本和优化设备性能。
SoMachine 软件支持六种 IEC 61131-3 编程语言： v IL (指令表) v LD (梯形图) v SFC (顺序功能块) v ST (结构文本) v FBD (功能块图) v CFC (连续功能图)
另外还支持 PLCopen 功能块，以管理设备的运动控制和轴控制。
4个控制器状态ledrunmsbatteryapp0app16个内置通信端口状态ledethlaethstethnsusbhostmbscomcansts用于在5对称导轨上安装卸载的锁扣两个用于通信模块的pci闲置插槽带有可插拔接线端子和锁扣显示块和标签插槽的24电源模块io模块每个模块都具有带锁扣的可插拔接线端子显示io状态的显示块和标签夹持器插槽带上锁解锁功能的锁扣的可插拔接线端子在侧面用于连接下一个模块的总线扩展连接器rtc实时时钟电池插槽连接usb存储卡用于传输程序数据或固件更新的usba连接器标记为host用于连接编程计算机的usbb微型连接器标记为pgrport用于连接以太网和或magelisxbtgt图形终端的rj45连接器标记为ethernet用于连接rs232或rs485串行链路的rj45连接器标记为mbs9芯subd公头连接器标记为can0用于连接canopen总线仅限tm258lf42dt4ltm258lf42drtm258lf66dt4l1011
FANUC OM全参数说明书
71.6 1改成0 PMC启动时读入芯片程序FANUC 0系统参数功能目录（其中：0—T或0—M栏中为0的表示该类数控机床拥有此项功能，否则不具备次功能）表1 SETTING参数参数号符号意义—T—M0000 PWE 参数写入0 0 0000 TVON 代码竖向校验0 0 0000 ISO EIA/ISO代码0 0 0000 INCH MDI方式公/英制0 0 0000 I/O RS—232C口0 0 0000 SEQ 自动加顺序号0 0表2 RS232C口参数2/0 STP2 通道0停止位0 0 552 通道0波特率0 0 12/0 STP2 通道1停止位0 0 553 通道1波特率0 0 50/0 STP2 通道2停止位0 0 250 通道2波特率0 0 51/0 STP2 通道3停止位0 0 251 通道3波特率0 0 55/3 RS42 Remote Buffer 口RS232/522 0 0 390/7 NODC3 缓冲区满0 0表3 伺服控制轴参数1/0 SCW 公/英制丝杠0 03/0.1 .2.4 ZM回零方向0 08/2.3 .4 ADW轴名称30/0. 4 ADW轴名称32/2. 3 LIN3，4轴，回转轴/直线轴388/1 ROAX 回转回转轴循环功能0 388/2 RODRC 绝对指令近距离回转0 388/3 ROCNT 相对指令规算0 788 回转轴每转回转角度011/2 ADLN 第4轴，回转轴/直线轴0 398/1 ROAX 回转轴循环功能0 398/2 RODRC 绝对指令近距离回转0 398/3 ROCNT 相对指令规算0 788 回转轴每转回转角度0860 回转轴每转回转角度0 0500—503 INPX，YZ，4到位宽度0 0504—507 SERRX，Y，Z，4运动时误差极限0 0508—511 GRDSX,Y,Z,4栅格偏移量0 0512—515 LPGIN位置伺服增益0 0517 LPGIN 位置伺服增益（各轴增益）0 0518—521 RPDFX,Y,X,4G00速度0 0522—525 LINTX,Y,Z,4直线加/减速时间常数526 THRDT G92时间常数0528 THKFL G92X轴的最低速度0 0 527 FEDMX F的极限值0 0 529 FEEDT F的时间常数0 0 530 FEDFL 指数函数加减速时间常数0 0 533 RPDFL 手动快速成移动倍率的最低值0 0 534 ZRNFL 回零点的低速0 0535—538 BKLX,Y,Z,4反向间隙0 0593—596 STPEX,Y,Z,4伺服轴停止时的位置误差极限0 0393/5 快速倍率为零时机床移动0 0表3 坐标系参数10/7 APRS 回零点后自动设定坐标系0 0 2/1 PPD 自动设坐标系相对坐标值清零024/6 CLCL 手动回零后清除局部坐标系0 28/5 EX10D 坐标系外部偏移时刀偏量的值（×10）0708—711 自动设定工件坐标系的坐标值735—728 第二参考点0 0780—783 第三参考点0 0784—787 第四参考点0 0表4 行程限位8/6 OTZN Z轴行程限位检查否0 15/4 LM2 第二行行程限位0 24/4 INOUT 第三行行程限位0 57/5 HOT3 超行程—LMX—+LMZ有效0 65/3 PSOT 回零点前是否检查行程限位0 0700—703 各轴正向行程0 0704—707 各轴负向行程0 015/2 COTZ 超行程—LMX—+LMZ有效0 20/4 LM2 第二行行程限位0 24/4 INOUT 第三行行程限位0743—746 第二行行程正向限位747—750 第二行行程反向限位804—806 第三行行程正向限位807—809 第三行行程反向限位770—773 第二行行程正向限位774—777 第二行行程反向限位747—750 第三行行程正向限位751—754 第三行行程反向限位760—763 第四行行程正向限位764—767 第四行行程反向限位表5 进给与伺服电机参数1/6 RDRN 空运行时，快速移动指令是否有效0 0 8/5 ROVE 快速倍率信号ROV2（G117/7）有效0 49/6 NPRV 不用位置编码器实现主轴每转进给0 0 20/5 NCIPS 是不进行到位检查0 0 4—7 参考计数器容量0 0 4—7 检测倍比0 021/0.1.2.3 APC绝对位置编码器0 035/7 ACMR 任意CMR 0 037/0.1.2.3 SPTP用分离型编码器0 0100—103 指令倍比CMR0 0表6 DI/DO参数8/7 EILK Z轴/各轴互锁0 09/0.1 .2.3 TFINFIN信号时间0 09/4.5 .6.7 TMFM，S，T读信号时间0 012/1 ZILK Z轴/所有轴互锁0 31/5 ADDCF GR1，GR2，DRN地址0252 复位信号扩展时间0 0表7 显示和编辑1/1 PROD 相对坐标显示是否包括刀补量0 0 2/1 PPD 自动设坐标系相对坐标清零0 0 15/1 NWCH 刀具磨损补偿显示W 0 0 18/5 PROAD 绝对坐标系显示是否包括刀补量0 23/3 CHI 汉字显示0 0 28/2 DACTF 显示实际速度0 029/0. 1 DSP第3，4轴位置显示35/3 NDSP 第4轴位置显示0 38/3 FLKY 用全键盘0 0 48/7 SFFDSP 显示软按键0 0 60/0 DADRDP 诊断画面上显示地址字0 0 60/2 LDDSPG 显示梯形图0 0 60/5 显示操作监控画面0 0 64/0 SETREL 自动设坐标系时相对坐标清零0 0 77/2 伺服波形显示0 0 389/0 SRVSET 显示伺服设定画面0 0 389/1 WKNMDI 显示主轴调整画面0 0表8 编程参数10/4 PRG9 O9000—O9999号程序保护0 0 15/7 CPRD 小数点的含义0 0 28/4 EXTS 外部程序号检索0 0 29/5 MABS MDI—B中，指令取决于G90/G91设定0 389/2 PRG8 O8000—O8999号程序保护0 0394/6 WKZRST 自动设工件坐标系时设为G54 0 表9 螺距误差补偿11/0. 1 PML螺补倍率0 0712—715 螺补间隔756—759 螺补间隔1000，2000 3000，4000 补偿基准点0 01001-1128 2001-2128 3001-3128 4001-4128 补偿值0 0表10 刀具补偿1/3 TOC 复位时清除刀长补偿矢量0 0 1/4 ORC 刀具补偿值（半径/直径输入）08/6 NOFC 刀补量计数器输入010/5 DOFSI 刀偏量直接输入013/1 GOFU2 几何补偿号（由刀补号或刀号）指定013/2 GMOFS 加几何补偿值（运动/变坐标）014/0 T2D T代码位数014/1 GMCL 复位时是否清几何补偿值014/5 WIGA 刀补量的限制015/4 MORB 直接输入刀补测量值的按钮024/6 QNI 刀补测量B时补偿号的选择075/3 WNPT刀尖补偿号的指定（在几何还是在磨损中）122 刀补偿量B时的补偿号0728 最大的刀具磨损补偿增量值0729 最大的刀具磨损补偿值078/0 NOINOW 用MDI键输入磨损补偿量0 0 78/1 NOINOG 用MDI键输入几何补偿量0 0 78/2 NOINMV 用MDI键输入宏程序变量0 0 78/3 NOINMZ 用MDI键输入工件坐标偏移量0 0 393/2 MKNMDI 在自动方式的停止时，用MDI键输入0 0工件坐标偏移量表11 主轴参数13/5 ORCM 定向时，S模拟输出的极性13/6.7 TCW,CWM S模拟M03，M04的方向0 0 14/2 主轴转速显示0 0 24/2 SCTO 是否检查SAR（G120/4）0 0 49/0 EVSF SF的输出0 0 71/0 ISRLPC 串行主轴时编码器信号的接法071/4 SRL2SP 用1或2个串行主轴071/7 FSRSP 是否用串行主轴0108G96或换档（#3/5：GST=1）或模拟主轴定向（SOR：G120/5：M=1）速度0 0110 检查SAR（G120/4）的延时时间0 516 模拟主轴的增益（G96）0539模拟主轴电动机的偏移补偿电压（G96）551 G96的主轴最高转速0 556 G96的主轴最高转速0540—543 各档主轴的最高转速3/5 GST 用SOR（G120/5）定向/换档0 14/0 SCTA 加工启动时检查SAR信号0 20/7 SFOUT 换档时输出SF 0 29/4 FSOB G96时输出SF 0 35/6 LGCM 各档最高速的参数号0539,54 1,555 各档的主轴最高转速542 主轴最高转速0 543 主轴最低转速0585,58 6 主轴换档速度（B型）577 模拟主轴电动机的偏移补偿电压0 6519/7 主轴电动机初始化0 0 6633 主轴电动机代码0 06501/2 POSC2 用位置编码器0 06501/5 -7 CAXIS1—3用高分辩率编码器0 06503/0 PCMGSL 定向方法（编码器/磁传感器）0 0 6501/1 PCCNCT 内装传感器0 06501/4 .6.7 位置编码器信号0 06504/1 HRPC 高分辩率编码器0 0表12 其它24/0 JGNPMC 用PMC 0 071/6 DPCRAM 显示PMC操作菜单0 0123 图形显示的绘图坐标系00001ADFT RDRN DECI ORC TOC DCS PROD DCS7 6 5 4 3 2 1 0 ADFT 1：进行自动漂移补偿。
MEMS陀螺仪传感器专用ASIC简介及设计
MEMS陀螺仪传感器专用ASIC简介及设计王浩（无锡华润上华科技有限公司设计服务中心，上海，200072）摘要：MEMS做为本世纪前沿技术，有着非常广阔的前景，越来越受到业界专注。
本文介绍了华润上华设计中心研发的3轴陀螺仪专用ASIC的相关设计方法和电路。
该电路主要由电荷放大器、相位检测器、积分电路、高性能模数转换器、温度感应器及直接数字综合电路等组成，其突出特点是高精度、低功耗、小面积，在满足不断增长的消费电子用MEMS陀螺仪市场需求方面处于世界前沿。
关键词：微电机系统；陀螺仪；模数转换器；电荷放大器；相位检测器；幅度检测器；同步检测器；温度传感器；直接数字综合MEMS Gyroscope Sensor ASIC Introduction and DesignWANG Hao（Design service center,CSMC technologies Corporation,Shanghai200072,China）Abstract:As advanced technology of this century,MEMS has a very broad prospect and is increasingly focused by the industry.This paper introduces the related design methods and circuits of the3-axis gyroscope-specific ASIC de-veloped by CSMC.The circuit is mainly composed of a charge amplifier,a phase detector,an integrating circuit,a high-performance analog-to-digital converter,a temperature sensor,and a DDS.Its outstanding features are high precision,low power consumption,and small area.This ASIC is at the forefront of the world in the market demand for consumer electronics.Key words:MEMS;Gyroscope;ADC;CA;PD;AMD;SD;TS;DDS1概述微机械MEMS是英文Micro Electro Mechanical systems的缩写，即微电子机械系统。
艾默生 Rosemount 644 温度变送器 说明书
产品说明书00813-0106-4728, Rev ZR2024 年 10 月Rosemount™ 644 温度变送器多功能温度变送器使用 Rosemount 644 系列多功能温度变送器，可降低各种温度应用的复杂性并简化其日常操作。
利用易于使用的新型 Rosemount 644 温度变送器功能，包括诊断、安全认证、整体瞬变保护和显示选项等，帮助您为流程做出更好的决策。
功能和优点采用可定制的变送器设计，在一个型号产品系列内满足您的需求■DIN 头部安装型、现场安装型■4–20 mA/HART ®可选第 5 和第 7 修订版、F OUNDATION ™现场总线或 PROFIBUS ® PA 协议支持■安全完整性等级 (SIL) 3 认证：公认的第三方机构对在达到 SIL 3要求 (SIL 2 单用 [1oo1] 和 SIL 3 冗余使用 [1oo2] 的最低要求)。
的仪表安全系统中的使用进行了 IEC 61508 认证。
■带有本地操作员界面 (LOI) 的增强型显示屏■LCD 显示屏■整体瞬变保护■增强的精度和稳定性■变送器-传感器匹配（卡伦德-范·杜森常数）■多种外壳类型使用资产位号随时获取信息新发运设备包含一个唯一的二维码资产位号，您可以通过它直接从设备访问序列化信息。
通过此功能，您可以：■在您的 MyEmerson 账号上访问设备图纸、图表、技术文档和故障排除信息■优化维修和保持效率的平均时间■确保您定位了正确的设备■省去耗时的先定位和抄录铭牌再查看资产信息的工作内容功能和优点............................................................................................................................................................................................2订购信息...............................................................................................................................................................................................5技术规格 .. (16)尺寸图.................................................................................................................................................................................................30产品认证 (45)Rosemount 6442024 年 10 月Rosemount 644 选择指南Rosemount 644 HART ®变送器HART 头部安装型和现场安装型表 1:头部安装型热电偶、mV 和欧姆的单或双传感器输入头部安装和现场安装变送器Rosemount 644F OUNDATION ™现场总线2024 年 10 ■用于RTD 、热电偶、mV 和欧姆的单传感器输入■DIN A 头部安装变送器■标准功能块：2 个模拟输入，1 个 PID 和 1 个备用链路活动调度器 (LAS)■LCD 显示屏月Rosemount 644Rosemount 6443■与 ITK 6.01 兼容■变送器-传感器匹配（卡伦德-范·杜森常数）■整体瞬变保护Rosemount 644PROFIBUS ®PA■用于RTD 、热电偶、mV 和欧姆的单传感器输入■DIN A 头部安装变送器■标准功能块：1 个物理模块，1 个传感器和 1 个模拟输入■LCD 显示屏■符合 PROFIBUS PA Profile 3.02■变送器-传感器匹配（卡伦德-范·杜森常数）易于使用的人性化设计，使您的工作更简单■通过直观的设备仪表板 (DD)，诊断信息和过程健康状况唾手可得。
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
TowerJazz和Crocus合作量产TMR磁传感器
据麦姆斯咨询报道，全球专业代工领导者TowerJazz和TMR（隧道磁
阻）磁传感器技术及嵌入式MRAM（磁随机存储器）领先开发商Crocus公
司，近日共同宣布双方将利用TowerJazz公司Cu BEOL（后道工序）中具有
专用磁模块的0.13um CMOS工艺，大规模量产Crocus公司的TMR传感
器。Crocus公司通过将自己的磁传感器制造工艺、专有技术和IP，结合
TowerJazz公司的工艺技术及集成经验，成功的将TMR技术授权给了一家汽
车Tier 1客户，为合作双方带来了业务提升。数月前，Crocus公司曾宣布，
将其先进的TMR磁传感技术相关IP授权给汽车半导体解决方案全球领导者
NXP Semiconductors（恩智浦半导体）。TMR技术能够帮助实现动力转向和
电子节气门控制（ETC）等下一代应用。授权合作将帮助NXP为其汽车应用
带来更高的灵敏度和性能，进一步降低功耗，提高集成度。据麦姆斯咨询此
前报道，2015年全球磁传感器市场规模约为22.5亿美元，预计到2022年将
增长至41.6亿美元，2016~2022年期间的复合年增长率为8.87%。市场增长