像素级数字长波制冷红外焦平面探测器研究进展

第40卷第4期红外技术 V ol.40 No.4 2018年4月 Infrared Technology Apr. 2018 301

〈综述与评论〉

白丕绩，姚立斌，陈楠，毛文彪，韩庆林，周连军，姬玉龙

（昆明物理研究所，云南昆明 650223）

摘要：介绍了美国、法国等西方红外强国在像素级数字化制冷长波红外焦平面探测器方面的研究现状

及发展趋势。基于像素级ADC （模数转换）数字读出电路（ROIC ）的不同实现架构，阐述了美国

MIT 实验室、法国Sofradir 及CEA-Leti 公司开发的像素级ADC 数字读出电路原理及像素级数字化长

波制冷红外焦平面探测器的最新研究成果。最后介绍了昆明物理研究所在像素级数字化制冷长波红外

焦平面探测器研究方面取得的最新进展。昆明物理研究所突破像素级ADC 设计等关键技术后，研制

出320×256（30 μm 中心距）

像素级数字读出电路，并与相同规格的长波制冷红外焦平面探测器互连，主要性能参数与国外同类像素级数字化长波焦平面探测器相当。

关键词：像素级ADC ；像素级数字读出电路；像素级数字长波探测器

中图分类号：TN386.5 文献标识码：A 文章编号：1001-8891(2018)04-0301-08

Progress of Pixel-ADC Level Digital Long Wave Cooled

Infrared Focal Plane Array Detector

BAI Piji ，YAO Libin ，CHEN Nan ，MAO Wenbiao ，HAN Qinlin ，ZHOU Lianjun ，JI Yulong

(Kunming Institute of Physics , Kunming 650223, China )

Abstract ：The status and trend of pixel-level analog to digital conversion(ADC) in digital long wave infrared focal plane array detectors in USA and France are presented. With reference to the different architectures of the pixel-level ADC obtained by a read out integrated circuit(ROIC), the theoretical characteristics of the pixel-level ADC ROICs were discussed. Various types of pixel-level ADCs in digital long wave infrared focal plane array detectors were recently presented at the Massachusetts Institute of Technology(MIT) laboratory in the USA and at Sofradir & CEA-Leti in France. These are introduced alongside the results of the pixel-level ADC digital long wave cooled infrared focal plane array detector research conducted by the Kunming Institute of Physics in China. The key technology of pixel-level ADC ROICs was successfully identified, and a 320×256(30 μm pitch) pixel-level ADC digital ROIC was developed and coupled to a long wave infrared cooled focal plane array detector by flip chip technology. The measured performance of the pixel-level ADC digital detector researched by the Kunming Institute of Physics is comparable with digital detectors abroad.

Key words ：pixel-level ADC ，pixel-level ADC digital read out integrated circuit ，pixel-level ADC digital long wave infrared detector

0 引言经过最近十几年的发展，红外探测器材料、器件工艺研制均取得长足进步，焦平面探测器的性能得到极大提升，已经接近或达到背景限水平。作为红外焦平面探测器的关键部分，读出电路（ROIC ）对像素

面积的利用也已经达到极限。对于当前主流的长波320×256红外焦平面探测器，其匹配的传统ROIC 通

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