Yole LED Packaging Sample

HB LED&LED PACKAGING’09 HB LED & LED PACKAGING ’09 Process, equipment and materialsTechnology and market trendsSAMPLEIR45 rue Sainte Geneviève, F-69006 Lyon, FranceOsramTel : +33 472 83 01 80 -Fax : +33 472 83 01 83Table of ContentContentIntroductionExecutive summary Acronyms & definitions LED market statusMarket segmentation •DICING–Location of Dicing Process–Saw Dicing–Laser Dicing–Saw VS Laser–Supply Chain–Market Volume for Sapphire Wafers•Market segmentation•Market Volume•Market Revenue•General Lighting•GaN-based White LEDs•Wafer Needs for General Lightingpp–Market Revenue for Dicing Services–Market of equipments in number of units–Market in $M•DIE BONDING–Location of the process–The Basics–Dispensing equipment from AsymtekLED Performance•Lumens. Depending on Applications•Internal Quantum Efficiency•Evolution Under High Current•Output Heat•Overall PerformancesDispensing equipment from Asymtek–Material for LED–Main players–Market Volume for Die Attach Material–Market Revenue for Die Attach Material–Market of equipments in number of units–Market of equipments in $M •INTERCONNECT•Expected Performances for White LED LED Packaging Status•Introduction•Package families•Assembly Process Flow INTERCONNECT–Location of the process–Overview of wire bonding–Electrical connection : the basics–Wire Bonding Processes–Ball bonding VS Wedge bonding–Ribbon bond VS wire bond–Main players–Definitions–Description–System Integration –Challenges–Value Chain–Evolution–TrendsMain players–Market revenue -Assumptions–Market revenue for gold wire bonding •ENCAPSULATION, LENS & PHOSPHOR–Location of the process–Encapsulation method for LED lamp–Casting process for encapsulationEncapsulation for SMD•Technology Roadmap •Packaging of Regular LED •Flow Chart for Regular LED –Main steps and materials–Standard Assembly Flow–Through Hole Devices–Surface Mount Devices –Encapsulation for SMD–Compression molding process–Materials for encapsulation–Market estimation of molding compound –How does LED generate white light?–Phosphor chemistry–Phosphor placement in white LEDMain phosphor technologies in use–Market Metrics -Packaged LED Market Volume –Main phosphor technologies in use –Main phosphor suppliers–Optics–Main playersTable of ContentPACKAGING OF HB/UBH ED Th l I f M i lPACKAGING OF HB/UBH LED•Introduction•What package for what LED? •Package type•Evolution of the packaging •Impact of the heatHB/UHB LED packaging function •INTERCONNECT–Location of the process–What’s new?–Evolution in wirebonding –Matrix LED –features –Flip Chip Technology –Wirebond VS Flip ChipFlip chip coupled with back face contact –Thermal Interface Material –Thermal Interface Material –Main Players –Heatsink–Heatsink –Main Players–Summary –LED Package with optimized heat transfer•HB/UHB LED packaging function •Different levels of packaging•Considerations of HB LED design •Materials challenges and solutions•Market Metrics -Packaged LED Market Volume •SCRIBING AND DICING–Location of the process –Flip-chip coupled with back-face contact reflector–Stud Bumping–Example of Lumileds Luxeon K2 –Laser Lift-Off (LLO) & Flip-Chip –Laser Lift Off Technique: definition –Laser Lift Off Technique: OSRAM –LLO equipment•ENCAPSULATION, LENS & PHOSPHOR–Location of the process–Optical extraction techniques –Remote phosphor–Silicon Product -Shin EtsuWAFER LEVEL PACKAGINGp–Scribing & Dicing: Definition–Techniques, Throughputs and Costs –Number of dice / wafer –Laser Scribing & Dicing –Diamond Scribing & Dicing–Example of JPSA Scribing & Dicing tool –Example of NWR Scribing & Dicing tool LLO equipment –LLO technique & Flip-chip mounting•TEMPORARY BONDING–introduction–Thin-wafer handling: different solutions –principleMain methods:a comparison •WAFER LEVEL PACKAGING –Main challenges for Power LED WLSP–Market drivers –Power LED Packaging –Power LED Packaging Manufacturer Motivations & Segmentation–3D-TSV developments for Power LEDs –Overview of power LED packaging types –Drivers for LED silicon packaging p g g–Laser Microjet Technology from Synova –Example of Synova Scribing & Dicing tool –Example of Oxford Lasers Scribing & Dicing tool–Example of ALSI Lasers Dicing tool –Stealth Dicing Technology –Stealth Dicing Roadmap–Main methods: a comparison –wax–adhesive tapes–EVG temporary bonding tools•THERMAL MANAGEMENT–Location of the process Thermal SolutionsDrivers for LED silicon packaging solutions–Supply chain focus on ESD protection using Si submounts for HB LEDs –Hymite: Silicon HB-LED packages –Silicon interposer for MEMS / LED Applications–3-D interposer to combine MOSFET + ASIC LED driver –Example of Stealth Laser Dicing tool –Example of Jenoptik-Votan dicing tool –Market Data -Assumptions –Laser vs saw–Market Revenue for HB/UHB LEDs–Market of equipment in number of units –Market revenue of equipments in $M–Thermal Solutions –Thermal solutions -Managing the LED Thermal System Configuration –Substrates–Substrates -SMD organic–Substrates -Metal Core Printed Circuit Board–Substrates -FR4 Board & Flexible ASIC LED driver–WLP : VisEra technologies–Estimation of 6” Silicon wafer demand for LED submount and WLP –Conclusion & challenges•CONCLUSION & CHALLENGES •DIE BONDING–Location of the process–Choosing die attach material–New material for HB/UHB LED -AuSn–AuSn –Strength and weakness of deposition methods –SummaryMarket Volume for Die Attach Material Substrate–Substrates -Ceramic Substrates –Substrates -Direct Bonded Copper –Substrates –Trends for DBC –Substrates -Summary–Substrates –Trends : Chip On Board –Substrates –Main Players •ANNEXES–Market Volume for Die Attach Material –Market Revenue for Die Attach Material–Market in number of die bonding equipment –Die bonding equipment –market in $M–Substrates –Market Data –Substrates –Market Volumes –Substrates –Market Revenue–HB LED submount –Market BreakdownLED Industry StatusSupply-ChainEPI WAFER WAFER PROCESSING EPI WAFERWAFER PROCESSINGPACKAGINGLED AssemblyFlow Chart for HB/UHB LEDScribing & Dicing¾saw ¾laserDie Bonding¾stencil printing ¾dispensing ¾jettingInterconnect¾Ball Bonding ¾Wedge Bonding ¾Flip Chip Th h Sili Vi ¾Through Silicon ViaThermal Management¾Substrate ¾Submount Phosphor & Encapsulation¾Remote Phosphor Dicing¾saw ¾laser¾Heat Slug¾molding ¾potting ¾castingLED Packaging StatusChallenges•Major requirements for LED package are :–Minimum light loss : improve LED efficiency–Thermal management : increase heat dissipation–Smaller size => cheaper–Specific assembly material, process and equipment => cheaper if fully automated Specific assembly material process and equipment=>cheaper if fully automated –Reducing the packaging cost to reduce the global LED manufacturing cost•Over the years, the input power has increased (HB & UHB LED) that Over the years the input power has increased(HB&UHB LED)thatproduces more lumens and so more heat is generated.•Several parameters have to be dramatically improved like : Several parameters have to be dramatically improved like:–Internal quantum efficiency (substrate level)–Electrical losses (die level)Extraction efficiency (die level)–Extraction efficiency(die level)–Phosphor conversion and optics quality (packaging level)LED industry have placed new requirements on packaging and assembly •LED industry have placed new requirements on packaging and assemblyChoices for package10000(mm 3)Overall volume of the package 10000the package 1000100100 100 0.1 1 10 100(W)PowerThermal ManagementLED Die •HB LED submount -Cree X-Lamp:LED Diep–Square shape LED silicon carrier submount withintegrated shottky diode for protection of ESDSilicon carrierSi carrierSubstrate with lens and phosphor removed, with the LEDdie assembly and bond wires in place (Courtesy ofMuAnalysis Inc.)Si carrier LED DiePlan view SEM image of the LED die mounted on Silicon submount (Courtesy of MuAnalysis Inc )on Silicon submount (Courtesy of MuAnalysis Inc.)Some of the recent Optical extraction techniques•Some of the recent techniques to improve light extraction efficiency–Silicon encapsulation and Silicon encapsulation and integrated secondary optics –Flip chip geometry –Thin film technology –Remote phosphor –Diffractive lenses –Photonic crystal ySubstrate –Current solutionsSilicon (TSV/WLP)0 %Substrates only70%Organic + Heat slug50%2008 Total HB/UHB LED MarketCeramic 20%S b t S b t t 30%Ceramic submount20%Submount + Substrates 30%Silicon submountSilicon submount 10%Wafer Level PackagingVisEra technologies•TSMC and its subsidiary VisEratechnologies has announced anew HB/UHB packagingtechnology based on 8” wafersgy•Features–Mass production (low cost)M d ti(l t)–Compatible with automatedequipment–Good thermal dissipation (5°C/W)Good thermal dissipation(5°C/W)–CTE compatible•Applications–Street lampsIndoor lighting–Indoor lightingCourtesy of VisEraPackaging of Regular LED Market size for materials。