KMS9412实现同步升压输出5V2A,输入5v2.1A移动电源单芯片方案
MP3402A SPEC V1_2
当VCC的输入电压超过3.0V并且大于电池电压时，充电模块开始对电池充电。如果电池电 压低于2.9V，充电模块用小电流对电池进行预充电。当电池电压超过2.9V时，充电器采用恒 流模式对电池充电。当电池电压接近4.2V时，充电电流逐渐减小，系统进入恒压充电模式。 当充电电流减小到充电结束阈值时，充电周期结束，完整的充电过程为涓流-恒流-恒压。
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1
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MHz
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1
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A
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2
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A
91
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%
DMAX IEND TOV THYS VRIPPLE TSHUT VSHORT IKEY
最大占空比 放电结束电流
过温保护 过温保护滞回 输出纹波电压 输出无负载关闭检测时间 短路保护电压 KEY引脚上拉电流
VOUT=5.0V&IOUT=1A
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85
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%
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20
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mA
的情况下实现充电速率最大化的热调节功能 C/10 充电终止，自动再充电 预设4.2V充电电压，精度达±1% 放电输出过流、短路、过压、过温保护 2颗LED电量显示、充放电指示及异常指示
典型应用电路（5V/1A）
Ver.1.2
移动电源单芯片解决方案 MP3402A
PCB LAYOUT注意事项（重点）：
JW9416 Datasheet 5V2A
其中: —PO_MAX
其中：PO_MAX 大工作频率由下式决定 4、电感计算 η为系统转换效率 本芯片开关频率会随工作模式和负载情况而改 LP 为原边电感 变。对于一个工作于 F 是系统最大输出功率 Ipk max为原边电感的峰值电流 大工作频率由下式决定 在确定好系统的工作频率
变。对于一个工作于 DCM 的 flyback
其中，Np 时变压器原边绕组匝数，Ns 为变压器输出绕组匝数，Ipeak 为原边电感的峰 值电流。
3、输出恒压控制原理
深圳市芯飞凌半导体有限公司
芯片通过采样辅助绕组平台电压， 经分压电阻分压 后与内部基准比较形成闭以 调整输出电压 Vo。
芯片通过采样辅助绕组平台电压， 经分压电阻分压 后与内部基准比较形成闭环， 以调整印标示
JW9416 JW9416
材料
Pb Free Pb Free
包装形式
料管/编带 料管
SOP7
DIP7
V1.0.8
共 12 页 第 2 页
JW9416
内部功能图 内部功能框图
VCC 1
UVLO
C 5,6
FB
2
OVP & OCKP
PRO
0.1V
COMP
Regulator & Bias
JA JC
表 2
V1.0.8
共 12 页 第 3 页
JW9416
电气极限参数
参数特性
工作电压 CS脚输入电压 反馈输入电压 工作温度范围 结温温度范围 存储温度范围 管脚到外壳温度 人体模式静电® (Tamb=25°C)
符号 VCC(Supply
Voltage)
范围 -0.3～20 -0.3～7 -0.3～7 -40 to +125 -40 to +150 -60 to +150 260 2000
S5802带限流 三合一5V 1 A输入输出
_______________________________________________________XySemi Inc - 1 - S5802-SIP of Power Bank Total Solution GENERAL DESCRIPTIONS5802 is one SIP that it integrates Li-Battery Charge management 、Li-BatteryProtection and Boost converter in only TSSOP16-PP package.This SIP can charge with 1A current and also can output 5V 1A to load such as smart phone or MID.It only need few components and can reduce the BOM area and BOM cost.FEATURESz Charger input voltage-4.5V to 6V z Charger current-MAX 1Az Boost converter-MAX 20V output z Boost converter-MAX 5V 1Az Boost converter Frequency-1.2MHz z Li Protection OCU-4.25V ODU-2.9V z Li Protection OCP-3A z Have UVLO 、OTP 、Short protection z TSSOP16-PP PackageAPPLICATIONS• Power bank for MID 、PAD •Power bank for Smart PhoneFigure 1. Typical Application Circuit1____________________________________________________________________________________________________ORDERING INFORMATIONPART NUMBER TEMP RANGE VIN OUTPUT VOLTAGE (V)CHARGE CURRENTPACKAGE PINS S5802-40°C to 85°C4.5~6VADJ1ATSSOP-PP 16PIN CONFIGURATIONFigure 2. PIN ConfigurationPIN DESCRIPTIONPIN NUMBER PIN NAME PIN DESCRIPTION1,2SWBoost Converter’s Switching pin3,12 B+Li-Battery’s Positive Pole ，pin 3 should be bypassed with a 1uF capacitor as close aspossible, Pin12 should be bypassed with a 10uF capacitor as close as possible 4 BSOCBoost Converter’s current limit setting pin ，For 5Vout 1A application ，you can select250K~300Kohm resistor to GND 5 BSEN Boost Converter’s Enable pin 6FBBoost Converter’s Feedback pin. it can set 5Vout with two resistors.7 CHRG Open-Drain Charge Status Output ， When the battery is charging, the CHRG pin ispulled low by an internal N-channel MOSFET. When the charge cycle is completed,CHRG pin will be in a high-impedance state. 8 CHEN Charge Enable Pin9PROG Charge Current Program, Charge Current Monitor and Shutdown Pin.10 CHSTD The completion of battery charging instructions side. When the battery charge iscomplete, CHSTD pulled low by internal switches, indicating the completion ofcharging. In addition, CHSTD pin will be in a high-impedance state. 11CHINPositive Input Supply Voltage, should be bypassed with at least a 10uF capacitor.S5802____________________________________________________________________________________________________13 VPBThe Power Supply of Li-Protection section ，Should connect 0.1uF capacitor betweenVpb and B- as close as possible and 100ohm resistor to B+ 14,15 B- Li-Battery’s Negative Pole 16,17GNDGround and EPADABSOLUTE MAXIMUM RATINGS(Note: Do not exceed these limits to prevent damage to the device. Exposure to absolute maximum rating conditions for long periods may affect device reliability.)PARAMETER VALUE UNITSupply Voltage VIN ；CHRG\CHEN\CHSTD Voltage -0.3 to 7 V FB Voltage ；Vpb Voltage ；B+\B-; BSEN pin; BSOC voltage -0.3 to 5 V SW Voltage Vin+0.3 to 15 V PROG Voltage-0.3~CHIN+0.3V Icharge 1.2 APROG Pin current1.2 mA Operating Ambient Temperature -40 to 85 °C Maximum Junction Temperature 150 °C Storage Temperature-55 to 150 °C Lead Temperature (Soldering, 10 sec)260°CELECTRICAL CHARACTERISTICS(V IN = 3.6V, T A = 25°C unless otherwise specified)PARAMETER SYMBOL TEST CONDITIONSMIN TYP MAX UNITInput Voltage Range CHIN 4.5 6.0V Regulated Charge Voltage Vfloat0°C ≤T A ≤85°C, Icharge = 40mA4.158 4.2 4.242V PROG pin Voltage Vprog R PROG =1k, Current mode0.93 1.0 1.07V R PROG =2k,Current mode450 500 550mA R PROG =1k,Current mode900 1000 1100mA Charge current Icharge Standby mode,Vbat=4.2V0 -2.5 -6 uA Trickle charge current Itrikl Vbat<Vtrikl,Rprog=1k 90100110mA Trickle charge Threshold VoltageVtriklR PROG =10K ，Vbat Rising2.8 2.93.0V Trickle voltage hysteresis voltageVtrhys R PROG =10K 6080110mV CHRG pin Output low voltageVchrg Ichrg =5mA 0.35 0.6V CHSTD pin Output low voltageVchstd Ichstd =5mA0.35 0.6VFUNCTIONAL DESCRIPTIONNORMAL OPERATIONS5802 integrates Li-Battery Charger 、Li-Battery Protection and Boost converter in only TSSOP16-PP packageAdapter inputs 5V voltage and charges the battery. After the battery is full, get off the adapter . And then we can boost up to 5V to charge the mobile advices when they is empty.Li-Battery Charger can set charge current by PROG resistor. Normal charging current is set from 0.5A to 1A. It will go into trickle charge mode to protect Li-Battery when BAT voltage is below 2.9V. Li-Battery Protection can detect the battery cell’s status such as Vcu 、Vcl ，Temp 、short-cut 、Over-current and take action to protect battery cell.Boost section can give us 5V 1A capacity to mobile devices.THERMAL OR SHORT-CUT PROTECTIONA thermal shutdown is implemented to prevent damages due to excessive heat and power dissipation. Typically the thermal shutdown threshold is 150℃ .When the thermal shutdown is triggered the device stops switching until the temperature falls below typically 136℃.Then the device starts switching again.If the Boost converter’s Vout is short to GND ，the IC will shut down and you should recharge the battery to get rid of this status.CHEN 、BSEN voltage Ven0.3 1 1.5VRecharge Battery threshold VoltageΔVrecg V FLOAT - V RECHRG 100 200mV Overcharge DetectionVoltage of Li BAT-Protection V CU 4.225 4.25 4.275V Overcharge Release Voltage of Li BAT-Protection V CL 4.075 4.10 4.125V Overdischarge DetectionVoltage of Li BAT-Protection V DL 2.85 2.9 2.95VOverdischarge ReleaseVoltage of Li BAT-Protection V DR2.953.0 3.05VOverdischarge Current1 Detection of Li BAT-ProtectionI IOV1 (V B+)-(V B -)=3.5V 2.1 3 3.9 ALoad Short-Circuiting Detection of Li BAT-ProtectionI SHORT (V B+)-(V B -)=3.5V 10 20 30 ABoost output voltage range Vout 20 VRegulated Feedback Voltage V FB1.118 1.2 1.212VPeak Inductor Current I PEAK Rset=150K Vin=3.3V Vout=5V 0.8 1 1.2 A Peak Inductor Current I PEAK Rset=500K Vin=3.3V Vout=5V2.2 2.55 2.9ABoost ConvertOscillator FrequencyF OSC0.9 1.2 1.5MHzAPPLICATION INFORMATIONINDUCTOR SELECTIONIn normal operation, the inductor maintains continuous current to the output. The inductor current has a ripple that is dependent on the inductance value. The high inductance reduces the ripple current.Selected inductor by actual application:Manufa cturer Part Number Inductance (uH) DRC max(Ohms)Dimensions L*W*H(mm3)2.2 0.0493.3 0.0654.7 0.08 LQH44PN10 0.164*4*1.7 2.2 0.0303.3 0.0444.7 0.058 MurataLQH5BP10 0.1065*5*2 2.2 0017 3.3 0.027 TDK SPM6530T4.7 0.0367.1*6.5*3 744373 240222.2 0.0614.4*4.05WURTH 744777004 4.70.0257.3*7.3*4.5Table 1. Recommend Surface Mount InductorsIf output voltage is 5V ，you can use 2.2uH~ 4.7uH, If output voltage is 12V, 4.7uH~ 10uH is OK ， Normal application: Input 3.3V (3.6V or 4.2V) to Output 5V 9V 12V ；Input 5V to Output 9V 12VCAPACITOR SELECTIONThe input capacitor reduces input voltage ripple to the converter, low ESR ceramic capacitor is highly recommended. For power bank application, A 10uF ceramic capacitor is used. The input capacitor should be placed as close as possible to CHIN and GND. Such as Murata GRM21BR60J106 or TDK C3216X5R1A106M A low ESR output capacitor is required in order to maintain low output voltage ripple. one 10~22uF ceramic output capacitor is suitable for most applications. Such as GRM21BR60J226 or TDK C3216X5R1A226M B+-Pin 3 should be bypassed with a 1uF capacitor as close as possible , B+-Pin12 should be bypassed with a 10uF capacitor as close as possible.SET CHARGE CURRENTThe charge current is programmed by connecting a 1% resistor, R PROG , PROG pin to ground. When charging in constant-current mode, this pin servos to 1V. In all modes, the voltage on this pin can be used to measure the charge current using the following formula: I charge = (V PROG /R PROG ) •1000.OUTPUT VOLTAGE PROGRAMMINGThe output voltage is set by a resistive divider according to the following equation:Typically choose R2=30K and determine R1 from the following equation:For example, you can select R2=31.5K R1=100K to set 5VoutDIODE SELECTIONAccording to max Iout and max Vout, you can select suitable diode. Normally we select diode If=(1.5~2)*Ioutmax and VR=(1.5~2)*Voutmax. For high efficiency，suggest that you select low Vf Schottky diode.For example, 5V 1Aout power bank application, you can select MBRA210LT3 or SS24. Using MBRA210LT3, you can get higher efficiency.OC SETTING( SETTING CURRENT LIMIT)S5802 can be adjusted SW current limit by one resistor connected with BSOC pin。
KMS9401-18.单芯片移动电源方案,三合一方案,移动电源5v1A 集成ic.
R3 P0R301
P0R302USNB0-UINSB0PI0NJK1101
P0C4P001C402
1R 1206
P0JK2102
P0JK3103
C4 10UF/0805
P0JK4104 P0JK5105
MICRO
P0R502 P0R501 P0UP1G0N6D P0U1G0N10D
GND GND
GND
2.0
3.0
RISET(KΩ)
充电电流(A) VS RISET(KΩ)
IISET(A)
Shenzhen kemeishun Electronic Co.,Ltd
6
KMS9401
移动电源单芯片解决方案
应用信息
一) 使用4颗LED显示电量
对 移 动 电 源 电 芯 进 行 充 电 工 作 时 ， 电 量 在0%～25%时 仅 第 一 颗LED“ 闪 烁 ” 工 作 ， 闪 烁 频 率 是 1/1.6s， 其 它 LED显 示 状 态 为 “ 灭 ” ； 电 量 在 25%～ 50%时 第 二 颗 LED“ 闪 烁 ” 工 作 ； 电 量 在 50%～ 7 5 %时 第 三 颗L E D“ 闪 烁 ” 工 作 ； 电 量 在7 5 %～1 0 0 %时 第 四 颗L E D“ 闪 烁 ” 工 作 ； 当 电 量 达 到1 0 0 %后 ， 第四颗LED的状态为“常亮”。以上情况其它三颗LED状态见下表。（附表一）
Shenzhen kemeishun Electronic Co.,Ltd
2
原理图应用
KMS9401
移动电源单芯片解决方案
GP0Q10G P0Q10D
P0R202 P0R201 P0R102 P0R101
移动电源2A手机充电芯片
Integrated Charger/Boost Convertor with Power Path ControlFeaturesAdaptor Input Detection and Power Path Control Built-in 90m Ω Power Switch for Power Path ControlAdapter Input Over-Voltage ProtectionHigh Accuracy Switching Charger for 1 Cell Li-lon battery with Internal Compensation±0.5% Accuracy Battery Charger Output Voltage Charger Status Flag OutputAdapter Input Current Limit Controller with Built-in Current Sense ResistorTrickle Charging and Defective Battery Detec-tionHigh Efficiency Synchronous Boost Convertor Adjustable Output of Boost ConvertorEnable and Current Limit Control Pin for Boost Convertor.Output Short Circuit Protection for Boost Con-vertorAvailable for 4.2V/4.3V/4.35V Charge Voltage SettingAvailable for 2A/1.5A Charge CurrentSOP-8 (FD) PackageApplicationsMobile Battery BankGeneral DescriptionG5214 is an integrated charger/boost convertor with power path control for 1 cell Li-lon battery bank. The power path controller detects adapter input and control internal power switch of power path with over-voltage and over-current protection.The system operates in charger mode when adapter plug in. Charge current, battery voltage and adapter input current limit are regulated by constant off time buck controller with internal power MOSFET. The sys-tem enters trickle charge if battery voltage is too low. The charging stops if defective battery is detected. Charge Voltage has 2 options, 4.35V and 4.2V. Charge Current has 2 options, 2A and 1.5A. FLAG output indicates the charger status.The system operates in boost mode if adapter is absent and battery voltage is high enough. The output voltage is adjustable by external resistors with over current and short circuit protection. A 3-levels logic control the on/off and over-current of boost convertor.Ordering InformationORDER NUMBERMARKINGCHARGE CurrentCHARGE Voltage TEMP. RANGE PACKAGE (Green)G5214AF11U G5214A 2A 4.35V -40°C to +85°C SOP-8 (FD) G5214CF11U G5214C 2A 4.2V -40°C to +85°C SOP-8 (FD) G5214DF11U G5214D 1.5A 4.35V -40°C to +85°C SOP-8(FD) G5214FF11U G5214F 1.5A4.2V -40°C to +85°C SOP-8 (FD)Note: F1:SOP-8 (FD) 1: Bonding CodeU: Tape & ReelPin ConfigurationVADPVSYS EN/OCLX CSIP SOP-8 (FD)VBAT FLAGBTFB Note: Connect the thermal PAD to GND for proper function and excellent power dissipationAbsolute Maximum RatingsSupply Voltage (ADP to GND) . . . . . . . . .-0.3V to 6.5V Supply Voltage (ADP to GND, <30µS pulse ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to 9V Supply Voltage (VSYS, VBAT to GND) . . . -0.3V to 6V CSIP to GND . . . . . . . . . . . . . . . . . . . . -0.3V to 6V LX to GND . . . . . . . . . . . . . . . . . . -0.5V to VSYS+0.5V Other Pins to GND. . . . . . . . . . . . . . . . . . . .-0.3V to 6V Thermal Resistance Junction to Ambient, (θJA )SOP-8 (FD) . . . . . . . . . . . . . . . . . . . . . . .132°C/W (1) SOP-8 (FD) (1in 2). . . . . . . . . . . . . . . . . . . . 108°C/W (2) Continuous Power Dissipation (T A = +25°C)SOP-8 (FD) . . . . . . . . . . . . . . . . . . . . . . .0.9W (1) SOP-8 (FD) (1in 2). . . . . . . . . . . . . . . . . . . . . . .1.2W (2) Thermal Resistance Junction to Case, (θJC )SOP-8 (FD) . . . . . . . . . . . . . . . . . . . . . . . . . . . 12°C/WStorage Temperature . . . . . . . . . . . . -65°C to +150°C Junction Temperature . . . . . . . . . . . . -10°C to +150°C Reflow Temperature (soldering, 10sec) . . . . . . .260°C ESD Protection (Human Body Mode) . . . . . . . . . . .2kVRecommended Operation ConditionsSupply Voltage (ADP to GND) . . . . . . . 4.8V to 5.5V Supply Voltage (VBAT to GND) . . . . . . .3V to 4.2V Operation Temperature (T A ) . . . . . . . -40°C to +85°CStress beyond those listed under “Absolute Maximum Ratings ” may cause permanent damage to the device.Note: (1): Please refer to Minimum Footprint PCB Layout Section. (2): Please refer to 1in 2 of 1oz PCB Layout Section.Electrical CharacteristicsADP =5V, V BAT =3.7V, T A =25°C, unless otherwise noted.The device is not guaranteed to function outside its operating conditions. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified.PARAMETER CONDITION MIN TYP MAX UNITSBattery Quiescent Current I VSYS =0 --- 500 700 µAVBAT=2.5V, Boost Convertor Stops --- 20 30 Battery Leakage CurrentVBAT=3.7V, Pull EN/OC low to shutdown--- 35 45 µAVBAT Rising2.62.752.9VBAT UVLO/ Trickle Charge ThresholdVBAT Falling 2.5 2.65 2.8VSwitch from VADP to VSYS --- 90 100m Ω Switch from VSYS to LX, V SYS =5V ---44 52 m Ω On-Resistance of Switches Switch from LX to GND, V SYS =5V --- 39 45 m Ω VSYS Short Circuit Blanking Time263443msVSYS Short Circuit Auto-Restart Time 177 238 300 msEN/OC input high threshold 4.5 --- ---EN/OC input low threshold --- --- 0.3 EN/OC Threshold EN/OC floating logic threshold 1.1 --- 3 V FLAG On Resistance ADP=5V---18 40 Ω FLAG Pin LeakageFLAG=6V--- 0.1 0.5 µA Thermal Shutdown Threshold Temperature Rising --- 150 --- °C Thermal Shutdown Hysteresis---25---°CAdapter Power Path Control ADP rising 4.65 4.74 4.83 V Adapter Power Good Threshold ADP falling 4.47 4.56 4.64 V ADP rising5.856.02 6.2 V Adapter OVP Threshold ADP falling 5.65 5.78 5.93 V G5214A/B/C, VSYS =0V 2.3 2.6 3.1Current Limit of Power SwitchG5214D/E/F, VSYS =0V1.82.1 2.6AElectrical Characteristics (continued)PARAMETER CONDITIONMINTYPMAX UNITSBOOST CONVERTORBTFB Output Voltage VBAT=3.0V~4.2V, I VSYS=0~2A 0.59 0.61 0.63VVSYS Short Current Limit VBAT>VSYS, R SNS=10mΩ, EN/OC floating 2.1 2.5 2.7 AReduction VSYS Short Current Limit VBAT>VSYS, R SNS=10mΩ, EN/OC input high 1.4 1.69 1.83 AVBAT=3.7V, EN/OC floating, R SNS=10mΩ 5.35 6.05 6.44VBAT=4.2V, EN/OC floating, R SNS=10mΩ 3.91 4.60 5.42Normal Inductor Peak Current LimitVBAT=3.0V, EN/OC floating, R SNS=10mΩ 5.42 6.40 7.49AVBAT=3.7V, EN/OC input high, R SNS=10mΩ 4.30 4.80 5.10VBAT=4.2V, EN/OC input high, R SNS=10mΩ 3.35 3.75 4.25Reduction Inductor Peak Current LimitVBAT=3.0V, EN/OC input high, R SNS=10mΩ 4.36 5.10 6.00AVBAT= 3.7V 1.2471.4341.649VBAT= 4.2V 1.421.6321.877Off-TimeVBAT=3V 1.0211.1641.339µsMinimum Off-Time --- 250 --- nsBoost Convertor OVP Threshold VSYS rising, reference to the normal boostoutput5 8 11 %Current Threshold of Asynchronous Converting R SNS=10mΩ100 150 300mASoft Start Time VBAT=3.7V, VSYS Rising to 4.8V --- 1 --- msBattery ChargerG5214C/F 4.1794.24.221Battery Charge Voltage AccuracyG5214A/D 4.328 4.35 4.372VG5214A/C, RSNS=10mΩ 1.83 2 2.17Charge Current AccuracyG5214D/F, RSNS=10mΩ 1.37 1.5 1.63AG5214A/C, RSNS=10mΩ110 250 350Trickle Charge Current AccuracyG5214D/F, RSNS=10mΩ80 200 300mAG5214A/C 1.822.3 Adapter Current Limit AccuracyG5214D/F 1.31.51.8AVSYS=5V, VBAT=3.7V 0.543 0.621 0.714VSYS=5V, VBAT=4.2V 0.329 0.379 0.436Off-TimeVSYS=5V, VBAT=2V 1.243 1.429 1.643µsMinimum Off-Time --- 250 --- nsDead Battery Detection Timeout Period 15415 17728 20387SVBAT rising, reference to the charge voltage 3.88 4 4.12Battery OVP ThresholdVBAT falling, reference to the charge voltage 2.43 2.5 2.58%Current Threshold of Asynchronous Converting R SNS=10mΩ-100 146 270mAMinimum Footprint PCB Layout SectionSOP-8 (FD)1in of 1oz PCB Layout SectionSOP-8 (FD)PIN NAMEPIN FUNCTION1 EN/OC Leave the pin floating set normal operating of boost convertor. Connect this pin to VBAT setthe current limit of boost convertor to 3/4 of normal value. Connect this pin to GND to shutdown the boost convertor.2 LX Connect the pin to output inductor.3 VSYS System output. Connect 33µFX2 capacitors to GND. 4VADPAC adapter input. Connect a capacitor to GND.5 FLAGCharger status indicator, open-drain output. The output is pulled low if the system is in charg-ing mode and battery is not fully charged. 6 BTFB Connect 2 resistors in series from VSYS to BTFB to GND to set the boost output votage 7 VBAT Battery input. Connect 20µF capacitors to GND. 8CSIPCurrent detection input.9 GND GroundBlock DiagramFunction DescriptionG5214 detects the plug-in of adapter, turns on power switch and decides boost/charging mode of the sys-tem automatically. If adapter is absent and battery voltage is high enough, the power switch is turned off and G5214 is in boost mode, the boost converter out-puts to system output source from battery. The power switch is turned on after adapter is plugged-in and detected. G5214 turns into charger mode after the power switch is fully turned on. In charger mode, sys-tem output is directly supply from adapter via the power switch, and the charger convertor supply charging current to the battery from system output. There are several protections of power path, boost convertor and charger convertor.Power Path ControlAdapter is detected if VADP is larger than power good threshold (4.74V with hysteresis) and smaller than OVP threshold (5.78V with hysteresis). After the de-tection of adapter, the power switch between VSYS and VADP turns on. The gate of NMOS switch rises slowly to minimize surge current of adapter. There is over-current protection for the power switch. If over-load occurs on VSYS, the switch gate is lowered down to keep the current flow through the switch in current limit to protect adapter and the switch.When adapter input OVP is detected, the power switch is shutdown immediately to keep VSYS below normal voltage range to protect the devices connected to VSYS from damaged by high voltage.After the gate of power switch rises high enough and no abnormal event is detected. The system gets into charger mode. If system isn’t in charger mode and the battery voltage is higher than VBAT UVLO threshold, the system operates in boost mode, otherwise the system is shutdown.Boost ConvertorIn boost mode, VSYS is boosted to the voltage setting by external resistors connected from VSYS to BTFB to GND. The BTFB pin is regulated to 0.61V. The con-troller of boost is constant off-time and the off-time is calculated by VSYS and VBAT to keep the switching frequency near 500kHz. Internal soft-start controls the rising time of VSYS output to about 1ms. There is OVP function of boost output.Boost convertor has current limit functions. If VSYS is lower than VBAT, the inductor current is limited to 2.5A. If VSYS is larger than VBAT, G5214 performs cycle by cycle peak inductor current limit. The current limit value is inversely proportion to VBAT, that makes output current limit changes slightly versus battery voltage.EN/OC pin controls the operation of boost convertor. The current limit is set to 3/4 of normal value when EN/OC is connected to VBAT. The boost convertor is shut down if EN/OC pin is pulled to GND. Leave the pin floating for normal operation.Charger ConvertorIn charger mode, adapter is connected to VSYS as the power of charger for 1 cell Li-lon battery. The system controls the battery voltage to 4.35V, 4.3V or 4.2V for G5214A/G5214D and G5214CG5214F, respectively. The charging current is lower down if adapter current is larger than a preset level. The current limit of total adapter current is 2A or 1.5A and current is sensed by internal resistor. The controller is constant off-time and the off-time is calculated by VSYS and VBAT to keep the switching frequency near 700kHz. The charger convertor is internal compensated.If battery voltage is below the UVLO threshold, the system is trickle charged with 15% of the normal charging current. The battery is determined as dead battery if battery voltage keeps under the UVLO threshold for over 17728S.G5214 has over-voltage protection for charger. The high and low side switched are turned off immediately if battery voltage goes over 4% of normal battery volt-age setting.The charge current is 2A or 1.5A. The adapter current is also limited to 2A or 1.5A. The current limits of power switch is 2.6A or 2.1A.Over-Current ProtectionsThe over-current protection of VSYS pin is auto-restart mode. If any of VSYS OCP event occurs (OCP of power switch or boost convertor) and lasting over 34ms, the system shutdown for 238ms and re-start again. The function keep the system temperature low even if VSYS is short. G5214 also have over-temperature protection. The whole system is shutdown if temperature rises over 150°C.Charger Status FlagWhen G5214 operates in charging mode, FLAG out-puts low if the battery is not fully charged. The FLAG pin outputs high impedance if system is not in charg-ing or the battery is fully charged.Application InformationInductor SelectionInductance between 3.3µH and 10µH is recommended. The RHZ is lower with large inductance. Select smaller inductance with larger VSYS capacitance to enlarge system bandwidth with the same output ripples at boost mode. It’s important to select inductor with maximum current to avoid saturation. Check both charger mode and boost mode for peak current.VSYS Capacitor SelectionThe recommended value of this capacitors is 33µFX2. This value maintain the boost controller loop at proper bandwidth with sufficient phase margin.VBAT Capacitor SelectionConnect 20µF capacitor to maintain charger loop sta-bility and serve as input capacitor at boost mode. Current Sense Resistor SelectionThe charging current and current limit at boost mode are inverse proportion to R SNS. Select 10mΩR SNS for proper current setting. To maintain stability of charger loop, 10mΩ or larger R SNS is recommanded.PCB Layout ConsiderationsSignal Ground and Power Ground ConnectionAt minimum, a reasonably large area of copper, which will shield other noise couplings through the IC, should be used as signal ground beneath the IC. The best tie-point between the signal ground and the power ground is at the negative side of the output capacitor on each side, where there is little noise; a noisy trace beneath the IC is not recommended.LX PinThis trace should be short, and positioned away from other weak signal traces. This node is noisy and has high voltage swing. No trace should be in parallel with it.CSIP, VBAT PinsThese pins is used as the battery voltage and inductor current feedback. The traces should be away from the noisy pins like LX. In general, the current sense resis-tor R SNS should be close to the IC.Copper Size for the LX NodeThe capacitance of LX should be kept very low to minimize ringing. It would be best to limit the size of the LX node copper.Exposed PADIt’s highly recommended to add larger copper to ex-posed PAD connected to signal ground. At high cur-rent operation, the power consumption is high. Large copper to exposed PAD decrease thermal resistance much.Package InformationSOP- 8 (FD) PackageTaping SpecificationPACKAGE Q ’TY/REELSOP-8 (FD)2,500 eaGMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.。
IP5306 v1.01 深圳市崇文科技有限公司
V1.01
10 / 10
根据照明灯亮度， 可接
位置
备注
0603 20R 5% 0603 10K 5% 0805 10uF 10% 0805 22uF 10% 0603 5mm SPM70701R0 10mm 短体卷口 Micro USB 母座 5 脚全贴 6.5mm*5.1mm 2*100mm 红 黑
R2 R1 C1、C2、C6、C7 C3、C4、C5 D1、D2、D3、D4 D5
状态 充电 放电 低电 充电过程 充满 D1 闪烁 亮 灭 灭 D2 灭 灭 亮 闪烁
D4 无 100%
1 灯模式
状态 充电 放电 充电过程 充饱 正常放电 低电 D1 闪烁 亮 亮 闪烁
V1.01
6 / 10
深圳市崇文科技有限公司
10 典型应用原理图
IP5306 只需要电感、电容、电阻， 即可实现完整功能的移动电源方案。
封装 兼容
充电 1.2A 1.2A 2.1A 1.5A 1.0A 2.0A 1.2A 1.2A 2.1A 2.1A 2.1A 4.8A 4.8A
1.0A 1.0A 2.4A
2A(Max) 2.0A
eSOP8 eSOP8 eSOP8 eSOP16 eSOP16 eSOP16 QFN24
PIN2PIN PIN2PIN PIN2PIN PIN2PIN
2 1 1 2
电感推荐型号 SPM70701R0
Inductance (uH) DC Resistance Tolerance Typ. (mΩ) Max. 8 Heat Rating Current DC Amp. Idc(A)Max. 12 Saturation Current DC Amps. Isat(A)Max. 15 Measuring Condition
XPT9410用户手册-矽普特
关断控制
为了提高效率，降低功耗，XPT9410设计特别加入了关断控制功能（SHDN）。当控制脚输入为低电平时， XPT9410就会关断内部的部份工作电流，如果把该管脚直接拉到GND时，XPT9410就会处于最小供电流模式。 该功能不用时，可将该管脚悬空或拉高。默认为工作模式。
MUTE 控制
XPT9410设有Mute脚静音功能，该管脚是用来对XPT9410的输出进行控制的管脚，该脚处于低电平时关断 输出，高电平时允许输出。可通过该管脚瞬间关断XPT9410的声音，达到静音功能，其静态电流参数参照上面 的电器性能表格。该功能不用时，可将该管脚悬空或拉高。默认为工作模式。
XPT9410 电气特性表 2 参数 Imute ISD Rdson fsw Vos VIH VIL VIH VIL OTP OTH 开关频率 输出偏置电压 启动输入电压（高电平） 启动输入电压（低电平） MUTE 输入电压（高电平） MUTE 输入电压（低电平） 过热保护 过温迟滞 描述 静音模式电流 关断电流 条件 VDD=5.0V VDD=2.0V to 5.5V IDS =500mA,Vgs=5V VDD=3V to 5V Vin=0V, VDD=5V VDD=5.0V VDD=5.0V VDD=5.0V VDD=5.0V 无负载，节点温度 VDD=5V 1.5 1.5 最小值 典型值 VMUTE 3.5 Vsd=0.3V PMOS NMOS <1 180 140 300 （300） 10 1.4 0.7 1.4 0.7 140 30 °C 0.4 V 0.4 V kHz mV 最大值 单位 mA μA mΩ
推荐工作条件
推荐工作条件表 参数 描述 最小值 最大值 单位
第 5 页 共 15 页
深圳市矽普特科技有限公司 立体声 AB/D 类模式切换、2X5W 音频功放
至为芯科技三合一移动电源芯片W332
W332支持双向PD3.0快充等多种协议的移动电源SOC特性•同时支持多个USB口✧1个USB A口输出✧1个USB B口输入✧1个USB C口输入/输出•快充规格✧任意一个口都支持快充✧集成QC2.0/QC3.0输出快充协议✧集成FCP输入/输出快充协议✧集成AFC输入/输出快充协议✧集成SFCP输出快充协议✧集成MTK PE+ 1.1&2.0输出快充协议✧集成USB C DRP协议，支持输入输出快充✧兼容BC1.2、苹果、三星手机快充•集成USB Power Delivery（PD2.0/PD3.0）协议✧支持PD2.0双向输入/输出协议✧支持PD3.0输入/输出✧支持5V，9V，12V电压档位输入✧支持5V，9V，12V电压档位输出✧集成硬件的双向标记编解码（BMC）协议✧集成物理层协议（PHY）✧集成硬件CRC✧支持Hard Reset•充电规格✧电池端充电电流最高可达5.0A✧自适应充电电流调节✧支持4.20V、4.35V、4.40V、4.50V电池•放电规格✧输出电流能力：5V：3.1A 9V：2.0A 12V：1.5A✧同步开关放电5V 2A效率达95%以上✧支持线补•电量显示✧内置14bit ADC和电量计✧支持1 / 2 / 3 / 4颗LED电量显示✧智能识别LED电量显示灯数目✧可调整电池电量曲线，显示灯更均匀•其他功能✧自动检测手机插入和拔出✧快充状态指示✧智能识别负载，轻负载自动进待机✧支持按键✧内置照明灯驱动•多重保护、高可靠性✧输入过压、欠压保护✧输出过流、过压、短路保护✧电池过充、过放、过流保护✧IC过温保护✧充放电电池温度NTC保护✧ESD 4KV，输入（含CC引脚）耐压25V •BOM极简✧内置开关功率MOS✧单电感实现充电、放电功能•深度定制✧I2C接口，可灵活、低成本定制方案•封装规格：5 mm ×5mm 0.5pitch QFN32概述W332是一款集成QC2.0 / QC3.0输出快充协议、FCP/AFC输入输出快充协议、SFCP输出快充协议、MTK PE+ 1.1&2.0输出快充协议、USB C/PD2.0/PD3.0输入输出协议、USB C PD3.0 输出协议、兼容BC1.2/苹果/三星手机、同步升/降压转换器、锂电池充电管理、电池电量指示等多功能的电源管理SOC，为快充移动电源提供完整的电源解决方案。
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USB
GND JK1 1 2 3 4 5
KMS9412
P0KMS9412015 SWT N0VIN 5V R1 Vin 5V P0C201 P0R101 P0R102 P0KMS941206
SW
P0SW01 P0SW02
P0JK101 P0JK102 P0JK103 P0JK104 P0JK105
VDD
极限参数
参数 所以引脚安全电压 存储环境温度 工作温度范围 HBM MM 额定值 -3 ~ +6.5 -50 ~ +150 -40 ~ +150 2000 200 单位 V ℃ ℃ V V
推荐的工作参数范围
名称 VDD Top 参数 输入工作电压 工作的环境稳定 参数范围 4.5~5.5 -20~85 单位 V ℃
特点；
>>输出：5v2A &VIN=3.7V 效率 90% ;5v1A &VIN=3.7V 效率 93% >>放电指示灯：充电指示灯（支持单、双 led 指示模式） >>锂电池放电关断电压 2.9v >>锂电池充满电压 4.2v ±0.15v >>集成充电和放电管理 >>智能温度控制 >>4 个 led 电量指示 >>led 手电筒电流 100mA >>输出短路、过压、过载、过充、过放保护 >>涓流模式、零电压启动充电模式 >>静态功耗：20uA >>支持各类手机移动数码产品充电
Ver1.8
Shenzhen kemeishun Electronic
Co.,Ltd
3
KMS9412
应用说明
恒温充电模式: KMS9412 内部集成了温度反馈环路，充电时，如果芯片内部的温度升高到 110℃，充电电流 会随着芯片的温度升高而降低，从而减小系统功耗，降低温升，当温度升高到 130℃时，充 电电流小为零， 由于温度反馈控制，IC 工作温度最终会稳定在 110℃～130℃之间的某个值。 充电电流设定: 充电电流可以通过设定 ISET 引脚的电阻来设定， 最大可设定充电电流为 1.2A，电流设定 关系如下式:
应用原理图
BAT+
P0KMS941207 P0C501 P0C401
BAT
P0KMS9412014 OUTP P0C302 P0C301
N0VOUT 5V Vout 5V
JK2 1 D-P0JK202 2 N0D+ D+ P0JK2033
P0JK201 N0D0 P0JK204
L1
P0L101 P0L102 P0KMS941201
AGND PGND PGND
P0KMS9412010 LED2
50% P0LED202
10UF GND
P0KMS941204
P0KMS941203
Hale Waihona Puke P0KMS941205R3 1k ESOP16
P0KMS9412011 LED1
25% P0LED102
GND
N04¸öLEDµçÁ¿Ö¸Ê¾µÆ¡£ 4个led 电量指示灯。
IC 型号 充电 电池电压（v） VBAT＜3.6 3.6≤VBAT＜3.75 KMS9412 3.75≤VBAT＜3.9 3.9≤VBAT＜4.2 4.2≤ VBAT Led1 闪烁 亮 亮 亮 亮 Led2 灭 闪烁 亮 亮 亮 Led3 灭 灭 闪烁 亮 亮 Led4 灭 灭 灭 闪烁 亮 放电 电池电压（v） VBAT＜2.9 2.9≤VBAT＜3.05 3.05≤VBAT＜3.5 3.5≤VBAT＜3.65 3.65≤VBAT＜3.8 3.8≤VBAT Led1 灭 快闪 亮 亮 亮 亮 Led2 灭 灭 灭 亮 亮 亮 Led3 灭 灭 灭 灭 亮 亮 Led4 灭 灭 灭 灭 灭 亮
KMS9412
概述
KMS9412 是一款专为移动电源设计同步升压单芯片解决方案,内部集成了线性充电管理模 块、 同步放电管理模块、电量检测与 LED 指示模块、保护模块。 KMS9412 内置充电与放电功率 MOS，充电电流可以设定，最大充电电流为 1.2A，支持外 。 MOS实现2.1A充电。同步升 压最大输出为 2.1A KMS9412 内部集成了温度补偿、过温保护、过充与过放保护、输出过压保护、输出重载保 护、输出短路保护等多重安全保护功能以保证芯片和锂离子电池的安全,应用电路简单,只需 很少元件便可实现充电管理与放电管理。
电气参数
符号 VDD VBAT △ VRECHRG VISET IBAT ITRK VTRK VTRK_HYS TST TZERO VUV_BAT VWN_BAT VBAT_END ISD_BAT VOUT TSD THYS VLIT ILEDx FLEDx_C FLED1_WN RON_CHRG RON_NMOS RON_PMOS FOSC 参数 充电输入电压 预设充电电压 再充电阈值电压 ISET 电压 BAT 恒流充电电流 BAT 涓流充电电流 涓流充电阈值电压 涓流充电滞回电压 温度补偿阈值 零电流温度 BAT 欠压锁定阈值电压 BAT 低压报警电压 BAT 放电终止电压 BAT 待机电流 升压输出电压 过温保护阈值 过温保护滞回 LIT 低电平电压 LED1～LED4 驱动电流 LEDx 充电闪烁频率 LED1 低电闪烁频率 充电 PMOS 导通电阻 放电 NMOS 导通电阻 放电 PMOS 导通电阻 升压电路工作频率 400 ILIT=100mA BAT=3.7V VBAT=3.7V ILOAD=1A,VB AT=3.7V 温度上升 4.8 130 VBAT 上升 VBAT 下降 2.8 4.2V 规格 4.35V 规格 VBAT-VRECH RG RISET=1KΩ RISET=1KΩ, 恒流充电模式 RISET=1KΩ, 恒流充电模式 SET=1K Ω,VBAT 上升 RISET=1KΩ 0.90 900 1 1000 100 2.96 100 110 140 3.15 3.05 2.9 16 5.0 140 20 0.6 3 1 2 300 40 40 500 600 3.0 30 5.2 150 1.1 1100 测试条件 最小值 4.3 4.15 4.3 典型值 5 4.2 4.35 最大值 5.5 4.25 4.4 单位 V V V mV V mA mA V mV ℃ ℃ V V V uA V ℃ ℃ V mA Hz Hz mΩ mΩ mΩ KHz
Ver1.8
Shenzhen kemeishun Electronic
Co.,Ltd
4
KMS9412
过温保护: 在充电或者放电时，如果芯片温度升高到 140℃，则芯片停止工作以保护芯片以及锂离子电 池,等到温度降低到 120℃后再自动恢复工作。 保护功能 : KMS9412 集成了过充保护、过放保护、充电温度补偿、过温保护、输出过压保护、输出重载 保护、输出短路保护等多重保护机制，也可以额外再加一颗 DW01 对系统进行双重保护。 元件选择: 1、输出电容 C3\C4\C5 选择质量较好的低 ESR 的贴片电容,否则会影响输出纹波； 2、电感 L1 的饱和电流需大于 5A，否则因电感饱和可能会导致芯片工作不正常； 3、电阻 R2 对封装尺寸无要求，但是 R2 不能省略； （RC 滤波 ) 4、电阻 R1 为可选，R1 主要是减小充电时芯片所承受的功耗降低芯片温度，这里需要根据 R1 的实际功耗选择封装尺寸； PCB 设计参考: 1、5V 输出端的 USB 外壳不能接 GND，需浮空； 2、IC 下面敷铜散热，散热面积尽量大且散热的地方留一些通孔增强散热； 3、AGND、PGND 直接打到 IC 下面的散热敷铜上； 4、BAT 与地的电容 C1 靠近 IC 的 BAT 和 GND 管脚，BAT+和 BAT-需先经过 BAT 电容再到 IC， 各 GND 走线要尽量粗，空余的地方全部走 GND； 5、应用电路中，电源回路走线要短且粗，尽量不要过过孔。 工作状态与电量指示 : LED1～LED4 为充放电状态与电量指示引脚，须串联 LED 到 GND；不同状况时 LED 状态如下： ①接入 VDD 时，LED1 到 LED4 会依次全部点亮，然后再根据电池电量指示充电状态，达到电 量的 LED 常量，当前电量 的 LED 以 1Hz 频率闪烁，充满电后 LED1～LED4 全亮； ②待机状态下，若按下按键 SW ，显示电量 16S 后关闭； ③放电时，LED1～LED4 根据电池电压指示当前电量，若电池电压低于 3.05V，LED1 会以 2HZ 的频率快闪提示电量低， 直到电池电压低于 2.9V，关闭电路，进入低功耗低压保护模式，需要重新充电至 3.2V 以上 才可以再次放电； ④长按 SW 键 1.5S，手电筒打开，再次长按 SW 键 1.5S 手电筒输出关闭。 LED1～LED4 工作状态
P0KMS941208 LED4
1206/0.4R
R2 1.5R
LED4 P0LED401 LED3 P0LED301 LED2 P0LED201 LED1
P0LED101
100%
P0LED402
P0KMS941209 LED3
75% P0LED302
C2 MCROUSB
P0R202
16 P0KMS9412016 ISET
P0C502
2.2UH D1
P0C101 P0LEDÊÖµçͲ01 P0LEDÊÖµçͲ02
SW P0KMS9412012 LIT
P0KMS941202 P0KMS9412013 OUTN
C3 10UF GND GND
P0C102
C1 10UF
LED
P0C402
SW
C5 22UF
C4 22UF
4
I CHRG 1000
1V RISET
充电模式: 如果充电之前锂离子电池电压低于 2.9V，为了保护电池，KMS9412 工作在涓流充电模式，此 时充电电流为正常设定电流的 1/7；当电池电压达到 2.9V 以后， KMS9412 进入恒流充电模 式，以设定的电流给电池充电；当电池电压达到 4.2V 后， KMS9412 工作在恒压充电模式， 此时输出电压恒定，充电电流逐渐减小，当充电电流减小为正常设定电流的 1/7 时，充电过 程结束，充电电流降为零。 负载检测与低功耗智能待机 : 负载插入时 KMS9412 可以自动检测到负载并开启升压电路工作。当负载拔掉，经过 16S 延 时，升压电路关闭，IC 进入低电流待机模式，待机电流减小到 10uA 以下。 放电指示 : 放电时，LED1～LED4 根据电池电压指示当前电量，当电池电压低于 3.05V 时，LED1 会以 2HZ 频率快闪进行低电提示。 手电照明输出: LIT 端可以驱动 LED 灯用于手电筒照明,最大驱动电流为 100mA , 可以给 LED 串联电阻 来减小指示手电灯的电流，SWT 是手电照明使能端,如果长按 S1 键 1.5S,手电筒打开，再 次长按 SW 键 1.5S 手电筒输出关闭。 电池低压保护: 启动时，当 BAT 电压大于 3.2V 时,升压电路开始工作，工作过程中如果电池电压低于 3.05V，则 LED1 会以 2HZ 频率快闪提醒电量较低，当电池电压低于 2.9V，则放电输出关闭， KMS9412 进入低电流待机模式，待机电流小于 10uA。