SN75183NSR中文资料
ANALOG DEVICES ADV7513 英文产品数据手册
165 MHz, High PerformanceHDMI Transmitter Data Sheet ADV7513Rev. 0Information furnished by Analog Devices is believed to be accurate and reliable. However, noresponsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. T rademarks and registered trademarks are the property of their respective owners. O ne Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.461.3113 ©2011 Analog Devices, Inc. All rights reserved.FEATURESGeneralIncorporates HDMI v1.4 features, including3D video support165 MHz supports all video formats up to 1080pand UXGASupports gamut metadata packet transmission Integrated CEC buffer/controllerCompatible with DVI v1.0 and HDCP v1.4Video/audio inputs accept logic levels from 1.8 V to 3.3 V Digital video3D video readyProgrammable, 2-way color space converterSupports RGB, YCbCr, and DDRSupports ITU-656-based embedded syncsAutomatic input video format timing detection (CEA-861-E) Digital audioSupports standard S/PDIF for stereo linear pulse codemodulation (LPCM) or compressed audio up to 192 kHz High bit rate (HBR) audio8-channel uncompressed LPCM I2S audio up to 192 kHz Special features for easy system design5 V tolerant I2C and Hot Plug™ detect (HPD) I/Os,no extra device neededNo audio master clock needed for supporting S/PDIFand I2SOn-chip MPU with I2C master performs HDCP operationsand EDID reading operationsOn-chip MPU reports HDMI events through interruptsand registersAPPLICATIONSGaming consolesPCsDVD players and recordersDigital set-top boxesA/V receiversFUNCTIONAL BLOCK DIAGRAM1225-1Figure 1.GENERAL DESCRIPTIONThe ADV7513 is a 165 MHz, High-Definition Multimedia Interface (HDMI®) transmitter that is ideal for DVD players/ recorders, digital set-top boxes, A/V receivers, gaming consoles, and PCs.The digital video interface contains an HDMI v1.4/DVI v1.0-compatible transmitter and supports all HDTV formats. The ADV7513 supports HDMI v1.4-specific features, including 3D video. The ADV7513 also supports x.v.Color™, high bit rate (HBR) audio, and the programmable auxiliary video information (AVI) InfoFrame features. With the inclusion of HDCP, the ADV7513 allows the secure transmission of protected content as specified by the HDCP v1.4 protocol.The ADV7513 supports both S/PDIF and 8-channel I2S audio. Its high fidelity 8-channel I2S interface can transmit either stereo or 7.1 surround audio up to 768 kHz. The S/PDIF interface can carry compressed audio, including Dolby® Digital, DTS®, and THX®. Fabricated in an advanced CMOS process, the ADV7513 is provided in a 64-lead LQFP surface-mount plastic package with exposed pad and is specified over the −25°C to +85°C temperature range.ADV7513Data SheetRev. 0 | Page 2 of 12TABLE OF CONTENTSFeatures .............................................................................................. 1 Applications ....................................................................................... 1 Functional Block Diagram .............................................................. 1 General Description ......................................................................... 1 Revision History ............................................................................... 2 Specifications ..................................................................................... 3 Electrical Specifications (3)Absolute Maximum Ratings ............................................................5 Explanation of Test Levels ............................................................5 ESD Caution...................................................................................5 Pin Configuration and Function Descriptions ..............................6 Applications Information .................................................................8 Design Resources ..........................................................................8 Outline Dimensions ..........................................................................9 Ordering Guide .. (9)REVISION HISTORY11/11—Revision 0: Initial VersionData SheetADV7513Rev. 0 | Page 3 of 12SPECIFICATIONSELECTRICAL SPECIFICATIONSTable 1.Parameter Symbol Temp Test Level 1 Min Typ Max Unit DIGITAL INPUTS Data Inputs, Video and Audio, CEC_CLK Input Voltage, High V IH Full VI 1.35 3.5 V Input Voltage, Low V IL Full VI −0.3 +0.7 V Input Capacitance 25°C VIII 1.0 1.5 pFCEC_CLK Frequency 2Full VIII 3 12 100 MHz CEC_CL KAccuracy Full VIII −2 +2 % DDC I 2C Lines (DDCSDA, DDCSCL) Input Voltage, High V IH Full IV 1.4 5.5 V Input Voltage, Low V IL Full IV −0.3 +0.7 V I 2C Lines (SDA, SCL) Input Voltage, High V IH Full VI 1.4 5.5 V Input Voltage, Low V IL Full VI −0.3 +0.7 V CEC Pin Input Voltage, High V IH Full VI 2.0 5.5 V Input Voltage, Low V IL Full VI −0.3 +0.8 V Output Voltage, High V OH Full VI 2.5 3.63 V Output Voltage, Low V OL Full VI −0.3 +0.6 V HPD Pin Input Voltage, High V IH Full VI 1.3 5.5 V Input Voltage, Low V IL Full VI −0.3 +0.8 V THERMAL CHARACTERISTICS Thermal Resistance Junction-to-Case θJC Full V 20 °C/W Junction-to-Ambient θJA Full V 43 °C/W Ambient Temperature Full V −25 +25 +85 °C DC SPECIFICATIONS Input Leakage Current I IL 25°C VI −1 +1 μA POWER SUPPLY1.8 V Supply Voltage (DVDD, AVDD,PVDD, BGVDD)Full IV 1.71 1.8 1.90 V 3.3 V Supply Voltage (DVDD_3V) Full IV 3.15 3.3 3.45 V Power-Down Current 25°C IV 300 μATransmitter Total Power 3At 1.8 V Full VI 256 mW At 3.3 V Full VI 1 mW AC SPECIFICATIONS TMDS Output Clock Frequency 25°C IV 20 165 MHz TMDS Output Clock Duty Cycle 25°C IV 48 52 % Input Video Clock Frequency Full IV 165 MHzInput Video Data Setup Time 4t VSU Full IV 1.8 ns Input Video Data Hold Time 4 t VHLD Full IV 1.3 ns TMDS Differential Swing 25°C VII 800 1100 1200 mV Differential Output Timing Low-to-High Transition Time 25°C VII 75 95 ps High-to-Low Transition Time 25°C VII 75 95 ps VSYNC and HSYNC Delay From DE Falling Edge 25°C IV 1 UI 5 To DE Rising Edge 25°C IV 1 UI 5ADV7513Data SheetRev. 0 | Page 4 of 12Parameter Symbol Temp Test Level 1 Min Typ Max Unit AUDIO AC TIMING SCLK Duty Cycle N/2 Is an Even Number Full IV 40 50 60 % N/2 Is an Odd Number Full IV 49 50 51 % I2S[3:0], S/PDIF Setup Time t ASU Full IV 2 ns I2S[3:0], S/PDIF Hold Time t AHLD Full IV 2 ns LRCLK Setup Time t ASU Full IV 2 ns LRCLK Hold Time t AHLD Full IV 2 ns I 2C INTERFACE SCL Clock Frequency Full 400 kHz SDA Setup Time t DSU Full 100 ns SDA Hold Time t DHO Full 100 ns Setup Time for Start Condition t STASU Full 0.6 μs Hold Time for Start Condition t STAH Full 0.6 μs Setup Time for Stop Condition t STOSU Full 0.6 μs1 See the Explanation of Test Levels section.212 MHz crystal oscillator for default register settings. 31080p, 24-bit typical random pattern. 4The video data setup and hold times are measured at 0.9 V. The relationship between the clock and data is programmable in 400 ps steps. 5UI is the unit interval.Data SheetADV7513Rev. 0 | Page 5 of 12ABSOLUTE MAXIMUM RATINGSTable 2.Parameter RatingDigital Inputs (SDA, SCL, DDCSDA, DDCSCL,HPD, PD)−0.3 V to +5.5 V Audio/Video Digital Inputs (D[23:0], MCLK,CLK, LRCLK, CEC, CEC_CLK, SPDIF, I2S[3:0],SCLK, HSYNC, DE, VSYNC)−0.3 V to +3.63 V Digital Output Current 20 mAOperating Temperature Range −40°C to +100°CStorage Temperature Range −65°C to +150°C Maximum Junction Temperature 150°C Maximum Case Temperature 150°CStresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operationalsection of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. EXPLANATION OF TEST LEVELSI. 100% production tested. II. 100% production tested at 25°C and sample tested at specified temperatures. III. Sample tested only. IV . Parameter is guaranteed by design and characterizationtesting.V . Parameter is a typical value only. VI.100% production tested at 25°C; guaranteed by design and characterization testing.VII.Limits defined by HDMI specification; guaranteed by design and characterization testing.VIII. Parameter is guaranteed by design.ESD CAUTIONADV7513Data SheetRev. 0 | Page 6 of 12DVDD D12T X C –H S Y N CPIN CONFIGURATION AND FUNCTION DESCRIPTIONSD ED 0D 1D 2D 3D 4D 5D 6D 7D 8C L KD 9D V D DD 10D 11VSYNC SPDIF MCLK I2S0I2S1I2S2I2S3SCLKLRCLK PVDD DVDD BGVDD R_EXT AVDD HPD D13D14D15D16D17D18D19D20D21D22D23SDA SCL DDCSDA DDCSCLT X C +A V D DT X 0–T X 0+P DT X 1–T X 1+A V D DT X 2–T X 2+I N TD V D D _3VC E CD V D DC E C _C L KNOTES1. THE EXPOSED PAD IS THE ELECTRICAL GROUND FOR THE PART AND MUST BE SOLDERED TO THE PCB.10225-002Figure 2. Pin ConfigurationTable 3. Pin Function DescriptionsPin No. Mnemonic Type Description 1, 11, 31, 51 DVDD Power 1.8 V Power Supply. These pins should be filtered and as quiet as possible. 2 VSYNC Input Vertical Synchronization Input. 3 SPDIF Input S/PDIF (Sony/Philips Digital Interface) Audio Input. 4 MCLK Input Audio Reference Clock Input. 5 I2S0 Input I 2S Channel 0 Audio Data Input. 6 I2S1 Input I 2S Channel 1 Audio Data Input. 7 I2S2 Input I 2S Channel 2 Audio Data Input. 8 I2S3 Input I 2S Channel 3 Audio Data Input. 9 SCL KInput I 2S Audio Clock Input. 10 LRCLK Input Left/Right Channel Signal Input. 12 PVDD Power 1.8 V PLL Power Supply. 13 BGVDD Power 1.8 V Band Gap Power Supply. 14 R_EXT Input This pin sets the internal reference currents. 15, 19, 25 AVDD Power 1.8 V Power Supply for TMDS Outputs. 16 HPD Input Hot Plug Detect Signal Input. 17, 18 TXC−, TXC+ DifferentialoutputDifferential TMDS Clock Output. 20, 21 TX0−, TX0+ DifferentialoutputDifferential TMDS Output Channel 0. 22 PD Input Power-Down Control and I 2C Address Selection. 23, 24 TX1−, TX1+ DifferentialoutputDifferential TMDS Output Channel 1. 26, 27 TX2−, TX2+ DifferentialoutputDifferential TMDS Output Channel 2.Data SheetADV7513Rev. 0 | Page 7 of 12Pin No. Mnemonic Type Description 28 INT Output Interrupt Signal Output. 29 DVDD_3V Power 3.3 V Power Supply. 30 CEC Input/output CEC Data Signal. 32 CEC_CLK Input CEC Clock (Oscillator from 3 MHz to 100 MHz). 33 DDCSCL Control Serial Port Data Clock to Sink. 34 DDCSDA Control Serial Port Data Input/Output to Sink. 35 SCL Control Serial Port Data Clock Input. 36 SDA Control Serial Port Data Input/Output.37 to 50, 52, 54 to 62 D[23:0]Input Video Data Inputs. 53 CLK Input Video Input Clock. 63 DE Input Data Enable Signal for Digital Video. 64 HSYNC Input Horizontal Synchronization Input. EPAD Power The exposed pad is the electrical ground for the part and must be soldered to the PCB.ADV7513Data SheetRev. 0 | Page 8 of 12APPLICATIONS INFORMATIONDESIGN RESOURCESEvaluation kits, reference design schematics, hardware and soft-ware guides, and other support documentation are available under a nondisclosure agreement (NDA). For more information, contact ATV_VideoTx_Apps@ . Other references include the following: •EIA/CEA-861-E —this technical specification document describes audio and video InfoFrames, as well as the E-EDID structure for HDMI. It is available from the Consumer Electronics Association (CEA).•High-Definition Multimedia Interface SpecificationVersion 1.4, a defining document for HDMI v1.4, and the HDMI Compliance Test Specification (CTS) Version 1.3a are available from HDMI Licensing, LLC.•High-Bandwidth Digital Content Protection SystemRevision 1.4, the defining technical specification document for HDCP Revision 1.4, is available from Digital Content Protection, LLC.Data SheetADV7513Rev. 0 | Page 9 of 12OUTLINE DIMENSIONSCOMPLIANT TO JEDEC STANDARDS MS-026-BCD-HD03-16-2010-AVIEW AROTATED 90°CCWFOR PROPER CONNECTION OF THE EXPOSED PAD,REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONSSECTION OF THIS DATA SHEET.Figure 3. 64-Lead Low Profile Quad Flat Package [LQFP_EP](SW-64-2)Dimensions shown in millimetersORDERING GUIDEModel 1Temperature Range Package DescriptionPackage Option ADV7513BSWZ −25°C to +85°C 64-Lead Low Profile Quad Flat Package, Exposed Pad [LQFP_EP] SW-64-2 EVAL-ADV7513-AKZEvaluation kit with HDCP keys1Z = RoHS Compliant Part.ADV7513 Data Sheet NOTESRev. 0 | Page 10 of 12Data Sheet ADV7513 NOTESRev. 0 | Page 11 of 12ADV7513Data SheetRev. 0 | Page 12 of 12 NOTESI 2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).HDMI, the HDMI Logo, and High-Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC in the United States and other countries.©2011 Analog Devices, Inc. All rights reserved. Trademarks andregistered trademarks are the property of their respective owners.D10225-0-11/11(0)。
SN75ALS181中文资料
IMPORTANT NOTICETexas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current.TI warrants performance of its semiconductor products and related software to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.Certain applications using semiconductor products may involve potential risks of death, personal injury, or severe property or environmental damage (“Critical Applications”).TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS.Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI products in such applications requires the written approval of an appropriate TI officer. Questions concerning potential risk applications should be directed to TI through a local SC sales office.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards should be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Nor does TI warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used.Copyright © 1996, Texas Instruments Incorporated。
半导体中频变压器参数表
半导体中频变压器参数表
【实用版】
目录
一、半导体中频变压器的概念与作用
二、半导体中频变压器的分类与型号
三、半导体中频变压器的参数及其含义
四、如何选择半导体中频变压器
五、使用半导体中频变压器的注意事项
正文
一、半导体中频变压器的概念与作用
半导体中频变压器是一种用于半导体收音机、电视机等电子设备中的电子元器件，主要作用是在信号处理过程中对中频信号进行变换和放大。
通过变换和放大中频信号，可以提高电子设备的接收性能和信号质量。
二、半导体中频变压器的分类与型号
半导体中频变压器有很多分类和型号，常见的分类有调频、调幅收音机用的中频变压器，彩色电视机用的中频变压器等。
其中，调频收音机的中频变压器有 TP-11、TP-12、TP-13、TP-06、WTP-07、TP-08、TP-09 等型号；调幅收音机的中频变压器有 TTF-1、TTF-2、BZX-19、BZX-20、SZP1、SZP2 等型号；彩色电视机用的中频变压器有 1OKR3744、1OKRC3706、
1OKRC3707、1SlOTCO1 等型号。
三、半导体中频变压器的参数及其含义
半导体中频变压器的参数主要包括工作频率、额定功率、电压等。
这些参数决定了中频变压器的使用范围和性能。
例如，工作频率决定了中频变压器适用的信号范围；额定功率决定了中频变压器能承受的最大功率；电压则决定了中频变压器的输入和输出电压范围。
四、如何选择半导体中频变压器
选择半导体中频变压器时，首先要根据设备的需要确定所需的型号和参数；其次要考虑中频变压器的性能，如工作稳定性、抗干扰能力等；最后还要考虑中频变压器的价格和可靠性。
半导体中频变压器参数表
半导体中频变压器参数表摘要：一、半导体中频变压器参数表的概述1.半导体中频变压器的定义和作用2.半导体中频变压器参数表的重要性二、半导体中频变压器参数表的具体内容1.变压器的基本参数a.输入电压b.输出电压c.额定功率d.频率e.电压调整率f.电流调整率g.效率h.绝缘电阻i.耐压强度2.变压器的结构参数a.外形尺寸b.重量c.接线方式d.冷却方式e.防护等级三、半导体中频变压器参数表的应用领域1.通信行业2.家电行业3.工业自动化领域4.医疗设备5.其他电子设备四、半导体中频变压器参数表的注意事项1.选择合适的参数2.考虑产品的可靠性3.考虑产品的安全性4.考虑产品的兼容性正文：半导体中频变压器参数表是半导体中频变压器的重要技术文档，它详细列出了变压器的各项性能指标和技术参数，为用户选择和使用半导体中频变压器提供了重要依据。
一、半导体中频变压器参数表的概述半导体中频变压器是一种将电能从一个电路传输到另一个电路的设备，它在电子设备中有着广泛的应用。
半导体中频变压器参数表则是详细列出变压器的各项性能指标和技术参数的表格，它对于理解变压器的性能和选择合适的变压器有着重要的参考价值。
二、半导体中频变压器参数表的具体内容半导体中频变压器参数表主要包括变压器的基本参数和结构参数。
其中，基本参数包括输入电压、输出电压、额定功率、频率、电压调整率、电流调整率、效率、绝缘电阻和耐压强度等；结构参数包括外形尺寸、重量、接线方式、冷却方式、防护等级等。
三、半导体中频变压器参数表的应用领域半导体中频变压器参数表广泛应用于通信行业、家电行业、工业自动化领域、医疗设备和其他电子设备等领域。
在这些领域中，用户可以根据参数表选择合适的变压器，以满足设备的性能要求。
四、半导体中频变压器参数表的注意事项在使用半导体中频变压器参数表时，用户需要注意选择合适的参数，以保证变压器的性能和可靠性。
SN75175DR中文资料
PACKAGING INFORMATIONOrderable DeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN65175D ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN65175DE4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN65175DG4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN65175DR ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN65175DRE4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN65175DRG4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN75175D ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN75175DE4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN75175DG4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN75175DR ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN75175DRE4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN75175DRG4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN75175J OBSOLETE CDIP J 16TBD Call TI Call TISN75175N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN75175NE4ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN75175NSR ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN75175NSRE4ACTIVESONS162000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)PACKAGE OPTION ADDENDUM15-Nov-2006Addendum-Page 1(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.PACKAGE OPTION ADDENDUM 15-Nov-2006Addendum-Page 2IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityLow Power Wireless /lpw Telephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2006, Texas Instruments Incorporated。
SN75175中文资料
p
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Input Voltage – High Logic State (Three–State Control) Input Voltage – Low Logic State (Three–State Control) Input Current – High Logic State (Three–State Control) (VIH = 2.7 V) (VIH = 5.5 V) Input Current – Low Logic State (Three–State Control) (VIL = 0.4 V) Input Clamp Diode Voltage (Three–State Control) (IIK = –18 mA) Output Third State Leakage Current (VI(D) = 3.0 V, VIL = 0.8 V, VO = 0.4 V) (VI(D) = –3.0 V, VIL = 0.8 V, VO = 2.4 V) Output Short–Circuit Current (Note 5) (VI(D) = 3.0 V, VIH = 2.0 V, VO = 0 V) Power Supply Current (VIL = 0 V) (All Inputs Grounded)
QUAD EIA–485 LINE RECEIVER WITH THREE–STATE OUTPUTS
SEMICONDUCTOR TECHNICAL DATA
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Meets CCITT Recommendations V.10, V.11, X.26, and X.27 Designed for Multipoint Transmission on Long Bus Lines in Noisy Environments 3–State Outputs Common–Mode Input Voltage Range . . . –12 V to 12 V Input Sensitivity . . . ±200 mV Input Hysteresis . . . 50 mV Typ High Input Impedance . . . 1 EIA–485 Unit Load Operates from Single 5.0 V Supply Lower Power Requirements Plug–In Replacement for MC3486
维沙亚高速塑料接收器数据手册说明书
Soft Recovery Ultrafast Plastic RectifierFEATURES•Glass passivated pellet chip junction •Ultrafast reverse recovery time •Low forward voltage drop•Low switching losses, high efficiency •High forward surge capability•Solder dip 275 °C max. 10 s, per JESD 22-B106•Material categorization: for definitions of compliance please see /doc?99912TYPICAL APPLICATIONSFor use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer and telecommunication.MECHANICAL DATACase: DO-201ADMolding compound meets UL 94 V-0 flammability rating Base P/N-E3 - RoHS-compliant, commercial gradeTerminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102E3 suffix meets JESD 201 class 1A whisker test Polarity: Color band denotes cathode endPRIMARY CHARACTERISTICSI F(AV) 3.0 AV RRM 50 V, 100 V, 200 V, 300 V, 400 V, 500 V, 600 V, 800 V, 1000 VI FSM 150 A t rr 50 ns, 75 ns V F 1.0 V, 1.7 V T J max.150 °C Package DO-201ADDiode variationsSingle dieDO-201ADMAXIMUM RATINGS (T A = 25 °C unless otherwise noted)PARAMETERSYMBOL UF5400UF5401UF5402UF5403UF5404UF5405UF5406UF5407UF5408UNIT Maximum repetitive peak reverse voltage V RRM 501002003004005006008001000V Maximum RMS voltage V RMS 3570140210280350420560700V Maximum DC blocking voltage V DC 501002003004005006008001000V Maximum average forwardrectified current, 0.375" (9.5 mm) lead length at T A = 55 °C I F(AV)3.0APeak forward surge current 8.3 ms single half sine-wave superimposed on rated load I FSM 150AOperating junction and storage temperature rangeT J , T STG-55 to +150°CNote(1)Pulse test: 300 μs pulse width, 1 % duty cycleNote(1)Thermal resistance from junction to lead and from junction to ambient with 0.375" (9.5 mm) lead length, both leads attached to heatsinkRATINGS AND CHARACTERISTICS CURVES (T A = 25 °C unless otherwise noted)Fig. 1 - Maximum Forward Current Derating Curve Fig. 2 - Forward Power Loss CharacteristicsELECTRICAL CHARACTERISTICS (T A = 25 °C unless otherwise noted)PARAMETER TEST CONDITIONS SYMBOL UF5400UF5401UF5402UF5403UF5404UF5405UF5406UF5407UF5408UNITMaximum instantaneous forward voltage 3.0 AV F (1)1.01.7VMaximum DC reverse current at rated DCblocking voltage T A = 25 °CI R10μAT A = 100 °C 75200Maximumreverse recovery timeI F = 0.5 A, I R = 1.0 A, I rr = 0.25 AT J = 25 °Ct rr 5075nsTypical junction capacitance4.0 V, 1 MHz C J 4536pFTHERMAL CHARACTERISTICS (T A = 25 °C unless otherwise noted)PARAMETERSYMBOL UF5400UF5401 UF5402 UF5403 UF5404 UF5405 UF5406 UF5407 UF5408 UNIT Typical thermal resistanceR θJA (1)20°C/WR θJL (1)8.5ORDERING INFORMATION (Example)PREFERRED P/N UNIT WEIGHT (g)PREFERRED PACKAGE CODEBASE QUANTITYDELIVERY MODEUF5406-E3/54 1.17254140013" diameter paper tape and reelUF5406-E3/731.172731000Ammo pack packagingFig. 3 - Maximum Non-Repetitive Peak Forward Surge Current Fig. 4 - Typical Instantaneous Forward Characteristics Fig. 5 - Typical Reverse Leakage CharacteristicsFig. 6 - Typical Junction CapacitancePACKAGE OUTLINE DIMENSIONS in inches (millimeters)Legal Disclaimer Notice VishayDisclaimerALL PRODUCT, PRODUCT SPECIFICAT IONS AND DAT A ARE SUBJECT T O CHANGE WIT HOUT NOT ICE T O IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product.Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein.Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. 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SN75188NE4中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-86889012A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-8688901CA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type 5962-8688901DA ACTIVE CFP W141TBD A42SNPB N/A for Pkg Type MC1488N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeMC1488NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type SN55188J ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type SN75188D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75188DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75188DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75188DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75188N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN75188NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN75188NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75188NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ55188FK ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type SNJ55188J ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type SNJ55188W ACTIVE CFP W141TBD A42SNPB N/A for Pkg Type (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is 18-Jul-2006provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.18-Jul-2006IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityLow Power Wireless /lpw Telephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2006, Texas Instruments Incorporated。
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PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)7900901CA ACTIVE CDIP J 141None A42SNPB Level-NC-NC-NC 7900901DA ACTIVE CFP W 141None A42SNPB Level-NC-NC-NC DS8830N OBSOLETE PDIP N 14None Call TI Call TISN55183J ACTIVE CDIP J 141None A42SNPB Level-NC-NC-NC SN75183D ACTIVE SOIC D 1450Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN75183DR ACTIVE SOIC D 142500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN75183N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN75183NSR ACTIVE SO NS 142000Pb-Free (RoHS)CU NIPDAULevel-2-260C-1YEAR/Level-1-235C-UNLIM SNJ55183FK ACTIVE LCCC FK 201None POST-PLATE Level-NC-NC-NC SNJ55183J ACTIVE CDIP J 141None A42SNPB Level-NC-NC-NC SNJ55183WACTIVECFPW141NoneA42SNPBLevel-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -May not be currently available -please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead (Pb-Free).Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor productsthat are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean "Pb-Free"and in addition,uses package materials that do not contain halogens,including bromine (Br)or antimony (Sb)above 0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM4-Mar-2005Addendum-Page 1元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。