数字温度传感器

数字温度传感器
数字温度传感器

1.General description

The LM75B is a temperature-to-digital converter using an on-chip band gap temperature sensor and Sigma-Delta A-to-D conversion technique with an overtemperature detection output. The LM75B contains a number of data registers: Con?guration register (Conf) to store the device settings such as device operation mode,OS operation mode,OS polarity and OS fault queue as described in Section 7 “Functional description”; temperature

register (T emp)to store the digital temp reading,and set-point registers (Tos and Thyst)to store programmable overtemperature shutdown and hysteresis limits, that can be communicated by a controller via the 2-wire serial I 2C-bus interface. The device also

includes an open-drain output (OS)which becomes active when the temperature exceeds the programmed limits.There are three selectable logic address pins so that eight devices can be connected on the same bus without address con?ict.

The LM75B can be con?gured for different operation conditions. It can be set in normal mode to periodically monitor the ambient temperature, or in shutdown mode to minimize power consumption. The OS output operates in either of two selectable modes:

OS comparator mode or OS interrupt mode. Its active state can be selected as either HIGH or LOW. The fault queue that de?nes the number of consecutive faults in order to activate the OS output is programmable as well as the set-point limits.

The temperature register always stores an 11-bit 2's complement data giving a

temperature resolution of 0.125°C.This high temperature resolution is particularly useful in applications of measuring precisely the thermal drift or runaway. When the LM75B is accessed the conversion in process is not interrupted (i.e., the I 2C-bus section is totally independent of the Sigma-Delta converter section) and accessing the LM75B

continuously without waiting at least one conversion time between communications will not prevent the device from updating the Temp register with a new conversion result. The new conversion result will be available immediately after the Temp register is updated.The LM75B powers up in the normal operation mode with the OS in comparator mode,temperature threshold of 80°C and hysteresis of 75°C, so that it can be used as a stand-alone thermostat with those pre-de?ned temperature set points.

2.Features

I Pin-for-pin replacement for industry standard LM75 and LM75A and offers improved temperature resolution of 0.125°C and speci?cation of a single part over power supply range from 2.8V to 5.5V

I I 2C-bus interface with up to 8 devices on the same bus I Power supply range from 2.8V to 5.5V

I T emperatures range from ?55°C to +125°C

LM75B

Digital temperature sensor and thermal watchdog

Rev. 02 — 9 December 2008

Product data sheet

I Frequency range 20Hz to 400kHz with bus fault time-out to prevent hanging up the

bus

I11-bit ADC that offers a temperature resolution of 0.125°C

I Temperature accuracy of:

N±2°C from?25°C to +100°C

N±3°C from?55°C to +125°C

I Programmable temperature threshold and hysteresis set points

I Supply current of 1.0μA in shutdown mode for power conservation

I Stand-alone operation as thermostat at power-up

I ESD protection exceeds 4500V HBM per JESD22-A114, 450V MM per

JESD22-A115 and 2000V CDM per JESD22-C101

I Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100mA

I Small 8-pin package types: SO8, TSSOP8 and 3mm×2mm XSON8U

3.Applications

I System thermal management

I Personal computers

I Electronics equipment

I Industrial controllers

4.Ordering information

Table 1.Ordering information

Type number Topside

mark

Package

Name Description Version

LM75BD LM75BD SO8plastic small outline package; 8 leads; body width3.9mm SOT96-1 LM75BDP LM75B TSSOP8plastic thin shrink small outline package; 8 leads; body width3mm SOT505-1 LM75BGD75B XSON8U plastic extremely thin small outline package; no leads; 8terminals;

UTLP based; body 3×2×0.5mm

SOT996-2

5.Block diagram

6.Pinning information

6.1Pinning

Fig 1.Block diagram of LM75B

LM75B

SDA V CC

SCL A0OS

A1GND

A2002aad453

BIAS REFERENCE

BAND GAP TEMP SENSOR

OSCILLATOR

POWER-ON RESET

11-BIT SIGMA-DELTA

A-to-D CONVERTER

POINTER REGISTER TIMER COMPARATOR/INTERRUPT

COUNTER

LOGIC CONTROL AND INTERFACE

CONFIGURATION

REGISTER THYST REGISTER

TOS REGISTER TEMPERATURE REGISTER Fig 2.Pin con?guration for SO8Fig 3.Pin con?guration for TSSOP8

Fig 4.

Pin con?guration for XSON8U

LM75BD

SDA V CC SCL A0OS A1GND

A2

002aad454

1234

65

8

7LM75BDP

SDA V CC SCL A0OS A1GND

A2

002aad455

1234

65

8

7002aae234

LM75BGD

Transparent top view

87

65

12

34

SDA SCL OS GND

V CC A0A1A2

6.2Pin description

Table 2.Pin description

Symbol Pin Description

SDA1Digital I/O. I2C-bus serial bidirectional data line; open-drain.

SCL2Digital input. I2C-bus serial clock input.

OS3Overtemp Shutdown output; open-drain.

GND4Ground. To be connected to the system ground.

A25Digital input. User-de?ned address bit2.

A16Digital input. User-de?ned address bit1.

A07Digital input. User-de?ned address bit0.

V CC8Power supply.

7.Functional description

7.1General operation

The LM75B uses the on-chip band gap sensor to measure the device temperature with

the resolution of0.125°C and stores the11-bit2's complement digital data,resulted from

11-bit A-to-D conversion,into the device Temp register.This Temp register can be read at

any time by a controller on the I2C-bus. Reading temperature data does not affect the

conversion in progress during the read operation.

The device can be set to operate in either mode:normal or shutdown.In normal operation

mode, the temp-to-digital conversion is executed every 100ms and the Temp register is

updated at the end of each conversion. During each ‘conversion period’ (T conv) of about

100ms the device takes only about 10ms, called ‘temperature conversion time’ (t conv(T)),

to complete a temperature-to-data conversion and then becomes idle for the time

remaining in the period. This feature is implemented to signi?cantly reduce the device

power dissipation. In shutdown mode, the device becomes idle, data conversion is

disabled and the Temp register holds the latest result; however, the device I2C-bus

interface is still active and register write/read operation can be performed. The device

operation mode is controllable by programming bit B0 of the con?guration register. The

temperature conversion is initiated when the device is powered-up or put back into normal

mode from shutdown.

In addition,at the end of each conversion in normal mode,the temperature data(or T emp)

in the T emp register is automatically compared with the overtemperature shutdown

threshold data (or T th(ots)) stored in the Tos register, and the hysteresis data (or T hys)

stored in the Thyst register, in order to set the state of the device OS output accordingly.

The device T os and Thyst registers are write/read capable, and both operate with 9-bit

2's complement digital data. To match with this 9-bit operation, the Temp register uses

only the 9MSB bits of its 11-bit data for the comparison.

The way that the OS output responds to the comparison operation depends upon the OS

operation mode selected by con?guration bit B1,and the user-de?ned fault queue de?ned

by con?guration bits B3 and B4.

In OS comparator mode, the OS output behaves like a thermostat. It becomes active when the T emp exceeds the T th(ots), and is reset when the Temp drops below the T hys .Reading the device registers or putting the device into shutdown does not change the state of the OS output. The OS output in this case can be used to control cooling fans or thermal switches.

In OS interrupt mode, the OS output is used for thermal interruption. When the device is powered-up,the OS output is ?rst activated only when the Temp exceeds the T th(ots);then it remains active inde?nitely until being reset by a read of any register.Once the OS output has been activated by crossing T th(ots)and then reset,it can be activated again only when the Temp drops below the T hys ; then again, it remains active inde?nitely until being reset by a read of any register.The OS interrupt operation would be continued in this sequence:T th(ots)trip, Reset, T hys trip, Reset, T th(ots)trip, Reset, T hys trip, Reset, etc. Putting the

device into the shutdown mode by setting the bit 0of the con?guration register also resets the OS output.

In both cases, comparator mode and interrupt mode, the OS output is activated only if a number of consecutive faults, de?ned by the device fault queue, has been met. The fault queue is programmable and stored in the two bits, B3 and B4, of the Con?guration register. Also, the OS output active state is selectable as HIGH or LOW by setting accordingly the con?guration register bit B2.

At power-up, the device is put into normal operation mode, the T th(ots) is set to 80°C, the T hys is set to 75°C,the OS active state is selected LOW and the fault queue is equal to 1.The temp reading data is not available until the ?rst conversion is completed in about 100ms.

The OS response to the temperature is illustrated in Figure 5.

(1)OS is reset by either reading register or putting the device in shutdown mode. It is assumed that

the fault queue is met at each T th(ots) and T hys crossing point.

Fig 5.OS response to temperature

002aae334

(1)(1)(1)

T th(ots)

T hys

OS reset OS active

OS reset OS active

OS output in comparator mode

OS output in interrupt mode

reading temperature limits

7.2I 2C-bus serial interface

The LM75B can be connected to a compatible 2-wire serial interface I 2C-bus as a slave device under the control of a controller or master device,using two device terminals,SCL and SDA.The controller must provide the SCL clock signal and write/read data to/from the device through the SDA terminal.Notice that if the I 2C-bus common pull-up resistors have not been installed as required for I 2C-bus, then an external pull-up resistor, about 10k ?,is needed for each of these two terminals. The bus communication protocols are described in Section 7.10.

7.2.1Bus fault time-out

If the SDA line is held LOW for longer than t to (75ms minimum /13.3Hz; guaranteed at 50ms minimum /20Hz), the LM75B will reset to the idle state (SDA released) and wait for a new ST ART condition. This ensures that the LM75B will never hang up the bus should there be con?ict in the transmission sequence.

7.3Slave address

The LM75B slave address on the I 2C-bus is partially de?ned by the logic applied to the device address pins A2,A1and A0.Each of them is typically connected either to GND for logic 0, or to V CC for logic 1. These pins represent the three LSB bits of the device 7-bit address. The other four MSB bits of the address data are preset to ‘1001’ by hard wiring inside the LM75B.T able 3 shows the device’s complete address and indicates that up to 8devices can be connected to the same bus without address con?ict. Because the input pins,SCL,SDA and A2to A0,are not internally biased,it is important that they should not be left ?oating in any application.

7.4Register list

The LM75B contains four data registers beside the pointer register as listed in Table 4.The pointer value, read/write capability and default content at power-up of the registers are also shown in T able 4.

Table 3.Address table 1 = HIGH; 0 = LOW.MSB LSB 1

1

A2

A1

A0

Table 4.

Register table

Register name Pointer value R/W POR state Description

Conf 01h R/W 00h Con?guration register: contains a single 8-bit data byte;to set the device operating condition;default =0.T emp 00h read only n/a Temperature register: contains two 8-bit data bytes;to store the measured Temp data.

T os

03h

R/W

5000h

Overtemperature shutdown threshold register:contains two 8-bit data bytes; to store the overtemperature shutdown T th(ots) limit;default =80°C.

Thyst 02h R/W 4B00h

Hysteresis register: contains two 8-bit data bytes;to store the hysteresis T hys limit; default =75°C.

7.4.1Pointer register

The Pointer register contains an 8-bit data byte, of which the two LSB bits represent the pointer value of the other four registers,and the other6MSB bits are equal to0,as shown in T able5 and T able6. The Pointer register is not accessible to the user, but is used to

select the data register for write/read operation by including the pointer data byte in the

bus command.

Table 5.Pointer register

B7B6B5B4B3B2B[1:0]

000000pointer value

Table 6.Pointer value

B1B0Selected register

00Temperature register (Temp)

01Con?guration register (Conf)

10Hysteresis register (Thyst)

11Overtemperature shutdown register (Tos)

Because the Pointer value is latched into the Pointer register when the bus command

(which includes the pointer byte) is executed, a read from the LM75B may or may not

include the pointer byte in the statement. To read again a register that has been recently read and the pointer has been preset, the pointer byte does not have to be included. T o read a register that is different from the one that has been recently read, the pointer byte must be included. However, a write to the LM75B must always include the pointer byte in the statement. The bus communication protocols are described in Section7.10.

At power-up,the Pointer value is equal to00and the Temp register is selected;users can then read the T emp data without specifying the pointer byte.

7.4.2Con?guration register

The Con?guration register (Conf) is a write/read register and contains an 8-bit

non-complement data byte that is used to con?gure the device for different operation

conditions.T able7 shows the bit assignments of this register.

Table 7.Conf register

Legend: * = default value.

Bit Symbol Access Value Description

B[7:5]reserved R/W000*reserved for manufacturer’s use; should be kept as

zeroes for normal operation

B[4:3]OS_F_QUE[1:0]R/W OS fault queue programming

00*queue value = 1

01queue value = 2

10queue value = 4

11queue value = 6

B2OS_POL R/W OS polarity selection

0*OS active LOW

1OS active HIGH

7.4.3Temperature register

The T emperature register (T emp) holds the digital result of temperature measurement or monitor at the end of each analog-to-digital conversion. This register is read-only and contains two 8-bit data bytes consisting of one Most Signi?cant Byte (MSByte) and one Least Signi?cant Byte (LSByte).However,only 11bits of those two bytes are used to store the T emp data in 2’s complement format with the resolution of 0.125°C.Table 8shows the bit arrangement of the T emp data in the data bytes.

When reading register Temp, all 16bits of the two data bytes (MSByte and LSByte) are provided to the bus and must be all collected by the controller to complete the bus operation. However, only the 11 most signi?cant bits should be used, and the 5 least

signi?cant bits of the LSByte are zero and should be ignored.One of the ways to calculate the Temp value in °C from the 11-bit Temp data is:

1.If the Temp data MSByte bit D10=0,then the temperature is positive and Temp value (°C)=+(T emp data)×0.125°C.

2.If the T emp data MSByte bit D10=1, then the temperature is negative and T emp value (°C)=?(2’s complement of Temp data)×0.125°C.Examples of the Temp data and value are shown in Table 9.

B1

OS_COMP_INT R/W

OS operation mode selection

0*OS comparator 1

OS interrupt

B0

SHUTDOWN

R/W

device operation mode selection 0*normal 1

shutdown

Table 7.Conf register …continued Legend: * = default value.Bit Symbol

Access Value Description

Table 8.Temp register

MSByte LSByte 7654321076543210D10

D9

D8

D7

D6

D5

D4

D3

D2

D1

D0

X

X

X

X

X

Table 9.

Temp register value

11-bit binary

(2’s complement)Hexadecimal value Decimal value Value 011 1111 10003F81016+127.000°C 011 1111 01113F71015+126.875°C 011 1111 00013F11009+126.125°C 011 1110 10003E81000+125.000°C 000 1100 10000C8200+25.000°C 000 0000 00010011+0.125°C 000 0000 000000000.000°C 111 1111 1111

7FF

?1

?0.125°C

For 9-bit Temp data application in replacing the industry standard LM75, just use only 9MSB bits of the two bytes and disregard 7LSB of the LSByte.The 9-bit Temp data with 0.5°C resolution of the LM75B is de?ned exactly in the same way as for the standard LM75 and it is here similar to the Tos and Thyst registers.

The only MSByte of the temperature can also be read with the use of a one-byte reading command. Then the temperature resolution will be 1.00°C instead.

7.4.4Overtemperature shutdown threshold (Tos) and hysteresis (Thyst) registers

These two registers,are write/read registers,and also called set-point registers.They are used to store the user-de?ned temperature limits, called overtemperature shutdown threshold (T th(ots)) and hysteresis temperature (T hys ), for the device watchdog operation.At the end of each conversion the T emp data will be compared with the data stored in these two registers in order to set the state of the device OS output; see Section 7.1.Each of the set-point registers contains two 8-bit data bytes consisting of one MSByte and one LSByte the same as register Temp. However, only 9bits of the two bytes are used to store the set-point data in 2’s complement format with the resolution of 0.5°C.Table 10and T able 11 show the bit arrangement of the Tos data and Thyst data in the data bytes.Notice that because only 9-bit data are used in the set-point registers, the device uses only the 9MSB of the T emp data for data comparison.

When a set-point register is read,all 16bits are provided to the bus and must be collected by the controller to complete the bus operation. However, only the 9most signi?cant bits should be used and the 7LSB of the LSByte are equal to zero and should be ignored.Table 12 shows examples of the limit data and value.

111 0011 1000738?200?25.000°C 110 0100 1001649?439?54.875°C 110 0100 1000

648

?440

?55.000°C

Table 9.

Temp register value …continued

11-bit binary

(2’s complement)Hexadecimal value Decimal value Value Table 10.Tos register

MSByte LSByte 7654321076543210D8

D7

D6

D5

D4

D3

D2

D1

D0

X

X

X

X

X

X

X

Table 11.Thyst register

MSByte LSByte

7654321076543210D8

D7

D6

D5

D4

D3

D2

D1

D0

X

X

X

X

X

X

X

7.5OS output and polarity

The OS output is an open-drain output and its state represents results of the device

watchdog operation as described in Section 7.1. In order to observe this output state, an external pull-up resistor is needed. The resistor should be as large as possible, up to 200k ?,to minimize the Temp reading error due to internal heating by the high OS sinking current.

The OS output active state can be selected as HIGH or LOW by programming bit B2(OS_POL) of register Conf: setting bit OS_POL to logic 1 selects OS active HIGH and setting bit B2 to logic 0 sets OS active LOW. At power-up, bit OS_POL is equal to logic 0and the OS active state is LOW.

7.6OS comparator and interrupt modes

As described in Section 7.1, the device OS output responds to the result of the

comparison between register Temp data and the programmed limits, in registers Tos and Thyst, in different ways depending on the selected OS mode: OS comparator or OS interrupt. The OS mode is selected by programming bit B1 (OS_COMP_INT) of register Conf: setting bit OS_COMP_INT to logic 1 selects the OS interrupt mode, and setting to logic 0 selects the OS comparator mode. At power-up, bit OS_COMP_INT is equal to logic 0 and the OS comparator is selected.

The main difference between the two modes is that in OS comparator mode, the OS output becomes active when Temp has exceeded T th(ots) and reset when Temp has

dropped below T hys ,reading a register or putting the device into shutdown mode does not change the state of the OS output;while in OS interrupt mode,once it has been activated either by exceeding T th(ots) or dropping below T hys , the OS output will remain active inde?nitely until reading a register, then the OS output is reset.

T emperature limits T th(ots) and T hys must be selected so that T th(ots) > T hys . Otherwise, the OS output state will be unde?ned.

Table 12.

Tos and Thyst limit data and value

11-bit binary

(2’s complement)Hexadecimal value Decimal value Value 0 1111 10100FA 250+125.0°C 0 0011 001003250+25.0°C 0 0000 00010011+0.5°C 0 0000 000000000.0°C 1 1111 11111FF ?1?0.5°C 1 1100 11101CE ?50?25.0°C 1 1001 0010

192

?110

?55.0°C

7.7OS fault queue

Fault queue is de?ned as the number of faults that must occur consecutively to activate the OS output. It is provided to avoid false tripping due to noise. Because faults are

determined at the end of data conversions, fault queue is also de?ned as the number of consecutive conversions returning a temperature trip. The value of fault queue is

selectable by programming the two bits B4 and B3 (OS_F_QUE[1:0]) in register Conf.

Notice that the programmed data and the fault queue value are not the same.Table13 shows the one-to-one relationship between them. At power-up, fault queue data=0 and fault queue value=1.

Table 13.Fault queue table

Fault queue data Fault queue value

OS_F_QUE[1]OS_F_QUE[0]Decimal

001

012

104

116

7.8Shutdown mode

The device operation mode is selected by programming bit B0 (SHUTDOWN) of register Conf.Setting bit SHUTDOWN to logic1will put the device into shutdown mode.Resetting bit SHUTDOWN to logic 0 will return the device to normal mode.

In shutdown mode, the device draws a small current of approximately 1.0μA and the

power dissipation is minimized; the temperature conversion stops, but the I2C-bus

interface remains active and register write/read operation can be performed. When the shutdown is set, the OS output will be unchanged in comparator mode and reset in

interrupt mode.

7.9Power-up default and power-on reset

The LM75B always powers-up in its default state with:

?Normal operation mode

?OS comparator mode

?T th(ots) = 80°C

?T hys = 75°C

?OS output active state is LOW

?Pointer value is logic00 (T emp)

When the power supply voltage is dropped below the device power-on reset level of

approximately 1.0V (POR) for over 2μs and then rises up again, the device will be reset to its default condition as listed above.

7.10Protocols for writing and reading the registers

The communication between the host and the LM75B must strictly follow the rules as

de?ned by the I2C-bus management. The protocols for LM75B register read/write

operations are illustrated in Figure6 to Figure11 together with the following de?nitions:

1.Before a communication,the I2C-bus must be free or not busy.It means that the SCL

and SDA lines must both be released by all devices on the bus, and they become

HIGH by the bus pull-up resistors.

2.The host must provide SCL clock pulses necessary for the communication. Data is

transferred in a sequence of 9SCL clock pulses for every 8-bit data byte followed by

1-bit status of the acknowledgement.

3.During data transfer, except the ST ART and STOP signals, the SDA signal must be

stable while the SCL signal is HIGH. It means that the SDA signal can be changed

only during the LOW duration of the SCL line.

4.S: ST ART signal, initiated by the host to start a communication, the SDA goes from

HIGH to LOW while the SCL is HIGH.

5.RS: RE-ST ART signal, same as the START signal, to start a read command that

follows a write command.

6.P: STOP signal, generated by the host to stop a communication, the SDA goes from

LOW to HIGH while the SCL is HIGH. The bus becomes free thereafter.

7.W: write bit, when the write/read bit = LOW in a write command.

8.R: read bit, when the write/read bit = HIGH in a read command.

9.A: device acknowledge bit, returned by the LM75B. It is LOW if the device works

properly and HIGH if not. The host must release the SDA line during this period in

order to give the device the control on the SDA line.

10.A’: master acknowledge bit, not returned by the device, but set by the master or host

in reading 2-byte data. During this clock period, the host must set the SDA line to

LOW in order to notify the device that the ?rst byte has been read for the device to

provide the second byte onto the bus.

11.NA: Not Acknowledge bit. During this clock period, both the device and host release

the SDA line at the end of a data transfer, the host is then enabled to generate the

STOP signal.

12.In a write protocol, data is sent from the host to the device and the host controls the

SDA line, except during the clock period when the device sends the device

acknowledgement signal to the bus.

13.In a read protocol,data is sent to the bus by the device and the host must release the

SDA line during the time that the device is providing data onto the bus and controlling

the SDA line, except during the clock period when the master sends the master

acknowledgement signal to the bus.

Fig 6.Write con?guration register (1-byte data)

001aad624

1

1

S

SDA

SCL 001A2A1A0W A 00000001A 000D4D3D2D1D0A P

23456789123456789123456789

START

STOP

write device acknowledge

device acknowledge

device acknowledge

device address

pointer byte

configuration data byte

Fig 7.Read con?guration register including pointer byte (1-byte data)

001aad625

SCL SDA

(next)

(next)

1

23456789123456789

device address

pointer byte

START

RE-START

write device acknowledge

device acknowledge

00000001A RS 1

S

001A2A1A0W A SCL (cont.)SDA (cont.)

1

2

3

4

5

6

7

8

9

1

2

3456789

device address

data byte from device

STOP

read master not acknowledged

device acknowledge

D7D6D5D4D3D2D1D0P

1

1

A2

A1

A0R

A

NA

Fig 8.Read con?guration or temp register with preset pointer (1-byte data)

001aad626

START

S

SCL SDA

1

23456789123456789

device address

data byte from device

STOP

read master not acknowledged

device acknowledge

D7D6D5D4D3D2D1D0P

1

001A2A1A0R A NA

Fig 9.Write Tos or Thyst register (2-byte data)

002aad036

1

23456789123456789

D7SDA (cont.)

SCL (cont.)D6D5D4D3D2D1D0A

D7D6D5D4D3D2D1D0

A P

1

S

SDA

SCL 001A2A1A0W A 000000P1P0A (next)

(next)

1

2

3

4

5

6

7

8

9

1

2

3456789

device address

pointer byte

MSByte data

LSByte data

START

write device acknowledge

device acknowledge

STOP

device acknowledge

device acknowledge

Fig 10.Read Temp, Tos or Thyst register including pointer byte (2-byte data)

1

234567891

2345678

9

1

2

3

4

5

6

7

8

9

1

23456789

1

001A2A1A0R A D7D6D5D4D3D2D1D0A'

D7D6D5D4D3D2D1D0NA

P

1234567890

1

S

001A2A1A0W A 000000P1P0A (next)

(next)

SDA

SCL SDA (cont)

SCL (cont)RS 002aad037

device address pointer byte

device address

MSByte from device

LSByte from device

START

RE-START

write device acknowledge

device acknowledge read master acknowledge

master not acknowledged

device acknowledge

STOP

Fig 11.Read Temp, Tos or Thyst register with preset pointer (2-byte data)

1

23456789123456789123456789

1

S

001A2A1A0R A D7D6D5D4D3D2D1D0A'D7D6D5D4D3D2D1D0NA

P

SDA

SCL 002aad038

device address MSByte from device

LSByte from device

START

read master acknowledge

master not acknowledged

device acknowledge

STOP

8.Application design-in information

8.1Typical application

8.2LM75A and LM75B comparison

[1]

This option is updated to be compatible with the competitive parts.When the OS output has been activated in the interrupt mode due to a temp limit violation, if the Con?guration Shutdown bit B0 is set (to the LM75A), then the OS output activated status remains

unchanged, while (to the LM75B) the OS will be reset. The latter is compatible with the operation condition of the competitive parts.[2]

The LM75 series is intentionally designed to provide two successive temperature data bytes (MSByte and LSByte) for the 11-bit data resolution and both bytes should be read in a typical application. In some speci?c applications, when only the MSByte is read using a single-byte read command, it often happens that if bit D7 of the LSByte is zero, then the device will hold the SDA bus in a LOW state forever,resulting in a bus hang-up problem,and the bus cannot be released until the device power is reset.This condition exists for the LM75A but not for the LM75B. For the LM75B the temperature can be read either one byte or two bytes without a hang-up problem.[3]

The bus time-out is included for releasing the LM75B device operation whenever the SDA input is kept at a LOW state for too long (longer than the LM75B time-out duration) due to a fault from the host. The trade-off for this option is the limitation of the I 2C-bus low frequency operation to be limited to 20Hz. This option is compatible with some of the latest versions of the competitive parts.[4]

The data hold time is improved to increase the timing margin in I 2C-bus operation.

Fig 12.Typical application

002aad457

0.1 μF

10 k ?

DIGITAL LOGIC

LM75B

DETECTOR OR INTERRUPT LINE

BUS PULL-UP RESISTORS

I 2C-BUS

8

2SCL SDA

A2

A1A0

561

7

43

OS

V CC

power supply

GND

10 k ?

10 k ?Table 14.

LM75A and LM75B comparison

Description

LM75A LM75B availability of the XSON8U (3mm ×2mm) package type

no yes OS output auto-reset when SHUTDOWN bit is set in interrupt mode [1]no yes support single-byte reading of the Temp registers without bus lockup [2]no yes bus fault time-out (75ms, 200ms)[3]no yes minimum data hold time (t HD;DAT )[4]

10ns

0ns

ratio of conversion time / conversion period (typical)[5]100ms / 100ms 10ms / 100ms supply current in shutdown mode (typical value) 3.5μA 0.2μA HBM ESD protection level (minimum)>2000V >4500V MM ESD protection level (minimum)>200V >450V CDM ESD protection level (minimum)

>1000V

>2000V

[5]The LM75B performs the temperature-to-data conversions with a much higher speed than the LM75A. While the LM75A takes almost

the whole of conversion period(T conv)time of about100ms to complete a conversion,the LM75B takes only about1?10of the period,or about10ms.Therefore,the conversion period(T conv)is the same,but the temperature conversion time(t conv(T))is different between the two parts. A shorter conversion time is applied to signi?cantly reduce the device’s average power dissipation. During each conversion period, when the conversion is completed, the LM75B becomes idled and the power is reduced, resulting in a lesser average power consumption.

8.3Temperature accuracy

Because the local channel of the temperature sensor measures its own die temperature

that is transferred from its body,the temperature of the device body must be stabilized and

saturated for it to provide the stable readings.Because the LM75B operates a a low power

level,the thermal gradient of the device package has a minor effect on the measurement.

The accuracy of the measurement is more dependent upon the de?nition of the

environment temperature, which is affected by different factors: the printed-circuit board

on which the device is mounted;the air?ow contacting the device body(if the ambient air

temperature and the printed-circuit board temperature are much different, then the

measurement may not be stable because of the different thermal paths between the die

and the environment). The stabilized temperature liquid of a thermal bath will provide the

best temperature environment when the device is completely dipped into it. A thermal

probe with the device mounted inside a sealed-end metal tube located in consistent

temperature air also provides a good method of temperature measurement.

8.4Noise effect

The LM75B device design includes the implementation of basic features for a good noise

immunity:

?The low-pass ?lter on both the bus pins SCL and SDA;

?The hysteresis of the threshold voltages to the bus input signals SCL and SDA,about 500mV minimum;

?All pins have ESD protection circuitry to prevent damage during electrical surges.The ESD protection on the address, OS, SCL and SDA pins it to ground. The latch-back

based device breakdown voltage of address/OS is typically 11V and SCL/SDA is

typically9.5V at any supply voltage but will vary over process and temperature.Since

there are no protection diodes from SCL or SDA to V CC, the LM75B will not hold the

I2C lines LOW when V CC is not supplied and therefore allow continued I2C-bus

operation if the LM75B is de-powered.

However,good layout practices and extra noise?lters are recommended when the device

is used in a very noisy environment:

?Use decoupling capacitors at V CC pin.

?Keep the digital traces away from switching power supplies.

?Apply proper terminations for the long board traces.

?Add capacitors to the SCL and SDA lines to increase the low-pass ?lter

characteristics.

9.Limiting values

Table 15.Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

V CC supply voltage?0.3+6.0V

V I input voltage at input pins?0.3+6.0V

I I input current at input pins?5.0+5.0mA

I O(sink)output sink current on pin OS-10.0mA

V O output voltage on pin OS?0.3+6.0V

T stg storage temperature?65+150°C

T j junction temperature-150°C 10.Recommended operating conditions

Table 16.Recommended operating characteristics

Symbol Parameter Conditions Min Typ Max Unit

V CC supply voltage 2.8- 5.5V

T amb ambient temperature?55-+125°C

11.Static characteristics

[1]

Typical values are at V CC =3.3V and T amb =25°C.

Table 17.Static characteristics

V CC =2.8V to 5.5V; T amb =?55°C to +125°C; unless otherwise speci?ed.Symbol Parameter

Conditions

Min Typ [1]Max Unit T acc temperature accuracy T amb =?25°C to +100°C ?2-+2°C T amb =?55°C to +125°C ?3-+3°C T res temperature resolution 11-bit digital temp data -0.125-°C t conv(T)temperature conversion time

normal mode -10-ms T conv conversion period normal mode

-100-ms I DD(AV)

average supply current

normal mode: I 2C-bus inactive -100200μA normal mode: I 2C-bus active;f SCL =400kHz --300μA shutdown mode

-0.2 1.0μA V IH HIGH-level input voltage digital pins (SCL, SDA, A2to A0)0.7×V CC -V CC +0.3V V IL LOW-level input voltage

digital pins ?0.3-0.3×V CC V V I(hys)hysteresis of input voltage SCL and SDA pins

-300-mV A2, A1, A0 pins

-150-mv I IH HIGH-level input current digital pins; V I =V CC ?1.0-+1.0μA I IL LOW-level input current digital pins; V I = 0V

?1.0-+1.0μA V OL LOW-level output voltage SDA and OS pins; I OL =3mA --0.4V I OL =4mA

--0.8V I LO output leakage current SDA and OS pins; V OH =V CC --10μA

N fault

number of faults

programmable; conversions in overtemperature-shutdown fault queue 1

-6

T th(ots)

overtemperature shutdown threshold temperature

default value

-80-°C

T hys hysteresis temperature default value -75-°C C i

input capacitance

digital pins

-

20

-

pF

Fig 13.Average supply current versus temperature;

I 2C-bus inactive

Fig 14.Average supply current versus temperature;

I 2C-bus active

Fig 15.Shutdown mode supply current

versus temperature

Fig 16.LOW-level output voltage on pin OS

versus temperature; I OL =4mA

Fig 17.LOW-level output voltage on pin SDA

versus temperature; I OL =4mA Fig 18.Typical temperature accuracy versus

temperature; V CC =3.3V

100200

300I DD(AV)(μA)

0T amb (°C)

?75

125

75

?2525002aae198

V CC = 5.5 V

4.5 V 3.3 V 2.8 V

100

200

300I DD(AV)(μA)

0T amb (°C)

?75

125

75

?2525002aae199

V CC = 5.5 V

4.5 V 3.3 V 2.8 V

0.20.30.10.4

0.5I DD(sd)(μA)

0T amb (°C)

?75

125

75

?2525002aae200

V CC = 5.5 V

4.5 V 3.3 V 2.8 V

0.20.30.10.4

0.5V OL(OS)(V)

0T amb (°C)

?75

125

75

?2525002aae201

V CC = 5.5 V

4.5 V 3.3 V 2.8 V

0.20.30.10.4

0.5

V OL(SDA)

(V)

0T amb (°C)

?75

125

75

?2525002aae202

V CC = 5.5 V

4.5 V 3.3 V 2.8 V

?2.0

1.0

?1.0

2.0T acc (°C)

T amb (°C)

?75

125

75

?2525002aae203

12.Dynamic characteristics

[1]These speci?cations are guaranteed by design and not tested in production.[2]This is the SDA time LOW for reset of serial interface.

[3]

Holding the SDA line LOW for a time grater than t to will cause the LM75B to reset SDA to the idle state of the serial bus communication (SDA set HIGH).

Table 18.I 2C-bus interface dynamic characteristics [1]

V CC =2.8V to 5.5V; T amb =?55°C to +125°C; unless otherwise speci?ed.Symbol Parameter

Conditions Min Typ Max Unit f SCL SCL clock frequency see Figure 19

0.02-400kHz t HIGH HIGH period of the SCL clock 0.6--μs t LOW LOW period of the SCL clock 1.3--μs t HD;STA hold time (repeated) ST ART condition 100--ns t SU;DA T data set-up time 100--ns t HD;DA T data hold time

0--ns t SU;STO set-up time for STOP condition 100

--ns t f fall time SDA and OS outputs;C L =400pF; I OL =3mA

-250-ns t to

time-out time

[2][3]

75

-

200

ms

Fig 19.Timing diagram

SDA

SCL

002aab271

t f

S

Sr

P

S

t HD;STA

t LOW

t r

t SU;DAT

t f

t HD;DAT

t HIGH t SU;ST A

t HD;ST A

t SP

t SU;STO

t r

t BUF

温度传感器工作原理

温度传感器工作原理 1.引脚★ ●GND接地。 ●DQ为数字信号输入\输出端。 ●VDD为外接电源输入端(在寄生电源接线方式时接地) 2.与单片机的连接方式★ 单线数字温度传感器DS18B20与单片机连接电路非常简单,引脚1接地(GND),引脚3(VCC)接电源+5V,引脚2(DQ)接单片机输入\输出一个端口,电压+5V和信号线(DQ)之间接有一个4.7k的电阻。 由于每片DS18B20含有唯一的串行数据口,所以在一条总线上可以挂接多个DS18B20芯片。 外部供电方式单点测温电路如图★ 外部供电方式多点测温电路如图★ 3.DS18B20的性能特点 DS18B20温度传感器是美国DALLAS半导体公司最新推出的一种改进型智能温度传感器。与传统的热敏电阻等测温元件相比,它能直接读出被测温度,并且可根据实际要求通过简单的编程实现9~12位的数字值读数方式。DS18B20的性能特点如下: ●独特的单线接口仅需要一个端口引脚进行通信。 ●多个DS18B20可以并联在唯一的三线上,实现多点组网功能。 ●不需要外部器件。 ●在寄生电源方式下可由数据线供电,电压围为3.0~5.5V。 ●零待机功耗。

●温度以9~12位数字量读出 ●用户可定义的非易失性温度报警设置。 ●报警搜索命令识别并标识超过程序限定温度(温度报警条件)的器件。 ●负电压特性,电源极性接反时,温度计不会因发热而烧毁,只是不能正常工作。 4.部结构 .DS18B20采用3脚PR—35封装或8脚SOIC封装,其部结构框图★ 64位ROM的位结构如图★◆。开始8位是产品类型的编号;接着是每个器件的唯一序号,共有48位;最后8位是前面56位的CRC检验码,这也是多个DS18B20可以采用单线进行通信的原因。非易失性温度报警触发器TH和TL,可通过软件写入用户报警上下限数据。 MSB LSB MSB LSB MSB LSB DS18B20温度传感器的部存储器还包括一个高速暂存RAM和一个非易失性的可电擦除的E2PROM。 高速暂存RAM的结构为9字节的存储器,结构如图★。前2字节包含测得的温度信息。第3和4字节是TH和TL的拷贝,是易失的,每次上电复位时被刷新。第5字节为配置寄存器,其容用于确定温度值的数字转换分辨率,DS18B20工作时按此寄存器中的分辨率将温度转化为相应精度的数值。该字节各位的定义如图★,其中,低5位一直为1;TM是测试模式位,用于设置DS18B20在工作模式还是在测试模式,在DS18B20出厂时,该位被设置为0,用户不要去改动;R0和R1决定温度转化的精度位数,即用来设置分辨率,其定义方法见表★ 高速暂存RAM的第6、7、8字节保留未用,表现为全逻辑1。第9字节是前面所有8

DS18B20数字温度传感器要点

DS18B20数字温度传感器接线方便,封装成后可应用于多种场合,如管道式,螺 纹式,磁铁吸附式,不锈钢 封装式,型号多种多样,有LTM8877,LTM8874等等。主要根据应用场合的不同而改变其外观。封装后的DS18B20可用于电缆沟测温,高炉水循环测温,锅炉测温,机房测温,农业大棚测温,洁净室测温,弹药库测温等各种非极限温度场合。耐磨耐碰,体积小,使用方便,封装形式多样,适用于各种狭小空间设备数字测温和控制领域。 1: 技术性能描述 ①、独特的单线接口方式,DS18B20在与微处理器连接时仅需要一条口线即可实现微处理器与DS18B20的双向通讯。 ②、测温范围-55℃~+125℃,固有测温误差(注意,不是分辨率,这里之前是错误的)1℃。 ③、支持多点组网功能,多个DS18B20可以并联在唯一的三线上,最多只能并联8个,实现多点测温,如果数量过多,会使供电电源电压过低,从而造成信号传输的不稳定。 ④、工作电源: 3.0~5.5V/DC (可以数据线寄生电源) ⑤、在使用中不需要任何外围元件 ⑥、测量结果以9~12位数字量方式串行传送 ⑦、不锈钢保护管直径Φ6 ⑧、适用于DN15~25, DN40~DN250各种介质工业管道和狭小空间设备测温 ⑨、标准安装螺纹 M10X1, M12X1.5, G1/2”任选 ⑩、PVC电缆直接出线或德式球型接线盒出线,便于与其它电器设备连接。[1]信息DS18B20+ 和 Maxim Integrated Manufactured by Maxim Integrated, DS18B20+ is a 温度传感器. 3应用范围编辑 2.1 该产品适用于冷冻库,粮仓,储罐,电讯机房,电力机房,电缆线槽等测温和控制领域 2.2 轴瓦,缸体,纺机,空调,等狭小空间工业设备测温和控制。 2.3 汽车空调、冰箱、冷柜、以及中低温干燥箱等。 2.4 供热/制冷管道热量计量,中央空调分户热能计量和工业领域测温和控制 4型号规格编辑 型号测温范围安装螺纹电缆长度适用管道 TS-18B20 -55~125 无 1.5 m TS-18B20A -55~125 M10X1 1.5m DN15~25 TS-18B20B -55~125 1/2”G 接线盒 DN40~ 60

各种温度传感器分类及其原理.

各种温度传感器分类及其原理

各种温度传感器分类及其原理 温度传感器是检测温度的器件,其种类最多,应用最广,发展最快。众所周知,日常使用的材料及电子元件大部分特性都随温度而变化,在此我们暂时介绍最常用的热电阻和热电偶两类产品。 1.热电偶的工作原理 当有两种不同的导体和半导体A和B 组成一个回路,其两端相互连接时,只要两结点处的温度不同,一端温度为T,称为工作端或热端,另一端温度为TO,称为自由端(也称参考端或冷端,则回路中就有电流产生,如图2-1(a所示,即回路中存在的电动势称为热电动势。这种由于温度不同而产生电动势的现象称为塞贝克效应。 与塞贝克有关的效应有两个:其一,当有电流流过两个不同导体的连接处时,此处便吸收或放出热量(取决于电流的方向, 称为珀尔帖效应;其二,当有电流流过存在温度梯度的导体时,导体吸收或放出热量(取决 于电流相对于温度梯度的方向,称为汤姆逊效应。两种不同导体或半导体的组合称为热电偶。热电偶的热电势EAB(T,T0 是由接触电势和温差电势合成的。接触电势是指两种不同 的导体或半导体在接触处产生的电势,此电势与两种导体或半导体的性质及在接触点的温度有关。 温差电势是指同一导体或半导体在温度不同的两端产生的电势, 此电势只与导体或半导体的性质和两端的温度有关,而与导体的长度、截面大小、沿其长度方向的温度分布无关。 无论接触电势或温差电势都是由于集中于接触处端点的电子数不同而产生的电势:热电偶测量的热电势是二者的合成。当回路断开时,在断开处a,b 之间便有一电动势差△ V,其极性和大小与回路中的热电势一致,如图 2-1(b所示。并规定在冷端,当电流由A流向B时,称A为正极,B 为负极。实验表明,当△ V很小时,△ V与厶T成正比关系。定义△ V对厶T 的微分热电势为热电势率,又称塞贝克系数。

温度传感器DS18B20工作原理

温度传感器: DS18B20是DALLAS公司生产的一线式数字温度传感器,具有3引脚TO-92小体积封装形式;温度测量范围为-55℃~+125℃,可编程为9位~12位A/D转换精度,测温分辨率可达0.0625℃,被测温度用符号扩展的16位数字量方式串行输出;其工作电源既可在远端引入,也可采用寄生电源方式产生;多个DS18B20可以并联到3根或2根线上,CPU只需一根端口线就能与诸多DS18B20通信,占用微处理器的端口较少,可节省大量的引线和逻辑电路。以上特点使DS18B20非常适用于远距离多点温度检测系统。 2 DS18B20的内部结构 DS18B20内部结构如图1所示,主要由4部分组成:64位ROM、温度传感器、非挥发的温度报警触发器TH和TL、配置寄存器。DS18B20的管脚排列如图2所示,DQ为数字信号输入/输出端;GND为电源地;VDD为外接供电电源输入端(在寄生电源接线方式时接地,见图4)。 ROM中的64位序列号是出厂前被光刻好的,它可以看作是该DS18B20的地址序列码,每个DS18B20的64位序列号均不相同。64位ROM的排的循环冗余校验码(CRC=X8+X5+X4+1)。ROM的作用是使每一个DS18B20都各不相同,这样就可以实现一根总线上挂接多个DS18B20的目的。 图1 DS18B20的内部结构

图2DS18B20的管脚排列 DS18B20中的温度传感器完成对温度的测量,用16位符号扩展的二进制补码读数形式提供,以0.0625℃/LSB形式表达,其中S为符号位。例如+125℃的数字输出为07D0H,+25.0625℃的数字输出为0191H,-25.0625℃的数字输出为FF6FH,-55℃的数字输出为FC90H。 温度值高字节 高低温报警触发器TH和TL、配置寄存器均由一个字节的EEPROM组成,使用一个存储器功能命令可对TH、TL或配置寄存器写入。其中配置寄存器的格式如下: R1、R0决定温度转换的精度位数:R1R0=“00”,9位精度,最大转换时间为93.75ms;R1R0=“01”,10位精度,最大转换时间为187.5ms;R1R0=“10”,11位精度,最大转换时间为375ms;R1R0=“11”,12位精度,最大转换时间为750ms;未编程时默认为12位精度。 高速暂存器是一个9字节的存储器。开始两个字节包含被测温度的数字量信息;第3、4、5字节分别是TH、TL、配置寄存器的临时拷贝,每一次上电复位时被刷新;第6、7、8字节未用,表现为全逻辑1;第9字节读出的是前面所有8个字节的CRC码,可用来保证通信正确。 3 DS18B20的工作时序 DS18B20的一线工作协议流程是:初始化→ROM操作指令→存储器操作指令→数据传输。其工作时序包括初始化时序、写时序和读时序,如图3(a)(b)(c)所示。

基于数字温度传感器的数字温度计

黄河科技学院《单片机应用技术》课程设计题目:基于数字温度传感器的数字温度计 姓名:时鹏 院(系):工学院 专业班级: 学号: 指导教师:

黄河科技学院课程设计任务书 工学院机械系机械设计制造及其自动化专业S13 级 1 班 学号1303050025 时鹏指导教师朱煜钰 题目:基于数字温度传感器的数字温度计设计 课程:单片机应用技术课程设计 课程设计时间2014年10月27 日至2014年11 月10 日共2 周 课程设计工作内容与基本要求(设计要求、设计任务、工作计划、所需相关资料)(纸张不够可加页)

课程设计任务书及摘要 一、课程设计题目:基于数字温度传感器的数字温度计 二、课程设计要求 利用数字温度传感器DS18B20与单片机结合来测量温度。利用数字温度传感器DS18B20测量温度信号,计算后在LED数码管上显示相应的温度值。其温度测量范围为-55℃~125℃,精确到0.5℃。数字温度计所测量的温度采用数字显示,控制器使用单片机AT89C51,温度传感器使用DS18B20,用3位共阳极LED数码管以串口传送数据,实现温度显示。 三、课程设计摘要 DS18B20是一种可组网的高精度数字式温度传感器,由于其具有单总线的独特优点,可以使用户轻松地组建起传感器网络,并可使多点温度测量电路变得简单、可靠。本文结合实际使用经验,介绍了DS18B20数字温度传感器在单片机下的硬件连接及软件编程,并给出了软件流程图。 该系统由上位机和下位机两大部分组成。下位机实现温度的检测并提供标准RS232通信接口,芯片使用了ATMEL公司的AT89C51单片机和DALLAS公司的DS18B20数字温度传感器。上位机部分使用了通用PC。该系统可应用于仓库测温、楼宇空调控制和生产过程监控等领域。 四、关键字:单片机温度测量DS18B20 数字温度传感器AT89C51

温度传感器简介

简谈温度传感器及研究进展 摘要:温度传感器是使用范围最广,数量最多的传感器,在日常生活,工业生产等领域都扮演着十分重要的角色。从17世纪温度传感器首次应用以来,依次诞生了接触式温度传感器,非接触式温度传感器,集成温度传感器。近年来在智能温度传感器在半导体技术,材料技术等新技术的支持下,温度传感器发展迅速。由于智能温度传感器的软件和硬件的合理配合既可以大大增强传感器的功能、提高传感器的精度,又可以使温度传感器的结构更为简单和紧凑,使用更加方便,因此智能温度传感器是当今的一个研究热点。微处理器的引入,使得温度信号的采集,记忆,存储,综合,处理与控制一体化,使温度传感器向智能化方向发展。关键词:温度传感器;智能温度传感器;接触式温度传感器 中图分类号:TP212.1 文献标识码:A Abstract:temperature transducer is used most widely, the largest number of sensors, in daily life, such as industrial production field plays a very important role.Since the 17th century temperature sensor for the first time application, was born in turn contact temperature sensor, non-contact temperature sensor, integrated temperature sensor.Intelligent temperature sensor in recent years in semiconductor technology, materials technology, under the support of new technologies such as the temperature sensor is developing rapidly.Due to the software and hardware of the intelligent temperature sensor reasonable matching can greatly enhance the function of the sensor, improve the precision of the sensor, and can make the temperature sensor has simple and compact structure, use more convenient, thus intelligent temperature sensor is a hot spot nowadays.The introduction of the microprocessor, which makes the temperature signal collection, memory, storage, comprehensive, processing and control integration, make the temperature sensor to the intelligent direction. Key words:temperature transducer; Smart temperature sensor; Contact temperature sensors 前言:温度作为国际单位制的七个基本量之一,测量温度的传感器的各种各样,温度传感器是温度测量仪表的核心部分,十分重要。据统计,温度传感器是使用范围最广,数量最多的传感器。简而言之,温度传感器(temperature transducer)就是是指能感受温度并转换成可用输出信号的传感器。在半导体技术的支持下,本世纪相继开发了半导体热电偶传感器、PN结温度传感器和集成温度传感器。在材料技术的支持下,陶瓷,有机,纳米等新材料用于温度传感器中可以使温度的测量和控制更加科学和精确。由于智能温度传感器的软件和硬件的合理配合既可以大大增强传感器的功能、提高传感器的精度,又可以使温度传感器的结构更为简单和紧凑,使用更加方便,因此智能温度传感器是当今的一个研究热点。微处理器的引入,使得温度信号的采集,记忆,存储,综合,处理与控制一体化,使温度传感器向智能化方向发展。

全面了解数字温度传感器规范

全面了解数字温度传感器规范 为了实现最佳性能并确保系统稳健性,就必须要进行系统监控测量。其中一个必需的典型测量项目就是环境温度。使用简单的数字温度传感器进行该测量将为系统设计人员提供如下保证:组件正常工作,系统处于其性能或校准限值范围内,不会使用户遇到危险。 测量结束后,通常由系统中的微控制器对环境温度进行相应调整。系统监控微控制器可以改变风扇速度、关闭非必要系统进程或使系统智能进入省电模式。系统设计人员需全面正确地了解数字温度传感器规范以设计系统,并就测量结果采取最佳措施。另外,全面了解传感器规范将确保在选择数字温度传感器器件时,可做到权衡得当。 当选择数字温度传感器(也称作串行输出温度传感器)时,应考虑的主要规范包括精度、分辨率、功耗、接口和封装。 精度 数字温度传感器精度表示传感器读数和系统实际温度 之间的误差。在产品说明书中,精度指标和温度范围相对应。通常针对不同温度范围,有数个最高精度指标。对于25~

+100℃温度范围来说,±2℃精度是很常见的。Analog Device 公司的ADT75、Maxim公司的DS75、National公司的LM75以及TI的TMP75均具有这种精度节点。但是,还有更高精度的器件。例如,TI的TMP275在120~100℃温度范围内的精度为±0.5℃。 虽然温度精度指标是非常重要的,然而对系统监控应用来说,它并非一定是最为关键的因素。这些应用更重视检测温度变化,而不是确定温度绝对值。 分辨率 数字温度传感器分辨率是描述传感器可检测温度变化细微程度的指标。集成于封装芯片的温度传感器本身就是一种模拟传感器。因此所有数字温度传感器均有一个模数转换器(ADC)。ADC分辨率将决定器件的总体分辨率,分辨率越高,可检测到的温度变化就越细微。 在产品说明书中,分辨率是采用位数和摄氏温度值来表示的。当采用位数来考虑分辨率时,必须多加注意,因为该值可能包括符号位,也可能不包括符号位。此外,该器件的内部电路可能以不同于传感器总体温度范围的值,来确定内部ADC的满量程范围。以摄氏度来表示的分辨率是一种更直接分辨率值,采用该数值可进行设计分析。

数字温度传感器AD7416及其应用

数字温度传感器AD7416及其应用 AD7416 是美国模拟器件公司(ADI)出品的单片机温度监控系统集成电路。其内部包含有带隙温度传感器和10位模数转换器,可将感应温度转换为0.25℃量化间隔的数字信号,以便用来与用户设置的温度点进行比较。AD7416片内寄存器可以进行高/低温度门限的设置当温度超过设置门限时,过温漏级开路指示器(OTI)将输出有效信号。另外,可以通过I2C接口对AD7416的内部寄存器进行读/写操作,最多可允许8片AD7416挂接在同一个串行总线上。该温度传感器可广泛应用于数据采集系统中的环境温度监测、 工业过程控制、电池充电以及个为计算机等系统。 1 基本特性与引脚功能 AD AD7416具有如下基本特性: ●工作电压范围为+2.7V~+5.5V; ●测温范围为-55℃~+125℃; ●具有10位数字输出温度值,分辨率为0.25℃; ●精度为±2℃(-25℃~+100℃)和±3℃(-55℃~+125℃); ●转换时间为15~30μs,更新速率为400μs; ●带有过温漏级开路指示器(OTI); ●具有I2C兼容的串行接口和可选的串行总线地址; ●具有低功耗关闭模式(典型值为0.2μA); ●可用来升级替换LM75。 AD7416采用8脚表面贴SO和8脚小型SOIC封装形式,图1所示为AD7416的引脚排列图,各引 脚功能如表1所列。 表1 AD7416引脚功能

2 工作原理 AD7416的内部功能框图如图2所示。它的片内带隙温度传感器可按预先设置的工作方式对环境温度进行实时测量,并将结果转化为数字量存入到温度值寄存器中(地址00H),其环境温度与输出数据的关 系如表2所列。 表2 环境温度与输出数据的关系 AD7416预先设置的工作方式分两种: ●自动测温方式。在这种方式下,AD7416每隔400μs对环境温度测量一次,每次的量化转换时间为1 5~30μs,其余时间芯片则自动转入休眠状态;

各种温度传感器分类及其原理.

各种温度传感器分类及其原理 温度传感器是检测温度的器件,其种类最多,应用最广,发展最快。众所周知,日常使用的材料及电子元件大部分特性都随温度而变化, 在此我们暂时介绍最常用的热电阻和热电偶两类产品。 1. 热电偶的工作原理 当有两种不同的导体和半导体 A 和 B 组成一个回路,其两端相互连接时,只要两结点处的温度不同,一端温度为 T ,称为工作端或热端,另一端温度为 TO ,称为自由端 (也称参考端或冷端,则回路中就有电流产生,如图 2-1(a所示,即回路中存在的电动势称为热电动势。这种由于温度不同而产生电动势的现象称为塞贝克效应。与塞贝克有关的效应有两个:其一, 当有电流流过两个不同导体的连接处时, 此处便吸收或放出热量 (取决于电流的方向 , 称为珀尔帖效应;其二,当有电流流过存在温度梯度的导体时,导体吸收或放出热量 (取决于电流相对于温度梯度的方向 ,称为汤姆逊效应。两种不同导体或半导体的组合称为热电偶。热电偶的热电势 EAB(T, T0 是由接触电势和温差电势合成的。接触电势是指两种不同的导体或半导体在接触处产生的电势, 此电势与两种导体或半导体的性质及在接触点的温度有关。温差电势是指同一导体或半导体在温度不同的两端产生的电势, 此电势只与导体或半导体的性质和两端的温度有关, 而与导体的长度、截面大小、沿其长度方向的温度分布无关。无论接触电势或温差电势都是由于集中于接触处端点的电子数不同而产生的电势, 热电偶测量的热电势是二者的合成。当回路断开时,在断开处 a , b 之间便有一电动势差△ V ,其极性和大小与回路中的热电势一致,如图 2-1(b所示。并规定在冷端,当电流由 A 流向 B 时, 称 A 为正极, B 为负极。实验表明,当△ V 很小时,△ V 与△ T 成正比关系。定义△ V 对△ T 的微分热电势为热电势率, 又称塞贝克系数。塞贝克系数的符号和大小取决于组成热电偶的两种导体的热电特性和结点的温度差。 2. 热电偶的种类

浅析数字温度传感器

浅析数字温度传感器 在传感器技术突飞猛进的今天,多家现代传感器企业提供的新型数字温度传感器,与传统温度传感器相比,具有性价比高、性能优越、可靠性高、使用方便、体积小、灵敏度高和控制电路简单等特点。与传统产品相比,新型温度传感器呈现出微型化、高精度、低功耗等发展趋势。完全可以替代传统热敏电阻和电阻式温度检测器。具体来说,数字温度传感器的主要构成包括一个双电流源、一个Δ-ΣA/D转换器、数字逻辑和一个通向数字器件(如与一个微处理器或微控制器连接)的串行接口(如I2C总线、SMBus或SPI)。 新型数字温度传感器原理 数字温度传感器也叫热电偶,是将两种不同材料的导体或半导体A和B焊接起来,构成一个闭合回路,当导体A和B的两个执着点1和2之间存在温差时,两者之间便产生电动势,因而在回路中形成一个大小的电流,这种现象称为热电效应。热电偶就是利用这一效应来工作的。热电偶是工业上最常用的温度检测元件之一。其优点是:(1)测量精度高;(2)测量范围广;(3)构造简单,使用方便。 新型数字温度传感器的应用 当前,虽然主要的温度传感器,如热电偶、热电阻及辐射温度计等的技术已经成熟,但是只能在传统的场合应用,不能满足许多领域的要求,尤其是高科技领域。因此,各国专家都在针对性的竞争开发各种新型温度传感器及特殊的实用测量技术。 新型数字温度传感器的应用范围很广,它不仅广泛应用于寻常百姓的日常生活中,而且也大量用于现代工业生产的自动化控制和生产过程检测控制系统。 当前世界范围内温度传感器正从模拟式向新型数字式、从传统集成式向现代智能化的方向发展。新型数字温度传感器自从二十世纪九十年代中期面世以来,在中国国内也迅猛发展,并迅速在广大人民群众的日常生活中推广应用。

智能温度传感器原理及应用

智能温度传感器原理及应用 电气信息学院 一、热电阻 热电阻是中低温区最常用的一种温度检测器。它的主要特点是测量精度高,性能稳定。其中铂热是阻的测量精确度是最高的,它不仅广泛应用于工业测温,而且被制成标准的基准仪。与热电偶的测温原理不同的是,热电阻是基于电阻的热效应进行温度测量的,即电阻体的阻值随温度的变化而变化的特性。因此,只要测量出感温热电阻的阻值变化,就可以测量出温度。目前主要有金属热电阻和半导体热敏电阻两类。金属热电阻的电阻值和温度一般可以用以下的近似关系式表示,即 Rt=Rt0[1+α(t-t0)] 式中,Rt为温度t时的阻值;Rt0为温度t0(通常t0=0℃)时对应电阻值;α为温度系数。半导体热敏电阻的阻值和温度关系为 Rt=AeB/t 式中Rt为温度为t时的阻值;A、B取决于半导体材料的结构的常数。 相比较而言,热敏电阻的温度系数更大,常温下的电阻值更高(通常在数千欧以上),但互换性较差,非线性严重,测温范围只有-50~300℃左右,大量用于家电和汽车用温度检测和控制。金属热电阻一般适用于-200~500℃范围内的温度测量,其特点是测量准确、稳定性好、性能可靠,在程控制中的应用极其广泛。 目前应用最广泛的热电阻材料是铂和铜:铂电阻精度高,适用于中性和氧化性介质,稳定性好,具有一定的非线性,温度越高电阻变化率越小;铜电阻在测温范围内电阻值和温度呈线性关系,温度线数大,适用于无腐蚀介质,超过150易被氧化。中国最常用的有R0=10Ω、R0=100Ω和R0=1000Ω等几种,它们的分度号分别为Pt10、Pt100、Pt1000;铜电阻有R0=50Ω和R0=100Ω两种,它们的分度号为Cu50和Cu100。其中Pt100和Cu50的应用最为广泛。 热电阻的信号连接方式热电阻是把温度变化转换为电阻值变化的一次元件,通常需要把电阻信号通过引线传递到计算机控制装置或者其它一次仪表上。工业用热电阻安装在生产现场,与控制室之间存在一定的距离,因此热电阻的引线对测量结果会有较大的影响。 目前热电阻的引线主要有三种方式 ○1二线制:在热电阻的两端各连接一根导线来引出电阻信号的方式叫二线制:这种引线方法很简单,但由于连接导线必然存在引线电阻r,r大小与导线的材质和长度的因素有关,因此这种引线方式只适用于测量精度较低的场合 ○2三线制:在热电阻的根部的一端连接一根引线,另一端连接两根引线的方式称为三线制,这种方式通常与电桥配套使用,可以较好的消除引线电阻的影响,是工业过程控制中的最常用的引线电阻。 ○3四线制:在热电阻的根部两端各连接两根导线的方式称为四线制,其中两根引线为热电阻提供恒定电流I,把R转换成电压信号U,再通过另两根引线把U引至二次仪表。

最新DS18B20数字温度传感器介绍

D S18B20数字温度传 感器介绍

目前常用的微机与外设之间进行的数据通信的串行总线主要有 I 2C 总线,SPI 总线等。其中 I 2C 总线以同步串行 2 线方式进行通信(一条时钟线,一条数据线), SPI 总线则以同步串行 3 线方式进行通信(一条时钟线,一条数据输入线,一条数据输出线)。这些总线至少需要两条或两条以上的信号线。而单总线( 1-wire bus ),采用单根信号线,既可传输数据,而且数据传输是双向的, CPU 只需一根端口线就能与诸多单总线器件通信,占用微处理器的端口较少,可节省大量的引线和逻辑电路。因而,这种单总线技术具有线路简单,硬件开销少,成本低廉,软件设计简单,便于总线扩展和维护。同时,基于单总线技术能较好地解决传统识别器普遍存在的携带不便,易损坏,易受腐馈,易受电磁干扰等不足,因此,单总线具有广阔的应用前景,是值得关注的一个发展领域。 单总线即只有一根数据线,系统中的数据交换,控制都由这根线完成。主机或从机通过一个漏极开路或三态端口连至数据线,以允许设备在不发送数据时能够释放总线,而让其它设备使用总线。单总线通常要求外接一个约为 4.7K 的上拉电阻,这样,当总线闲置时其状态为高电平。 DS18B20 数字式温度传感器,与传统的热敏电阻有所不同的是,使用集成芯片,采用单总线技术,其能够有效的减小外界的干扰,提高测量的精度,同时,它可以直接将被测温度转化成串行数字信号供微机处理,接口简单,使数据传输和处理简单化。部分功能电路的集成,使总体硬件设计更简洁,能有效地降低成本,搭建电路和焊接电路时更快,调试也更方便简单化,这也就缩短了开发的周期。

使用单片机和温度传感器制作数字式温度计

《微机原理》课外设计制作 总结报告 题目(B):使用单片机和温度传感器制作数字式温度计组号:29 任课教师:王向阳 组长:11122412 侯景业20% 成员:11122445 白波20% 成员:11122510 吕锦涛20% 成员:11123633 柴金磊20% 成员:11123722 沈璘熙20% 联系方式:0 二零一三年五月十五日

一、课程设计目的与要求 利用学习过的《单片机与接口技术》课程的内容和其他相关课程的内容,设计数字式温度计。 使用单片机和温度传感器制作数字式温度计 (1)实时温度采集 (2)数字显示 (3)显示精度:0.1℃ (4)其它与温度有关的扩展 二、课程设计内容 2.1数字温度计设计方案 考虑到用温度传感器,在单片机电路设计中,大多都是使用传感器,所以可以采用一只温度传感器DS18B20,该传感器可以很容易直接读取被测温度值,进行转换,就可以满足设计要求。 2.2方案的总体框图 温度计电路设计总体设计方框图如图1所示,控制器采用单片机8051,温度传感器采用DS18B20,用3位LED数码管以串口传送数据实现温度显示。

图1 总体设计方框图主控制器 单片机8051具有低电压供电和体积小等特点,四个端口只需要两个口就能满足电路系统的设计需要,很适合便携手持式产品的设计使用系统可用二节电池供电。 温度传感器 数字温度传感器DS18B20,它不仅能直接输出串行数字信号,而且具有微型化、低功耗、高性能、易于微处理器连接和抗干扰能力强等优点。DS18B20数字温度传感器对于实测的温度提供了9-12位的数据和报警温度寄存器,它的测温范围为-55℃~+125℃,其中在-10℃~+85℃的范围内的测量精度为±0.5℃。由于每个DS18B20有唯一的一个连续64位的产品号,所以允许在一根电缆上连接多个传感器,以构成大型温度测控网络。 DS18B20特性 DS18B20 可以程序设定9~12 位的分辨率,精度为±0.5°C。可选更小的封装方式,更宽的电压适用范围。分辨率设

基于温度传感器的数字温度计.

华东交通大学电子测量传感器设计报告 报告题目:基于温度传感器的数字温度计 作者姓名: 专业班级: 学号: 指导老师: 时间:2013~2014学年第一学期

摘要 温度控制系统广泛应用于社会生活的各个领域,如家电、汽车、材料、电力电子等,常用的控制电路根据应用场合和所要求的性能指标有所不同, 在工业企业中,如何提高温度控制对象的运行性能一直以来都是控制人员和现场技术人员努力解决的问题。这类控制对象惯性大,滞后现象严重,存在很多不确定的因素,难以建立精确的数学模型,从而导致控制系统性能不佳,甚至出现控制不稳定、失控现象。传统的继电器调温电路简单实用,但由于继电器动作频繁,可能会因触点不良而影响正常工作。控制领域还大量采用传统的PID控制方式,但PID控制对象的模型难以建立,并且当扰动因素不明确时,参数调整不便仍是普遍存在的问题。 采用数字温度传感器DS18B20,因其内部集成了A/D转换器,使得电路结构更加简单,而且减少了温度测量转换时的精度损失,使得测量温度更加精确。数字温度传感器DS18B20只用一个引脚即可与单片机进行通信,大大减少了接线的麻烦,使得单片机更加具有扩展性。由于DS18B20芯片的小型化,更加可以通过单跳数据线就可以和主电路连接,故可以把数字温度传感器DS18B20做成探头,探入到狭小的地方,增加了实用性。更能串接多个数字温度传感器DS18B20进行范围的温度检测。 本文主要介绍了一个基于89C51单片机和DS18B20的测温系统,详细描述了利用数字温度传感器DS18B20开发测温系统的过程,重点对传感器在单片机下的硬件连接,软件编程以及各模块系统流程进行了详尽分析,该系统可以方便的实现实现温度采集和显示,并可根据需要任意设定上下限报警温度,适合于我们日常生活和工、农业生产中的温度测量。 关键词:AT89C51单片机、温度传感器DS18B20 Abstract Temperature control system is widely applied in various fields of social life, such as household appliances, automobiles, materials, power electronics, the commonly used

数字温度传感器

中南林业科技大学涉外学 院 传感器课程设计 题 指导老师向诚 学生姓名王璋娅 学号 20148080 专业班级电子信息工程四班 摘要

目前,单片机已经在测控领域中获得了广泛的应用,它除了可以测量电信以外,还可以用于温度、湿度等非电信号的测量,能独立工作的单片机温度检测、温度控制系统已经广泛应用很多领域。本次课程设计,就是用单片机实现温度控制,传统的温度检测大多以热敏电阻为温度传感器,但热敏电阻的可靠性差,测量温度准确率低,而且必须经过专门的接口电路转换成数字信号才能由单片机进行处理。本次采用DS18B20数字温度传感器来实现基于51单片机的数字温度计的设计,主要介绍了一个基于AT89C51单片机和数字温度传感器DS18B20的测温系统,并用LED 数码管显示温度值,易于读数。系统电路简单、操作简便,能任意设定报警温度并可查询最近的10个温度值,系统具有可靠性高、成本低、功耗小等优点。

目录 1. 引言 --------------------------------------------------------------4 2.总体方案设计---------------------------------------------------6 2.1设计要求-------------------------------------------------------6 2.2方案论证-------------------------------------------------------6 2.3 系统整体方案思路 -----------------------------------------7 3.硬件电路设计---------------------------------------------------9 3.1 主控制器系统的设计---------------------------------------11 3.2 温度传感器的设计-----------------------------------------11 3.2.1DS18B20基本介绍----------------------------------------11 3.2.3DS18B20测温原理---------------------------------------12 3.3 温度控制电路的设计--------------------------------------18 3.4 显示电路的设计 ------------------------------------------19 3. 4.1显示电路模块---------------------------------------------19 3.4.2数字显示驱动电路---------------------------------------19 4. 系统的软件设计----------------------------------------------20 5.系统的安装与调试--------------------------------------------22 结论----------------------------------------------------------------23 参考资料---------------------------------------------------------25

各种温度传感器分类及其原理.

各种温度传感器分类及其原理.

各种温度传感器分类及其原理 温度传感器是检测温度的器件,其种类最多,应用最广,发展最快。众所周知,日 常使用的材料及电子元件大部分特性都随温度而变化, 在此我们暂时介绍最常用的热电阻和热电偶两类产品。 1. 热电偶的工作原理 当有两种不同的导体和半导体A 和B 组成一个回路,其两端相互连接时,只要两结点处的温度不同,一端温度为T ,称为工作端或热端,另一端温度为TO ,称为自由端(也称参考端或冷端,则回路中就有电流产生,如图2-1(a所示,即回路中存在的电动势称为热电动势。这种由于温度不同而产生电动势的现象称为塞贝克效应。与塞贝克有关的效应有两个:其一, 当有电流流过两个不同导体的连接处时, 此处便吸收或放出热量(取决于电流的方向, 称为珀尔帖效应;其二,当有电流流过存在温度梯度的导体时,导体吸收或放出热量(取决于电流相对于温度梯度的方向,称为汤姆逊效应。两种不同导体或半导体的组合称为热电偶。热电偶的热电势EAB(T, T0 是由接触电势和温差电势合成的。接触电势是指两种不同的导体或半导体在接触处产生的电势, 此电势与两种导体或半导体的性质及在接触点的温度有关。温差电势是指同一导体或半导体在温度不同的两端产生的电势, 此电势只与导体或半导体的性质和两端的温度有关, 而与导体的长度、截面大小、沿其长度方向的温度分布无关。无论接触电势或温差电势都是由于集中于接触处端点的电子数不同而产生的电势, 热电偶测量的热电势是二者的合成。当回路断开时,在断开处a , b 之间便有一电动势差△V ,其极性和大小与回路中的热电势一致,如图2-1(b所示。并规定在冷端,当电流由A 流向B 时, 称A 为正极, B 为负极。实验表明,当△V 很小时,△V 与△T 成正比关系。定义△V 对△T

数字温度传感器介绍

走进数字温度传感器 数字温度传感器是一种能将温度物理量,通过温度敏感元件(如ntc温度传感器https://www.360docs.net/doc/8417472706.html,的核心部件ntc热敏电阻,当然这不同于数字温度传感器,不做细述,具体可以参看呈瑞官网,ntc热敏电阻https://www.360docs.net/doc/8417472706.html, 温度传感器)和相应电路转换成数字信号的传感器,数字温度传感器能使计算机等设备能够直接获取数字信号信息。 数字温度传感器可以进行系统监控测量,用以检测环境温度。数字温度传感器进行环境温度检测既能保证用户的安全,又能保证其测量的精确度,同时不影响组件的正常工作。 数字温度传感器的选型也是非常重要的,在选择数字温度传感器时,我们主要考虑其精度,功耗,分辨率,接口和封装等。下面我们对数字温度传感器的这些因素逐个进行分析。 精度 精度显示了数字温度传感器读数和实际温度的误差。在-25~+100℃温度范围内,常见精度一般为±2℃,呈瑞所研发的数字温度传感器精度能达到更高。 功耗 数字温度传感器功耗必须在整个系统功率预算以下,目前市场上的数字温度传感器消耗的电流一般都在微安级。说到功耗,不得不考虑到传感器的电源电压,目前大多数数字温度传感器供电电压范围为2.7~5.5V。大多数系统设计人员都非常关心系统的总功耗,电池供电系统尤为如此。对于这些应用领域使用的数字温度传感器来说,规定功耗必须在整个系统功率预算以下。现在市场上的许多数字温度传感器处于工作状态时,仅消耗微安电流。市场上还有一些具有断电引脚或断电寄存器功能的其他器件。它们在断电状态下的耗电可能远不到1mA。因为系统监控活动通常是非连续的,因此设计人员可充分利用“单触发”模式的优势(该模式也是一些数字温度传感器的功能之一)。在“单触发”模式中,该器件的上电时间刚好完成测量,接着随即恢复断电模式。利用这种功能,时间平均耗电量可降至最低。 National公司的LM70数字温度传感器就是一款采用断电寄存器的中等低功耗器件。运行状态下的最大静态电流指标是490μA,但当该器件进入关机模式时,电流消耗通常降至12μA。TI的TMP102采用了“单触发”模式,因此设计人员可轻松地使该器件处于断电状态,其电流消耗通常低于1μA。即使处于工作状态时,该器件也仅消耗10μA静态电流。 考虑系统功耗时,另一个因素是数字温度传感器的电源电压要求。大多数温度传感器的性能指标要求的供电电压范围为 2.7~5.5V。有几款器件(如Maxim公司的DS75LX)则专门适于低电压应用,其规范要求的电压范围是1.7V~3.7V。TMP102的性能要求电压可低至1.4V。

温度传感器的使用

温度传感器的使用 摘要本设计采用了TI 公司生产的MSP430F1611 微功耗单片机作为系统的核心控制器。装置使用了DS18B20型号的温度传感器,能直接测出温度值。温度传感器的种类众多,在应用与高精度、高可靠性的场合时DALLAS(达拉斯)公司生产的DS18B20温度传感器当仁不让。超小的体积,超低的硬件开消,抗干扰能力强,精度高,附加功能强,使得DS18B20更受欢迎。对于我们普通的电子爱好者来说,DS18B20的优势更是我们学习单片机技术和开发温度相关的小产品的不二选择。了解其工作原理和应用可以拓宽您对单片机开发的思路。 关键词MSP43 单片机,DS18B20温度传感器,共阴极四位七段数码管 一.方案设计与论证 根据题目的要求,主要学会使用温度传感器,则系统可以分为3部分,分别为测温 模块,控制模块,显示模块。 系统总体框图如图1 图1 系统总体框图 1.控制模块的选择 使用MSP430单片机同时完成检测、控制、显示等功能,此方案简单易行,设计自由度大而且成本较低。 2.温度传感器的选择 DS18B20的温度检测与数字数据输出全集成于一个芯片之上,从而抗干扰力更强。其一个工作周期可分为两个部分,即温度检测和数据处理。18B20共有三种形态的存储器资源,它们分别是:ROM 只读存储器,用于存放DS18B20ID编码,其前8位是单线系列编码(DS18B20的编码是19H),后面48位是芯片唯一的序列号,最后8位是以上56的位的CRC 码(冗余校验)。数据在出产时设置不由用户更改。DS18B20共64位ROM。RAM 数据暂存器,用于内部计算和数据存取,数据在掉电后丢失,DS18B20共9个字节RAM,每个字节为8位。第1、2个字节是温度转换后的数据值信息,第3、4个字节是用户EEPROM(常用于温度报警值储存)的镜像。在上电复位时其值将被刷新。第5个字节则是用户第3个EEPROM的镜像。第6、7、8个字节为计数寄存器,是为了让用户得到更高的温度分辨率而设计的,同样也是内部温度转换、计算的暂存单元。第9个字节为前8个字节的CRC码。EEPROM 非易失性记忆体,用于存放长期需要保存的数据,上下限温度报警值和校验数据,DS18B20共3位EEPROM,并在RAM都存在镜像。在每一次读温度之前都必须进行复杂的且精准时序的处理,因为DS18B20的硬件简单结果就会导致软件的巨大开消,也是尽力减

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