CTCMD5D13-330M中文资料
MR13-1中文说明书
MR13 三回路九段可编程PID调节器中文操作指南请确认型号符合MR13选型,随表提供英文说明书和中文说明、操作流程图。
一．仪表的面板显示名称及分类:4．十一个发光二级管工作指示灯□ AT 绿灯:自整定动作时闪烁,待机时灯亮,结束时熄灭□ REM 绿灯:外给定状态时灯亮□ FLW 绿灯:二三回路跟踪一回路PV或SV值时状态灯亮□ COM 绿灯:通讯（可读/写）状态时灯亮,本机状态时熄灭□ RUN 绿灯:程序运行时灯亮,复位时熄灭□ OUT1,OUT2,OUT3 绿灯(3个):调节输出通断或线性亮度指示□ EV1,EV2,EV3 红灯(3个):报警指示二．仪表六个面板操作键及键操作说明:⒈ DISP键:返回键。
返回上一级菜单。
⒉ CH 键：a.回路选择键。
选择各回路的参数和状态。
b.在窗口[0-2], 与增“ENT”键同时按,控制程序的运行或复位。
⒊循环键:循环下移子窗口；在参数窗口群（1）同时按增∧键，可向上移窗口。
⒋增∧, 减∨键: 修改数字型参数,选择字符型参数。
⒌ENT确认键: 确认参数的修改或设定。
三.中文操作流程图和基本的工作方式说明:全部操作窗口按功能分为（0）基本窗口群，（1）参数窗口群和（2）程序参数窗口群。
窗口组成是:三排CH1,CH2,CH3各回路的测量值，一排为各回路设定值数码显示，一位回路号显示;窗口数字名称标在左上角；右边窗口的中文说明;例如:[0-0]代表测量/设定值显示和定值设定窗口,又称流程图空间的基本窗口。
虚线表示为选件窗口，有通道号显示一定是三回路多参数窗口。
此外,窗口间移动以及简要说明等也标在图上。
MR13基本的工作方式：1．分别独立的三回路，定值调节方式2．第一回路程序运行，二、三回路定值调节方式3．二、三回路跟踪一回路设定值的三温区方式4．第一回路定值／程序，二、三回路跟踪一回路设定值后测量值的三输出方式。
用于加热／制冷、主辅调节的复杂系统5．模拟遥控（外给定）用于群控或配比调节细读:参照流程图,仪表上电后, 经初始信息提示后进入[0-0]窗口。
ETC1-1-13TR中文资料
Input Impedance
ETC1-1-13 V4
1 Secondary Dot (Output Thru) 3 Secondary (Output Coupled)
Phase Unbalance
Amplitude Unbalance
2 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
E-Series RF 1:1 Transmission Line Transformer 4.5 – 3000 MHz
Features
• 1:1 Impedance Ratio • Surface Mount • Tape and reel packaging available
Description
Visit for additional data sheets and product information.
E-Series RF 1:1 Transmission Line Transformer 4.5 – 3000 MHz
C8051F330中文资料
（2）IO: IO 信号输出控制程序。 （3）Keyled: 键盘读取及 LED 数码管显示程序。 （4）IIC_EEPROM: IIC 接口 EEPROM(AT24C02A, 容量256字节)读写程序。 （5）IIC_RTC: IIC 接口实时时钟(PCF8563)读写程序。 （6）PWM: PWM 信号输出控制程序。 （7）RS232: RS232串行数据通信程序。 （8）ADC_Uart: ADC 采样转换及计算程序。 （9）ADC_display: ADC 采样转换及数据处理数码管显示。 （10）DAC: DAC 转换及计算程序。 （11）Timer: Timer2、Timer3计时程序。 （12）INT0: 外部中断0测试程序。 （13）bootloader: 如果 C8051F330内部 bootloader 程序不慎被擦除，可应用 C8051F 网络生产的 EC3将 bootloader.hex 程序下载到芯片中。
时钟源 − 两个内部振荡器：
24.5MHz，±2%的精度，可支持无晶体 UART 操作 80/40/20/10 kHz 低频率、低功耗振荡器 − 外部振荡器：晶体、RC、C、或外部时钟 − 可在运行中切换时钟源，适用于节电方式 封装：20脚 MLP
性能最好，价格最低的 C8051F 单片机学习板 c8051f 单片机应用解析之 c8051f330 内容：
3．本学习板主要特点 （1）选择与 MCS51单片机兼容高性能的混合信号处理器 C8051F330作为控制芯片。 （2）可以不使用仿真器（EC3）就可以进行软件下载调试，节约开发费用。 （3）编写了完善的软件例程，基本覆盖了 C8051F330单片机的所有功能。
4．学习板软件例程 （1）Delay: 软件延时程序，利用软件进行延时操作。
DSK5.1(RS232)顶力中文说明书
MI C1
M I C2
M IC3
M IC4
R
DIGISYNTHETIC
IR
MEN U
RS- 232 ENT ER
MAS TER
IN A
INB
FL
FR
C ENT
S. L
S.R
S.W
CL IP LIMIT
-3 -6 -12
-18 -24
CL IP L IMIT
-3 -6 -12
-18 -24
CL IP L IMIT
-3 -6 -12
-18 -24
CL IP LIMIT
-3 -6 -12
-18 -24
C L IP L I MIT
-3 -6 - 12
- 18 - 24
CL IP L IMIT
-3 -6 -12
-18 -24
CLI P L IM IT
-3 -6 -12
-18 -24
MUTE
MUTE
SL RECORD LEVEL RECORD
SR
BGM
IN 1
OUT
IN 2
SUBWOOFER OUT
OUTPUT R
IN 1,2 LEVEL
B GM
－∞ IN 2
+3dB IN1
I N PUT R
OUT PUT L
BGM INPUT LEVEL
B GM
－∞ IN 2
+3dB IN 1
IN PUT L
按向下键[DOWN]
音乐环绕音量
MASTER : 0dB S.W.: 0dB +
超低音音量
6
操作简介
KP-330III使用手朋
安全
安全
请在使用本产品前仔细阅读本手册，不要执行本手册中没有明确说明的操作。未经授权的操作会导致错误或 意外。制造商对因错误操作而导致的任何问题均不负责。 为了防止人员受伤、触电、或引起火灾、机器故障等，请您务必遵守以下注意事项： 在安装使用本机之前，请仔细阅读本手册，并请妥善保存本手册，以便了解正确用法和各项功能，以及使用 过程中出现疑问时查询。 不要执行本手册中没有明确说明的操作。未经授权的操作会导致错误或意外。制造商对因错误操作而导致的 任何问题均不负责。 请严格遵守标示在打印机手册及机体上的所有警告和指导。 打印机手册及机体上的警告、告诫及注意事项标记如下： 必须照办，以免伤害人体。 必须遵守，以免损坏设备或导致人员负伤。 框内内容为重要信息和有用的提示。 使用电源注意事项： 请务必使用有接地的电源及插座（AC220V，50/60Hz） 。 请不要用湿手触摸电源线，以免触电。 请勿将电源线置于易受挤压的地方，不要把电源线铺在通道上。一经发现电源线破损应立即更换，避免触电 或火灾。 请确认电源插座和电源线的最大承受电流大于设备的最大电流,以免引起火灾。 打雷时，请把电源开关置于 OFF，并拔出电源插头。 安装注意事项： 不要把打印机置放于不平稳的桌子、台面或机架上。 请勿堵塞机壳上的小槽或开孔。不要把打印机放在睡床、沙发、地毯或其它类似物品的表面，以防堵塞通风 孔。如果打印机被置于比较拥挤的环境中工作，应采取相应的通风措施。 不要将打印机放置在阳光直射、高温、潮湿和多尘的地方。 不要将打印机与大型电机及大功率用电设备并在同一回路使用。 不要将打印机置放于带有强磁场或有腐蚀性气体的地方。 整个计算机系统应远离干扰源，如大功率音箱或无线电主机等。 在不用打印机时，应拔掉打印机电源线。外接插座应安装在接近打印机的地方。 使用注意事项： 先确认打印机的电源开关处于关断状态，然后再将电源插入电源插座。 开启打印机之前必须按注意事项卡去除保护材料。 关机后，必须等待 5 秒钟后才能再次开启打印机，否则会造成打印机的损坏。 设备运行时，请不要触摸打印机的运动部件和锐利部件(如透明盖撕纸边沿等 )，以免伤人或设备损坏。 打印中或打印刚结束，绝对不要触摸打印头，避免因其高温可导致烫伤。 请不要把别针、订书钉、图钉等金属物落入机内，以免引发故障。 请不要将可乐、果汁、咖啡、水等液体洒到机内，以免引发故障。
MBD330DWT1G资料
MBD110DWT1,MBD330DWT1,MBD770DWT1Preferred DeviceDual Schottky Barrier DiodesApplication circuit designs are moving toward the consolidation of device count and into smaller packages. The new SOT−363 package is a solution which simplifies circuit design, reduces device count, and reduces board space by putting two discrete devices in one small six−leaded package. The SOT−363 is ideal for low−power surface mount applications where board space is at a premium, such as portable products.Surface Mount Comparisons:SOT−363SOT−23Area (mm2) 4.67.6Max Package P D (mW)120225Device Count21Space Savings:Package 1 SOT−23 2 SOT−23SOT−36340%70%The MBD110DW, MBD330DW, and MBD770DW devices are spin−offs of our popular MMBD101LT1, MMBD301LT1, and MMBD701LT1 SOT−23 devices. They are designed for high−efficiency UHF and VHF detector applications. Readily available to many other fast switching RF and digital applications. Features•Extremely Low Minority Carrier Lifetime•Very Low Capacitance•Low Reverse Leakage•Pb−Free Packages are AvailableMAXIMUM RATINGSRating Symbol ValueUnitReverse Voltage MBD110DWT1MBD330DWT1MBD770DWT1V R7.03070VForward Power Dissipation T A = 25°C P F120mW Junction Temperature T J−55 to +125°C Storage Temperature Range T stg−55 to +150°CStresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.Preferred devices are recommended choices for future use and best overall value.ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted)CharacteristicSymbol Min Typ Max Unit Reverse Breakdown Voltage(I R = 10 m A)MBD110DWT1MBD330DWT1MBD770DWT1V (BR)R7.0307010−−−−−VDiode Capacitance(V R = 0, f = 1.0 MHz, Note 1)MBD110DWT1C D −0.88 1.0pFTotal Capacitance(V R = 15 Volts, f = 1.0 MHz)MBD330DWT1(V R = 20 Volts, f = 1.0 MHz)MBD770DWT1C T−−0.90.5 1.51.0pFReverse Leakage(V R = 3.0 V) MBD110DWT1(V R = 25 V)MBD330DWT1(V R = 35 V)MBD770DWT1I R−−−0.02139.00.25200200m A nA nA Noise Figure(f = 1.0 GHz, Note 2)MBD110DWT1NF− 6.0−dB Forward Voltage(I F = 10 mA)MBD110DWT1(I F = 1.0 mA)MBD330DWT1(I F = 10 mA)(I F = 1.0 mA)MBD770DWT1(I F = 10 mA)V F −−−−−0.50.380.520.420.70.60.450.60.51.0VORDERING INFORMATIONDeviceMarkingPackage Shipping †MBD110DWT1M4SC−88 / SOT−3633000 Units / Tape & ReelMBD110DWT1G SC−88 / SOT−363(Pb−Free)MBD330DWT1T4SC−88 / SOT−363MBD330DWT1G SC−88 / SOT−363(Pb−Free)MBD770DWT1H5SC−88 / SOT−363MBD770DWT1GSC−88 / SOT−363(Pb−Free)†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.TYPICAL CHARACTERISTICSMBD110DWT1Figure 3. Capacitance V R , REVERSE VOLTAGE (VOLTS)Figure 4. Noise FigureP LO , LOCAL OSCILLATOR POWER (mW), R E V E R S E L E A K A G E ( A )I R m 0.10.20.5 1.0 2.0 5.0101.02.03.04.00.070.02Figure 5. Noise Figure Test CircuitNote 3 − L S is measured on a package having a short insteadof a die, using an impedance bridge (Boonton Radio Model 250A RX Meter).Note 1 − C D and C T are measured using a capacitancebridge (Boonton Electronics Model 75A or equiva-lent).Note 2 − Noise figure measured with diode under test in tuneddiode mount using UHF noise source and local oscillator (LO) frequency of 1.0 GHz. The LO power is adjusted for 1.0 mW. IF amplifier NF = 1.5 dB, f = 30 MHz, see Figure 5.NOTES ON TESTING AND SPECIFICATIONSC D,C A P A C I T A N C E (p F )TYPICAL CHARACTERISTICSMBD330DWT1V R , REVERSE VOLTAGE (VOLTS)Figure 8. Reverse Leakage V F , FORWARD VOLTAGE (VOLTS)Figure 9. Forward Voltage, R E V E R S E L E A K A G E ( A )I R m 0.20.40.60.81.0 1.20 6.0121824101.00.10.010.0012.82.42.01.61.20.80300.4, T O T A L C A P A C I T A N C E (p F )C TTYPICAL CHARACTERISTICSMBD770DWT1Figure 12. Reverse Leakage Figure 13. Forward VoltageV R , REVERSE VOLTAGE (VOLTS)V F , FORWARD VOLTAGE (VOLTS), R E V E R S E L E A K A G E ( A )I R m 0.20.40.8 1.21.62.00102030402.01.61.20.8050, T O T A L C A P A C I T A N C E (p F )C TPACKAGE DIMENSIONSSC−88 / SC−70 / SOT−363CASE 419B−02ISSUE WNOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: INCH.3.419B−01 OBSOLETE, NEW STANDARD 419B−02.DIM MIN NOM MAX MILLIMETERS A 0.800.95 1.10A10.000.050.10A3b 0.100.210.30C 0.100.140.25D 1.80 2.00 2.200.0310.0370.0430.0000.0020.0040.0040.0080.0120.0040.0050.0100.0700.0780.086MIN NOM MAX INCHES0.20 REF 0.008 REF H EE 1.15 1.25 1.35e 0.65 BSC L 0.100.200.302.00 2.10 2.200.0450.0490.0530.026 BSC0.0040.0080.0120.0780.0820.086STYLE 6:PIN 1.ANODE 2 2.N/C3.CATHODE 14.ANODE 15.N/C6.CATHODE 2*For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION。
XC6113D330资料
1/26XC6101_07_XC6111_17 ETR0207_009Preliminary◆CMOS Voltage Detector◆Manual Reset Input ◆Watchdog Functions ◆Built-in Delay Circuit ◆Detect Voltage Range: 1.6~5.0V, ± 2% ◆Reset Function is Selectable V DFL (Low When Detected) V DFH (High When Detected)■GENERAL DESCRIPTION The XC6101~XC6107, XC6111~XC6117 series aregroups of high-precision, low current consumption voltage detectors with manual reset input function and watchdog functions incorporating CMOS process technology. The series consist of a reference voltage source, delay circuit, comparator, and output driver.With the built-in delay circuit, the XC6101 ~ XC6107, XC6111 ~ XC6117 series’ ICs do not require any external components to output signals with release delay time. Moreover, with the manual reset function, reset can be asserted at any time. The ICs produce two types of output; V DFL (low when detected) and V DFH (high when detected).With the XC6101 ~ XC6105, XC6111 ~ XC6115 series’ ICs, the WD pin can be left open if the watchdog function is not used. Whenever the watchdog pin is opened, the internal counter clears before the watchdog timeout occurs. Since the manual reset pin is internally pulled up to the V IN pin voltage level, the ICs can be used with the manual reset pin left unconnected if the pin is unused.The detect voltages are internally fixed 1.6V ~ 5.0V in increments of 100mV, using laser trimming technology. Six watchdog timeout period settings are available in a range from 6.25msec to 1.6sec. Seven release delay time 1 are available in a range from 3.13msec to 1.6sec.■APPLICATIONS●Microprocessor reset circuits●Memory battery backup circuits ●System power-on reset circuits ●Power failure detection■TYPICAL APPLICATION CIRCUIT* Not necessary with CMOS output products.■FEATURESDetect Voltage Range: 1.6V ~ 5.0V, +2% (100mV increments)Hysteresis Range : V DF x 5%, TYP .(XC6101~XC6107)V DF x 0.1%, TYP .(XC6111~XC6117)Operating Voltage Range : 1.0V ~ 6.0V Detect Voltage Temperature Characteristics : +100ppm/O C (TYP .) Output Configuration : N-channel open drain,CMOSWatchdog Pin : Watchdog inputIf watchdog input maintains ‘H’ or ‘L’ within the watchdog timeout period, a reset signal is output to the RESET output pinManual Reset Pin : When driven ‘H’ to ‘L’levelsignal, the MRB pin voltage asserts forced reset on theoutput pin.Release Delay Time : 1.6sec, 400msec, 200msec,100msec, 50msec, 25msec, 3.13msec (TYP .) can be selectable.Watchdog Timeout Period : 1.6sec, 400msec, 200msec,100msec, 50msec,6.25msec (TYP .) can be selectable.■TYPICAL PERFORMANCE CHARACTERISTICS ●Supply Current vs. Input Voltage* ‘x’ represents both ‘0’ and ‘1’. (ex. XC61x1⇒XC6101 and XC6111)2/26XC6101~XC6107, XC6111~XC6117 SeriesPIN NUMBERXC6101, XC6102 XC6103 XC6104, XC6105XC6106, XC6107XC6111, XC6112 XC6113 XC6114, XC6115XC6116, XC6117SOT-25 USP-6C SOT-25 USP-6C SOT-25 USP-6C SOT-25USP-6CPIN NAMEFUNCTION1 4 - - 1 4 1 4 R ESETB Reset Output(V DFL : Low Level When Detected)2 5 2 5 2 5 2 5 V SSGround3 2 3 2 - -4 1 M RB ManualReset 4 1 4 1 4 1 - - WDWatchdog5 6 5 6 5 6 5 6 V IN Power Input - - 1 4 3 2 3 2 RESETReset Output (V DFH: High Level When Detected)■PIN CONFIGURATION SOT-25 (TOP VIEW)MRBV IN WD RESETBV SSMRBWD RESETV SSV IN RESETWD RESETBV SS V IN SOT-25 (TOP VIEW)RESETMRB RESETBV SS V IN SOT-25 (TOP VIEW) ■PIN ASSIGNMENT●SOT-25XC6101, XC6102 SeriesXC6111, XC6112 SeriesSOT-25 (TOP VIEW)XC6103 & XC6113 SeriesXC6104, XC6105 Series XC6114, XC6115 SeriesXC6106, XC6107 Series XC6116, XC6117 Series●USP-6CXC6101, XC6102 Series XC6111, XC6112 SeriesXC6103 & XC6113 SeriesXC6104, XC6105 Series XC6114, XC6115 SeriesXC6106, XC6107 Series XC6116, XC6117 SeriesUSP-6C (BOTTOM VIEW)USP-6C (BOTTOM VIEW)USP-6C (BOTTOM VIEW)USP-6C (BOTTOM VIEW)* The dissipation pad for the USP-6C package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the V SS pin.3/26XC6101 ~ XC6107, XC6111~ XC6117SeriesRESET OUTPUTSERIES WATCHDOGMANUAL RESET V DFL (RESETB)V DFH (RESET)XC6101 XC6111 Available Available CMOS - XC6102XC6112AvailableAvailableN-channel open drain-XC6103 XC6113 Available Available - CMOS XC6104 XC6114 Available Not AvailableCMOS CMOS XC6105 XC6115 Available Not Available N-channel open drain CMOS XC6106 XC6116 Not Available AvailableCMOSCMOS XC6107XC6117Not AvailableAvailableN-channel open drainCMOSDESIGNATORDESCRIPTIONSYMBOLDESCRIPTION0 : V DF x 5% (TYP .) with hysteresis ① Hysteresis Range1 : V DF x 0.1% (TYP .) without hysteresis② Functions and Type of Reset Output1 ~ 7: Watchdog and manual functions, and reset output type as per Selection Guide in the above chartA : 3.13msec (TYP .)B : 25msec (TYP .) C: 50msec (TYP .) D : 100msec (TYP .) E : 200msec (TYP .) F : 400msec (TYP .) ③ Release Delay Time * H : 1.6sec (TYP .)0 : No WD timeout period forXC6106, XC6107, XC6116, XC6117 Series 1: 6.25msec (TYP .) 2 : 50msec (TYP .) 3 : 100msec (TYP .) 4 : 200msec (TYP .) 5 : 400msec (TYP .) ④ Watchdog Timeout Period6: 1.6sec (TYP .) ⑤⑥ Detect Voltage 16 ~ 50: Detect voltageex.) 4.5V: ⑤⇒4, ⑥⇒5M : SOT-25 ⑦ Package E : USP-6C R : Embossed tape, standard feed ⑧ Device OrientationL: Embossed tape, reverse feed* Please set the release delay time shorter than or equal to the watchdog timeout period. ex.) XC6101D427MR or XC6101D327MR■PRODUCT CLASSIFICATION ●Selection Guide ●Ordering Information XC61①②③④⑤⑥⑦⑧4/26XC6101~XC6107, XC6111~XC6117 Series■PACKAGING INFORMATION●SOT-25●USP-6C5/26XC6101 ~ XC6107, XC6111~ XC6117Series④ Represents production lot number0 to 9 and A to Z and inverted 0 to 9 and A to Z repeated. (G, I, J, O, Q, W expected.) * ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)■MARKING RULE●SOT-25①②③④SOT-25 (TOP VIEW)6/26XC6101~XC6107, XC6111~XC6117 Series① Represents product series② Represents release delay time MARK RELEASE DELAY TIME PRODUCT SERIES A 3.13msec XC61XxAxxxxx B 25msec XC61XxBxxxxx C 50msec XC61XxCxxxxx D 100msec XC61XxDxxxxx E 200msec XC61XxExxxxx F 400msec XC61XxFxxxxx H 1.6sec XC61XxHxxxxx③ Represents watchdog timeout period MARK WATCHDOG TIMEOUT PERIOD PRODUCT SERIES 0 XC61X6, XC61X7 series XC61Xxx0xxxx 1 6.25msec XC61Xxx1xxxx 2 50msec XC61Xxx2xxxx 3 100msec XC61Xxx3xxxx 4 200msec XC61Xxx4xxxx 5 400msec XC61Xxx5xxxx 6 1.6sec XC61Xxx6xxxx④⑤ Represents detect voltage MARK④ ⑤DETECT VOLTAGE (V)PRODUCT SERIES3 3 3.3 XC61Xxxx33xx 5 0 5.0XC61Xxxx50xx⑥ Represents production lot number0 to 9 and A to Z repeated. (G, I, J, O, Q, W excepted.)* No character inversion used. ** ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)MARK PRODUCT SERIES MARK PRODUCT SERIES 3 XC6101xxxxxx 8 XC6111xxxxxx 4 XC6102xxxxxx 9 XC6112xxxxxx 5 XC6103xxxxxx A XC6113xxxxxx 6 XC6104xxxxxx B XC6114xxxxxx 7 XC6105xxxxxx C XC6115xxxxxx 3 XC6106xxxxxx 8 XC6116xxxxxx 4 XC6107xxxxxx 9 XC6117xxxxxx■MARKING RULE (Continued)●USP-6CUSP-6C (TOP VIEW)7/26XC6101 ~ XC6107, XC6111~ XC6117Series■BLOCK DIAGRAMS●XC6101, XC6111 Series●XC6102, XC6112 Series●XC6103, XC6113 Series8/26XC6101~XC6107, XC6111~XC6117 Series■BLOCK DIAGRAMS (Continued)●XC6107, XC6117 Series●XC6106, XC6116 Series●XC6105, XC6115 Series●XC6104, XC6114 Series9/26XC6101 ~ XC6107, XC6111~ XC6117SeriesPARAMETERSYMBOL RATINGSUNITSV INV SS -0.3 ~ 7.0 VM RBV SS -0.3 ~ V IN +0.3 VInput Voltage WD V SS -0.3 ~ 7.0V Output Current I OUT 20 mACMOS Output RESETB/RESET V SS -0.3 ~ V IN +0.3Output Voltage N-ch Open Drain Output RESETB V SS -0.3 ~ 7.0VSOT-25 250Power Dissipation USP-6C Pd 100mWOperational Temperature Range Topr -40 ~ +85 OCStorage Temperature Range Tstg -40 ~ +125 OC■ABSOLUTE MAXIMUM RATINGSTa = 25O C10/26XC6101~XC6107, XC6111~XC6117 SeriesNOTE:*1: XC6101~XC6107 (with hysteresis) *2: XC6111~XC6117 (without hysteresis)*3: ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111) *4: V DF(T): Setting detect voltage*5: If only “V DF ” is indicated, it represents both V DFL (low when detected) and V DFH (high when detected).PARAMETERSYMBOLCONDITIONSMIN.TYP .MAX. UNITS CIRCUITDetect Voltage V DFL V DFHV DF(T)× 0.98V DF(T) V DF(T)× 1.02 V 1 Hysteresis Range XC6101~XC6107 (*1) V HYS V DF × 0.02V DF × 0.05 V DF× 0.08 V 1Hysteresis Range XC6111~XC6117 (*2) V HYS 0 V DF × 0.001 V DFx 0.01V 1V IN =V DF(T)×0.9V - 5 11 V IN =V DF(T)×1.1V- 10 16 XC61X1/XC61X2/XC61X3XC61X4/XC61X5 (*3)(The MRB & the WD Pin: No connection) V IN =6.0V - 1218 V IN =V DF(T)×0.9V - 4 10 V IN =V DF(T)×1.1V - 8 14 Supply Current I SS XC61X6/XC61X7 (*3)(The MRB Pin: No connection)V IN = 6.0V - 1016 µA 2Operating Voltage V IN 1.0 - 6.0 V 1VIN = 1.0V 0.15 0.5 -V IN =2.0V (V DFL(T)> 2.0V) 2.0 2.5 - V IN =3.0V (V DFL(T) >3.0V) 3.0 3.5 -N-ch.V DS = 0.5V V IN =4.0V (V DFL(T) >4.0V) 3.5 4.0 - 3 V DFL Output Current (RESETB) I RBOUTCMOS,P-chV DS = 0.5V V IN = 6.0V - - 1.1 -0.8 mA 4 N-chV DS = 0.5VV IN =6.0V 4.4 4.9 - 3V IN =1.0V - - 0.08 - 0.02 V IN =2.0V (V DFH(T)> 2.0V)- - 0.50 - 0.30 V IN =3.0V (V DFH(T)>3.0V)- - 0.75 - 0.55V DFHOutput Current (RESET) I ROUT P-ch. V DS = 0.5V V IN =4.0V (V DFH(T)>4.0V)- - 0.95 - 0.75 mA 4Temperature Characteristics △V DF / △Topr ・V DF -40OC < Topr < 85 O C - +100 - ppm / O C12 3.13 5 13 25 3825 50 75 60 100 140 120 200 280 240 400 560Release Delay Time(V DF <1.8V)T DR Time until V IN is increased from1.0V to2.0Vand attains to the release time level,and the Reset output pin inverts.960 1600 2240 ms 5 2 3.13 5 13 25 38 25 50 7560 100 140 120 200 280 240 400 560 Release Delay Time(V DF >1.9V)T DRTime until V IN is increased from1.0V to (V DF x1.1V) and attains to the releasetime level,and the Reset output pin inverts. 960 1600 2240ms 5 Detect Delay Time T DFTime until V IN is decreased from 6.0V to 1.0V and attains to the detect voltage level, and the Reset output pin detectswhile the WD pin left opened.- 3 30 µs 5V DFL /V DFH CMOS Output Leak CurrentI LEAK V IN =6.0V, RESETB=6.0V (V DFL ) V IN =6.0V, RESET=0V (V DFH )- 0.01 - µA 3V DFL N-ch Open DrainOutput Leak CurrentI LEAKV IN =6.0V, RESETB=6.0V-0.010.10µA 3■ELECTRICAL CHARACTERISTICS●XC6101~XC6107, XC6111~XC6117 SeriesTa = 25O CSeriesPARAMETERSYMBOL CONDITIONS MIN.TYP . MAX. UNITS CIRCUIT3.13 6.25 9.38 25 50 7560 100 140 120 200 280240 400 560 Watchdog Timeout Period (V DF <1.8V)T WDTime until V IN increases form1.0V to2.0V andthe Reset output pin is released to go into the detection state. (WD=V SS )960 1600 2240 ms 6 3.13 6.25 9.38 25 50 75 60 100 140 120 200 280240 400 560 Watchdog Timeout Period (V DF >1.9V)T WDTime until V IN increases form1.0V to (V DF x1.1V)and the Reset output pin is released to go into the detection state. (WD=V SS )960 1600 2240 ms 6 WatchdogMinimum Pulse Width T WDIN V IN =6.0V,Apply pulse from 6.0V to 0Vto the WD pin. 300 - - ns 7 Watchdog High Level VoltageV WDH V IN =V DF x 1.1V ~ 6.0V V IN x 0.7- 6 V 7 Watchdog Low Level Voltage V WDL V IN =V DF x 1.1V ~ 6.0V0 - V IN x 0.3 V 7 V IN =6.0V, V WD =6.0V (Avg. when peak )- 12 19Watchdog Input Current I WD V IN =6.0V, V WD =0V (Avg. when peak) - 19 -12 -µA 8 Watchdog Input ResistanceR WDV IN =6.0V, V WD =0V, R WD =V IN / |I WD |315500880k Ω8PARAMETERSYMBOL CONDITIONS MIN.TYP . MAX.UNITS CIRCUITMRBHigh Level VoltageV MRH V IN =V DF x1.1V ~ 6.0V 1.4 - V IN 9MRBLow Level VoltageV MRL V IN =V DF x1.1V ~ 6.0V-0.35 V9MRBPull-up Resistance R MR V IN =6.0V, MRB=0V, R MR =V IN / |I MRB | 1.6 2.4 3.0 M Ω 10 MRB Minimum Pulse Width (*3) XC6101~XC6105 XC6111~XC6115 T MRINV IN =6.0V,Apply pulse from 6.0V to 0V tothe MRB pin 2.8 - -MRB Minimum Pulse Width (*4) XC6106, XC6107 XC6116, XC6117T MRIN V IN =6.0V,Apply pulse from 6.0V to 0V tothe MRB pin1.2 - -µs11●XC6101 ~ XC6103, XC6106 ~ XC6107, XC6111 ~ XC6113, XC6116 ~ XC6117 Series NOTE:*1: V DF(T): Setting detect voltage *2: If only “V DF ” is indicated, it represents both V DFL (low when detected) and V DFH (high when detected). *3: Watchdog function is available. *4: Watchdog function is not available.Ta = 25O CTa = 25O C ■ELECTRICAL CHARACTERISTICS (Continued)●XC6101~XC6105, XC6111~XC6115 Series■OPERATIONAL EXPLANATIONThe XC6101~XC6107, XC6111~XC6117 series compare, using the error amplifier, the voltage of the internal voltage reference source with the voltage divided by R1, R2 and R3 connected to the V IN pin. The resulting output signal from the error amplifier activates the watchdog logic, manual reset logic, delay circuit and the output driver. When the V IN pin voltage gradually falls and finally reaches the detect voltage, the RESETB pin output goes from high to low in the case of the V DFL type ICs, and the RESET pin output goes from low to high in the case of the V DFH type ICs.<RESETB / RESET Pin Output Signal>* V DFL (RESETB) type - output signal: Low when detected.The RESETB pin output goes from high to low whenever the V IN pin voltage falls below the detect voltage, or whenever the MRB pin is driven from high to low. The RESETB pin remains low for the release delay time (T DR) after the V IN pin voltage reaches the release voltage. If neither rising nor falling signals are applied to the WD pin within the watchdog timeout period, the RESETB pin output remains low for the release delay time (T DR), and thereafter the RESET pin outputs high level signal. * V DFH (RESET) type – output signal: High when detected.The RESET pin output goes from low to high whenever the V IN pin voltage falls below the detect voltage, or whenever the MRB pin is driven from high to low. The RESET pin remains high for the release delay time (T DR) after the V IN pin voltage reaches the release voltage. If neither rising nor falling signals are applied to the WD pin within the watchdog timeout period, the V OUT pin output remains high for the release delay time (T DR), and thereafter the RESET pin outputs low level signal.<Hysteresis>When the internal comparator output is high, the NMOS transistor connected in parallel to R3 is turned ON, activating the hysteresis circuit. The difference between the release and detect voltages represents the hysteresis range, as shown by the following calculations:V DF (detect voltage) = (R1+R2+R3) x Vref(R2+R3)V DR (release voltage) = (R1+R2) x Vref(R2)V HYS (hysteresis range)=V DR-V DF (V)V DR > V DF* Detect voltage (V DF) includes conditions of both V DFL (low when detected) and V DFH (high when detected).* Please refer to the block diagrams for R1, R2, R3 and Vref.Hysteresis range is selectable from V DF x 0.05V (XC6101~XC6107) or V DF x 0.001V (XC6111~XC6117).<Watchdog (WD) Pin>The XC6101~XC6107, XC6111~XC6117 series use a watchdog timer to detect malfunction or “runaway” of the microprocessor. If neither rising nor falling signals are applied from the microprocessor within the watchdog timeout period, the RESETB/RESET pin output maintains the detection state for the release delay time (T DR), and thereafter the RESET/RESETB pin output returns to the release state (Please refer to the FUNCTION CHART). The timer in the watchdog is then restarted. Six watchdog timeout period settings are available in 1.6sec, 400msec, 200msec, 100msec, 50msec, 6.25msec.<MRB Pin>Using the MRB pin input, the RESET/RESETB pin signal can be forced to the detection state. When the MRB pin is driven from high to low, the RESETB pin output goes from high to low in the case of the V DFL type ICs, and the RESET pin output goes from low to high in the case of the V DFH type. Even after the MRB pin is driven back high, the RESET/RESETB pin output maintains the detection state for the release delay time (T DR). Since the MRB pin is internally pulled up to the V IN pin voltage level, leave the MRB pin open if unused (Please refer to the FUNCTION CHART). A diode, which is an input protection element, is connected between the MRB pin and V IN pin. Therefore, if the MRB pin is applied voltage that exceeds V IN, the current will flow to V IN through the diode. Please use this IC within the stated maximum ratings (V SS -0.3 ~ V IN+0.3) on the MRB pin.<Release Delay Time>Release delay time (T DR) is the time that elapses from when the V IN pin reaches the release voltage, or when the watchdog timeout period expires with no rising signal applied to the WD pin, until the RESET/RESETB pin output is released from the detection state. Seven release delay time (T DR) watchdog timeout period settings are available in 1.6sec, 400msec, 200msec, 100msec, 50msec, 25msec, 3.13msec.<Detect Delay Time>Detect Delay Time (T DF) is the time that elapses from when the V IN pin voltage falls to the detect voltage until the RESET/ RESETB pin output goes into the detection state.Series■TIMING CHARTS●CMOS Output●T DF (CMOS Output)VINVDFL LevelGNDVIN Level VDFL Level GNDVIN x 0.1V■NOTES ON USE1. Please use this IC within the stated maximum ratings. Operation beyond these limits may cause degrading or permanent damage to the device.2. When a resistor is connected between the V IN pin and the input, the V IN voltage drops while the IC is operating and a malfunction may occur as a result of the IC’s through current. For the CMOS output products, the V IN voltage drops while the IC is operating and malfunction may occur as a result of the IC’s output current. Please be careful with using the XC6111~XC6117 series (without hysteresis).3. In order to stabilize the IC’s operations, please ensure that the V IN pin’s input frequency’s rise and fall times are more than 1 µ sec/V.4. Noise at the power supply may cause a malfunction of the watchdog operation or the circuit. In such case, please strength the line between V IN and the GND pin and connect about 0.22µF of a capacitor between the V IN pin and the GND pin.5. Protecting against a malfunction while the watchdog time out period, an ignoring time (no reaction time) occurs to the rise and fall times. Referring to the figure below, the ignoring time (no reaction time) lasts for 900µsec at maximum.GNDGNDGNDVIN Pin Wave FormWD Pin Wave FormRESETB Pin Wave Form (VDFL)SeriesPIN NAMELOGIC CONDITIONSH V IN >V DF +V HYS V IN L V IN <V DF H MRB>1.40V MRBL MRB<0.35V H When keeping W D >V WDH more than T WD L When keeping W D <V WDL more than T WD L → H V WDL → V WDH , T WDIN >300nsec WDH → L V WDH →V WDH , T WDIN >300nsecV IN MRB WD RESETB (*2) H HH LRepeat detect and release (H →L →H)H OpenH L → HH H or Open H → L H HLL *1 LV IN MRB WD RESETB (*3) H HH LRepeat detect and release (L →H →L)H OpenH L → HH H or Open H → L L HLL *1 HV IN WD RESETB (*2) RESET (*3) H HH L Repeat detect and release (H →L →H)Repeat detect and release (L →H →L)H OpenH L → HH H → L H L HL*1 L HV IN MRB RESETB (*2)RESET (*3)H H or Open H LH LL L H■PIN LOGIC CONDITIONSNOTE:*1: If only “V DF ” is indicated, it represents both V DFL (low when detected) and V DFH (high when detected).*2: For the details of each parameter, please see the electrical characteristics. V DF : Detect VoltageV HYS : Hysteresis RangeV WDH : WD High Level Voltage V WDL: WD Low Level Voltage T WDIN : WD Pulse Width T WD : WD Timeout Period■FUNCTION CHART●XC6103/XC61113 Series●XC6104/XC61114, XC6105/XC6115 Series●XC6106/XC61116, XC6107/XC6117 Series●XC6101/XC61111, XC6102/6112 Series*1: Including all logic of WD (WD=H, L, L →H, H →L, OPEN). *2: When the RESETB is High, the circuit is in the release state. When the RESETB is Low, the circuit is in the detection state. *3: When the RESET is High, the circuit is in the release state. When the RESET is Low, the circuit is in the detection state.■TEST CIRCUITSCircuit 1Circuit 2Circuit 3Circuit 4Series ■TEST CIRCUITS (Continued)Circuit 5Circuit 6Circuit 7■TEST CIRCUITS (Continued)Circuit 8Circuit 9Circuit 10Circuit 11Series■TYPICAL PERFORMANCE CHARACTERISTICS(1.1) Supply Current vs. Input Voltage(1.2) Supply Current vs. Input Voltage■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(2) Detect, Release Voltage vs. Ambient Temperature(1.2) Supply Current vs. Input Voltage (Continued)Series■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (3-1) Output Voltage vs. Input Voltage (V DFL ) (3.1) Detect, Release Voltage vs. Input Voltage (V DFL )(3.2) Detect, Release Voltage vs. Input Voltage (V DFH )■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(4) N-ch Driver Output Current vs. V DSSeries(6) P-ch Driver Output Current vs. Input Voltage 1■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(8) Release Delay Time vs. Ambient Temperature(7) P-ch Driver Output Current vs. Input Voltage 2■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (10) Release Delay Time vs. Input Voltage(11) Watchdog Timeout Period vs. Input VoltageSeries■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(14) MRB Low Level Voltage vs. Ambient Temperature(15) MRB High Level Voltage vs. Ambient Temperature* ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)。
SMAJ5.0CA-13-F中文资料
SMAJ5.0(C)A - SMAJ170(C)A 400W SURFACE MOUNT TRANSIENT VOLTAGESUPPRESSORFeaturesMaximum Ratings@ T A= 25°C unless otherwise specified·400W Peak Pulse Power Dissipation·Glass Passivated Die Construction·Uni- and Bi-Directional Versions Available·Excellent Clamping Capability·Fast Response Time·Lead Free Finish/RoHS Compliant (Note 4)Mechanical Data·Case: SMA·Case Material: Molded Plastic. UL FlammabilityClassification Rating 94V-0·Moisture Sensitivity: Level 1 per J-STD-020C·Terminals:Lead Free Plating (Matte Tin Finish).Solderable per MIL-STD-202, Method 208·Polarity Indicator: Cathode Band (Note: Bi-directionaldevices have no polarity indicator.)·Marking: Date Code and Marking Code See Page 4·Weight: 0.064 grams (approximate)Notes: 1. Valid provided that terminals are kept at ambient temperature.2. Measured with 8.3ms single half sine-wave. Duty cycle = 4 pulses per minute maximum.3. Unidirectional units only.4.RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.Notes: 5. Suffix C denotes Bi-directional device.6.V BR measured with I T current pulse = 300m s7. For Bi-Directional devices having V RWM of 10V and under, the I R is doubled.101001000100001101001000C ,J U N C T I O N C A P A C I T A N C E (p F )T V ,STANDOFF VOLTAGE (V)Fig.2Typical Total CapacitanceWM255075100125150175200100755025T ,AMBIENT TEMPERATURE (C)Fig.1Pulse Derating CurveA °P E A K P U L S E D E R A T I N G I N %O F P E A K P O W E R O R C U R R E N T0123I ,P E A K P U L S E C U R R E N T (%I )P p pt,TIME (ms)Fig.4Pulse Waveform0.11.00.1101001.010100010000P ,P E A K P U L S E P O W E R (k W )d 1000.00.20.40.6255075100125150175200P M S T E A D Y S T A T E P O W E R D I S S I P A T I O N (W )(A V ),T ,LEAD TEMPERATURE (C)Fig.6Steady State Power Derating CurveL °0.81.06050403020102510P E A K F O R W A R D S U R G E C U R R E N T ,(A )NUMBER OF CYCLES AT 60HzFig.5Maximum Non-Repetitive Surge Current20501001XX =Product type marking code (See Page 2)=Manufacturers’code marking YWW =Date code markingY =Last digit of year ex:2for 2002WW =Week code 01to52Marking InformationOrdering InformationNotes: 8. For Packaging Details, go to our website at /datasheets/ap02007.pdf.*x = Device Voltage, e.g., SMCJ170A-13-F.Example: SMAJ170A-13-F.(Note 8)。
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Power Inductors
ctparts.com
Manufacturer of Inductors, Chokes, Coils, Beads, Transformers & Toroids
800-684-5322Inside US 949-453-1811Outside US
Copyright © 2006 by CT Magnetics, DBA Central Technologies. All rights reserved.
CT Magnetics reserves the right to make improvements or change specifications without notice
CENTRAL
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03.15.06
SPECIFICATIONS
Parts are available in ±20% inductance tolerance only.
CTCMD5D13FPlease specify “F”for RoHS Compliant
*Rated Current:Inductance drop = 10% typ.
L TestDCRRated Current*
PartInductanceFreq.Max.Max.
Number(µH ±20%)(kHz)(Ω )(A)
CTCMD5D13_-3R3M3.31000.0811.25
CTCMD5D13_-4R7M4.71000.1061.20
CTCMD5D13_-6R8M6.81000.1440.90
CTCMD5D13_-100M101000.1870.85
CTCMD5D13_-150M151000.3000.57
CTCMD5D13_-220M221000.4310.54
CTCMD5D13_-330M331000.6370.28
CTCMD5D13_-470M471000.8750.35
CTCMD5D13 Series
From 3.3 µH to 47 µH
Not shown at actual size.
CHARACTERISTICS
PAD LAYOUT
Description:SMD power inductor
Applications:Power supplies for VTR, OA equipment, LCD
televisions, PC notebooks, portable communication equipment,
DC/DC converters, etc.
Operating Temperature:-25°C to +85°C
Inductance Tolerance:±20%
Testing:Tested on a HP4285A at 100 KHz , 0.1V
Packaging:Tape & Reel
Marking:Parts are marked with inductance code
Miscellaneous:RoHS Compliant
Additional Information:Additional electrical & physical
information available upon request
Samples available.See website for ordering information.
ABDCF
G
E
4
312
XXX
124
3
Marking: Inductance Code
4312Bottom View3.3µH ~ 15µH431
2
Bottom View
22µH ~ 47µH
3.61.4
3
.
4
1
.
1
Unit: mm
SizeABCDEFG
Max.Max.Max.
mm
5.87.41.56.00.64.24.5
inches
0.2280.2910.0590.2360.0240.1650.177
PHYSICAL DIMENSIONS
RoHS
Compliant
Available
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