Electromagnetic compatibility management for fast diagnostic design

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电磁兼容专用词汇中英对照表

电磁兼容专用词汇中英对照表

電磁兼容专用词汇中英对照表1.电磁兼容性electromagnetic compatibility (EMC)2.电磁骚扰electromagnetic disturbance3.电磁干扰electromagnetic interference4.电磁环境electromagnetic environment5.电磁发射electromagnetic emission6.电磁敏感性electromagnetic susceptibility7.电磁屏蔽electromagnetic screen8.抗扰度限值immunity limit9.抗扰度电平(水平)immunity level10.静电放电ESD electrostatic discharge11.瞬态transient12.猝发(脉冲群)burst13.喀呖声click14.基波(分量)fundamental (component)15.谐波(分量)harmonic (component)16.人工电源网络artificial mains network17.模拟手artificial hand18.准峰值检波器quasi-peak detector19.峰值检波器peak detector20.平均值检波器average detector21.(辐射)测试场地(radiation)test site22.电流探头current probe23.工科医频段ISM frequency band24.(发射或信号的)带宽band width(of an emisson or signal)25.选择性selectivity26.电压波动voltage fluctuation28. 电压瞬时跌落voltage dip(电压暂降)29. 电压浪涌voltage surge30. 闪烁flicker31.闪烁计flickermeter32.(抗扰度)符合电平(immunity)compliance level33.(性能的)降低degradation(of performance)34.有效辐射功率effective radiation power35.基本性能essential performance36.生理模拟频率physiological simulation frequency37.公共电网public mains network38.无线电频率RF radio frequency39.信息技术设备ITE information technology equipment40.受试设备(EUT)equipment under test (EUT)41.接地参考平面GRP ground reference plane(GRP)42.耦合板coupling plane43.调幅amplitude modulation44.电波暗室anechoic chamber45.全电波暗室fully anechoic chamber46.半电波暗室semi-anechoic chamber47.场强field strength48.感应场inducted field49.极化polarization50.屏蔽室shielded enclosure51.扫描sweep52.收发机transceiver53.去耦网络decoupling network54.耦合网络coupling network55.瞬态transient56.辅助设备(AE)auxiliary equipment57.钳注入clamp injection58.电流钳current clamp59.吸收钳absorbing clamp60.电磁钳electromagnetic clamp61.感应线圈induction coil。

射频指标及测试方法

射频指标及测试方法
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接收灵敏度
接收灵敏度是指收信机在满足一定的误码率 性能条件下收信机输入端需输入的最小信号电 平。衡量收信机误码性能主要有帧删除率 (FER)、残余误比特率(RBER)和误比特率(BER)三 个参数。(BER是收到的错误的比特数与总比特数 之比。RBER是当帧被删除时,只测量剩余帧的 BER。FER是在观察的时间段里被删除的帧占总 传送帧数的百分比.)
(**)DCS1800话机 -30dBc或 -20dBm,选其中较大者
14
最低下限
GSM 900:-59dBc 或–54dBm,选其中最高者, 除了时槽超前執行槽,因此許可之位準可至59dBc或–36dBm,选其中最高者。 DCS 1800:-48dBc或-48dBm,选其中最高者。
15
ห้องสมุดไป่ตู้
频谱
16
30
2.相位误差峰值Peak phase error 若Peak phase error<7deg,则相位误差峰值为 优; 若7deg≤Peak phase error≤l0deg,则相位误 差峰值为良好; 若10deg≤Peak phase error≤20deg则相位误差 峰值为一般; 若Peak phase error>20deg,则这项指标为不 合格。
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3.相位误差有效值 若RMS phase error<2.5deg,则相位误差有效 值为优; 若2.5deg≤RMS phase error≤4deg,则相位误 差有效值为良好; 若4deg≤RMS phase error≤5deg,则相位误差 有效值为一般; 若RMS phase error>5deg,则这项指标为不合 格。
37
GPRS的服务类型 按所提供的服务种类来说,现在有 Class A、B、 C三种。 ClassA可以在上网的同时接听电话,其技术含义 是同时支持包交换(数据)和电路交换(语 音)。 ClassB可以上网和接电话,但不能同时进行,其 技术含义是虽然也支持包交换和电路交换,但不 可在同一时刻支持包交换和电路交换,状态可以 切换; ClassC则只能上网,什么时候都不能打电话,其 技术含义是它只支持包交换。

MDD指令93_42_EEC(中英文对照版最终版)

MDD指令93_42_EEC(中英文对照版最终版)
Whereas the national provisions for the safety and health protection of patients, users and, where appropriate, other persons, with regard to the use of medical devices should be harmonized in order to guarantee the free movement of such devices within the internal markert; 鉴于医疗器械的使用对病患, 使用者, 甚至其他人有关安全及健康保护的相关国家规定应加以调和, 以保证此类器械在 内部市场能自由流通;
第 1 页 共 72页 Edited By Stephen Ling. Any question, please contact with me Via Email: ibat@
Whereas certain medical devices are intended to administer medicinal products within the meaning of Council Directive 65/65/EEC of 26 January 1965 on the approximation of provisions laid down by law, regulation or administrative action relating to proprietary medicinal products; whereas, in such cases, the placing on the market of the medical device as a general rule is governed by the present Directive and the placing on the market of the medicinal product is governed by Directive 65/65/EEC; whereas if, however, such a device is placed on the market in such a way that the device and the medicinal product form a single integral unit which is intended exclusively for use in the given combination and which is not reusable, that single-unit product shall be governed by Directive 65/65/EEC; whereas a distinction must be drawn between the abovementioned devices and medical devices incorporating, inter alia, substances which, if used separately, may be considered to be a medicinal substance within the meaning of Directive 65/65/EEC; whereas in such cases, if the substances incorporated in the medical devices are liable to act upon the body with action ancillary to that of the device, the placing of the devices on the market is governed by this Directive; whereas, in this context, the safety, quality and usefulness of the substances must be verified by analogy with the appropriate methods specified in Council Directive 75/318/EEC of 20 May 1975 on the approximation of the laws of the Member States relating to analytical, pharmaco-toxicological and clinical standards and protocols in respect of the testing of proprietary medicinal products; 鉴于部分医疗器械是符合 1965 年 1 月 26 日理事会第 65/65/EEC 号指令, 与专卖医药产品有关的法律, 法规或管理行 为所订的实施规定, 鉴于医疗器械的上市基本上由本指令规范, 但医疗产品的上市则受 65/65/EEC 号指令规范; 鉴于若 有某种器械须与其他医疗产品组成一完整的产品而上市销售, 使用, 且无法二次使用时, 则该组合产品应受 65/65/EEC 号指令规范; 鉴于前述的医疗器械和包含医疗物质且该物质单独使用时符合 65/65/EEC 号指令规定的医疗器械应加以 区别; 鉴于前述包含于医疗器械的医疗物质若对人体产生作用以辅助医疗器械的作用时, 则该医疗器械的上市应由本指 令规范; 鉴于 1975 年 5 月 20 日 75/318/EEC 号理事会指令[制定各会员国在测试专利医疗产品方面有关分析药物毒性 和临床的标准及调查书的法律调和], 医疗物质的安全, 品质及效用在前述情况下则须依该指令明定的适当方法加以证 实;

爱发科离子注入机操作术语英文

爱发科离子注入机操作术语英文

爱发科离子注入机操作术语英文爱发科离子注入机的操作术语英文可以分为以下几个方面:
1. 机器操作术语,包括设备的开启、关闭、运行、停止等基本操作,可能涉及到的术语有,Start, Stop, Power On, Power Off, Run, Idle等。

2. 参数设置,涉及到设备参数的设置和调整,可能涉及到的术语有,Parameter Setting, Adjustment, Calibration, Configuration等。

3. 程序操作,包括设备程序的加载、执行、保存等操作,可能涉及到的术语有,Load Program, Execute, Save Program等。

4. 安全操作,涉及到设备安全操作的术语,包括紧急停止、安全锁定等,可能涉及到的术语有,Emergency Stop, Safety Lock 等。

5. 故障处理,涉及到设备故障处理的术语,包括故障代码、故障排除等,可能涉及到的术语有,Fault Code, Troubleshooting
等。

以上是一些可能涉及到的操作术语的英文翻译,当然具体的术语翻译还需要根据具体的操作手册或者设备说明书来确定。

希望以上信息能够帮助到你。

EMI和ESD基知及PCB-LAYOUT时如何防止

EMI和ESD基知及PCB-LAYOUT时如何防止

EMI和ESD基知及PCB-LAYOUT 时如何防止EMI和ESD基础知识及PCB LAYOUT時如何防止1.EMC內容EMC是Electromagnetic Compatibility的縮寫,即電磁兼容性, 是指设备或系统在其电磁环境中符合要求运行并不对其环境中的任何设备产生无法忍受的电磁干扰的能力。

EMC包括两个方面的要求:一方面是指设备在正常运行过程中对所在环境产生的电磁干扰不能超过一定的限值;另一方面是设备对所在环境中存在的电磁干扰具有一定程度的抗扰度,即电磁敏感性。

国际电工委员会标准IEC对电磁兼容的定义是:系统或设备在所处的电磁环境中能正常工作,同时不对其他系统和设备造成干扰。

EMC 包括EMI(interference)和EMS(susceptibility),也就是电磁干扰和电磁抗干扰。

EMI,电磁干扰度,描述一产品对其他产品的电磁辐射干扰程度,是否会影响其周围环境或同一电气环境内的其它电子或电气产品的正常工作;EMS,电磁抗干扰度,描述一电子或电气产品是否会受其周围环境或同一电气环境内其它电子或电气产品的干扰而影响其自身的正常工作。

EMI又包括传导干扰CE(conduction emission)和辐射干扰RE(radiation emission)以及谐波harmonic。

EMS又包括静电抗干扰ESD,射频抗扰度EFT,电快速瞬变脉冲群抗扰度,浪涌抗扰度,电压暂降抗扰度Dip,等等相关项目。

ESD是ElectroStatic Discharge,即”静电放电”的意思,电子产品使用+/-8KV空气放电,非金属部分,使用+/-4KV接触放电,金属部分的标准.2. 电磁干扰源3.EMC标准编号4.电磁兼容标准的内容5.PCB板层分配在PCB LAYOUT压制辐射比在机壳的金属和塑胶方面的改良方面下功夫更有效.不同板层电源,地,信号线排布可参考下表.6.EMC LAYOUT注意的地方.a.IC電源線的處理,所有的DSP,都有幾組電源,+3.3V,+1.8V,在+3.V或+1.8V網絡上有許多0.1uF電容,不LAYOUT時盡量要求每個電容盡量靠近所對應的電源腳,b.时钟线的处理a)时钟线的频率很高,从MCU到功能IC都有CLOCK线,到内存,到SENSOR IC等IC都有CLOCK,此网络走线对辐射影响大.b)频率大于等于66M的时钟线,每条过孔数不要超过2个, 频率小于66M的时钟线,每条过孔数不要超过3个,走线尽可能短.c)时钟线不要和I/O线平行走,如果做不到,间距要大于50MIL.c. USB信号线的处理要求D+和D-两条信号要求等长等宽,尽量平行走线,尽量不穿孔,一条线最多一个过孔.线宽30MIL以上.d.布线原则a)数字地与模拟地分开,尽量加宽电源线、地线宽度,它们的关系一般是:地线> 电源线> 信号线,通常信号线宽为:0. 2~0. 3mm,最细宽度可达0. 08~0.1mm,电源线为1. 2~2. 5 mm。

dell4600词汇表

dell4600词汇表

词汇表Dell™PowerEdge™4600 系统用户指南下表定义或解释了系统说明文件中使用的技术术语、缩略语和缩写词。

A安培(ampere) 的缩写。

AC交流(alternating current) 的缩写。

BIOS基本输入/输出系统(basic input/output system) 的缩写。

系统的BIOS 包含存储在快擦写内存芯片中的程序。

BIOS 可以控制以下功能:微处理器与外围设备(例如键盘和视频适配器等)之间的通信其它功能,例如系统信息bps位/秒(bit per second) 的缩写。

BTU英制热量单位(British thermal unit) 的缩写。

C摄氏度(Celsius) 的缩写。

CD-ROM只读光盘存储器(compact disc read-only memory) 的缩写。

CD-ROM 驱动器使用光学技术从CD 中读取数据。

CD 是只读存储设备;您不能使用标准CD-ROM 驱动器在CD 中写入新数据。

COMn系统上第一至第四个串行端口的设备名称分别为COM1、COM2、COM3 和COM4。

COM1 和COM3 的默认中断为IRQ4、COM2 和COM4 的默认中断为IRQ3。

因此,在配置运行串行设备的软件时,请注意不要产生中断冲突。

cpi每英寸字符数(character per inch) 的缩写。

CPU中央处理器(central processing unit) 的缩写。

另请参阅微处理器。

dB分贝(decibel) 的缩写。

dBA调整分贝(adjusted decibel) 的缩写。

DC直流电源(direct current) 的缩写。

DDR双倍数据速率(dual data rate) 的缩写。

DIMM双列直插式内存模块(dual in-line memory module) 的缩写。

一种连接至主机板的小型电路板,内含DRAM 芯片。

DIN德国工业标准(Deutsche Industrie Norm) 的缩写。

LED显示屏EMC基础知识及设计规范

LED显示屏EMC基础知识及设计规范
a:AC输入端(包括甩线)到滤波器之间的AC线不能走排线、二合一线等线材,以免受到 CLK/OE高速信号干扰。
整改前
时钟频率点超标,是因 为排线或其他信号线摆 放靠近AC输入线
整改后
c:DC线与排线分开绑紧。
6. 箱体连接器处接地良好。
此处应该要金属屏蔽壳, 且与外壳相接,网线屏 蔽水晶头才能良好接地
孔缝处理
A、尽量降低缝隙的阻抗(包括减小接触电阻),是减小缝隙泄漏的最佳策略。影响接触电阻 的因素主要有接触面积(接触点数)、接触面的材料(一般较软的材料接触电阻较小)、接触 面上的压力(压力要足以使接触点穿透金属表层氧化层)、接触面的清洁程度、氧化腐蚀等。
在实际工程中,可以通过下面的做法来减小缝隙阻抗。 (1)使用机械加工的手段(如用铣床加工接触表面)增加接触面的平整度,以保证接触良好。 (2)增加两部分之间的紧固件(螺钉、铆钉)的密度,但这个方法仅适合永久性或半永久性
传导干扰: 指通过电源线或信号线把一个电路的信号干扰到另一个电路 辐射干扰: 是指干扰源通过空间把其信号干扰到另一个电路。
EMS ( Electro Magnetic Susceptibility )直译是“电磁敏感度”. 电磁环境不妨碍电子设备/系统的正常运行
各国EMC适用法规(ITE)
EMC
CE欧盟 C-TICK纽澳
内容
EMC基础知识介绍 EMC设计规范
内容
EMC基础知识介绍
●名词解释
1. CE:欧共体(CONFORMITE EUROPEENNE ) : LVD(安规)+ EMC(电磁兼容)
2. ETL:美国电子测试实验室(Electrical Testing Laboratories)的简称 , 只包含安规.

电磁兼容术语

电磁兼容术语

电磁兼容术语1、电磁兼容性(EMC,Electromagnetic Compatibility)是指电子设备或系统在其电磁环境中复合要求运行并不对其环境中的任何设备产生无法忍受的电磁骚扰的能力。

2、电磁骚扰是指任何可能引起装置、设备(系统)性能降低或对有生命(无生命)物质产生损害作用的各种电磁现象。

3、电磁环境(Electromagnetic environment)是指存在于给定场所的所有电磁现象的综合。

4、电磁干扰(EMI,Electromagnetic Interference)是指由电磁骚扰引起的设备、传输通道或系统的性能降低。

5、电磁灵敏度(Electromagnetic Susceptibility)在存在电磁骚扰的情况下,电子装置、设备或系统无法避免性能降级的特性。

6、电磁抗扰度(Electromagnetic Immunity)在存在电磁骚扰的情况下,电子装置、设备或系统能正常工作,不出现性能降级的能力。

7、抗扰度电平(Immunity level)将某给定电磁骚扰施加于某一装置、电子设备或系统而仍能正常工作并保持所需性能等级时的最大电平。

8、电磁辐射(Electromagnetic Radiated)①能量以电磁波形式由源发射到空间的现象。

②能量以电磁波形式在空间传播。

9、电磁噪声(Electromagnetic noise)指一种明显的不传送信息的时变电磁现象,它可能与有用信号叠加或组合。

注:噪声与信号的区别主要在于是否携带信息。

10、无线电频率(Radio Frequency)指用于无线电传播的频率,位于声频和红外频谱之间的电磁频谱中,也叫作射频,通常选用的范围是9KHz-3GHz。

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Electromagnetic compatibility management for fast diagnostic designJ.Raimbourg a )Commissariat àl’Energie Atomique (CEA),BP 12,91680Bruyeres Le Chatel,France(Presented on 22April 2004;published 18October 2004)This article presents an overview of electromagnetic compatibility (EMC )management for fast diagnostic design.We will present and detail the classical approach in EMC.This approach can be successfully applied for installations where a single engineering entity has the authority to prescribe and enforce a certain compatibility level.Most of the time,strict application of generic standards is required for fast hertheless,the pulse perturbation must be synchronized to the fast diagnostic operation.Some “traditional”techniques,such as star-earthing and bonding cable screens at one end,have been shown to be inadequate for fast diagnostic design.Our laser facility,the LIL,will be able to focus up to 60kJ into a volume of less than 1mm 3.We have to evaluate the electromagnetic pulse (EMP )where diagnostics,cables,and oscilloscopes will be installed.We performed electromagnetic measurements inside and outside the OMEGA target chamber.The electromagnetic pulse generated by the target chamber contains very high frequency components above 1GHz.The electric field is around a few kV/m outside and goes up to 20kV/m inside the target.We designed a specific electromagnetic probe for pulse measurement with a rise time down to 100ps.An ultrashort rise time EMP bench test was built to test apparatus before installation around a target chamber.It produces an electric field higher than 5kV/m with a rise time under 100ps.©2004American Institute of Physics.[DOI:10.1063/1.1787608]I.INTRODUCTIONElectromagnetic compatibility (EMC )is “The ability of a system or equipment to function satisfactorily in its elec-tromagnetic environment without introducing intolerable electromagnetic disturbances to anything in that environ-ment.”The three elements of an electromagnetic pulse (EMP )episode are the source,the victim,and the coupling path.They are characterized by their sensitivity and bandwidth.An EMC solution can be placed at either end of the coupling path,or in between,to make the sources less emit-ting or the victim less susceptible.There are engineering constraints and cost aspects in deciding whether to put the suppression burden on the source,the victim,or the coupling mon sense dictates that the suppression should be made at/or near the source.This is not always feasible,es-pecially for diagnostic measurements where electromagnetic interference (EMI )is one of the undesirable side effects of the physical experiment.Thus,in many instances,solutions will be applied to the victim’s side or along the coupling path.II.IMMUNITY STANDARDS AND FAST DESIGN SPECIFICITYThe techniques described in IEC 61000-5-2:1997(EMC–Installation and mitigation guidelines–Earthing and cabling )principally address the mitigation achievable by re-duction of the coupling through appropriate practices on the implementation of bonding.This improves EMC in equip-ment,systems,and installations by creating a low-impedance path to the local rf reference or a low-impedance run along an existing cable.IEC 61000-6-2:1997–Immunity for industrial environ-ments applies to electrical and electronic apparatus intended for use in industrial environment.The object of this standard is to define the immunity test and level requirements for apparatus defined in the scope in relation to continuous and transient,conducted and radiated disturbances including electrostatic plying with this standard is sufficient for 90%of experiments.Most of the time,the specificity of fast diagnostic is to operate during high pulse electromagnetic environments.For this reason,the most important specific standards areIEC61000-4-2:Electrostatic discharge test;IEC61000-4-4:Electrical fast transient/burst test;IEC61000-4-5:Surge immunity test;and IEC61000-4-9:Pulse magnetic field test.The “pulse”specificity of fast diagnostic needs to take performance criteria into account The variety and the diver-sity of the apparatus within the scope of these standards make it difficult to define precise criteria for the evaluation of the immunity test results.In order for criterion to be ap-plicable,the pulse perturbation must be synchronized to the fast diagnostic operation.We have seen that,most of the time,we only require strict application of standards.But physical experiments can cause very high electromagnetic interferences.In this case,we use a standard test,only modified.For example,the elec-trostatic discharge generator produces high electric field lev-els (few kV/m )in a ring around the discharge point.This is similar to target chamber radiation but in a small area.Wea )Electronic mail:joel.raimbourg@cea.frREVIEW OF SCIENTIFIC INSTRUMENTS VOLUME 75,NUMBER 10OCTOBER 20040034-6748/2004/75(10)/4234/3/$22.004234©2004American Institute ofPhysicsalso use a surge immunity test generator to simulate induced current from a capacitor bank discharge in a laser.III.SOURCE IDENTIFICATIONUsually,current,voltage and rise time characteristics are sufficient for EMC source identification.But sometimes,measurements are necessary.We illustrate this approach with an example:EMC on plasma diagnostics in a 10–60kJ class laser.A.Radiated EMI measurementOur laser facility,the LIL (Ligne d’Integration Laser ),will be able to focus up to 60kJ into a volume of less than a mm 3.We had to evaluate the electromagnetic pulse (EMP )inside and outside the target chamber where diagnostics,cables,and oscilloscopes will be installed.We performed experiments at the OMEGA laser facility at the University of Rochester,NY .It generates 30kJ of UV light with a 1ns duration.To estimate immunity level needed for instrumentation,we measured the electromagnetic field generated inside and out-side of the target chamber.We designed specific electromag-netic probes for this experiment.There was a 1cm 2magnetic loop with a Moebius design to achieve a rise time down to 100ps.The probe was con-nected to a 10m high frequency cable and a 3GHz oscillo-scope ͑TDS 694C ͒.B.ResultsThe electromagnetic pulse (Fig.1)generated by the tar-get chamber contains very high frequency components above 1GHz (Fig.2).Outside,the field decreases with the inverse of the distance with 4kV/m at 1m from the wall.Inside the chamber,we measured an electric field of up to 20kV/m.With high level,high frequency field,we had to design spe-cific radiation bench tests.IV.RADIATED EMI TEST A.EMI bench testWe used two different bench tests to generate a high radiation field.Our goal was to test diagnostic equipment before installing them close to a target chamber.The first main test is a strip line initially designed for nuclear electromagnetic pulse simulation.It is able to pro-duce free radiated field up to 100kV/m with 3ns risetime.FIG.1.H field radiated in the targetchamber.FIG.2.H field radiated in the target chamber (spectral density ).FIG.3.Ultrashort rise time EMP bench test.Rev.Sci.Instrum.,Vol.75,No.10,October 2004Plasma diagnostics 4235To increase equivalent frequency,we built an ultrashort rise time EMP bench test (Fig.3).A high voltage and fast rise time generator is connected to a double ridge guide an-tenna.It produces electric field higher than 5kV/m with rise time under 100ps.B.Oscilloscope under an ultrashort rise time fieldThe previous bench tested a TDS 694C oscilloscope.Two channels were connected to a RG58cable (single braid ),a SHF8cable (double braid )and a 50⍀terminal.The two others were only connected with their caps.The high level,short rise time electric field induced parasite level from 10mV (short cap )to 200mV (cable )(Fig.4).V.SINGLE POINT/MULTIPLE POINT GROUNDINGThe OMEGA laser facility is single point grounded.For EMI measurements,we first needed to insulate the BNC feedthrough connector located in the target chamber wall.Our first measurements showed the EMI field plus a strange large pulse a few hundred nanoseconds later (step 1).The second pulse could have been ion impact from the target to the probe.We removed the insulation on each BNC connector.This reduces the level of the pulse (step 2).Next,we put a glass screen to filter ions in front of the H field probe.We changed low EMC immunity BNC connectors for SMA connectors and we chose a higher EMC immunity cable with two braids (step 3).Figure 5shows the results of these three steps and clearly indicates that it was an EMIproblem.FIG.4.Parasites induced by radiatedEMP.FIG.5.Single point vs multiple point grounding effect.4236Rev.Sci.Instrum.,Vol.75,No.10,October 2004J.Raimbourg。

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