DISH薪款高清专用机211t
1150 型号说明书
Thermo Fisher Scientific Air Quality Instruments 27 Forge Parkway Franklin, MA 02038 1-508-520-0430 /aqi
WEEE iance
This product is required to comply with the European Union’s Waste Electrical & Electronic Equipment (WEEE) Directive 2002/96/EC. It is marked with the following symbol:
NCP551SN27T1G、NCP551SN28T1G和NCV551SN36T1G：电路板组件工业有
NCP551SN27T1G NCP551SN28T1G NCV551SN36T1GNCP551, NCV551Voltage Regulator - CMOS,Low Iq, Low-Dropout150 mAThe NCP551 series of fixed output low dropout linear regulators are designed for handheld communication equipment and portable battery powered applications which require low quiescent. The NCP551series features an ultra −low quiescent current of 4.0 m A. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, resistors for setting output voltage, current limit, and temperature limit protection circuits.The NCP551 has been designed to be used with low cost ceramic capacitors and requires a minimum output capacitor of 0.1 m F. The device is housed in the TSOP −5 surface mount package. Standard voltage versions are 1.4, 1.5, 1.8, 2.5, 2.7, 2.8, 2.9, 3.0, 3.1, 3.2, 3.3,3.6, 3.8 and 5.0 V . Other voltages are available in 100 mV steps.Features•Low Quiescent Current of 4.0 m A Typical •Maximum Operating V oltage of 12 V •Low Output V oltage Option•High Accuracy Output V oltage of 2.0%•Industrial Temperature Range of −40°C to 85°C (NCV551, T A = −40°C to +125°C)•NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC −Q100Qualified and PPAP Capable•These Devices are Pb −Free and are RoHS CompliantTypical Applications•Battery Powered Instruments •Hand −Held Instruments •Camcorders and CamerasFigure 1. Representative Block DiagramV inV outEnable OFFON See detailed ordering and shipping information in the package dimensions section on page 11 of this data sheet.ORDERING INFORMATIONTSOP −5(SOT23−5, SC59−5)SN SUFFIX CASE 483PIN CONNECTIONS AND MARKING DIAGRAM13N/CVin 2GND Enable4V out5(Top View)xxxAYW G G xxx = Specific Device Code A = Assembly Location Y = YearW = Work Week G = Pb −Free Package(Note: Microdot may be in either location)PIN FUNCTION DESCRIPTIONPin No.Pin Name Description1V in Positive power supply input voltage.2GND Power supply ground.3Enable This input is used to place the device into low−power standby. When this input is pulled low, thedevice is disabled. If this function is not used, Enable should be connected to V in.4N/C No Internal Connection.5V out Regulated output voltage.MAXIMUM RATINGSRating Symbol Value Unit Input Voltage V in0 to 12V Enable Voltage V EN−0.3 to V in+0.3V Output Voltage V out−0.3 to V in+0.3V Power Dissipation P D Internally Limited W Operating Junction Temperature T J+150°COperating Ambient Temperature NCP551NCV551T A−40 to +85−40 to +125°CStorage Temperature T stg−55 to +150°C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionalityshould not be assumed, damage may occur and reliability may be affected.1.This device series contains ESD protection and exceeds the following tests:Human Body Model 2000 V per MIL−STD−883, Method 3015Machine Model Method 200 VCharge Device Model (CDM) tested C3B per EIA/JESD22−C101.tchup capability (85°C) "100 mA DC with trigger voltage.THERMAL CHARACTERISTICSRating Symbol Test Conditions Typical Value Unit Junction−to−Ambient R q JA 1 oz Copper Thickness, 100 mm2250°C/W PSIJ−Lead 2Y J−L2 1 oz Copper Thickness, 100 mm268°C/W NOTE:Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the following boundary conditions as stated in EIA/JESD 51−1, 2, 3, 7, 12.ELECTRICAL CHARACTERISTICS(V in = V out(nom.) + 1.0 V, V EN = V in, C in = 1.0 m F, C out = 1.0 m F, T A = 25°C, unless otherwise noted.)Characteristic Symbol Min Typ Max UnitOutput Voltage (T A = 25°C, I out = 10 mA) 1.4 V1.5 V1.8 V2.5 V2.7 V2.8 V2.9 V3.0 V3.1 V3.2 V3.3 V3.6 V3.8 V5.0 V V out1.3581.4551.7462.4252.6462.7442.8422.9403.0383.1363.2343.5283.7244.901.41.51.82.52.72.82.93.03.13.23.33.63.85.01.4421.5451.8542.5752.7542.8562.9583.0603.1623.2643.3663.6723.8765.10VOutput Voltage (T A = T low to T high, I out = 10 mA) 1.4 V1.5 V1.8 V2.5 V2.7 V2.8 V2.9 V3.0 V3.1 V3.2 V3.3 V3.6 V3.8 V5.0 V V out1.3441.4401.7282.4002.6192.7162.8132.9103.0073.1043.2013.4923.6864.8501.41.51.82.52.72.82.93.03.13.23.33.63.85.01.4561.5601.8722.6002.7812.8842.9873.0903.1933.2963.3993.7083.9145.150VLine Regulation (V in = V out + 1.0 V to 12 V, I out = 10 mA)Reg line−1030mV Load Regulation (I out = 10 mA to 150 mA, V in = V out + 2.0 V)Reg load−4065mVOutput Current (V out = (V out at I out = 100 mA) −3%)1.4 V−2.0 V (V in = 4.0 V)2.1 V−3.0 V (V in = 5.0 V)3.1 V−4.0 V (V in = 6.0 V)4.1 V−5.0 V (V in = 8.0 V)I o(nom.)150150150150−−−−−−−−mADropout Voltage (I out = 10 mA, Measured at V out−3.0%)1.4 V1.5 V, 1.8 V,2.5 V2.7 V, 2.8 V, 2.9 V,3.0 V, 3.1 V, 3.2 V, 3.3 V, 3.6 V, 3.8 V, 5.0 V V in−V out−−−17013040250220150mVQuiescent Current(Enable Input = 0 V)(Enable Input = V in, I out = 1.0 mA to I o(nom.))1.4 V−2.0 V options, V in = 4.0 V2.1 V−3.0 V options, V in = 5.0 V3.1 V−4.0 V options, V in = 6.0 V4.1 V−5.0 V options, V in = 8.0 V I Q−−0.14.01.08.0m AOutput Voltage Temperature Coefficient T c−"100−ppm/°CEnable Input Threshold Voltage(Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low)V th(en)1.3−−−−0.3VELECTRICAL CHARACTERISTICS (continued)(V in = V out(nom.) + 1.0 V, V EN = V in , C in = 1.0 m F, C out = 1.0 m F, T A = 25°C, unless otherwise noted.)Output Short Circuit Current (V out = 0 V)1.4 V −2.0 V (V in = 4.0 V)2.1 V −3.0 V (V in = 5.0 V)3.1 V −4.0 V (V in = 6.0 V)4.1 V −5.0 V (V in = 8.0 V)I out(max)160160160160350350350350600600600600mA3.Maximum package power dissipation limits must be observed.PD +T J(max)*T A R q JA4.Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.5.NCP551T low = −40°CT high = +85°C NCV551T low = −40°CT high = +125°C.DEFINITIONSLoad RegulationThe change in output voltage for a change in output current at a constant temperature.Dropout VoltageThe input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 3% below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Maximum Power DissipationThe maximum total dissipation for which the regulator will operate within its specifications.Quiescent CurrentThe quiescent current is the current which flows through the ground when the LDO operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the difference between the input current (measured through the LDO input pin) and the output current.Line RegulationThe change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected.Line Transient ResponseTypical over and undershoot response when input voltage is excited with a given slope.Thermal ProtectionInternal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 160°C, the regulator turns off. This feature is provided to prevent failures from accidental overheating.Maximum Package Power DissipationThe maximum power package dissipation is the power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 125°C. Depending on the ambient power dissipation and thus the maximum available output current.3.25G R O U N D C U R R E N T (m A )3.05Figure 2. Ground Pin Current versusOutput Current 3.35I out , OUTPUT CURRENT (mA)3.33.13.23.15Figure 3. Ground Pin Current versusOutput Current3.35G R O U N D C U R R E N T (m A )3.153.45I out , OUTPUT CURRENT (mA)3.43.23.33.250.50Figure4. Ground Pin Current versusInput Voltage V in , INPUT VOLTAGE (VOLTS)Figure 5. Ground Pin Current versusInput VoltageG R OU N D P I N C U R R E N T (m A )11.522.533.540.50V in , INPUT VOLTAGE (VOLTS)G R OU N D P I N C U R R E N T (m A )11.522.533.5440004−200200−60064200TIME (m s)Figure 6. Line Transient Response Figure 7. Line Transient Response8TIME (m s)−20004006−400−400O U T P U T V O L T A G E D E V I A T I O N (m V )V i n , I N P U T V O L T A G E (V )O U T P U T V O L T A G E D E V I A T I O N (m V )V i n , I N P U T V O L T A G E (V )4−−4200TIME (m s)Figure 8. Line Transient Response Figure 9. Line Transient ResponseTIME (m s)−20004006−−400O U T P U T V O L T A G E D E V I A T I O N (m V )V i n , I N P U T V O L T A G E (V )O U T P U T V O L T A G E D E V I A T I O N (m V )V i n , I N P U T V O L T A G E (V )−600−−4200Figure 10. Line Transient Response Figure 11. Line Transient ResponseTIME (m s)−20004006−−400O U T P U T V O L T A G E D E V I A T I O N (m V )V i n , I N P U T V O L T A G E (V )O U T P U T V O L T A G E D E V I A T I O N (m V )V i n , I N P U T V O L T A G E (V )−600600800TIME (m s)150O U T P U T V O L T A G E D E V I A T I O N (m V )−1000TIME (ms)Figure 12. Load Transient Response ON Figure 13. Load Transient Response OFFTIME (ms)−50000I o u t , O U T P U T C U R R E N T (m A )−O U T P U T V O L T A G E D E V I A T I O N (m V )I o u t , O U T P U T C U R R E N T (m A )Figure 14. Load Transient Response OFF TIME (ms)Figure 15. Load Transient Response ONTIME (ms)150−5005000−−01000O U T P U T V O L T A G E D E V I A T I O N (m V )I o u t , O U T P U T C U R R E N T (m A )O U T P U T V O L T A G E D E V I A T I O N (m V )I o u t , O U T P U T C U R R E N T (m A )12Figure 16. Turn −On Response 3TIME (m s)0132V o u t , O U T P U T V O L T A G E (V )E N A B L E V O L T A G E (V )Figure 17. Turn−On ResponseTIME (m s)V o u t , O U T P U T V O L T A G E (V )E N A B L E V O L T A G E(V )Figure 18. Output Voltage versus Input Voltage Figure 19. Output Voltage versus Input Voltage2V o u t , O U T P U T V O L T A G E (V O L T S )3V in , INPUT VOLTAGE (VOLTS)2.50.51.51V o u t , O U T P U T V O L T A G E (V O L T S )V in , INPUT VOLTAGE (VOLTS)APPLICATIONS INFORMATIONA typical application circuit for the NCP551 series is shown in Figure 20.Input Decoupling (C1)A 0.1 m F capacitor either ceramic or tantalum is recommended and should be connected close to the NCP551package. Higher values and lower ESR will improve the overall line transient response.Output Decoupling (C2)The NCP551 is a stable Regulator and does not require any specific Equivalent Series Resistance (ESR) or a minimum output current. Capacitors exhibiting ESRs ranging from a few m W up to 3.0 W can thus safely be used.The minimum decoupling value is 0.1 m F and can be augmented to fulfill stringent load transient requirements.The regulator accepts ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load regulation transient response.Enable OperationThe enable pin will turn on or off the regulator. These limits of threshold are covered in the electrical specification section of this data sheet. If the enable is not used then the pin should be connected to V in .HintsPlease be sure the V in and GND lines are sufficiently wide.When the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction.Set external components, especially the output capacitor,as close as possible to the circuit, and make leads as short as possible.ThermalAs power across the NCP551 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and also the ambient temperature effect the rate of temperature rise for the part.This is stating that when the NCP551 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications.The maximum dissipation the package can handle is given by:PD +T J(max)*T AR q JAIf junction temperature is not allowed above the maximum 125°C, then the NCP551 can dissipate up to 400 mW @ 25°C.The power dissipated by the NCP551 can be calculated from the following equation:P tot +ƪV in *I gnd (I out )ƫ)[V in *V out ]*I outorV inMAX +P tot)V out *I outI GND )I outIf a 150 mA output current is needed then the ground current from the data sheet is 4.0 m A. For an NCP551SN30T1 (3.0 V), the maximum input voltage will then be 5.6 V .Battery or Unregulated VoltageFigure 20. Typical Application CircuitOFFONm FFigure 21. Current Boost RegulatorFigure 22. Current Boost Regulator withShort Circuit LimitFigure 23. Delayed Turn −onFigure 24. Input Voltages Greater than 12 VThe NCP551 series can be current boosted with a PNP transist-or. Resistor R in conjunction with V BE of the PNP determines when the pass transistor begins conducting; this circuit is not short circuit proof. Input/Output differential voltage minimum is increased by V BE of the pass resistor.Short circuit current limit is essentially set by the V BE of Q2 and R1. I SC = ((V BEQ2 − ib * R2) / R1) + I O(max) RegulatorIf a delayed turn −on is needed during power up of several volt-ages then the above schematic can be used. Resistor R, and capacitor C, will delay the turn −on of the bottom regulator.A regulated output can be achieved with input voltages that exceed the 12 V maximum rating of the NCP551 series with the addition of a simple pre −regulator circuit. Care must be taken to prevent Q1 from overheating when the regulated output (V out ) is shorted to GND .ORDERING INFORMATIONDeviceNominalOutput Voltage Marking Package Shipping†NCP551SN15T1G 1.5LAO TSOP−5(Pb−Free)3000 / Tape & Reel NCP551SN18T1G 1.8LAP TSOP−5(Pb−Free)3000 / Tape & Reel NCP551SN25T1G 2.5LAQ TSOP−5(Pb−Free)3000 / Tape & Reel NCP551SN27T1G 2.7LAR TSOP−5(Pb−Free)3000 / Tape & Reel NCP551SN28T1G 2.8LAS TSOP−5(Pb−Free)3000 / Tape & ReelNCP551SN29T1G 2.9LJL TSOP−5(Pb−Free)3000 / Tape & ReelNCP551SN30T1G 3.0LAT TSOP−5(Pb−Free)3000 / Tape & ReelNCP551SN31T1G 3.1LJM TSOP−5(Pb−Free)3000 / Tape & ReelNCP551SN32T1G 3.2LIV TSOP−5(Pb−Free)3000 / Tape & ReelNCP551SN33T1G 3.3LAU TSOP−5(Pb−Free)3000 / Tape & ReelNCP551SN50T1G 5.0LAV TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN14T1G* 1.4AAT TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN15T1G* 1.5LFZ TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN18T1G* 1.8LGA TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN25T1G* 2.5LGB TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN27T1G* 2.7LGC TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN28T1G* 2.8LGD TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN30T1G* 3.0LGE TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN31T1G* 3.1LJR TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN32T1G* 3.2LFR TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN33T1G* 3.3LGG TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN36T1G* 3.6AEJ TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN38T1G* 3.8AD5TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN50T1G* 5.0LGF TSOP−5(Pb−Free)3000 / Tape & ReelNOTE:Additional voltages in 100 mV steps are available upon request by contacting your ON Semiconductor representative.†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T ape and Reel Packaging Specific-ations Brochure, BRD8011/D.*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable.PACKAGE DIMENSIONSTSOP −5SN SUFFIX CASE 483−02ISSUE KNOTES:1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.2.CONTROLLING DIMENSION: MILLIMETERS.3.MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.4.DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLDFLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A.5.OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION.TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2FROM BODY .DIM MIN MAX MILLIMETERS A 3.00 BSC B 1.50 BSC C 0.90 1.10D 0.250.50G 0.95 BSC H 0.010.10J 0.100.26K 0.200.60M 0 10 S2.503.00__ǒmm inchesǓ*For additional information on our Pb −Free strategy and solderingdetails, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*2XDETAIL ZTOP VIEWON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at /site/pdf/Patent −Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATIONNCP551SN27T1G NCP551SN28T1G NCV551SN36T1G。
T2212-PRINTER 打印机附件说明书
1-2186529-1T2212-Printer, Printer Accessories, Spare, Printer Accessory For Use With T2212-PRINTERIdentification & Labeling>Printers, Software & Accessories>Printer AccessoriesPrinter Accessory For Use With:T2212-PRINTERPrinter Accessory Type:SpareFeaturesProduct Type FeaturesPrinter Accessory Type SpareOperation/ApplicationPrinter Accessory For Use With T2212-PRINTERProduct ComplianceFor compliance documentation, visit the product page on >EU RoHS Directive 2011/65/EU CompliantEU ELV Directive 2000/53/EC CompliantChina RoHS 2 Directive MIIT Order No 32, 2016No Restricted Materials Above ThresholdEU REACH Regulation (EC) No. 1907/2006Current ECHA Candidate List: JUN 2020(209)Candidate List Declared Against: JUN 2018(191)Does not contain REACH SVHC Halogen Content Low Halogen - Br, Cl, F, I < 900 ppm perhomogenous material. Also BFR/CFR/PVCFreeSolder Process Capability Not applicable for solder process capability Product Compliance DisclaimerThis information is provided based on reasonable inquiry of our suppliers and represents our current actual knowledgebased on the information they provided. This information is subject to change. The part numbers that TE has identified asEU RoHS compliant have a maximum concentration of 0.1% by weight in homogenous materials for lead, hexavalentchromium, mercury, PBB, PBDE, DBP, BBP, DEHP, DIBP, and 0.01% for cadmium, or qualify for an exemption to theselimits as defined in the Annexes of Directive 2011/65/EU (RoHS2). Finished electrical and electronic equipment productswill be CE marked as required by Directive 2011/65/EU. Components may not be CE marked. Additionally, the part1-2186529-1 ACTIVET2212-PrinterTE Internal #:1-2186529-1T2212-Printer, Printer Accessories, Spare, Printer Accessory For UseWith T2212-PRINTERView on >numbers that TE has identified as EU ELV compliant have a maximum concentration of 0.1% by weight in homogenous materials for lead, hexavalent chromium, and mercury, and 0.01% for cadmium, or qualify for an exemption to these limits as defined in the Annexes of Directive 2000/53/EC (ELV). Regarding the REACH Regulation, the information TE provides on SVHC in articles for this part number is based on the latest European Chemicals Agency (ECHA) ‘Guidance on requirements for substances in articles’ posted at this URL: https://echa.europa.eu/guidance-documents/guidance-on-reachTE Model / Part #9-624830-0ANVILTE Model / Part #7-1707300-0ANVILTE Model / Part #2151764-1OCEAN_2.0_Applicator-S-055F083OTE Model / Part #1-624830-7ANVILTE Model / Part #6776552008RPPM-NR510-X-STKTE Model / Part #CD78763001ACW0219-1.00-41(NS)TE Model / Part #1-1823440-122POS, MIXED,REC HSG,ASSY,SEALEDTE Model / Part #794683-109P .140 MNL CAP BLK HTPrinters(2)Printer Accessories(19) TE Model / Part #1-2186527-1T2212-PRINTERTE Model / Part #1-2186528-1T2212-SWARE-PRINTERCompatible PartsAlso in the Series T2212-PrinterCustomers Also BoughtTE Model / Part #4150038-2OCEAN-2.0-APPLICATOR-EDocumentsCAD Files3D PDF3DCustomer View ModelENG_CVM_CVM_1-2186529-1_A.2d_dxf.zip EnglishCustomer View ModelENG_CVM_CVM_1-2186529-1_A.3d_igs.zip EnglishCustomer View ModelENG_CVM_CVM_1-2186529-1_A.3d_stp.zip EnglishBy downloading the CAD file I accept and agree to the of use.Terms and Conditions Datasheets & Catalog PagesTT PRINTER ACCESSORIESEnglishT2212 printerEnglishProduct SpecificationsT2212 Cutter Operator's Manual GermanT2212 Cutter Operator's ManualEnglishAgency ApprovalsAgency Approval DocumentEnglish。
胜家 个性化餐具卡套 缝纫机 使用说明书
SINGER®个性化餐具卡套用各式各样的图案，制作一些简单的餐具卡套，使您的家居生活更加丰富多彩。
前端有一个透明口袋，可以用来放置卡片，卡片内容可以用手写，也可以用缝纫机缝制。
卡套可以重复利用，卡片也可以随时更换。
注意：所列出的耗材适用于一套餐具，可以根据自身实际情况来调整数量。
另外，所示的卡套适合装有长度为8英寸（20厘米）的餐刀。
如果您的刀长超过8英寸（20厘米），请在卡套前、后增加必要的长度，并延长口袋的长度。
难度系数: ★☆☆☆☆材料清单：o 卡套前面部分所需面料尺寸：5” x 10”(12.7cm x 25.4cm) o 卡套主体部分所需面料尺寸：5” x 10”(12.7cm x 25.4cm) o 口袋前面部分所需面料尺寸：5” x 5”(12.7cm x 12.7cm) o 口袋里衬部分所需面料尺寸：5” x 5”(12.7cm x 12.7cm) o 铺棉4½” x 9½”(11.5cm x 24.1cm) o 布衬5” x 5”(12.7cm x 12.7cm) o 一片PVC透明塑料片3¼” x 2¼”(8.3cm x 5.7cm) o 专业缝纫机线o 口袋周围用的装饰线o 切刀、垫子、直尺o 手缝针o 剪刀o 特氟龙不沾压脚o 暗缝针迹压脚o绣花压脚（可选，如果在机器上自带文字，可在卡片上缝制）o胶带o卡片缝制操作1. 将4½” x 9½”（11.5cm x 24.1cm）的铺棉烫在5” x 10” (12.7cm x 25.4cm)的卡套主体部分的反面。
将5” x 5” (12.7cm x 12.7cm)的布衬烫在5” x 5” (12.7cm x12.7cm)口袋前面部分的反面。
2. 锁芯绕好缝纫机线。
在机器顶部上穿上要用于口袋周围的装饰线。
卸下万能压脚并装上不沾压脚，这将帮助压脚不会沾在PVC上。
HP Color LaserJet Pro M252 用户指南说明书
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Edition 3, 8/2019
2 纸盘 .......................................................................................................................................................................................................... 15 将纸张装入单页进纸槽（纸盘 1） ................................................................................................................................ 16 简介 ..................................................................................................................................................................... 16 将纸张装入单页优先进纸槽 ........................................................................................................................ 16 在单页优先进纸槽中装入信封（纸盘 1） .............................................................................................. 17 纸盘 1 纸张方向 ............................................................................................................................................... 19 在纸盘 2 中装入纸张 .......................................................................................................................................................... 20 简介 ..................................................................................................................................................................... 20 在纸盘 2 中装入纸张 ...................................................................................................................................... 20 在纸盘 2 中装入信封 ...................................................................................................................................... 22 纸盘 2 纸张方向 ............................................................................................................................................... 25
InTANK iR2022 用户手册说明书
InTANK iR2022 User ManualiR2022 User Manual» InTANK iR2022 User Manual (1)» InTANK iR2022 產品使用說明 (12)v0.2 (Oct.2015)iR2022 User ManualThank you for purchasing RAIDON products. This User Manual will introduce you the InTANK iR2022 storage product. Before using your iR2022, please read it thoroughly. Although all information contented in this User Manual had already been carefully verified before publishing, however, the actual product and its specification will be based upon the time of delivery from RAIDON. Any update to the product or its relevant information may be listed on . Product is subjected to change without prior notifications.If you have any question regarding to the product you purchased, or you would like to know the latest product information, User Manual’s update, please contact to your local supplier or visit to for further information.Copyright © Raidon Technology, Inc. – All right is reserved.1. Package Contents and Product Views2. Operating Information3. Hardware Requirements and Precautions4. Hardware Installation Procedure5. Setting RAID Mode6. C omputer Setup7. Hard Disk Status and LCD Display8. Data Rebuilding Operation9. GUI Monitoring Software and Firmware Update10. Frequently Asked QuestionsOpen the package and you should find the following parts:Please make sure that the contents listed above are not damaged or missing. If you should find damages or missing contents, please contact your supplier immediately.iR2022 User ManualProduct View, Front and BackLED Indicators ：1. LCD Display2. UP/DOWN Buttons3. ESC Button4. Enter Button5. Mute Button1. Cooling Fan2. Fan Connector3. RS232 Port4. 15-pin SATA Power Connector5. 7-pin SATA Connector6. Power/False Indicator7. Removable Drive Tray8. HDD Tray Key Lock And Tray Open Button9. HDD Status Indicator2. Operation InformationOperating Temperature : 0 ~ 40 o C (32 ~ 104 o F) Storage Temperature : -10 ~ 70 o C (14 ~ 158 o F) Line Voltage : 100 ~ 240V AC3. Hardware Requirements and Precautions1. Computers or servers must be with SATA I, SATA II, or SATA III.2. Hard drive must be with SATA I, SATA II, or SATA III.3. You are strongly advised to set the storage mode before using your iR2022.Note:The default (Factory) setting is the RAID 1 mode.iR2022 User ManualNote:Once the drive mode configuration has been completed, re-configuration using the same hard drives to set the drive mode will result in complete data loss. If you must change the drive mode, make sure to backup all data prior to the mode change.Please follow the instructions below to complete the hardware installation.Open the package, take out the product, and make sure that all the enclosed contents are not damaged or missing. Should you find damages or missing contents, please contact to your supplier immediately.Put the system on a stable surface, ensure that it is well ventilated without blockage of the air flow, and keep it away from the wet and any area which may easily get e the key included in the Accessory Kit, insert it into the Key Access Opening to eject the removable drive tray latch, and extract the Removable Drive Tray.Mount your hard drives onto the Removable Drive Tray, secure it with the screws included in the Accessory Kit to avoid any damage to the hard drive due to accidental movements.Step 1Step 2Step 3Step 44. iR2022 product allows user to simultaneously use the two different hard drives from two different manufactures.However, if the user expects a better efficiency, we strongly recommend the user to use the two hard drives from the same manufacturer.5. Please make sure that the two hard drives are free from bad blocks or defects prior to installation in order to avoid system crashes or data loss.6. The actual storage capacity of iR202 recognized by the system may differ from the total capacity stated on the hard drives combined once the drives have been formatted.7. It is highly recommended for user to back up important data contained within the iR2022 unit on a regular basis or whenever the user feels necessary to a remote or a separate storage device. RAIDON will not be responsible for any lost of data caused during the use of the unit or the recovery of the data lost.iR2022 User Manual45cm SATA CablePower Supply ConnectorInternal CaseInternal RS232 CableExternal RS232 Cable1234※ Note :1. RS232 Port and RS232 Cable: User can use RS232 to monitor the status of two hard disks in industrial control system or IPC.2. W e do not recommend user to disassemble the device without proper instructions and the authorization. The Manufacture Warranty will not cover the damages caused by unauthorized disassembling.3. T o prevent the device from malfunction, please make sure that your device is well connected with a direct and dedicated power supply for a stable power input.After placing your two hard disks, turn on power and press UP Button, you are with the RAID Setting mode. (Since the default setting is RAID 1 mode by factory, you do not have to reset RAID if you want to use your iR2022 with RAID 1 mode.)1. RAID 1 mode1). Place two new hard drives into iR2022.We would strongly suggest you to use two identical hard drives to get the maximum memory capacity. And if the capacities of your two hard drives are difference, iR2022 only recognizes the memory capacity at the small capacity hard drive.2). Under RAID 1 mode, two hard drives will have the identical information as one from its mirroringfeature, therefore, even though one and only one of the two hard drives failed, iR2022 will still work fine and properly. Once you replace the failed hard disk with a new one, iR2022 will automatically do rebuilding the data from the good one to the new hard disk.When the hard drive installation has been completed, insert the hard drive tray into the system horizontally and secure the latch into place.Use the preferred cable included to connect your computer to the relative interface connection on the iR2022 unit.Step 5Step 6iR2022 User ManualWhen the hardware setup for iR2022 is complete, you are now ready to turn the machine on.After the hardware installation is complete, the iR2022 will be treated as one single hard drive. When the computer is turned on, the system will retrieve the following information. 1. Device Manager Utility of Window OS will automatically detect the hard drive(s).2. You can choose to format the hard drive by using the Disk Management tool of the operating system before using the iR2022.At this point, the installation process is completely finished. The user can freely retrieve and save data to iR2o22 just like retrieving and saving data to a regular hard drive. If the user has any problemduring the operation, please refer to the Question & Answer (Q&A) section in Appendix.2. RAID 0 mode1). Place two new hard drives into iR2022.We would strongly suggest you to use two identical hard drives to get the maximum memory capacity. And if the capacities of your two hard drives are difference, iR2022 only recognizes the memory capacity at the small capacity hard drive.2). Under RAID 0 mode, the total memory capacity of iR2022 would be double from the small capacityhard drive. And also, RAID 0 mode will perform an excellent efficiency from its high data transfer rate for user to read & write data.iR2022 User Manual2. Over Heat (≥50°C)Pri HDD : OKSec HDD : OK T3. Fan FailurePri HDD : OK F Sec HDD : OK4. RAID 1 Degraded ：Primary hard drive is failure, but secondary hard drive is normal.RAID-1 degraded Pri : X Sec : O5. RAID 1 Failure ：Primary and secondary hard drives are failure.RAID-1 failure Pri : X Sec : X6. RAID 1 Failure ：Double SourceRAID-1 failure Double Source7. RAID 0 Failure ：Primary hard drive is missing, but secondary hard drive is normal.RAID-0 failure Pri : M Sec :O8. RebuildingRebuilding Sec →Pri 32%1. Booting and Normal status.iR2022 RAID-1 vxxxxxx.xPri HDD : OK Sec HDD : OKiR2022 User ManualThe Hot Swappable hard drive and Auto Rebuilding features are available.Off-line Back up ：When the data is stored in iR2022, user can remove one of the hard drives as back up drive for data such as system operation file, secured files, seldom modified files or image and music files. The user can periodically insert the hard drive back into iR2022 to execute automatic backup to protect the system from being hit by computer virus or to avoid the risk of having both hard drives failing at the same time.When one of the two hard drives fails in iR2022, it will issue an alert of a hard drive failure message in both LCD display and the monitoring software. User can remove the failed hard drive from the system while the system is still in operation without shutting down the machine. If the failed hard drive is replaced shortly, the system will automatically execute the Auto Rebuilding function without affecting the system operation and also any operation command from the user.When the iR2022 detects one hard drive missing or failure, the Buzzer starts BEEPING and the LCD displays the following messages ：After replacing a new hard disk with the failed one, LCD displays the following messages:After few seconds from your inserting a new hard drive, LCD displays the data rebuilding progress ：When iR2022 completes its rebuilding, LCD again displays the following messages ：Pri HDD : OKSec HDD : OKRAID-1 degraded Pri : X Sec : OPri HDD : OK Sec HDD : Insert Rebuilding Sec →Pri 32%Pri HDD :Insert Sec HDD : OKRebuilding Pri →Sec 32%iR2022 User Manual You can install GUI software to monitor the status of iR2022. And this can be done by installing software from CD.1. System Status:This GUI automatically detects your iR2022 and reveals relative information accordingly.2. Firmware Upfrade:You may update the Firmware via this GUI, to just simply click on the “Load” button to locate the firmware file to proceed. After completing the update, you may restart the power to work with the new firmware.※ Caution: Any random firmware update may cause the malfunction at your iR2022, We strongly recommend you not to change/upgrade iR2022 firmware if still works properly.3. Email NotificationPlease first set up an e-mail address for the notification of a malfunction drive or the removed drive.3-1 Setup1). Select an Outgoing SMTP and write down your e-mail name and address.2). If it requests a password, select an option SMTP Login Authentication, and key-in thepassword.3). When completing the configuration, click on the “OK” button to save.※ Device must be in the operation states during configuration works.3-2 HDD Failure / Device Removed1). Insert your e-mail address as the receiver for notification, and click on “+” to add the e-mailaddress onto the Notification List. (Maximum up to 10 e-mail addresses)2). Key-in the Subject title and contents in the columns of “Subject” and “Contents”.3). When completing the configuration, click on “OK” button to save.※ Device must be in the operation status during configurations works.The GUI Management Software Version: Unstable system after installing iR2022Q1. A:Q2. A:After installing iR2022, we are unable to start the computer or the computer doesn’t recognize iR2022.1. Please check whether if the readings of iR2022 LCD appears normal.2. Please check whether if the SATA Cable properly connects to the computer and whether ifthe two hard disks are functioning properly.3. If all the devices work properly but user is still unable to start the computer, it might be thesystem incompatibility problem. If such incompatibility takes place, please contact to our ************************************************.tw.Computer works fine, but iR2022 doesn’t perform right in reading/writing messagesproperly. Please first check whether if iR2022 is executing the auto REBUILDING work.If it works for REBUILDING, your iR2022 is a good device. And if it doesn’t, please follow the following two ways to find out the possible root cause:1. Please examine if your SATA cable is too long and will attenuate signal, or whether if the TwoSATA cables fail to meet the cable specification requirements.2. If the two cables meet the requirements at both the specification & length, please turn off thecomputer, remove the two hard drives from iR2022, and directly connect the hard drives to computer, format them, and then try to read/write data into them.You may find out that the hard disk (s) are with unacceptable bad sector quanty.Hard Disk Drive (HDD) FailureUnder the Mirror mode (RAID 1), what will be the total storage capacity when adding a brandnew HDD?1. The total storage capacity at your iR2022 is determined by the storage capacity of the primary HDD installed during the initial usage.2. The storage capacity will not be increased even though you replace a larger capacity new HDD.Why does the error message appear when I install the second HDD? The storage capacity of the new replaced HDD must be larger than the first HDD.Otherwise, iR2022 is unable to perform REBUILDING work.Q1.A:Q2.A:About the Auto Rebuilding FunctionWhat will happen if we turn off the computer power while iR2022 is still executing autoREBUILDING work? Under the Mirror mode (RAID 1), if computer power is off during REBUILDING work, iR2022 will still remember the percentage of its REBUILDING work, and then resume it back to its REBUILDING work while computer power is back on.Is it possible to lose data during the REBUILDING work? The REBUILDING work will automatically duplication data from one sector to another sector.Technically speaking, the data should not be lost during its REBUILDING work. However, if the original HDD is detected with too many bad sectors during the REBUILDING work, iR2022 will make hypothetical duplication instead of treating the bad sectors as HDD failure. Therefore, the data stored in the bad sectors could potentially be lost during REBUILDING work.Q1.A:Q2.A:1. 感謝您使用RAIDON 的產品。
211_163_Product Guide
Four-line LCD with white back Light
There are six LEDs (←2） around Start Button for easy recognition. Clear and Stop keys combined.
Changed Function Key position
bizhub 210 GDI
bizhub 211
bizhub 210 PCL6
bizhub 211
bizhub 211/163 Product Guide
5
New Panel Design
Using Arrow Menu keys instead of a number of scattered Arrow Keys, operation will be simplified and more understandable.
(bizhub 210: 194 sec. (bizhub 210: 372 sec. bizhub 211: 99 sec.) bizhub 211: 156 sec.)
PCL (Optional Controller): Approximately twice the speed of previous models
bizhub 211/163 Product Guide
3
Improvements Over the Current bizhub 210 and 162
13. Konica Minolta Unified Driver Screen Layout 14. USB 2.0 Compatible 15. Maximum Number of Accounts Increased for Department Management (from 20 to 50) 16. Network Interface Card Functions Integrated into the Image Controller IC-206 17. Optional Expansion Memory Capacity Increased (from 32/64MB to 128MB) and Shared Use with PCL Controller 18. Uninstall Capability Added for TWAIN Driver 19. PageScope Web Connection Screen Changed (including input of Japanese kanji and traditional or simplified Chinese characters) 20. Improved Local Setup and Diagnosis (LSD) Function 21. New Energy Star qualification 22. Windows VISTA Compatibility Expected
ODA Technologies co.,ltd Limited MX-Series User's
MX-Series User's Guide forREV 211216ACopyright ⓒ 2018 ODA Technologies co.,ltd Limited法律通告© ODA Technologies Co., Ltd.2008此文件获得大韩民国政府的批准，获得国际著作权批准，未经(株)ODA Technologies的提前同意，以法律禁止内容的复制、再生产、或翻译成其它国家的语言进行销售。
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指南版本信息Manual Part Number: 018PT-2.0Edition 2, February, 2018 Printed in ROK 包括部分修改和最新更新的重印指南印刷日会相同。
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