Band structure of boron doped carbon nanotubes
碳纳米管增强型复合材料功能梯度板的自由振动模型与尺度效应

碳纳米管增强型复合材料功能梯度板的自由振动模型与尺度效应贺丹;门亮【摘要】A free vibration model of orthotropic functionally graded carbon nanotubes-reinforced com-posite plates is developed based on a new modified couple stress theory.The present model can describe the scale effects with only one material length parameter incorporated.The equations of motion are derived based on the Hamilton's principle in conjunction with the first-order shear deformation theory.A simply supported square plate is taken as the illustrative example and analytical solved.The effects of plate thickness,volume fraction and distribution of carbon nanotubes on the natural frequencies of the plate are investigated.Numerical results indicate that the natural frequencies predicted by the present model are always higher than those by the Mindlin plate model of classical elasticity theory.The differences between the natural frequencies predicted by the two models are significant when the plate thickness approaches the material length parameter,but are diminishing with the increase of the plate thickness.%基于一种新的各向异性修正偶应力理论,建立了碳纳米管增强复合材料功能梯度板的自由振动模型.该模型能够描述尺度效应,且仅包含一个尺度参数.基于一阶剪切变形理论和哈密顿原理推演了板的运动微分方程,并以四边简支板为例给出了自振频率的解析解.讨论了板的几何尺寸、碳纳米管体分比含量和分布方式等因素对板的自振频率的影响.结果表明,本文模型所预测的板的自振基频总是高于经典弹性理论的Mindlin板模型的预测结果,两者间的差异在板的几何尺寸接近尺度参数的值时非常明显,且会随着板的几何尺寸的增大而逐渐消失.【期刊名称】《计算力学学报》【年(卷),期】2018(035)003【总页数】5页(P326-330)【关键词】修正偶应力理论;功能梯度材料;自由振动;尺度效应;碳纳米管【作者】贺丹;门亮【作者单位】沈阳航空航天大学辽宁省飞行器复合材料结构分析与仿真重点实验室,沈阳110136;沈阳航空航天大学辽宁省飞行器复合材料结构分析与仿真重点实验室,沈阳110136【正文语种】中文【中图分类】O3251 引言碳纳米管(CNTs)具有高强度、高刚度、低密度以及良好的延展性[1]等优点,可用作复合材料的增强相。
金刚石肖特基二极管的研究进展

between different metals and diamond crystals are studied. Then the preparation processes of transverse, vertical and pseudovertical device structures and their effect on forward, reverse and breakdown characteristics of the SBDs are analyzed. The
等特性持续受到研究人员的关注。 然而,传统的半导体材料仍存在导热性能不足、击穿电压较低,以及器件
功率和频率之间难以同时提升的问题。 特别是对于功率半导体器件来说,其作为电力系统中电能控制与转
换的核心部件,直接影响系统的电力损耗。 因此,开展新型功率半导体器件的研究十分必要。 超宽禁带半导
体金刚石具有热、电、声、光、机械等优异的材料特性,以及最优的器件品质因子,在高功率电子器件等方面有
基接触而得到。 目前,高性能金刚石肖特基二极管的研发仍有一些难题亟待解决。 首先,硼掺杂浓度和精度
难以控制;其次,金刚石难以形成异质 pn 结,不利于复杂器件结构的制备。 此外,高温条件下还可能引起肖
特基金属与 p 型金刚石之间的界面反应,进而影响器件的反向击穿特性。 本文从 p 型金刚石薄膜生长、金
qV i ≈W M - W S ,如图 2( b) 所示,其中 qV i 为扩散电势,W S 为真空能级到半导体费米能级的距离。 施加正向偏
压 V F 时,扩散电势减小[ qV′i = q( V i - V F ) ] 。 正偏时势垒高度变低,因此有利于从半导体向金属注入载流子,
形成了从半导体指向金属的电流( J SM ) ,如图 2( a) 所示。 图 2( c) 展示了施加反向偏压 V R 时的情形,扩散电
硼掺杂金刚石的方法

硼掺杂金刚石的方法英文回答:Boron-doped diamond is a type of diamond that has been intentionally impregnated with boron atoms. This process is known as boron doping and is commonly used to modify the electrical and optical properties of diamond for various applications.There are several methods to dope diamond with boron. One common method is called chemical vapor deposition (CVD). In this method, a mixture of a carbon-containing gas (such as methane) and a boron-containing gas (such as diborane)is introduced into a chamber where diamond growth occurs. The boron atoms from the boron-containing gas are incorporated into the growing diamond lattice, resulting in boron-doped diamond.Another method is called ion implantation. In this method, high-energy boron ions are accelerated andbombarded onto the surface of diamond. The high-energy ions penetrate the diamond lattice and become embedded within it, creating boron-doped regions. This method allows forprecise control over the doping concentration and depth, making it suitable for specific applications.Boron-doped diamond has unique properties that make it useful in various fields. For example, it exhibitselectrical conductivity, which is unusual for diamond, a typically insulating material. This property makes boron-doped diamond suitable for applications in electronics,such as high-power devices and high-frequency transistors.Furthermore, boron-doped diamond has excellent thermal conductivity, making it ideal for heat management in electronic devices. It can efficiently dissipate heat, preventing overheating and improving device performance and reliability.中文回答:硼掺杂金刚石是一种在金刚石中有意注入硼原子的材料。
n型硅基底硼扩散过程中产生的富硼层的去除及表征

n型硅基底硼扩散过程中产生的富硼层的去除及表征n型硅基底硼扩散过程中产生的富硼层的去除及表征1. 导言n型硅基底底层硼扩散过程中会产生富硼层,这是由于硼在硅中的扩散速度较快,并且在扩散过程中形成一个浓度很高的硼层。
这个富硼层可能会对器件的性能产生负面影响,因此需要进行去除和表征。
本文将探讨n型硅基底硼扩散过程中富硼层的去除方法和表征技术。
2. 富硼层的去除方法2.1 钝化剂去除法钝化剂去除法是一种常用的去除富硼层的方法。
钝化剂可以选择多种化学物质,如硝酸、硫酸等。
这些钝化剂可以将富硼层表面的硼与钝化剂反应生成可溶解的化合物,从而实现富硼层的去除。
这种方法具有操作简单、效果稳定的特点,但是需要注意控制去除时间和浓度,以避免对硅基底造成不必要的损伤。
2.2 机械去除法机械去除法是通过机械切割或者刮擦的方式将富硼层物理性地去除。
这种方法需要使用特定的机械工具,如刮刀、砂纸等。
机械去除法可以有效地去除富硼层,但是需要注意控制力度和角度,以避免对硅基底造成划痕或损伤。
2.3 化学溶解法化学溶解法是通过特定的溶液将富硼层溶解掉。
这种方法可以根据硼化物在不同溶液中的溶解度进行选择。
常用的溶液有氢氟酸等。
化学溶解法具有去除效果好的优点,但是需要注意控制溶解的时间和浓度,以避免对硅基底造成腐蚀。
3. 富硼层的表征技术3.1 压电测量法压电测量法是一种常用的富硼层表征技术。
该方法基于硅基底在压电材料作用下产生的压电效应,通过测量压电信号来了解富硼层的位置和厚度。
这种方法可以非常准确地定量测量富硼层参数,并且无需对样品进行破坏性测试,是一种非常重要的表征技术。
3.2 X射线衍射分析X射线衍射分析是一种结构表征技术,可以用来分析材料的晶体结构。
通过测量样品被X射线衍射后的散射强度和散射角度,可以得到样品的晶胞参数和晶格结构信息。
对于富硼层的表征,X射线衍射分析可以提供详细的晶体结构信息,帮助分析富硼层的形貌、晶格失配和应力等特征。
硼氮共掺杂生物质炭的制备及吸附性能研究

第42卷第6期2023年6月硅㊀酸㊀盐㊀通㊀报BULLETIN OF THE CHINESE CERAMIC SOCIETY Vol.42㊀No.6June,2023硼氮共掺杂生物质炭的制备及吸附性能研究许㊀蒙,郭玉呈,林国强,李建保,陈拥军,骆丽杰(海南大学材料科学与工程学院,南海海洋资源利用国家重点实验室,海口㊀570228)摘要:以木棉㊁硼酸(HBO 3)㊁尿素(CO(NH 2)2)为原料,在氨气(NH 3)气氛下通过高温反应制备了硼氮共掺杂生物质炭材料,利用聚乙烯亚胺(PEI)对硼碳氮(BCN)材料进行处理,得到PEI-BCN 材料,并研究了该材料的吸附性能㊂结果表明:当反应温度为1100ħ时,制备得到的BCN 材料为多孔结构,其平均孔径为11.0nm;BCN 材料的吸附能力优于生物质炭,经PEI 改性处理后,BCN 材料的吸附性能得到大幅提高,其对有机染料孔雀石绿(MG)的吸附量高达710.0mg /g;PEI-BCN 材料的吸附与准一级吸附动力学模型吻合,其对MG 的吸附属于Langmuir 等温吸附㊂关键词:硼碳氮材料;生物质炭;木棉;聚乙烯亚胺;高温反应;吸附;孔雀石绿中图分类号:X703㊀㊀文献标志码:A ㊀㊀文章编号:1001-1625(2023)06-2242-09Preparation and Adsorption Properties of Boron-Nitrogen Co-Doped Biochar MaterialsXU Meng ,GUO Yucheng ,LIN Guoqiang ,LI Jianbao ,CHEN Yongjun ,LUO Lijie(State Key Laboratory of Marine Resource Utilization in South China Sea,School of Materials Science and Engineering,Hainan University,Haikou 570228,China)Abstract :Boron-nitrogen co-doped biochar material was prepared by high temperature reaction under ammonia (NH 3)atmosphere,using kapok,boric acid (HBO 3),and urea (CO(NH 2)2)as raw materials.The PEI-BCN material was obtained by treating boron-carbon-nitrogen (BCN)material with polyethyleneimine (PEI),and the adsorption properties of PEI-BCN material were studied.The results show that the prepared BCN material has a porous structure with an averagepore size of 11.0nm when the reaction temperature is 1100ħ.The adsorption property of BCN material is better than that of biochar,and after PEI modification,the adsorption property of BCN material is greatly improved.The adsorption amount of organic dye malachite green (MG)by PEI-BCN material is up to 710.0mg /g,showing excellent adsorption property.The adsorption of PEI-BCN material is consistent with the pseudo-first-order adsorption kinetics model,and the adsorption of MG by PEI-BCN material belongs to Langmuir isothermal adsorption.Key words :BCN material;biochar;kapok;polythyleneimine;high temperature reaction;adsorption;malachite green 收稿日期:2023-02-16;修订日期:2023-03-08基金项目:海南省重点研发计划(ZDYF2021XDNY196)作者简介:许㊀蒙(1997 ),女,硕士研究生㊂主要从事吸附材料的研究㊂E-mail:xmm2021@通信作者:骆丽杰,博士,副教授㊂E-mail:992767@0㊀引㊀言水环境污染一直是世界多国关注的问题㊂纺织㊁金属加工㊁化肥工业㊁制革厂等行业是水体污染的主要来源[1]㊂开发水体污染物去除技术,对生态经济的可持续发展具有重要意义㊂当前水体修复的技术主要包括吸附法[2]㊁膜技术[3]㊁化学沉淀[4]㊁离子交换[5]㊁混凝[6]㊁浮选[7]和臭氧化[8],其中吸附法具有低能耗㊁低污染㊁低成本等优点,在工业废水处理等领域具有广阔的应用前景㊂目前吸附法所用材料主要包括金属氧化物[9-10]㊁过渡金属硫族化合物[11-12]㊁过渡金属碳化物[13]㊁凝胶[14-16]㊁炭类材料[17-18]等,其中生物质炭来源丰富且可实现循环使用,但其吸附性能有待提高㊂而氮化硼具有宽的能隙㊁高的抗氧化性和化学惰性,特别是B N 键具有极性,表面缺陷较多,对重金属污染物和染料污染物都表现㊀第6期许㊀蒙等:硼氮共掺杂生物质炭的制备及吸附性能研究2243出优良的吸附性能[19-21]㊂因此,硼碳氮(BCN)材料作为一种新型材料,不但具有与石墨和BN纳米材料相近的优异力学性能,还具有优异的电学性能㊁光催化性能㊁抗氧化能力[22]㊂因此,相比于C和BN,BCN纳米材料可在B原子㊁N原子和C原子处提供更多的位点,而C原子的存在还可以削弱B和N之间的电子共轭结构,从而增加对污染物的吸附量[23]㊂综上所述,从化学改性的思路出发,在生物质炭材料中引入异类原子,有望提高炭类材料的吸附性能;通过调节B㊁C和N原子的比例,有望优化BCN材料的吸附性能,可使炭类材料在污水处理方面发挥更好的作用㊂木棉纤维属于丝状纤维,具有独特的中空结构,是一种用于吸附污染物的有前途的生物质炭材料[24]㊂然而,木棉表面的蜡层抑制了亲水性着色剂和含离子的溶液进入木棉表面,需要进行预处理以改变其固有的表面性质才能进行吸附[25]㊂综上所述,本文以木棉为原料,通过高温化学反应实现B㊁N原子共掺杂来制备生物质炭材料,并利用聚乙烯亚胺(PEI)改性来提高材料的表面性能㊂以Cr3+㊁Cu2+㊁罗丹明B(RB)㊁孔雀石绿(MG)为吸附质,考察了改性前后BCN材料的吸附性能㊂通过吸附动力学分析和等温吸附曲线拟合,系统研究了BCN材料的吸附过程㊂1㊀实㊀验1.1㊀材料的制备将海南当地收集的木棉去除杂质并用去离子水洗净,干燥后放入乙醇水溶液中,并加入次氯酸钠,用乙酸将混合溶液的pH值调至4.5,于80ħ下超声进行脱脂处理,以去除木棉纤维表面的蜡质成分,然后用去离子水清洗至pH呈中性,真空干燥备用㊂向烧杯中加入硼酸㊁尿素和适量的去离子水,将烧杯放置在60ħ的水浴锅中搅拌,使硼酸㊁尿素完全溶解在去离子水中,随后将处理过的木棉浸泡在溶液中,使木棉完全吸收溶液后进行24h冷冻干燥㊂将冷冻干燥后的样品置于氧化铝瓷舟中,于高温管式气氛炉中的高温恒温区进行热处理,并密封反应系统㊂加热前,对管式炉炉管进行排空处理㊂然后在流动N2保护下,以5ħ㊃min-1的升温速率升温至1000ħ后关闭N2,通入流动NH3,继续升温至1100ħ,保温4h㊂反应结束后,将NH3关闭,在N2保护下样品随炉冷却至室温,将样品取出,记为BCN㊂将上述得到的BCN浸泡在PEI中,放置在60ħ电热恒温水浴锅中一定时间,随后取出干燥备用,记为PEI-BCN㊂为了进行比较,将海南当地收集到的木棉直接进行碳化,取出干燥备用,记为C㊂1.2㊀吸附试验将一定量的吸附剂加入配制好的无机污染物(硝酸铬㊁硝酸铜)和有机污染物(罗丹明B和孔雀石绿)溶液,在25ħ的吸附条件下模拟水流吸附循环试验㊂在不同时间下取吸附溶液(10mL),迅速置入离心机离心(5min,3600r/min)分离,取澄清的上层离心液,做好时间标记后保存待测㊂使用紫外分光光度计测试浓度,并根据式(1)计算样品的平衡吸附量Q e㊂Q e=(C0-C e)VM(1)式中:C0为初始浓度,mg㊃L-1;C e为平衡浓度,mg㊃L-1;V为溶液体积,L;M为吸附剂质量,g㊂1.3㊀结构表征采用X射线衍射仪(Rigaku Smart Lab)㊁傅里叶变换红外光谱仪(PerkinElmer Frontier)㊁X射线光电子能谱仪(Thermo ESCALAB250XI)对样品的组成㊁结构进行表征㊂采用扫描电子显微镜(Thermoscientific Verios G4UC)㊁透射电子显微镜(Talos F200X)分析样品的表面形貌㊂利用微孔物理吸附分析仪(麦克ASAP2460)研究样品的比面积和孔隙结构㊂利用有机元素分析仪(UNICUBE)分析木棉的元素组成㊂2㊀结果与讨论2.1㊀XRD和FTIR分析图1(a)为不同反应温度(1000㊁1100㊁1200ħ)下产物的XRD谱㊂从图1(a)中可以看出,26ʎ和42ʎ分2244㊀新型功能材料硅酸盐通报㊀㊀㊀㊀㊀㊀第42卷别对应BCN 材料类石墨烯结构的(002)晶面和(100)晶面[26]㊂随着温度升高,样品的结晶度提高㊂然而,根据密度理论函数[27],B N 键的能量稳定性高于其他键,所以高温不利于形成B C 键和N C 键,但有利于形成稳定的B N 键㊂由此推断反应温度过高,样品表面可能会生成氮化硼,因此反应温度选择1100ħ较适宜㊂从图1(b)中可以看出,799㊁1398cm -1处的特征吸收峰分别对应B N 键的横向振动和B N B 键的伸缩振动㊂3100㊁3500cm -1处存在的峰对应N H 键的伸缩振动和O H 键的伸缩振动,这些官能团的存在有利于后续吸附[28]㊂图1㊀不同温度下制备的BCN 样品的XRD 谱和FTIR 谱Fig.1㊀XRD patterns and FTIR spectra of BCN samples prepared at different temperatures 图2是BCN 样品经PEI 改性前后的FTIR 谱㊂图中显示BCN 的B N 键的横向振动峰和B N B 键的伸缩振动峰在790㊁1386cm -1左右,C N 键对应的峰在1660cm -1左右,而N H 键的伸缩振动峰在3150cm -1左右㊂对比BCN 样品,PEI 改性的BCN 样品(PEI-BCN)在N H 键处的峰值得到加强,这是由于PEI 接枝到BCN 样品中,使 NH 2数量增加,从而使该处的峰值得到增强;PEI 改性的BCN 样品(PEI-BCN)在1300cm -1左右的峰值有所增加,这归因于PEI 中的C N 键衍射峰增强㊂以上结果表明PEI 通过接枝方式成功对BCN 进行了改性㊂图2㊀BCN 样品改性前后的FTIR 谱Fig.2㊀FTIR spectra of BCN samples before and after modification 2.2㊀XPS 分析图3为BCN 样品的XPS 谱㊂从样品的全谱图中可以看出BCN 样品中包含了B㊁C㊁N 和O 元素㊂O 1s 峰可能归因于表面吸附的H 2O 和未反应的B O㊂高分辨率的B 1s㊁C 1s 和N 1s 光谱进一步证明了BCN 的成键特征和化学基团㊂从分峰拟合的结果来看,B 1s 特征峰在190.4㊁190.9㊁192.1eV 处的峰分别对应着B C㊁B N 和B O 键[29],C 1s 特征峰在284.7㊁285.5㊁286.7eV 处的峰分别对应着C B㊁C C 和C N 键[30],N 1s 特征峰在398.1㊁399.0㊁401.4eV 处的峰分别对应着N B㊁N C 和N H 键[31]㊂因此,可推断B㊁N 原子以成键的方式在生物质炭中实现掺杂㊂表1是经过计算后得到的BCN 的化学组成,其成分为第6期许㊀蒙等:硼氮共掺杂生物质炭的制备及吸附性能研究2245㊀B 0.41C 0.22N 0.37㊂㊀图3㊀BCN 样品的XPS 分析Fig.3㊀XPS analysis of BCN samples表1㊀BCN 样品的元素组成Table 1㊀Elemental composition of BCN samplesComposition B C N Atomic fraction /%4122372.3㊀显微结构分析图4(a)㊁(b)分别为木棉和脱脂木棉的SEM 照片㊂可以看出,木棉纤维直径均匀,表面光滑,而脱脂木棉纤维表面略显粗糙但仍保持中空结构㊂利用有机元素分析仪对脱脂木棉进行元素分析,发现本试验已经将木棉中的S㊁P 等脂肪有效去除,这可以增加木棉纤维表面的亲水性,为后续试验提供有利条件㊂图4(c)㊁(d)为BCN 样品在温度为1100ħ㊁升温速率为5ħ/min 条件下的SEM 照片㊂可以清楚地看到,BCN 样品呈多孔结构,并且还保留了木棉纤维的中空结构特征,样品的管壁表面还有许多微小的孔洞(见图4(d)中的放大图)㊂由于木棉纤维㊁HBO 3㊁CO(NH 2)2在热解过程中脱氢脱氧,产生大量的气体,在气体逸出过程中形成了多孔结构,这大大提高了材料的比表面积㊂2246㊀新型功能材料硅酸盐通报㊀㊀㊀㊀㊀㊀第42卷图4㊀木棉㊁脱脂木棉和BCN 样品的SEM 照片Fig.4㊀SEM images of kapok,defatted kapok,and BCN samples 2.4㊀TEM 分析图5为BCN 样品的TEM 表征结果㊂从图5(a)的高分辨TEM(HRTEM)照片可以看出,所得样品的晶格条纹杂乱,有结构缺陷,结晶度较差,样品存在的表面缺陷较多,提供的活性位点较多,有利于材料的吸附㊂测量结果显示BCN 样品(002)晶面的间距为0.345nm,这与XRD 计算结果相对应㊂图5(b)为样品的元素分布图,可以看到元素B㊁C㊁N 分布均匀,说明样品的主要成分为BCN㊂图5㊀BCN 样品的HRTEM 照片和元素面分布Fig.5㊀HRTEM image and elemental plane distribution of BCN samples 2.5㊀氮气吸附等温线为了进一步研究材料的比表面积和孔径分布,测定了BCN 样品和PEI-BCN 样品的氮气吸附-解吸等温线,如图6所示㊂样品的等温线呈IV 型,具有明显的滞后环㊂毛细凝聚现象使等温吸附与脱附曲线错位,产生部分吸附滞后现象,说明内部孔结构复杂[32]㊂通过比表面积测试仪测得BCN 材料的比表面积为73.67m 2/g㊂图7是BCN 样品和PEI-BCN 样品的孔径分布,可以看出BCN 样品的平均孔径为11.0nm㊂经过PEI 改性后,所得PEI-BCN 样品的孔径分布范围有所增加,孔径稍有增大,平均孔径为12.6nm,属于介孔结构㊂结合SEM 结果可以得出材料内部存在大孔㊁中孔和微孔,它们之间的相互连接能够促进离子快速传输[33]㊂因此改性后的BCN 具有多级孔结构,这使得材料拥有更加丰富的活性位点,从而能够提高BCN 材料对污染物的吸附效率㊂2.6㊀吸附性能选用两种无机污染物(Cr 3+㊁Cu 2+)和两种有机污染物(罗丹明B㊁孔雀石绿)作为吸附质,对改性前后BCN 的吸附性能进行了研究,如图8所示㊂从图8可以看出,PEI-BCN 对Cu 2+㊁Cr 3+㊁RB 和MG 的吸附量均明显高于BCN,且改性后BCN 材料对孔雀石绿的吸附能力高达710.0mg /g,这是由于PEI 被成功接枝到BCN 结构中㊂PEI 具有大量氨基( NH 2),经过PEI 改性过后,BCN 对离子的配位络合作用更强,对染料的吸附增强㊂Cr 3+的吸附量大于Cu 2+,这种行为可能与Cu 2+比Cr 3+半径大有关㊂BCN 材料的孔结构以介孔为主,因此,离子半径小的金属可以更多地进入吸附剂的孔中,与吸附剂的活性位点相互作用㊂MG 是带有第6期许㊀蒙等:硼氮共掺杂生物质炭的制备及吸附性能研究2247㊀电子的阴离子染料,RB 是阳离子染料,因此PEI-BCN 对MG 的吸附能力大于RB㊂图9为MG 不同初始浓度下C㊁BCN 和PEI-BCN 的吸附性能,可以看出吸附量随着初始浓度的增大而增大㊂这是由于在吸附过程中样品内部所具有的吸附位点数量是不变的,离子的初始浓度越高越有利于离子的传质,因此随着溶液初始浓度增大,样品对离子的吸附量也会增大㊂另外,可以看到BCN 对MG 的吸附性能也明显高于生物质炭材料㊂由此可见,通过B㊁N 掺杂炭材料,可以形成B N㊁C N 等极性键,增加材料表面缺陷结构,从而提高其吸附性能[19-21]㊂图6㊀BCN 和PEI-BCN 的氮气吸附-解吸等温线Fig.6㊀Nitrogen adsorption-desorption isotherm curves of BCN andPEI-BCN 图7㊀BCN 和PEI-BCN 的孔径分布Fig.7㊀Pore size distribution of BCN andPEI-BCN 图8㊀BCN 和PEI-BCN 在Cr 3+㊁Cu 2+㊁RB 和MG 初始浓度为50mg /L 的条件下的吸附性能Fig.8㊀Adsorption properties of BCN and PEI-BCN at initial concentration of 50mg /L for Cr 3+,Cu 2+,RB andMG 图9㊀MG 不同初始浓度下C㊁BCN 和PEI-BCN 的吸附性能Fig.9㊀Adsorption properties of C,BCN and PEI-BCN at different initial concentration of MG2.7㊀等温吸附模型吸附等温线可以反映吸附过程中吸附剂与被吸附剂之间的相互作用关系,推导出吸附的具体机理㊂PEI-BCN 在25ħ下对MG 的吸附等温线如图10所示㊂Q e 值先增大,随后趋于稳定㊂这是因为当吸附浓度较低时,吸附剂的结合位点足够吸附,而随着MG 浓度的不断增加,PEI-BCN 的固有吸附位点被MG 完全占有,吸附逐渐达到饱和㊂此外,利用Langmuir 和Freundlich 等温模型对吸附过程进行了拟合,其中Langmuir 等温模型是假设吸附发生在单层表面且吸附表面均匀,吸附剂颗粒相互独立,而Freundlich 等温模型假设吸附同时发生在单层和多层㊂表2为Langmuir 和Freundlich 等温吸附模型参数㊂从表2可以看出,Langmuir 模型的常数R 2达到了0.998,这说明拟合结果符合Langmuir 吸附模型,MG 的吸附过程主要为单分子吸附㊂2248㊀新型功能材料硅酸盐通报㊀㊀㊀㊀㊀㊀第42卷图10㊀Langmuir等温吸附和Freundlich等温吸附的拟合曲线Fig.10㊀Fitting curves of Langmuir isotherm adsorption and Freundlich isotherm adsorption表2㊀Langmuir等温吸附和Freundlich等温吸附模型参数Table2㊀Model parameters of Langmuir isothermal adsorption and Freundlich isothermal adsorptionLangmuir model Freundlich modelQ max/(mg㊃g-1)K L/(L㊃mg-1)R2K F/(mg㊃g-1)(L㊃mg-1)1/n n R2811.584 1.070.998374.5690.350.960㊀㊀注:Q max代表单层分子吸附剂能有效捕获的物质的量;K L和K F分别为Langmuir和Freundlich等温吸附模型的平衡吸附常数㊂2.8㊀吸附动力学图11为准一级和准二级吸附动力学拟合曲线以及ln(Q e-Q T)㊁T/Q T与时间T的关系曲线,其中Q T为T时刻的吸附量㊂表3为准一级和准二级吸附动力学模型拟合参数㊂可以看出,PEI-BCN材料对MG的吸附过程大致分为三个阶段:在初始的0~50min,PEI-BCN对MG的吸附速度快,为快吸附阶段;在50~180min,材料对MG的吸附速度较之前开始下降,为慢吸附阶段;180min后吸附速度基本不变,吸附基本达到平衡㊂从表3可以看出,准一级模型的R2值在0.999左右,高于准二级模型的R2值,说明准一级动力学模型更适合描述PEI-BCN对MG的吸附行为㊂由于所得BCN材料具有中空结构,在吸附过程中,MG离子可以快速地扩散至材料内部活性位点,从而被吸附㊂表3㊀准一级和准二级吸附动力学模型拟合参数Table3㊀Fitting parameters of pseudo-first-order and pseudo-second-order adsorption kinetics modelsMG concentration/ (mg㊃L-1)Pseudo-first-order Pseudo-second-orderQ e/(mg㊃g-1)Intercept R2Q e/(mg㊃g-1)Intercept R210160.271 6.5780.999184.1640.0570.995 20324.180 6.6550.992391.3860.0920.985 40660.867 5.8150.998833.8210.1400.996 50715.030 4.9100.999854.2710.1730.989第6期许㊀蒙等:硼氮共掺杂生物质炭的制备及吸附性能研究2249㊀图11㊀吸附试验结果Fig.11㊀Adsorption test results 3㊀结㊀论1)采用高温化学反应法利用天然木棉制备了BCN 多孔材料,其平均孔径为11.0nm,吸附性能优于生物质炭㊂2)经过PEI 改性后的PEI-BCN 材料的平均孔径为12.6nm,其吸附能力大幅增加,其中对MG 的吸附高达710.0mg /g㊂3)PEI-BCN 对MG 的吸附属于均匀表面单层分子的等温吸附㊂经过对比发现MG 的吸附动力学过程更符合准一级吸附动力学模型㊂参考文献[1]㊀ALALWAN H A,KADHOM M A,ALMINSHID A H.Removal of heavy metals from 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基于掺硼金刚石电极的工业废水处理研究进展

化工进展Chemical Industry and Engineering Progress2024 年第 43 卷第 1 期基于掺硼金刚石电极的工业废水处理研究进展王博,张长安,赵利民,袁俊,宋永一(中石化(大连)石油化工研究院有限公司,辽宁 大连 116045)摘要:工业废水普遍具有可生化性差、污染物种类多、有机物含量高、难降解等特点,常规处理手段难使其达标排放。
以电化学高级氧化工艺为代表的污水深度处理工艺处理污水效果显著,是近年来环境工作者的研究热点之一。
掺硼金刚石(boron-doped diamond ,BDD )电极理化性质优异,是目前电化学高级氧化处理废水最为理想高效的阳极材料,但关于大尺寸BDD 电极的应用及处理真实工业废水的研究情况尚未及时总结归纳。
本文以基于BDD 电极的电化学高级氧化工艺过程为对象,对该过程涉及到的废水特点、工艺原理、BDD 电极特点及制备方法、处理案例和工艺参数优化等方面的研究进展进行综述,重点聚焦不同污染体系下的大型实验室装置、中试装置和处理真实工业废水案例,总结了BDD 电极材料开发情况和不同类型工艺的技术特点,探讨了工艺优化方面的研究进展和目前限制该技术大规模工业化应用的主要原因。
最后对基于BDD 电极的电化学高级氧化工艺应用前景和重点发展方向作出了展望。
关键词:电化学;废水;氧化;掺硼金刚石;工艺优化中图分类号:X7 文献标志码:A 文章编号:1000-6613(2024)01-0501-13Industrial wastewater treatment technology based on boron-dopeddiamond electrodes:A reviewWANG Bo ,ZHANG Chang ’an ,ZHAO Limin ,YUAN Jun ,SONG Yongyi(SINOPEC Dalian Research Institute of Petroleum and Petrochemicals Co., Ltd., Dalian 116045, Liaoning, China)Abstract: Industrial wastewater is generally characterized by poor biochemical properties, with manykinds of pollutants, high organic content and difficulty in degradation, etc . It is difficult to meet the discharge standards with conventional treatment methods. The deep treatment process of wastewater represented by the electrochemical advanced oxidation process can effectively treat industrial wastewater, which is one of the research hotspot for environmentalists in recent years. Boron-doped diamond (BDD) electrode has excellent physicochemical properties and is the most ideal and efficient anode material for the electrochemical oxidation treatment of wastewater. However, the research on the application of BDD electrodes in large size and the treatment of real industrial wastewater has not been summarized in time. This paper firstly reviewed the research progress on industrial wastewater characteristics, process principles, BDD electrode characteristics and preparation methods, treatment cases and optimization of process parameters involved in this process based on the electrochemical advanced oxidation process with BDD electrodes, and focused on large laboratory installations, pilot plants, and real industrial wastewater综述与专论DOI :10.16085/j.issn.1000-6613.2023-0269收稿日期:2023-02-27;修改稿日期:2023-07-10。
氮掺杂碳材料的制备及在超级电容器中的应用研究

摘要能源稀缺和环境污染已成为21世纪不可忽视的两大社会问题,学者们纷纷致力于寻找和开发清洁环保的可再生能源以及安全高效的储能装置。
其中,超级电容器(电化学电容器或法拉第电容器),因为其具有充放电速率快、功率密度高、循环稳定性好等优点,逐渐成为了科学家们的研究重点。
碳材料作为一种常用的超级电容器电极材料,具有比表面积大、孔径结构可调控、导电性能好和来源广泛、成本低廉等优点,受到了广泛的关注。
但单纯的碳材料作为电极材料时,存在比电容和能量密度较低的缺点,严重限制了其进一步发展和应用。
据报道,在碳基骨架中掺杂氮、磷、氧、硼等杂原子,能有效对碳材料进行改性,增加其比电容和能量密度。
本课题主要制备了三种氮掺杂的多孔碳材料(PNCs),研究不同前驱体及碳化温度对PNCs形貌、结构和电化学性能的影响,并探究了PNCs样品作为超级电容器电极材料的实用性能:首先,以对苯二胺(PPD)和三聚氯氰(TCT)为主要原料,通过缩聚反应生成具有三嗪结构的微孔聚合物,再在不同温度下煅烧碳化,制备氮掺杂的碳材料。
测试表征结果表明:碳化温度是影响电极材料比表面积、孔径分布、氮掺杂量和电化学性能的重要因素;碳化温度升高时,样品的比表面积和微孔孔体积逐渐增大,但当碳化温度过高时,比表面积和微孔孔体积变小,碳化温度为900 ℃时,样品具有最高的比表面积和微孔孔体积;随着碳化温度的逐渐升高,样品的石墨化程度逐渐变大,导电性逐渐增强,氮含量逐渐减少。
在比表面积、孔径结构、氮掺杂量和导电性能的综合作用下,900 ℃碳化的样品(N-CTF-900) 在1 A g-1电流密度时具有264 F g-1的比电容,为各个碳化温度中的最大值,且其具有良好的倍率性能和循环稳定性。
其次,分别以对苯二胺(PPD)为碳源和氮源,六氯环三磷腈(HCCP)为氮源和磷源,通过氨基对氯的亲核取代,生成具有微孔结构的聚合物,再置于不同温度的管式炉中煅烧碳化,制备氮磷共掺杂的多孔碳材料。
半导体必备词汇

Abrupt junction 突变结Accelerated testing 加速实验Acceptor 受主Acceptor atom 受主原子Accumulation 积累、堆积Accumulating contact 积累接触Accumulation region 积累区Accumulation layer 积累层Active region 有源区Active component 有源元Active device 有源器件Activation 激活Activation energy 激活能Active region 有源(放大)区Admittance 导纳Allowed band 允带Alloy-junction device合金结器件Aluminum(Aluminium) 铝Aluminum ? oxide 铝氧化物Aluminum passivation 铝钝化Ambipolar 双极的Ambient temperature 环境温度Amorphous 无定形的,非晶体的Amplifier 功放扩音器放大器Analogue(Analog) comparator 模拟比较器Angstrom 埃Anneal 退火Anisotropic 各向异性的Anode 阳极Arsenic (AS) 砷Auger 俄歇Auger process 俄歇过程Avalanche 雪崩Avalanche breakdown 雪崩击穿Avalanche excitation雪崩激发Background carrier 本底载流子Background doping 本底掺杂Backward 反向Backward bias 反向偏置Ballasting resistor 整流电阻Ball bond 球形键合Band 能带Band gap 能带间隙Barrier 势垒Barrier layer 势垒层Barrier width 势垒宽度Base 基极Base contact 基区接触Base stretching 基区扩展效应Base transit time 基区渡越时间Base transport efficiency 基区输运系数Base-width modulation基区宽度调制Basis vector 基矢Bias 偏置Bilateral switch 双向开关Binary code 二进制代码Binary compound semiconductor 二元化合物半导体Bipolar 双极性的Bipolar Junction Transistor (BJT)双极晶体管Bloch 布洛赫Blocking band 阻挡能带Blocking contact 阻挡接触Body - centered 体心立方Body-centred cubic structure 体立心结构Boltzmann 波尔兹曼Bond 键、键合Bonding electron 价电子Bonding pad 键合点Bootstrap circuit 自举电路Bootstrapped emitter follower 自举射极跟随器Boron 硼Borosilicate glass 硼硅玻璃Boundary condition 边界条件Bound electron 束缚电子Breadboard 模拟板、实验板Break down 击穿Break over 转折Brillouin 布里渊Brillouin zone 布里渊区Built-in 内建的Build-in electric field 内建电场Bulk 体/体内Bulk absorption 体吸收Bulk generation 体产生Bulk recombination 体复合Burn - in 老化Burn out 烧毁Buried channel 埋沟Buried diffusion region 隐埋扩散区Can 外壳Capacitance 电容Capture cross section 俘获截面Capture carrier 俘获载流子Carrier 载流子、载波Carry bit 进位位Carry-in bit 进位输入Carry-out bit 进位输出Cascade 级联Case 管壳Cathode 阴极Center 中心Ceramic 陶瓷(的)Channel 沟道Channel breakdown 沟道击穿Channel current 沟道电流Channel doping 沟道掺杂Channel shortening 沟道缩短Channel width 沟道宽度Characteristic impedance 特征阻抗Charge 电荷、充电Charge-compensation effects 电荷补偿效应Charge conservation 电荷守恒Charge neutrality condition 电中性条件Charge drive/exchange/sharing/transfer/storage 电荷驱动/交换/共享/转移/存储Chemmical etching 化学腐蚀法Chemically-Polish 化学抛光Chemmically-Mechanically Polish (CMP) 化学机械抛光Chip 芯片Chip yield 芯片成品率Clamped 箝位Clamping diode 箝位二极管Cleavage plane 解理面Clock rate 时钟频率Clock generator 时钟发生器Clock flip-flop 时钟触发器Close-packed structure 密堆积结构Close-loop gain 闭环增益Collector 集电极Collision 碰撞Compensated OP-AMP 补偿运放Common-base/collector/emitter connection 共基极/集电极/发射极连接Common-gate/drain/source connection 共栅/漏/源连接Common-mode gain 共模增益Common-mode input 共模输入Common-mode rejection ratio (CMRR) 共模抑制比Compatibility 兼容性Compensation 补偿Compensated impurities 补偿杂质Compensated semiconductor 补偿半导体Complementary Darlington circuit 互补达林顿电路Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(CMOS)互补金属氧化物半导体场效应晶体管Complementary error function 余误差函数Computer-aided design (CAD)/test(CA T)/manufacture(CAM) 计算机辅助设计/ 测试/制造Compound Semiconductor 化合物半导体Conductance 电导Conduction band (edge) 导带(底) Conduction level/state 导带态Conductor 导体Conductivity 电导率Configuration 组态Conlomb 库仑Conpled Configuration Devices 结构组态Constants 物理常数Constant energy surface 等能面Constant-source diffusion恒定源扩散Contact 接触Contamination 治污Continuity equation 连续性方程Contact hole 接触孔Contact potential 接触电势Continuity condition 连续性条件Contra doping 反掺杂Controlled 受控的Converter 转换器Conveyer 传输器Copper interconnection system 铜互连系统Couping 耦合Covalent 共阶的Crossover 跨交Critical 临界的Crossunder 穿交Crucible坩埚Crystal defect/face/orientation/lattice 晶体缺陷/晶面/晶向/晶格Current density 电流密度Curvature 曲率Cut off 截止Current drift/dirve/sharing 电流漂移/驱动/共享Current Sense 电流取样Curvature 弯曲Custom integrated circuit 定制集成电路Cylindrical 柱面的Czochralshicrystal 直立单晶Czochralski technique 切克劳斯基技术(Cz法直拉晶体J)Dangling bonds 悬挂键Dark current 暗电流Dead time 空载时间Debye length 德拜长度De.broglie 德布洛意Decderate 减速Decibel (dB) 分贝Decode 译码Deep acceptor level 深受主能级Deep donor level 深施主能级Deep impurity level 深度杂质能级Deep trap 深陷阱Defeat 缺陷Degenerate semiconductor 简并半导体Degeneracy 简并度Degradation 退化Degree Celsius(centigrade) /Kelvin 摄氏/开氏温度Delay 延迟Density 密度Density of states 态密度Depletion 耗尽Depletion approximation 耗尽近似Depletion contact 耗尽接触Depletion depth 耗尽深度Depletion effect 耗尽效应Depletion layer 耗尽层Depletion MOS 耗尽MOS Depletion region 耗尽区Deposited film 淀积薄膜Deposition process 淀积工艺Design rules 设计规则Die 芯片(复数dice)Diode 二极管Dielectric 介电的Dielectric isolation 介质隔离Difference-mode input 差模输入Differential amplifier 差分放大器Differential capacitance 微分电容Diffused junction 扩散结Diffusion 扩散Diffusion coefficient 扩散系数Diffusion constant 扩散常数Diffusivity 扩散率Diffusion capacitance/barrier/current/furnace 扩散电容/势垒/电流/炉Digital circuit 数字电路Dipole domain 偶极畴Dipole layer 偶极层Direct-coupling 直接耦合Direct-gap semiconductor 直接带隙半导体Direct transition 直接跃迁Discharge 放电Discrete component 分立元件Dissipation 耗散Distribution 分布Distributed capacitance 分布电容Distributed model 分布模型Displacement 位移Dislocation 位错Domain 畴Donor 施主Donor exhaustion 施主耗尽Dopant 掺杂剂Doped semiconductor 掺杂半导体Doping concentration 掺杂浓度Double-diffusive MOS(DMOS)双扩散MOS.Drift 漂移Drift field 漂移电场Drift mobility 迁移率Dry etching 干法腐蚀Dry/wet oxidation 干/湿法氧化Dose 剂量Duty cycle 工作周期Dual-in-line package (DIP)双列直插式封装Dynamics 动态Dynamic characteristics 动态属性Dynamic impedance 动态阻抗Early effect 厄利效应Early failure 早期失效Effective mass 有效质量Einstein relation(ship) 爱因斯坦关系Electric Erase Programmable Read Only Memory(E2PROM) 一次性电可擦除只读存储器Electrode 电极Electrominggratim 电迁移Electron affinity 电子亲和势Electronic -grade 电子能Electron-beam photo-resist exposure 光致抗蚀剂的电子束曝光Electron gas 电子气Electron-grade water 电子级纯水Electron trapping center 电子俘获中心Electron V olt (eV) 电子伏Electrostatic 静电的Element 元素/元件/配件Elemental semiconductor 元素半导体Ellipse 椭圆Ellipsoid 椭球Emitter 发射极Emitter-coupled logic 发射极耦合逻辑Emitter-coupled pair 发射极耦合对Emitter follower 射随器Empty band 空带Emitter crowding effect 发射极集边(拥挤)效应Endurance test =life test 寿命测试Energy state 能态Energy momentum diagram 能量-动量(E-K)图Enhancement mode 增强型模式Enhancement MOS 增强性MOS Entefic (低)共溶的Environmental test 环境测试Epitaxial 外延的Epitaxial layer 外延层Epitaxial slice 外延片Expitaxy 外延Equivalent curcuit 等效电路Equilibrium majority /minority carriers 平衡多数/少数载流子Erasable Programmable ROM (EPROM)可搽取(编程)存储器Error function complement 余误差函数Etch 刻蚀Etchant 刻蚀剂Etching mask 抗蚀剂掩模Excess carrier 过剩载流子Excitation energy 激发能Excited state 激发态Exciton 激子Extrapolation 外推法Extrinsic 非本征的Extrinsic semiconductor 杂质半导体Face - centered 面心立方Fall time 下降时间Fan-in 扇入Fan-out 扇出Fast recovery 快恢复Fast surface states 快界面态Feedback 反馈Fermi level 费米能级Fermi-Dirac Distribution 费米-狄拉克分布Femi potential 费米势Fick equation 菲克方程(扩散)Field effect transistor 场效应晶体管Field oxide 场氧化层Filled band 满带Film 薄膜Flash memory 闪烁存储器Flat band 平带Flat pack 扁平封装Flicker noise 闪烁(变)噪声Flip-flop toggle 触发器翻转Floating gate 浮栅Fluoride etch 氟化氢刻蚀Forbidden band 禁带Forward bias 正向偏置Forward blocking /conducting正向阻断/导通Frequency deviation noise频率漂移噪声Frequency response 频率响应Function 函数Gain 增益Gallium-Arsenide(GaAs) 砷化钾Gamy ray r 射线Gate 门、栅、控制极Gate oxide 栅氧化层Gauss(ian)高斯Gaussian distribution profile 高斯掺杂分布Generation-recombination 产生-复合Geometries 几何尺寸Germanium(Ge) 锗Graded 缓变的Graded (gradual) channel 缓变沟道Graded junction 缓变结Grain 晶粒Gradient 梯度Grown junction 生长结Guard ring 保护环Gummel-Poom model 葛谋-潘模型Gunn - effect 狄氏效应Hardened device 辐射加固器件Heat of formation 形成热Heat sink 散热器、热沉Heavy/light hole band 重/轻空穴带Heavy saturation 重掺杂Hell - effect 霍尔效应Heterojunction 异质结Heterojunction structure 异质结结构Heterojunction Bipolar Transistor(HBT)异质结双极型晶体High field property 高场特性High-performance MOS.( H-MOS)高性能MOS. Hormalized 归一化Horizontal epitaxial reactor 卧式外延反应器Hot carrior 热载流子Hybrid integration 混合集成Image - force 镜象力Impact ionization 碰撞电离Impedance 阻抗Imperfect structure 不完整结构Implantation dose 注入剂量Implanted ion 注入离子Impurity 杂质Impurity scattering 杂志散射Incremental resistance 电阻增量(微分电阻)In-contact mask 接触式掩模Indium tin oxide (ITO) 铟锡氧化物Induced channel 感应沟道Infrared 红外的Injection 注入Input offset voltage 输入失调电压Insulator 绝缘体Insulated Gate FET(IGFET)绝缘栅FET Integrated injection logic集成注入逻辑Integration 集成、积分Interconnection 互连Interconnection time delay 互连延时Interdigitated structure 交互式结构Interface 界面Interference 干涉International system of unions国际单位制Internally scattering 谷间散射Interpolation 内插法Intrinsic 本征的Intrinsic semiconductor 本征半导体Inverse operation 反向工作Inversion 反型Inverter 倒相器Ion 离子Ion beam 离子束Ion etching 离子刻蚀Ion implantation 离子注入Ionization 电离Ionization energy 电离能Irradiation 辐照Isolation land 隔离岛Isotropic 各向同性Junction FET(JFET) 结型场效应管Junction isolation 结隔离Junction spacing 结间距Junction side-wall 结侧壁Latch up 闭锁Lateral 横向的Lattice 晶格Layout 版图Lattice binding/cell/constant/defect/distortion 晶格结合力/晶胞/晶格/晶格常熟/晶格缺陷/晶格畸变Leakage current (泄)漏电流Level shifting 电平移动Life time 寿命linearity 线性度Linked bond 共价键Liquid Nitrogen 液氮Liquid-phase epitaxial growth technique 液相外延生长技术Lithography 光刻Light Emitting Diode(LED) 发光二极管Load line or Variable 负载线Locating and Wiring 布局布线Longitudinal 纵向的Logic swing 逻辑摆幅Lorentz 洛沦兹Lumped model 集总模型Majority carrier 多数载流子Mask 掩膜板,光刻板Mask level 掩模序号Mask set 掩模组Mass - action law质量守恒定律Master-slave D flip-flop 主从D触发器Matching 匹配Maxwell 麦克斯韦Mean free path 平均自由程Meandered emitter junction 梳状发射极结Mean time before failure (MTBF) 平均工作时间Megeto - resistance 磁阻Mesa 台面MESFET-Metal Semiconductor金属半导体FET Metallization 金属化Microelectronic technique 微电子技术Microelectronics 微电子学Millen indices 密勒指数Minority carrier 少数载流子Misfit 失配Mismatching 失配Mobile ions 可动离子Mobility 迁移率Module 模块Modulate 调制Molecular crystal分子晶体Monolithic IC 单片IC MOSFET金属氧化物半导体场效应晶体管Mos. Transistor(MOST )MOS. 晶体管Multiplication 倍增Modulator 调制Multi-chip IC 多芯片ICMulti-chip module(MCM) 多芯片模块Multiplication coefficient倍增因子Naked chip 未封装的芯片(裸片)Negative feedback 负反馈Negative resistance 负阻Nesting 套刻Negative-temperature-coefficient 负温度系数Noise margin 噪声容限Nonequilibrium 非平衡Nonrolatile 非挥发(易失)性Normally off/on 常闭/开Numerical analysis 数值分析Occupied band 满带Officienay 功率Offset 偏移、失调On standby 待命状态Ohmic contact 欧姆接触Open circuit 开路Operating point 工作点Operating bias 工作偏置Operational amplifier (OPAMP)运算放大器Optical photon =photon 光子Optical quenching光猝灭Optical transition 光跃迁Optical-coupled isolator光耦合隔离器Organic semiconductor有机半导体Orientation 晶向、定向Outline 外形Out-of-contact mask非接触式掩模Output characteristic 输出特性Output voltage swing 输出电压摆幅Overcompensation 过补偿Over-current protection 过流保护Over shoot 过冲Over-voltage protection 过压保护Overlap 交迭Overload 过载Oscillator 振荡器Oxide 氧化物Oxidation 氧化Oxide passivation 氧化层钝化Package 封装Pad 压焊点Parameter 参数Parasitic effect 寄生效应Parasitic oscillation 寄生振荡Passination 钝化Passive component 无源元件Passive device 无源器件Passive surface 钝化界面Parasitic transistor 寄生晶体管Peak-point voltage 峰点电压Peak voltage 峰值电压Permanent-storage circuit 永久存储电路Period 周期Periodic table 周期表Permeable - base 可渗透基区Phase-lock loop 锁相环Phase drift 相移Phonon spectra 声子谱Photo conduction 光电导Photo diode 光电二极管Photoelectric cell 光电池Photoelectric effect 光电效应Photoenic devices 光子器件Photolithographic process 光刻工艺(photo) resist (光敏)抗腐蚀剂Pin 管脚Pinch off 夹断Pinning of Fermi level 费米能级的钉扎(效应)Planar process 平面工艺Planar transistor 平面晶体管Plasma 等离子体Plezoelectric effect 压电效应Poisson equation 泊松方程Point contact 点接触Polarity 极性Polycrystal 多晶Polymer semiconductor聚合物半导体Poly-silicon 多晶硅Potential (电)势Potential barrier 势垒Potential well 势阱Power dissipation 功耗Power transistor 功率晶体管Preamplifier 前置放大器Primary flat 主平面Principal axes 主轴Print-circuit board(PCB) 印制电路板Probability 几率Probe 探针Process 工艺Propagation delay 传输延时Pseudopotential method 膺势发Punch through 穿通Pulse triggering/modulating 脉冲触发/调制PulseWiden Modulator(PWM) 脉冲宽度调制Punchthrough 穿通Push-pull stage 推挽级Quality factor 品质因子Quantization 量子化Quantum 量子Quantum efficiency量子效应Quantum mechanics 量子力学Quasi ? Fermi-level准费米能级Quartz 石英Radiation conductivity 辐射电导率Radiation damage 辐射损伤Radiation flux density 辐射通量密度Radiation hardening 辐射加固Radiation protection 辐射保护Radiative - recombination 辐照复合Radioactive 放射性Reach through 穿通Reactive sputtering source 反应溅射源Read diode 里德二极管Recombination 复合Recovery diode 恢复二极管Reciprocal lattice 倒核子Recovery time 恢复时间Rectifier 整流器(管)Rectifying contact 整流接触Reference 基准点基准参考点Refractive index 折射率Register 寄存器Registration 对准Regulate 控制调整Relaxation lifetime 驰豫时间Reliability 可靠性Resonance 谐振Resistance 电阻Resistor 电阻器Resistivity 电阻率Regulator 稳压管(器)Relaxation 驰豫Resonant frequency共射频率Response time 响应时间Reverse 反向的Reverse bias 反向偏置Sampling circuit 取样电路Sapphire 蓝宝石(Al2O3)Satellite valley 卫星谷Saturated current range电流饱和区Saturation region 饱和区Saturation 饱和的Scaled down 按比例缩小Scattering 散射Schockley diode 肖克莱二极管Schottky 肖特基Schottky barrier 肖特基势垒Schottky contact 肖特基接触Schrodingen 薛定厄Scribing grid 划片格Secondary flat 次平面Seed crystal 籽晶Segregation 分凝Selectivity 选择性Self aligned 自对准的Self diffusion 自扩散Semiconductor 半导体Semiconductor-controlled rectifier 可控硅Sendsitivity 灵敏度Serial 串行/串联Series inductance 串联电感Settle time 建立时间Sheet resistance 薄层电阻Shield 屏蔽Short circuit 短路Shot noise 散粒噪声Shunt 分流Sidewall capacitance 边墙电容Signal 信号Silica glass 石英玻璃Silicon 硅Silicon carbide 碳化硅Silicon dioxide (SiO2) 二氧化硅Silicon Nitride(Si3N4) 氮化硅Silicon On Insulator 绝缘硅Siliver whiskers 银须Simple cubic 简立方Single crystal 单晶Sink 沉Skin effect 趋肤效应Snap time 急变时间Sneak path 潜行通路Sulethreshold 亚阈的Solar battery/cell 太阳能电池Solid circuit 固体电路Solid Solubility 固溶度Sonband 子带Source 源极Source follower 源随器Space charge 空间电荷Specific heat(PT) 热Speed-power product 速度功耗乘积Spherical 球面的Spin 自旋Split 分裂Spontaneous emission 自发发射Spreading resistance扩展电阻Sputter 溅射Stacking fault 层错Static characteristic 静态特性Stimulated emission 受激发射Stimulated recombination 受激复合Storage time 存储时间Stress 应力Straggle 偏差Sublimation 升华Substrate 衬底Substitutional 替位式的Superlattice 超晶格Supply 电源Surface 表面Surge capacity 浪涌能力Subscript 下标Switching time 开关时间Switch 开关Tailing 扩展Terminal 终端Tensor 张量Tensorial 张量的Thermal activation 热激发Thermal conductivity 热导率Thermal equilibrium 热平衡Thermal Oxidation 热氧化Thermal resistance 热阻Thermal sink 热沉Thermal velocity 热运动Thermoelectricpovoer 温差电动势率Thick-film technique 厚膜技术Thin-film hybrid IC薄膜混合集成电路Thin-Film Transistor(TFT) 薄膜晶体Threshlod 阈值Thyistor 晶闸管Transconductance 跨导Transfer characteristic 转移特性Transfer electron 转移电子Transfer function 传输函数Transient 瞬态的Transistor aging(stress) 晶体管老化Transit time 渡越时间Transition 跃迁Transition-metal silica 过度金属硅化物Transition probability 跃迁几率Transition region 过渡区Transport 输运Transverse 横向的Trap 陷阱Trapping 俘获Trapped charge 陷阱电荷Triangle generator 三角波发生器Triboelectricity 摩擦电Trigger 触发Trim 调配调整Triple diffusion 三重扩散Truth table 真值表Tolerahce 容差Tunnel(ing) 隧道(穿)Tunnel current 隧道电流Turn over 转折Turn - off time 关断时间Ultraviolet 紫外的Unijunction 单结的Unipolar 单极的Unit cell 原(元)胞Unity-gain frequency 单位增益频率Unilateral-switch单向开关Vacancy 空位Vacuum 真空Valence(value) band 价带Value band edge 价带顶Valence bond 价键Vapour phase 汽相Varactor 变容管Varistor 变阻器Vibration 振动V oltage 电压Wafer 晶片Wave equation 波动方程Wave guide 波导Wave number 波数Wave-particle duality 波粒二相性Wear-out 烧毁Wire routing 布线Work function 功函数Worst-case device 最坏情况器件Yield 成品率Zener breakdown 齐纳击穿Zone melting 区熔法。
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a r X i v :c o n d -m a t /0311169v 1 [c o n d -m a t .m t r l -s c i ] 7 N o v 2003Band structure of boron doped carbon nanotubes Ludger Wirtz ∗and Angel Rubio ∗∗Department of Material Physics,University of the Basque Country,Centro Mixto CSIC-UPV ,and Donostia International Physics Center,Po.Manuel de Lardizabal 4,20018Donostia-San Sebastián,Spain Abstract.We present ab initio and self-consistent tight-binding calculations on the band structure of single wall semiconducting carbon nanotubes with high degrees (up to 25%)of boron substitu-tion.Besides a lowering of the Fermi energy into the valence band,a regular,periodic distribution of the p-dopants leads to the formation of a dispersive “acceptor”-like band in the band gap of the undoped tube.This comes from the superposition of acceptor levels at the boron atoms with the delocalized carbon π-orbitals.Irregular (random)boron-doping leads to a high concentration of hybrids of acceptor and unoccupied carbon states above the Fermi edge.INTRODUCTION The electronic properties of single wall carbon nanotubes depend sensitively on the diameter and the chirality of the tubes.Therefore,in order to use tubes as elements in nano-electronical devices,a controlled way to produce and separate a large quantity of tubes of specific radius and chirality has to be found.Alternatively,doping of tubes by boron and nitrogen [1]may lead to electronic properties that are more controlled by the chemistry (i.e.,the amount of doping)than the specific geometry of the tubes.Indeed,theoretical investigations of BCN nanotube heterojunctions have predicted that the characteristics of these junctions are largely independent of geometrical parameters [2].It has been predicted that even stochastic doping may lead to useful electronic elements such as chains of random quantum dots and nanoscale diodes in series [3].The realization of p-type doping of pure carbon nanotubes by a substitution reaction with boron atoms [4,5,6]offered the possibility to transform semiconducting tubes into metallic tubes by lowering the Fermi level into the valence band.Indeed,transport measurements [7,8,9]have shown a clearly enhanced conductivity of B-doped tubes.The metallic behavior of B-doped multiwall carbon nanotubes was also confirmed by scanning tunneling spectroscopy [10].In bulk semiconductors,typical doping concentrations of impurity atoms are around 10−3%.At such low concentration,the presence of group III atoms (e.g.,B)in a groupIV semiconductor leads to the formation of an acceptor state (non-dispersive band)in the band gap at low energy above the valence band edge [11].For B doping in a C(8,0)tube,Yi and Bernholc [12]have calculated (using a B/C ratio of 1/80)that this acceptor state is located at 0.16eV above the Fermi energy.However no discussion has been made up-to-date on the evolution of this acceptor-like level with the degree of B-doping.Since in recent experiments [6],Boron substitution up to 15%has been reported,we investigate in this paper the band structure of strongly B-doped single wall carbon nanotubes.display the corresponding unit cells(C atoms black,B atoms white).COMPUTATIONAL METHODIn order to demonstrate the effect of B doping on a semiconducting tube,we have chosen a(16,0)tube with a diameter of12.5Åwhich is close to the average radius of commonly produced SWNT samples.Since the distribution of borons in B-doped tubes is still unknown,we have performed two sets of calculations.1.)For regular periodic distributions that are commensurate with the unit-cell of the undoped tubes,we perform ab initio calculations[13]of electronic band structure and density of states(DOS).2.)In order to test the effect of disordered B doping,we employ a supercell comprising6unit-cells(384atoms)and distribute the boron atoms“randomly”with the only constraint that they cannot occupy nearest neighbor positions on the hexagonal carbon grid.For this large system,we use a self-consistent tight-binding(SCTB)method[3,15].RESULTSFig.1shows the band structure and DOS of a C(16,0)tube without doping and with various concentrations of B-doping in a periodic manner(see insets).For the undoped tube it can be noted,that the DOS is symmetric around the band gap for the1st and2nd Van-Hove singularities(VHSs).However,beyond this small energy regime around the band gap,asymmetries arise due to the mixing of p and s orbitals.Doping of the tubesFIGURE2.b)regular dopingleads to a lowering of the Fermi level into the valence band of the undoped tube.Clearly, the stronger the doping,the stronger is also the shift of the Fermi level.Above the highest occupied bands of the undoped tube new bands are formed.These bands correspond to the formation of an acceptor level in semiconductors with very low dopant concentration. Due to the strong concentration in the present case,the boron levels hybridize with the carbon levels and form strongly dispersive“acceptor-like bands”.The band structure of the valence band is strongly distorted upon doping,because the levels of carbon atoms that are substituted by boron move upwards in energy.In addition,the lowering of the symmetry by doping leads to many clear avoided crossings between states that perform a real crossing in the case of the undoped tube where they posses a different symmetry. Clearly,in all cases displayed in Fig.1,the doping with B leads to a metallic character of the tube.However,the density of states at the Fermi level strongly depends on the geometry of the structure and varies non-monotonously with the doping concentration. In fact,in BC3tubes with a different geometry than in Fig.1d),a gap betweenπ-type orbitals andσtype orbitals opens up at the Fermi level and renders the tubes semiconducting in this particular case[17].Fig.2compares the DOS of a C(16,0)tube with12.5%boron substitution in three different geometries.The two regular structures both display a pattern with the familiar pronounced Van Hove singularities of a1-dim.band structure.However,the different ordering of the boron atoms gives rise to a different hybridization of the bands and thereby to a pronounced difference in the peak structure of the DOS.The DOS at the Fermi level strongly depends on the ordering of the B atoms.In the DOS of the randomly doped tube,the pattern of the VHSs is mostly smeared out[18].Due to the missing translational geometry,the1-dim.band structure of the regularly doped tubes is transformed into the DOS of a0-dimensional structure,i.e.of a large molecule or cluster without periodicity.The states between the Fermi level and the original valence band edge of the undoped tubes are hybrids of acceptor levels and unoccupied carbon levels.The electronic excitations into these levels should explain the optical absorption spectra of B-doped carbon tubes[6]:In addition to the pronounced absorption peaks that are commonly affiliated with the transitions E ii(i=1,2)from thefirst/second occupied VHS to thefirst/second unoccupied VHS of the pure semiconducting carbon tubes,the spectra of B-doped tubes display additional absorption at energies lower than E11.CONCLUSIONThe calculations on the band structure of boron doped carbon nanotubes clearly confirm the expectation(and experimental observation)that these tubes are metallic with low resistance.For regularly doped structures,we have observed the formation of a disper-sive“acceptor”band while the Fermi level is shifted downwards into the valence band of the undoped tubes.Electronic excitations into these hybrids of acceptor states and unoccupied carbon levels are expected to play an important role in optical absorption spectra.Randomly doped tubes display the same downshift of the Fermi edge but cease to display strongly dispersive bands.We hope that in the near future,spatially resolved TEM/EELS will help to elucidate the exact geometry of the boron dopants and scanning tunneling spectroscopy will probe the exact density of states.Work supported by COMELCAN(contract number HPRN-CT-2000-00128).We ac-knowledge stimulating discussion with T.Pichler,J.Fink and G.G.Fuentes.REFERENCES1.O.Stéphan et al.,Science266,1683(1994);M.Terrones et al.,Chem.Phys.Lett.257(1996);Ph.Redlich et al.,Chem.Phys.Lett.260,465(1996);Y.Zhang et al.,Chem.Phys.Lett.279264(1997);R.Sen,indaraj,and C.N.R.Rao,Chem.Phys.Lett.287,671(1998);D.Golberg et al.,Chem.Phys.Lett.359,220(2002);D.Golberg et al.,Chem.Phys.Lett.360,1(2002);2.X.Blase,J.-C.Charlier,A.De Vita,and R.Car,Appl.Phys.Lett.70,197(1997).mmert,V.H.Crespi,and A.Rubio,Phys.Rev.Lett.87(2001).4.W.Han,Y.Bando,K.Kurashima,and T.Sato,Chem.Phys.Lett.299368(1999).5. 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B.Wei,R.Spolenak,P.Kohler-Redlich,M.Rühle,and E.Arzt,Appl.Phys.Lett.74,3149(1999).9.K.Liu,Ph.Avouris,R.Martel,and W.K.Hsu,Phys.Rev.B63,161404(2001).10.D.L.Carroll et al,Phys.Rev.Lett.81,2332(1998).11.see,e.g.,N.W.Ashcroft and N.D.Mermin,Solid State Physics,Saunders College Publishing,Orlando,1976.12.J.-Y.Yi and J.Bernholc,Phys.Rev.B47,1708(1993).13.The ab initio calculations have been performed with the code ABINIT,using density-functional the-ory(DFT)in the local density approximation(LDA).We use a plane wave expansion with an energy cutoff at50Ry.Core electrons are simulated by Troullier-Martins pseudopotentials.A supercell geom-etry is employed with a large inter-tube distance(10a.u.).The density is calculated self-consistently using a sampling of8k-points for the(quasi-one dimensional)first Brillouin zone of the tubes.A non-self consistent calculation yields the energies of occupied and unoccupied states on a grid of50 k-points.Since the tubes have large diameter,we have neglected the effect of local atomic distortion induced by doping which leads to a small outward movement of the boron atoms(<0.11Å[12]). 14.The ABINIT code is a common project of the UniversitéCatholique de Louvain,Corning Incorpo-rated,and other contributors(URL ).15.In the SCTB calculation(following Ref.[3])we use a non-orthogonal tight-binding basis with sand p valence orbitals,fitted to LDA calculations[16].The Coulomb potential generated by the charge density is self-consistently included as a shift in the on-site potentials.We have checked for the systems displayed in Fig.1that the SCTB yields results in very close agreement with the ab initio calculations.16.D.Porezag,Th.Frauenheim,Th.Köhler,G.Seifert,and R.Kaschner,Phys.Rev.B51,12947(1995).17.Y.Miyamoto,A.Rubio,S.G.Louie,and M.L.Cohen,Phys.Rev.B50,18360(1994).18.The system still possesses a translational symmetry even though with a large unit cell.Therefore,some of the dispersive band structure,including Van-Hove singularities,is still visible.。