摄像头工艺学习资料

Camera Test Item Introduction
June 18th, 18th, 2013 v 2.1
By Rickson
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Test Items
Resolution Defect Pixel Relative Illuminance Relative Uniformity Blemish Color Uniformity Color Accuracy Optical Center Thermal Blemish Hot pixel Color Calibration ALS Alignment NVM NVM Check AF
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Resolution - SFR
反差 & 銳度
Edge Response
FFT
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Resolution - MTF
CTF
Contrast Transfer Function
Since the MTF is referring to the sine-wave input, the system response to a square-wave (or bar) target is the contrast transfer function (CTF).
Vmin – The average luminace for black area. VMax – The average luminace for white area. VB– The min luminace for black area. Vw – The Max luminace for black area. C(0) = (Vw - VB) / (Vw + VB ) C(f) = (Vmax - Vmin ) / (Vmax + Vmin ) MTF(f) = 100%*C(f)/C(0)
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Resolution - SFR
Test Objective : Use the contrast value to adjust and confirm the module’s resolution. Test Result : CT (Center) 06D TL(Top Left) 06D TR(Top Right) 06D BL(Button Left) 06D BR(Button Right) 09D TL(Top Left) 09D TR(Top Right) 09D BL(Button Left) 09D BR(Button Right) Issue Dirty lens Lens tilt Lens Scratch Die Tilt
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Resolution - debug
Lens & IR & Sensor 不平行
Die Tilt
溢焦
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Resolution - debug
傳輸線issue , data lose 周圍低對比， 周圍低對比，SFR輸出0
Chart 與實際距離不配合
治具頭遮蔽材料視野導致暗角
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Defect Pixel
Objective : Filter double/multiplex defect pixel modules. Test Algorithm: Test every pixel in three color channels.
Test Criteria :
Issue : Would / Dead pixel Particle Component
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為基板邊緣solder mask類物質
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Defective Pixel - Debug
OV7739 : 3um*3um OV9726 : 1.75um*1.75um
Action : 1,HP改機手件后需要清潔機器， 改機手件后需要清潔機器，軌道， 軌道，邦頭。 邦頭。 2,要求廠商提高來料PCB邊緣平滑度。 邊緣平滑度。減少由於 和彈夾， 和彈夾，機器軌道摩擦而產生Particle 基板邊緣solder mask類物質3.2*3.5
Action : 1,要求要求廠商改善來料品質， 要求要求廠商改善來料品質， 2, PE 正在Study增加離子吹風時間到1S,並要求 作業人員在吹風時， 作業人員在吹風時，翻轉L/H Holder 纖維
Action : 因其比較光亮， 因其比較光亮，兩端比較成圓球 懷疑為PCB錫類物質 建議作業人員在挑錫珠后， 建議作業人員在挑錫珠后，輕敲PCB，使可移動 物質與PCB充分脫落
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RI(Relative Illuminance )
Objective: Make sure the image corner uniformity. Measurement Environment： Light Field: A uniform field of light. Camera Setting： LSC off , WPC off , BPC off , White Balance off Measurement Method： The image is to be split up into NxN pixel block starting at (0,0) of the image. ( 30 x 30 , old project) Calculate the average Y for each measurement region. Image (upper left UL, upper right UR, lower left LL, lower right LR) by the average value of the region at the optical center of the image Measurement Criteria： Four coner RI value > 0.4 ( old project) RI_Delta < 10
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RU (Relative Uniformity)
Objective: Image without blemish. Measurement Environment： Light Field: A uniform field of light. Camera Setting： Lens Correction : Disable Measurement Method： The image is to be split up into NxN regions block starting at (0,0) of the image. (N = 32 , old project) Calculate the average Y for each measurement region. Getting the MINIMUM value and the MAXIMUM value from the all measurement value. Measurement Criteria： It’s NOT deviate from its surrounding measurement regions by more than 5%. The max variation between the MINIMUM value and the MAXIMUM value is 15%.
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Blemish
Objective : Find the particle on IR or lens surface. Find the IR break. Test Algorithm: Use high/low frequency to screen the black-white change status. Catch the abnormal frequency between high & low frequency.
Low frequency
Mid frequency
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High frequency
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Blemish - Debug
Action : 1，要求vendor 改善來料。 改善來料。 2, 100%檢測馬達Holder 的IR下表面， 下表面，防止人為漏失。 防止人為漏失。
IR下 Holder 屑(24*25um)
Action : 1, 100%檢測馬達Holder 的IR下表面， 下表面， 防止人為漏失。 防止人為漏失。 2,作業在檢測清潔Holder 時候， 時候，每完成 一個tray,需要用離子風吹手套後在作業。 需要用離子風吹手套後在作業。
人體皮屑 (16*16um)
Action : 需要為HP set up 準備dummy. Action : 要求Vendor 改善wafer 品質， 品質，
HP膠水
Die scratch
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CU ( Color Uniformity)
Objective: Color channel uniformity. Measurement Environment： Light Field: A uniform field of light. Camera Setting： Lens Correction : Disable Measurement Method： The image is to be split up into N x N regions block starting at (0,0) of the image. (N = 32 , old project) Calculate the ratio of R to B for each measurement region. Getting the MINIMUM value and the MAXIMUM value from the all measurement value. Measurement Criteria： It’s NOT deviate from its surrounding measurement regions by more than 5%. The max variation between the MINIMUM value and the MAXIMUM value is 15%.
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Color Accuracy
Objective Make sure the color accuracy. Measurement Environment： D50 light source Measurement Target： 24 Color Checker（R、G and B Patch） Camera Setting： AE，Enable (average Y:110-140)。 AWB，Disable Measurement Method： 1. Capture R, G, and B signal of red, green, and blue patches on the Macbeth color checker on a RAW image. 2. Transfer R,G,B pattern to the La*b* color space. 3. Compare the accuracy.
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Optical Center
2 bin filter to get the circle graph.
OV7739 : 3um*3um OV9726 : 1.75um*1.75um
640x480 Logic Center Issue Module
X shift 320 300
Y shift 240 238
320-300=20 20*3=60um
Help to review the COB assemble result. COB assemble tolerance 20~50um
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Thermal Blemish
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Light Panel-Debug
Flick IR 壓破 光板有粉塵
模組進水氣 3cm focus
光板沒拉好
5cm focus
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Other Issue
Flick
Timer 輪詢太快CPU無法負荷
HVS 不出圖狀況
LVDS干擾
1.8v電壓不對
Data lost 接觸不良(平行) Data Lost (Pin Short)
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No image
1,為WB鏡檢時， 鏡檢時，作業人員漏檢， 作業人員漏檢， 2,WB第一點不粘， 第一點不粘，造成不良
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