DS3232MZ+TRL;DS3232MZ+;中文规格书,Datasheet资料
聚英翱翔电子云系列DAM3232-单 WIFI 版产品说明书

云系列DAM3232单WIFI版说明书V1.0北京聚英翱翔电子有限责任公司2017年10月目录一、产品特点 (1)二、产品功能 (1)三、版本说明 (1)四、主要参数 (1)五、接口说明 (2)1、引脚说明 (2)六、通讯接线说明 (4)1、WIFI连接 (4)2、WiFi复位说明 (5)3、架构说明 (5)七、快速使用说明 (6)八、输入输出接线 (6)1、有源开关量接线示意图 (6)2、无源开关量接线示意图 (7)3、继电器接线说明 (7)4、模拟量接线示意图 (7)九、设备参数及工作模式配置 (8)1、网络配置 (8)2、设备地址 (9)3、波特率的读取与设置 (9)4、工作模式 (9)5、点动功能 (9)十、设备唯一ID号 (10)1、扫描二维码获取 (10)十一、开发资料说明 (10)1、通讯协议说明 (10)2、Modbus寄存器说明 (10)3、指令生成说明 (13)4、指令列表 (13)5、指令详解 (16)十二、常见问题与解决方法 (22)十三、技术支持联系方式 (22)一、产品特点●DC12V/24V(默认12V);●继电器输出触点隔离;●485通信光电隔离;●通讯接口支持RS485或RS232、无线WIFI通讯;●通信波特率:2400,4800,9600,19200,38400(可以通过软件修改,默认9600);●通信协议:支持标准modbus-RTU/TCP/ASCLL协议;●可以设置0-255个设备地址;●具有闪开、闪断功能,可以在指令里边带参数、操作继电器开一段时间自动关闭;●具有频闪功能,可以控制器继电器周期性开关。
二、产品功能●三十二路继电器控制;●三十二路(或16路)光耦隔离输入,可以接无源触点和DC5-24V电压;●十六路模拟量(4-20mA/0-10V/0-5V)输入;●定时控制----年月日时分秒自定义设置时间控制,可循环;●输出互锁----自定义输出通道与输出通道之间的互锁关系;●开关量联动----手动开关或开关量触发设备与控制输出联动;●场景控制-----自定义完整的逻辑控制触发条件;●70组规则设定----多达70组规则条件设定,满足各种逻辑要求。
DS3232S#;DS3232SN#;DS3232S#T&R;DS3232SN#T&R;中文规格书,Datasheet资料

EVALUATION KIT AVAILABLE For pricing, delivery, and ordering information, please contact Maxim Directat 1-888-629-4642, or visit Maxim’s website at www.maxim .General DescriptionThe D S3232 is a low-cost temperature-compensatedcrystal oscillator (TCXO) with a very accurate, tempera-ture-compensated, integrated real-time clock (RTC) and236 bytes of battery-backed SRAM. Additionally, theDS3232 incorporates a battery input and maintains accu-rate timekeeping when main power to the device is inter-rupted. The integration of the crystal resonator enhancesthe long-term accuracy of the device as well as reducesthe piece-part count in a manufacturing line. The DS3232is available in commercial and industrial temperatureranges, and is offered in an industry-standard 20-pin,300-mil SO package.The RTC maintains seconds, minutes, hours, day, date,month, and year information. The date at the end of themonth is automatically adjusted for months with fewerthan 31 days, including corrections for leap year. Theclock operates in either the 24-hour or 12-hour formatwith an AM/PM indicator. Two programmable time-of-day alarms and a programmable square-wave outputare provided. Address and data are transferred seriallythrough an I2C bidirectional bus.A precision temperature-compensated voltage refer-ence and comparator circuit monitors the status of V CCto detect power failures, to provide a reset output, andto automatically switch to the backup supply when nec-essary. Additionally, the RST pin is monitored as apushbutton input for generating a µP reset.ApplicationsServers Utility Power MetersTelematics GPSFeatures♦Accuracy ±2ppm from 0°C to +40°C♦Accuracy ±3.5ppm from -40°C to +85°C♦Battery Backup Input for ContinuousTimekeeping♦Operating Temperature RangesCommercial: 0°C to +70°CIndustrial: -40°C to +85°C♦236 Bytes of Battery-Backed SRAM♦Low-Power Consumption♦Real-Time Clock Counts Seconds, Minutes,Hours, Day, Date, Month, and Year with Leap YearCompensation Valid Up to 2099♦Two Time-of-Day Alarms♦Programmable Square-Wave Output♦Fast (400kHz) I2C Interface♦3.3V Operation♦Digital Temp Sensor Output: ±3°C Accuracy♦Register for Aging Trim♦RST Input/Output♦300-Mil, 20-Pin SO Package♦Underwriters Laboratories RecognizedExtremely Accurate I2C RTC withIntegrated Crystal and SRAM19-5337; Rev 5; 7/10Ordering InformationPin ConfigurationDS3232Extremely Accurate I 2C RTC with Integrated Crystal and SRAMABSOLUTE MAXIMUM RATINGSRECOMMENDED OPERATING CONDITIONSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Voltage Range on V CC , V BAT , 32kHz, SCL, SDA, RST ,INT /SQW Relative to Ground.............................-0.3V to +6.0V Junction-to-Ambient Thermal Resistance (θJC ) (Note 1)..55.1°C/W Junction-to-Case Thermal Resistance (θJC ) (Note 1)..........24°C/W Operating Temperature Range(noncondensing).............................................-40°C to +85°CJunction Temperature......................................................+125°C Storage Temperature Range...............................-40°C to +85°C Lead Temperature (soldering, 10s).................................+260°C Soldering Temperature (reflow, 2 times max)....................+260°C(See the Handling, PC Board Layout, and Assembly section.)ELECTRICAL CHARACTERISTICSNote 1:Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to /thermal-tutorial .DS32322Maxim IntegratedExtremely Accurate I 2C RTC withIntegrated Crystal and SRAMELECTRICAL CHARACTERISTICS (continued)ELECTRICAL CHARACTERISTICSDS32323Maxim IntegratedExtremely Accurate I 2C RTC with Integrated Crystal and SRAMAC ELECTRICAL CHARACTERISTICSPOWER-SWITCH CHARACTERISTICSDS32324Maxim IntegratedDS3232Extremely Accurate I2C RTC withIntegrated Crystal and SRAMPushbutton Reset TimingPower-Switch Timing5 Maxim IntegratedExtremely Accurate I 2C RTC with Integrated Crystal and SRAMData Transfer on I 2C Serial BusNote 2:Limits at -40°C are guaranteed by design and not production tested.Note 3:All voltages are referenced to ground.Note 4:I CCA —SCL clocking at max frequency = 400kHz.Note 5:Current is the averaged input current, which includes the temperature conversion current.Note 6:The RST pin has an internal 50k Ω(nominal) pullup resistor to V CC .Note 7:After this period, the first clock pulse is generated.Note 8:A device must internally provide a hold time of at least 300ns for the SDA signal (referred to the V IH(MIN)of the SCL signal)to bridge the undefined region of the falling edge of SCL.Note 9:The maximum t HD:DAT needs only to be met if the device does not stretch the low period (t LOW ) of the SCL signal.Note 10:A fast-mode device can be used in a standard-mode system, but the requirement t SU:DAT ≥250ns must then be met. Thisis automatically the case if the device does not stretch the low period of the SCL signal. If such a device does stretch the low period of the SCL signal, it must output the next data bit to the SDA line t R(MAX)+ t SU:DAT = 1000 + 250 = 1250ns before the SCL line is released.Note 11:C B —total capacitance of one bus line in pF.Note 12:Minimum operating frequency of the I 2C interface is imposed by the timeout period.Note 13:The parameter t OSF is the period of time the oscillator must be stopped for the OSF flag to be set over the voltage range of0V ≤V CC ≤V CC(MAX) and 2.3V ≤V BAT ≤3.4V.Note 14:This delay only applies if the oscillator is enabled and running. If the EOSC bit is 1, t REC is bypassed and RST immediatelygoes high.WARNING: Negative undershoots below -0.3V while the part is in battery-backed mode may cause loss of data.DS32326Maxim IntegratedExtremely Accurate I 2C RTC withIntegrated Crystal and SRAMSTANDBY SUPPLY CURRENT vs. SUPPLY VOLTAGEV CC (V)S U P P L Y C U R R E N T (n A )5.34.84.32.83.33.850100150125752502.3SUPPLY CURRENT vs. SUPPLY VOLTAGEV BAT (V)S U P P L Y C U R R E N T (n A )5.34.84.32.83.33.880090010009508507507002.3SUPPLY CURRENT vs. TEMPERATURETEMPERATURE (°C)S U P P L Y C U R R E N T (μA )806040-20200.7000.8000.9000.600-40FREQUENCY DEVIATION vs. TEMPERATURE vs. AGINGTEMPERATURE (°C)F R E Q U E N C Y D E V I A T I O N (p p m )806040-20020*******-5-15-25-3575655545-45-40Typical Operating Characteristics(V CC = +3.3V, T A = +25°C, unless otherwise noted.)DELTA TIME AND FREQUENCYvs. TEMPERATURETEMPERATURE (°C)D E L T A F R E Q U E N C Y (p p m )D E L T A T I M E (M I N /Y E A R )80705060-10010203040-30-20-180-160-140-120-100-80-60-40-20020-200-80-60-40-200-100-40DS32327Maxim IntegratedExtremely Accurate I2C RTC withIntegrated Crystal and SRAMBlock DiagramDetailed Description The D S3232 is a serial RTC driven by a temperature-compensated 32kHz crystal oscillator. The TCXO pro-vides a stable and accurate reference clock, and maintains the RTC to within ±2 minutes per year accu-racy from -40°C to +85°C. The TCXO frequency output is available at the 32kHz pin. The RTC is a low-power clock/calendar with two programmable time-of-day alarms and a programmable square-wave output. The INT/SQW provides either an interrupt signal due to alarm conditions or a square-wave output. The clock/cal-endar provides seconds, minutes, hours, day, date, month, and year information. The date at the end of the month is automatically adjusted for months with fewer than 31 days, including corrections for leap year. The clock operates in either the 24-hour or 12-hour format with an AM/PM indicator. The internal registers are accessible though an I2C bus interface.A temperature-compensated voltage reference and comparator circuit monitors the level of V CC to detectDS32328Maxim IntegratedExtremely Accurate I2C RTC with Integrated Crystal and SRAMpower failures and to automatically switch to the back-up supply when necessary. The RST pin provides an external pushbutton function and acts as an indicator of a power-fail event. Also available are 236 bytes of gen-eral-purpose battery-backed SRAM.Operation The block diagram shows the main elements of the D S3232. The eight blocks can be grouped into four functional groups: TCXO, power control, pushbutton function, and RTC. Their operations are described sep-arately in the following sections.32kHz TCXO The temperature sensor, oscillator, and control logic form the TCXO. The controller reads the output of the on-chip temperature sensor and uses a lookup table to determine the capacitance required, adds the aging correction in AGE register, and then sets the capaci-tance selection registers. New values, including changes to the AGE register, are loaded only when a change in the temperature value occurs. The tempera-ture is read on initial application of V CC and once every 64 seconds (default, see the description for CRATE1 and CRATE0 in the control/status register) afterwards.DS32329Maxim IntegratedPower Control This function is provided by a temperature-compensat-ed voltage reference and a comparator circuit that monitors the V CC level. When V CC is greater than V PF, the part is powered by V CC. When V CC is less than V PF but greater than V BAT, the DS3232 is powered by V CC. If V CC is less than V PF and is less than V BAT, the device is powered by V BAT. See Table 1.BATthe device, the oscillator does not start up and no tem-perature conversions take place until V CC exceeds V PF or until a valid I2C address is written to the part. After the first time V CC is ramped up, the oscillator starts up and the V BAT source powers the oscillator during power-down and keeps the oscillator running. When the DS3232 switches to V BAT, the oscillator may be dis-abled by setting the EOSC bit.V BAT Operation There are several modes of operation that affect the amount of V BAT current that is drawn. While the device is powered by V BAT and the serial interface is active, active battery current, I BATA, is drawn. When the serial interface is inactive, timekeeping current (I BATT), which includes the averaged temperature conversion current, I BATTC, is used (refer to Application Note 3644: Power Considerations for Accurate Real-Time Clocks for details). Temperature conversion current, I BATTC, is specified since the system must be able to support the periodic higher current pulse and still maintain a valid voltage level. D ata retention current, I BATTDR, is the current drawn by the part when the oscillator is stopped (EOSC= 1). This mode can be used to mini-mize battery requirements for times when maintaining time and date information is not necessary, e.g., while the end system is waiting to be shipped to a customer.Pushbutton Reset Function The DS3232 provides for a pushbutton switch to be con-nected to the RST output pin. When the DS3232 is not in a reset cycle, it continuously monitors the RST signal for a low going edge. If an edge transition is detected, the D S3232 debounces the switch by pulling the RST low.After the internal timer has expired (PB DB), the D S3232 continues to monitor the RST line. If the line is still low, the DS3232 continuously monitors the line looking for a rising edge. Upon detecting release, the D S3232 forces the RST pin low and holds it low for t RST.The same pin, RST, is used to indicate a power-fail con-dition. When V CC is lower than V PF, an internal power-fail signal is generated, which forces the RST pin low. When V CC returns to a level above V PF, the RST pin is held low for t REC to allow the power supply to stabilize. If the oscillator is not running (see the Power Control section) when V CC is applied, t REC is bypassed and RST immediately goes high.Assertion of the RST output, whether by pushbutton or power-fail detection, does not affect the internal opera-tion of the DS3232.Real-Time Clock With the clock source from the TCXO, the RTC provides seconds, minutes, hours, day, date, month, and year information. The date at the end of the month is automati-cally adjusted for months with fewer than 31 days, includ-ing corrections for leap year. The clock operates in either the 24-hour or 12-hour format with an AM/PM indicator. The clock provides two programmable time-of-day alarms and a programmable square-wave output. The INT/SQW pin either generates an interrupt due to alarm condition or outputs a square-wave signal and the selection is controlled by the bit INTCN.SRAM The D S3232 provides 236 bytes of general-purpose battery-backed read/write memory. The I2C address ranges from 14h to 0FFh. The SRAM can be written or read whenever V CC or V BAT is greater than the mini-mum operating voltage.Address Map Figure 1 shows the address map for the DS3232 time-keeping registers. During a multibyte access, when the address pointer reaches the end of the register space (0FFh), it wraps around to location 00h. On an I2C START or address pointer incrementing to location 00h, the current time is transferred to a second set of regis-ters. The time information is read from these secondary registers, while the clock may continue to run. This eliminates the need to reread the registers in case the main registers update during a read.I2C Interface The I2C interface is accessible whenever either V CC or V BAT is at a valid level. If a microcontroller connected to the D S3232 resets because of a loss of V CC or otherExtremely Accurate I2C RTC withIntegrated Crystal and SRAMDS323210Maxim Integrated分销商库存信息:MAXIMDS3232S#DS3232SN#DS3232S#T&R DS3232SN#T&R。
串口电平转换芯片数据手册SP3222_3232E

DESCRIPTIONs Meets true EIA/TIA-232-F Standards from a +3.0V to +5.5V power supplys 235KBps Transmission Rate Under Load s 1µA Low-Power Shutdown with Receivers Active (SP3222E )s Interoperable with RS-232 down to +2.7V power sources Enhanced ESD Specifications: ±15kV Human Body Model±15kV IEC1000-4-2 Air Discharge ±8kV IEC1000-4-2 Contact DischargeThe SP3222E/3232E series is an RS-232 transceiver solution intended for portable or hand-held applications such as notebook or palmtop computers. The SP3222E/3232E series has a high-efficiency, charge-pump power supply that requires only 0.1µF capacitors in 3.3V operation. This charge pump allows the SP3222E/3232E series to deliver true RS-232performance from a single power supply ranging from +3.3V to +5.0V. The SP3222E/3232E are 2-driver/2-receiver devices. This series is ideal for portable or hand-held applications such as notebook or palmtop computers. The ESD tolerance of the SP3222E/3232E devices are over ±15kV for both Human Body Model and IEC1000-4-2 Air discharge test methods. The SP3222E device has a low-power shutdown mode where the devices' driver outputs and charge pumps are disabled. During shutdown, the supply current falls to less than 1µA.SELECTION TABLEL E D O M s e i l p p u S r e w o P 232-S R s r D e v i r 232-S R sr e v i e c e R l a n r e t x E st n e n o p m o C nw o d t u h S L T T a S -3e t t f o .o N s n i P 2223P S V 5.5+o t V 0.3+224s e Y s e Y 02,812323P S V5.5+o t V 0.3+224oN oN 61RE T E M A R A P .N I M .P Y T .X A M ST I N U SN O I T I D N O C S C I T S I R E T C A R A H C C D tn e r r u C y l p p u S 3.00.1A m T ,d a o l o n B M A 52+=o V ,C C C V 3.3=tn e r r u C y l p p u S n w o d t u h S 0.101µA,D N G =N D H S T B M A 52+=o V ,C C C V3.3+=S T U P T U O R E V I E C E R D N A S T U P N I C I G O L W O L d l o h s e r h T c i g o L t u p n I 8.0V 2e t o N ,N D H S ,N E ,N I x T H G I H d l o h s e r h T c i g o L t u p n I 0.24.2V V C C 2e t o N ,V 3.3=V C C 2e t o N ,V 0.5=t n e r r u C e g a k a e L t u p n I 10.0±0.1±µA ,N D H S ,N E ,N I x T T B M A 52+=o C t n e r r u C e g a k a e L t u p t u O 50.0±01±µA d e l b a s i d s r e v i e c e r W O L e g a t l o V t u p t u O 4.0V I T U O A m 6.1=H G I H e g a t l o V t u p t u O V C C 6.0-V C C 1.0-VI T U O Am 0.1-=S T U P T U O R E V I R D gn i w S e g a t l o V t u p t u O 0.5±4.5±Vk 3Ω,s t u p t u o r e v i r d l l a t a d n u o r g o t d a o l T B M A 52+=o Cec n a t s i s e R t u p t u O 003ΩV C C T ,V 0=-V =+V =T U O =+V 2t n e r r u C t i u c r i C -t r o h S t u p t u O 53±07±06±001±A m A m V T U O V 0=V T U O =+V51tn e r r u C e g a k a e L t u p t u O 52±µAV T U O =+V ,V 21C C de l b a s i d s r e v i r d ,V 5.5o t V 0=NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.ABSOLUTE MAXIMUM RATINGSThese are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability and cause permanent damage to the device.V CC ................................................................-0.3V to +6.0V V+ (NOTE 1)................................................-0.3V to +7.0V V- (NOTE 1)................................................+0.3V to -7.0V V+ + |V-| (NOTE 1)....................................................+13V I CC (DC V CC or GND current).................................±100mAInput VoltagesTxIN, EN .....................................................-0.3V to +6.0V RxIN.............................................................................±25V Output VoltagesTxOUT.....................................................................±13.2V RxOUT..............................................-0.3V to (V CC + 0.3V)Short-Circuit DurationTxOUT...............................................................Continuous Storage Temperature.................................-65°C to +150°C Power Dissipation Per Package20-pin SSOP (derate 9.25mW/o C above +70o C).....750mW 18-pin PDIP (derate 15.2mW/o C above +70o C)....1220mW 18-pin SOIC (derate 15.7mW/o C above +70o C)...1260mW 20-pin TSSOP (derate 11.1mW/o C above +70o C)..890mW 16-pin SSOP (derate 9.69mW/o C above +70o C).....775mW 16-pin PDIP (derate 14.3mW/o C above +70o C)....1150mW 16-pin Wide SOIC (derate 11.2mW/o C above +70o C)900mW 16-pin TSSOP (derate 10.5mW/o C above +70o C)..850mW 16-pin nSOIC (derate 13.57mW/°C above +70°C)..1086mWSPECIFICATIONSUnless otherwise noted, the following specifications apply for V CC = +3.0V to +5.0V with T AMB = T MIN to T MAXR E T E M A R A P .N I M .P Y T .X A M ST I N U SN O I T I D N O C S T U P N I R E V I E C E R e g n a R e g a t l o V t u p n I 51-51+V W O L d l o h s e r h T t u p n I 6.08.02.15.1V V C C V 3.3=V C C V 0.5=H G I H d l o h s e r h T t u p n I 5.18.14.24.2V V C C V 3.3=V C C V0.5=s i s e r e t s y H t u p n I 3.0V ec n a t s i s e R t u p n I 357k ΩS C I T S I R E T C A R A H C G N I M I T e t a R a t a D m u m i x a M 021532s p b k R L k 3=ΩC ,L g n i h c t i w s r e v i r d e n o ,F p 0001=y a l e D n o i t a g a p o r P r e v i r D 0.10.1µs µs t L H P R ,L K 3=ΩC ,L F p 0001=t H L P R ,L K 3=ΩC ,L F p 0001=y a l e D n o i t a g a p o r P r e v i e c e R 3.03.0µs t L H P C ,T U O x R o t N I x R ,L F p 051=t H L P C ,T U O x R o t N I x R ,L Fp 051=e m i T e l b a n E t u p t u O r e v i e c e R 002s n e m i T e l b a s i D t u p t u O r e v i e c e R 002s n w e k S r e v i r D 001005s n t |L H P t -H L P T ,|B M A 52=o C we k S r e v i e c e R 0020001s n t |L H P t -H L P |et a R w e l S n o i g e R -n o i t i s n a r T 03/V µsV C C R ,V 3.3=L K 3=ΩT ,B M A 52=o ,C V 0.3+o t V 0.3-m o r f n e k a t s t n e m e r u s a e m V0.3-o t V 0.3+r o SPECIFICATIONS (continued)Unless otherwise noted, the following specifications apply for V CC = +3.0V to +5.0V with T AMB = T MIN to T MAX .Typical Values apply at V CC = +3.3V or +5.0V and T AMB = 25o C.NOTE 2: Driver input hysteresis is typically 250mV.Capacitance for the SP3222 and the SP3232SP3222 and the SP3232Transmitting Data for the SP3222 and the SP3232TYPICAL PERFORMANCE CHARACTERISTICSUnless otherwise noted, the following performance characteristics apply for V CC = +3.3V, 235kbps data rates, all drivers loaded with 3k Ω, 0.1µF charge pump capacitors, and T AMB = +25°C.DESCRIPTIONThe SP3222E/3232E transceivers meet the EIA/TIA-232 and V.28/V.24 communication proto-cols and can be implemented in battery-pow-ered, portable, or hand-held applications such as notebook or palmtop computers. The SP3222E/3232E devices all feature Sipex's proprietary on-board charge pump circuitry that generates 2x V CC for RS-232 voltage levels from a single +3.0V to +5.5V power supply. This series is ideal for +3.3V-only systems, mixed +3.3V to +5.5V systems, or +5.0V-only systems that re-quire true RS-232 performance. The SP3222E/3232E series have drivers that operate at a typi-cal data rate of 235Kbps fully loaded.The SP3222E and SP3232E are 2-driver/2-re-ceiver devices ideal for portable or hand-held applications. The SP3222E features a 1µA shutdown mode that reduces power consump-tion and extends battery life in portable systems.Its receivers remain active in shutdown mode,allowing external devices such as modems to be monitored using only 1µA supply current.THEORY OF OPERATIONThe SP3222E/3232E series are made up of three basic circuit blocks: 1. Drivers, 2. Receivers,and 3. the Sipex proprietary charge pump.DriversThe drivers are inverting level transmitters that convert TTL or CMOS logic levels to ±5.0V EIA/TIA-232 levels inverted relative to the in-put logic levels. Typically, the RS-232 output voltage swing is ±5.5V with no load and at least ±5V minimum fully loaded. The driver outputs are protected against infinite short-circuits to ground without degradation in reliability. Driver outputs will meet EIA/TIA-562 levels of ±3.7V with supply voltages as low as 2.7V.The drivers typically can operate at a data rate of 235Kbps. The drivers can guarantee a data rate of 120Kbps fully loaded with 3K Ω in parallel with 1000pF, ensuring compatibility with PC-to-PC communication software.The slew rate of the driver output is internally limited to a maximum of 30V/µs in order to meet the EIA standards (EIA RS-232D 2.1.7, Para-graph 5). The transition of the loaded output from HIGH to LOW also meets the monotonic-ity requirements of the standard.The SP3222E/3232E drivers can maintain high data rates up to 240Kbps fully loaded. Figure 8shows a loopback test circuit used to test the RS-232 drivers. Figure 9 shows the test results of the loopback circuit with all drivers active at 120Kbps with RS-232 loads in parallel with 1000pF capacitors. Figure 10 shows the test results where one driver was active at 235Kbps and all drivers loaded with an RS-232 receiver in parallel with a 1000pF capacitor. A solid RS-232 data transmission rate of 120Kbps provides compatibility with many designs in personal computer peripherals and LAN applications.The SP3222E driver's output stages are turned off (tri-state) when the device is in shutdown mode. When the power is off, the SP3222E device permits the outputs to be driven up to ±12V. The driver's inputs do not have pull-up resistors. Designers should connect unused inputs to V CC or GND.In the shutdown mode, the supply current falls to less than 1µA, where SHDN = LOW. When the SP3222E device is shut down, the device's driver outputs are disabled (tri-stated) and the charge pumps are turned off with V+ pulled down to V CC and V- pulled to GND. The time required to exit shutdown is typically 100µs.Connect SHDN to V CC if the shutdown mode is not used. SHDN has no effect on RxOUT or RxOUTB. As they become active, the two driver outputs go to opposite RS-232 levels where one driver input is HIGH and the other LOW. Note that the drivers are enabled only when the magnitude of V- exceeds approximately 3V.ReceiversThe receivers convert EIA/TIA-232 levels to TTL or CMOS logic output levels. All receivers have an inverting tri-state output. These receiver outputs (RxOUT) are tri-stated when the enable control EN = HIGH. In the shutdown mode, the receivers can be active or inactive. EN has no effect on TxOUT. The truth table logic of the SP3222E/3232E driver and receiver outputs can be found in Table 2.Since receiver input is usually from a transmis-sion line where long cable lengths and system interference can degrade the signal, the inputs have a typical hysteresis margin of 300mV. This ensures that the receiver is virtually immune to noisy transmission lines. Should an input be left unconnected, a 5k Ω pulldown resistor to ground will commit the output of the receiver to a HIGH state.Charge PumpThe charge pump is a Sipex –patented design (5,306,954) and uses a unique approach com-pared to older less–efficient designs. The charge pump still requires four external capacitors, but uses a four–phase voltage shifting technique to attain symmetrical 5.5V power supplies. The internal power supply consists of a regulated dual charge pump that provides output voltages 5.5V regardless of the input voltage (V CC ) over the +3.0V to +5.5V range.In most circumstances, decoupling the power supply can be achieved adequately using a 0.1µF bypass capacitor at C5 (refer to Figures 6 and 7).In applications that are sensitive to power-sup-ply noise, decouple V CC to ground with a capaci-tor of the same value as charge-pump capacitor C1. Physically connect bypass capacitors as close to the IC as possible.The charge pumps operate in a discontinuous mode using an internal oscillator. If the output voltages are less than a magnitude of 5.5V, the charge pumps are enabled. If the output voltage exceed a magnitude of 5.5V, the charge pumps are disabled. This oscillator controls the four phases of the voltage shifting. A description of each phase follows.Phase 1— V SS charge storage — During this phase of the clock cycle, the positive side of capacitors C 1and C 2 are initially charged to V CC . C l + is then switched to GND and the charge in C 1– is trans-ferred to C 2–. Since C 2+ is connected to V CC , the voltage potential across capacitor C 2 is now 2times V CC .Phase 2— V SS transfer — Phase two of the clock con-nects the negative terminal of C 2 to the V SS storage capacitor and the positive terminal of C 2to GND. This transfers a negative generated voltage to C 3. This generated voltage is regu-lated to a minimum voltage of -5.5V. Simulta-neous with the transfer of the voltage to C 3, the positive side of capacitor C 1 is switched to V CC and the negative side is connected to GND.Phase 3— V DD charge storage — The third phase of the clock is identical to the first phase — the charge transferred in C 1 produces –V CC in the negative terminal of C 1, which is applied to the negative side of capacitor C 2. Since C 2+ is at V CC , the voltage potential across C 2 is 2 times V CC .Table 2. Truth Table Logic for Shutdown and Enable ControlN D H S N E T U O x T T U O x R 00e t a t s -i r T e v i t c A 01e t a t s -i r T e t a t s -i r T 10e v i t c A e v i t c A 11ev i t c A et a t s -i r TPhase 4— V DD transfer — The fourth phase of the clock connects the negative terminal of C 2 to GND,and transfers this positive generated voltage across C 2 to C 4, the V DD storage capacitor. This voltage is regulated to +5.5V. At this voltage,the internal oscillator is disabled. Simultaneous with the transfer of the voltage to C 4, the positive side of capacitor C 1 is switched to V CC and the negative side is connected to GND, allowing the charge pump cycle to begin again. The charge pump cycle will continue as long as the opera-tional conditions for the internal oscillator are present.Since both V + and V – are separately generated from V CC ; in a no–load condition V + and V – will be symmetrical. Older charge pump approaches that generate V – from V + will show a decrease in the magnitude of V – compared to V + due to the inherent inefficiencies in the design.The clock rate for the charge pump typically operates at 250kHz. The external capacitors can be as low as 0.1µF with a 16V breakdown voltage rating.ESD ToleranceThe SP3222E/3232E series incorporates ruggedized ESD cells on all driver output and receiver input pins. The ESD structure is improved over our previous family for more rugged applications and environments sensitive to electro-static discharges and associated transients. The improved ESD tolerance is at least ±15kV without damage nor latch-up.There are different methods of ESD testing applied:a) MIL-STD-883, Method 3015.7b) IEC1000-4-2 Air-Discharge c) IEC1000-4-2 Direct Contact The Human Body Model has been the generally accepted ESD testing method for semiconduc-tors. This method is also specified in MIL-STD-883, Method 3015.7 for ESD testing. The premise of this ESD test is to simulate the human body’spotential to store electro-static energy and discharge it to an integrated circuit. The simulation is performed by using a test model as shown in Figure 17. This method will test the IC’s capability to withstand an ESD transient during normal handling such as in manufacturing areas where the ICs tend to be handled frequently.The IEC-1000-4-2, formerly IEC801-2, is generally used for testing ESD on equipment and systems. For system manufacturers, they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside environment and human presence.The premise with IEC1000-4-2 is that the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the equipment that are accessible to personnel during normal usage.The transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. The test circuit for IEC1000-4-2is shown on Figure 18. There are two methods within IEC1000-4-2, the Air Discharge method and the Contact Discharge method.With the Air Discharge Method, an ESD voltage is applied to the equipment under test (EUT) through air. This simulates an electrically charged person ready to connect a cable onto the rear of the system only to find an unpleasant zap just before the person touches the back panel. The high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system. This energy, whether discharged directly or through air, is predominantly a function of the discharge current rather than the discharge voltage.Variables with an air discharge such as approach speed of the object carrying the ESD potential to the system and humidity will tend to change the discharge current. For example, the rise time of the discharge current varies with the approach speed.Figure 14. Charge Pump WaveformsThe Contact Discharge Method applies the ESD current directly to the EUT. This method was devised to reduce the unpredictability of the ESD arc. The discharge current rise time is constant since the energy is directly transferred without the air-gap arc. In situations such as hand held systems, the ESD charge can be directly discharged to the equipment from a person already holding the equipment. The current is transferred on to the keypad or the serial port of the equipment directly and then travels through the PCB and finally to the IC.The circuit models in Figures 17 and 18 represent the typical ESD testing circuits used for all three methods. The C S is initially charged with the DC power supply when the first switch (SW1) is on. Now that the capacitor is charged, the second switch (SW2) is on while SW1 switches off. The voltage stored in the capacitor is then applied through R S, the current limiting resistor, onto the device under test (DUT). In ESD tests, the SW2 switch is pulsed so that the device under test receives a duration of voltage.Figure 17. ESD Test Circuit for Human Body ModelFigure 18. ESD Test Circuit for IEC1000-4-2Figure 19. ESD Test Waveform for IEC1000-4-230AI ¥0A15At=30nst ¥t=0nsFor the Human Body Model, the current limiting resistor (R S ) and the source capacitor (C S ) are 1.5k Ω an 100pF, respectively. For IEC-1000-4-2, the current limiting resistor (R S )and the source capacitor (C S ) are 330Ω an 150pF,respectively.The higher C S value and lower R S value in the IEC1000-4-2 model are more stringent than the Human Body Model. The larger storage capacitor injects a higher voltage to the test point when SW2 is switched on. The lower current limiting resistor increases the current charge onto the test point.Device Pin Human Body IEC1000-4-2Tested Model Air Discharge Direct Contact LevelDriver Outputs ±15kV ±15kV ±8kV 4Receiver Inputs ±15kV±15kV±8kV4Table 3. Transceiver ESD Tolerance LevelsPACKAGE:PLASTIC SHRINKPACKAGE:PLASTICDUAL–IN–LINE (NARROW)PACKAGE:PLASTICPACKAGE:PLASTICSMALL OUTLINE (SOIC)(NARROW)DIMENSIONSin inches (mm) Minimum/Maximum Symbol16 Lead20 Lead D0.193/0.2010.252/0.260(4.90/5.10)(6.40/6.60)e0.026 BSC0.026 BSC(0.65 BSC)(0.65 BSC)PACKAGE:PLASTIC THINSMALL OUTLINE(TSSOP)ORDERING INFORMATIONModel Temperature Range Package Type SP3222ECA.............................................0˚C to +70˚C..........................................20-Pin SSOP SP3222ECP.............................................0˚C to +70˚C............................................18-Pin PDIP SP3222ECT.............................................0˚C to +70˚C...........................................18-Pin SOIC SP3222ECY.............................................0˚C to +70˚C........................................20-Pin TSSOP SP3222EEA............................................-40˚C to +85˚C........................................20-Pin SSOP SP3222EEP............................................-40˚C to +85˚C..........................................18-Pin PDIP SP3222EET............................................-40˚C to +85˚C.........................................18-Pin SOIC SP3222EEY............................................-40˚C to +85˚C......................................20-Pin TSSOP SP3232ECA.............................................0˚C to +70˚C..........................................16-Pin SSOP SP3232ECP.............................................0˚C to +70˚C............................................16-Pin PDIP SP3232ECT.............................................0˚C to +70˚C..................................16-Pin Wide SOIC SP3232ECN.............................................0˚C to +70˚C.........................................16-Pin nSOIC SP3232ECY.............................................0˚C to +70˚C........................................16-Pin TSSOP SP3232EEA............................................-40˚C to +85˚C........................................16-Pin SSOP SP3232EEP............................................-40˚C to +85˚C..........................................16-Pin PDIP SP3232EET............................................-40˚C to +85˚C................................16-Pin Wide SOIC SP3232EEN............................................-40˚C to +85˚C.......................................16-Pin nSOIC SP3232EEY............................................-40˚C to +85˚C......................................16-Pin TSSOP。
DLP-2232MSP;中文规格书,Datasheet资料

D L P -2232M S PLEAD FREEUSB / MICROCONTROLLER MODULEThe DLP-2232MSP combines the same USB interface used in the DLP-2232H and the DLP-1232H modules with a Texas Instruments microcontroller to form a rapid development tool. TheMSP430F2618 microcontroller is preprogrammed with basic functionality for accessing the port pins and can be reprogrammed with user firmware via a 10-pin header using a device programmer (purchased separately).FEATURES:• Send/receive data over a high-speed USB 2.0 interface to a host computer• 32 digital I/O lines (8 can be configured as A/D inputs; 2 can be configured as D/A outputs) plus the 8-bit data bus available for interfacing to user electronics• Texas Instruments 16-bit RISC architecture processor with 116K bytes FLASH ROM, 8K bytes RAM, a multi-channel,12-bit A/D converter and dual, 12-bit D/A converters• “Token I/O” code preprogrammed into the MSP430F2618’s FLASH memory for basic port pin input/output capability including access to the A/D and D/A converters• The FLASH memory can be easily erased and reprogrammed utilizing a user-supplied compatible programmer• No in-depth knowledge of USB is required as all USB protocols are handled automatically by the on-board FT2232H and its support circuitry• Royalty-free device drivers eliminate the need for USB driver development in most cases • USB bulk or isocronous data-transfer modes• Required 5V supply can be taken directly from the USB port or supplied by user electronics • USB 1.1 and USB 2.0 compatible• USB VID, PID, serial number and product-description strings stored in an on-board EEPROM memory• Royalty-Free Virtual COM Port (VCP) Drivers for:- Windows 2000, Server 2003 and Server 2008- Windows XP and XP 64 bit- Windows Vista and Vista 64 bit- Windows 7- Windows CE 4.2-, 5.0- and 5.2-based OS- MAC OS-X- Linux (tested using kernel 2.6.32)•Royalty-Free D2XX Direct Drivers (USB drivers + DLL S/W interface) for:- Windows 2000, Server 2003 and Server 2008- Windows XP and XP 64 bit- Windows Vista and Vista 64 bit- Windows 7- Windows CE 4.2-, 5.0- and 5.2-based OSOS-X-MAC- Linux (tested using kernel 2.6.32)APPLICATION AREAS:• Prototype development•USB ISDN and ADSL modems•USB interface for digital cameras•USB interface for MP3 players•High-speed USB instrumentation•USB smart-card readers•Set top box (STB) PC-USB interface•USB hardware modems•USB wireless modems•USB bar code readers1.0 GENERAL DESCRIPTIONThe DLP-2232MSP provides a cost-effective, microcontroller-based method of interfacing an electronic peripheral to a host computer via USB.To send data from the peripheral to the host computer, the microcontroller simply writes thebyte-wide data into the FT2232H when TXE# is low. If the FT2232H’s transmit buffer fills up or is busy storing the previously written byte, it will take TXE# high in order to stop further data from being written until some of the FIFO data has been transferred over USB to the host.When the host sends data to the peripheral over USB, the FT2232H will take RXF# low to let the microcontroller know that at least one byte of data is available. The microcontroller then reads the data until RXF# goes high indicating that no more data is available to be read.By using FTDI’s Virtual COM Port Drivers, the peripheral looks like a standard COM port to the application software. Commands to set the baud rate are ignored--the FT2232H always transfers data at its fastest rate regardless of the application’s baud-rate setting. The latest versions of the drivers are available for download from DLP Design’s website at .2.0 DRIVER SOFTWAREFTDI's VCP (Virtual COM Port) driver-executable files are provided royalty free on the condition that they are used only with designs incorporating an FTDI device (i.e. the FT2232H on theDLP-2232MSP). The latest version of the drivers can be downloaded from or .The VCP driver download file is a combined set of drivers for Windows 7, Windows Vista and Windows 2000/XP. Unzip the file to a blank floppy disk or folder on your PC. (The drivers can coexist on the same floppy disk or folder since the INF files determine which set of drivers to load for each operating system version.) Once loaded, the VCP drivers allow the application software running on your host PC to communicate with the DLP-2232MSP as though it were connected to a COM(RS-232) port.In addition to VCP drivers, FTDI's D2XX direct drivers offer an alternative solution to the VCP drivers that allow application software to interface with the DLP-2232MSP using a DLL instead of a Virtual COM Port. The architecture of the D2XX drivers consists of a Windows WDM driver that communicates with the device via the Windows USB stack and a DLL that interfaces the application software (written in VC++, C++ Builder, Delphi, VB, etc.) to the WDM driver. An INF installation file, uninstaller program and D2XX Programmer’s Guide complete the package.The D2XX direct drivers add support for simultaneous access and control of multiple FT2232H devices. The extended open function (FT_OpenEx) allows the device to be opened by either its product description or serial number, both of which can be programmed to be unique. The list devices function (FT_ListDevices) allows the application software to determine which devices are currently available for use, again by product description or by serial number.Download FTDI Application Notes AN232-03, AN232-05, AN232-06 and AN232-07 for detailed instructions on how to install and remove the drivers.3.0 EEPROM WRITE UTILITYThe DLP-2232MSP has the option to accept manufacturer-specific information that is written into on-board EEPROM memory. Parameters that can be programmed include the VID and the PID identifiers, the manufacturer's product string or a serial number.MPROG is an EEPROM serializer and testing utility from FTDI for the FT2232H device. MPROG is based on the new D2XX drivers and will work on Windows 7, Windows Vista and Windows 2000/XP platforms. You must install the latest release of the CDM drivers in order to run this application. (Refer to the MPROG User’s Guide for details on the program’s use.)4.0 QUICK START GUIDEThis guide requires the use of a Windows 7/Vista/2000/XP PC that is equipped with a USB port.1. Download the WHQL-certified CDM device drivers from either or. Unzip the drivers onto a blank floppy disk or into a folder on the hard drive.Note: The DLP-2232MSP can be configured to receive its operating power from the USB port or from user electronics. Pins 24 and 25 or the barrel jack allow for this configuration. (Refer to the Pinout Description in the next section for details on the DLP-2232MSP electrical interface.)**The board will not operate until a power source has been connected.**2. Connect the DLP-2232MSP board to the PC via a standard A-B, 6-foot USB cable. This actioninitiates the loading of the USB drivers. When prompted, select the folder where the CDM device drivers were stored in Step 1. Windows will then complete the installation of the device drivers for the DLP-2232MSP board. The next time the DLP-2232MSP board is attached, the host PC will immediately load the correct drivers without any prompting. Reboot the PC if prompted to do so.The DLP-2232MSP is shipped with default VID, PID, etc. values programmed into the EEPROM memory. You only need to run MPROG if you want to change the default values.At this point, the DLP-2232MSP is ready for use. Note that the DLP-2232MSP will appearnon-responsive if data sent from the host PC is not read from the FT2232H device by theMSP430F2618 microcontroller. The token firmware with which the DLP-2232MSP comes preloaded will read data sent by the host by default. Custom user firmware should also follow this protocol. 5.0 TOKEN I/OThe MSP430F2618 microcontroller on the DLP-2232MSP comes preprogrammed with firmware that provides rudimentary access to the port pins via either the VCP or DLL drivers. Features include the ability to read and write individual port pins.The firmware in the DLP-2232MSP also provides access to the MSP430F2618’s A/D converter, D/A converter and communications. Commands sent to the Token I/O firmware must adhere to a specific communications protocol. Each command sequence contains the following information:Byte 0: Number of bytes in command sequenceByte 1: CommandByte 2…n: Parameter/data bytesFor example, setting Port Pin P1.1 high would require the following string of bytes:0x04, 0x30, 0x11, 0x00, 0x01Definition of the Bytes:0x04 – Number of bytes in command0x30 – Command for digital port pin access0x11 – Affected port pin0x00 – Set port pin to output0x01 – Desired state of port pinThe port pins equate to hexadecimal numeric constants as defined here:PORT 1:0x10 = P1.0 MSP430F2618 Pin 12, DLP-2232MSP module Pin J1.120x11 = P1.1 MSP430F2618 Pin 13, DLP-2232MSP module Pin J1.13PORT 2:0x20 = P2.0 MSP430F2618 Pin 20, DLP-2232MSP module Pin J1.140x21 = P2.1 MSP430F2618 Pin 21, DLP-2232MSP module Pin J1.160x22 = P2.2 MSP430F2618 Pin 22, DLP-2232MSP module Pin J1.180x23 = P2.3 MSP430F2618 Pin 23, DLP-2232MSP module Pin J1.200x24 = P2.4 MSP430F2618 Pin 24, DLP-2232MSP module Pin J1.190x25 = P2.5 MSP430F2618 Pin 25, DLP-2232MSP module Pin J1.170x26 = P2.6 MSP430F2618 Pin 26, DLP-2232MSP module Pin J1.150x27 = P2.7 MSP430F2618 Pin 27, DLP-2232MSP module Pin J1.21PORT 3:0x30 = P3.0 MSP430F2618 Pin 20, DLP-2232MSP module Pin J1.390x31 = P3.1 MSP430F2618 Pin 21, DLP-2232MSP module Pin J1.410x32 = P3.2 MSP430F2618 Pin 22, DLP-2232MSP module Pin J1.370x33 = P3.3 MSP430F2618 Pin 23, DLP-2232MSP module Pin J1.380x34 = P3.4 MSP430F2618 Pin 24, DLP-2232MSP module Pin J1.360x35 = P3.5 MSP430F2618 Pin 25, DLP-2232MSP module Pin J1.40PORT 5:0x50 = P5.0 MSP430F2618 Pin 44, DLP-2232MSP module Pin J1.430x51 = P5.1 MSP430F2618 Pin 45, DLP-2232MSP module Pin J1.450x52 = P5.2 MSP430F2618 Pin 46, DLP-2232MSP module Pin J1.440x53 = P5.3 MSP430F2618 Pin 2, DLP-2232MSP module Pin J1.460x54 = P5.4 MSP430F2618 Pin 48, DLP-2232MSP module Pin J1.470x55 = P5.5 MSP430F2618 Pin 49, DLP-2232MSP module Pin J1.480x56 = P5.6 MSP430F2618 Pin 50, DLP-2232MSP module Pin J1.500x57 = P5.7 MSP430F2618 Pin 51, DLP-2232MSP module Pin J1.49PORT 6:0x60 = P6.0/A0 MSP430F2618 Pin 59, DLP-2232MSP module Pin J1.20x61 = P6.1/A1 MSP430F2618 Pin 60, DLP-2232MSP module Pin J1.30x62 = P6.2/A2 MSP430F2618 Pin 61, DLP-2232MSP module Pin J1.40x63 = P6.3/A3 MSP430F2618 Pin 2, DLP-2232MSP module Pin J1.50x64 = P6.4/A4 MSP430F2618 Pin 3, DLP-2232MSP module Pin J1.70x65 = P6.5/A5 MSP430F2618 Pin 4, DLP-2232MSP module Pin J1.80x66 = P6.6/A6/DAC0 MSP430F2618 Pin 5, DLP-2232MSP module Pin J1.90x67 = P6.7/A7/DAC1 MSP430F2618 Pin 6, DLP-2232MSP module Pin J1.10The source code for the Token I/O firmware (developed using the CCS C compiler) is available as a free download upon purchase and receipt of the hardware. Example Visual C++ source code developed using Microsoft Visual C for communicating with the DLP-2232MSP via the Token I/O firmware is also available for download. (The Windows source code also contains the port pin definitions listed above.)5.1 TOKEN I/O COMMAND SET0x27 – Ping – Host NotificationLength: 2 BytesParameters: NoneReturns: 1 Byte: ASCII “S” or hex 0x53Function:This function returns an ASCII ‘S’ to tell the host that the module is up and running Example:0x02, 0x27 – Causes the module to return a 0x53 to the host0x28 – Flash LED – Toggle the LEDLength: 2 BytesParameters: NoneReturns: 1 Byte: command echo acknowledgement=0x28Function:This function will cause the module’s green LED to flash brieflyExample:0x02, 0x28 – Causes the LED to toggle briefly0x29 – LED On/OffLength: 3 BytesParameters: 1 Byte: 0=Turn LED Off; 1=Turn LED OnReturns: 1 Byte: command echo acknowledgement=0x29Function:This function will turn the module’s green LED on or offExample:0x03, 0x29, 0x01 - Turns on the LED0x30 – Digital I/O Read/WriteLength: 4 or 5 BytesParameters: 2 or 3 Bytes:1. Port Selection – Select the desired MSP430F2618 port pin (refer to the port listunder the previous section)2. Port Direction: 1=Input; 0=Output3. Port Value if Byte 2 specifies OutputReturns: 2 Bytes for Input=Value on port pin; command echo acknowledgement=0x301 byte for Output=command echo acknowledgement=0x30Function:This function will read from or write to the selected port pinExample:0x04, 0x30, 0x60, 0x00, 0x01 – Sets Port 6 Pin 0 high0x40 – A/D ConversionLength: 3 BytesParameters:Mode: 0=Single conversion, 1=Continuous conversions (~1 per second)Note: Setting the ADC mode to continuous (1) starts an infinite loop. The ADCwill perform a conversion approximately once a second and report the result tothe host. To exit, break the code using the debugger or reset the module. Returns: 2 Bytes: The 12-bit voltage data; MSB firstFunction:This function will enable A/D conversion on the selected channel and ADC, pause 10uS, perform the A/D conversion and then return 2 bytes to the host (MSB first).Command 0x42 must have been previously called to configure the desired analogchannel as an A/D input, and 0x43 / 0x44 must have been called to configure thevoltage reference.Example:0x3, 0x40 0x00 – Performs the A/D conversion and, using ADC0, returns 2 bytes of data0x41 – Disable A/DLength: 3 BytesParameters: 0=ADC0, 1=ADC1Returns: 1 Byte: command echo acknowledgement=0x41Function:This function disables the specified A/D converterExample:0x3, 0x41 0x01 – Disables A/D Converter 10x42 – Select A/D InputLength: 3 BytesParameters:0x00=Select input A0 (P6.0)0x01=Select input A1 (P6.1)0x02=Select input A2 (P6.2)0x03=Select input A3 (P6.3)0x04=Select input A4 (P6.4)0x05=Select input A5 (P6.5)0x06=Select input A6 (P6.6)0x07=Select input A7 (P6.7)0x08=Select internal input Veref+0x09=Select internal input Vref-/Veref-0x0A=Select internal temperature diode0x0B=Select internal input (Avcc – Avss)/2Returns: 1 Byte: command echo acknowledgement=0x42Function:This function selects the analog input to be used by the specified A/D converter Example:0x3, 0x42 0x03 – Selects analog input A30x43 – External ReferenceLength: 2 BytesParameters: NoneReturns: 1 Byte: command echo acknowledgement=0x43Function:This function sets the A/D and D/A references to be externalExample:0x2, 0x43 – Select External Voltage Reference0x44 – Internal ReferenceLength: 2 BytesParameters: NoneReturns: 1 Byte: command echo acknowledgement=0x44Function:This function sets the A/D and D/A references to be internal; use command 0x50 to select the Internal Voltage Reference valueExample:0x2, 0x44 – Select Internal Voltage Reference0x50 – Select Internal Reference SourceLength: 3 BytesParameters:0=+1.5V, 1=+2.5VReturns: 1 Byte: command echo acknowledgement=0x50Function:This function sets the A/D and D/A internal voltage reference valuesExample:0x3, 0x50 0x00 – Select Internal Voltage Reference of +1.5V0x60 – D/A OutputLength: 5 BytesParameters: 3 Bytes:1. 0=DAC0 output on Port A6; 1=DAC1 output on Port A72. 0x0n (n=MSB 4 bits of 12-bit DAC output value)3. 0xmm (mm=LSB 8 bits of 12-bit DAC output value)Returns: 1 Byte: command echo acknowledgement=0x60Function:This function selects the D/A converter and specifies the output valueExample:0x5, 0x60 0x00 0x01 0x23 – Select DAC 0 to output value 0x123; the actual voltage depends upon the reference selected0x61 – Disable D/ALength: 3 BytesParameters: 0=DAC0; 1=DAC1Returns: 1 Byte: command echo acknowledgement=0x61Function:This function disables the specified D/A converterExample:0x3, 0x61 0x00 – Disables D/A converter 00x70 – UART LoopbackThis command configures UART 1 to loop back any bytes received on its input port to its transmit output port. Port B on the FT2232H must be set to UART mode with a baud rate of 115200. Once set any bytes sent through Port B of the FT2232H will be echoed back. This command initiates an infinite loop in which all bytes sent are looped back. To exit, break the code using the debugger or reset the module.Length: 2 BytesParameters: NoneReturns: 1 Byte: command echo acknowledgement=0x70(After a command is sent, subsequent bytes sent to the UART via FT2232HPort B will be echoed back)Function:This function configures UART 1 to loop back received bytesExample:0x2, 0x70 – UART 1 loopback enabledTABLE 1: DLP-2232MSP PINOUT DESCRIPTION1252650PIN # DESCRIPTION1 GROUND2 P6.0/A0 (I/O)Port 6 Pin 0 connected to the MSP430F2618 Digital I/O P6.3 and Analog Input 03 P6.1/A1 (I/O) Port 6 Pin 1 connected to the MSP430F2618 Digital I/O P6.3 and Analog Input 14 P6.1/A2 (I/O) Port 6 Pin 2 connected to the MSP430F2618 Digital I/O P6.3 and Analog Input 25 P6.3/A3 (I/O) Port6 Pin 3 connected to the MSP430F2618 Digital I/O P6.3 and Analog Input 36 GROUND7 P6.3/A4 (I/O) Port 6 Pin 4 connected to the MSP430F2618 Digital I/O P6.4 and Analog Input 48 P6.3/A5 (I/O) Port 6 Pin 5 connected to the MSP430F2618 Digital I/O P6.5 and Analog Input 59 P6.3/A6/DAC0 (I/O) Port 6 Pin 6 connected to the MSP430F2618 Digital I/O P6.6, Analog Input 6 and D/A output DAC010 P6.3/A7/DAC1 (I/O) Port 6 Pin 7 connected to the MSP430F2618 Digital I/O P6.7, Analog Input 7 and D/A output DAC0111 GROUND12 P1.0 (I/O) Port 1 Pin 0 connected to the MSP430F2618 Digital I/O P1.013 P1.1 (I/O) Port 1 Pin 1 connected to the MSP430F2618 Digital I/O P1.114 P2.0 (I/O) Port 2 Pin 0 connected to the MSP430F2618 Digital I/O P2.015 P2.6 (I/O) Port 2 Pin 6 connected to the MSP430F2618 Digital I/O P2.616 P2.1 (I/O) Port 2 Pin 1 connected to the MSP430F2618 Digital I/O P2.117 P2.5 (I/O) Port 2 Pin 5 connected to the MSP430F2618 Digital I/O P2.518 P2.2 (I/O) Port 2 Pin 2 connected to the MSP430F2618 Digital I/O P2.219 P2.4 (I/O) Port 2 Pin 4 connected to the MSP430F2618 Digital I/O P2.420 P2.3 (I/O) Port 2 Pin 3 connected to the MSP430F2618 Digital I/O P2.321 P2.7 (I/O) Port 2 Pin 7 connected to the MSP430F2618 Digital I/O P2.722 SWVCC (Out) Power from EXTVCC (Pin 24) controlled via Pin 60 (PWREN#) of theFT2232H and Q1 MOSFET power switch; R8 and C24 control the power-up rate to help limit inrush current23 GROUND24 EXTVCC (In) Use for applying main power (4.4-5.25 volts) to the module; connect to PORTVCC if the module is to be powered by the USB port (typical configuration)25 PORTVCC (Out) Power from USB port—Connect to EXTVCC if the module is to be powered by the USB port (typical configuration); 500mA is the maximum current available to the DLP-2232MSP and target electronics if the USB device is configured for high power26 GROUND27 DB0 (I/O) Line 0 of the data bus between the MSP430F2618 and the FT2232H USB-FIFO28 DB1 (I/O) Line 1 of the data bus between the MSP430F2618 and the FT2232H USB-FIFO29 DB2 (I/O) Line 2 of the data bus between the MSP430F2618 and the FT2232H USB-FIFO30 DB3 (I/O) Line 3 of the data bus between the MSP430F2618 and the FT2232H USB-FIFO31 DB4 (I/O) Line 4 of the data bus between the MSP430F2618 and the FT2232H USB-FIFO32 DB5 (I/O) Line 5 of the data bus between the MSP430F2618 and the FT2232H USB-FIFO33 DB6 (I/O) Line 6 of the data bus between the MSP430F2618 and the FT2232H USB-FIFO34 DB7 (I/O) Line 7 of the data bus between the MSP430F2618 and the FT2232H USB-FIFO35 GROUND36 P3.4 (I/O) Port 3 Pin 4 connected to the MSP430F2618 Digital I/O P3.437 P3.2 (I/O) Port 3 Pin 2 connected to the MSP430F2618 Digital I/O P3.238 P3.3 (I/O) Port 3 Pin 3 connected to the MSP430F2618 Digital I/O P3.339 P3.0 (I/O) Port 3 Pin 0 connected to the MSP430F2618 Digital I/O P3.040 P3.5 (I/O) Port 3 Pin 5 connected to the MSP430F2618 Digital I/O P3.541 P3.1 (I/O) Port 3 Pin 1 connected to the MSP430F2618 Digital I/O P3.142 GROUND43 P5.0 (I/O) Port 5 Pin 0 connected to the MSP430F2618 Digital I/O P5.044 P5.2 (I/O) Port 5 Pin 2 connected to the MSP430F2618 Digital I/O P5.245 P5.1 (I/O) Port 5 Pin 1 connected to the MSP430F2618 Digital I/O P5.146 P5.3 (I/O) Port 5 Pin 3 connected to the MSP430F2618 Digital I/O P5.347 P5.4 (I/O) Port 5 Pin 4 connected to the MSP430F2618 Digital I/O P5.448 P5.5 (I/O) Port 5 Pin 5 connected to the MSP430F2618 Digital I/O P5.5分销商库存信息: DLP-DESIGNDLP-2232MSP。
ICL3232中文资料

TM
Data Sheet
ICL3221 thru ICL3243
May 2000 File Number 4805.2
1 Microamp Supply-Current, +3V to +5.5V, 250kbps, RS-232 Transmitters/Receivers
PART NUMBER ICL3221 ICL3222 ICL3223 ICL3232 ICL3241 ICL3243
NO. OF NO. OF
Tx.
Rx.
1
1
2
2
2
2
2
2
3
5
3
5
TABLE 1. SUMMARY OF FEATURES
NO. OF MONITOR Rx.
(ROUTB)
0
DATA RATE (kbps)
EN 1 C1+ 2 V+ 3 C1- 4 C2+ 5 C2- 6
V- 7 T2OUT 8
R2IN 9 R2OUT 10
20 FORCEOFF 19 VCC 18 GND 17 T1OUT 16 R1IN 15 R1OUT 14 FORCEON 13 T1IN 12 T2IN 11 INVALID
ICL3232 (PDIP, SOIC, SSOP, TSSOP) TOP VIEW
ICL3241 (SOIC, SSOP, TSSOP) TOP VIEW
C1+ 1 V+ 2
C1- 3 C2+ 4 C2- 5
V- 6 T2OUT 7
R2IN 8
16 VCC 15 GND
EN 1 C1+ 2 V+ 3 C1- 4 C2+ 5 C2- 6
RSM232D_ds

北京周立功
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传真:(027)87163755
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地址:上海市北京东路 668 号科技京城东座 7E 室 电话:(021)53083452 53083453 53083496 传真:(021)53083491
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2.3
电气参数 ................................................................................................................... 2
2.4
绝缘特性 ................................................................................................................... 3
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地址:杭州市天目山路 217 号江南电子大厦 502 室 电话:(0571) 28139611 28139612 28139613
28139615 28139616 28139618 传真:(0571) 28139621
R3232-I中文资料

8-port Ethernet Hub Optional w/uplink switch V.90, ISDN, or IDSL Port
Aux Backup Port
Console Port
IDSL Port
Power
Technical Specifications
Physical Connections
WAN Interface • IDSL (2x Bonded) symmetric connections from 64 to 288 Kbps. • Second WAN interface for additional DSL bonding or Dial backup options • Auxiliary Serial Port: Connect to external analog or ISDN modem for backup or remote configuration. Or use with optional AppleTalk kit LAN Interface • 8-port 10-BaseT Ethernet hub with uplink switch Management Interface • Console Management port for direct console connections to PC (DB9) or Macintosh (mini-DIN8), cables included • Remote out-of-band management available over modem connection, requires optional Aux Port Modem Cable (TE6/DB25) • In-bound management via Telnet, SNMP or Web clients to a centralized DHCP server. • Modular Architecture: Flexible hardware design lets you add or change connection types by swapping out WAN module cards. • Optional DSL Bonding (IMUX): Combine four IDSL lines for speeds up to 576 Kbps. Standard on model R3232-I. Available only through service providers using Copper Mountain DSL Central Office equipment. • Dial backup: (Optional on R3100-T) Backup to analog or ISDN modem connected to auxiliary serial port. Requires optional Aux Port Modem Cable (TE6/DB25). • Circuit (PVC) with ATM Adaptation Layer 5 (AAL5); Allows manual configuration of Virtual Path Identifier (VPI) and Virtual Channel Identifier (VCI). Routing: Transmit and Receive RIPv1 and RIPv2 (RFC 1723) and RIPv1 compatibility mode, up to 16 static routes with default route and the option to not advertise routes, configurable with up to 8 subnets on LAN with DHCP pool associated with each subnet. IP Addressing: Dynamic Host Configuration Protocol (DHCP) and BootP servers. Supports up to 8 different pools of IP addresses (one per subnet) with a maximum of 512 addresses. WAN IP Interface: Numbered or Unnumbered Interface. Connection profiles: Specify configuration information for up to 16 Virtual Private Networks (or up to 15 Virtual Private Network Tunnels)
sp 中文资料说明书

15 R1OUT 10 R2OUT
1 EN
R1IN 16 5k
R2IN 9 5k
SHDN 20
GND *
18
RS-232 VCC 或 GND
图 6 SP3222E 典型工作电路
6
图 7 SP3232E 典型工作电路
描述
SP3222E/3232E 接收器满足 EIA/TIA-232 和 V.28/V.24 通信协议,能应用于用电池供电,便携的手持式 设备(如笔记本或掌上型电脑)。SP3222E/3232E 器件都包含 Sipex 系列特有的片内电荷泵电路,可从+3.0V~ +5.5V 的电源电压产生 2×Vcc 的 RS-232 电压电平。该系列适用于+3.3V 系统,混合的+3.3V~+5.5V 系统 或需要 RS-232 性能的+5.0V 系统。SP3220E 器件的驱动器满载工作时典型的数据速率为 235Kbps。
10KHz
40
35
30
25
20
15
10
5
图3
0
0
500
1000
1500
2000
2330
负载电容 [pF]
SP3220E 传输数据时的电源电流和负载电容
4
表 1 器件管脚描述
管脚号
管脚名
用途
SP3222E DIP/SO SSOP/
TSSO
SP3232E
P
EN
接收器使能控制。正常工作模式下管脚为低电平。该管脚
Vcc…………………………………………………………………………………………………-0.3V~+6.0V V+(注释 1)…………………………………………………………………………………………-0.3V~+7.0V V-(注释 1)………………………………………………………………………………………. +0.3V~-7.0V V++|V-|(注释 1)…………………………………………………..………………………………………….13V ICC(DCVCC 或 GND 电流)………………………….…………………………………………………±100mA 输入电压
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General DescriptionThe DS3232M is a low-cost, extremely accurate, I 2C real-time clock (RTC) with 236 bytes of battery-backed SRAM. The device incorporates a battery input and maintains accurate timekeeping when main power to the device is interrupted. The integration of the microelec-tromechanical systems (MEMS) resonator enhances the long-term accuracy of the device and reduces the piece-part count in a manufacturing line.The RTC maintains seconds, minutes, hours, day, date, month, and year information. The date at the end of the month is automatically adjusted for months with fewer than 31 days, including corrections for leap year. The clock operates in either the 24-hour or 12-hour format with anAM /PM indicator. Two programmable time-of-day alarms and a 1Hz output are provided. Address and data are transferred serially through an I 2C bidirectional bus. A precision temperature-compensated voltage reference and comparator circuit monitors the status of V CC to detect power failures, to provide a reset output, and to automatically switch to the backup supply when neces-sary. Additionally, the RST pin is monitored as a pushbut-ton input for generating a microprocessor reset. See the Block Diagram for more details.ApplicationsPower Meters Industrial ApplicationsFeaturesS Timekeeping Accuracy ±5ppm (±0.432 Second/Day) from -40N C to +85N C S 236 Bytes of Battery-Backed User SRAM S Battery Backup for Continuous Timekeeping S Low Power ConsumptionS Functionally Compatible to DS3232S Complete Clock Calendar Functionality Including Seconds, Minutes, Hours, Day, Date, Month, and Year with Leap Year Compensation Up to Year 2100S Two Time-of-Day Alarms S 1Hz and 32.768kHz OutputsS Reset Output and Pushbutton Input with Debounce S Fast (400kHz) I 2C-Compatible Serial Bus S +2.3V to +4.5V Supply VoltageS Digital Temp Sensor with ±3N C Accuracy S -40N C to +85N C Temperature Range S 8-Pin SO (150 mils) PackageS Underwriters Laboratories (UL) RecognizedTypical Operating CircuitOrdering Information appears at end of data sheet.Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device may be simultaneously available through various sales channels. For information about device errata, go to: /errata .For related parts and recommended products to use with this part, refer to: /DS3232M.related±5ppm, I 2C Real-Time Clock with SRAMVoltage Range on Any Pin Relative to GND ........-0.3V to +6.0V Operating Temperature Range ..........................-40N C to +85N C Storage Temperature Range ............................-55N C to +125N CLead Temperature (soldering, 10s) ................................+260N CSoldering Temperature (reflow) ......................................+260N CABSOLUTE MAXIMUM RATINGSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.RECOMMENDED OPERATING CONDITIONS(T A = -40N C to +85N C, unless otherwise noted.) (Note 1)ELECTRICAL CHARACTERISTICS—FREQUENCY AND TIMEKEEPING(V CC or V BAT = +3.3V, T A = -40N C to +85N C, unless otherwise noted. Typical values are at V CC = +3.3V, V BAT = +3.0V, and T A = +25N C, unless otherwise noted.) (Note 1)DC ELECTRICAL CHARACTERISTICS—GENERAL(V CC = +2.3V to +4.5V, T A = -40N C to +85N C, unless otherwise noted. Typical values are at V CC = +3.3V, V BAT = +3.0V, and T A = +25N C, unless otherwise noted.) (Note 1)PARAMETERSYMBOL CONDITIONSMINTYPMAX UNITS 1Hz Frequency Tolerance D f/f OUT Measured over R 10s intervalQ 5ppm 1Hz Frequency Stability vs. V CC VoltageD f/V Q 1ppm/V Timekeeping Accuracy tK A Q 0.432Seconds/Day32kHz Frequency ToleranceD f/f OUTQ 2.5%PARAMETERSYMBOL CONDITIONSMIN TYP MAX UNITS Supply Voltage V CC 2.3 3.3 4.5V V BAT 2.3 3.04.5Logic 1V IH 0.7 x V CC V CC + 0.3V Logic 0V IL-0.30.3 x V CCVPARAMETERSYMBOL CONDITIONSMINTYP MAX UNITS Active Supply Current (I 2C Active)I CCA (Note 2)125250µAStandby Supply Current (I 2C Inactive)I CCS(Notes 2, 3)100175µA±5ppm, I 2C Real-Time Clock with SRAMDC ELECTRICAL CHARACTERISTICS—GENERAL (continued)(V CC = +2.3V to +4.5V, T A = -40N C to +85N C, unless otherwise noted. Typical values are at V CC = +3.3V, V BAT = +3.0V, and T A = +25N C, unless otherwise noted.) (Note 1)DC ELECTRICAL CHARACTERISTICS—V BAT CURRENT CONSUMPTION(V CC = 0V, V BAT = +2.3V to +4.5V, T A = -40N C to +85N C, unless otherwise noted. Typical values are at V CC = 0V, V BAT = +3.0V, and T A = +25N C, unless otherwise noted.) (Note 1)PARAMETERSYMBOL CONDITIONSMINTYP MAX UNITS Temperature Conversion Current (I 2C Inactive)I CCSCONV200350µA Power-Fail Voltage V PF 2.452.5752.70V Logic 0 Output(32KHZ, INT /SQW, SDA)V OL I OL = 3mA 0.4V Logic 0 Output (RST )V OL I OL = 1mA0.4VLogic 1 Output (32KHZ)V OHActive supply > 3.3V, I OH = -1mA 2.0VActive supply > 2.7V, I OH = -0.75mA 2.0Active supply > 2.3V, I OH = -0.14mA2.0Output Leakage(32KHZ, INT /SQW, SDA)I LO -0.1+0.1µA Input Leakage (SCL)I LI -0.1+0.1µA RST I/O Leakage I OL -200+10µA V BAT Leakage I BATLKG T A = +25N C-10025+100nA Temperature Accuracy TEMP ACC V CC or V BAT = +3.3VQ 3N C Temperature Conversion Time t CONV 10ms Pushbutton Debounce PB DB 250ms Reset Active Timet RST 250ms Oscillator Stop Flag (OSF) Delayt OSF(Note 4)25100ms PARAMETERSYMBOL CONDITIONSMINTYP MAX UNITS Active Battery Current (I 2C Active)I BATA (Note 2)2575µA Timekeeping Battery Current (I 2C Inactive)I BATT EN32KHZ = 0, INTCN = 1 (Note 2)1.8 3.0µA Temperature Conversion Current (I 2C Inactive)I BATTC200350µAData Retention Current(Oscillator Stopped and I 2C Inactive)I BATDR T A = +25N C100nA±5ppm, I 2C Real-Time Clock with SRAMNote 1: Limits are 100% tested at T A = +25°C and T A = +85°C. Limits over the operating temperature range and relevant supplyvoltage range are guaranteed by design and characterization. Typical values are not guaranteed.Note 2: Includes the temperature conversion current (averaged).Note 3: Does not include RST leakage if V CC < V PF .Note 4: The parameter t OSF is the period of time the oscillator must be stopped for the OSF flag to be set.Note 5: The state of RST does not affect the I 2C interface or RTC functions.Note 6: Interface timing shown is for fast-mode (400kHz) operation. This device is also backward-compatible with standard modeI 2C timing.Note 7: C B = total capacitance of one bus line in picofarads.Note 8: Guaranteed by design and not 100% production tested.AC ELECTRICAL CHARACTERISTICS—POWER SWITCH(T A = -40N C to +85N C, unless otherwise noted.) (Note 1, Figure 2)AC ELECTRICAL CHARACTERISTICS—I 2C INTERFACE(V CC or V BAT = +2.3V to +4.5V, T A = -40N C to +85N C, unless otherwise noted. Typical values are at V CC = +3.3V, V BAT = +3.0V, and T A = +25N C, unless otherwise noted.) (Notes 1, 6, Figure 1)PARAMETERSYMBOL CONDITIONSMIN TYPMAXUNITS V CC Fall Time, V PFMAX to V PFMINt VCCF 300F s V CC Rise Time, V PFMIN to V PFMAXt VCCR 0F s Recovery at Power-Upt REC(Note 5)250300msPARAMETERSYMBOL CONDITIONSMIN TYPMAX UNITS SCL Clock Frequencyf SCL 0400kHz Bus Free Time Between STOP and START Conditions t BUF 1.3F s Hold Time (Repeated) START Conditiont HD:STA 0.6F s Low Period of SCL t LOW 1.3F s High Period of SCL t HIGH 0.6F s Data Hold Time t HD:DAT 00.9F s Data Set-Up Time t SU:DAT 100ns START Set-Up Time t SU:STA 0.6F s SDA and SCL Rise Time t R (Note 7)20 + 0.1C B 300ns SDA and SCL Fall Time t F (Note 7)20 + 0.1C B 300ns STOP Set-Up Timet SU:STO 0.6F s SDA, SCL Input CapacitanceC BIN(Note 8)10pF±5ppm, I 2C Real-Time Clock with SRAMTiming DiagramsFigure 1. IC TimingFigure 2. Power Switch TimingFigure 3. Pushbutton Reset Timing±5ppm, I 2C Real-Time Clock with SRAMTypical Operating Characteristics(T A = +25°C, unless otherwise noted.)POWER-SUPPLY CURRENT vs. POWER-SUPPLY VOLTAGES U P P L Y C U R R E N T (µA )608010012014016018020040SUPPLY VOLTAGE (V) 4.33.83.32.82.31.01.52.02.5BATTERY CURRENT vs. BATTERY VOLTAGEB A T T E R YC U R R E N T (µA )3.00.5SUPPLY VOLTAGE (V)4.33.83.32.82.3RST OUTPUT VOLTAGE vs. OUTPUT CURRENTOUTPUT CURRENT (mA)O U T P U T V O L T A G E (V )43210.10.20.30.40.50.605INT/SQW OUTPUT VOLTAGE vs. OUTPUT CURRENTOUTPUT CURRENT (mA)O U T P U T V O L T A G E (V )86420.10.20.30.40.50010POWER-SUPPLY CURRENT vs. SCL FREQUENCYSCL FREQUENCY (kHz)S U P P L Y C U R R E N T (µA )300200100809010011012013014015016017070400THERMOMETER ERROR vs. TEMPERATURETEMPERATURE (°C)T H E R M O M E T E R E R R O R (°C )5020-10-4-3-2-1012345-5-4080±5ppm, I 2C Real-Time Clock with SRAMTypical Operating Characteristics (continued)(T A = +25°C, unless otherwise noted.)1Hz FREQUENCY ERROR (MEASURED EVERY SECOND)TIME (SECONDS)F R E Q U E N C Y E R R O R (p p m )-8-6-4-20246810-10302520151051Hz FREQUENCY ERROR (MEASURED EVERY SECOND)TIME (MINUTES)F R E Q U E N C Y E R R O R (p p m )-8-6-4-20246810-100302520151051Hz FREQUENCY ERROR (DELTA FROM T0)TIME (MINUTES)F R E Q U E N C Y E R R O R (p p m )030252015105-4-3-2-1012345-51Hz FREQUENCY ERROR (10s THERMAL UPDATES MEASURED EVERY SECOND)TIME (SECONDS)F R E Q U E N C Y E R R O R (p p m )-8-6-4-20246810-10302520151051Hz FREQUENCY ERROR (1s THERMAL UPDATES MEASURED EVERY SECOND)TIME (SECONDS)F R E Q U E N C Y E R R O R (p p m )-8-6-4-20246810-1030252015105TIMEKEEPING ACCURACY vs. TEMPERATURETEMPERATURE (°C)F R E Q U E N C Y E R O R (p p m )806040200-20-150-100-50050-200-40±5ppm, I 2C Real-Time Clock with SRAMPin ConfigurationPin DescriptionPIN NAME FUNCTION132KHZ32.768KHZ Output (Push-Pull Output, 50% Duty Cycle). If enabled (EN32KHZ = 1), the 32kHz output is active on V CC . If enabled for battery operation (BB32KHZ = 1), the output is also active on V BAT . When disabled, the output is forced low. This pin can be left unconnected if not used.2V CCDC Power Pin for Primary Power Supply. This pin should be decoupled using a 0.1F F to 1.0F F capacitor. Connect to ground if not used.3INT / SQWActive-Low Interrupt or 1Hz Square-Wave Output. This open-drain pin requires an external pullup resistor connected to a supply at 4.5V or less. It can be left open if not used. This multifunction pin is determined by the state of the INTCN bit in the Control register (0Eh). When INTCN is set to logic 0, this pin outputs a 1Hz square wave. When INTCN is set to logic 1, a match between the timekeeping registers and either of the alarm registers activates the INT /SQW pin (if the alarm is enabled). Because the INTCN bit is set to logic 1 when power is first applied, the pin defaults to an interrupt output with alarms disabled.4RSTActive-Low Reset. This pin is an open-drain input/output. It indicates the status of V CC relative to the V PF specification. As V CC falls below V PF , the RST pin is driven low. When V CC exceeds V PF , for t RST , the RST pin is pulled high by the internal pullup resistor. The active-low, open-drain output is combined with a debounced pushbutton input function. This pin can be activated by a pushbutton reset request. It has an internal 50k I (R PU ) nominal value pullup resistor to V CC . No external pullup resistors should be con-nected. If the oscillator is disabled, t REC is bypassed and RST immediately goes high.5GNDGround6VBATBackup Power-Supply Input. When using the device with the V BAT input as the primary power source, this pin should be decoupled using a 0.1F F to 1.0F F low-leakage capacitor. When using the device with the V BAT input as the backup power source, the capacitor is not required. If V BAT is not used, connect to ground. The device is UL recognized to ensure against reverse charging when used with a primary lithium battery. Go to /qa/info/ul for more information.7SDA Serial-Data Input/Output. This pin is the data input/output for the I 2C serial interface. This open-drain pin requires an external pullup resistor. The pullup voltage can be up to 4.5V, regardless of the voltage on V CC .8SCLSerial-Clock Input. This pin is the clock input for the I 2C serial interface and is used to synchronize data movement on the serial interface. The pullup voltage can be up to 4.5V, regardless of the voltage on V CC .±5ppm, I2C Real-Time Clock with SRAMDetailed Description The DS3232M is a serial real-time clock (RTC) driven by an internal, temperature-compensated, microelectrome-chanical systems (MEMS) resonator. The oscillator pro-vides a stable and accurate reference clock and main-tains the RTC to within Q0.432 seconds-per-day accu-racy from -40N C to +85N C. The RTC is a low-power clock/ calendar with two programmable time-of-day alarms. INT/ SQW provides either an interrupt signal due to alarm conditions or a 1Hz square wave. The clock/calendar provides seconds, minutes, hours, day, date, month, and year information. The date at the end of the month is auto-matically adjusted for months with fewer than 31 days, including corrections for leap year. The clock operates in either the 24-hour or 12-hour format with an AM/PM indi-cator. The internal registers are accessible though an I2C bus interface. A temperature-compensated voltage refer-ence and comparator circuit monitors the level of V CC to detect power failures and to automatically switch to the backup supply when necessary. The RST pin provides an external pushbutton function and acts as an indica-tor of a power-fail event. Also available are 236 bytes of general-purpose battery-backed SRAM.Operation The Block Diagram shows the device’s main elements. Each of the major blocks is described separately in the following sections.Block Diagram±5ppm, I 2C Real-Time Clock with SRAMHigh-Accuracy Time BaseThe temperature sensor, oscillator, and digital adjust-ment controller logic form the highly accurate time base. The controller reads the output of the on-board tempera-ture sensor and adjusts the final 1Hz output to maintain the required accuracy. The device is trimmed at the factory to maintain a tight accuracy over the operating temperature range. When the device is powered by V CC , the adjustment occurs once a second. When the device is powered by V BAT , the adjustment occurs once every 10s to conserve power. Adjusting the 1Hz time base less often does not affect the device’s long-term timekeeping accuracy. The device also contains an Aging Offset reg-ister that allows a constant offset (positive or negative) to be added to the factory-trimmed adjustment value.Power-Supply ConfigurationsThe DS3232M can be configured to operate on a single power supply (using either V CC or V BAT ) or in a dual-supply configuration, which provides a backup supply source to keep the timekeeping circuits alive during absence of primary system power.Figure 4 illustrates a single-supply configuration using V CC only, with the V BAT input grounded. When V CC < V PF , the RST output is asserted (active low). Temperature con-versions are executed once per second.Figure 5 illustrates a single-supply configuration using V BAT only, with the V CC input grounded. The RST output is disabled and is held at ground through the connection of the internal pullup resistor. Temperature conversions are executed once every 10s.Figure 6 illustrates a dual-supply configuration, using the V CC supply for normal system operation and the V BAT supply for backup power. In this configuration, the power-selection function is provided by a temperature-compensated voltage reference and a comparator circuit that monitors the V CC level. When V CC is greater than V PF , the device is powered by V CC . When V CC is less than V PF but greater than V BAT , the device is powered by V CC . If V CC is less than V PF and is less than V BAT , the device is powered by V BAT (see Table 1).When V CC < V PF , the RST output is asserted (active low). When V CC is the presently selected power source, temperature conversions are executed once per second. When V BAT is the presently selected power source, tem-perature conversions are executed once every 10s.Figure 4. Single Supply (V CC Only)Figure 5. Single Supply (V BAT Only)Figure 6. Dual Power SupplyV BATV CC+3.3VV BATV CCV BATV CC+3.3V分销商库存信息:MAXIMDS3232MZ+TRL DS3232MZ+。